Intelligent temperature control vacuum reflow soldering machine in negative pressure environment
By using segmented fast and slow vacuum and multiple cooling systems in vacuum reflow machines, the service life of the sealing ring is extended, and the problem of short sealing ring life of existing vacuum reflow machines is solved, and the reliability and welding quality of ultra-high temperature vacuum welding are improved.
Patent Information
- Application Number
- CN202510230787.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2025-04-08
AI Technical Summary
When existing vacuum reflow soldering machines are welded in high temperature zones, the sealing ring has a short service life and usually needs to be replaced within 7 days, which cannot meet the reliability requirements of ultra-high temperature vacuum welding.
An intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment was designed, using segmented fast and slow vacuum technology, combined with an internal cooling sink and a nitrogen cooling source to extend the service life of the sealing ring.
In high temperature environment, the service life of the sealing ring is extended to more than 3 months, which improves the reliability of ultra-high temperature vacuum welding and achieves a low hollow rate of product welding.
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Figure CN119772304A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of vacuum reflow soldering machines, and more specifically to an intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment. Background Art
[0002] The vacuum reflow soldering machine is a device that performs electronic assembly soldering in a high vacuum or low pressure environment. It removes the air in the soldering area by vacuuming to create a near-vacuum environment. In this environment, the components to be soldered are placed on the soldering platform and heated by infrared radiation and other methods to melt the solder. The surface tension of the melted solder is reduced, and it can better wet and diffuse to the surface and pins of the components. At the same time, the vacuum environment helps the bubbles inside the solder joint to overflow and reduce the void rate. When the solder is fully wetted and diffused, the soldering platform gradually lowers the temperature, and the solder solidifies to form a stable soldering structure.
[0003] At present, for common vacuum reflow soldering machines on the market, when the soldering temperature in the high temperature zone is greater than 320 degrees Celsius, the soldering process requirements for this temperature are exceeded and the service life of the sealing ring is short (the sealing ring needs to be replaced in about 7 days).
[0004] Therefore, it is necessary to propose an intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment to at least partially solve the problems existing in the prior art. Summary of the invention
[0005] A series of simplified concepts are introduced in the Summary of the Invention, which will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.
[0006] In order to at least partially solve the above problems, the present invention provides an intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment, comprising: a vacuum reflow soldering machine body, which includes a lower frame, an upper machine cover, an intelligent control module, a feed transmission part, a discharge transmission part, and a negative pressure vacuum part. The intelligent control module is arranged at the left end of the lower frame, and a welding furnace core is arranged in the lower frame. The feed transmission part, the discharge transmission part, and the negative pressure vacuum part are arranged in the welding furnace core. The upper machine cover is movably on the lower frame and can be buckled on the welding furnace core.
[0007] According to the intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment of an embodiment of the present invention, a front turbulent zone, a preheating zone, a constant temperature zone, a reflow zone, a vacuum welding zone, a cooling zone, and a rear turbulent zone are provided in the welding furnace. The feeding transmission part passes through the front turbulent zone, the preheating zone, the constant temperature zone, and the reflow zone. The negative pressure vacuum part corresponds to the vacuum welding zone, and the discharging transmission part passes through the cooling zone and the rear turbulent zone.
[0008] According to the intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment of the embodiment of the present invention, the negative pressure vacuum part includes an upper vacuum chamber cover and a lower vacuum chamber seat, the lower vacuum chamber seat is arranged in the welding furnace, the upper vacuum chamber cover is movably arranged on the lower vacuum chamber seat, the lower vacuum chamber seat is arranged with an upper heating mechanism, a material conveying mechanism and a lower heating mechanism, the material conveying mechanism is located between the upper heating mechanism and the lower heating mechanism, and a sealing ring is arranged on the lower vacuum chamber seat.
[0009] According to the intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment of the embodiment of the present invention, a circumferential sealing groove is arranged on the lower vacuum chamber seat, the sealing ring is arranged in the circumferential sealing groove, and an internal cooling water tank is also arranged in the lower vacuum chamber seat, the internal cooling water tank is located below the circumferential sealing groove, and is connected to the cooling water source.
[0010] According to the intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment of the embodiment of the present invention, a cold air peripheral groove is arranged in the lower end of the upper vacuum chamber cover, an upper chamber nitrogen pipeline is arranged on one end side of the upper vacuum chamber cover, and the cold air peripheral groove is connected to the nitrogen cold source part through the upper chamber nitrogen pipeline.
[0011] According to the intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment of the embodiment of the present invention, the lower vacuum chamber seat is connected to the vacuum pumping part, the vacuum pumping part includes a vacuum pumping tube, a vacuum pump, and a vacuum pipeline mechanism, the vacuum pumping tube, the vacuum pump, and the vacuum pipeline mechanism are located at the bottom of the welding furnace, the vacuum pumping tube is arranged at the bottom of the lower vacuum chamber seat, and the vacuum pump is connected to the vacuum pumping tube through the vacuum pipeline mechanism.
[0012] According to the intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment of an embodiment of the present invention, a lifting mechanism is also arranged below the lower vacuum chamber seat, the lifting mechanism includes a lifting base plate, a lifting motor, a reducer, and a lifting wire rod member, the lifting wire rod member is arranged on the lifting base plate, the reducer is rotatably connected to the lifting wire rod member and is arranged below the lifting base plate, the lifting motor is rotatably connected to the reducer and is arranged on one side of the reducer, and the lifting wire rod member is connected to the upper vacuum chamber cover.
[0013] According to the intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment of an embodiment of the present invention, a lifting frame is arranged on the lifting wire rod, and the lifting frame includes a first lifting plate and a second lifting plate. The first lifting plate is arranged at the upper end of the lifting wire rod, and the first lifting plate is connected to the second lifting plate through two first vertical rods. The second lifting plate is arranged below the lower vacuum chamber seat, and the end of the second lifting plate extends out of the end of the lower vacuum chamber seat. The end of the second lifting plate is arranged with a second vertical rod, and is connected to the upper vacuum chamber cover through the second vertical rod.
[0014] According to the embodiment of the present invention, the intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment also includes: a leak-proof joint assembly, which includes a first leak-proof joint and a second leak-proof joint. The first leak-proof joint is arranged at the opening of the inner cooling water tank, and the first leak-proof joint has an external extension head. The second leak-proof joint is arranged on the internal extension head of the cooling pipe. There is a receiving groove between the second leak-proof joint and the internal extension head, and the external extension head can be inserted into the receiving groove. There are multiple external locking grooves on the outer wall of the external extension head, and there are multiple internal locking mechanisms corresponding to the external locking grooves in the second leak-proof joint.
[0015] According to the intelligent temperature-controlled vacuum reflow soldering machine in a negative pressure environment of an embodiment of the present invention, the inner wall of the outer extension head is provided with a plurality of anti-sway inner grooves, and the outer wall of the inner extension head is provided with anti-sway convex plates corresponding to the anti-sway inner grooves.
[0016] Compared with the prior art, the present invention has at least the following beneficial effects:
[0017] The present invention provides an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment. When the intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment is working, the material tray can be transported into the welding furnace through an external feeding conveying mechanism, and transported from the feeding transmission part to the negative pressure vacuum part. The material tray enters the negative pressure vacuum part for negative pressure vacuum welding, and then enters the discharging transmission part and is transported to the external discharging conveying mechanism to complete welding. The main body of the vacuum reflow soldering machine provides a reflow soldering environment with a temperature exceeding 400°C and an absolute vacuum degree less than 1mbar, and the vacuum is drawn in sections at fast and slow speeds, and the sealing ring can also have a service life of more than 3 months in this high temperature environment, thereby improving the reliability of ultra-high temperature vacuum soldering and achieving a low void rate of product soldering relative to ordinary reflow soldering.
[0018] The intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment of the present invention, other advantages, objectives and features of the present invention will be partially reflected through the following description, and partly will also be understood by technicians in this field through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0020] Figure 1 It is a structural schematic diagram of the present invention.
[0021] Figure 2 It is a schematic diagram of the internal structure of the present invention.
[0022] Figure 3 It is a schematic diagram of the structure of the negative pressure vacuum part in the present invention.
[0023] Figure 4Schematic diagram of the internal structure of the negative pressure vacuum part of the present invention Figure 1 .
[0024] Figure 5 Schematic diagram of the internal structure of the negative pressure vacuum part of the present invention Figure 2 .
[0025] Figure 6 It is a top view of the structure of the upper heating mechanism in the present invention.
[0026] Figure 7 It is a structural schematic diagram of the vacuum pumping part in the present invention.
[0027] Figure 8 The structure of the leak-proof joint assembly of the present invention is shown in FIG. Figure 1 .
[0028] Fig. 9 The structure of the leak-proof joint assembly of the present invention is shown in FIG. Figure 2 .
[0029] Fig.10 The structure of the second leak-proof joint in the present invention is shown in FIG. Figure 1 .
[0030] Fig.11 The structure of the second leak-proof joint in the present invention is shown in FIG. Figure 2 .
[0031] Fig.12 For the present invention Figure 8 Schematic diagram of the enlarged structure of the part A in the middle.
[0032] Fig.13 For the present invention Fig. 9 Schematic diagram of the enlarged structure of the part B in the middle.
[0033] Fig.14 For the present invention Fig.11 Schematic diagram of the enlarged structure of the part C in the middle.
[0034] Fig.15 For the present invention Fig.11 Schematic diagram of the enlarged structure of the part D in the middle. DETAILED DESCRIPTION
[0035] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.
[0036] It should be understood that the terms such as “having”, “including” and “comprising” used herein do not exclude the existence or addition of one or more other elements or combinations thereof.
[0037] like Figure 1As shown, the present invention provides an intelligent temperature-controlled vacuum reflow soldering machine under a negative pressure environment, comprising: a vacuum reflow soldering machine body 100, the vacuum reflow soldering machine body 100 comprising a lower frame 1, an upper machine cover 2, an intelligent control module 3, a feeding transmission part 4, a discharging transmission part 5, and a negative pressure vacuum part 6, wherein the intelligent control module 3 is installed at the left end of the lower frame 1, and a display 31 and an input device 32 can also be installed at the left end of the lower frame 1, so that an operator can set parameters for the vacuum reflow soldering machine body 100 through the display 31, the input device 32, and the intelligent control module 3;
[0038] A welding furnace 10 is provided in the lower frame 1, and the upper machine cover 2 is movably on the lower frame 1 and can be buckled on the welding furnace 10. The feed transmission part 4, the negative pressure vacuum part 6, and the discharge transmission part 5 are sequentially installed in the welding furnace 10 from left to right. An external feed conveying mechanism 111 is also installed at the left end of the lower frame 1, and an external discharge conveying mechanism 112 is also installed at the right end. When the vacuum reflow soldering machine body 100 is working, the material tray can be transported to the welding furnace 10 through the external feed conveying mechanism 111, and transported to the negative pressure vacuum part 6 by the feed transmission part 4. The material tray 200 enters the negative pressure vacuum part 6 for negative pressure vacuum welding, and then enters the discharge transmission part 5 and is transported to the external discharge conveying mechanism 112 to complete welding. The vacuum reflow soldering machine body 100 provides a reflow soldering environment with a temperature exceeding 400°C and an absolute vacuum degree less than 1 mbar, and can perform fast and slow vacuum pumping in stages. The sealing ring can also have a service life of more than 3 months in this high-temperature environment, thereby improving the reliability of ultra-high temperature vacuum soldering and achieving a low void rate in product soldering compared to ordinary reflow soldering.
[0039] like Figure 2 As shown, further, in some embodiments of the present invention, a front turbulent zone 11, a preheating zone 12, a constant temperature zone 13, a reflow zone 14, a vacuum welding zone 15, a cooling zone 16, and a rear turbulent zone 17 are provided in the welding furnace 10, and the above-mentioned feeding transmission part 4 passes through the front turbulent zone 11, the preheating zone 12, the constant temperature zone 13, and the reflow zone 14, and the negative pressure vacuum part 6 corresponds to the vacuum welding zone 15, and the discharging transmission part 5 passes through the cooling zone 16 and the rear turbulent zone 17, and then the feeding transmission part 4 drives the material tray 200 to pass through the above-mentioned preheating zone 12, the constant temperature zone 13, and the reflow zone 14 in sequence, providing preheating, constant temperature and other preliminary preparations for welding for the material to be welded on the material tray 200, from the melting point of the solder to the peak value and then down to the melting point, the process of solder melting, PAD and solder are welded. The material tray 200 enters the negative pressure vacuum part 6 in the vacuum welding area 15 to complete the negative pressure vacuum welding, and then passes through the cooling area 16 and the rear turbulent area 17 in sequence through the discharge transmission part 5, and completes the cooling of the material and the stabilization of the air inside the rear end of the welding furnace 10.
[0040] Exemplary Negative Pressure Vacuum Section
[0041] like Figure 3-Figure 7 As shown, further, some embodiments of the present invention provide a specific structure of the negative pressure vacuum part 6, wherein the negative pressure vacuum part 6 of the structure includes an upper vacuum chamber cover 61 and a lower vacuum chamber seat 62, wherein the lower vacuum chamber seat 62 is fixedly installed in the welding furnace 10, and the upper vacuum chamber cover 61 is movably installed above the lower vacuum chamber seat 62, and an upper heating mechanism 63, a material conveying mechanism 64, and a lower heating mechanism 65 are also installed in the lower vacuum chamber seat 62, wherein the material conveying mechanism 64 is located between the upper heating mechanism 63 and the lower heating mechanism 65, so the material tray can be transported to the material conveying mechanism 64 through the feed transmission part 4; wherein the upper heating mechanism 63 and the lower heating mechanism 65 are both provided with a continuous S-shaped heating wire 66, and the S-shaped heating wire 66 can generate high temperature for welding.
[0042] After the material conveying mechanism 64 drives the material tray 200 to the welding station, the upper vacuum chamber cover 61 moves downward to fit onto the lower vacuum chamber seat 62. Since a sealing ring 621 is installed on the lower vacuum chamber seat 62, the upper vacuum chamber cover 61 and the lower vacuum chamber seat 62 are in a sealed state. After evacuation, the upper vacuum chamber cover 61 and the lower vacuum chamber seat 62 are in a negative pressure vacuum environment with an absolute vacuum degree of less than 1 mbar. The upper heating mechanism 63 and the lower heating mechanism 65 are started and can generate a welding environment with a temperature exceeding 400°C, thereby completing the welding of the material. In this way, the sealing ring 621 can have a service life of more than 3 months in this high temperature environment, thereby improving the reliability of ultra-high temperature vacuum welding and achieving a low void rate in product welding relative to ordinary reflow welding.
[0043] like Figure 4-Figure 6 As shown, in addition, the existing commonly used vacuum reflow soldering machine uses upper hot air to conduct to the vacuum chamber shell to heat the components inside the chamber, which will cause the surface temperature in contact with the sealing ring to be high, causing its sealing failure. Therefore, in some embodiments of the present invention, a circumferential sealing groove 622 is provided on the lower vacuum chamber seat 62, and the sealing ring 621 is installed in the circumferential sealing groove 622, and an internal cooling water tank 623 is also provided in the lower vacuum chamber seat 62. The internal cooling water tank 623 is located below the circumferential sealing groove 622 and is connected to the cooling pipe 70 of the cooling water source (not shown), so that cooling water can continuously enter the lower vacuum chamber seat 62 to take away the high temperature heat around the sealing ring 621 to prevent sealing failure.
[0044] Furthermore, in some embodiments of the present invention, a cold air groove 611 is further opened in the lower end of the upper vacuum chamber cover 61, and an upper chamber nitrogen pipeline 612 is installed on one end of the upper vacuum chamber cover 61, and the cold air groove 611 is connected to the nitrogen cold source part through the upper chamber nitrogen pipeline 612, so that the low-temperature nitrogen also produces a cooling effect on the upper vacuum chamber cover 61, taking away the high-temperature heat around the sealing ring 621, and preventing sealing failure.
[0045] By combining water cooling and air cooling such as the internal cooling water tank 623 and the cold air peripheral groove 611, the local temperature around the sealing ring 621 is kept within 320°C, while the temperature of the internal welding area of the upper vacuum chamber cover 61 and the lower vacuum chamber seat 62 is 400°C without affecting the sealing ring 621. The service life of the sealing ring 621 can exceed 3 months in this high temperature environment, thereby improving the reliability of ultra-high temperature vacuum welding and achieving a low void rate in product welding compared to ordinary reflow welding.
[0046] Exemplary leak-proof joint assembly
[0047] like Figure 8-Figure 15 As shown, further, in some embodiments of the present invention, the cooling pipe 70 of the cooling water source part is connected to the cooling water tank 623 of the lower vacuum chamber seat 62 through a leak-proof joint assembly 7, where the leak-proof joint assembly 7 includes a first leak-proof joint 71 and a second leak-proof joint 72. The first leak-proof joint 71 and the second leak-proof joint 72 can prevent cooling water leakage and facilitate subsequent maintenance.
[0048] Specifically, the first leak-proof joint 71 is installed at the opening of the inner cooling water tank 623, and has an outer extension head 711 on the first leak-proof joint 71, and the second leak-proof joint 72 is installed on the inner extension head 701 of the cooling pipe 70, and the inner extension head 701 also has an inner leak-proof ring 703, wherein a receiving groove 710 is provided between the second leak-proof joint 72 and the inner extension head 701, so when the first leak-proof joint 71 and the second leak-proof joint 72 are connected, the second leak-proof joint 72 is aligned with the first leak-proof joint 1 7 allows the protruding head 711 to be inserted into the accommodating groove 710. Furthermore, a plurality of outer locking grooves 712 are provided on the outer wall of the protruding head 711, and a plurality of inner locking mechanisms 73 corresponding to the outer locking grooves 712 are provided in the second leak-proof joint 72. Therefore, the inner locking mechanism 73 is stuck to the outer locking groove 712 of the first leak-proof joint 17 to complete the locking. At the same time, the first leak-proof joint 17 also presses against the inner leak-proof ring 703, thereby realizing a fixed leak-proof connection between the first leak-proof joint 17 and the second leak-proof joint 72.
[0049] Furthermore, a plurality of anti-sway inner grooves 713 are provided on the inner wall of the external protruding head 711, and correspondingly, an anti-sway convex plate 702 corresponding to the anti-sway inner grooves 713 is provided on the outer wall of the internal protruding head 701. Therefore, when the external protruding head 711 enters the accommodating groove 710, the anti-sway convex plate 702 corresponds to the anti-sway inner grooves 713, thereby facilitating the fixing of the external protruding head 711 to the internal protruding head 701, and preventing the external protruding head 711 from rotating circumferentially on the internal protruding head 701, thereby avoiding the misalignment of the internal locking mechanism 73 and the external locking groove 712, thereby reducing the fixing and leak-proofing effect between the first leak-proof joint 17 and the second leak-proof joint 72.
[0050] Exemplary Second Leak-Proof Joint
[0051] like Figure 10-11 As shown, further, some embodiments of the present invention provide a specific structure of the second leak-proof joint 72, wherein the second leak-proof joint 72 of the structure includes a leak-proof sealing plate 721 and a leak-proof cone cap 722, wherein the leak-proof cone cap 722 is installed on the inner extension head 701 through an inner support member 720, the leak-proof sealing plate 721 is installed on the front end of the leak-proof cone cap 722, and the leak-proof sealing plate 721 has an inner opening 7211 corresponding to the inner extension head 701;
[0052] When the locking cam 72 is in the closed position, the locking cam 723 is in the closed position, and the locking cam 723 is in the closed position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 72
[0053] Furthermore, the above-mentioned internal support member 720 includes an inner support ring 7201 and multiple inner support support plates 7202. The inner support ring 7201 is fixed on the inner extension head 701. The multiple inner support support plates 7202 are evenly distributed on the inner extension head 701 and connected to the inner wall of the leak-proof cone cap 722. The leak-proof cone cap 722 is further fixed and supported on the inner extension head 701 through the above-mentioned internal support member 720.
[0054] Exemplary Lock Cylinder
[0055] like Fig.14As shown, further, some embodiments of the present invention provide a specific structure of the lock core part 75, where the lock core part 75 of the structure includes a lock core base plate 751, a first elastic member 752, a lock core clamping plate 753, and a second elastic member 754, wherein the first elastic member 752 is mounted on the inner end wall of the anti-leakage cone cap 722, and the lock core base plate 751 is mounted on the first elastic member 752, and the second elastic member 754 is mounted on the lock core base plate 751, the lock core clamping plate 753 is mounted on the second elastic member 754, and the lock core clamping plate 753 abuts against the outer lock groove 712;
[0056] The lock core portion 75 can support the lock core base plate 751 through two first elastic members 752, and the lock core base plate 751 can support the lock core clamping plate 753 through two elastic members 754, so that the lock core clamping plate 753 can be clamped and pressed into the outer lock groove 712, and the first elastic member 752 and the second elastic member 754 also have a retraction function, thereby facilitating the subsequent separation of the lock core clamping plate 753 away from the outer lock groove 712, and facilitating the subsequent separation of the first anti-leakage joint 17 and the second anti-leakage joint 72 for maintenance.
[0057] The first elastic member 752 comprises a first cylinder 7521, a first inner support column 7522 and a first spring body 7523. The first cylinder 7521 is mounted on the inner end wall of the anti-leakage cone cap 722. The first inner support column 7522 is mounted in the first cylinder 7521 and connected to the lock core base plate 751. The first spring body 7523 is sleeved on the first cylinder 7521 and the first inner support column 7522, and is supported against the inner end wall of the lock core base plate 751 and the anti-leakage cone cap 722, so as to realize the support and contraction of the first elastic member 752. Similarly, the second elastic member 754 includes a second cylinder 7541, a second inner support column 7542, and a second spring body 7543. The second cylinder 7541 is installed on the lock core base plate 751, the second inner support column 7542 is installed in the second cylinder 7541, the lock core clamping plate 753 is installed on the second inner support column 7542, and the second spring body 7543 is sleeved on the second cylinder 7541 and the second inner support column 7542, and is supported between the lock core base plate 751 and the lock core clamping plate 753, so as to realize the support and contraction of the second elastic member 754.
[0058] Exemplary inner linkage
[0059] Furthermore, some embodiments of the present invention provide a specific structure of the inner linkage part 74, wherein the inner linkage part 74 of the structure includes an inner circumference 741 and a linkage hinge 742, wherein the inner circumference 741 can be rotatably installed in the inner circumference groove of the leak-proof cone cap 722, and the linkage hinge 742 includes two hinge plates 743 and a hinge seat 744, wherein the hinge seat 744 is installed on the lock core seat plate 751, one end of the hinge plate 743 is connected to the first hinge shaft 745 on the hinge seat 744, and the other end is connected to the second hinge shaft 746 on the inner circumference 741, and a plurality of first convex tooth blocks 747 are provided on the inner circumference 741, and a plurality of second convex tooth blocks 747 are provided on the handle member 723 accordingly. When the locking cam 752 is in the unlocking state, the locking cam 752 is in the unlocking state, and the locking cam 752 is in the unlocking state.
[0060] Exemplary Locking and Anti-Moving Mechanisms
[0061] like Fig.15 As shown, further, in some embodiments of the present invention, a locking and anti-movement mechanism 75 is installed on the anti-leakage cone cap 722. The locking and anti-movement mechanism 75 can not only fix the handle 723 again to prevent it from moving, but also facilitate the subsequent movement away from the handle 723 to unlock the handle 723.
[0062] Specifically, the locking anti-movement mechanism 75 of the above structure includes an anti-movement rod 751, an anti-movement seat 752, a third elastic member 753, a first anti-movement wedge 754, a fourth elastic member 755, and a second anti-movement wedge 756, wherein the anti-movement seat 752 is installed on the inner end wall of the leak-proof cone cap 722, and the anti-movement rod 751 is movably penetrated on the leak-proof cone cap 722, one end of the anti-movement rod 751 is connected to the first anti-movement wedge 754, and the third elastic member 753 is installed on the inner end wall of the leak-proof cone cap 722. Installed between the first anti-movement wedge block 754 and the anti-leakage cone cap 722, the fourth elastic member 755 is movably installed on the anti-movement seat 752, the second anti-movement wedge block 756 is installed at the bottom of the fourth elastic member 755, and corresponds to the plurality of third convex tooth blocks 725 on the handle member 723, further, the first anti-movement wedge block 754 has a first wedge-shaped wall 757 corresponding to the fourth elastic member 755, and the second anti-movement wedge block 756 has a second wedge-shaped wall 758;
[0063] Therefore, when the handle 723 is rotated, the handle 723 rotates and the third protruding tooth block 725 abuts against the second wedge-shaped wall 758, so that the second anti-movement wedge block 756 moves upward and the fourth elastic member 755 also moves upward, so that the third protruding tooth block 725 rotates to the rear side of the second anti-movement wedge block 756, and the locking anti-movement mechanism 75 is implemented to fix the handle 723 again to prevent it from moving;
[0064] Then, the anti-movement rod 751 can be pressed from the outside of the leak-proof cone cap 722, and the anti-movement rod 751 drives the first anti-movement wedge block 754 to move to the top of the fourth elastic member 755, and pushes the top of the fourth elastic member 755 upward, and then the fourth elastic member 755 drives the second anti-movement wedge block 756 below to move upward away from the third protruding tooth block 725, so as to facilitate the rotation of the handle member 723 again, realize the unlocking of the handle member 723, and then facilitate the rotation of the internal linkage part 74.
[0065] Exemplary Lifting Mechanism
[0066] like Figure 3-Figure 4 As shown, further, in some embodiments of the present invention, a lifting mechanism 67 is further installed below the lower vacuum chamber seat 62, and the lifting and lowering buckling of the upper vacuum chamber cover 61 on the lower vacuum chamber seat 62 is realized by the lifting mechanism 67; the lifting mechanism 67 of this structure includes a lifting base plate 671, a lifting motor 672, a reducer 673, and a lifting wire rod 673, wherein the lifting wire rod 673 is installed on the lifting base plate 671, and the reducer 673 is rotatably connected to the lifting wire rod 673 and installed below the lifting base plate 671, the lifting motor 672 is rotatably connected to the reducer 673 and installed on one side of the reducer 673, and the lifting wire rod 673 is connected to the upper vacuum chamber cover 61;
[0067] Therefore, when the lifting motor 672 is started, it can drive the reducer 673 to rotate, and then drive the lifting screw rod 673 to rotate, so that the screw rod body 675 of the lifting screw rod 673 can rise upward or shrink downward, and then drive the upper vacuum chamber cover 61 to lift and engage on the lower vacuum chamber seat 62, and reduce the impact force of the upper vacuum chamber cover 61 on the sealing ring 621 when closing through speed control.
[0068] Furthermore, a lifting frame 68 is installed on the lifting wire rod 673 , and is connected to the upper vacuum chamber cover 61 through the lifting frame 68 . The lifting frame 68 includes a first lifting plate 681 and a second lifting plate 682. Specifically, the first lifting plate 681 is installed on the upper end of the lifting screw rod 673, and the first lifting plate 681 is connected to the second lifting plate 682 through two first vertical rods 683, so that the second lifting plate 682 is located below the lower vacuum chamber seat 62, and the end of the second lifting plate 682 extends out of the end of the lower vacuum chamber seat 62, and a second vertical rod 684 is installed at the end of the second lifting plate 682, which is connected to the upper vacuum chamber cover 61 through the second vertical rod 684, so the screw body 675 in the lifting screw rod 673 can drive the first lifting plate 681 to lift and lower, thereby realizing the lifting and lowering of the second lifting plate 682, and the second lifting plate 682 drives the upper vacuum chamber cover 61 to lift and lower and buckle on the lower vacuum chamber seat 62. The above structure can make the lifting and buckling action of the upper vacuum chamber cover 61 more stable and improve work efficiency.
[0069] Exemplary Vacuum Section
[0070] like Figure 7 As shown, further, in some embodiments of the present invention, the lower vacuum chamber seat 62 is connected to the vacuum pumping part, and the vacuum pumping part includes a vacuum pumping tube 661, a vacuum pump 662, and a vacuum pipeline mechanism 663. The vacuum pumping tube 661, the vacuum pump 662, and the vacuum pipeline mechanism 663 are located at the bottom of the welding furnace 10. The vacuum pumping tube 661 is arranged at the bottom of the lower vacuum chamber seat 62. The vacuum pump 662 is connected to the vacuum pumping tube 661 through the vacuum pipeline mechanism 663, wherein the vacuum pipeline mechanism 663 includes a vacuum pump 661 connected in sequence. The bellows 664, high vacuum valve 665, butterfly valve 666, vacuum gauge 667, vacuum breaking solenoid valve 668, filter tank 669, cooling tank 670, vacuum pipe 660 and other components, the bellows 664 is connected to the vacuum pump 662, and the vacuum pipe 660 is connected to the vacuum pipe 661. By using the above-mentioned high vacuum valve 665, butterfly valve 666, vacuum gauge 667 and other components, the vacuum pipeline mechanism 663 is optimized, and the vacuum pumping frequency and speed are adjusted and controlled to generate air oscillation pressure difference, which effectively reduces the welding void rate.
[0071] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0072] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0073] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.
Claims
1. An intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: include: The main body of the vacuum reflow soldering machine includes a lower frame, an upper machine cover, an intelligent control module, a feeding transmission part, a discharging transmission part, and a negative pressure vacuum part. The intelligent control module is arranged at the left end of the lower frame. The lower frame has a welding furnace core. The feeding transmission part, the discharging transmission part, and the negative pressure vacuum part are arranged in the welding furnace core. The upper machine cover is movably on the lower frame and can be buckled on the welding furnace core.
2. According to claim 1, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: The welding furnace has a front turbulence zone, a preheating zone, a constant temperature zone, a reflow zone, a vacuum welding zone, a cooling zone, and a rear turbulence zone. The feeding transmission part passes through the front turbulence zone, the preheating zone, the constant temperature zone, and the reflow zone. The negative pressure vacuum part corresponds to the vacuum welding zone, and the discharging transmission part passes through the cooling zone and the rear turbulence zone.
3. According to claim 1, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: The negative pressure vacuum part includes an upper vacuum chamber cover and a lower vacuum chamber seat. The lower vacuum chamber seat is arranged in the welding furnace. The upper vacuum chamber cover is movably arranged on the lower vacuum chamber seat. The lower vacuum chamber seat is provided with an upper heating mechanism, a material conveying mechanism and a lower heating mechanism. The material conveying mechanism is located between the upper heating mechanism and the lower heating mechanism. A sealing ring is arranged on the lower vacuum chamber seat.
4. According to claim 3, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: A circumferential sealing groove is arranged on the lower vacuum chamber seat, a sealing ring is arranged in the circumferential sealing groove, and an inner cooling water groove is also arranged in the lower vacuum chamber seat, the inner cooling water groove is located below the circumferential sealing groove and connected to the cooling water source.
5. According to claim 3, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: A cold air peripheral groove is arranged in the lower end of the upper vacuum chamber cover, an upper chamber nitrogen pipeline is arranged on one end side of the upper vacuum chamber cover, and the cold air peripheral groove is connected to the nitrogen cold source part through the upper chamber nitrogen pipeline.
6. According to claim 3, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: The lower vacuum chamber seat is connected to the vacuum pumping part, which includes a vacuum pumping tube, a vacuum pump, and a vacuum pipeline mechanism. The vacuum pumping tube, the vacuum pump, and the vacuum pipeline mechanism are located at the bottom of the welding furnace. The vacuum pumping tube is arranged at the bottom of the lower vacuum chamber seat, and the vacuum pump is connected to the vacuum pumping tube through the vacuum pipeline mechanism.
7. According to claim 3, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: A lifting mechanism is also arranged below the lower vacuum chamber seat, and the lifting mechanism includes a lifting base plate, a lifting motor, a reducer, and a lifting wire rod. The lifting wire rod is arranged on the lifting base plate, the reducer is rotatably connected to the lifting wire rod and is arranged below the lifting base plate, the lifting motor is rotatably connected to the reducer and is arranged on one side of the reducer, and the lifting wire rod is connected to the upper vacuum chamber cover.
8. An intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment according to claim 7, characterized in that: A lifting frame is arranged on the lifting wire rod, and the lifting frame includes a first lifting plate and a second lifting plate. The first lifting plate is arranged at the upper end of the lifting wire rod, and the first lifting plate is connected to the second lifting plate through two first vertical rods. The second lifting plate is arranged below the lower vacuum chamber seat, and the end of the second lifting plate extends out of the end of the lower vacuum chamber seat. The end of the second lifting plate is arranged with a second vertical rod, and is connected to the upper vacuum chamber cover through the second vertical rod.
9. According to claim 3, an intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment, characterized in that: Also includes: The leak-proof joint assembly includes a first leak-proof joint and a second leak-proof joint. The first leak-proof joint is arranged at the opening of an inner cooling water tank. The first leak-proof joint has an outer extension head. The second leak-proof joint is arranged on an inner extension head of a cooling pipe. A receiving groove is provided between the second leak-proof joint and the inner extension head. The outer extension head can be inserted into the receiving groove. A plurality of outer locking grooves are provided on the outer wall of the outer extension head. The second leak-proof joint has a plurality of inner locking mechanisms corresponding to the outer locking grooves.
10. An intelligent temperature-controlled vacuum reflow soldering machine under negative pressure environment according to claim 9, characterized in that: The inner wall of the outer extension head is provided with a plurality of anti-sway inner grooves, and the outer wall of the inner extension head is provided with anti-sway convex plates corresponding to the anti-sway inner grooves.
Citation Information
Cited By
Vacuum welding and transporting mechanism under high-temperature environment
CN121131904A