Cooling device for cooling electronic component and electronic device comprising such cooling device

Abstract

A cooling apparatus for cooling one or more electronic components is disclosed. The cooling device includes a substrate having a front wall (110a), a rear wall (110b), and a substrate cavity (110c), and further includes a plurality of cooling fins (120a). Each cooling fin (120a) defines a cooling fin cavity (124) and is attached to the front wall (110a) of the substrate such that the cooling fin cavity (124) is in fluid communication with at least a portion of the substrate cavity (110c). The substrate and each cooling fin (120a) of the plurality of cooling fins (120a) define a loop heat pipe (LHP) for circulating a coolant, where the coolant includes a liquid coolant and a vapor coolant. The LHP comprises an LHP evaporation zone (A) within the substrate cavity (124), an LHP compensation zone (B) within the cooling fin (120a), and a core element (122a, 122b) arranged within the substrate cavity (110c) to extend at least partially between the LHP evaporation zone (A) and the LHP compensation zone (B) and for absorbing and conveying the liquid coolant to separate the LHP evaporation zone (A) from the LHP compensation zone (B).

Description

Technical Field

[0001] The present invention relates to cooling technology, and in particular to a cooling device for cooling electronic components and an electronic device comprising the cooling device. Background Art

[0002] When current flows through electronic components, they generate heat. The amount of heat depends on the power, device characteristics, and circuit design. The resistance of the processor, driver circuits, power circuits, and memory will cause some heat and power loss. To avoid failure or circuit malfunction, electronic components must operate and remain within a safe temperature range. While some circuits can work without additional cooling, most circuits require heat dissipation and cooling mechanisms. Summary of the invention

[0003] The object is to provide an improved cooling device for cooling electronic components and an electronic device comprising such an improved cooling device.

[0004] The above and other objects are achieved by the subject matter claimed in the independent claims. Other implementations are apparent from the dependent claims, the description and the drawings.

[0005] According to a first aspect, a cooling device for cooling one or more electronic components such as an electronic chip or a microprocessor is provided.

[0006] The cooling device comprises a substrate having a front wall, a rear wall and a substrate cavity defined between the front wall and the rear wall. When in use, the rear wall of the substrate is used for thermal contact with one or more electronic components to be cooled. The substrate can be made of metal, especially aluminum or an aluminum alloy.

[0007] Furthermore, the cooling device comprises a plurality of cooling fins, wherein each cooling fin defines a cooling fin cavity and is attached to the front wall of the base plate such that the cooling fin cavity is in fluid communication with at least a portion of the base plate cavity. Each cooling fin may be made of metal, in particular aluminum or an aluminum alloy. The cooling fin cavity may comprise a plurality of serpentine cooling channels.

[0008] The substrate and each of the plurality of cooling fins define a corresponding loop heat pipe (LHP), the LHP being used to circulate a coolant, wherein the coolant includes a liquid phase coolant and a vapor phase coolant. The LHP includes an LHP evaporation zone (also referred to as an LHP evaporator) in the substrate cavity, wherein the LHP evaporation zone is used to convert the liquid phase coolant into the vapor phase coolant, i.e., evaporate the liquid phase coolant. In addition, the LHP includes an LHP compensation zone (also referred to as an LHP reservoir) in the corresponding cooling fin, wherein the LHP compensation zone is used to accumulate condensed liquid phase coolant and supply the coolant back to the LHP evaporator. The LHP also includes a core element (also referred to as a core structure), which is arranged in the substrate cavity to extend at least partially between the LHP evaporation zone and the LHP compensation zone, and is used to separate the LHP evaporation zone from the LHP compensation zone, and absorb and transport liquid coolant. The core element may include metal powder, such as aluminum alloy powder, pure aluminum powder, copper powder, etc. Thus, an improved cooling device is provided that is capable of efficiently cooling electronic components by means of an LHP cooling circuit. The improved cooling device has a lower thermal resistance and thus a more uniform temperature distribution along the base plate and cooling fins, thereby providing an easier path for heat flow from the electronic components through the cooling device and ultimately to the cooling air. Thus, for a given size of cooling device, by reducing the thermal resistance of the cooling device, the electronic components can be cooled more efficiently.

[0009] In another possible implementation, the LHP compensation zone is defined by the cooling fin cavity and is arranged at a height less than the LHP evaporation zone when the device is in use, wherein the wick element is used to transport the liquid coolant from the LHP compensation zone to the LHP evaporation zone by capillary action against gravity. In other words, in one implementation, the wick element is arranged and used to generate a capillary pressure, which causes a pressure difference between the LHP evaporation zone and the LHP compensation zone, forcing the liquid coolant to move upward from the LHP compensation zone to the LHP evaporation zone against gravity.

[0010] In another possible implementation, each cooling fin or the front wall of the substrate further includes a partition wall, which is arranged between a portion of the cooling fin cavity and a portion of the substrate cavity to separate at least a portion of the LHP compensation zone from at least a portion of the LHP evaporation zone.

[0011] In another possible implementation, the LHP further comprises a coolant line, the coolant line fluidically connecting the LHP evaporation zone with the LHP compensation zone. In other words, in one implementation, the LHP comprises a coolant line, the coolant line being used to provide fluid communication between the LHP evaporation zone and the LHP compensation zone for the vapor coolant generated in the LHP evaporation zone.

[0012] In another possible implementation, the LHP compensation zone is located in a portion of the coolant pipeline and, when the device is in use, is arranged at a height greater than the LHP evaporation zone, wherein the core element is used to absorb liquid coolant from the LHP compensation zone and prevent vapor coolant from being transported from the LHP evaporation zone to the LHP compensation zone via the core element.

[0013] In another possible implementation, the coolant line is defined by one or more internal channels of each cooling fin of the plurality of cooling fins.

[0014] In another possible implementation, when the device is used, a portion of the coolant line is arranged at a height smaller than the cooling fin cavity, in particular, smaller than a bottom portion of the cooling fin cavity.

[0015] In another possible implementation, the LHP further includes at least one other core element, wherein the at least one other core element is arranged on at least a portion of the inner surface of the coolant pipeline and is fluidically connected to the core element arranged in the substrate cavity, so that liquid coolant is exchanged between the other core element and the core element arranged in the substrate cavity.

[0016] In another possible implementation, each cooling fin cavity includes a plurality of serpentine cooling channels for directing the flow of steam and liquid coolant in the cooling fin cavity. Portions of the plurality of serpentine cooling channels are separated by material portions of each cooling fin that mechanically strengthen each cooling fin to withstand a wide range of operating pressures (i.e., below and above ambient pressure levels).

[0017] In another possible implementation, the plurality of serpentine cooling channels of each cooling fin cavity define an LHP condensation zone, and the LHP condensation zone is used to convert the vapor-phase coolant into the liquid-phase coolant.

[0018] In another possible implementation, the plurality of cooling fins include a plurality of roll-bonded cooling fins. In other words, in one implementation, the cooling fins are manufactured using a roll-bonding process.

[0019] In another possible implementation, the core element comprises a porous metal structure. In one implementation, the porous metal core element may be made of metal powder, metal fiber, metal mesh or a combination thereof.

[0020] In another possible implementation, the core element is arranged in the substrate cavity and contacts the rear wall of the substrate, wherein the rear wall of the substrate is used to contact the one or more electronic components. A portion of the core element in the evaporation zone may contact both the front wall and the rear wall of the substrate.

[0021] According to a second aspect, an electronic device is provided, comprising one or more electronic components and a cooling device according to the first aspect, wherein the cooling device is used to cool the one or more electronic components. For example, the electronic device may include an electronic telecommunication device such as an antenna, a receiver, a radio remote unit (RRU), a massive MIMO unit, etc.

[0022] The following drawings and description set forth one or more embodiments in detail. Other features, objects, and advantages are apparent in the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the accompanying drawings:

[0024] Figure 1 is a partially exploded perspective view of a cooling device for cooling an electronic component according to an embodiment;

[0025] Figure 2 yes Figure 1 A perspective view of a cooling device, wherein air flows through spaces between a plurality of cooling fins and a base plate of the cooling device;

[0026] Figure 3a According to an embodiment Figure 1 and Figure 2 A cross-sectional view of a cooling fin and a base plate of a cooling device;

[0027] Figure 3b Schematically shows Figure 3a The flow of liquid coolant and vapor coolant within the cooling fins and baseplate portion shown;

[0028] Figure 4a According to another embodiment Figure 1 and Figure 2 A cross-sectional view of a cooling fin and a base plate of a cooling device;

[0029] Figure 4b Schematically shows Figure 4aThe flow of liquid coolant and vapor coolant within the cooling fins and baseplate portion shown;

[0030] Figure 5a According to another embodiment Figure 1 and Figure 2 A cross-sectional view of a cooling fin and a base plate of a cooling device;

[0031] Figure 5b Schematically shows Figure 5a The flow of liquid coolant and vapor coolant within the cooling fins and baseplate portion shown;

[0032] In the following, identical reference signs refer to identical or at least functionally equivalent features. DETAILED DESCRIPTION

[0033] In the following description, reference is made to the accompanying drawings that form a part of the present invention, which illustrate specific aspects of embodiments of the present invention or specific aspects in which embodiments of the present invention may be used by way of illustration. It should be understood that embodiments of the present invention may be used in other aspects and include structural or logical changes that are not depicted in the accompanying drawings. Therefore, the following detailed description should not be understood in a restrictive sense, and the scope of the present invention is defined by the appended claims.

[0034] Figure 1 2 is a perspective view of a cooling device 100 for cooling an electronic component or an electronic device 200, 210 according to an embodiment. Figure 1 In the illustrated embodiment, the electronic component includes a printed circuit board 200 having a plurality of electronic chips 210, wherein the printed circuit board 200 and the electronic chips 210 are attached to the cooling device 100. The plurality of electronic chips 210 may include a CPU, an electronic memory, a communication interface, etc. For example, the electronic device including one or more electronic components 200, 210 and the cooling device 100 may be an electronic telecommunication device, such as an antenna, a receiver, a radio remote unit (RRU), a massive MIMO unit, etc.

[0035] The cooling device 100 includes a base plate 110 and a plurality of cooling fins 120a to 120n. Figures 3a to 5a and Figure 3b to Figure 5b As described in detail in FIG. 1 , the substrate 110 includes a front wall or front portion 110a, a rear wall or rear portion 110b, and a substrate cavity 110c defined between the front wall 110a and the rear wall 110b of the substrate 110. Figure 2 As can be seen in FIG. 1 , a plurality of cooling fins 120 a to 120 n are attached to the front wall 110 a of the base plate 110 . Figures 3a to 5a and Figure 3b to Figure 5bIn the illustrated embodiment, implemented as a plate having a preferably P-shaped profile, the front wall 110a may be generally rectangular in shape.

[0036] In one embodiment, the front wall 110a of the substrate may include a plurality of slits or openings for accommodating a plurality of cooling fins 120a to 120n. A plurality of electronic components 200, 210 are attached to the rear wall 110b of the substrate 110. Therefore, when in use, the rear wall 110b of the substrate 110 is used to thermally contact with one or more electronic components 200, 210 to be cooled. In one embodiment, the front wall 110a and / or the rear wall 110b of the substrate 110 may be made of metal (especially aluminum or an aluminum alloy). Similarly, a plurality of cooling fins 120a to 120n may be made of metal (especially aluminum or an aluminum alloy). In one embodiment, a plurality of cooling fins 120a to 120n include a plurality of roll-bonded cooling fins 120a to 120n, that is, a plurality of cooling fins 120a to 120n manufactured using a roll-bonding process.

[0037] Figure 3a According to an embodiment Figure 1 and Figure 2 1 is a cross-sectional view of a cooling fin 120a and a base plate 110 of a cooling device 100. Figure 3b Schematically shows the Figure 3a The flow of liquid coolant (indicated by solid arrows) and vapor coolant (indicated by dashed arrows) within the cooling fins 120a and the base plate 110a portion of the illustrated embodiment. Figure 3a A cross section of a cooling fin 120a is shown as an example of a plurality of cooling fins 120a to 120n attached to a base plate 110, from Figure 3a As can be seen, the exemplary cooling fin 120a defines a cooling fin cavity 124 having a plurality of serpentine cooling channels and is attached to the front wall 110a of the base plate 110 such that the cooling fin cavity 124 having a plurality of serpentine cooling channels is in fluid communication with at least a portion of the base plate cavity 110c.

[0038] As detailed below, especially in Figure 3b In the context of , the base plate 110 and the exemplary cooling fins 120a define a loop heat pipe (LHP), ie, a cooling circuit for circulating a coolant, wherein the coolant includes a liquid phase coolant and a vapor phase coolant. In one embodiment, the coolant may be a refrigerant liquid.

[0039] The LHP includes an LHP evaporation zone (also referred to as an LHP evaporator) within the substrate chamber 110c. Figures 3a to 5a , Figure 3b to Figure 5bThe LHP evaporation zone A is used to convert the liquid phase coolant into the vapor phase coolant, that is, to evaporate the liquid phase coolant. In addition, the LHP includes an LHP compensation zone (also called an LHP reservoir, in Figures 3a to 5a , Figure 3b to Figure 5b In the Figure 3a and Figure 3b In the illustrated embodiment, the LHP compensation zone is located in a cooling fin cavity 124 having a plurality of serpentine cooling channels, particularly in the bottom portion of the cooling fin cavity 124. The LHP compensation zone B is used to accumulate condensed liquid coolant and supply the liquid coolant back to the LHP evaporation zone A. The LHP further includes core elements (also referred to as core structures) 122a, 122b, which are arranged in the substrate cavity 110c to extend at least partially between the LHP evaporation zone A and the LHP compensation zone B to separate the LHP evaporation zone A from the LHP compensation zone B. Figure 3a and Figure 3b In the illustrated embodiment, specifically, the wick element portion 122b extends between the LHP evaporation region A and the LHP compensation region B to separate the LHP evaporation region A from the LHP compensation region B. In one embodiment, the wick elements 122a, 122b include a porous metal structure. In one embodiment, the porous metal wick elements 122a, 122b may be made of metal powder, metal felt, metal mesh, and / or combinations thereof.

[0040] exist Figure 3a and Figure 3b In the embodiment shown, when the device 100 is used, the LHP evaporation zone A is arranged at a height greater than the LHP compensation zone B. In this embodiment, Figure 3b As can be seen in FIG. 1 , the flow of the liquid coolant is indicated by solid arrows, and the flow of the vapor coolant is indicated by dashed arrows. The core elements 122a and 122b are used to transport the liquid coolant accumulated in the LHP compensation area B (i.e., at the bottom of the cooling fin cavity 124) upward to the LHP evaporation area A by capillary action to overcome gravity. In other words, Figure 3a and Figure 3b In the illustrated embodiment, the wick elements 122a, 122b are arranged and used to generate capillary pressure, which causes a pressure difference between the LHP evaporation zone A and the LHP compensation zone B, forcing the liquid coolant to move upward from the LHP compensation zone B to the LHP evaporation zone A along the wick element portion 122a against gravity.

[0041] like Figure 3a and Figure 3bAs shown, the wick element portions 122a, 122b may be disposed within the substrate cavity 110c, in contact with the rear wall 110b of the substrate 110 and partially in contact with the front wall 110a, wherein, as described above, the electronic components 200, 210 are attached to and thus in thermal contact with the rear wall 110b of the substrate 110. As the wick elements 122a, 122b are disposed within the substrate cavity 110c, the liquid coolant rises due to the capillary pressure in the wick elements 122a, 122b, efficiently absorbing the heat generated by the electronic components 200, 210. This heat absorption, in turn, causes the heated liquid coolant in the wick element 122a to evaporate into the evaporation zone, as shown. Figure 3b It is schematically shown in FIG.

[0042] like Figure 3a and Figure 3b As shown, the LHP defined by the exemplary cooling fins 120a and the base plate 110 also includes coolant lines 123a to 123d that fluidly connect the LHP evaporation region A to the LHP compensation region B. It should be understood that Figure 3b As shown, coolant lines 123a to 123d provide fluid communication between the LHP evaporation zone A and the LHP compensation zone B for the vapor coolant generated in the LHP evaporation zone A. Figure 3a and Figure 3b In the illustrated embodiment, coolant lines 123a - 123d between the LHP evaporation zone A and the LHP compensation zone B are defined by one or more internal channels 123a - 123d of the exemplary cooling fin 120a.

[0043] exist Figure 3a and Figure 3bIn the illustrated embodiment, the coolant lines 123a to 123d defined by the cooling channels 123a to 123d of the exemplary cooling fin 120a include: a first channel portion 123a extending horizontally at a first height away from the LHP evaporation region A, a second channel portion 123b extending vertically downward to a second height, a third channel portion 123c, and a fourth channel portion 123d, wherein the third channel portion 123c extends in a short horizontal direction at the second height to reverse the flow direction, and the fourth channel portion 123d extends vertically upward from the second height to guide the vapor coolant generated by the LHP evaporation region A to the cooling fin cavity 124 of the exemplary cooling fin 120a. Therefore, in one embodiment, when the cooling device 100 is used, the arrangement height of at least a portion of the coolant lines 123a to 123d (especially the third channel portion 123c) is less than the cooling fin cavity 124 having a plurality of serpentine cooling channels. It should be understood that the coolant line that fluidly connects the LHP evaporation zone A with the LHP compensation zone B may have a different shape and / or a different number of portions than the coolant lines 123a to 123d shown in the drawings. In one embodiment, each cooling fin 120a to 120n may also include more than one coolant line that fluidly connects the LHP evaporation zone A with the LHP compensation zone B. It should be further understood that the generally P-shaped profile of the exemplary cooling fin 120a facilitates more efficient use of the bottom portion of the cooling fin 120a, which is located at a lower height than the cooling fin cavity 124 having a plurality of serpentine cooling channels.

[0044] from Figure 3a and Figure 3bAs can be seen in the illustrative cooling fin 120a, the cooling fin cavity 124 of the exemplary cooling fin 120a includes a plurality of interconnected serpentine cooling channels or a network of interconnected serpentine cooling channels. Such a network of interconnected serpentine cooling channels of the cooling fin cavity 124 can be defined by a plurality of material portions 126 of the roll-bonded material of the exemplary cooling fin 120a, which help prevent the cooling fin cavity 124 from expanding or contracting, and when the cooling device 100 is used, the operating pressure within the cooling fin cavity 124 can be within a range above and below the ambient pressure level. The network of interconnected serpentine cooling channels of the cooling fin cavity 124 defined by the material portions 126 of the exemplary cooling fin 120a is used to direct the flow of the vapor coolant in the cooling fin cavity 124 in a serpentine manner. In the embodiment shown in the drawings, by way of example, the plurality of material portions 126 have a generally hexagonal profile or cross-section (which may be circular) to define a honeycomb pattern of the material portions 126, which in turn defines a network of interconnected serpentine cooling channels of the cooling fin cavity 124. It should be understood that, in use, the plurality of material portions 126, together with the plurality of serpentine cooling channels formed between the material portions 126, absorb a portion of the heat of the vapor coolant flowing upwardly into the cooling fin cavity 124 via the coolant lines 123a to 123d. This heat is thermally conducted via the material portions 126 and the serpentine cooling channel walls to the outer surface of the exemplary cooling fin 120a, which is cooled by air moving along the outer surface of the exemplary cooling fin 120a, as shown in FIG. Figure 2 It will be appreciated that some heat dissipation also occurs in the coolant lines defined by passages 123a-123d, as described in detail below.

[0045] Due to heat dissipation via the inner surface of the cooling fin 120a, the vapor coolant flowing upward in the plurality of serpentine cooling channels of the cooling fin cavity 124 releases heat energy to the ambient air and is thereby condensed into liquid coolant. Therefore, it can be considered that the plurality of serpentine cooling channels of the cooling fin cavity 124 of the exemplary cooling fin 120a define an LHP condensation zone C for converting the vapor phase coolant into the liquid phase coolant. Figure 3b As shown, the liquid phase coolant generated in the LHP condensation zone C accumulates at the bottom of the cooling fin cavity 124, that is, in the LHP compensation zone B.

[0046] like Figure 3b As shown, some of the vapor coolant may have condensed while flowing through the fourth channel portion 123d extending vertically upward of the coolant lines 123a to 123d and accumulated at the bottom of the fourth channel portion 123d extending vertically upward, i.e., in the third channel portion 123c. Figure 3bAs shown, it can also be considered that the fourth channel portion 123d extending vertically upward, which guides the vapor coolant generated by the LHP evaporation zone A to the cooling fin cavity 124 having a plurality of serpentine cooling channels, defines another part of the LHP condensation zone C.

[0047] In order to efficiently transport the liquid coolant accumulated in the third channel portion 123c and the bottom of the cooling fin cavity 124 to the core elements 122a, 122b arranged in the substrate cavity 110c, the exemplary cooling fin 120a and LHP may further include at least one other core element 122c, 122d. Figure 3a and Figure 3b In the illustrated embodiment, at least one other core element 122c, 122d is arranged on the inner surface of the fourth channel portion 123d extending vertically upward and on the bottom surface of the cooling fin cavity 124. Figure 3a and Figure 3b Schematically shown, at least one other wick element 122c, 122d is in fluid communication with the wick elements 122a, 122b disposed within the substrate cavity to deliver liquid coolant from the LHP condensation zone C and the LHP compensation zone B to the wick elements 122a, 122b disposed within the substrate cavity 110c.

[0048] like Figure 3a and Figure 3b As shown, in one embodiment, the exemplary cooling fin 120a may further include a partition wall 125, which is disposed between a portion of the cooling fin cavity having a plurality of serpentine cooling channels 124 and a portion of the substrate cavity 110c, and extends between a portion of the cooling fin cavity having a plurality of serpentine cooling channels 124 and a portion of the substrate cavity 110c. In another embodiment, the partition wall 125 may be a portion of the front wall 110a of the substrate 110.

[0049] Figure 4a , Figure 4b , Figure 5a and Figure 5b 1 and 10 show other embodiments of exemplary cooling fins 120a and base plate 110. Figure 4a , Figure 4b , Figure 5a and Figure 5b The exemplary cooling fin 120a and base plate 110 shown in the embodiment are similar to Figure 3a and Figure 3b The differences between the embodiments shown. Figure 4b and Figure 5b The first major difference is that Figure 4a , Figure 4b , Figure 5a and Figure 5bIn the exemplary cooling fin 120a and base plate 110 shown in the embodiment, Figure 3a and Figure 3b Compared to the illustrated embodiment, the flow directions of the vapor coolant and the liquid coolant are generally opposite.

[0050] Furthermore, it should be understood that Figure 4a , Figure 4b , Figure 5a and Figure 5b In the exemplary cooling fin 120a and the base plate 110 shown in the embodiment, when the cooling device 100 is used, the arrangement height of the LHP compensation area B is greater than the LHP evaporation area A. More specifically, as shown in the figure, Figure 4a , Figure 4b , Figure 5a and Figure 5b In the illustrated embodiment of the exemplary cooling fin 120a and base plate 110, the LHP compensation zone B is primarily defined within the first horizontally extending channel portion of the coolant lines 123a to 123d, which is defined in the upper portion of the exemplary cooling fin 120a. Figure 4b and Figure 5b As can be seen in these embodiments, the wick elements 122a, 122b are used to absorb liquid coolant from the LHP compensation zone B located within the first horizontally extending channel portion of the coolant lines 123a to 123d, and thereby block the vapor coolant from being transported from the LHP evaporation zone A to the LHP compensation zone B via the wick elements. Due to this blocking effect of the wick elements 122a, 122b, the vapor coolant generated in the LHP evaporation zone A flows back to the LHP compensation zone B through the cooling fin cavity 124 having a plurality of serpentine cooling channels and the coolant lines 123a to 123d. The cooling fin cavity 124 having a plurality of serpentine cooling channels and the channels 123a to 123d are arranged so that at least some of the vapor coolant condenses in the coolant line portion 123a.

[0051] exist Figure 4a and Figure 4b In the embodiment shown, there is no Figure 3a and Figure 3b Other core elements 122c, 122d as in the embodiment shown. Figure 5a and Figure 5b In the illustrated embodiment, other core elements 122c, 122d are provided on the inner surfaces of the horizontally extending first channel portion 123a and the second vertically downwardly extending channel portion 123b of the coolant lines 123a to 123d.

[0052] As above Figure 1 and Figure 2In the context of , a plurality of cooling fins 120a to 120n are inserted into the front wall 110a of the base plate 110, for example, into appropriately sized slits thereof. In one embodiment, Figure 3a , Figure 3b , Figure 4a , Figure 4b , Figure 5a and Figure 5b The wick element portions 122a, 122b shown may extend through the entire substrate cavity 110c and thereby provide wick elements for all cooling fins 120a to 120n. In another embodiment, the substrate cavity 110c may be divided into a plurality of compartments by inner walls, wherein the wick element of each compartment provides wick elements 122a, 122b for one or more cooling fins 120a to 120n. In one embodiment, the compartments may have different sizes and thereby provide wick elements for different numbers of cooling fins.

Claims

1. A cooling device (100) for cooling one or more electronic components (200, 210), characterized in that: The cooling device (100) comprises: A substrate (110), wherein the substrate (110) has a front wall (110a), a rear wall (110b), and a substrate cavity (110c) located between the front wall (110a) and the rear wall (110b), and the rear wall (110b) is used for thermal contact with the one or more electronic components (200, 210); a plurality of cooling fins (120a to 120n), wherein each cooling fin (120a to 120n) defines a cooling fin cavity (124) and is attached to the front wall (110a) of the base plate (110) such that the cooling fin cavity (124) is in fluid communication with at least a portion of the base plate cavity (110c); The base plate (110) and each of the plurality of cooling fins (120a to 120n) define a loop heat pipe (LHP), the LHP being used to circulate a coolant, wherein the coolant comprises a liquid coolant and a vapor coolant, and the LHP comprises: an LHP evaporation zone (A) in the substrate cavity (110c), wherein the LHP evaporation zone (A) is used to evaporate the liquid coolant into the vapor coolant; an LHP compensation area (B) within the respective cooling fins (120a to 120n), wherein the LHP compensation area (B) is used to accumulate the liquid coolant; A core element (122a, 122b), wherein the core element (122a, 122b) is arranged in the substrate cavity (110c) to extend at least partially between the LHP evaporation area (A) and the LHP compensation area (B), and is used to absorb and transport liquid coolant to separate the LHP evaporation area (A) from the LHP compensation area (B).

2. The cooling device (100) according to claim 1, characterized in that: The LHP compensation zone (B) is defined by the cooling fin cavity (124) and is arranged at a height smaller than the LHP evaporation zone (A), wherein the wick elements (122a, 122b) are used to transport the liquid coolant from the LHP compensation zone (B) to the LHP evaporation zone (A) by capillary action.

3. The cooling device (100) according to claim 2, characterized in that: Each cooling fin (120a to 120n) or the front wall (110a) of the base plate (110) further includes a partition wall (125) disposed between a portion of the cooling fin cavity (124) and a portion of the base plate cavity (110c).

4. The cooling device (100) according to any one of the preceding claims, characterized in that: The LHP further includes coolant lines (123a to 123d) fluidly connecting the LHP evaporation region (A) with the LHP compensation region (B).

5. The cooling device (100) according to claim 4, characterized in that: The LHP compensation zone (B) is located in a portion of the coolant pipeline (123a to 123d) and is arranged at a height greater than the LHP evaporation zone (A), wherein the core elements (122a, 122b) are used to absorb liquid coolant from the LHP compensation zone (B) and prevent vapor coolant from being transported from the LHP evaporation zone (A) to the LHP compensation zone (B) via the core elements (122a, 122b).

6. The cooling device (100) according to claim 4 or 5, characterized in that: The coolant line (123a to 123d) is defined by one or more internal channels (123a to 123d) of each cooling fin (120a to 120n) of the plurality of cooling fins (120a to 120n).

7. The cooling device (100) according to any one of claims 4 to 6, characterized in that: A portion (123c) of the coolant pipeline (123a to 123d) is arranged at a height smaller than that of the cooling fin cavity (124).

8. The cooling device (100) according to any one of claims 4 to 7, characterized in that: The LHP further comprises at least one other core element (122c, 122d), wherein the at least one other core element (122c, 122d) is arranged on at least a portion of the inner surface of the coolant pipeline (123a to 123d) and is in fluid communication with the core elements (122a, 122b) arranged in the substrate cavity (110c), so that liquid coolant is exchanged between the other core elements (122c, 122d) and the core elements (122a, 122b) arranged in the substrate cavity (110c).

9. The cooling device (100) according to any one of the preceding claims, characterized in that: Each cooling fin (120a to 120n) includes a plurality of serpentine cooling channels for directing the flow of a vapor coolant in the cooling fin cavity (124).

10. The cooling device (100) according to claim 9, characterized in that: Portions of the plurality of serpentine cooling channels are separated by a plurality of material portions (126) of each cooling fin (120a to 120n).

11. The cooling device (100) according to claim 10, characterized in that: The plurality of material portions (126) and the serpentine cooling passages formed between the material portions (126) define a LHP condensation zone for converting the vapor coolant into the liquid coolant.

12. The cooling device (100) according to any one of the preceding claims, characterized in that: The plurality of cooling fins (120a to 120n) include a plurality of roll-bonded cooling fins (120a to 120n).

13. The cooling device (100) according to any one of the preceding claims, characterized in that The core element (122a, 122b, 122c, 122d) comprises a porous metal structure.

14. The cooling device (100) according to any one of the preceding claims, characterized in that The core element (122a, 122b) is arranged in the substrate cavity (110c) and contacts a portion of the front wall (110a) and a portion of the rear wall (110b) of the substrate (110), wherein the rear wall (110b) of the substrate (110) is used for thermal contact with the one or more electronic components (200, 210).

15. An electronic device, characterized in that: include: one or more electronic components (200, 210); The cooling device (100) according to any one of the preceding claims, wherein the cooling device (100) is used to cool the one or more electronic components (200, 210).

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