A solder wire spot welding auxiliary device for computer circuit boards
By designing the spot welding auxiliary device for computer circuit boards, the welding process is monitored and controlled in real time, the problem of solder wire not being sufficiently melted and dummy soldered in traditional spot welding methods is solved, the welding quality and efficiency are improved, and a clean welding environment is provided.
Patent Information
- Application Number
- CN202411984697.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-04-08
AI Technical Summary
The traditional spot welding method has the phenomenon that the solder wire cannot be fully melted and soldered, resulting in low welding quality and fluctuations in the temperature of the soldering iron, resulting in low welding efficiency.
A solder wire spot welding auxiliary device for computer circuit boards is designed, including a soldering iron head, a face-changing rotating mechanism, a flux spraying mechanism, a flux trigger mechanism and a smoke suction mechanism. The welding process is monitored and controlled in real time through the PLC controller to ensure that the welding is carried out at the appropriate temperature and flux spraying.
It effectively avoids the phenomenon of false welding, improves welding quality and efficiency, reduces the time to wait for the temperature of the soldering iron to recover, and provides a clean welding environment that meets environmental protection and occupational health requirements.
Smart Images

Figure CN119772305A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of integrated circuit board welding, and in particular relates to a solder wire spot welding auxiliary device for a computer circuit board. Background Art
[0002] With the rapid development of computer technology, the manufacturing process requirements for computer high-precision integrated circuit boards, especially computer motherboards and other precision circuit boards, have become increasingly stringent. In the production and assembly process, spot welding plays a vital role and is directly related to the electrical performance and stability of the circuit boards.
[0003] The traditional spot welding method relies on the cooperation of electric soldering iron and solder wire to complete the solder joint connection. However, this method has many disadvantages. In actual operation, the solder wire is taken out from the room temperature environment, and the initial surface temperature is low. This low-temperature medium contacts the high-temperature electric soldering iron welding head, which will quickly absorb a large amount of heat, causing the surface temperature of the electric soldering iron to drop sharply. From the perspective of welding quality, once the temperature of the electric soldering iron is lower than a certain range of the melting point of the solder, the solder cannot be fully melted and flowed, and it is difficult to infiltrate the pads of the circuit board and the pins of the electronic components, and then the phenomenon of cold soldering will inevitably occur. Cold soldering affects the overall performance of the computer and even causes frequent equipment failures. From the perspective of welding quality, when the temperature of the electric soldering iron drops due to the above reasons, if you want to weld smoothly again, you must wait for its temperature to rise to the appropriate range. This waiting process takes an uncertain time, which is restricted by many factors such as the power of the electric soldering iron and the heat dissipation environment. It takes at least a dozen seconds and at most several minutes. For large-scale circuit board production line operations, frequent pauses and waiting greatly slow down the production rhythm.
[0004] Therefore, a solder wire spot welding auxiliary device for computer circuit board is proposed. Summary of the invention
[0005] The object of the present invention is to provide a solder wire spot welding auxiliary device for computer circuit boards in view of the above problems.
[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a solder wire spot welding auxiliary device for computer circuit boards, comprising a body, a cylinder, an electric soldering iron rod, an automatic solder wire feeding box and a solder wire feeding pipe, wherein the cylinder is fixedly arranged on the top of the body, a mobile frame is fixedly arranged on the movable end of the cylinder, the automatic solder wire feeding box is fixedly arranged on the bottom of the mobile frame, one end of the solder wire feeding pipe is fixedly connected to the side wall of the automatic solder wire feeding box, a fixed sleeve is vertically fixed on one side of the mobile frame, the electric soldering iron rod is fixedly arranged inside the fixed sleeve, and further comprising: An electric soldering iron tip is fixedly arranged at the lower end of the electric soldering iron rod, the electric soldering iron tip is a trihedron, a high temperature resistant shell is fixedly arranged inside the electric soldering iron tip, and three side walls of the high temperature resistant shell are fixedly provided with wireless temperature sensors that are arranged in contact with three inner side walls of the electric soldering iron tip; A round box is fixedly arranged at the upper end of the fixed sleeve, and a face-changing rotating mechanism is arranged inside the round box, and the upper end of the electric soldering iron rod is connected to the face-changing rotating mechanism; A soldering flux ejection mechanism is arranged on one side of the electric soldering iron head; A soldering flux trigger mechanism is arranged between the inner wall of the round box and the rod wall of the electric soldering iron rod; A smoke suction mechanism is fixedly arranged on the side wall of the movable frame, and the smoke suction mechanism is arranged toward the electric soldering iron head; A PLC controller is fixedly arranged on the side wall of the machine body, and the cylinder, the soldering iron rod, the automatic solder wire feeding box, the soldering iron head, the wireless temperature sensor, the face-changing rotating mechanism, the pump body inside the flux triggering mechanism, the flux triggering mechanism and the smoke suction mechanism are all electrically connected to the PLC controller.
[0007] Preferably, the face-changing rotation mechanism includes a motor fixedly arranged on the top of the round box, the output shaft of the motor extends to the interior of the round box and is fixedly provided with a small gear, the rod wall of the soldering iron rod is fixedly provided with a large gear, the small gear is meshed with the large gear, a conductive rotating joint is fixedly provided inside the top of the round box, and the upper end of the soldering iron rod is fixedly connected to the bottom of the conductive rotating joint.
[0008] Preferably, the flux spraying mechanism includes a flux storage box fixedly arranged at the bottom of the solder wire automatic feeding box, a flux nozzle is fixedly arranged at the end of the solder wire feeding pipe, a flux supply pipe is arranged between the flux nozzle and the flux storage box, and the flux supply pipe is arranged inside the solder wire feeding pipe.
[0009] Preferably, the flux trigger mechanism includes a plurality of inductive proximity switches fixedly arranged on the inner wall of the bottom of the round box, the plurality of inductive proximity switches are evenly distributed around the soldering iron rod as the center of the circle, and a metal trigger block is fixedly provided on the rod wall of the soldering iron rod at a position corresponding to the position of the inductive proximity switch.
[0010] Preferably, the smoke extraction mechanism includes a smoke extraction cylinder fixedly mounted on the side wall of the mobile frame, a smoke extraction pipe is fixedly mounted on the bottom of the smoke extraction cylinder, a smoke extraction fan is mounted on one side of the smoke extraction cylinder, and an activated carbon filter layer is mounted inside the smoke extraction cylinder.
[0011] Preferably, the smoke extraction cylinder includes a first cylinder body and a second cylinder body, and a threaded ring and a threaded groove that cooperate with each other are arranged between the first cylinder body and the second cylinder body, the smoke extraction pipe is fixedly arranged at the bottom of the first cylinder body, the smoke extraction fan is fixedly arranged on the side wall of the second cylinder body, a fixed orifice plate and a movable orifice plate are arranged inside the second cylinder body, the activated carbon filter layer is arranged between the fixed orifice plate and the movable orifice plate, and an L-shaped top rod that is arranged against the movable orifice plate is fixedly arranged on the inner side wall of the first cylinder body.
[0012] Preferably, a supporting arm is fixedly provided on the side wall of the body and located below the electric soldering iron head, and a material receiving groove is provided on the upper side of the end of the supporting arm.
[0013] Preferably, an LED fill light bead is fixedly provided at the lower end of the solder wire feeding tube, and the LED fill light bead is electrically connected to the PLC controller.
[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the setting of the electric soldering iron tip and the face-changing rotating mechanism, the wireless temperature sensor inside the electric soldering iron tip can monitor the temperature of the three sides of the electric soldering iron tip in real time, and transmit the temperature data to the PLC controller. When the temperature of one side drops due to welding, the PLC controller can timely control the action of the face-changing rotating mechanism to ensure that welding is always carried out on the surface with the appropriate temperature, thereby ensuring the welding quality and avoiding problems such as cold soldering. At the same time, it saves the time of waiting for the temperature of the electric soldering iron tip to recover and improves the spot welding efficiency.
[0015] 2. Through the set flux spraying mechanism and flux triggering mechanism, the flux spraying mechanism and the flux triggering mechanism are used together. When the soldering iron tip is changed, the flux can be accurately sprayed onto the surface to be soldered, which plays a cleaning and activation role, removes impurities such as oxide layer and oil stains on the metal surface, makes it easier for the solder wire to combine with the metal surface, and guides the solder to better fill the gap between the pin and the pad, further ensures the quality of the solder joint, and improves the welding effect.
[0016] 3. The smoke suction mechanism can timely suck the smoke gas generated during spot welding. The activated carbon filter layer can effectively absorb harmful substances in the smoke (such as organic volatiles, metal oxide particles, etc.), reduce the harm of harmful gases to the health of operators and the pollution to the environment, and provide a relatively clean environment for welding work, which meets the requirements of environmental protection and occupational health. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a three-dimensional structural schematic diagram of a solder wire spot welding auxiliary device for a computer circuit board provided by the present invention; Figure 2The invention provides a solder wire spot welding auxiliary device for computer circuit boards. Figure 1 A schematic diagram of the structure of the electric soldering iron rod, the fixed sleeve and the round box; Figure 3 The invention provides a solder wire spot welding auxiliary device for computer circuit boards. Figure 2 A schematic diagram of the top view of the soldering iron tip; Figure 4 The invention provides a solder wire spot welding auxiliary device for computer circuit boards. Figure 3 Schematic diagram of the three-dimensional structure of the Zhongdian soldering iron tip; Figure 5 The invention provides a solder wire spot welding auxiliary device for computer circuit boards. Figure 1 Schematic diagram of the local structure of the end of the middle solder wire feeding tube; Figure 6 The invention provides a solder wire spot welding auxiliary device for computer circuit boards. Figure 1 A schematic diagram of the structure of the smoke extraction mechanism; Figure 7 The invention provides a solder wire spot welding auxiliary device for computer circuit boards. Figure 6 Schematic diagram of the cross-section of the smoke extraction mechanism.
[0018] In the figure: 1 body, 2 cylinder, 3 soldering iron rod, 4 solder wire automatic feeding box, 5 solder wire feeding tube, 6 mobile frame, 7 fixed sleeve, 8 soldering iron head, 9 high temperature resistant shell, 10 wireless temperature sensor, 11 round box, 12 face-changing rotating mechanism, 121 motor, 122 small gear, 123 large gear, 124 conductive rotating joint, 13 flux ejecting mechanism, 131 flux storage box, 132 flux nozzle, 133 flux supply tube, 14 solder flux trigger mechanism, 141 inductive proximity switch, 142 metal trigger block, 15 smoke suction mechanism, 151 smoke suction cylinder, 152 smoke suction tube, 153 smoke suction fan, 154 activated carbon filter layer, 16 PLC controller, 17 first cylinder, 18 second cylinder, 19 threaded ring, 20 fixed orifice plate, 21 movable orifice plate, 22 L-shaped ejector rod, 23 support arm, 24 receiving trough, 25 LED fill light beads. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0020] like Figure 1-Figure 7As shown, a solder wire spot welding auxiliary device for computer circuit boards includes a body 1, a cylinder 2, an electric soldering iron rod 3, an automatic solder wire feeding box 4 and a solder wire feeding pipe 5, the cylinder 2 is fixedly arranged on the top of the body 1, a mobile frame 6 is fixedly arranged on the movable end of the cylinder 2, the automatic solder wire feeding box 4 is fixedly arranged on the bottom of the mobile frame 6, one end of the solder wire feeding pipe 5 is fixedly connected to the side wall of the automatic solder wire feeding box 4, a fixed sleeve 7 is vertically fixed on one side of the mobile frame 6, and the electric soldering iron rod 3 is fixedly arranged inside the fixed sleeve 7, and also includes: The soldering iron tip 8 is fixedly arranged at the lower end of the soldering iron rod 3. The soldering iron tip 8 is a trihedron. A high-temperature resistant shell 9 is fixedly arranged inside the soldering iron tip 8. The three side walls of the high-temperature resistant shell 9 are fixedly provided with wireless temperature sensors 10 that are arranged in contact with the three inner side walls of the soldering iron tip 8. The wireless temperature sensor 10 can continuously detect the temperature of the three surfaces of the soldering iron tip 8. A supporting arm 23 is fixedly arranged on the side wall of the body 1 and located below the soldering iron tip 8. A material receiving trough 24 is arranged on the upper side of the end of the supporting arm 23. During the welding process, flux residue or metal oxidation products may appear, which can be collected through the material receiving trough 24. At the same time, there will be some components that can be temporarily placed inside the material receiving trough 24.
[0021] The round box 11 is fixedly arranged at the upper end of the fixed sleeve 7, and a face-changing rotating mechanism 12 is arranged inside the round box 11. The upper end of the soldering iron rod 3 is connected to the face-changing rotating mechanism 12. The face-changing rotating mechanism 12 includes a motor 121 fixedly arranged at the top of the round box 11. The output shaft of the motor 121 extends to the inside of the round box 11 and is fixedly provided with a small gear 122. A large gear 123 is fixedly arranged on the rod wall of the soldering iron rod 3. The small gear 122 is meshed with the large gear 123. A conductive rotating joint 124 is fixedly arranged inside the top of the round box 11. The upper end of the soldering iron rod 3 is fixedly connected to the bottom of the conductive rotating joint 124. The motor 121 can drive the small gear 122 to rotate when it works, and the small gear 122 can drive the large gear 123 to rotate, thereby driving the soldering iron rod 3 and the soldering iron head 8 to rotate together, so that the soldering iron head 8 performs a face-changing action.
[0022] The flux spraying mechanism 13 is arranged on one side of the electric soldering iron tip 8. The flux spraying mechanism 13 includes a flux storage box 131 fixedly arranged at the bottom of the solder wire automatic feeding box 4. A flux nozzle 132 is fixedly arranged at the end of the solder wire feeding pipe 5. A flux supply pipe 133 is arranged between the flux nozzle 132 and the flux storage box 131, and the flux supply pipe 133 is arranged inside the solder wire feeding pipe 5. The pump body inside the flux storage box 131 can discharge the flux into the flux supply pipe 133 and the flux nozzle 132, and finally spray it to the surface to be soldered of the integrated circuit board through the flux nozzle 132, which can remove impurities such as oxide layer and oil stains on the metal surface, and at the same time make the solder wire easier to combine with the metal surface, and can guide the solder to better fill the gap between the pin and the pad to ensure the quality of the solder joint.
[0023] The flux trigger mechanism 14 is arranged between the inner wall of the round box 11 and the rod wall of the soldering iron rod 3. The flux trigger mechanism 14 includes a plurality of inductive proximity switches 141 fixedly arranged on the inner wall of the bottom of the round box 11. The plurality of inductive proximity switches 141 are evenly distributed around the soldering iron rod 3 as the center of the circle. A metal trigger block 142 is fixedly arranged on the rod wall of the soldering iron rod 3 and at a position corresponding to the position of the inductive proximity switch 141. When the soldering iron rod 3 rotates, the metal trigger block 142 will also rotate together. When the metal trigger block 142 rotates and aligns with one of the inductive proximity switches 141, the oscillation circuit inside the inductive proximity switch 141 changes due to the induction of the metal trigger block 142. This change will change the output state of the inductive proximity switch 141 and achieve triggering.
[0024] The smoke suction mechanism 15 is fixedly arranged on the side wall of the mobile frame 6, and the smoke suction mechanism 15 is arranged toward the electric soldering iron head 8. The smoke suction mechanism 15 includes a smoke suction cylinder 151 fixedly arranged on the side wall of the mobile frame 6, a smoke suction pipe 152 is fixedly arranged at the bottom of the smoke suction cylinder 151, a smoke suction fan 153 is arranged on one side of the smoke suction cylinder 151, and an activated carbon filter layer 154 is arranged inside the smoke suction cylinder 151. When the smoke suction fan 153 is working, negative pressure can be generated inside the smoke suction cylinder 151 and inside the smoke suction pipe 152, so that the smoke gas generated during the spot welding process can be sucked through the activated carbon filter layer 154, so that the smoke gas can be discharged into the air after being processed; the smoke suction cylinder 151 includes a first cylinder body 17 and a second cylinder body 18, and a screw that cooperates with each other is arranged between the first cylinder body 17 and the second cylinder body 18. The patterned ring 19 and the threaded groove, the smoke suction pipe 152 is fixedly arranged at the bottom of the first cylinder 17, the smoke suction fan 153 is fixedly arranged on the side wall of the second cylinder 18, the interior of the second cylinder 18 is provided with a fixed orifice plate 20 and a movable orifice plate 21, the activated carbon filter layer 154 is arranged between the fixed orifice plate 20 and the movable orifice plate 21, the inner side wall of the first cylinder 17 is fixedly provided with an L-shaped top rod 22 which is set against the movable orifice plate 21, the second cylinder 18 is rotated to separate the threaded ring 19 and the threaded groove between the second cylinder 18 and the first cylinder 17, and when the first cylinder 17 and the second cylinder 18 are separated, the L-shaped top rod 22 will also be separated from the movable orifice plate 21, and then the movable orifice plate 21 is taken out from the interior of the second cylinder 18, and then the activated carbon filter layer 154 is poured out and replaced with new material, and finally the first cylinder 17 and the second cylinder 18 are spirally fixed.
[0025] The PLC controller 16 is fixedly arranged on the side wall of the machine body 1, and the cylinder 2, the soldering iron rod 3, the solder wire automatic feeding box 4, the soldering iron head 8, the wireless temperature sensor 10, the face-changing rotation mechanism 12, the pump body inside the flux trigger mechanism 14, the flux trigger mechanism 14 and the smoke suction mechanism 15 are all electrically connected to the PLC controller 16. The lower end of the solder wire feeding pipe 5 is fixedly provided with an LED fill light bead 25, and the LED fill light bead 25 is electrically connected to the PLC controller 16. By operating the PLC controller 16, the LED fill light bead 25 can be turned on to work, so that the LED fill light bead 25 can provide fill light to the position of the soldering iron head 8, which is convenient for the staff to observe and operate.
[0026] The operating principle of the present invention is described as follows: the staff first operates the PLC controller 16 to start the telescopic action of the cylinder 2, so that the cylinder 2 drives the movable frame 6 to move downward or upward and adjust the use height of the electric soldering iron tip 8. After the height is adjusted, the staff operates the PLC controller 16 to preheat the electric soldering iron tip 8. As the surface temperature of the electric soldering iron tip 8 continues to rise, the wireless temperature sensor 10 can continuously detect the surface temperature of the electric soldering iron tip 8 (the thermistor of the wireless temperature sensor 10 is installed in a position in close contact with the electric soldering iron tip 8. When the temperature of the electric soldering iron tip 8 rises, the resistance of the thermistor increases. The circuit in the wireless temperature sensor 10 converts this resistance change into an electrical signal, and then the wireless communication module processes the electrical signal and sends it to the PLC controller 16 in the form of a wireless signal, thereby realizing wireless transmission and monitoring of temperature data). During the preheating process, the staff picks up the integrated circuit board and aligns the component to be spot welded with the electric soldering iron tip 8; When the temperature of the electric soldering iron tip 8 reaches a preset maximum temperature value (300°C), the wireless temperature sensor 10 feeds back an electrical signal to the PLC controller 16, which then controls the heating power of the electric soldering iron tip 8 to decrease to maintain the temperature of the electric soldering iron tip 8 stable at the set value (300°C). At the same time, the PLC controller 16 controls the automatic solder wire feeding box 4 and the smoke suction fan 153 to work, and the automatic solder wire feeding box 4 conveys the solder wire and discharges it through the solder wire feeding pipe 5, so that the end of the solder wire contacts one side of the electric soldering iron tip 8, and the surface temperature of the electric soldering iron tip 8 is The solder wire melts to form liquid tin droplets, which fall on the surface of the component to be spot-welded and complete the spot-welding operation. When the smoke suction fan 153 is working, negative pressure can be generated inside the smoke suction tube 151 and inside the smoke suction pipe 152, so that the smoke gas generated during the spot welding process can be sucked through the activated carbon filter layer 154 [when the smoke gas generated by the solder contacts the activated carbon, the harmful substances in the smoke gas (such as organic volatiles, metal oxide particles, etc.) will be adsorbed to the pore surface of the activated carbon under the action of intermolecular forces (van der Waals forces)], and the smoke gas is discharged into the air after being processed; When the solder wire contacts one side of the electric soldering iron tip 8, heat is transferred from the contacted side to the surface of the solder wire, causing the contact surface temperature of the electric soldering iron tip 8 to drop sharply. At this time, the wireless temperature sensor 10 can monitor this temperature change. When the temperature drops to a temperature value preset inside the wireless temperature sensor 10 (below 280°C), the wireless temperature sensor 10 will feedback an electrical signal to the PLC controller 16, causing the PLC controller 16 to turn on the power of the motor 121. The motor 121 can drive the small gear 122 to rotate, and the small gear 122 can drive the large gear 123 to rotate, thereby driving the electric soldering iron rod 3 and the electric soldering iron tip 8 to rotate at an angle together, causing the electric soldering iron tip 8 to perform a face-changing action ( The contact surface temperature of the electric soldering iron tip 8 is lower than 280°C. If the solder wire continues to contact the lowered surface of the electric soldering iron tip 8, part of the solder wire will not be melted, and the solder cannot be guaranteed to flow evenly to the welding point, which may cause a cold solder joint or an incomplete solder joint. The newly replaced surface temperature of the electric soldering iron tip 8 is maintained at the set value (300°C). When the solder wire contacts the new surface of the electric soldering iron tip 8, it can be directly melted into liquid tin droplets, and there will be no cold solder joint or incomplete solder joint, which improves the quality of welding. Moreover, after the lowered surface of the electric soldering iron tip 8 rotates, the temperature will return to the set temperature value (300°C) over time, saving waiting time and improving the spot welding efficiency. During the rotation of the soldering iron rod 3, the metal trigger block 142 will also rotate together. When the metal trigger block 142 rotates and aligns with one of the inductive proximity switches 141, the oscillation circuit inside the inductive proximity switch 141 changes due to the induction of the metal trigger block 142. This change will change the output state of the inductive proximity switch 141 and trigger it. After being triggered, the inductive proximity switch 141 feeds back an electrical signal to the PLC controller 16. The PLC controller 16 immediately turns off the power of the motor 121, so that the heated surface of the soldering iron tip 8 is aligned with the solder wire (because there are three inductive proximity switches 141, which just correspond to the three surfaces of the soldering iron tip 8, as long as one inductive proximity switch 141 is triggered, the heated surface of the soldering iron tip 8 is aligned with the solder wire, and no readjustment is required); When the inductive proximity switch 141 is triggered, the PLC controller 16 controls the pump body inside the flux storage box 131 to work for 3 seconds and then shut down, so that the flux can be discharged into the flux supply pipe 133 and the flux nozzle 132, and finally sprayed to the surface to be soldered of the integrated circuit board through the flux nozzle 132. The flux can clean and activate the soldering surface in advance, remove the oxide layer, oil stains and other impurities on the metal surface, and make the solder wire easier to combine with the metal surface, and guide the solder to better fill the gap between the pin and the pad to ensure the quality of the solder joint (it should be emphasized that the flux ejection mechanism 13 is not triggered when the integrated circuit board is soldered for the first time, but it will be triggered every time thereafter), until the surface of the integrated circuit board is spot-welded, and then the equipment stops working; Since the activated carbon filter material in the smoke suction mechanism 15 will become saturated after 3-4 months of use, the adsorption capacity of the activated carbon filter material will decrease after saturation. The staff can manually rotate the second cylinder 18 to separate the threaded ring 19 and the threaded groove between the second cylinder 18 and the first cylinder 17. When the first cylinder 17 and the second cylinder 18 are separated, the L-shaped top rod 22 will also be separated from the movable orifice plate 21, and then the movable orifice plate 21 is taken out from the inside of the second cylinder 18, and then the activated carbon filter layer 154 is poured out and replaced with new material. Finally, the first cylinder 17 and the second cylinder 18 are screwed together to ensure that the smoke suction mechanism 15 can continue to work efficiently.
[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A solder wire spot welding auxiliary device for a computer circuit board, comprising a body (1), a cylinder (2), an electric soldering iron rod (3), an automatic solder wire feeding box (4) and a solder wire feeding pipe (5), wherein the cylinder (2) is fixedly arranged on the top of the body (1), a movable frame (6) is fixedly arranged on the movable end of the cylinder (2), the automatic solder wire feeding box (4) is fixedly arranged on the bottom of the movable frame (6), one end of the solder wire feeding pipe (5) is fixedly connected to the side wall of the automatic solder wire feeding box (4), a fixed sleeve (7) is vertically fixedly arranged on one side of the movable frame (6), and the electric soldering iron rod (3) is fixedly arranged inside the fixed sleeve (7), characterized in that: Also includes: An electric soldering iron tip (8) is fixedly arranged at the lower end of the electric soldering iron rod (3); the electric soldering iron tip (8) is a trihedron; a high temperature resistant shell (9) is fixedly arranged inside the electric soldering iron tip (8); three side walls of the high temperature resistant shell (9) are fixedly provided with wireless temperature sensors (10) arranged in contact with three inner side walls of the electric soldering iron tip (8); A round box (11) is fixedly arranged at the upper end of the fixed sleeve (7), and a face-changing rotating mechanism (12) is provided inside the round box (11), and the upper end of the electric soldering iron rod (3) is connected to the face-changing rotating mechanism (12); A soldering flux ejection mechanism (13) disposed on one side of the electric soldering iron tip (8); A soldering flux trigger mechanism (14) is arranged between the inner wall of the round box (11) and the rod wall of the electric soldering iron rod (3); A smoke suction mechanism (15) is fixedly arranged on a side wall of the movable frame (6), and the smoke suction mechanism (15) is arranged toward the electric soldering iron head (8); A PLC controller (16) is fixedly mounted on a side wall of the machine body (1); the cylinder (2), the soldering iron rod (3), the solder wire automatic feeding box (4), the soldering iron tip (8), the wireless temperature sensor (10), the face-changing rotating mechanism (12), the pump body inside the soldering flux trigger mechanism (14), the soldering flux trigger mechanism (14) and the smoke suction mechanism (15) are all electrically connected to the PLC controller (16).
2. The solder wire spot welding auxiliary device for computer circuit boards according to claim 1, characterized in that: The face-changing rotating mechanism (12) comprises a motor (121) fixedly arranged on the top of the round box (11), the output shaft of the motor (121) extending into the interior of the round box (11) and fixedly provided with a small gear (122), a rod wall of the electric soldering iron rod (3) fixedly provided with a large gear (123), the small gear (122) and the large gear (123) being meshed, a conductive rotating joint (124) fixedly arranged inside the top of the round box (11), and the upper end of the electric soldering iron rod (3) being fixedly connected to the bottom of the conductive rotating joint (124).
3. The solder wire spot welding auxiliary device for computer circuit boards according to claim 1, characterized in that: The flux ejection mechanism (13) comprises a flux storage box (131) fixedly arranged at the bottom of the solder wire automatic feeding box (4); a flux nozzle (132) is fixedly arranged at the end of the solder wire feeding tube (5); a flux supply tube (133) is arranged between the flux nozzle (132) and the flux storage box (131); and the flux supply tube (133) is arranged inside the solder wire feeding tube (5).
4. The solder wire spot welding auxiliary device for computer circuit boards according to claim 1, characterized in that: The soldering flux trigger mechanism (14) comprises a plurality of inductive proximity switches (141) fixedly arranged on the inner wall of the bottom of the round box (11); the plurality of inductive proximity switches (141) are evenly distributed around the soldering iron rod (3) as the center of the circle; a metal trigger block (142) is fixedly arranged on the rod wall of the soldering iron rod (3) at a position corresponding to the position of the inductive proximity switch (141).
5. The solder wire spot welding auxiliary device for computer circuit boards according to claim 1, characterized in that: The smoke extraction mechanism (15) comprises a smoke extraction cylinder (151) fixedly arranged on the side wall of the mobile frame (6); a smoke extraction pipe (152) is fixedly arranged at the bottom of the smoke extraction cylinder (151); a smoke extraction fan (153) is arranged on one side of the smoke extraction cylinder (151); and an activated carbon filter layer (154) is arranged inside the smoke extraction cylinder (151).
6. A solder wire spot welding auxiliary device for computer circuit boards according to claim 5, characterized in that: The smoke suction cylinder (151) comprises a first cylinder (17) and a second cylinder (18), wherein a threaded ring (19) and a threaded groove which cooperate with each other are arranged between the first cylinder (17) and the second cylinder (18), the smoke suction pipe (152) is fixedly arranged at the bottom of the first cylinder (17), the smoke suction fan (153) is fixedly arranged on the side wall of the second cylinder (18), a fixed orifice plate (20) and a movable orifice plate (21) are arranged inside the second cylinder (18), the activated carbon filter layer (154) is arranged between the fixed orifice plate (20) and the movable orifice plate (21), and an L-shaped top rod (22) which is arranged to abut against the movable orifice plate (21) is fixedly arranged on the inner side wall of the first cylinder (17).
7. The solder wire spot welding auxiliary device for computer circuit boards according to claim 1, characterized in that: A support arm (23) is fixedly provided on the side wall of the machine body (1) and located below the electric soldering iron head (8), and a material receiving groove (24) is provided on the upper side of the end of the support arm (23).
8. The solder wire spot welding auxiliary device for computer circuit boards according to claim 1, characterized in that: An LED fill light bead (25) is fixedly provided at the lower end of the solder wire feeding tube (5), and the LED fill light bead (25) is electrically connected to the PLC controller (16).