Cleaner with heat dissipation structure

Abstract

Disclosed is a cleaner that includes an attachable / detachable battery on a body thereof. The printed circuit board is disposed on the main body. A first connector including a first terminal portion is disposed on the printed circuit board. A second connector including a second terminal portion is disposed on the battery. The first terminal portion is coupled to the second terminal portion when the battery is mounted on the battery mounting portion of the main body. A heat dissipation structure for dissipating heat of the first terminal portion is provided on the printed circuit board. The heat dissipation structure includes a heat dissipation pad disposed on the printed circuit board and a plurality of heat dissipation patterns two-dimensionally disposed on the heat dissipation pad.

Description

Technical Field

[0001] The present disclosure relates to a cleaning appliance. Background Art

[0002] A cleaner (such as a vacuum cleaner) uses negative pressure to suck in air containing foreign matter such as dust, and separates the foreign matter from the sucked air and receives the foreign matter in a dust collection container. The cordless cleaner may include a battery. The battery may be detachable from the cordless cleaner. In the cordless cleaner, a battery connector may be provided on the battery, and a main body side connector may be provided on the cordless cleaner. When the battery is mounted on the cordless cleaner, the battery connector is coupled to the main body side connector. The cordless cleaner may receive power from the battery through the battery connector and the main body side connector to perform a cleaning operation. Summary of the invention

[0003] An embodiment of the cleaner body includes a board accommodating portion and a battery mounting portion. A printed circuit board (PCB) is disposed in the board accommodating portion. A first connector is disposed on the PCB. The first connector includes a first terminal portion. The first terminal portion of the first connector is exposed to the outside through the battery mounting portion. The battery can be mounted on / removed from the battery mounting portion. A second connector including a second terminal portion is disposed on the battery. When the battery is mounted on the battery mounting portion, the first terminal portion is coupled to the second terminal portion. A heat dissipation structure configured to dissipate heat from the first terminal portion is disposed on the PCB. The heat dissipation structure includes a heat dissipation pad and a plurality of heat dissipation patterns. A plurality of heat dissipation patterns are two-dimensionally arranged on the heat dissipation pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a schematic partial cross-sectional perspective view of a cleaning device according to an embodiment of the present disclosure.

[0005] Figure 2 is a schematic perspective view of a printed circuit board (PCB) according to an embodiment of the present disclosure.

[0006] Figure 3 is a schematic partial perspective view of a cleaning device with a battery removed according to an embodiment of the present disclosure.

[0007] Figure 4 is a schematic perspective view of a battery according to an embodiment of the present disclosure.

[0008] Figure 5 An embodiment is shown in a state where the first connector is coupled to the second connector when the battery is mounted to the body.

[0009] Figure 6 is a schematic plan view of a PCB to which a heat dissipation structure is applied according to an embodiment of the present disclosure.

[0010] Figure 7 is a schematic cross-sectional view showing a heat dissipation structure according to an embodiment of the present disclosure.

[0011] Figure 8 is a schematic plan view showing a heat dissipation structure according to an embodiment of the present disclosure.

[0012] Fig. 9 is a schematic plan view showing a heat dissipation structure according to an embodiment of the present disclosure.

[0013] Fig.10 is a schematic cross-sectional view showing a double-sided heat dissipation structure according to an embodiment of the present disclosure.

[0014] Fig.11 is a schematic cross-sectional view showing a heat dissipation structure according to an embodiment of the present disclosure.

[0015] Fig.12 is a schematic cross-sectional view showing a heat dissipation structure according to an embodiment of the present disclosure.

[0016] Fig.13 is a schematic partial perspective view of a cleaning device with a battery removed according to an embodiment of the present disclosure.

[0017] Fig.14 is a schematic partial cross-sectional view of a cleaning device according to an embodiment of the present disclosure.

[0018] Fig.15 is a schematic partial cross-sectional view of a cleaning device according to an embodiment of the present disclosure.

[0019] Fig.16 is a schematic partial cross-sectional view of a cleaning device according to an embodiment of the present disclosure.

[0020] Fig.17 is a schematic perspective view of a first connector according to an embodiment of the present disclosure.

[0021] Fig.18 is a schematic perspective view of a PCB according to an embodiment of the present disclosure.

[0022] Fig.19 is a schematic perspective view of a PCB according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0023] Throughout the disclosure, the expression "at least one of a, b or c" or "at least one selected from a, b and c" refers to only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or variations thereof.

[0024] It should be understood that the various embodiments of the present disclosure in this document and the terms used therein are not intended to limit the technical features described herein to the specific embodiments of the present disclosure, and it should be understood that the present disclosure includes various modifications, equivalents or replacements of the embodiments of the present disclosure.

[0025] Regarding the description of the drawings, the same reference numerals may be used to designate the same or related elements.

[0026] Unless the context clearly indicates otherwise, a singular form of a noun corresponding to an item may include one or more items.

[0027] As used herein, each of phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in the corresponding one of the phrases.

[0028] The term "and / or" includes any combination of the listed plural related elements or any one of the plural related listed elements.

[0029] Terms such as “first”, “second”, etc. may be used simply to distinguish elements from other elements, and do not limit these elements in any other respects (eg, importance or order).

[0030] It will be understood that when an element (e.g., a first element) is referred to as being "coupled" or "connected" to another element (e.g., a second element) when the terms "functionally" or "communicatively" are used or when the terms "functionally" or "communicatively" are not used, the element may be coupled to the other element directly (e.g., in a wired manner), wirelessly, or via a third element.

[0031] Terms such as “comprise,” “include,” or “having” are intended to specify the presence of stated features, quantities, steps, operations, elements, components, or a combination thereof, but do not preclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, or a combination thereof.

[0032] It will also be understood that when an element is referred to as being “connected,” “coupled,” “supported” or “contacting” another element, this includes not only the case where the elements are directly connected, coupled, supported or contacted, but also the case where they are indirectly connected, coupled, supported or contacted via a third element.

[0033] It will also be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present therebetween.

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals or symbols refer to the same components or elements that perform substantially the same functions.

[0035] A cleaner (e.g., a vacuum cleaner) uses a suction force generated by a suction motor to suck in air and foreign matter (such as dust), filter out the foreign matter and collect them in a dust collection container. The cordless cleaner receives power from a battery to perform a cleaning operation. The battery is detachable from the cordless cleaner. When the battery is mounted on the cordless cleaner, the power from the battery is supplied to the cordless cleaner via a connector-to-connector connection structure. In the connector-to-connector connection structure, a main body side terminal portion provided on the main body of the cleaner and a battery side terminal portion provided on the battery are electrically contacted with each other to supply power from the battery to the main body, and heat may be generated in the main body side terminal portion due to contact resistance. The heat generated in the terminal portion may affect the performance and life of the cleaner.

[0036] An embodiment of a cleaner according to the present disclosure has a heat dissipation structure capable of reducing or dissipating heat generated in a terminal portion electrically connecting a main body to a battery. Figure 1 is a schematic partial cross-sectional perspective view of a cleaning device according to an embodiment of the present disclosure. Figure 1 The cleaner shown in the figure is a pole-type cordless cleaner. Although not shown in the drawings, the embodiment of the cleaner may be any one of various types of cleaners using batteries, such as a handheld cleaner, a robot cleaner, and the like. Figure 2 is a schematic perspective view of a printed circuit board (PCB) 200 according to an embodiment of the present disclosure. Figure 3 is a schematic partial perspective view of a cleaner with a battery 900 removed according to an embodiment of the present disclosure. Figure 4 is a schematic perspective view of a battery 900 according to an embodiment of the present disclosure. Figure 5 The embodiment is shown in a state where the first connector 300 is coupled to the second connector 400 when the battery 900 is mounted to the body 100 .

[0037] refer to Figures 1 to 5, an embodiment of the cleaner includes a main body 100 and a battery 900. The battery 900 can be mounted on / removed from the main body 100. The main body 100 may include a board accommodating portion 102 and a battery mounting portion 101. The PCB 200 is disposed or placed in the board accommodating portion 102. The board accommodating portion 102 is disposed in the internal space of the main body 100. The first connector 300 is disposed on the PCB 200. The first connector 300 includes a first terminal portion 320. The first connector 300 is disposed on the PCB 200 so that the first terminal portion 320 is exposed to the outside through the battery mounting portion 101. The battery 900 can be mounted on / removed from the battery mounting portion 101. The second connector 400 is disposed in the battery 900. The second connector 400 includes a second terminal portion 420. When the battery 900 is mounted on the battery mounting portion 101, the second connector 400 is coupled to the first connector 300. The second terminal portion 420 is coupled to the first terminal portion 320. Thus, the battery 900 is electrically connected to the main body 100. Power from the battery 900 can be supplied to the main body 100, and a control signal can be communicated between the battery 900 and the main body 100. The heat dissipation structure ( Figure 6 The heat dissipation structure 500 may include a heat dissipation pad ( Figure 6 520) and a plurality of heat dissipation patterns ( Figure 6 510).

[0038] The main body 100 may include an extension tube mounting portion 110 to which an extension tube (not shown) is mounted. A suction nozzle (not shown) is detachably connected to one end of the extension tube. The other end of the extension tube may be detachably connected to the extension tube mounting portion 110 in the main body 100. The extension tube connects the main body 100 and the suction nozzle to form a passage through which air and foreign matter sucked in via the suction nozzle move to the main body 100.

[0039] The main body 100 is provided with a suction fan 191, a dust collector 192, and a dust collection container 193, the suction fan 191 generates the suction force necessary for sucking in air and foreign matter on the surface to be cleaned, the dust collector 192 separates foreign matter from the sucked air, and the separated foreign matter is received in the dust collection container 193. The suction fan 191 may include a suction motor 191a and an impeller 191b mounted on the rotating shaft of the suction motor 191a. When the suction motor 191a is driven to rotate the impeller 191b, a suction pressure is generated to suck in air and foreign matter on the surface to be cleaned through the air inlet channel 195. The dust collection container 193 may be detachable from the main body 100. The dust collection container 193 may be separated from the main body 100, and foreign matter collected in the dust collection container 193 may be removed. The dust collector 192 may have, for example, a cyclonic dust collection structure. Based on the flow path of the sucked air, the dust collector 192 may be located between the dust collection container 193 and the suction fan 191. The main body 100 is provided with an air intake passage 195 connecting the extension pipe mounting portion 110 and the dust collector 192. Foreign matter and air sucked through the suction pipe port due to the suction force generated by the suction fan 191 pass through the extension pipe, the extension pipe mounting portion 110 and the air intake passage 195 and reach the dust collector 192. The foreign matter is separated by the dust collector 192 and received in the dust collection container 193.

[0040] The main body 100 is provided with an exhaust passage 196 for discharging air from which foreign matter is filtered out. The exhaust passage 196 is arranged at the downstream side of the suction fan 191. The filter 197 may be arranged at the entrance of the exhaust passage 196, in the middle of the exhaust passage 196e, or at the outlet of the exhaust passage 196. In an embodiment of the present disclosure, the filter 197 is arranged at the outlet of the exhaust passage 196. There is no specific restriction on the type of the filter 197. In an embodiment, the filter 197 may include, for example, a high efficiency particulate air (HEPA) filter. The filter 197 may filter out ultrafine dust, etc., which is not filtered out by the dust collector 192. The filter 197 may be accommodated in a filter housing 198. The filter housing 198 may be disassembled from the main body 100. The filter housing 198 may be removed from the main body 100, and the filter 197 accommodated in the filter housing 198 may be replaced with a new filter. Alternatively, the filter 197 accommodated in the filter housing 198 may be cleaned. The air from which foreign materials are filtered may be exhausted to the outside after passing through the exhaust passage 196 and the filter 197. The filter housing 198 may include an exhaust port 199 through which the air passing through the exhaust passage 196 and the filter 197 is exhausted.

[0041] The main body 100 may be provided with a controller 180. The controller 180 may include a control circuit and a manipulation part for manipulation inputs such as power on / off, suction force adjustment, and operation mode. The controller 180 may also include an indication part for displaying information about the operating state of the cleaner, etc. The manipulation part may include a physical button, a resistive or capacitive touch panel, etc. The manipulation part may have a structure that allows manipulation inputs by means of voice recognition, communication with an external control device, etc. The indication part may audibly and visually display the operating state of the cleaner. For example, the indication part may include a buzzer, a display, one or more light emitters, etc. By adopting a touch panel display, the manipulation part and the indication part may be integrated. The control circuit may control the cleaner according to the input manipulation via the manipulation part, and the indication part may be controlled to display information about the operating state of the cleaner, etc.

[0042] In an embodiment, for example, the main body 100 may include a base portion 103 extending in a longitudinal direction, a battery mounting portion 101 extending in a longitudinal direction parallel to the base portion 103, and a support portion 104 connecting the base portion 103 and the battery mounting portion 101. The base portion 103 may extend backward in the longitudinal direction beyond the support portion 104. A dust collection container 193, a dust collector 192, a suction fan 191, and a filter housing 198 may be mounted on the top of the base portion 103. An extension pipe mounting portion 110 may be disposed at the front of the base portion 103. An air intake passage 195 is disposed inside the base portion 103 and extends from the extension pipe mounting portion 110 to the dust collector 192. An exhaust passage 196 may be disposed between the suction fan 191 and the filter 197 at the top of the base portion 103. The support portion 104 may connect the front end of the battery mounting portion 101 to the base portion 103. In an embodiment, the board accommodating portion 102 is disposed inside the support portion 104. In this embodiment, the plate accommodating portion 102 can be the inner space of the supporting portion 104. In an embodiment, for example, the supporting portion 104 can be tilted toward the front from the lower end to the upper end. The main body 100 can be provided with a handle 105 for enabling the user to carry and operate the cleaner. The handle 105 can be located at the rear of the supporting portion 104. In an embodiment, for example, the handle 105 can be formed to connect the rear end of the battery mounting portion 101 to the rear end of the base portion 103. For ease of use, the handle 105 can be tilted toward the front from the lower end to the upper end. For example, the upper end of the handle 105 can form an obtuse angle with the base portion 103, and the lower end of the handle 105 can form an acute angle with the battery mounting portion 101. The handle 105 can have a sufficiently large size so that the user can hold it comfortably in his or her hand. The controller 180 can be located near the rear end of the base portion 103 and on the top of the handle 105.

[0043] refer to Figure 1 and Figure 2 In an embodiment, the PCB 200 is located in the board receiving portion 102. The PCB 200 may be a single-sided PCB, a double-sided PCB, or a multi-layer PCB. The first connector 300 is disposed on the PCB 200. The first connector 300 may include a first connector housing 310 and a first terminal portion 320 supported on the first connector housing 310. For example, the first terminal portion 320 may penetrate the PCB 200 in the thickness direction and be electrically connected to a printed circuit pattern disposed on the PCB 200 by soldering.

[0044] PCB 200 may have a structure for transmitting power between battery 900 and main body 100. For example, first terminal portion 320 may include first power terminals 321 and 322. First power terminal 321 may be a positive terminal, and first power terminal 322 may be a ground terminal. First power terminals 321 and 322 may be terminals for supplying power to power-consuming components of the cleaner. Power-consuming components may include, for example, suction motor 191a. PCB 200 may include power connection portions 211 and 212 for supplying power to power-consuming components in main body 100. Power connection portions 211 and 212 are electrically connected to first power terminals 321 and 322, respectively. Power supply lines 221 and 222 may be connected to power connection portions 211 and 212, respectively. Power supply lines 221 and 222 electrically connect power-consuming components to power connection portions 211 and 212.

[0045] The PCB 200 may also have a structure for transmitting a control signal between the battery 900 and the main body 100. For example, the first terminal portion 320 may also include a first control signal terminal 323. The first control signal terminals 323 each transmit a control signal between the battery 900 and the controller 180 of the main body 100. A control signal tap 230 may also be provided on the PCB 200. The control signal tap 230 may be electrically connected to the first control signal terminal 323. The control signal tap 230 may be electrically connected to various sensors (not shown) in the main body 100. The control signal tap 230 is connected to the controller 180, such as a control circuit of the controller 180, via a wire 231.

[0046] The first control signal terminal 323 may be located between the first power terminals 321 and 322. In an embodiment, the first power terminals 321 and 322 may be larger than the first control signal terminal 323 to reduce the contact with the second power terminal ( Figure 4At least one of the width or height of the first power terminals 321 and 322 may be greater than the width or height of the first control signal terminal 323.

[0047] refer to Figure 2 and Figure 3 , the first connector 300 is disposed at one end of the PCB 200 ( Figure 6 201), for example, near one end of the battery mounting portion 101. The first connector 300 is exposed to the outside by means of the battery mounting portion 101. Figure 3 As shown in FIG. 1 , part of the first connector housing 310 and the first terminal portion 320 are exposed to the outside.

[0048] refer to Figure 4 In an embodiment, the battery 900 includes a battery housing 901. A plurality of battery cells (not shown) and a battery management system (BMS) circuit board (not shown) are housed in the battery housing 901. The second connector 400 may be disposed on the BMS circuit board and exposed to the outside of the battery housing 901. For example, the second connector 400 may be exposed at the front upper end of the battery housing 901. The second connector 400 may include a second connector housing 410 and a second terminal portion 420 supported on the second connector housing 410. The second terminal portion 420 may include second power terminals 421 and 422. The second terminal portion 420 may also include a second control signal terminal 423. The second power terminals 421 and 422 and the second control signal terminal 423 are arranged at positions corresponding to the positions of the first power terminals 321 and 322 and the first control signal terminal 323 of the first connector 300.

[0049] exist Figure 5 In the embodiment, the main body 100 is not shown. Figure 2 , Figure 4 and Figure 5 , when the battery 900 is mounted on the battery mounting portion 101 of the main body 100, the first connector 300 and the second connector 400 are coupled to each other. The first terminal portion 320 and the second terminal portion 420 are coupled to each other and electrically connected. The first terminal portion 320 can be matched with the second terminal portion 420. The first power terminals 321 and 322 are respectively coupled to the second power terminals 421 and 422. Therefore, the power from the battery 900 can be delivered to the PCB 200. The power from the battery 900 can be delivered to the main body 100, such as components that consume power, via the second power terminals 421 and 422, the first power terminals 321 and 322, the power connection portions 211 and 212 of the PCB 200, and the power supply lines 221 and 222.

[0050] The first control signal terminal 323 is coupled to the second control signal terminal 423. Therefore, the control signal from the battery 900 can be sent to the PCB 200. The battery 900 can exchange control signals with the controller 180 via the second control signal terminal 423, the first control signal terminal 323, the control signal tap 230 on the PCB 200, and the wire 231.

[0051] When the cleaner is used, heat may be generated in the power system from the battery 900 to the main body 100 (such as, suction motor 191a). For example, heat may be generated at the first terminal part 320 of the first connector 300 and the second terminal part 420 of the second connector 400. A large amount of heat is generated at the first power terminals 321 and 322 of the first terminal part 320, and power is transmitted from the battery 900 to the main body 100 at the first power terminals 321 and 322 of the first terminal part 320. The heat generated in the first terminal part 320 may be transferred to the inside of the battery 900 via the second terminal part 420, and negatively affect the power efficiency of the battery 900. In addition, the heat generated in the power system including the first terminal part 320 may negatively affect the performance and life of the cleaner. When the temperature of the first power terminals 321 and 322 of the first connector 300 rises, the first power terminals 321 and 322 may cause deformation of the appearance of the adjacent components and the main body 100 constituting the cleaner, color changes of the shell components forming the appearance of the main body 100, etc. The present disclosure provides a heat dissipation structure capable of dissipating heat generated in a power system including the first terminal portion 320. The present disclosure provides a heat dissipation structure capable of suppressing a temperature increase of the first power terminals 321 and 322 by dissipating heat from the first power terminals 321 and 322.

[0052] In an embodiment of the present disclosure, the heat dissipation structure may be disposed on the PCB 200 . Figure 6 2 is a schematic plan view of a PCB 200 to which a heat dissipation structure according to an embodiment of the present disclosure is applied. Figure 6, the heat dissipation structure 500 is disposed on the PCB 200. The heat dissipation structure 500 is disposed on the surface of the PCB 200. The heat dissipation structure 500 may include a heat dissipation pad 520 and a plurality of heat dissipation patterns 510 arranged two-dimensionally on the heat dissipation pad 520. The plurality of heat dissipation patterns 510 may be formed on the surface of the PCB 200 except for the area 241 where the control signal pattern is formed. For example, the control signal pattern may include a pattern that electrically connects the first control signal terminal 323 to the control signal tap 230. The control signal pattern may include a pattern that electrically connects the control signal tap 230 or another control signal tap or (multiple) taps on the PCB 200 to the sensor inside the body 100. In an embodiment of the present disclosure, the heat dissipation structure 500 is disposed on the first side 200-1 of the PCB 200. In such an embodiment of the present disclosure, the plurality of heat dissipation patterns 510 may be arranged two-dimensionally in the area between the first power terminals 321 and 322 and the control signal tap 230. In an embodiment of the present disclosure, a plurality of heat dissipation patterns 510 may be formed beyond the control signal tap 230 to a region extending to the end 202 of the PCB 200, the end 202 of the PCB 200 being opposite to the end 201 where the first connector 300 is located. Fig. 9 Describe this.

[0053] The heat dissipation pad 520 may be disposed on an area other than the area 241 where the control signal pattern is formed on the first side 200-1 of the PCB 200. The heat dissipation pad 520 may include a metal having electrical conductivity and thermal conductivity (such as copper (Cu), gold (Au), silver (Ag), tin (Sn), etc.) or be formed of a metal having electrical conductivity and thermal conductivity (such as copper (Cu), gold (Au), silver (Ag), tin (Sn), etc.). In this embodiment of the present disclosure, the heat dissipation pad 520 is disposed on an area between the first power terminals 321 and 322 and the control signal tap 230. The heat dissipation pad may also be referred to as a pad. A plurality of heat dissipation patterns 510 are arranged two-dimensionally on the heat dissipation pad 520. A plurality of heat dissipation patterns 510 are formed to protrude from the first side 200-1 of the PCB 200. For example, the heat dissipation pattern 510 may be a welding pattern. In an embodiment, the heat dissipation pad 520 may be formed beyond the control signal tap 230 to the vicinity of the end 202 opposite to the end 201 of the PCB 200 where the first connector 300 is located. Fig. 9 Describe this.

[0054] The heat dissipation pad 520 may include a first heat dissipation pad 521 and a second heat dissipation pad 522. The first heat dissipation pad 521 may extend from an area adjacent to the first power terminal 321 of the PCB 200 toward the end 202 of the PCB 200, for example, to the vicinity of the control signal tap 230. The first heat dissipation pad 522 may extend from an area adjacent to the first power terminal 322 of the PCB 200 toward the end 202 of the PCB 200, for example, to the vicinity of the control signal tap 230. The area 241 where the control signal pattern is formed may be located between the first heat dissipation pad 521 and the second heat dissipation pad 522. The plurality of heat dissipation patterns 510 include a plurality of first heat dissipation patterns 511 and a plurality of second heat dissipation patterns 512 that are two-dimensionally arranged on the first heat dissipation pad 521 and the second heat dissipation pad 522, respectively.

[0055] Figure 7 is a schematic cross-sectional view showing a heat dissipation structure 500 according to an embodiment of the present disclosure. Figure 7 , the heat dissipation pad 520 is disposed on one surface of the PCB 200. The surface of the heat dissipation pad 520 is covered by a cover layer 209 except for the area where the plurality of heat dissipation patterns 510 are to be formed. The cover layer 209 may be, for example, an insulating layer. The cover layer 209 is used as a mask layer to define the area where the heat dissipation pattern 510 is to be formed. A plurality of exposed areas 529 arranged two-dimensionally on the surface of the heat dissipation pad 520 are defined by the cover layer 209. A plurality of heat dissipation patterns 510 are formed by forming, for example, welding patterns on the plurality of exposed areas 529, respectively. Thus, a heat dissipation structure 500 including a heat dissipation pad 520 and a plurality of heat dissipation patterns 510 arranged two-dimensionally on the heat dissipation pad 520 may be formed.

[0056] Heat generation in the power system mainly occurs in the first terminal portion 320 where a large amount of current flows, such as the first power terminals 321 and 322 and their surroundings. The inside of the support portion 104 is an idle space. The PCB 200 can be set in the board receiving portion 102 inside the support portion 104, and the surface area of ​​the PCB 200 can be used as a surface area for heat dissipation. The size of the PCB 200 can be increased to a size large enough to accommodate the PCB 200 in the board receiving portion 102. By forming a heat dissipation structure 500 with high thermal conductivity on the PCB 200, heat can be transferred to a wide area of ​​the PCB 200, and the heat is dissipated to the inside of the board receiving portion 102 by the heat dissipation structure 500, and the temperature increase of the power system including the first power terminals 321 and 322 can be suppressed. Because the protruding heat dissipation pattern 510 is formed on the heat dissipation pad 520, the top surface and the side surface of the heat dissipation pattern 510 become an effective heat dissipation surface area in contact with the air inside the board receiving portion 102. Therefore, the heat dissipation surface area can be effectively increased, and the heat dissipation efficiency can be improved. By forming the heat dissipation pattern 510 as a solder pattern, the heat dissipation structure 500 can be formed during the manufacturing process of the PCB 200.

[0057] Reference again Figure 6 , the power connection parts 211 and 212 may be positioned adjacent to the first power terminals 321 and 322, respectively. The power connection parts 211 and 212 are connected to the first power terminals 321 and 322 via power patterns 211a and 212a, respectively. The power patterns 211a and 212a form current paths from the first power terminal 321 to the power connection part 211 and from the first power terminal 322 to the power connection part 212, respectively. The first heat dissipation pad 521 and the second heat dissipation pad 522 are separated from the first power terminals 321 and 322, respectively. The first heat dissipation pad 521 and the second heat dissipation pad 522 are separated from the power patterns 211a and 212a, respectively. In this embodiment, the first heat dissipation pad 521 and the second heat dissipation pad 522 are separated from the current paths from the first power terminal 321 to the power connection part 211 and from the first power terminal 322 to the power connection part 212, respectively.

[0058] Figure 8 is a schematic plan view showing a heat dissipation structure according to an embodiment of the present disclosure. Figure 8 According to the embodiments of the present disclosure Figure 8 The heat dissipation structure 500 according to the embodiment of the present disclosure Figure 6The difference of the heat dissipation structure 500 is that the first heat dissipation pad 521 and the second heat dissipation pad 522 are connected to the first power terminals 321 and 322, respectively. In this embodiment, the heat from the first power terminals 321 and 322 can be effectively transferred to the heat dissipation structure 500 and dissipated through the heat dissipation structure 500. In addition, as Figure 8 As shown in the figure, the first heat dissipation pad 521 and the second heat dissipation pad 522 can be integrated with the power patterns 211a and 212a, respectively. The first heat dissipation pad 521 and the second heat dissipation pad 522 are respectively connected to the current path from the first power terminal 321 to the power connection part 211 and from the first power terminal 322 to the power connection part 212. In other words, the power connection parts 211 and 212 can be connected to the first power terminals 321 and 322 respectively through the first heat dissipation pad 521 and the second heat dissipation pad 522. Therefore, the heat from the first power terminals 321 and 322, the heat generated in the current path between the first power terminals 321 and 322 and the power connection parts 211 and 212, and the heat generated in the power supply lines 221 and 222 and the power connection parts 211 and 212 can be effectively transferred to the heat dissipation structure 500 and dissipated through the heat dissipation structure 500. Although not shown, the first and second heat dissipation pads 521 and 522 may be connected to the first power terminals 321 and 322 , respectively, but separated from the power patterns 211 a and 212 a .

[0059] Fig. 9 Schematic plan view showing a heat dissipation structure according to an embodiment of the present disclosure. Fig. 9 The heat dissipation structure 500 according to the embodiment of the present disclosure Figure 6 and Figure 8 The heat dissipation structure 500 is different in that the power connection portions 211 and 212 are spaced further apart from the first power terminals 321 and 322, respectively. Fig. 9, the power connection parts 211 and 212 are positioned adjacent to the end 202 of the PCB 200. In other words, the power connection parts 211 and 212 are spaced further from the first connector 300 than the control signal tap 230. The first heat dissipation pad 521 and the second heat dissipation pad 522 are connected to the first power terminals 321 and 322, respectively, and extend to the power connection parts 211 and 212, respectively. Therefore, the first heat dissipation pad 521 and the second heat dissipation pad 522 form a current path from the first power terminal 321 to the power connection part 211 and from the first power terminal 322 to the power connection part 212, respectively. As a result, the heat dissipation area of ​​the heat dissipation structure 500 can be increased, thereby improving the heat dissipation effect. Heat from the first power terminals 321 and 322, heat generated in the current paths connecting the first power terminals 321 and 322 to the power connection parts 211 and 212 respectively, and heat generated in the power supply lines 221 and 222 and the power connection parts 211 and 212 can be effectively transferred to the heat dissipation structure 500 and dissipated through the heat dissipation structure 500.

[0060] In the above embodiment, the heat dissipation structure 500 is disposed on the first surface 200 - 1 of the PCB 200 . The heat dissipation structure 500 may be disposed on both surfaces of the PCB 200 . Fig.10 is a schematic cross-sectional view showing a double-sided heat dissipation structure according to an embodiment of the present disclosure. Fig.10 , the PCB 200 may include a first surface 200-1 and a second surface 200-2 opposite to the first surface 200-1. The first heat dissipation structure 500-1 and the second heat dissipation structure 500-2 may be respectively disposed on the first surface 200-1 and the second surface 200-2 of the PCB 200. The first heat dissipation structure 500-1 and the second heat dissipation structure 500-2 may be connected to the reference Figures 6 to 9 The described implementation of the heat dissipation structure 500 is the same.

[0061] In an embodiment, for example, the first heat dissipation structure 500-1 may include a first heat dissipation pad 520-1 disposed on the first face 200-1 of the PCB 200 and a plurality of first heat dissipation patterns 510-1 two-dimensionally arranged on the surface of the first heat dissipation pad 520-1. The surface of the first heat dissipation pad 520-1, except for the region where the plurality of first heat dissipation patterns 510-1 are to be formed, is covered by the cover layer 209, so that a plurality of exposed regions 529-1 two-dimensionally arranged are disposed on the surface of the first heat dissipation pad 520-1. The first heat dissipation pattern 510-1 is arranged in each of the plurality of exposed regions 529-1. Thus, the first heat dissipation structure 500-1 including a plurality of heat dissipation patterns 510-1 two-dimensionally arranged may be formed. The second heat dissipation structure 500-2 may include a second heat dissipation pad 520-2 disposed on the second face 200-2 of the PCB 200 and a plurality of second heat dissipation patterns 510-2 two-dimensionally arranged on the surface of the second heat dissipation pad 520-2. The surface of the second heat dissipation pad 520-2 is covered by the cover layer 209 except for the area where the plurality of second heat dissipation patterns 510-2 are to be formed, so that the plurality of exposed areas 529-2 arranged two-dimensionally are provided on the surface of the second heat dissipation pad 520-2. The second heat dissipation pattern 510-2 is arranged in each of the plurality of exposed areas 529-2. Therefore, the second heat dissipation structure 500-2 including the plurality of heat dissipation patterns 510-2 arranged two-dimensionally can be formed.

[0062] The range of the first heat dissipation pad 520-1 of the first heat dissipation structure 500-1 and the number and arrangement of the plurality of first heat dissipation patterns 510-1 may be the same as or different from the range of the second heat dissipation pad 520-2 of the second heat dissipation structure 500-2 and the number and arrangement of the plurality of second heat dissipation patterns 510-2. By considering the arrangement of the circuit elements respectively disposed on the first side 200-1 and the second side 200-2 of the PCB 200 and the range of the area 241 where the control signal pattern is formed, the first heat dissipation structure 500-1 and the second heat dissipation structure 500-2 may be formed in an appropriate shape and size. By forming the first heat dissipation structure 500-1 and the second heat dissipation structure 500-2 on both sides of the PCB 200, respectively, the heat dissipation area of ​​the PCB 200 may be increased, and the heat dissipation effect may be improved.

[0063] Each of the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 may be separated from the first power terminals 321 and 322 and may be connected to the first power terminals 321 and 322. Each of the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 may be separated from the current path connecting the first power terminals 321 and 322 to the power connection parts 211 and 212, respectively, or may be connected to the current path connecting the first power terminals 321 and 322 to the power connection parts 211 and 212, respectively. In other words, each of the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 may be separated from the power patterns 211a and 211b and may be integrated with the power patterns 211a and 211b.

[0064] Fig.11 Schematic cross-sectional view showing a heat dissipation structure according to an embodiment of the present disclosure. Fig.11 The heat dissipation structure according to the embodiment of the present disclosure Fig.10 The heat dissipation structure of FIG. 200 is different in that the first heat dissipation structure 500-1 and the second heat dissipation structure 500-2 are thermally connected to each other by a plurality of thermal conductive vias 530 defined or formed through the PCB 200. Fig.11 , the thermal via 530 passes through the PCB 200 in the thickness direction. The thermal via 530 can pass through the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2. The inner surface of each of the thermal vias 530 can be coated with a thermally conductive material such as metal. In this embodiment, the entire interior of the thermal via 530 can be filled with a thermally conductive material such as metal. The thermal via 530 may also be referred to as a thermal via, a via, a via hole, a through hole, etc. The first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 are thermally connected to each other through the thermal via 530, which helps the heat transfer between the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2. Therefore, the heat from the power system (such as the first power terminals 321 and 322 of the first terminal portion 320) can be actively dissipated via both sides of the PCB 200, thereby improving the heat dissipation effect. The plurality of thermal vias 530 may also thermally connect at least some of the plurality of first heat dissipation patterns 510-1 to the plurality of second heat dissipation patterns 510-2 corresponding to the first heat dissipation patterns 510-1 in the thickness direction of the PCB 200. This may further improve the heat dissipation effect.

[0065] In the experiment, in the case of a PCB without a heat dissipation structure according to the prior art, during the operation of the cleaner, the temperature of the first power terminals 321 and 322 increased to 91.4° C. According to the experiment, in the case of a PCB according to an embodiment of the present disclosure to which the first and second heat dissipation structures 500-1 and 500-2 and the thermal conductive vias 530 are applied and each of the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 has a structure separated from the current path connecting the first power terminals 321 and 322 to the power connection portions 211 and 212, respectively, the temperature of the first power terminals 321 and 322 increased to 46.1° C. According to the experiment, in the case of a PCB to which the first and second heat dissipation structures 500-1 and 500-2 and the thermal conductive vias 530 are applied according to an embodiment of the present disclosure and each of the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 has a structure connected to a current path that connects the first power terminals 321 and 322 to the power connection portions 211 and 212, respectively, the temperature of the first power terminals 321 and 322 rises to 55.6° C. Based on the experimental results, it can be seen that the PCB having the first and second heat dissipation structures 500-1 and 500-2 and the thermal conductive vias 530 and the PCB having the first and second heat dissipation structures 500-1 and 500-2 exhibit a large heat dissipation effect.

[0066] Fig.12 Schematic cross-sectional view showing a heat dissipation structure according to an embodiment of the present disclosure. Fig.12 The heat dissipation structure and Fig.11 The heat dissipation structure is different in that a multi-layer PCB is used as the PCB 200. Fig.12 , PCB 200 has a structure in which three substrate layers 200a, 200b and 200c are stacked. The first heat dissipation structure 500-1 can be arranged on the surface of the substrate layer 200a. The second heat dissipation structure 500-2 can be arranged on the rear surface of the substrate layer 200c. In this embodiment, the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 are surface heat dissipation pads respectively arranged on the surface (e.g., the first face 200-1 and the second face 200-2) of the PCB 200. Interlayer heat dissipation pads 541 and 542 can be respectively arranged on the surface of the substrate layer 200b and the substrate layer 200c. No heat dissipation pattern is formed on the interlayer heat dissipation pads 541 and 542. The interlayer heat dissipation pads 541 and 542 are located between the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2. The thermal via 530 can thermally (and electrically) connect at least two of the first heat dissipation pad 520-1 and the second heat dissipation pad 520-2 and the interlayer heat dissipation pads 541 and 542 to each other. By adopting a multi-layer PCB, the heat conduction area can be expanded, which can improve the heat dissipation effect. Fig.12A PCB 200 having a three-layer structure is shown, but the number of layers in the PCB 200 is not limited thereto. Considering the heat generated by the cleaner, a double-sided PCB (two-layer PCB) or a PCB having a multi-layer structure consisting of four or more layers may be used as the PCB 200.

[0067] In the embodiment of the present disclosure, in order to suppress the temperature increase of the first power terminals 321 and 322 of the first connector 300, a method of increasing the thermal conductivity of the first power terminals 321 and 322 of the first connector 300 may be considered. Figure 2 As described, the first connector 300 includes a first terminal portion 320. The first terminal portion 320 may include first power terminals 321 and 322 and a first control signal terminal 323. The first power terminals 321 and 322 may include a material having a high thermal conductivity or be formed of a material having a high thermal conductivity. The first power terminals 321 and 322 may include a material having a higher thermal conductivity than the first control signal terminal 323 or be formed of a material having a higher thermal conductivity than the first control signal terminal 323, wherein a relatively small amount of current flows through the first control signal terminal 323. In an embodiment of the present disclosure, the first control signal terminal 323 may be formed of copper or a copper alloy, and the first power terminals 321 and 322 may be formed of a material having a higher thermal conductivity than the thermal conductivity of the copper or copper alloy (such as silver). In an embodiment of the present disclosure, the first control signal terminal 323 may be formed of copper or a copper alloy, and the first power terminals 321 and 322 may be formed by electroplating a material having a high thermal conductivity (such as silver) on the copper or copper alloy. The thermal conductivity of copper is about 400 watts per meter Kelvin (W / m·K). The thermal conductivity of silver is about 429 W / m·K, which is about 7% higher than the thermal conductivity of copper. Therefore, the temperature increase of the first power terminals 321 and 322 can be suppressed by increasing the heat dissipation performance of the first power terminals 321 and 322. In addition, because silver has high conductivity, the contact resistance between the first power terminals 321 and 322 and the second power terminals 421 and 422 of the battery 900 can be reduced by forming the first power terminals 321 and 322 using silver, thereby reducing heat generation.

[0068] As described above, the PCB 200 is disposed inside the board receiving portion 102 of the body 100. In an embodiment, in order to improve the heat dissipation effect of the PCB 200, the board receiving portion 102 may communicate with the outside. For example, a channel allowing external air to enter the board receiving portion 102 may be provided in the body 100.

[0069] Fig.13 9 is a schematic partial perspective view of a cleaning device with a battery 900 removed according to an embodiment of the present disclosure. Fig.13As described above, in the first connector 300, part of the first connector housing 310 and the first terminal portion 320 are exposed to the outside through the battery mounting portion 101. The battery mounting portion 101 may be provided with air holes 551 and 552, and the interior of the board accommodating portion 102 is communicated with the outside via the air holes 551 and 552. The air holes 551 and 552 may be provided at predetermined positions in the battery mounting portion 101 to allow the board accommodating portion 102 to communicate with the outside. In an embodiment, the positions of the air holes 551 and 552 may be determined differently. When the battery 900 is mounted on the battery mounting portion 101, the air holes 551 and 552 may be provided at positions that are not exposed to the outside. The above-mentioned heat dissipation structure and the structure for improving the heat dissipation effect may also be applied to Fig.13 The embodiments of the present disclosure are shown in FIG.

[0070] In the PCB 200, a large amount of heat is generated in an area close to the first connector 300. Therefore, in an embodiment, the air holes 551 and 552 may be positioned adjacent to the first connector 300 to allow external air to be easily supplied to an area close to the first connector 300 on the PCB 200, or to allow heated air to easily escape to the outside. A large amount of heat is generated in the first power terminals 321 and 322. The air holes 551 and 552 may be positioned adjacent to the first power terminals 321 and 322, respectively, to allow external air to be easily supplied to an area close to the first power terminals 321 and 322, or to allow air that has absorbed heat from the first power terminals 321 and 322 to easily escape to the outside. Because the internal space of the board accommodating portion 102 is connected to the outside air via the air holes 551 and 552, the heat dissipation effect achieved by the heat dissipation structure 500 may be improved. Although in Fig.13 Two air holes 551 and 552 are shown in the figure, but considering the heat dissipation effect, one or three or more air holes may be provided in the battery mounting portion 101.

[0071] It is possible to consider a method of supplying air to the board receiving portion 102. In the embodiment of the present disclosure, by using the suction pressure from the intake passage 195, the external air may be smoothly supplied into the board receiving portion 102 via the air holes 551 and 552. Fig.14 is a schematic partial cross-sectional view of a cleaning device according to an embodiment of the present disclosure. Fig.14 The first communication port 561 is provided in the intake passage 195 through which the external air is sucked. The first communication port 561 allows the intake passage 195 to communicate with the board communication portion 102. The PCB 200 and the first connector 300 may be provided inside the board receiving portion 102.

[0072] The suction pressure generated by the suction fan 191 in the air inlet passage 195 is applied to the board accommodating portion 102. External air (hereinafter referred to as cooling air) is sucked into the board accommodating portion 102 through the air holes 551 and 552 by the suction pressure. The cooling air absorbs heat from the PCB 200 having the heat dissipation structure 500. The cooling air enters the air inlet passage 195 through the first communication port 561, combines with the air sucked through the extension pipe, passes through the dust collector and the exhaust passage 196, and is discharged to the outside of the main body 100. According to an embodiment having this configuration, since the external air is smoothly supplied to the board accommodating portion 102 through the air holes 551 and 552 by the suction pressure generated by the suction fan 191, the heat from the heat dissipation structure 500 of the PCB 200 and the heat generated by the power system including the first terminal portion 320 can be effectively dissipated to the outside of the main body 100. Since the cooling air leaves the main body 100 after the foreign matter is removed from the main body 100 by the dust collector 192 , a separate filter for filtering the cooling air may be omitted.

[0073] The above heat dissipation structure and the structure for improving heat dissipation effect can also be applied to Fig.14 The embodiments of the present disclosure are shown in FIG.

[0074] Fig.15 is a schematic partial cross-sectional view of a cleaner according to an embodiment of the present disclosure. Fig.15 Cleaner and Fig.14 The difference between the cleaners is that Fig.15 The cleaner includes a first cooling channel 562. Fig.15, the first communication port 561 is provided in the air inlet passage 195 for sucking in external air, and the air inlet passage 195 is communicated with the board receiving portion 102 via the first communication port 561. The PCB 200 and the first connector 300 may be provided inside the board receiving portion 102. The first cooling passage 562 applies the suction pressure generated in the air inlet passage 195 close to the PCB 200. For example, the first cooling passage 562 has one end connected to the first communication port 561 and the other end extending toward the PCB 200. The other end of the first cooling passage 562 may extend to a position adjacent to the PCB 200. For example, the other end of the first cooling passage 562 may extend to a position adjacent to the heat dissipation structure 500. For example, the other end of the first cooling passage 562 may extend to a position adjacent to the first connector 300. The external air (hereinafter referred to as cooling air) sucked into the board receiving portion 102 via the air holes 551 and 552 is concentrated at the other end of the first cooling passage 562 near the PCB 200. The air flow near the PCB 200 may be increased, thereby improving the heat dissipation effect. The first cooling passage 562 may be implemented by a flexible tubular member such as a tube, a hose, etc. The first cooling passage 562 may also be formed integrally with the body 100 .

[0075] The above heat dissipation structure and the structure for improving heat dissipation effect can also be applied to Fig.15 The embodiments of the present disclosure are shown in FIG.

[0076] In the embodiment of the present disclosure, exhaust air discharged through the exhaust passage 196 may be supplied into the board receiving portion 102 . Fig.16 is a schematic partial cross-sectional view of a cleaning device according to an embodiment of the present disclosure. Fig.16 , the exhaust passage 196 is connected to the board receiving portion 102. The PCB 200 and the first connector 300 may be disposed inside the board receiving portion 102.

[0077] For example, the second communication port 571 communicated with the board accommodating portion 102 may be provided in the exhaust passage 196. For example, the exhaust passage 196 may be connected to the board accommodating portion via the second cooling passage 572. One end of the second cooling passage 572 may branch from the exhaust passage 196. As an example, the second cooling passage 572 may have one end connected to the second communication port 571 and the other end extending into the board accommodating portion 102. A portion of the exhaust air (hereinafter referred to as cooling air) flowing through the exhaust passage 196 is supplied to the board accommodating portion 102 through the second cooling passage 572. The cooling air absorbs heat from the PCB 200 having the heat dissipation structure 500. The cooling air is discharged to the outside of the body 100 through the air holes 551 and 552. According to this configuration, since part of the exhaust air is used to cool the PCB 200, the heat from the heat dissipation structure 500 of the PCB 200 and the heat generated by the power system including the first terminal portion 320 can be effectively removed. Since the exhaust air is cleared of foreign matter, a separate filter is not required to purify the cooling air emitted from the exhaust air.

[0078] The other end of the second cooling channel 572 can extend toward the PCB 200, for example, to a position adjacent to the PCB 200. For example, the other end of the second cooling channel 572 can extend to a position adjacent to the heat dissipation structure 500. For example, the other end of the second cooling channel 572 can extend to a position adjacent to the first connector 300. Part of the exhaust air (cooling air) sucked into the board accommodating portion 102 through the second cooling channel 572 is supplied to the vicinity of the PCB 200. The flow rate of the cooling air near the PCB 200 can be increased, thereby improving the heat dissipation effect. The second cooling channel 572 can be implemented by a flexible tubular member such as a tube, a hose, etc. The second cooling channel 572 can also be formed integrally with the main body 100.

[0079] The above heat dissipation structure and the structure for improving heat dissipation effect can also be applied to Fig.16 The embodiments of the present disclosure are shown in FIG.

[0080] The first terminal portion 320 of the first connector 300 is supported on the first connector housing 310. In the embodiment of the present disclosure, a method of using the first connector housing 310 for heat dissipation may be considered. To this end, the first connector housing 310 may include an insulating material having high thermal conductivity or be formed of an insulating material having high thermal conductivity. The first connector housing 310 may be formed of a polymer compound, oxide, nitride, etc. having high thermal conductivity. For example, the first connector housing 310 may be made of aluminum oxide (Al 2 O 3 ), magnesium oxide (MgO), boron nitride (BN), etc.

[0081] The second terminal portion 420 of the second connector 400 is supported on the second connector housing 410. In the embodiment of the present disclosure, a method of using the second connector housing 410 for heat dissipation may be considered. To this end, the second connector housing 410 may include an insulating material having high thermal conductivity or be formed of an insulating material having high thermal conductivity. The second connector housing 310 may be formed of a polymer compound, oxide, nitride, etc. having high thermal conductivity. For example, the second connector housing 410 may be made of Al 2 O 3 , MgO, BN, etc.

[0082] In an embodiment of the present disclosure, heat dissipation using the first power terminals 321 and 322 of the first connector 300 may be considered. Fig.17 is a schematic perspective view of a first connector 300 according to an embodiment of the present disclosure. Fig.17 PCB 200 and first connector 300 are shown. Figure 2 and Fig.17 The first power terminals 321 and 322 may respectively include engaging portions (eg, engaging with corresponding terminals (eg, second power terminals 421 and 422) of the second connector 400) Figure 2 The first power terminals 321 and 322a are connected to the board receiving portion 102 and are provided with protruding portions 321b and 322b extending from the engaging portions 321a and 322a in the thickness direction of the PCB 200 and protruding outward from the PCB 200 by penetrating the PCB 200. For example, the engaging portions 321a and 322a protrude from the first side 200-1 of the PCB 200, and the protruding portions 321b and 322b penetrate the PCB 200 and protrude from the second side 200-2 of the PCB 200. The protruding portions 321b and 322b protrude from the second side 200-2 of the PCB 200 by a greater amount than the first control signal terminal 323 protrudes from the second side 200-2 of the PCB 200. The protruding portions 321b and 322b protrude into the board receiving portion 102 and are exposed to the air inside the board receiving portion 102, so that the heat from the first power terminals 321 and 322 can be dissipated through the protruding portions 321b and 322b. Therefore, the protruding portions 321b and 322b can help suppress the temperature increase of the first power terminals 321 and 322. The heat dissipation effect achieved by the protruding portions 321b and 322b can be improved by means of combination with the air holes 551 and 552. The heat dissipation effect achieved by the protruding portions 321b and 322b can be improved by means of combination with a structure that allows communication between the intake passage 195 and / or the exhaust passage 196 and the board accommodating portion 102.

[0083] The above heat dissipation structure and the structure for improving heat dissipation effect can also be applied to Fig.17The embodiments of the present disclosure are shown in FIG.

[0084] In an embodiment of the present disclosure, a dummy terminal for heat dissipation may be provided on the PCB 200. The dummy terminal may be provided on the first side 200-1 or the second side 200-2 of the PCB 200 or on both sides of the PCB 200. The number of dummy terminals is not particularly limited. The number of dummy terminals may be appropriately determined in consideration of the structure of the cleaner and the amount of heat generated.

[0085] Fig.18 and Fig.19 is a schematic perspective view of a PCB 200 according to an embodiment of the present disclosure. Fig.18 and Fig.19 The PCB 200 and the first connector 300 are shown. Fig.18 , one or more dummy terminals 581 may be provided on the first side 200-1 of the PCB 200. One or more dummy terminals 581 each protrude from the first side 200-1 of the PCB 200. One or more dummy terminals 581 may each be formed of, for example, a material having high thermal conductivity (such as metal). One or more dummy terminals 581 may be connected to the heat dissipation pad 520 of the heat dissipation structure 500. One or more dummy terminals 581 may penetrate the PCB 200 and protrude from the second side 200-2 of the PCB 200. One or more dummy terminals 581 protrude into the board accommodating portion 102 and are exposed to the air inside the board accommodating portion 102, and the heat from the heat dissipation structure 500 provided on the PCB 200 and the heat generated by the power system including the first terminal portion 320 may be dissipated through the one or more dummy terminals 581. Therefore, one or more dummy terminals 581 may help suppress the temperature increase of the first power terminals 321 and 322. The heat dissipation effect achieved by one or more dummy terminals 581 can be improved by means of a combination with the air holes 551 and 552. The heat dissipation effect achieved by one or more dummy terminals 581 can be improved by means of a combination with a structure that allows communication between the intake channel 195 and / or the exhaust channel 196 and the board accommodating portion 102.

[0086] refer to Fig.19, one or more dummy terminals 582 may be provided on the second side 200-2 of the PCB 200. One or more dummy terminals 582 each protrude from the second side 200-2 of the PCB 200. One or more dummy terminals 582 may each be formed of, for example, a material having high thermal conductivity (such as metal). One or more dummy terminals 582 may be connected to the heat dissipation pad 520 of the heat dissipation structure 500. One or more dummy terminals 582 may penetrate the PCB 200 and protrude from the first side 200-1 of the PCB 200. One or more dummy terminals 582 protrude into the board accommodating portion 102 and are exposed to the air inside the board accommodating portion 102, and the heat generated in the heat dissipation structure on the PCB 200 and the power system including the first terminal portion 320 may be dissipated through one or more dummy terminals 582. Therefore, one or more dummy terminals 582 may help to suppress the temperature rise of the first power terminals 321 and 322. The heat dissipation effect achieved by one or more dummy terminals 582 may be improved by means of a combination with the air holes 551 and 552. The heat dissipation effect achieved by the one or more dummy terminals 582 may be improved by means of a combination with a structure that allows communication between the intake passage 195 and / or the exhaust passage 196 and the board receiving portion 102 .

[0087] The above heat dissipation structure and the structure for improving heat dissipation effect can also be applied to Fig.18 and Fig.19 The embodiments of the present disclosure are shown in FIG.

[0088] According to aspects of the present disclosure, the cleaner includes: a main body, including a board accommodating portion and a battery mounting portion; a PCB, located in the board accommodating portion; a first connector, including a first terminal portion, and arranged on the PCB so that the first terminal portion is exposed to the outside through the battery mounting portion; a battery, which can be removed from the battery mounting portion; a second connector, arranged in the battery, and including a second terminal portion connected to the first terminal portion when the battery is mounted on the battery mounting portion; and a heat dissipation structure, including a heat dissipation pad arranged on the PCB and a plurality of heat dissipation patterns arranged two-dimensionally on the heat dissipation pad, and configured to dissipate heat from the first terminal portion.

[0089] In an embodiment of the present disclosure, the PCB may include a region where the control signal pattern is formed, and the heat dissipation pad may be provided on a region of the surface of the PCB 200 excluding the region where the control signal pattern is formed.

[0090] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal, and the heat dissipation pad may be separated from the first power terminal.

[0091] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal, and the heat dissipation pad may be connected to the first power terminal.

[0092] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal, and the PCB may include a power connection portion connected to the first power terminal portion. The heat dissipation pad may be separated from a current path between the first power terminal and the power connection portion.

[0093] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal, and the PCB may include a power connection portion connected to the first power terminal portion. The heat dissipation pad may be connected to a current path between the first power terminal and the power connection portion.

[0094] In an embodiment of the present disclosure, the PCB may include a first surface and a second surface opposite to the first surface. The heat dissipation structure may include a first heat dissipation structure disposed on the first surface and a second heat dissipation structure disposed on the second surface.

[0095] In an embodiment of the present disclosure, the first heat dissipation structure may be connected to the second heat dissipation structure through a plurality of thermal conductive vias passing through the PCB.

[0096] In an embodiment of the present disclosure, the PCB may be a multilayer PCB. The heat dissipation pad may include a pair of surface heat dissipation pads located on the surface of the PCB and having a plurality of heat dissipation patterns formed thereon and an interlayer heat dissipation pad between the pair of surface heat dissipation pads. At least two of the pair of surface heat dissipation pads and the interlayer heat dissipation pad may be thermally connected to each other.

[0097] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal and a first control signal terminal, and the first power terminal may be formed of a material having a higher thermal conductivity than that of the first control signal terminal.

[0098] In an embodiment of the present disclosure, the first power terminal may be silver-plated.

[0099] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal and a first control signal terminal, and the first power terminal may be larger than the first control signal terminal.

[0100] In an embodiment of the present disclosure, the battery mounting portion may be provided with an air hole through which the inside of the board receiving portion communicates with the outside of the board receiving portion.

[0101] In an embodiment of the present disclosure, the air hole may be located adjacent to the first connector.

[0102] In an embodiment of the present disclosure, the body may include an air intake passage through which external air is sucked, and a first communication port communicating with the board accommodating portion may be provided in the air intake passage. In an embodiment of the present disclosure, the cleaner may include a first cooling passage having one end connected to the first communication port and the other end extending toward the PCB.

[0103] In an embodiment of the present disclosure, the main body may include an exhaust channel through which the sucked air is exhausted, and the exhaust channel may be connected to the board accommodating portion. In an embodiment of the present disclosure, the cleaner may include a second cooling channel having one end branching from the exhaust channel and the other end extending toward the PCB.

[0104] In an embodiment of the present disclosure, the first terminal portion may include a first power terminal and a first control signal terminal. The first power terminal may include a bonding portion protruding from a first side of the PCB and engaging with the second terminal portion, and a protruding portion extending from the bonding portion in a thickness direction of the PCB and penetrating the PCB to protrude from the second side of the PCB more than the first control signal terminal.

[0105] In an embodiment of the present disclosure, the cleaner may include a dummy terminal protruding from at least one of the first side or the second side of the PCB.

[0106] Although the embodiments of the present disclosure shown in the accompanying drawings have been referred to for understanding of the present disclosure and specific terms have been used to describe the embodiments of the present disclosure, the scope of the present disclosure is not limited by the specific terms and the present disclosure will be construed to cover all embodiments that would normally occur to one of ordinary skill in the art.

[0107] The specific implementation described herein corresponds only to the embodiments of the present disclosure, and does not limit the scope of the present disclosure in any way. For the purpose of simplifying the specification, conventional electronic configurations, control systems, software and other functional aspects of the system can be omitted. In addition, the connecting wires or connectors shown in each figure are intended to represent the exemplary functional connections and / or physical or circuit connections between the components in the figure, and in actual devices, the connections between the components can be represented by many alternatives or additional functional relationships, physical connections or logical connections. In addition, unless the element is specifically described as "essential", "critical", etc., the element may not be necessary for the practice of the present disclosure. As used herein, terms such as "comprising", "including", etc. are used to be understood as open terms for describing the embodiments of the present disclosure.

[0108] The use of the term "said" and similar indicators in the context of describing the present disclosure (particularly in the context of the appended claims) should be interpreted as covering both the singular and the plural. In addition, the description of the range of values ​​herein is intended only to be used as a shorthand method for individually referring to each individual value falling within the range (unless otherwise indicated herein), and each individual value is incorporated into this specification as if it were individually described herein. Finally, unless clearly specified herein or contradicted by the context, the operation of the method according to the disclosure described herein can be performed in any suitable order. The present disclosure is not limited to the described order of operations. The use of any and all examples or exemplary language (e.g., "such as" etc.) provided herein is intended only to describe the present disclosure in detail, and unless otherwise limited by the claims, the scope of the present disclosure is not limited. In addition, various changes and modifications will be apparent to those of ordinary skill in the art without departing from the spirit and scope of the present disclosure.

Claims

1. Cleaner, including: A main body (100) including a board receiving portion (102) and a battery mounting portion (101); A printed circuit board PCB (200) is arranged in the board receiving portion; a first connector (300) including a first terminal portion (320) and disposed on the PCB such that the first terminal portion is exposed to the outside through the battery mounting portion; A battery (900) capable of being removed from the battery mounting portion; a second connector (400) provided in the battery and comprising a second terminal portion (420) coupled to the first terminal portion when the battery is mounted on the battery mounting portion; and The heat dissipation structure (500) comprises a heat dissipation pad (520) provided on the PCB and a plurality of heat dissipation patterns (510) arranged two-dimensionally on the heat dissipation pad, and is configured to dissipate heat from the first terminal portion.

2. The cleaning device according to claim 1, wherein: The PCB includes an area (241) where a control signal pattern is formed, and The heat dissipation pad is disposed on a region of the surface of the PCB except for the region where the control signal pattern is formed.

3. The cleaning device according to claim 1, wherein: The first terminal portion includes a first power terminal (321, 322), and The heat dissipation pad is separated from the first power terminal.

4. The cleaning device according to claim 1, wherein: The first terminal portion includes the first power terminals (321, 322), and The heat dissipation pad is connected to the first power terminal.

5. The cleaning device according to claim 1, wherein: The first terminal portion includes a first power terminal (321, 322), The PCB includes a power connection portion (211, 212) connected to the first power terminal portion, and The heat dissipation pad is separated from a current path between the first power terminal and the power connecting portion.

6. The cleaning device according to claim 1, wherein: The first terminal portion includes a first power terminal (321, 322), The PCB includes a power connection portion (211, 212) connected to the first power terminal portion, and The heat dissipation pad is connected to a current path between the first power terminal and the power connection portion.

7. The cleaning device according to any one of claims 1 to 6, wherein: The PCB comprises a first surface (200-1) and a second surface (200-2) opposite to the first surface, The heat dissipation structure comprises a first heat dissipation structure (500-1) arranged on the first surface and a second heat dissipation structure (500-2) arranged on the second surface, and The first heat dissipation structure is connected to the second heat dissipation structure via a plurality of thermal conductive vias (530) passing through the PCB.

8. The cleaning device according to any one of claims 1 to 6, wherein: The PCB is a multi-layer PCB, The heat dissipation pad comprises: a pair of surface heat dissipation pads (520) located on the surface of the PCB, and the plurality of heat dissipation patterns are formed on the pair of surface heat dissipation pads; and an interlayer heat dissipation pad (541, 542) located between the pair of surface heat dissipation pads, and At least two of the pair of surface heat dissipation pads and the interlayer heat dissipation pads are thermally connected to each other.

9. The cleaning device according to any one of claims 1 to 8, wherein: The first terminal portion includes the first power terminals (321, 322) and a first control signal terminal (323), and The first power terminals are each formed of a material having a thermal conductivity higher than that of the first control signal terminal.

10. The cleaning device according to any one of claims 1 to 9, wherein: The first terminal portion includes the first power terminals (321, 322) and the first control signal terminal (323), and Each of the first power terminals is larger than each of the first control signal terminals.

11. The cleaning device according to any one of claims 1 to 10, wherein: The battery mounting portion includes air holes (551, 552), and the interior of the board receiving portion communicates with the exterior of the board receiving portion through the air holes (551, 552).

12. A cleaning device according to any one of claims 1 to 11, wherein: The main body includes an air intake passage (195) through which external air is sucked, and A first communication port (561) configured to communicate with the plate accommodating portion is provided in the air intake passage.

13. A cleaning device according to any one of claims 1 to 12, wherein: The main body includes an exhaust passage (196) through which the inhaled air is exhausted, and The exhaust passage is connected to the board accommodating portion.

14. A cleaning device according to any one of claims 1 to 13, wherein: The first terminal portion includes the first power terminals (321, 322) and the first control signal terminal (323), and The first power terminals respectively include: an engaging portion (321a and 322a) protruding from the first side of the PCB and engaging with the second terminal portion; and Protruding portions (321b and 322b) respectively extend from the engaging portion in a thickness direction of the PCB and penetrate the PCB to protrude more from the second face of the PCB than the first control signal terminal.

15. The cleaner according to any one of claims 1 to 14, comprising dummy terminals (581, 582) protruding from at least one of the first side or the second side of the PCB.

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