A semiconductor laser alignment welding device and auxiliary alignment method

Abstract

The present invention relates to the field of laser welding technology, and discloses a semiconductor laser alignment welding device, including a packaging box, a pneumatic finger movably connected to the bottom of the first cylinder, a proximity switch fixedly installed on the front of the electric slide rail, a clamping claw member arranged on the top of the mechanical arm, a photoelectric detection element arranged on the inner top wall of the L-shaped mounting plate, and a micro electric push rod fixedly installed on the inner rear wall of the L-shaped mounting plate. The semiconductor laser alignment welding device and auxiliary alignment method detect the photoelectric signal changes of the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor to determine whether the laser cap cannot be aligned due to offset, and then control the second electric push rod to push the laser cap to reset, so that it is aligned with the chip, and then use the second electrode contact to move down to contact the first electrode contact to perform electric welding operation, thereby achieving automatic detection and calibration effect.

Description

Technical Field

[0001] The invention relates to the technical field of laser welding, in particular to a semiconductor laser alignment welding device and an auxiliary alignment method. Background Art

[0002] Semiconductor laser welding refers to the packaging and welding process of transistors and crystal oscillators through a capping machine. Due to the sophisticated structure of semiconductor lasers, the processing accuracy is relatively strict. In order to reduce the welding defective rate, it is necessary to use an alignment welding device for auxiliary alignment to improve the welding packaging efficiency.

[0003] After searching, according to the invention patent with Chinese patent publication number CN105436680A, a coaxial semiconductor laser alignment welding device is disclosed. The coaxial semiconductor laser alignment welding device is to adjust the height of the two-dimensional translation platform and the coaxial optical video microscope barrel until the laser chip waveguide is moved to the center of the light spot, and then the alignment of the light spot and the waveguide is adjusted through the display, and at this time, the tube cap and the tube seat can be aligned;

[0004] However, this observation and adjustment method relies on manual operation, which not only increases the operation steps, but also easily produces certain data errors, thereby affecting the accuracy of welding alignment adjustment. Therefore, further improvement is needed in the alignment method. Therefore, a semiconductor laser alignment welding device and an auxiliary alignment method are proposed. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the shortcomings of the prior art, the present invention provides a semiconductor laser alignment welding device and an auxiliary alignment method, which have the advantages of automatic detection and adjustment for alignment, and solve the problem that the coaxial semiconductor laser alignment welding device in the above-mentioned background technology requires manual observation and operation, which is prone to certain manual operation errors.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purpose of automatic detection and adjustment to align, the present invention provides the following technical solutions: a semiconductor laser alignment welding device, comprising a packaging box, a welding packaging mechanism is arranged inside the packaging box, and an auxiliary alignment mechanism is arranged inside the packaging box;

[0009] The welding packaging mechanism comprises a welding table fixed to the inner bottom wall of the packaging box, a turntable table is movably installed on the inner side of the welding table, a hydraulic cylinder is fixedly installed on the top of the welding table, an electric slide rail is fixedly installed on the inner rear wall of the welding table, a slide table is slidably connected to the front of the electric slide rail, a first cylinder is fixedly installed on the front of the slide table, a pneumatic finger is movably connected to the bottom of the first cylinder, a proximity switch is fixedly installed on the front of the electric slide rail, a mechanical arm is movably installed on the inner bottom wall of the welding table, and a clamping claw is arranged on the top of the mechanical arm;

[0010] The auxiliary alignment mechanism comprises an L-shaped mounting plate fixed to the inner rear wall of the welding table, a photoelectric detection element is arranged on the inner top wall of the L-shaped mounting plate, and a micro electric push rod is fixedly mounted on the inner rear wall of the L-shaped mounting plate.

[0011] Preferably, an exhaust assembly is provided on the outside of the packaging box, and the exhaust assembly includes an exhaust pipe connected to the inner top wall of the packaging box, and two pipe ends are provided at the bottom of the exhaust pipe. A vacuum pump is fixedly installed on the back of the packaging box, and one of the pipe ends of the exhaust pipe is connected to the top of the vacuum pump. The back of the vacuum pump is externally connected to a vacuum tank.

[0012] Preferably, an air pump is fixedly installed on the back of the packaging box, the other end of the exhaust pipe is connected to the top of the air pump, the back of the air pump is externally connected to a nitrogen tank, and a pressure gauge is fixedly installed on the top of the packaging box, and a detection terminal is provided at the bottom of the pressure gauge.

[0013] Preferably, a number of positioning grooves distributed in a circular array are opened inside the turntable, and a first electrode contact is fixedly connected to the inner side of each positioning groove. A battery pack is fixedly installed on the bottom of the turntable, and the top of the battery pack is electrically connected to each first electrode contact through a number of wires. A driving assembly is arranged inside the welding table, and the driving assembly includes a driving gear rotatably connected to the inside of the welding table, and a rotating gear is meshed and transmitted on the outer side of the driving gear, and the bottom of the battery pack is coaxially fixed to the top of the rotating gear through a gasket.

[0014] Preferably, a rotary encoder is fixedly installed inside the welding table, the top of the rotary encoder is coaxially fixed with the bottom of the driving gear, a stepper motor is fixedly installed inside the welding table, the output end of the stepper motor is fixedly connected to the bottom of the rotary encoder, a steering angle sensor is fixedly installed inside the welding table, and the top of the steering angle sensor is coaxially fixed with the bottom of the rotating gear;

[0015] The output end of the hydraulic cylinder is movably connected to a hydraulic push rod, the bottom of the hydraulic push rod is fixedly connected to a guide seat located directly above the positioning groove, the back of the guide seat is slidably connected to the inner rear wall of the welding table through an axle rod, the bottom of the guide seat is fixedly connected to a second electrode contact adapted to the first electrode contact, the second electrode contact is externally connected to a power supply module, and a motor drive controller is fixedly installed on the right side of the welding table.

[0016] Preferably, the left side of the packaging box is connected through with a first material box, a loading assembly is arranged inside the first material box, the loading assembly comprises a first material platform fixed to the inner bottom wall of the first material box, a stacking rack is fixedly connected to the top left side of the first material platform, a number of laser caps are vertically stacked on the inner side of the stacking rack, a first electric push rod is fixedly installed on the top left side of the first material platform, the right end of the first electric push rod is located directly below the stacking rack, a loading circular groove adapted to the laser cap is opened on the top of the first material platform, and a beam-type photoelectric switch is fixedly installed on the top front side and the top rear side of the loading circular groove;

[0017] The left end of the electric slide rail is fixed to the inner rear wall of the first material box, the output end of the first cylinder is movably connected to the first piston push rod, the top of the pneumatic finger is fixedly connected to the bottom of the first piston push rod, and the top left and top right sides of the slide table are fixedly connected with reflective sheets adapted to the proximity switch.

[0018] Preferably, a turntable is movably mounted on the inner bottom wall of the welding table, the mechanical arm comprises a column fixedly connected to the top of the turntable, the top of the column is rotatably connected to a first movable arm, and a first oil cylinder telescopic rod is fixedly mounted on the outside of the column, the top of the first movable arm is rotatably connected to a second movable arm, and a second oil cylinder telescopic rod is fixedly mounted on the outside of the first movable arm;

[0019] The clamping jaw member includes a clamp seat which is fixedly connected to one end of the second movable arm and has a U-shaped structure. Second cylinders are fixedly installed on the front and rear sides of the clamp seat. The output ends of the two second cylinders are fixedly connected to second piston push rods. The right side of the packaging box is connected with a second material box. A second material table is fixedly installed on the inner bottom wall of the second material box. A chip tray is placed on the top of the second material table, and a material collection box is fixedly connected to the front of the second material table.

[0020] Preferably, the L-shaped mounting plate is located above the positioning groove, the photoelectric detection element comprises a first photoelectric sensor, a second photoelectric sensor and a third photoelectric sensor respectively fixed to the inner top wall of the L-shaped mounting plate, the second photoelectric sensor is located directly above the positioning groove, the first photoelectric sensor is located in front of the second photoelectric sensor, and the third photoelectric sensor is located behind the second photoelectric sensor;

[0021] The intervals between the first photoelectric sensor and the third photoelectric sensor and the second photoelectric sensor are all 1.5-2 mm. A second electric push rod is fixedly mounted on the inner rear wall of the L-shaped mounting plate, and the second electric push rod is slidably fitted to the top surface of the turntable.

[0022] A semiconductor laser welding auxiliary alignment method includes the following implementation steps:

[0023] S31. First, the second piston push rod is driven by the second cylinder on the robot arm to take the chip on the chip tray and place it on the first electrode contact on the inner side of the positioning groove on the turntable;

[0024] S32. The first piston push rod is driven by the first cylinder to drive the pneumatic finger to rise and fall, and the pneumatic finger is opened and closed to take the laser cap on the first material table and put it on the chip inside the positioning groove on the turntable table;

[0025] S34. At this time, the laser cap position changes in two ways as the turntable starts and stops in an orderly manner and shakes or the laser cap cannot be aligned with the chip due to improper placement:

[0026] 1) From blocking the detection ends of the first photoelectric sensor and the second photoelectric sensor to simultaneously blocking the detection ends of the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor;

[0027] 2) Transforming from blocking the detection ends of the first photoelectric sensor and the second photoelectric sensor to blocking the first photoelectric sensor or not blocking;

[0028] S35. By detecting the changes in the photoelectric signals of the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor, it is determined whether the laser cap cannot be aligned due to offset, and then the laser cap is pushed to reset by controlling the second electric push rod. At this time, it can be aligned with the chip, and then the second electrode contact is moved down to contact the first electrode contact to perform electric welding operations.

[0029] (III) Beneficial effects

[0030] Compared with the prior art, the present invention provides a semiconductor laser alignment welding device and an auxiliary alignment method, which have the following beneficial effects:

[0031] 1. The semiconductor laser alignment welding device and auxiliary alignment method vertically stack the laser caps on the inner side of the stacking rack in an orderly manner, push the laser caps into the loading circular groove through the first electric push rod, so as to load the materials in an orderly manner, and then place the chips in an orderly manner on the top of the chip tray, clamp the chips into the positioning groove through the second cylinder of the robot arm, and then clamp the welding parts from the positioning groove to realize automatic loading and unloading operations.

[0032] 2. The semiconductor laser alignment welding device and auxiliary alignment method detect the photoelectric signal changes of the first photoelectric sensor, the second photoelectric sensor and the third photoelectric sensor to determine whether the laser cap cannot be aligned due to offset, and then control the second electric push rod to push the laser cap to reset it so that it is aligned with the chip, and then use the second electrode contact to move down and contact the first electrode contact to perform electric welding operation, thereby automatically detecting and calibrating. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a cross-sectional view of the packaging box structure of the present invention;

[0034] Figure 2 for Figure 1 rear view of perspective;

[0035] Figure 3 for Figure 1 Front view of the welding table structure in perspective;

[0036] Figure 4 for Figure 1 Three-dimensional schematic diagram of the welding packaging mechanism in the viewing angle;

[0037] Figure 5 for Figure 4 Schematic diagram of some structures in the viewing angle;

[0038] Figure 6 for Figure 5 Schematic diagram of the auxiliary alignment mechanism in the viewing angle;

[0039] Figure 7 for Figure 4 Schematic diagram of the electric slide structure in perspective;

[0040] Figure 8 for Figure 4 Schematic diagram of the robotic arm structure in perspective;

[0041] Fig. 9 for Figure 4 Schematic diagram of the first material platform structure in perspective.

[0042] In the figure: 1. packaging box; 2. welding packaging mechanism; 201. welding table; 202. turntable table; 203. hydraulic cylinder; 204. electric slide rail; 205. slide table; 206. first cylinder; 207. pneumatic finger; 208. proximity switch; 209. mechanical arm; 2091. column; 2092. first movable arm; 2093. telescopic rod of first oil cylinder; 2094. second movable arm; 2095. telescopic rod of second oil cylinder; 210. clamping claw; 2101. fixture seat; 2102. second cylinder; 3. auxiliary alignment mechanism; 301. L-shaped mounting plate; 302. photoelectric detection element; 3021. first photoelectric sensor; 3022. second photoelectric sensor; 3023. third photoelectric sensor; 303. second electric push rod; 4. air extraction Component; 401, exhaust pipe; 402, vacuum pump; 403, vacuum pump; 404, pressure gauge; 5, positioning groove; 6, first electrode contact; 7, battery pack; 8, drive component; 801, driving gear; 802, rotary gear; 803, rotary encoder; 804, stepping motor; 805, steering angle sensor; 9, guide seat; 10, second electrode contact; 11, first material box; 12, loading component; 1201, first material platform; 1202, stacking rack; 1203, first electric push rod; 1204, loading circular groove; 1205, opposite-beam photoelectric switch; 13, laser cap; 14, reflector; 15, turntable; 16, second material box; 17, second material platform; 18, chip tray; 19, collection box; 20, motor drive controller. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Embodiment 1:

[0045] Furthermore, an exhaust assembly 4 is provided outside the packaging box 1, and the exhaust assembly 4 includes an exhaust pipe 401 connected to the inner top wall of the packaging box 1, and two pipe ends are provided at the bottom of the exhaust pipe 401. A vacuum pump 402 is fixedly installed on the back of the packaging box 1, and one of the pipe ends of the exhaust pipe 401 is connected to the top of the vacuum pump 402. A vacuum tank is externally connected to the back of the vacuum pump 402;

[0046] An air pump 403 is fixedly installed on the back of the packaging box 1, the other end of the exhaust pipe 401 is connected to the top of the air pump 403, the back of the air pump 403 is externally connected to a nitrogen tank, and a pressure gauge 404 is fixedly installed on the top of the packaging box 1, and a detection terminal is set at the bottom of the pressure gauge 404.

[0047] Specifically, the valve at one end of the exhaust pipe 401 is opened, and the inside of the packaging box 1 is vacuumed by the vacuum pump 402. Then, the valve at the other end of the pipe is closed and then opened again, and the nitrogen source gas is delivered into the packaging box 1 by the gas pump 403. The internal pressure change is detected by the pressure gauge 404 to realize the pressurized environment simulation.

[0048] Embodiment 2:

[0049] Furthermore, a number of positioning grooves 5 are provided inside the turntable 202 and are distributed in a circular array. A first electrode contact 6 is fixedly connected to the inner side of each positioning groove 5. A battery pack 7 is fixedly installed at the bottom of the turntable 202. The top of the battery pack 7 is electrically connected to each first electrode contact 6 through a number of wires. A driving assembly 8 is provided inside the welding table 201. The driving assembly 8 includes a driving gear 801 that is rotatably connected to the inside of the welding table 201. The outer side of the driving gear 801 is meshed with a rotating gear 802. The bottom of the battery pack 7 is coaxially fixed to the top of the rotating gear 802 through a gasket.

[0050] A rotary encoder 803 is fixedly installed inside the welding table 201, and the top of the rotary encoder 803 is coaxially fixed with the bottom of the driving gear 801. A stepper motor 804 is fixedly installed inside the welding table 201, and the output end of the stepper motor 804 is fixedly connected to the bottom of the rotary encoder 803. A steering angle sensor 805 is fixedly installed inside the welding table 201, and the top of the steering angle sensor 805 is coaxially fixed with the bottom of the rotating gear 802.

[0051] The output end of the hydraulic cylinder 203 is movably connected to a hydraulic push rod, and the bottom of the hydraulic push rod is fixedly connected to a guide seat 9 located directly above the positioning groove 5. The back of the guide seat 9 is slidably connected to the inner rear wall of the welding table 201 through an axis rod. The bottom of the guide seat 9 is fixedly connected to a second electrode contact 10 that is adapted to the first electrode contact 6, and the second electrode contact 10 is externally connected to a power module. A motor drive controller 20 is fixedly installed on the right side of the welding table 201.

[0052] Specifically, the motor drive controller 20 receives the command signal of the corresponding rotation direction and rotation angle from the rotary encoder 803 to generate a corresponding pulse signal, thereby controlling the rotation angle and rotation direction of the output shaft of the stepper motor 804. At this time, the rotary encoder 803 is connected to the second stepper motor 804 and the bottom of the driving gear 801 through the rotating rod structure, and the rotation direction and speed of the driving gear 801 are determined after processing by the internal photodiode and signal processing circuit.

[0053] The steering angle sensor 805 is internally composed of an optical coupling element and a perforated slot plate. The optical coupling element is composed of a light-emitting diode and a photosensitive crystal transistor structure. The perforated slot plate is set in the middle position between the light-emitting diode and the photosensitive crystal transistor. A rotating shaft is connected to the top of the perforated slot plate, and the rotating shaft is coaxially fixed to the bottom of the rotating gear 802. When the rotating gear 802 drives the perforated slot plate to rotate through the rotating shaft, a number of light-transmitting circular holes opened on the perforated slot plate will emit the light of the light-emitting diode into the photosensitive crystal transistor. At this time, the photosensitive crystal transistor detects different light signals according to the changes in the light passing through the circular holes on the perforated slot plate to generate corresponding data differential signals. The detected data differential signal is used to calculate the rotation angle and rotation direction of the perforated slot plate through a logic algorithm, that is, the rotation angle and rotation direction data of the rotating gear 802 are obtained.

[0054] Embodiment three:

[0055] Furthermore, the left side of the packaging box 1 is connected through with the first material box 11, and the interior of the first material box 11 is provided with a loading assembly 12, which includes a first material platform 1201 fixed to the inner bottom wall of the first material box 11, and a stacking rack 1202 is fixedly connected to the top left side of the first material platform 1201, and a number of laser caps 13 are vertically stacked on the inner side of the stacking rack 1202, and a first electric push rod 1203 is fixedly installed on the top left side of the first material platform 1201, and the right end of the first electric push rod 1203 is located directly below the stacking rack 1202, and a loading circular groove 1204 adapted to the laser cap 13 is opened on the top of the first material platform 1201, and a beam-type photoelectric switch 1205 is fixedly installed on the top front side and the top rear side of the loading circular groove 1204;

[0056] The left end of the electric slide rail 204 is fixed to the inner rear wall of the first material box 11, the output end of the first cylinder 206 is movably connected to the first piston push rod, the top of the pneumatic finger 207 is fixedly connected to the bottom of the first piston push rod, and the top left and top right sides of the slide 205 are fixedly connected to a reflective sheet 14 adapted to the proximity switch 208.

[0057] Specifically, the laser cap 13 is pushed into the feeding circular groove 1204 by the first electric push rod 1203, and the stacked laser caps 13 will fall down in an orderly manner. When the laser cap 13 enters the feeding circular groove 1204, the laser path between the two opposing photoelectric switches 1205 will be cut off, and it is determined whether there is a laser cap 13 inside the feeding circular groove 1204.

[0058] The electric slide rail 204 drives the slide table 205 to slide left and right, and uses the reflective sheet 14 to block the detection end of the proximity switch 208 to generate a photoelectric signal to control the left and right travel of the slide table 205.

[0059] Embodiment 4:

[0060] Further, a turntable 15 is movably mounted on the inner bottom wall of the welding table 201, and the mechanical arm 209 includes a column 2091 fixedly connected to the top of the turntable 15, the top of the column 2091 is rotatably connected to a first movable arm 2092, and a first oil cylinder telescopic rod 2093 is fixedly mounted on the outside of the column 2091, the top of the first movable arm 2092 is rotatably connected to a second movable arm 2094, and a second oil cylinder telescopic rod 2095 is fixedly mounted on the outside of the first movable arm 2092;

[0061] The clamping jaw member 210 includes a clamp seat 2101 which is fixedly connected to one end of the second movable arm 2094 and has a U-shaped structure. Second cylinders 2102 are fixedly installed on the front and rear sides of the clamp seat 2101. The output ends of the two second cylinders 2102 are fixedly connected to second piston push rods. The right side of the packaging box 1 is through-connected with a second material box 16. The inner bottom wall of the second material box 16 is fixedly installed with a second material table 17. A chip tray 18 is placed on the top of the second material table 17, and a collection box 19 is fixedly connected to the front of the second material table 17.

[0062] Specifically, the external hydraulic control system inputs hydraulic oil to the first cylinder telescopic rod 2093 and the second cylinder telescopic rod 2095 to change the arm angles of the first movable arm 2092 and the second movable arm 2094, and then drives the second piston push rod through the second cylinder 2102 to load chips and unload welding parts.

[0063] Embodiment five:

[0064] Further, the L-shaped mounting plate 301 is located above the positioning groove 5, and the photoelectric detection element 302 includes a first photoelectric sensor 3021, a second photoelectric sensor 3022, and a third photoelectric sensor 3023 respectively fixed to the inner top wall of the L-shaped mounting plate 301, the second photoelectric sensor 3022 is located directly above the positioning groove 5, the first photoelectric sensor 3021 is located in front of the second photoelectric sensor 3022, and the third photoelectric sensor 3023 is located at the rear of the second photoelectric sensor 3022;

[0065] The intervals between the first photoelectric sensor 3021 and the third photoelectric sensor 3023 and the second photoelectric sensor 3022 are all 1.5-2 mm. The second electric push rod 303 is fixedly mounted on the inner rear wall of the L-shaped mounting plate 301 , and the second electric push rod 303 is slidably attached to the top surface of the turntable 202 .

[0066] Specifically, shaking caused by the orderly start and stop of the turntable 202 or improper placement will cause the laser cap 13 to be unable to be aligned with the chip, and normal welding cannot be performed at this time. Since the laser cap 13 can only block the first photoelectric sensor 3021 and the second photoelectric sensor 3022 during normal alignment, when the laser cap 13 simultaneously blocks the detection ends of the first photoelectric sensor 3021, the second photoelectric sensor 3022 and the third photoelectric sensor 3023, or only blocks the first photoelectric sensor 3021 or has no obstruction, it can be determined that the laser cap 13 cannot be aligned due to offset, and the laser cap 13 is pushed to reset by controlling the second electric push rod 303.

[0067] In summary, the working principles of the semiconductor laser alignment welding device and the auxiliary alignment method are as follows:

[0068] The laser caps 13 are stacked vertically and orderly on the inner side of the stacking rack 1202, and the chips are placed orderly on the top of the chip tray 18. The slide 205 is driven left and right by the electric slide rail 204, and the light detection signal of the proximity switch 208 is reflected by the reflective sheet 14. The proximity switch 208 converts the detected light signal into an electrical signal and then connects to an external control system, thereby controlling the left and right travel of the slide 205.

[0069] When the slide 205 drives the first cylinder 206 to stay below the proximity switch 208 on the left, the pneumatic finger 207 is located directly above the feeding circular groove 1204. The first cylinder 206 drives the first piston push rod to control the pneumatic finger 207 to move downward to clamp the laser cap 13 in the feeding circular groove 1204. At this time, each time the first electric push rod 1203 pushes a laser cap 13 into the feeding circular groove 1204, the laser cap 13 on the inner side of the stacking rack 1202 will drop one position, thereby realizing orderly feeding;

[0070] The motor drive controller 20 receives the command signal of the corresponding rotation direction and rotation angle from the rotary encoder 803 to generate the corresponding pulse signal, and then controls the rotation angle and rotation direction of the output shaft of the stepper motor 804. The stepper motor 804 controls the turntable 202 to rotate and change the set angle once, so as to change the position of the positioning slot 5 once, that is, the second cylinder 2102 of the robot arm 209 first clamps the chip and puts it into the positioning slot 5, and then the first cylinder 206 drives the first piston push rod to control the pneumatic finger 207 to clamp a laser cap 13 and put it into the positioning slot 5;

[0071] At this time, by detecting the changes in the photoelectric signals of the first photoelectric sensor 3021, the second photoelectric sensor 3022 and the third photoelectric sensor 3023, it is determined whether the laser cap 13 cannot be aligned due to offset, and then the laser cap 13 is pushed to reset by controlling the second electric push rod 303. At this time, it can be aligned with the chip, and then the second electrode contact 10 is moved down to contact the first electrode contact 6 for electric welding operation. After welding, it is clamped by the second cylinder 2102 of the robot arm 209 and placed in the collection box 19 for unloading.

[0072] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0073] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser alignment welding device, comprising a packaging box (1), characterized in that: A welding packaging mechanism (2) is provided inside the packaging box (1), and an auxiliary alignment mechanism (3) is provided inside the packaging box (1); The welding packaging mechanism (2) comprises a welding table (201) fixed to the inner bottom wall of the packaging box (1); a turntable table (202) is movably mounted on the inner side of the welding table (201); a hydraulic cylinder (203) is fixedly mounted on the top of the welding table (201); an electric slide rail (204) is fixedly mounted on the inner rear wall of the welding table (201); a slide table (205) is slidably connected to the front of the electric slide rail (204); a first cylinder (206) is fixedly mounted on the front of the slide table (205); a pneumatic finger (207) is movably connected to the bottom of the first cylinder (206); a proximity switch (208) is fixedly mounted on the front of the electric slide rail (204); a mechanical arm (209) is movably mounted on the inner bottom wall of the welding table (201); and a clamping claw (210) is provided on the top of the mechanical arm (202); The auxiliary alignment mechanism (3) comprises an L-shaped mounting plate (301) fixed to the inner rear wall of the welding table (201), a photoelectric detection element (302) being provided on the inner top wall of the L-shaped mounting plate (301), and a micro electric push rod (303) being fixedly mounted on the inner rear wall of the L-shaped mounting plate (301).

2. A semiconductor laser alignment welding device according to claim 1, characterized in that: An exhaust assembly (4) is arranged outside the packaging box (1), the exhaust assembly (4) comprises an exhaust pipe (401) which is connected to the inner top wall of the packaging box (1), two pipe ends are arranged at the bottom of the exhaust pipe (401), a vacuum pump (402) is fixedly installed on the back of the packaging box (1), one of the pipe ends of the exhaust pipe (401) is connected to the top of the vacuum pump (402), and a vacuum tank is externally connected to the back of the vacuum pump (402).

3. A semiconductor laser alignment welding device according to claim 2, characterized in that: An air pump (403) is fixedly mounted on the back of the packaging box (1); the other end of the air extraction pipe (401) is connected to the top of the air pump (403); a nitrogen tank is externally connected to the back of the air pump (403); a pressure gauge (404) is fixedly mounted on the top of the packaging box (1); and a detection terminal is provided at the bottom of the pressure gauge (404).

4. A semiconductor laser alignment welding device according to claim 1, characterized in that: The turntable (202) is provided with a plurality of positioning grooves (5) distributed in a ring array, the inner side of each positioning groove (5) is fixedly connected to a first electrode contact (6), a battery pack (7) is fixedly mounted on the bottom of the turntable (202), the top of the battery pack (7) is electrically connected to each first electrode contact (6) via a plurality of wires, a driving assembly (8) is provided inside the welding table (201), the driving assembly (8) comprises a driving gear (801) rotatably connected to the inside of the welding table (201), the outer side of the driving gear (801) is meshed with a rotating gear (802), and the bottom of the battery pack (7) is coaxially fixed to the top of the rotating gear (802) via a gasket.

5. A semiconductor laser alignment welding device according to claim 4, characterized in that: A rotary encoder (803) is fixedly installed inside the welding table (201), the top of the rotary encoder (803) is coaxially fixed with the bottom of the driving gear (801), a stepper motor (804) is fixedly installed inside the welding table (201), the output end of the stepper motor (804) is fixedly connected to the bottom of the rotary encoder (803), and a steering angle sensor (805) is fixedly installed inside the welding table (201), the top of the steering angle sensor (805) is coaxially fixed with the bottom of the rotating gear (802); The output end of the hydraulic cylinder (203) is movably connected to a hydraulic push rod, the bottom of the hydraulic push rod is fixedly connected to a guide seat (9) located directly above the positioning groove (5), the back of the guide seat (9) is slidably connected to the inner rear wall of the welding table (201) through an axle, the bottom of the guide seat (9) is fixedly connected to a second electrode contact (10) adapted to the first electrode contact (6), the second electrode contact (10) is externally connected to a power module, and a motor drive controller (20) is fixedly installed on the right side of the welding table (201).

6. A semiconductor laser alignment welding device according to claim 1, characterized in that: The left side of the packaging box (1) is connected to a first material box (11), and a loading assembly (12) is arranged inside the first material box (11). The loading assembly (12) includes a first material platform (1201) fixed to the inner bottom wall of the first material box (11), a stacking rack (1202) is fixedly connected to the top left side of the first material platform (1201), and a number of laser caps (13) are vertically stacked on the inner side of the stacking rack (1202), a first electric push rod (1203) is fixedly installed on the top left side of the first material platform (1201), and the right end of the first electric push rod (1203) is located directly below the stacking rack (1202), and a loading circular groove (1204) adapted to the laser cap (13) is opened on the top of the first material platform (1201), and a beam-type photoelectric switch (1205) is fixedly installed on the top front side and the top rear side of the loading circular groove (1204); The left end of the electric slide rail (204) is fixed to the inner rear wall of the first material box (11), the output end of the first cylinder (206) is movably connected to the first piston push rod, the top of the pneumatic finger (207) is fixedly connected to the bottom of the first piston push rod, and the top left and top right sides of the slide table (205) are fixedly connected to a reflective sheet (14) adapted to the proximity switch (208).

7. A semiconductor laser alignment welding device according to claim 1, characterized in that: A turntable (15) is movably mounted on the inner bottom wall of the welding table (201); the mechanical arm (209) comprises a column (2091) fixedly connected to the top of the turntable (15); the top of the column (2091) is rotatably connected to a first movable arm (2092); a first oil cylinder telescopic rod (2093) is fixedly mounted on the outside of the column (2091); the top of the first movable arm (2092) is rotatably connected to a second movable arm (2094); and a second oil cylinder telescopic rod (2095) is fixedly mounted on the outside of the first movable arm (2092); The clamping jaw member (210) comprises a clamp seat (2101) which is fixedly connected to one end of the second movable arm (2094) and has a U-shaped structure. The front and rear sides of the clamp seat (2101) are fixedly installed with second cylinders (2102). The output ends of the two second cylinders (2102) are fixedly connected with second piston push rods. The right side of the packaging box (1) is connected with a second material box (16). The inner bottom wall of the second material box (16) is fixedly installed with a second material table (17). A chip tray (18) is placed on the top of the second material table (17), and a material collection box (19) is fixedly connected to the front of the second material table (17).

8. A semiconductor laser alignment welding device according to claim 4, characterized in that: The L-shaped mounting plate (301) is located above the positioning groove (5); the photoelectric detection element (302) comprises a first photoelectric sensor (3021), a second photoelectric sensor (3022) and a third photoelectric sensor (3023) respectively fixed to the inner top wall of the L-shaped mounting plate (301); the second photoelectric sensor (3022) is located directly above the positioning groove (5); the first photoelectric sensor (3021) is located in front of the second photoelectric sensor (3022); and the third photoelectric sensor (3023) is located in the rear of the second photoelectric sensor (3022); The spacing between the first photoelectric sensor (3021) and the third photoelectric sensor (3023) and the second photoelectric sensor (3022) is 1.5-2 mm. A second electric push rod (303) is fixedly mounted on the inner rear wall of the L-shaped mounting plate (301), and the second electric push rod (303) is slidably attached to the top surface of the turntable (202).

9. A semiconductor laser welding auxiliary alignment method, characterized in that: The method comprises the one described in claims 1 to 8, and further comprises the following implementation steps: S31. First, the second cylinder (2102) on the robot arm (209) drives the second piston push rod to take the chip on the chip tray (18) and place it on the first electrode contact (6) on the inner side of the positioning groove (5) on the turntable (202); S32. The first piston push rod is driven by the first cylinder (206) to drive the pneumatic finger (207) to rise and fall, and the pneumatic finger (207) is opened and closed to take the laser cap (13) on the first material table (1201) and put it on the chip inside the positioning groove (5) on the turntable table (202); S34. At this time, the laser cap (13) and the chip cannot be aligned due to shaking caused by the orderly start and stop of the turntable (202) or improper placement. At this time, the position of the laser cap (13) changes in two ways: 1) Transforming from blocking the detection ends of the first photoelectric sensor (3021) and the second photoelectric sensor (3022) to simultaneously blocking the detection ends of the first photoelectric sensor (3021), the second photoelectric sensor (3022) and the third photoelectric sensor (3023); 2) Transforming from blocking the detection ends of the first photoelectric sensor (3021) and the second photoelectric sensor (3022) to blocking the first photoelectric sensor (3021) or not blocking; S35. By detecting the changes in the photoelectric signals of the first photoelectric sensor (3021), the second photoelectric sensor (3022) and the third photoelectric sensor (3023), it is determined whether the laser cap (13) cannot be aligned due to offset, and then the laser cap (13) is pushed to reset by controlling the second electric push rod (303). At this time, it can be aligned with the chip, and then the second electrode contact (10) is moved down to contact the first electrode contact (6) to perform electric welding operations.

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