Lead-free reflow soldering machine for producing automobile tail lamp module circuit board

Abstract

The invention relates to the technical field of automobile tail lamp module circuit board welding, and discloses a lead-free reflow soldering machine for producing an automobile tail lamp module circuit board, which comprises a mounting unit, a transmission unit and a rolling unit, the mounting unit comprises a workbench, a notch is formed in the middle of the workbench, a transmission roller is arranged in an inner cavity of the notch, and the transmission roller is arranged in the inner cavity of the workbench; and guide notches are further formed in the two opposite side walls of the notch inner cavity, a smearing cavity, an SMT patch containing cavity, a heating welding cavity and a cooling cavity are formed above the workbench, and a first sealing heat insulation plate is arranged between the smearing cavity and the SMT patch containing cavity. According to the device, when the driving assembly moves downwards to a certain position, reciprocating motion can be conducted under assistance of a conical block and a special-shaped plate at the moment, and therefore a circular pressing plate can be driven to rotate in a reciprocating mode through a first mounting plate and a second mounting plate; therefore, the solder paste diffused on the circuit board can be ground through the circular pressing plate, so that the solder paste can be in a uniform state on the circuit board.

Description

Technical Field

[0001] The invention belongs to the technical field of automobile taillight module circuit board welding, and in particular relates to a lead-free reflow soldering machine for producing automobile taillight module circuit boards. Background Art

[0002] In the early stages of automobile taillight module circuit board production, lead soldering was a common technology. However, lead is a heavy metal that is seriously harmful to the environment and human health. As the world pays more and more attention to environmental protection, many countries and regions have introduced strict environmental regulations to restrict or prohibit the use of lead materials in the manufacture of electronic products.

[0003] Lead-free solder is mainly an alloy based on tin (Sn) with other metal elements such as silver (Ag), copper (Cu), bismuth (Bi), etc. Its melting point is generally around 217℃ - 220℃, which is higher than the melting point of traditional lead-containing solder. The surface tension of lead-free solder is greater than that of lead-containing solder, and its fluidity is poorer.

[0004] However, in the existing lead-free soldering of automobile taillight module circuit boards, it is often necessary to apply solder paste to the circuit boards. However, when applying the existing solder paste, since it is often applied manually, the solder paste is easily uneven on the circuit boards. Therefore, when the circuit boards and SMT patches are heated to melt the solder paste, solder beads are easily formed in the solder paste, resulting in poor welding effect between the circuit boards and the SMT patches.

[0005] In view of this, the present invention is proposed. Summary of the invention

[0006] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is: A lead-free reflow soldering machine for producing automobile taillight module circuit boards, comprising a mounting unit, a transmission unit and a rolling unit: The installation unit comprises a workbench, a notch is provided in the middle of the workbench, and a transmission roller is provided in the inner cavity of the notch, and guide notches are provided on the two opposite side walls of the inner cavity of the notch, a coating chamber, an SMT patch placement chamber, a heating and welding chamber and a cooling chamber are provided above the workbench, a first sealed heat-insulating plate is provided between the coating chamber and the SMT patch placement chamber, a cavity is provided in the first sealed heat-insulating plate, and a rectangular notch is provided in one side wall, a second sealed movable heat-insulating plate is slidably provided in the first sealed heat-insulating plate, a third sealed heat-insulating plate is provided between the SMT patch placement chamber, the heating and welding chamber and the cooling chamber, a plurality of support legs equidistantly distributed are fixedly installed at the bottom of the workbench, each of the support legs is symmetrical with each other, and circuit boards are placed in the inner cavities of the two guide notches; The transmission unit includes a driving assembly and a circular pressing plate, and the driving assembly is used to drive the rolling unit to drive the circular pressing plate to reciprocate slightly; The rolling unit includes a first mounting plate and a second mounting plate, and the opposite side walls of the first mounting plate and the second mounting plate are each provided with a special-shaped sliding groove, the two special-shaped sliding grooves are parallel to each other, and sliding blocks are slidably installed in the inner cavities of the two special-shaped sliding grooves, and the bottoms of the first mounting plate and the second mounting plate are fixedly connected to the circular pressure plate.

[0007] As a preferred embodiment of the present invention, a mechanical arm is arranged above the SMT patch placement cavity, and an electronic adsorption plate is arranged at the bottom of the mechanical arm.

[0008] As a preferred embodiment of the present invention, the driving assembly includes a servo motor, which is installed above the inner cavity of the coating chamber. A threaded rod is fixedly installed at the output end of the servo motor, and a threaded sleeve is fixedly installed at the output end of the threaded rod. Two mutually symmetrical guide rods are movably penetrated through the threaded sleeve, and the top ends of the two guide rods are fixedly connected above the inner cavity of the coating chamber.

[0009] As a preferred embodiment of the present invention, two symmetrical rectangular tubes are fixedly installed at the bottom of the threaded sleeve, and the inner cavities of the two rectangular tubes are each provided with a first sliding mechanism, the first sliding mechanism includes two first sliding grooves, the two first sliding grooves are respectively opened on the two opposite side walls of the inner cavity of the rectangular tube, the two first sliding grooves are symmetrical to each other, and the inner cavities of the two first sliding grooves are both slidably installed with a first slider, the two first sliders are symmetrical to each other, and a movable plate is fixedly connected to one side wall opposite to the two first sliders, and the two movable plates are symmetrical to each other.

[0010] As a preferred embodiment of the present invention, the bottom of the two movable plates are fixedly connected with a plug-in rod, the two plug-in rods are symmetrical to each other, the top of the two movable plates are fixedly installed with a first return spring, the other ends of the two first return springs are fixedly connected to the top of the inner cavity of the rectangular tube, and the top of the two movable plates are also fixedly installed with a special-shaped plate, the two special-shaped plates are symmetrical to each other.

[0011] As a preferred embodiment of the present invention, one side wall opposite to the two rectangular tubes is provided with a placement slot, the two placement slots are symmetrical to each other, and the inner cavities of the two placement slots are provided with a second sliding mechanism.

[0012] As a preferred embodiment of the present invention, the second sliding mechanism includes two second sliding grooves, which are respectively opened on the two opposite side walls of the inner cavity of the placement slot, the two second sliding grooves are symmetrical to each other, and the inner cavities of the two second sliding grooves are both slidably installed with second sliders, and the two second sliders are symmetrical to each other.

[0013] As a preferred embodiment of the present invention, one side wall of the four second sliding blocks is fixedly connected to a driving plate, the two driving plates are symmetrical to each other, and one side wall of the two driving plates is fixedly installed with a conical block, and the opposite ends of the two driving plates are fixedly connected to a mounting rod, and the opposite ends of the two mounting rods are respectively fixedly connected to the sliding block, and one side wall of each second sliding block is fixedly connected to a second return spring, and the other end of the second return spring is respectively fixedly connected to the inner wall of the second slide groove.

[0014] As a preferred embodiment of the present invention, a third sliding mechanism is arranged above the circular pressure plate, and the third sliding mechanism includes a first circular slide groove, and the first circular slide groove is opened above the circular pressure plate. Two mutually symmetrical guide sliders are slidably installed in the inner cavity of the first circular slide groove, and plug rods are fixedly connected above the two guide sliders.

[0015] As a preferred embodiment of the present invention, a second circular slide groove is opened on the side wall of the circular pressure plate, a movable slider is slidably installed in the inner cavity of the second circular slide groove, an L-shaped fixing rod is fixedly installed on the movable slider, the other end of the L-shaped fixing rod is movably passed through the rectangular groove, and is fixedly connected to the second sealed movable insulation plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention drives the circular pressing plate to move vertically downward through a driving component, and when the circular pressing plate moves vertically downward, it can squeeze the solder paste placed on the circuit board that is limited at this time and diffuse it around, and when the driving component moves downward to a certain position, it can make the conical block and the special-shaped plate move back and forth with the assistance of the first mounting plate and the second mounting plate, so that the circular pressing plate can be driven to rotate back and forth, so that the solder paste diffused on the circuit board can be ground by the circular pressing plate, so that it can be in a uniform state on the circuit board, so that when the SMT patch is placed and the SMT patch and the circuit board are transferred to the heating welding chamber together, the solder paste can be melted, which ensures to a certain extent that no solder beads will appear during the melting of the solder paste, and at the same time ensures that the solder joints between the circuit board and the SMT patch are full.

[0017] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the attached picture: Figure 1 The three-dimensional structure diagram of a lead-free reflow soldering machine for producing automobile taillight module circuit boards; Figure 2The figure is a schematic diagram of the side structure of a lead-free reflow soldering machine used for producing automobile taillight module circuit boards; Figure 3 The schematic diagram of the inner cavity structure of a coating chamber of a lead-free reflow soldering machine used for producing automobile taillight module circuit boards; Figure 4 The schematic diagram of the transmission unit structure of a lead-free reflow soldering machine for producing automobile taillight module circuit boards; Figure 5 The schematic diagram of the rectangular tube cross-sectional structure of a lead-free reflow soldering machine used for producing automobile taillight module circuit boards; Figure 6 A lead-free reflow soldering machine for producing automobile taillight module circuit boards Figure 5 The enlarged structural diagram at A in the middle; Figure 7 A schematic diagram of the inner cavity structure of a placement slot of a lead-free reflow soldering machine for producing automobile taillight module circuit boards; Figure 8 A lead-free reflow soldering machine for producing automobile taillight module circuit boards Figure 7 The enlarged structural diagram at B in the middle; Fig. 9 The present invention is a schematic diagram of the partial structure of the third sealing and heat insulation installation of a lead-free reflow soldering machine used for producing automobile taillight module circuit boards.

[0019] In the figure: 100, installation unit; 101, workbench; 1011, support leg; 1012, coating chamber; 1013, SMT patch placement chamber; 1014, heating and welding chamber; 1015, cooling chamber; 1016, transmission roller; 1017, guide notch; 1018, mechanical arm; 1019, electronic adsorption plate; 102, circuit board; 103, first sealed heat insulation board; 1031, rectangular notch; 1032, second sealed movable heat insulation board; 1033, third sealed heat insulation board; 200, transmission unit; 201, servo motor; 2011, threaded rod; 2012, threaded sleeve; 2013, guide rod; 202, rectangular tube; 2021, first slide groove; 2022, first slider; 2023, moving plate; 2024, plug-in rod; 2025, first return spring; 2026, special-shaped plate; 2027, placement notch; 203, circular pressure plate; 2031, first circular slide groove; 2032, guide slider; 2033, second circular slide groove; 2034, moving slider; 2035, L-shaped fixing rod; 300, rolling unit; 301, conical block; 3011, driving plate; 3012, mounting rod; 3013, second slide groove; 3014, second slider; 3015, second return spring; 302, first mounting plate; 3021, special-shaped slide groove; 3022, sliding block; 303, second mounting plate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0021] Embodiment 1: like Figures 1 to 9As shown, a lead-free reflow soldering machine for producing automobile taillight module circuit boards includes an installation unit 100, a transmission unit 200 and a rolling unit 300: the installation unit 100 includes a workbench 101, a notch is provided in the middle of the workbench 101, and a transmission roller 1016 is provided in the inner cavity of the notch, and guide notches 1017 are provided on the two opposite side walls of the inner cavity of the notch, a coating chamber 1012, an SMT patch placement chamber 1013, a heating and welding chamber 1014 and a cooling chamber 1015 are provided above the workbench 101, a first sealed heat insulation board 103 is provided between the coating chamber 1012 and the SMT patch placement chamber 1013, a cavity is provided in the first sealed heat insulation board 103, and a rectangular notch 1031 is provided in one side wall, a second sealed movable heat insulation board 1032 is slidably provided in the first sealed heat insulation board 103, the SMT patch placement chamber 1013, the heating and welding chamber 1014 and the cooling chamber 1015 are provided above the workbench 101, a first sealed heat insulation board 103 is provided between the coating chamber 1012 and the SMT patch placement chamber 1013, a cavity is provided in the first sealed heat insulation board 103, and a rectangular notch 1031 is provided in one side wall, a second sealed movable heat insulation board 1032 is slidably provided in the first sealed heat insulation board 103, 14 and the cooling chamber 1015 are provided with a third sealing insulation plate 1033, a plurality of equidistantly distributed supporting legs 1011 are fixedly installed at the bottom of the workbench 101, each supporting leg 1011 is symmetrical with each other, and the circuit board 102 is placed in the inner cavity of the two guide slots 1017; the transmission unit 200 includes a driving assembly and a circular pressure plate 203, the driving assembly is used to drive the rolling unit 300 to drive the circular pressure plate 203 to rotate slightly back and forth; the rolling unit 300 includes a first mounting plate 302 and a second mounting plate 303, and the first mounting plate 302 and the second mounting plate 303 are opposite to each other. The side walls are provided with special-shaped slide grooves 3021, and the two special-shaped slide grooves 3021 are parallel to each other. The inner cavities of the two special-shaped slide grooves 3021 are both slidably installed with sliding blocks 3022, and the bottoms of the first mounting plate 302 and the second mounting plate 303 are fixedly connected to the circular pressure plate 203. The circular pressing plate 203 is driven to move vertically downward by the driving component. When the circular pressing plate 203 moves vertically downward, the solder paste placed on the circuit board 102 that is limited at this time can be squeezed and diffused to the surroundings. When the driving component moves downward to a certain position, the conical block 301 and the special-shaped plate 2026 can be assisted to move back and forth at this time, so that the circular pressing plate 203 can be driven to rotate back and forth by the first mounting plate 302 and the second mounting plate 303. Therefore, the solder paste diffused on the circuit board 102 can be ground by the circular pressing plate 203, so that it can be in a uniform state on the circuit board 102. Therefore, when the SMT patch is placed and the SMT patch and the circuit board 102 are transferred to the heating welding chamber 1014 together, the solder paste can be melted, which ensures to a certain extent that no solder beads will appear during the melting of the solder paste, and at the same time ensures that the solder joints between the circuit board 102 and the SMT patch are full.

[0022] like Fig. 9As shown, in a specific implementation, a mechanical arm 1018 is disposed above the inner cavity of the SMT patch placement cavity 1013, and an electronic adsorption plate 1019 is disposed at the bottom of the mechanical arm 1018. In this configuration, a specific movement mode of the SMT patch is determined.

[0023] Embodiment 2: The difference between Example 1 and this Example is that: Figures 2 to 7 As shown, a lead-free reflow soldering machine for producing automobile taillight module circuit boards, the driving assembly includes a servo motor 201, the servo motor 201 is installed above the inner cavity of the coating chamber 1012, the output end of the servo motor 201 is fixedly installed with a threaded rod 2011, the output end of the threaded rod 2011 is fixedly installed with a threaded sleeve 2012, the threaded sleeve 2012 is movably penetrated with two mutually symmetrical guide rods 2013, the top ends of the two guide rods 2013 are fixedly connected above the inner cavity of the coating chamber 1012. In this setting, the installation position and components of the driving assembly are determined.

[0024] like Figures 2 to 7 As shown, in a specific embodiment, two mutually symmetrical rectangular tubes 202 are fixedly installed at the bottom of the threaded sleeve 2012, and the inner cavities of the two rectangular tubes 202 are both provided with a first sliding mechanism, and the first sliding mechanism includes two first slide grooves 2021, and the two first slide grooves 2021 are respectively opened on the two opposite side walls of the inner cavity of the rectangular tube 202, and the two first slide grooves 2021 are symmetrical to each other, and the inner cavities of the two first slide grooves 2021 are both slidably installed with a first slider 2022, and the two first sliders 2022 are symmetrical to each other, and the opposite side walls of the two first sliders 2022 are fixedly connected with a moving plate 2023, and the two moving plates 2023 are symmetrical to each other. In this setting, it is ensured that when the plug rod 2024 is in a stationary state, the rectangular tube 202 can move vertically downward.

[0025] like Figures 2 to 7 As shown, further, the bottoms of the two moving plates 2023 are fixedly connected with plug rods 2024, the two plug rods 2024 are symmetrical to each other, the tops of the two moving plates 2023 are fixedly installed with first return springs 2025, the other ends of the two first return springs 2025 are fixedly connected to the top of the inner cavity of the rectangular tube 202, and the tops of the two moving plates 2023 are also fixedly installed with special-shaped plates 2026, the two special-shaped plates 2026 are symmetrical to each other. In this setting, the specific installation positions of the moving plates 2023 and the installation positions of the special-shaped plates 2026 are determined.

[0026] like Figures 2 to 8 As shown, further, the two opposite side walls of the two rectangular tubes 202 are provided with placement slots 2027, the two placement slots 2027 are symmetrical to each other, and the inner cavities of the two placement slots 2027 are provided with second sliding mechanisms. In this configuration, the opening positions of the placement slots 2027 are determined.

[0027] like Figures 2 to 8 As shown, further, the second sliding mechanism includes two second slide grooves 3013, the two second slide grooves 3013 are respectively opened on the two side walls opposite to the inner cavity of the placement slot 2027, the two second slide grooves 3013 are symmetrical to each other, and the inner cavities of the two second slide grooves 3013 are both slidably mounted with second sliders 3014, and the two second sliders 3014 are symmetrical to each other. In this setting, the installation position and components of the second sliding mechanism are determined.

[0028] like Figures 2 to 8 As shown, further, the side walls of the four second sliders 3014 opposite to each other are fixedly connected with a driving plate 3011, the two driving plates 3011 are symmetrical to each other, the side walls opposite to the two driving plates 3011 are fixedly installed with a conical block 301, the opposite ends of the two driving plates 3011 are fixedly connected with a mounting rod 3012, the opposite ends of the two mounting rods 3012 are respectively fixedly connected to the sliding block 3022, and the side wall of each second slider 3014 is fixedly connected with a second return spring 3015, and the other end of the second return spring 3015 is respectively fixedly connected to the inner wall of the second slide groove 3013. In this configuration, the specific installation position and connection method of the conical block 301 are determined.

[0029] Embodiment 3: The difference between Example 2 and this example is that: Figures 2 to 5 and Figure 7 and Fig. 9 As shown, a lead-free reflow soldering machine for producing automobile taillight module circuit boards is provided above the circular pressing plate 203. The third sliding mechanism includes a first circular slide groove 2031. The first circular slide groove 2031 is provided above the circular pressing plate 203. Two mutually symmetrical guide sliders 2032 are slidably installed in the inner cavity of the first circular slide groove 2031. The two guide sliders 2032 are respectively fixedly connected with a plug-in rod 2024 above. In this setting, the installation position and components of the third sliding mechanism are determined, ensuring that the circular pressing plate 203 can move vertically downward and can rotate slightly.

[0030] like Figures 2 to 5 and Figure 7 as well as Fig. 9As shown, in a specific embodiment, a second circular slide groove 2033 is provided on the side wall of the circular pressing plate 203, a movable slider 2034 is slidably installed in the inner cavity of the second circular slide groove 2033, an L-shaped fixing rod 2035 is fixedly installed on the movable slider 2034, the other end of the L-shaped fixing rod 2035 movably passes through the rectangular notch 1031, and is fixedly connected to the second sealed movable heat insulating plate 1032. In this configuration, because the circular pressing plate 203 moves downward, the second sealed movable heat insulating plate 1032 can be driven to move vertically downward through the L-shaped fixing rod 2035, thereby closing the coating cavity 1012, and thus preventing the circuit board 102 from being transmitted.

[0031] The implementation principle of a lead-free reflow soldering machine for producing automobile taillight module circuit boards of the present invention is as follows: First, the staff places the circuit board 102 in two guide slots 1017 opened on the workbench 101. At this time, the transmission roller 1016 is controlled by the controller to operate, so that the circuit board 102 can be driven to move (this is the prior art). Before the circuit board 102 moves, solder paste is placed in the middle of the circuit board; When the circuit board 102 is driven by the transmission roller 1016 to move to the inner cavity of the coating chamber 1012, the controller controls the servo motor 201 to operate. When the servo motor 201 operates, it can drive the threaded rod 2011 to rotate. When the threaded rod 2011 rotates, it can drive the threaded sleeve 2012 to move vertically downward with the assistance of the guide rod 2013. When the threaded sleeve 2012 moves vertically downward, it can drive the rectangular tube 202, the plug-in rod 2024 and the circular pressing plate 203 to move vertically downward, so that the circular pressing plate 203 is pressed on the circuit board 102 (at this time, because the circular pressing plate 203 moves downward, it can drive the second sealing movable heat insulation plate 1032 to move vertically downward through the L-shaped fixing rod 2035, thereby closing the coating chamber 1012, so as to prevent the circuit board 102 from being transmitted); When the circular pressing plate 203 is pressed on the circuit board 102, the solder paste on the circuit board 102 will be squeezed and spread around. At the same time, because the plug-in rod 2024 is plugged into the rectangular tube 202, the plug-in rod 2024 is stationary at this time, but the rectangular tube 202 can continue to move downward. When the rectangular tube 202 moves downward, it can drive the conical block 301 to move vertically downward, so that the conical block 301 can move back and forth with the assistance of the special-shaped plate 2026 (because a driving plate 3011 is fixedly installed at one end of the conical block 301, and a second sliding mechanism is provided at both ends of the driving plate 3011, and a second return spring 3015 is fixedly connected between the second slider 3014 and the second slide groove 3013 in the second sliding mechanism, so when the conical block 301 enters the convex surface of the special-shaped plate 2026, the elasticity can be contracted, and when entering the concave surface, the elasticity is relaxed, so that the conical block 301 can move back and forth); When the conical block 301 moves back and forth, it can drive the mounting rod 3012 to move back and forth, because one end of the mounting rod 3012 is connected to the second slider 3014 provided on the first mounting plate 302 and the second mounting plate 303, respectively, so that the first mounting plate 302 and the second mounting plate 303 can respectively give a thrust and a pull, so that the first mounting plate 302 and the second mounting plate 303 can drive the circular pressing plate 203 to rotate slightly back and forth, so as to grind the spread solder paste on the circuit board 102 back and forth, so as to achieve the purpose of uniformity; When the solder paste is in a uniform state on the circuit board 102, the servo motor 201 performs reverse operation at this time, because the second sealed movable insulation plate 1032 can be opened, so that the circuit board 102 can be transferred to the SMT patch placement chamber 1013, and the electronic adsorption plate 1019 on the mechanical arm 1018 set in the SMT patch placement chamber 1013 is controlled by the controller to adsorb the SMT patch and place it on the circuit board 102. At this time, the electronic adsorption plate 1019 is powered off, so that the SMT patch can be placed on the circuit board 102. At this time, the circuit board 102 can enter the heating welding chamber 1014 with the assistance of the transmission roller 1016, so as to melt the solder paste at high temperature. After melting, the circuit board 102 is transferred to the cooling chamber 1015 to cool the melted solder paste, so as to complete the welding between the circuit board 102 and the SMT patch (the opening and closing of the third sealed insulation plate 1033 are both existing technologies).

Claims

1. A lead-free reflow soldering machine for producing automobile taillight module circuit boards, characterized in that: It comprises an installation unit (100), a transmission unit (200) and a rolling unit (300): The installation unit (100) comprises a workbench (101), a slot is provided in the middle of the workbench (101), a transmission roller (1016) is provided in the inner cavity of the slot, and guide slots (1017) are provided on two opposite side walls of the inner cavity of the slot, a coating chamber (1012), an SMT patch placement chamber (1013), a heating and welding chamber (1014) and a cooling chamber (1015) are provided above the workbench (101), a first sealing heat insulation board (103) is provided between the coating chamber (1012) and the SMT patch placement chamber (1013), and a first sealing heat insulation board (103) is provided inside the first sealing heat insulation board (103). A cavity is provided, and a rectangular notch (1031) is provided on one side wall; a second sealed movable heat insulation board (1032) is slidably arranged inside the first sealed heat insulation board (103); a third sealed heat insulation board (1033) is arranged between each of the SMT patch placement cavity (1013), the heating welding cavity (1014) and the cooling cavity (1015); a plurality of support legs (1011) arranged in equal spacing are fixedly installed at the bottom of the workbench (101), each of the support legs (1011) is symmetrical to each other, and a circuit board (102) is placed in the inner cavity of the two guide notches (1017); The transmission unit (200) comprises a driving assembly and a circular pressing plate (203), wherein the driving assembly is used to drive the rolling unit (300) to drive the circular pressing plate (203) to perform slight reciprocating rotation; The rolling unit (300) comprises a first mounting plate (302) and a second mounting plate (303); opposite side walls of the first mounting plate (302) and the second mounting plate (303) are each provided with a special-shaped slide groove (3021); the two special-shaped slide grooves (3021) are parallel to each other; sliding blocks (3022) are slidably installed in the inner cavities of the two special-shaped slide grooves (3021); the bottoms of the first mounting plate (302) and the second mounting plate (303) are fixedly connected to the circular pressure plate (203).

2. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 1, characterized in that: A mechanical arm (1018) is arranged above the inner cavity of the SMT patch placement cavity (1013), and an electronic adsorption plate (1019) is arranged at the bottom of the mechanical arm (1018).

3. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 1, characterized in that: The driving assembly comprises a servo motor (201), the servo motor (201) being mounted above the inner cavity of the coating chamber (1012), a threaded rod (2011) being fixedly mounted on the output end of the servo motor (201), a threaded sleeve (212) being fixedly mounted on the output end of the threaded rod (2011), two mutually symmetrical guide rods (2013) being movably penetrated through the threaded sleeve (2012), and the top ends of the two guide rods (2013) are fixedly connected above the inner cavity of the coating chamber (1012).

4. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 3, characterized in that: Two mutually symmetrical rectangular tubes (202) are fixedly installed at the bottom of the threaded sleeve (2012), and the inner cavities of the two rectangular tubes (202) are both provided with a first sliding mechanism, and the first sliding mechanism includes two first sliding grooves (2021), and the two first sliding grooves (2021) are respectively opened on the two opposite side walls of the inner cavity of the rectangular tube (202), and the two first sliding grooves (2021) are symmetrical to each other. The inner cavities of the two first sliding grooves (2021) are both slidably installed with a first sliding block (2022), and the two first sliding blocks (2022) are symmetrical to each other. The opposite side walls of the two first sliding blocks (2022) are fixedly connected with a moving plate (223), and the two moving plates (223) are symmetrical to each other.

5. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 4, characterized in that: The bottoms of the two movable plates (2023) are fixedly connected with a plug rod (2024), the two plug rods (2024) are symmetrical to each other, the tops of the two movable plates (2023) are fixedly mounted with a first return spring (2025), the other ends of the two first return springs (2025) are fixedly connected to the top of the inner cavity of the rectangular tube (202), and the tops of the two movable plates (2023) are also fixedly mounted with a special-shaped plate (2026), the two special-shaped plates (2026) are symmetrical to each other.

6. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 4, characterized in that: A placement slot (2027) is provided on one side wall opposite to the two rectangular cylinders (202), the two placement slots (2027) are symmetrical to each other, and a second sliding mechanism is provided in the inner cavity of the two placement slots (2027).

7. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 6, characterized in that: The second sliding mechanism comprises two second sliding grooves (3013), the two second sliding grooves (3013) are respectively arranged on two opposite side walls of the inner cavity of the placement slot (2027), the two second sliding grooves (3013) are symmetrical to each other, the inner cavities of the two second sliding grooves (3013) are both slidably mounted with second sliding blocks (3014), and the two second sliding blocks (3014) are symmetrical to each other.

8. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 7, characterized in that: One side wall of the four second sliding blocks (3014) opposite to each other is fixedly connected to a driving plate (3011), the two driving plates (3011) are symmetrical to each other, and one side wall of the two driving plates (3011) opposite to each other is fixedly installed with a conical block (301), and opposite ends of the two driving plates (3011) are fixedly connected to a mounting rod (3012), and opposite ends of the two mounting rods (3012) are respectively fixedly connected to the sliding block (3022), and one side wall of each second sliding block (3014) is fixedly connected to a second return spring (3015), and the other end of the second return spring (3015) is respectively fixedly connected to the inner wall of the second sliding groove (3013).

9. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 1, characterized in that: A third sliding mechanism is arranged above the circular pressure plate (203), and the third sliding mechanism comprises a first circular slide groove (2031). The first circular slide groove (2031) is opened above the circular pressure plate (203), and two mutually symmetrical guide slide blocks (2032) are slidably installed in the inner cavity of the first circular slide groove (2031), and the two guide slide blocks (2032) are respectively fixedly connected with a plug rod (2024) above.

10. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 9, characterized in that: A second circular slide groove (2033) is provided on the side wall of the circular pressure plate (203), a movable slider (2034) is slidably mounted in the inner cavity of the second circular slide groove (2033), an L-shaped fixing rod (2035) is fixedly mounted on the movable slider (2034), and the other end of the L-shaped fixing rod (2035) is movably inserted into the rectangular notch (1031) and is fixedly connected to the second sealed movable heat insulation plate (1032).

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