Tool setting method and device of laser processing equipment, computer equipment and storage medium

Abstract

The invention relates to a tool setting method and device of laser processing equipment, computer equipment and a storage medium. The method comprises the following steps: acquiring a target offset of a position detector relative to a focus of a laser beam emitted by a laser head; in the laser processing equipment, the relative position relation between a laser head and a position detector is fixed; performing offset processing on the current detection position of the position detector according to the target offset to obtain the current focusing position of the focus; and tool setting processing is carried out according to the current focusing position and the tool setting point position. By adopting the method, the tool setting efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of mechanical processing technology, and in particular to a tool setting method, device, computer equipment and storage medium for laser processing equipment. Background Art

[0002] With the development of mechanical processing technology, laser processing technology has emerged, which can focus the laser beam onto a tiny spot and use the spot to remove or change the microstructure of the workpiece surface. In laser processing, the tool setting operation of the laser processing equipment is a key step, and the tool setting accuracy directly affects the processing quality.

[0003] In traditional technology, laser processing equipment is manually adjusted to achieve tool setting of laser processing equipment. However, this method is relatively limited, resulting in low tool setting efficiency of laser processing equipment. Summary of the invention

[0004] Based on this, it is necessary to provide a tool setting method, device, computer equipment and storage medium for laser processing equipment that can improve tool setting efficiency in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a tool setting method for laser processing equipment, comprising:

[0006] Obtaining a target offset of the position detector relative to the focus of the laser beam emitted by the laser head; wherein, in the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed;

[0007] Performing an offset process on the current detection position of the position detector according to the target offset to obtain the current focus position of the focus;

[0008] Tool setting processing is performed according to the current focus position and the tool setting point position.

[0009] In a second aspect, the present application also provides a tool setting device for laser processing equipment, comprising:

[0010] An acquisition module, used to acquire a target offset of the position detector relative to the focus of the laser beam emitted by the laser head; wherein, in the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed;

[0011] A determination module, configured to perform an offset process on the current detection position of the position detector according to the target offset to obtain a current focus position of the focus;

[0012] The tool setting module is used to perform tool setting processing according to the current focus position and the tool setting point position.

[0013] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps in the above method when executing the computer program.

[0014] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the steps in the above method when executed by a processor.

[0015] In a fifth aspect, the present application also provides a computer program product, including a computer program, which implements the steps in the above method when executed by a processor.

[0016] The tool setting method, device, computer device, storage medium and computer program product of the above-mentioned laser processing equipment obtain the target offset of the position detector relative to the focus of the laser beam emitted by the laser head. In the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed, and the focusing characteristics of the laser head determine that the laser beam emitted by it forms a focus at a specific distance, and the position of this focus relative to the laser head is fixed. Therefore, the target offset of the position detector relative to the focus of the laser beam emitted by the laser head is also fixed. Since the position detector itself has the ability to detect the position, the current detection position of the position detector can be obtained more quickly and conveniently; then, the current detection position of the position detector is offset according to the target offset to obtain the current focus position of the focus, which can ensure the efficiency of obtaining the current focus position; then, the tool setting is performed according to the current focus position and the tool setting point position, so that the tool setting of the laser processing equipment can be realized, without the need for manual adjustment of the laser processing equipment, which greatly improves the tool setting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic flow chart of a tool setting method for laser processing equipment provided in an embodiment of the present application.

[0018] Figure 2 A schematic diagram of various light spot areas provided in an embodiment of the present application.

[0019] Figure 3 A schematic diagram of a third offset provided in an embodiment of the present application.

[0020] Figure 4 A schematic diagram of a reference mark and a reference circle trajectory provided in an embodiment of the present application.

[0021] Figure 5 A schematic diagram of a reference circle corresponding to a reference circle trajectory provided in an embodiment of the present application.

[0022] Figure 6A schematic diagram of a reference sphere fixed on a processing surface provided in an embodiment of the present application.

[0023] Figure 7 A schematic diagram of a position detector detecting a spherical surface position when a turntable rotates around the first rotation axis is provided in an embodiment of the present application.

[0024] Figure 8 A schematic diagram of a position detector detecting a spherical surface position when the turntable rotates around the second rotation axis provided in an embodiment of the present application.

[0025] Fig. 9 A schematic diagram of the structure of a laser processing device provided in an embodiment of the present application.

[0026] Fig.10 A schematic diagram of a process for determining a first offset, a second offset, and a third offset is provided in an embodiment of the present application.

[0027] Fig.11 A structural block diagram of a tool setting device for laser processing equipment provided in an embodiment of the present application.

[0028] Fig.12 An internal structure diagram of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] In an exemplary embodiment, Figure 1 As shown, a flow chart of a tool setting method for laser processing equipment is provided, and the method is described by taking the application of the method to laser processing equipment as an example, including the following steps 102 to 106.

[0031] Step 102, obtaining a target offset of the position detector relative to the focus of the laser beam emitted by the laser head; in the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed.

[0032] Among them, the position detector refers to a sensor used to detect the position. The position detector has the ability to detect the position and can feed back the sensed position information to the laser processing equipment. The laser head is used to emit the laser beam. The laser head can be pre-calibrated, and the laser beam emitted by the laser head each time has consistency and stability. The target offset is used to characterize the offset of the detection position of the position detector relative to the focus position of the focus.

[0033] In some embodiments, the laser processing equipment may obtain the position and distance of the input position detector relative to the focus to obtain the target offset.

[0034] In some embodiments, the laser processing equipment is provided with a machine tool coordinate system. The machine tool coordinate system includes a first linear axis, a second linear axis and a third linear axis, and the directions of the three linear axes are respectively the first linear axis direction, the second linear axis direction and the third linear axis direction. The target offset may include a first offset, a second offset and a third offset of the position detector relative to the focus on the first linear axis direction, the second linear axis direction and the third linear axis direction, respectively. It can be understood that the positions on the laser processing equipment can be described using the machine tool coordinates in the machine tool coordinate system.

[0035] In some embodiments, the laser processing equipment can change its own posture until the focus of the laser beam emitted by the laser head is positioned on the surface of the reference object on the laser processing equipment. At this time, the position difference between the position detector and the focus on the surface of the reference object can be used to determine the target offset.

[0036] In some embodiments, the reference object may be, but is not limited to, a processing surface of a laser processing device or an object made of an energy-sensitive material. Since energy-sensitive materials are sensitive to laser energy, a light spot area will be processed on the energy-sensitive material when the laser beam reaches the energy-sensitive material. The shape of the light spot area is related to the position of the focus, and by observing the shape of the light spot area, it can be determined whether the focus is located in the light spot area.

[0037] In some embodiments, the laser processing device may be, but is not limited to, a five-axis CNC device. The laser processing device includes three translational degrees of freedom and two rotational degrees of freedom. The laser processing device can achieve position adjustment by translational movement in the first linear axis, the second linear axis, or the third linear axis. The attitude adjustment is achieved by rotational movement in the first rotational axis or the second rotational axis.

[0038] In some embodiments, the laser processing equipment may be, but is not limited to, a laser dermatoglyphic machine.

[0039] In some embodiments, the position detector may be a contact probe or a non-contact detector.

[0040] In some embodiments, when the focus of the laser beam emitted by the laser head is located on the reference object, the position of the position detector can be recorded, and a reference mark can be marked on the reference object. The laser processing device can then control the position detector to detect the position of the reference mark, and determine the target offset based on the difference between the recorded position of the position detector and the detected position of the reference mark.

[0041] In some embodiments, in the laser processing device, the laser head and the position detector are fixed to the first component. The relative position relationship between the laser head and the position detector on the first component is fixed. The laser processing device can control the movement of the first component, and the laser head and the position detector will move with the first component.

[0042] In some embodiments, the laser beam emitted by the laser head is parallel to the third straight line axis. The first offset can be, but is not limited to, obtained by measuring the offset between the laser head and the position detector in the first straight line axis. The second offset can be, but is not limited to, obtained by measuring the offset between the laser head and the position detector in the second straight line axis. The third offset can be, but is not limited to, obtained by measuring the distance between the position detector and the end surface of the reference object when the focus is located at the end surface of the reference object perpendicular to the third straight line axis.

[0043] Step 104, performing an offset process on the current detection position of the position detector according to the target offset to obtain the current focus position of the focus.

[0044] The current detection position refers to the current position of the position detector. The current focus position refers to the current position of the focus.

[0045] For example, the laser processing equipment may obtain the current detection position of the position detector, and superimpose the target offset onto the current detection position to obtain the current focus position of the focus.

[0046] In some embodiments, the laser processing equipment can obtain the current detection coordinates fed back by the position detector. The current detection coordinates are coordinates in the machine tool coordinate system, which are used to characterize the current detection position. The current detection coordinates are offset according to the first offset, the second offset, and the third offset to obtain the current focus coordinates of the focus. The current focus coordinates are coordinates in the machine tool coordinate system, which are used to characterize the current focus position.

[0047] In some embodiments, the coordinates in the machine tool coordinate system include a first coordinate value in the axial direction of the first straight line, a second coordinate value in the axial direction of the second straight line, and a third coordinate value in the axial direction of the third straight line. The laser processing equipment can offset the first coordinate value in the current detection coordinate according to the first offset to obtain the first coordinate value in the current focus coordinate. The second coordinate value in the current detection coordinate is offset according to the second offset to obtain the second coordinate value in the current focus coordinate. The third coordinate value in the current detection coordinate is offset according to the third offset to obtain the third coordinate value in the current focus coordinate.

[0048] In some embodiments, the first offset, the second offset, and the third offset are respectively superimposed on the first coordinate value, the second coordinate value, and the third coordinate value in the current focus coordinate to obtain the current detection coordinate.

[0049] Step 106, performing tool setting processing according to the current focus position and the tool setting point position.

[0050] The tool setting point position refers to the location of the tool setting point. The tool setting point refers to the starting point of the relative movement of the laser processing equipment to the workpiece when processing the workpiece.

[0051] For example, the laser processing equipment can obtain the position of the tool setting point and adjust its own processing posture to make the current focus position coincide with the position of the tool setting point, thereby achieving tool setting.

[0052] In some embodiments, the tool setting point coordinates in the machine tool coordinate system are used to represent the tool setting point position. The laser processing equipment can adjust its own processing posture to make the current focus coordinates coincide with the tool setting point coordinates.

[0053] In the tool setting method of the above-mentioned laser processing equipment, the target offset of the position detector relative to the focus of the laser beam emitted by the laser head is obtained. In the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed, and the focusing characteristics of the laser head determine that the laser beam emitted by it forms a focus at a specific distance, and the position of this focus relative to the laser head is fixed. Therefore, the target offset of the position detector relative to the focus of the laser beam emitted by the laser head is also fixed. Since the position detector itself has the ability to detect the position, the current detection position of the position detector can be obtained more quickly and conveniently; then, the current detection position of the position detector is offset according to the target offset to obtain the current focus position of the focus, which can ensure the efficiency of obtaining the current focus position; then, the tool setting is performed according to the current focus position and the tool setting point position, so that the tool setting of the laser processing equipment can be realized, without the need for manual adjustment of the laser processing equipment, which greatly improves the tool setting efficiency.

[0054] In some embodiments, the target offset includes a first offset, a second offset, and a third offset of the position detector relative to the focus in the first linear axis, the second linear axis, and the third linear axis, respectively; obtaining the target offset of the position detector relative to the focus of the laser beam emitted by the laser head includes: determining the focus detection position of the position detector when the focus of the laser beam emitted by the laser head is located at the end face of the reference object when the end face of the reference object on the laser processing equipment is perpendicular to the third linear axis; determining the third offset based on the focus detection position and the end face position of the reference object; determining the first offset and the second offset of the position detector relative to the focus when the distance between the position detector and the end face of the reference object reaches the third offset.

[0055] It can be understood that the distance between the position detector and the end surface of the reference object reaches the third offset, which means that the distance between the position detector and the end surface of the reference object in the axial direction of the third straight line is equal to the third offset.

[0056] Exemplarily, the reference object is an object made of energy-sensitive material, and the two end faces of the reference object are parallel. The laser processing equipment can control the turntable to rotate according to the axis calibration data of the first rotation axis, so that the processing surface on the turntable is perpendicular to the third straight line axis. When the reference object is placed flat on the processing surface perpendicular to the third straight line axis, the end face of the reference object will also be perpendicular to the third straight line axis. Further, in order to ensure that the reference object is placed flat on the processing surface, that is, the end face of the reference object is parallel to the processing surface, a leveling instrument can be used for leveling. The leveling instrument can include a micrometer. Alternatively, in order to ensure that the processing surface is perpendicular to the third straight line axis, a leveling instrument can be used to level the processing surface.

[0057] The reference object may be a first object or a second object. In the case where the end face of the first object on the laser processing equipment is perpendicular to the axial direction of the third straight line, determine the focus detection position of the position detector when the focus of the laser beam emitted by the laser head is located on the end face of the first object. The third offset is determined based on the offset of the focus detection position relative to the end face position of the first object in the axial direction of the third straight line. It can be understood that since the first object is made of energy-sensitive material, a spot area will be formed when the laser beam is irradiated on the first object. The spot area generated in the process of determining the third offset will affect the subsequent determination of the first offset and the second offset. In order to ensure accuracy, it is replaced with the second object. In the case where the end face of the second object on the laser processing equipment is perpendicular to the axial direction of the third straight line, determine the first offset and the second offset of the position detector relative to the focus when the distance of the position detector relative to the end face of the second object reaches the third offset.

[0058] In this embodiment, when the end face of the reference object on the laser processing equipment is perpendicular to the axial direction of the third straight line, the focus detection position of the position detector is determined when the focus of the laser beam emitted by the laser head is located at the end face of the reference object; the third offset is determined based on the focus detection position and the end face position of the reference object; when the distance of the position detector relative to the end face of the reference object reaches the third offset, the first offset and the second offset of the position detector relative to the focus are determined, and the subsequent first offset, second offset and third offset are used as the basis for offset processing of the current detection position of the position detector, so as to obtain the current focus position of the focus, realize the positioning of the focus, and then realize tool setting based on the current focus position and the tool setting point position without manual operation, thereby greatly improving the tool setting efficiency.

[0059] In some embodiments, a laser head and a position detector are fixed on a first component that can translate along a direction parallel to the axis of a third straight line; determining the focus detection position of the position detector when the focus of the laser beam emitted by the laser head is located at the end face of a reference object comprises: controlling the laser head to emit the laser beam to process a spot area on the end face of the reference object; when a focus stop condition is not met, moving the first component along a direction parallel to the axis of the third straight line by a first step length, and moving the reference object along a direction parallel to the axis of the first straight line by a second step length, returning to the step of controlling the laser head to emit the laser beam to process a spot area on the end face of the reference object; when a focus stop condition is met, determining a reference spot area where the focus is located from each spot area on the end face of the reference object; and obtaining the focus detection position of the position detector when the laser processing equipment is in a focus posture corresponding to the reference spot area.

[0060] The focusing posture corresponding to the reference light spot area refers to the posture of the laser processing equipment when the reference light spot area is processed on the end face of the reference object.

[0061] Exemplarily, the first component is located on a third guide rail parallel to the axis of the third straight line and can move along the guide rail. The reference object is located on the processing surface. The processing surface is fixed on a second component that can be moved in a direction parallel to the axis of the first straight line and in a direction parallel to the axis of the second straight line. The second component is located on a second guide rail parallel to the axis of the second straight line. The second guide rail is located on a first guide rail parallel to the axis of the first straight line. The laser processing equipment can adjust its own posture to a preset initial posture to obtain a current posture. In the current posture, the laser head is controlled to emit a laser beam, and a spot area is processed on the end face of the reference object, and the current posture is used as the focus posture corresponding to the spot area. If the focus stop condition is not met, the first component is moved on the third guide rail in a direction parallel to the axis of the third straight line by the first step length, and the second component is moved on the first guide rail in a direction parallel to the axis of the first straight line by the second step length to obtain a new current posture, and the step of controlling the laser head to emit a laser beam is returned to the current posture to continue. If the focus stop condition is met, at least two spot areas are processed on the end face of the reference object. The laser processing equipment can determine a reference spot area where the focus is located from at least two spot areas according to the size of each spot area. It can be understood that the reference spot area where the focus is located can be the spot area with the smallest size among the at least two spot areas. The laser processing equipment can obtain the focus detection position of the position detector under the focus posture corresponding to the reference spot area. The position detector is controlled to contact the end face of the first object to obtain the first end face position detected at the first contact point. The third offset is determined according to the focus detection position and the first end face position.

[0062] In some embodiments, it is ensured that the laser processing equipment is in normal working condition. Specifically, the three linear axes and two rotary axes on the machine tool of the laser processing equipment move flexibly, there is no fault alarm, the laser optical path of the laser head is normal, the position detector is firmly connected to the first component, and the processing surface is perpendicular to the third linear axis. Figure 2 As shown, a schematic diagram of each spot area is provided. There are multiple first objects. The first object on the laser processing device is replaced in each round of focusing. The replaced first object is placed flat on the processing surface, and the laser processing device moves the turntable where the processing surface is located along at least one of the first guide rail or the second guide rail to ensure that the laser beam emitted by the laser head can irradiate the end surface of the first object, and the laser processing device moves the first component along the third guide rail so that the laser processing device is in a preset initial posture. The laser processing device can control the laser head to emit a laser beam for the first time in the preset initial posture during each round of focusing, and process a spot area on the end surface of the first object. After that, starting from the current posture each time, the first component is moved on the third guide rail by the first step length, and the second component is moved on the first guide rail by the second step length, and a new current posture is obtained. In the current posture, the laser head is controlled to emit a laser beam to process a spot area on the end surface of the first object until the distance between the first component and the end surface of the reference object is not greater than the first step length or reaches the preset number of times, and each spot area of ​​this round is obtained. It can be understood that the focus stop condition can be satisfied when the distance between the first component and the end face of the reference object is not greater than the first step length or reaches a preset number of times. Usually, the spot of the laser beam at the focus is the smallest, and the size of the spot area is correspondingly the smallest. Determine the reference spot area of ​​this round with the smallest size from each spot area of ​​this round, and record the focus detection position of the position detector in the focus posture corresponding to the reference spot area of ​​this round. Control the position detector to contact the end face of the first object to obtain the first end face position of this round detected at the first contact point. Return to the step of controlling the laser head to emit the laser beam for the first time in the preset initial posture in each round process to machine the spot area on the end face of the first object until the preset number of rounds is reached, and the focus detection position of the preset number of rounds and the first end face position of the preset number of rounds are obtained. Calculate the mean of the focus detection positions of the preset number of rounds to obtain the average detection position. Calculate the mean of the first end face positions of the preset number of rounds to obtain the average end face position. As Figure 3 As shown in FIG. 1 , a schematic diagram of the third offset is provided. The offset of the detection average position Zl relative to the end surface average position Zp in the axial direction of the third straight line is determined as the third offset Zo. It can be understood that since the first component where the position detector is located can only move on the third guide rail parallel to the axial direction of the third straight line, the position of the position detector can be specified as long as the third coordinate value in the axial direction of the third straight line is available. Assuming that the preset number of rounds is n, the focus detection positions measured are z 1 , z 2 , z3 ,.....z n , then the average position of the detection It can be calculated by the following formula

[0063] In some embodiments, the laser processing device can obtain a reference focus image captured by the image acquisition device on the end surface of the first object. The reference focus image includes image areas corresponding to each light spot area. Through connected domain detection, the smallest connected domain is identified from the reference focus image, and the light spot area corresponding to the connected domain is determined as the reference light spot area.

[0064] In this embodiment, a spot area is processed on the end face of a reference object by controlling a laser head to emit a laser beam; when a focus stop condition is not met, the first component is moved by a first step length in a direction parallel to the axis of the third straight line, and the reference object is moved by a second step length in a direction parallel to the axis of the first straight line, and the laser head is returned to be controlled to emit a laser beam, and the step of processing a spot area on the end face of the reference object is continued; when a focus stop condition is met, a reference spot area where the focus is located is determined from each spot area on the end face of the reference object; and then, when the laser processing equipment is in a focus posture corresponding to the reference spot area, the focus detection position of the position detector is obtained, which is more efficient than manually operating the laser processing equipment to perform multiple focusing operations.

[0065] In some embodiments, determining a first offset and a second offset of the position detector relative to the focus when the distance of the position detector relative to the end surface of the reference object reaches a third offset includes: when the distance of the position detector relative to the end surface of the reference object reaches the third offset, controlling a laser head to emit a laser beam to process a reference mark on the end surface of the reference object; and determining the first offset and the second offset based on the position difference of the position detector relative to the reference mark.

[0066] Exemplarily, the second component is located on a second guide rail parallel to the second linear axis. The second guide rail is located on a first guide rail parallel to the first linear axis. The second component can move along the parallel direction of the first linear axis and the parallel direction of the second linear axis. In the case where the end face of the second object is perpendicular to the third linear axis, when the distance of the position detector relative to the end face of the second object reaches the third offset, the second component is moved on the first guide rail, and the laser head is controlled to emit a laser beam to process a first linear track on the end face of the second object, and the second component is moved on the second guide rail, and the laser head is controlled to emit a laser beam to process a second linear track on the end face of the second object. The first linear track and the second linear track form a cross pattern, and this cross pattern is a reference mark. Determine the positioning posture corresponding to the intersection area between the first linear track and the second linear track. It can be understood that since the spot of the laser beam on the end face of the second object has a certain size, the processed trajectory line has a certain width, and there is an intersection area between the first linear track and the second linear track. The positioning posture corresponding to the intersection area refers to the posture of the laser processing equipment when the laser beam emitted by the laser head irradiates the intersection area. When the laser processing device is in a positioning posture, the laser beam will irradiate the intersection area, and the focus of the laser beam is located in the intersection area. Based on the position difference of the position detector relative to the reference mark in the positioning posture, the first offset and the second offset are determined.

[0067] In some embodiments, the positioning posture refers to the posture of the laser processing device when the distance between the position detector and the end surface of the reference object reaches the third offset and the position detector and the first rotation axis meet the center alignment condition. The laser processing device can determine the position of the position detector in the positioning posture based on the axis calibration data of the first rotation axis. The position of the position detector can also be directly obtained in the positioning posture. The first rotation axis can be a rotation axis for rotating around the third straight line axis.

[0068] In some embodiments, the axis calibration data includes axis position data and axial data. The axis position data may include a first coordinate value in the axial direction of the first straight line and a second coordinate value in the axial direction of the second straight line. The laser processing equipment may control the position detector to detect the position of the end face of the second object to obtain a third coordinate value of the end face of the second object. The positioning posture refers to the posture of the laser processing equipment when the difference between the third coordinate value of the position detector and the third coordinate value of the end face of the second object reaches a third offset, and the first coordinate value and the second coordinate value of the position detector reach the first coordinate value and the second coordinate axis of the first rotation axis respectively. The laser processing equipment can directly obtain the machine tool coordinates of the position detector in the positioning posture. The machine tool coordinates include a first coordinate value, a second coordinate value and a third coordinate value. The laser processing equipment may also determine the first coordinate value and the second coordinate value of the first rotation axis as the first coordinate value and the second coordinate value of the position detector in the positioning posture. The third coordinate value of the end face of the second object is offset according to the third offset to obtain the third coordinate value of the position detector in the positioning posture. It can be understood that the first coordinate value, the second coordinate value and the third coordinate value of the position detector in the positioning posture jointly specify the position of the position detector in the positioning posture in the machine tool coordinate system.

[0069] In this embodiment, when the distance between the position detector and the end face of the reference object reaches a third offset, the laser head is controlled to emit a laser beam to process a reference mark on the end face of the reference object; then, based on the position difference between the position detector and the reference mark, the first offset and the second offset are determined. Subsequently, the first offset and the second offset are used as a basis for offset processing of the current detection position of the position detector, so that the current focus position of the focus can be obtained, and the focus can be quickly positioned, so that tool setting can be achieved based on the current focus position and the tool setting point position without manual operation, thereby greatly improving the tool setting efficiency.

[0070] In some embodiments, a reference object is placed on a processing surface of a turntable of a laser processing device; the turntable is provided with a first rotation axis; when the distance of the position detector relative to the end surface of the reference object reaches a third offset, the laser head is controlled to emit a laser beam to process a reference mark on the end surface of the reference object, including: determining a positioning posture of the laser processing device when the distance of the position detector relative to the end surface of the reference object reaches the third offset and the position detector and the first rotation axis meet a center alignment condition; when the laser processing device is in the positioning posture, the laser head is controlled to emit a laser beam to process a reference mark on the end surface of the reference object; based on the position difference of the position detector relative to the reference mark The method comprises the steps of: starting from a positioning posture, controlling a turntable to rotate around a third straight axis according to the axis calibration data of a first rotation axis, and controlling a laser head to emit a laser beam during the rotation to process a reference circular trajectory on the end face of a reference object; obtaining a reference positioning image captured by an image acquisition device on the end face of the reference object; determining a first image position corresponding to the center of the reference circular trajectory and a second image position corresponding to the reference mark based on the reference positioning image; converting a position difference between the first image position and the second image position according to the calibration parameters of the image acquisition device to obtain a first offset and a second offset.

[0071] The calibration parameters of the image acquisition device are used to describe the conversion relationship between the machine tool coordinate system and the pixel coordinate system in the image. It can be understood that in order to determine the relationship between the machine tool coordinates in the machine tool coordinate system and their corresponding points in the image, a geometric model of imaging must be established. These geometric model parameters are the calibration parameters of the image acquisition device.

[0072] Exemplarily, the laser processing equipment can adjust its own posture so that the difference between the third coordinate value of the position detector and the third coordinate value of the end face of the second object reaches a third offset and the first coordinate value and the second coordinate value of the position detector respectively reach the first coordinate value and the second coordinate axis of the first rotation axis to obtain a positioning posture.

[0073] like Figure 4As shown, a schematic diagram of a reference mark and a reference circle trajectory is provided. The reference mark is a cross pattern formed by a first straight line trajectory and a second straight line trajectory. The laser processing equipment can start from a positioning posture, control the second component to move on the first guide rail in a direction parallel to the first straight line axis, and control the laser head to emit a laser beam to process the first straight line trajectory on the end face of the second object. The first straight line trajectory is parallel to the first straight line axis. Starting from the positioning posture, the second component is controlled to move on the second guide rail in a direction parallel to the second straight line axis, and the laser head is controlled to emit a laser beam to process the second straight line trajectory on the end face of the second object. The second straight line trajectory is parallel to the second straight line axis. Wherein, when the laser processing equipment is in the positioning posture, the laser beam emitted by the laser head irradiates the intersection area between the first straight line trajectory and the second straight line trajectory. The center position of the intersection area between the first straight line trajectory and the second straight line trajectory can be used as the position of the reference mark.

[0074] The second object is located on the processing surface of the turntable, and the second object will be driven to rotate when the turntable rotates. The laser processing equipment can start from the positioning posture, control the turntable to rotate around the third straight line axis according to the axis calibration data of the first rotation axis, and control the laser head to emit a laser beam during the rotation process to process a reference circle trajectory on the end face of the reference object.

[0075] The laser processing equipment can control the image acquisition equipment to acquire images of the end face of the reference object to obtain a reference positioning image. The trajectory lines processed by the laser processing equipment have a certain width. The laser processing equipment can extract the line center of the reference positioning image to obtain an intermediate positioning image. The intermediate positioning image includes a first line segment corresponding to the first straight line trajectory, a second line segment corresponding to the second straight line trajectory, and a reference circle corresponding to the reference circle trajectory. Figure 5 As shown, a schematic diagram of a reference circle corresponding to the reference circle trajectory is provided. The intermediate positioning image is subjected to circle fitting processing to obtain the first pixel coordinates of the center of the reference circle. The first pixel coordinates of the center of the reference circle are used to characterize the first image position corresponding to the center of the reference circle trajectory. Corner point detection is performed on the intermediate positioning image to obtain the first pixel coordinates of the intersection point between the first line segment and the second line segment. It can be understood that the intersection point between the first line segment and the second line segment is the projection of the center of the intersection area in the intermediate positioning image, and the first pixel coordinates of the intersection point can be used to characterize the second image position corresponding to the reference mark.

[0076] The laser processing device can obtain the calibration parameters of the image acquisition device, and convert the position difference of the first pixel coordinate relative to the second pixel coordinate according to the calibration parameters to obtain the first offset and the second offset.

[0077] In some embodiments, the laser processing equipment may utilize a sub-pixel laser stripe center line extraction algorithm (Steger algorithm) to perform line center extraction processing on the reference positioning image to obtain an intermediate positioning image.

[0078] In some embodiments, the laser processing device may perform corner detection on the intermediate positioning image using a corner detection algorithm, which may be, but is not limited to, a Harris corner detection algorithm.

[0079] In some embodiments, the laser processing equipment can perform circle fitting processing on the reference positioning image to obtain a first image position corresponding to the center of the reference circle trajectory, and perform corner point detection on the reference positioning image to obtain a second image position corresponding to the reference mark.

[0080] In some embodiments, the laser processing device can calculate a first pixel difference between the first pixel coordinate and the second pixel coordinate in the axial direction of the first straight line, and a second pixel difference between the first pixel coordinate and the second pixel coordinate in the axial direction of the second straight line. The first pixel difference is converted according to the calibration parameters to obtain a first offset. The second pixel difference is converted according to the calibration parameters to obtain a second offset.

[0081] In some embodiments, the laser processing equipment can convert the first pixel coordinate and the second pixel coordinate respectively according to the calibration parameters of the image acquisition device to obtain the first machine tool coordinate and the second machine tool coordinate. The offset of the first machine tool coordinate relative to the second machine tool coordinate in the axial direction of the first straight line is determined as the first offset. The offset of the first machine tool coordinate relative to the second machine tool coordinate in the axial direction of the second straight line is determined as the first offset.

[0082] In some embodiments, the image acquisition device may be, but is not limited to, a scanner or a camera, etc. The optical axis of the image acquisition device may be parallel to the third linear axis.

[0083] In some embodiments, the turntable is a double turntable. The double turntable is provided with a first rotation axis and a second rotation axis. The first rotation axis may be a rotation axis for rotating about the third straight line axis. The second rotation axis may be a rotation axis for rotating about the first straight line axis. The laser processing equipment may perform rotation processing according to the axis calibration data of the first rotation axis and the axis calibration data of the second rotation axis, so that the processing surface on the double turntable is perpendicular to the third straight line axis. When the reference object is placed flat on the processing surface perpendicular to the third straight line axis, the end face of the reference object will also be perpendicular to the third straight line axis.

[0084] In this embodiment, the positioning posture of the laser processing device is determined when the distance between the position detector and the end face of the reference object reaches the third offset and the position detector and the first rotation axis meet the center alignment condition; when the laser processing device is in the positioning posture, the laser head is controlled to emit a laser beam to process a reference mark on the end face of the reference object, and the position of the reference mark in the first straight line axis and the second straight line axis is consistent with the position of the focus. Starting from the positioning posture, the turntable is controlled to rotate around the third straight line axis according to the axis calibration data of the first rotation axis, and during the rotation, the laser head is controlled to emit a laser beam to process a reference circular trajectory on the end face of the reference object, and the position of the reference circular trajectory in the first straight line axis and the second axis is consistent with the position detector. A reference positioning image captured by the image acquisition device on the end face of the reference object is obtained; based on the reference positioning image, the first image position corresponding to the center of the reference circular trajectory and the second image position corresponding to the reference mark are determined; the position difference of the first image position relative to the second image position is the projection of the position difference of the position detector relative to the focus in the image. Furthermore, by converting the position difference of the first image position relative to the second image position according to the calibration parameters of the image acquisition device, the first offset and the second offset can be obtained, without the need to manually measure the first offset and the second offset, which is more efficient.

[0085] In some embodiments, the turntable is fixed on a second component which can move along a direction parallel to the first straight line axis and a direction parallel to the second straight line axis; the reference mark includes a first straight line trajectory and a second straight line trajectory; when the laser processing equipment is in a positioning position, the laser head is controlled to emit a laser beam to process the reference mark on the end face of the reference object, including: starting from the positioning position, controlling the second component to move along a direction parallel to the first straight line axis, and controlling the laser head to emit a laser beam to process the first straight line trajectory on the end face of the reference object; starting from the positioning position, controlling the second component to move along a direction parallel to the second straight line axis, and controlling the laser head to emit a laser beam to process the second straight line trajectory on the end face of the reference object.

[0086] Exemplarily, the second component is located on a second guide rail parallel to the second straight line axis. The second guide rail is located on a first guide rail parallel to the first straight line axis. The reference object may be a second object. The laser processing equipment may start from a positioning posture, move the second component on the first guide rail, and control the laser head to emit a laser beam to process a first straight line track on the end face of the second object. Starting from the positioning posture, move the second component on the second guide rail, and control the laser head to emit a laser beam to process a second straight line track on the end face of the second object. The center of the intersection area between the first straight line track and the second straight line track is used to characterize the position of the focus when the laser processing equipment is in the positioning posture.

[0087] In this embodiment, starting from the positioning posture, the second component is controlled to move in a direction parallel to the first straight line axis, and the laser head is controlled to emit a laser beam to process a first straight line trajectory on the end face of the reference object; starting from the positioning posture, the second component is controlled to move in a direction parallel to the second straight line axis, and the laser head is controlled to emit a laser beam to process a second straight line trajectory on the end face of the reference object. Since both the first straight line trajectory and the second straight line trajectory are processed from the positioning posture, the intersection area of ​​the first straight line trajectory and the second straight line trajectory can accurately reflect the position of the focus in the positioning posture.

[0088] In some embodiments, the method also includes: with the reference sphere fixed on the machining surface, continuously executing the step of rotating the turntable around the first rotation axis by a first preset angle, and then determining the first center position of the reference sphere where the center of the reference sphere is currently located according to the spherical position of the reference sphere until the first rotation stop condition is met; performing spatial circle fitting on each first center position to obtain a first spatial circle; and determining the axis calibration data of the first rotation axis based on the center and normal of the first spatial circle.

[0089] For example, Figure 6 As shown, a schematic diagram of a reference sphere fixed on a processing surface is provided. The reference sphere can be fixed on the processing surface by a clamp. When the reference sphere is fixed on the processing surface, the laser processing equipment can fix the position of the turntable, rotate the turntable around the first rotation axis by a first preset angle, and then determine the first center position of the reference sphere where the center is currently located according to the spherical position of the reference sphere. If the first rotation stop condition is not met, return to the step of rotating the turntable around the first rotation axis by a first preset angle to continue. If the first rotation stop condition is met, each first center position is obtained, and a spatial circle is fitted to each first center position using the least squares method to obtain a first spatial circle. The position of the center of the first spatial circle is determined as the axis position of the first rotation axis, and the normal of the first spatial circle is determined as the axial direction of the first rotation axis to obtain axis calibration data.

[0090] In some embodiments, when the angle range of the turntable rotating around the first rotation axis reaches the first rotation angle range corresponding to the first rotation axis, it means that the first rotation stop condition is satisfied. The first rotation angle range corresponding to the first rotation axis can be 0° to 360°.

[0091] In some embodiments, Figure 7 As shown, a schematic diagram of the position detector detecting the position of the spherical surface when the turntable rotates around the first rotation axis is provided. The laser processing equipment can control the position detector to contact the spherical surface of the reference sphere after the turntable rotates around the first rotation axis by a first preset angle to obtain the spherical surface position, and determine the first spherical center position where the spherical center of the reference sphere is currently located according to the spherical surface position.

[0092] In some embodiments, the laser processing equipment can determine the first sphere center position where the sphere center of the reference sphere is currently located according to the reference sphere radius and the spherical surface position.

[0093] In some embodiments, the laser processing equipment can perform spherical fitting on the spherical surface position to obtain the first spherical center position where the spherical center of the reference sphere is currently located.

[0094] In some embodiments, the laser processing device can select three non-collinear first reference points, second reference points, and third reference points from the first space circle, and calculate the first direction vector and the second direction vector between the first reference point and the second reference point and the third reference point, respectively. Specifically, Among them, the first reference point A(x a ,y a, z a ), the second reference point B(x b ,y b, z b ), the third reference point C(x c ,y c, z c ). Represents the first direction vector. represents the second direction vector. Perform a cross product calculation on the first direction vector and the second direction vector to obtain the normal vector of the first space circle. Specifically, in, Represents the normal vector.

[0095] The position of the center of the first space circle is determined as the axis position of the first rotation axis, and the normal direction of the first space circle is determined as the axial direction of the first rotation axis to obtain axis calibration data.

[0096] In some embodiments, the laser processing equipment can fix the position of the turntable, rotate the turntable around the second rotation axis by a second preset angle, and then determine the second sphere center position where the sphere center of the reference sphere is currently located according to the spherical surface position of the reference sphere. If the second rotation stop condition is not met, the step of rotating the turntable around the second rotation axis by a second preset angle is returned to continue. If the second rotation stop condition is met, each second sphere center position is obtained, and a spatial circle is fitted to each second sphere center position using the least squares method to obtain a second spatial circle. The position of the center of the second spatial circle is determined as the axis position of the second rotation axis, and the normal of the second spatial circle is determined as the axial direction of the second rotation axis to obtain axis calibration data.

[0097] In some embodiments, when the angle range of the turntable rotating around the second rotation axis reaches the second rotation angle range corresponding to the second rotation axis, it means that the second rotation stop condition is satisfied. The second rotation angle range corresponding to the second rotation axis may be -30° to +30°.

[0098] In some embodiments, Figure 8 As shown, a schematic diagram of the position detector detecting the position of the spherical surface when the turntable rotates around the second rotation axis is provided. The laser processing equipment can control the position detector to contact the spherical surface of the reference sphere after the turntable rotates around the second rotation axis by a second preset angle to obtain the spherical surface position, and determine the second spherical center position where the spherical center of the reference sphere is currently located according to the spherical surface position.

[0099] In some embodiments, the laser processing equipment can determine the second sphere center position where the sphere center of the reference sphere is currently located according to the reference sphere radius and the spherical surface position.

[0100] In some embodiments, the laser processing equipment can perform spherical fitting on the spherical surface position to obtain the second spherical center position where the spherical center of the reference sphere is currently located.

[0101] In some embodiments, the laser processing device can select three non-collinear fourth reference points, fifth reference points, and sixth reference points from the second space circle. Calculate the third direction vector and the fourth direction vector between the fourth reference point and the fifth reference point and the sixth reference point, respectively. Specifically, Among them, the fourth reference point D(x d ,y d, z d ), the fifth reference point E(x e ,y e, z e ), the sixth reference point F(x f ,y f, z f ). Represents the third direction vector. represents the fourth direction vector. Perform a cross product calculation on the third direction vector and the fourth direction vector to obtain the normal vector of the second space circle. Specifically, in, Represents the normal vector.

[0102] In this embodiment, with the reference sphere fixed on the processing surface, the turntable is continuously rotated around the first rotation axis by a first preset angle, and then the first center position of the reference sphere is determined according to the spherical position of the reference sphere until the first rotation stop condition is met; spatial circle fitting is performed on each first center position to obtain a first spatial circle; and the axis calibration data of the first rotation axis is determined based on the center and normal of the first spatial circle. The axis calibration data of the first rotation axis can support the laser processing equipment to accurately adjust its own posture, thereby ensuring that the laser processing equipment can be accurately adjusted to the posture when the current focusing position and the tool setting point position coincide, thereby ensuring the accuracy of the tool setting processing.

[0103] In some embodiments, Fig. 9 As shown, a schematic diagram of the structure of a laser processing device is provided. The laser processing device is provided with a first linear axis, a second linear axis, a third linear axis, a first rotation axis and a second rotation axis. The first linear axis, the second linear axis and the third linear axis are coordinate axes in the machine tool coordinate system. The laser processing device includes a laser head, a position detector and a processing surface. The laser head and the position detector are fixed to a first component on the third guide rail. The turntable where the processing surface is located is fixed to a second component on the second guide rail. The second guide rail is fixed to the first guide rail. The first guide rail, the second guide rail and the third guide rail are parallel to the first linear axis, the second linear axis and the third linear axis, respectively.

[0104] In some embodiments, Fig.10As shown, a flow chart for determining the first offset, the second offset, and the third offset is provided. The laser processing equipment can obtain the axis calibration data of the first rotating axis and the axis calibration data of the second rotating axis. The turntable is rotated according to the axis calibration data of the first rotating axis and the axis calibration data of the second rotating axis, so that the processing surface on the turntable is perpendicular to the third straight line axis. The first object is placed flat on the processing surface, and the laser processing equipment can adjust its posture so that the laser beam emitted by the laser head irradiates the end surface of the first object, and the laser head is controlled to emit the laser beam to process a spot area on the end surface of the first object, and the current posture of the laser processing equipment is determined as the focus posture corresponding to the spot area. Starting from the current posture each time, the first component is moved on the third guide rail by the first step length, and the second component is moved on the first guide rail by the second step length, and a new current posture is obtained. Under the current posture, the laser head is controlled to emit the laser beam to process a spot area on the end surface of the first object until the distance between the first component and the end surface of the reference object is not greater than the first step length or reaches a preset number of times, and each spot area is obtained. The reference spot area with the smallest size is selected from each spot area. The laser processing equipment can obtain the focus detection position of the position detector under the focus posture corresponding to the reference spot area. The position detector is controlled to contact the end face of the first object to obtain the first end face position detected at the first contact point. Based on the focus detection position and the first end face position, a third offset of the position detector relative to the focus in the axial direction of the third straight line is calculated.

[0105] The second object is placed flat on the processing surface. The laser processing equipment can adjust its own posture so that the difference between the third coordinate value of the position detector and the third coordinate value of the end face of the second object reaches the third offset and the first coordinate value and the second coordinate value of the position detector reach the first coordinate value and the second coordinate axis of the first rotation axis respectively, so as to obtain the positioning posture. Starting from the positioning posture, the second component is controlled to move on the first guide rail in a direction parallel to the first linear axis, and the laser head is controlled to emit a laser beam to process a first linear track on the end face of the second object. Starting from the positioning posture, the second component is controlled to move on the second guide rail in a direction parallel to the second linear axis, and the laser head is controlled to emit a laser beam to process a second linear track on the end face of the second object. The first linear track and the second linear track together constitute a reference mark. The center position of the intersection area between the first linear track and the second linear track can be used as the position of the reference mark. Starting from the positioning posture, the turntable is controlled to rotate around the third linear axis according to the axis calibration data of the first rotation axis. During the rotation process, the laser head is controlled to emit a laser beam to process a reference circular track on the end face of the reference object. The image acquisition device is controlled to acquire an image of the end face of the reference object to obtain a reference positioning image. The reference positioning image is subjected to line center extraction processing to obtain an intermediate positioning image. The intermediate positioning image includes a first line segment corresponding to the first straight line trajectory, a second line segment corresponding to the second straight line trajectory, and a reference circle corresponding to the reference circle trajectory. The intermediate positioning image is subjected to circle fitting processing to obtain the first pixel coordinates of the center of the reference circle. The first pixel coordinates of the center of the reference circle are used to characterize the first image position corresponding to the center of the reference circle trajectory. Corner point detection is performed on the intermediate positioning image to obtain the first pixel coordinates of the intersection between the first line segment and the second line segment. The first pixel coordinates of the center of the reference circle are used to characterize the first image position corresponding to the center of the reference circle trajectory. The first pixel coordinates of the intersection point can be used to characterize the second image position corresponding to the reference mark. The position difference of the first pixel coordinate relative to the second pixel coordinate is converted according to the calibration parameters of the image acquisition device, and the first offset and the second offset of the position detector relative to the focus on the first straight line axis and the second straight line axis are calculated.

[0106] Furthermore, the laser processing equipment can perform offset processing on the current detection position of the position detector according to the first offset, the second offset and the third offset to obtain the current focus position of the focus. The current focus position and the tool setting point position are overlapped by adjusting the own posture to achieve tool setting.

[0107] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0108] Based on the same inventive concept, the embodiment of the present application also provides a tool setting device for laser processing equipment for implementing the tool setting method for laser processing equipment involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the tool setting device for laser processing equipment provided below can refer to the limitations of the tool setting method for laser processing equipment above, and will not be repeated here.

[0109] In an exemplary embodiment, Fig.11 As shown, a structural block diagram of a tool setting device 1100 of a laser processing equipment is provided, including: an acquisition module 1102 , a determination module 1104 and a tool setting module 1106 .

[0110] The acquisition module 1102 is used to acquire the target offset of the position detector relative to the focus of the laser beam emitted by the laser head; wherein, in the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed.

[0111] The determination module 1104 is used to perform an offset process on the current detection position of the position detector according to the target offset to obtain the current focus position of the focus.

[0112] The tool setting module 1106 is used to perform tool setting processing according to the current focus position and the tool setting point position.

[0113] In some embodiments, the target offset includes a first offset, a second offset, and a third offset of the position detector relative to the focus in the first linear axis, the second linear axis, and the third linear axis, respectively; an acquisition module 1102 is specifically used to determine the focus detection position of the position detector when the focus of the laser beam emitted by the laser head is located at the end face of the reference object when the end face of the reference object on the laser processing equipment is perpendicular to the third linear axis; determine the third offset based on the focus detection position and the end face position of the reference object; determine the first offset and the second offset of the position detector relative to the focus when the distance between the position detector and the end face of the reference object reaches the third offset.

[0114] In some embodiments, the laser head and the position detector are fixed on a first component that can be translated along a direction parallel to the axis of the third straight line; the acquisition module 1102 is specifically used to control the laser head to emit a laser beam to process a spot area on the end face of the reference object; when the focus stop condition is not met, the first component is moved along a direction parallel to the axis of the third straight line by a first step length, and the reference object is moved along a direction parallel to the axis of the first straight line by a second step length, and the step of controlling the laser head to emit a laser beam to process a spot area on the end face of the reference object is continued; when the focus stop condition is met, a reference spot area where the focus is located is determined from each spot area on the end face of the reference object; the focus detection position of the position detector is obtained when the laser processing equipment is in a focus posture corresponding to the reference spot area.

[0115] In some embodiments, the acquisition module 1102 is specifically used to control the laser head to emit a laser beam to process a reference mark on the end face of the reference object when the distance between the position detector and the end face of the reference object reaches a third offset; and determine the first offset and the second offset based on the position difference between the position detector and the reference mark.

[0116] In some embodiments, a reference object is placed on a processing surface of a turntable of a laser processing device; the turntable is provided with a first rotation axis; an acquisition module 1102 is specifically used to determine a positioning posture of the laser processing device when the distance between the position detector and the end face of the reference object reaches a third offset and the position detector and the first rotation axis meet a center alignment condition; when the laser processing device is in the positioning posture, the laser head is controlled to emit a laser beam to process a reference mark on the end face of the reference object; starting from the positioning posture, the turntable is controlled to rotate around a third straight axis according to the axis calibration data of the first rotation axis, and during the rotation, the laser head is controlled to emit a laser beam to process a reference circular trajectory on the end face of the reference object; a reference positioning image captured by an image acquisition device on the end face of the reference object is acquired; based on the reference positioning image, a first image position corresponding to the center of the reference circular trajectory and a second image position corresponding to the reference mark are determined; according to the calibration parameters of the image acquisition device, the position difference of the first image position relative to the second image position is converted to obtain a first offset and a second offset.

[0117] In some embodiments, the turntable is fixed on a second component that can move along a direction parallel to the first straight line axis and a direction parallel to the second straight line axis; the reference mark includes a first straight line trajectory and a second straight line trajectory; the acquisition module 1102 is specifically used to control the second component to move along a direction parallel to the first straight line axis starting from the positioning posture, and control the laser head to emit a laser beam to process the first straight line trajectory on the end face of the reference object; starting from the positioning posture, the second component is controlled to move along a direction parallel to the second straight line axis, and the laser head is controlled to emit a laser beam to process the second straight line trajectory on the end face of the reference object.

[0118] In some embodiments, the acquisition module 1102 is specifically used to continuously execute the steps of rotating the turntable around the first rotation axis by a first preset angle, and then determining the first center position of the reference sphere where the center of the reference sphere is currently located according to the spherical position of the reference sphere, when the reference sphere is fixed on the machining surface, until the first rotation stop condition is met; performing spatial circle fitting on each first center position to obtain a first spatial circle; and determining the axis calibration data of the first rotation axis based on the center and normal of the first spatial circle.

[0119] In some embodiments, the determination module 1104 is specifically used to obtain the current detection position of the position detector; and superimpose the target offset onto the current detection position to obtain the current focus position of the focus.

[0120] In some embodiments, the determination module 1104 is specifically used to obtain the current detection coordinates fed back by the position detector; the current detection coordinates are coordinates in the machine tool coordinate system, which are used to characterize the current detection position; the current detection coordinates are offset according to the first offset, the second offset and the third offset to obtain the current focus coordinates of the focus; the current focus coordinates are coordinates in the machine tool coordinate system, which are used to characterize the current focus position.

[0121] In some embodiments, the tool setting module 1106 is specifically used to perform tool setting processing according to the current focus coordinates and the tool setting point coordinates; the tool setting point coordinates are coordinates in the machine tool coordinate system, which are used to represent the tool setting point position.

[0122] In some embodiments, the tool setting module 1106 is specifically used to adjust the posture of the laser processing equipment to make the current focus position and the tool setting point position coincide with each other, thereby achieving tool setting of the laser processing equipment.

[0123] In some embodiments, the tool setting module 1106 is specifically used to perform at least one of the following processing for adjusting the posture: controlling the turntable to rotate according to at least one of the axis calibration data of the first rotation axis or the axis calibration data of the second rotation axis; controlling the first component to move along a direction parallel to the axis of the third straight line; controlling the second component to move along at least one of the direction parallel to the axis of the first straight line or the direction parallel to the axis of the second straight line.

[0124] Each module in the tool setting device of the above laser processing equipment can be implemented in whole or in part by software, hardware and their combination. Each module can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each module.

[0125] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Fig.12As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a tool setting method for laser processing equipment is implemented.

[0126] Those skilled in the art will understand that Fig.12 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0127] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0128] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0129] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0130] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0131] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0132] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A tool setting method for laser processing equipment, characterized in that: In the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed; The method comprises: Acquiring a target offset of the position detector relative to the focus of the laser beam emitted by the laser head; Performing an offset process on the current detection position of the position detector according to the target offset to obtain the current focus position of the focus; Tool setting processing is performed according to the current focus position and the tool setting point position.

2. The method according to claim 1, characterized in that The target offset includes a first offset, a second offset, and a third offset of the position detector relative to the focus in the first linear axis, the second linear axis, and the third linear axis, respectively; and obtaining the target offset of the position detector relative to the focus of the laser beam emitted by the laser head includes: In a case where the end surface of the reference object on the laser processing device is perpendicular to the axial direction of the third straight line, determining the focus detection position of the position detector when the focus of the laser beam emitted by the laser head is located at the end surface of the reference object; determining the third offset based on the focus detection position and the end surface position of the reference object; The first offset and the second offset of the position detector relative to the focus are determined when the distance of the position detector relative to the end surface of the reference object reaches the third offset.

3. The method according to claim 2, characterized in that The laser head and the position detector are fixed on a first component which can move in a direction parallel to the axis of the third straight line; The step of determining the focus detection position of the position detector when the focus of the laser beam emitted by the laser head is located at the end surface of the reference object comprises: Controlling the laser head to emit a laser beam to process a light spot area on the end surface of the reference object; If the focus stop condition is not met, the first component is moved by a first step length in a direction parallel to the axis of the third straight line, and the reference object is moved by a second step length in a direction parallel to the axis of the first straight line, and the process returns to the step of controlling the laser head to emit a laser beam and machining a spot area on the end surface of the reference object; When the focus stop condition is met, determining a reference light spot area where the focus is located from each of the light spot areas on the end surface of the reference object; The focus detection position of the position detector is obtained when the laser processing equipment is in a focus posture corresponding to the reference light spot area.

4. The method according to claim 2, characterized in that: The determining, when the distance of the position detector relative to the end surface of the reference object reaches the third offset, the first offset and the second offset of the position detector relative to the focus comprises: When the distance between the position detector and the end surface of the reference object reaches the third offset, controlling the laser head to emit a laser beam to process a reference mark on the end surface of the reference object; The first offset and the second offset are determined based on a position difference of the position detector relative to the reference mark.

5. The method according to claim 4, characterized in that The reference object is placed on a processing surface of a turntable of the laser processing equipment; the turntable is provided with a first rotation axis; when the distance between the position detector and the end surface of the reference object reaches the third offset, the laser head is controlled to emit a laser beam to process a reference mark on the end surface of the reference object, including: Determining a positioning posture of the laser processing device when the distance between the position detector and the end surface of the reference object reaches the third offset and the position detector and the first rotation axis meet a center alignment condition; When the laser processing equipment is in the positioning posture, controlling the laser head to emit a laser beam to process a reference mark on the end surface of the reference object; The determining the first offset and the second offset based on the position difference of the position detector relative to the reference mark comprises: Starting from the positioning posture, the turntable is controlled to rotate around the third straight axis according to the axis calibration data of the first rotation axis, and during the rotation, the laser head is controlled to emit a laser beam to process a reference circular trajectory on the end surface of the reference object; Acquire a reference positioning image acquired by an image acquisition device on the end surface of the reference object; Determine, based on the reference positioning image, a first image position corresponding to the center of the reference circular trajectory and a second image position corresponding to the reference marker; The position difference of the first image position relative to the second image position is converted according to the calibration parameters of the image acquisition device to obtain the first offset and the second offset.

6. The method according to claim 5, characterized in that The turntable is fixed on a second component which can be moved along a direction parallel to the first straight line axis and a direction parallel to the second straight line axis; the reference mark includes a first straight line track and a second straight line track; when the laser processing equipment is in the positioning posture, the laser head is controlled to emit a laser beam to process the reference mark on the end surface of the reference object, including: Starting from the positioning position, controlling the second component to move in a direction parallel to the first straight line axis, and controlling the laser head to emit a laser beam to machine the first straight line track on the end surface of the reference object; Starting from the positioning position, the second component is controlled to move in a direction parallel to the second straight line axis, and the laser head is controlled to emit a laser beam to process the second straight line trajectory on the end surface of the reference object.

7. The method according to claim 5, characterized in that The method further comprises: In the case where the reference ball is fixed on the processing surface, the step of continuously rotating the turntable around the first rotation axis by a first preset angle and then determining a first spherical center position where the spherical center of the reference ball is currently located according to the spherical surface position of the reference ball is performed until a first rotation stop condition is met; Performing spatial circle fitting on each of the first sphere center positions to obtain a first spatial circle; Axis calibration data of the first rotation axis is determined based on the center and normal of the first spatial circle.

8. A tool setting device for laser processing equipment, characterized in that: The device comprises: An acquisition module, used for acquiring a target offset of the position detector relative to the focus of the laser beam emitted by the laser head; wherein, in the laser processing equipment, the relative position relationship between the laser head and the position detector is fixed; A determination module, configured to perform an offset process on the current detection position of the position detector according to the target offset to obtain a current focus position of the focus; The tool setting module is used to perform tool setting processing according to the current focus position and the tool setting point position.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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