Wafer defect detection platform deck and use method thereof

Abstract

The invention relates to the technical field of wafer detection, and discloses a wafer defect detection carrying table and a use method thereof, the wafer defect detection carrying table comprises a carrying table, two lifting assemblies and two connecting assemblies; the two lifting assemblies are located on the two sides of the objective table, and each lifting assembly is provided with a lifting end. The first end of one connecting assembly is hinged to the lifting end of one lifting assembly, and the second end of the connecting assembly is hinged to one end, in the first direction, of the objective table; in the other connecting assembly, the first end of the connecting assembly is hinged to the lifting end of the other lifting assembly, and the second end of the connecting assembly is hinged to the other end, in the first direction, of the objective table; wherein at least one of the connecting assemblies can elastically stretch out and draw back in the second direction; the first end and the second end of at least one connecting assembly can be circumferentially limited in the second direction, and the second direction is that the first end of the connecting assembly faces the second end of the connecting assembly; the imaging definition of an imaging device on a part with a warping degree of a wafer can be improved, so that defect information of the wafer can be acquired.

Description

Technical Field

[0001] The present application relates to the field of wafer inspection technology, and in particular to a wafer defect inspection platform and a method of using the same. Background Art

[0002] Silicon wafers are thin, flat, circular silicon-based materials that are purified from silicon elements and processed through a series of processes. They are widely used in many fields, such as integrated circuits, solar panels, sensors, micro-electromechanical systems, optoelectronics, and optical communications. Wafers are usually required to have precise mechanical properties and excellent surface quality.

[0003] In the related art, in order to improve the surface quality and polishing speed of chemical mechanical polishing of silicon wafers, defect detection and imaging analysis are usually performed on the polished wafers; the wafer surface defect imaging equipment can read the defect coordinates generated by the wafer front-end process, quickly scan the defects corresponding to the coordinates, and perform SEM imaging (SEM, Scanning Electron Microscope) on them.

[0004] However, due to the inherent characteristics of chamfering, grinding, polishing and cleaning processes in the wafer production process, the edge of the wafer has a certain degree of warping. The existence of warping causes the wafer surface defect imaging equipment to have inconsistent depth of field when imaging defects at the edge of the wafer, which can easily lead to focusing failure and inability to obtain specific information on the defects at the edge of the wafer. Summary of the invention

[0005] The present application provides a wafer defect detection stage and a method of using the same, which can improve the imaging clarity of an imaging device on a portion of a wafer with warpage, so as to obtain defect information of the wafer.

[0006] On the one hand, the present application provides a wafer defect detection platform, including a stage, two lifting components and a connecting component; the specific scheme is as follows.

[0007] The two lifting assemblies are respectively located on two sides of the loading platform along the first direction, and each lifting assembly is provided with a lifting end;

[0008] Two connecting assemblies are provided, wherein a first end of one connecting assembly is hinged to the lifting end of one lifting assembly, and a second end of the connecting assembly is hinged to one end of the loading platform along the first direction; a first end of the other connecting assembly is hinged to the lifting end of another lifting assembly, and a second end of the other end of the loading platform along the first direction;

[0009] Among them, at least one of the two connecting components can be elastically extended and retracted along the second direction; at least one of the two connecting components, its first end and the second end can be circumferentially limited around the second direction, wherein the second direction is the direction from the first end of the connecting component toward its second end.

[0010] Beneficial effect: since a lifting assembly is respectively arranged on both sides of the stage along the first direction, the two lifting assemblies are respectively connected to the stage through a connecting assembly, and the connecting assembly can be elastically retracted, in the process of adjusting the angle of the stage by one of the two lifting ends rising and the other falling (or one lifting end remains stationary and the other rises or falls), since the connecting assembly can be elastically retracted, the displacement difference caused by the increase in the distance between the two lifting ends can be absorbed; and the lifting ends on the two lifting assemblies and the first end and the second end of the connecting assembly are always kept in a straight line, thereby ensuring the accuracy of adjusting the inclination angle of the stage; at the same time, since the first end and the second end of the connecting assembly can be circumferentially limited around the second direction, the stage can be prevented from rotating around the second direction, so that the stage remains stable, thereby realizing the tilt adjustment of the stage, enabling the imaging device to perform orthographic projection detection on the edge of the wafer, thereby improving the imaging clarity of the imaging device on the warped part of the wafer, so as to obtain the defect information of the wafer.

[0011] In an optional embodiment, the connecting component includes at least two rigid parts and an elastic telescopic part, and the multiple rigid parts are hinged in series in sequence, and the two ends of the elastic telescopic part are respectively connected to the two rigid parts, so that the first end and the second end of the connecting component tend to approach each other.

[0012] In an optional embodiment, it also includes a first rotation drive component, the stage includes a stage body and a turntable, the turntable is located on the stage body and connected to the stage body, the turntable is used to carry the wafer, and the turntable can be rotatably connected to the rotating end of the first rotation drive component to rotate relative to the stage body.

[0013] In an optional embodiment, a through hole is provided on the carrier body, and a rotating shaft is provided on the surface of the turntable close to the carrier body. The rotating shaft passes through the through hole and is rotatably connected to the rotating end of the first rotating drive component, and the rotating end of the first rotating drive component can be rotatably connected to or separated from the rotating shaft.

[0014] In an optional embodiment, the first rotary drive component includes a rotary component body and an adapter, the adapter being capable of extending and retracting along its axial direction, one end of the adapter being fixedly connected to the rotating end of the rotary component body, and the other end of the adapter being rotationally connected or separated from the rotating shaft through extension and retraction.

[0015] In an optional embodiment, a first cavity and a second cavity are provided in the turntable, a plurality of first adsorption holes are arranged at a portion of the turntable for contacting the wafer, and the plurality of first adsorption holes are all connected to the first cavity, a plurality of second adsorption holes are arranged at a portion of the turntable for contacting the carrier body, and the plurality of second adsorption holes are all connected to the second cavity, and the first cavity and the second cavity are both used to be connected to a vacuum pumping device.

[0016] In an optional embodiment, the lifting assembly includes a guide rail column, a lead screw and a slider, a receiving cavity being arranged in the guide rail column along its axial direction, a limiting groove being arranged on the outer wall surface of the guide rail column, the limiting groove extending along the axial direction of the guide rail column, and the limiting groove being connected to the receiving cavity; the lead screw is rotatably arranged in the receiving cavity, and the axial direction of the lead screw is parallel to or coincides with the axial direction of the guide rail column; one end of the slider is located in the receiving cavity and is screwed to the lead screw, and the other end of the slider passes through the limiting groove and is located outside the guide rail column, and is hinged to the connecting assembly, and the slider is the lifting end.

[0017] In an optional embodiment, it also includes a fixed frame, two transmission wheels, an annular transmission member and a second rotation drive assembly, the two guide rail columns are connected to the fixed frame, the two lead screws are coaxially connected to one transmission wheel at one end close to the fixed frame, the second rotation drive assembly is transmission connected to any one of the transmission wheels, and the two transmission wheels are transmission connected via the annular transmission member.

[0018] In an optional embodiment, it also includes a measuring instrument and a controller, wherein the measuring instrument is used to measure the warpage of the wafer, and the controller is connected to the measuring instrument and the second rotation drive component, and the controller can send an action signal to the second rotation drive component according to the measurement result of the measuring instrument.

[0019] On the other hand, the present application also provides a method for using the wafer defect detection stage in any one of the above embodiments, comprising:

[0020] Place the wafer on the stage;

[0021] Measure the warpage of the wafer edge;

[0022] According to the warping degree, the lifting end of at least one lifting assembly is controlled to rise or fall to adjust the angle of the stage so that the depth of field of the imaging device is consistent when imaging the edge of the wafer.

[0023] Beneficial effect: Since this method uses a wafer defect detection platform and has the same effect as a wafer defect detection platform, it will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the related technologies, the drawings required for use in the specific implementation methods or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of the structure of a wafer defect detection platform according to an embodiment of the present application;

[0026] Figure 2 for Figure 1 A partial enlarged view of point A shown;

[0027] Figure 3 This is a schematic diagram of the structure of a lifting assembly in a wafer defect detection platform in an embodiment of the present application without a slider.

[0028] Description of reference numerals:

[0029] X, first direction; Y, second direction;

[0030] 1. Loading platform; 2. Lifting assembly; 3. Connecting assembly; 4. First rotating drive assembly; 5. Fixed frame; 6. Transmission wheel; 7. Ring transmission member; 8. Second rotating drive assembly;

[0031] 101. stage body; 102. turntable; 103. rotating shaft;

[0032] 201, lifting end; 202, guide rail column; 203, lead screw; 204, slider;

[0033] 2021, accommodating cavity;

[0034] 301, rigid part; 302, elastic telescopic part;

[0035] 401. Rotating component body; 402. Adapter. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0037] In the related art, in order to improve the surface quality and polishing speed of chemical mechanical polishing of single crystal silicon, defect detection and imaging analysis are usually performed on the polished wafer; the wafer surface defect imaging equipment can read the defect coordinates generated by the wafer front-end process, quickly scan the defects corresponding to the coordinates, and perform SEM imaging (SEM, Scanning Electron Microscope) on them.

[0038] However, due to the inherent characteristics of chamfering, grinding, polishing and cleaning processes in the wafer production process, the edge of the wafer has a certain degree of warping. The existence of warping causes the wafer surface defect imaging equipment to have inconsistent depth of field when imaging defects at the edge of the wafer, which can easily lead to focusing failure and inability to obtain specific information on the defects at the edge of the wafer.

[0039] Therefore, the present application provides a wafer defect detection stage and a method of using the same, which can improve the imaging clarity of the imaging device on the warped portion of the wafer, so as to obtain the defect information of the wafer.

[0040] Combine the following Figures 1 to 3 , describing an embodiment of the present application.

[0041] According to an embodiment of the present application, on the one hand, a wafer defect detection stage is provided, such as Figure 1 As shown, it includes a loading platform 1, a lifting component 2 and a connecting component 3; the specific scheme is as follows.

[0042] The stage 1 is used to carry wafers for testing. Specifically, the shape of the stage 1 can be any shape such as round, square, rectangular, etc., preferably round. A restriction surface such as a circular groove can be set on the stage 1 to limit the position of the wafer to prevent it from falling.

[0043] like Figure 1 As shown, two lifting assemblies 2 are provided, which are respectively located on both sides of the loading platform 1 along the first direction X, and each lifting assembly 2 is provided with a lifting end 201; specifically, the lifting end 201 on the lifting assembly 2 has the function of moving up and down, and there are many specific implementation methods, such as connecting ropes to the lifting ends 201, and moving the lifting ends 201 up and down by the lifting ropes, or other methods, as long as the up and down movement of the lifting ends 201 can be achieved.

[0044] like Figure 1 As shown, two connecting components 3 are provided. In one connecting component 3, the first end thereof is hinged to the lifting end 201 of one lifting component 2, and the second end thereof is hinged to one end of the loading platform 1 along the first direction X; in the other connecting component 3, the first end thereof is hinged to the lifting end 201 of another lifting component 2, and the second end thereof is hinged to the other end of the loading platform 1 along the first direction X; that is, the two connecting components 3 are respectively used to connect the lifting ends 201 of the two lifting components 2 with the two ends of the loading platform 1 along the first direction X.

[0045] Among them, at least one of the two connecting components 3 can be elastically extended and retracted along the second direction Y; at least one of the two connecting components 3 has its first end and second end capable of circumferentially limiting around the second direction Y, wherein the second direction Y is the direction from the first end of the connecting component 3 toward its second end.

[0046] It should be noted that the above “at least one of the two connecting components 3 can be elastically extended and retracted along the second direction Y” means that the connecting component 3 can be extended and retracted along the second direction Y and can be reset under the action of elastic force.

[0047] The above “its first end and the second end can be circumferentially limited around the second direction Y” means that the first end and the second end of the connecting component 3 cannot rotate relative to each other around the second direction Y to maintain the stability of the worktable 1 and prevent it from rotating around the second direction Y.

[0048] It should also be noted that if Figure 2 As shown, the "second direction Y" is the direction from the first end to the second end of the connecting component 3; that is, each connecting component 3 has a second direction Y; generally speaking, the second directions Y of the two components are the same, because the first ends and the second ends of the two connecting components 3 are on a straight line.

[0049] The specific schemes of the two connecting components 3 can be: Scheme 1: one connecting component 3 is a connecting rod (cannot be extended or retracted), and the other connecting component 3 is a spring retractable component; Scheme 2: one connecting component 3 can be extended or retracted, and its first end and second end can be circumferentially limited around the second direction Y, and the other connecting component 3 is not limited; Scheme 3: both connecting components 3 can be extended or retracted, and their first end and second end can be circumferentially limited around the second direction Y; Scheme 3 is the preferred scheme.

[0050] In the specific use process, such as Figure 1As shown, in the initial stage of use, the lifting ends 201 of the two lifting assemblies 2 are maintained at the same horizontal height to keep the stage 1 horizontal, and then a wafer is placed on the stage 1 and inspected using an imaging device; during the inspection process, it is found that the edge of the wafer has a warp, so the two lifting ends 201 are controlled to be lifted and lowered in a coordinated manner to make the stage 1 tilt at a certain angle to offset the warp at the edge of the wafer, so that the imaging device can perform orthographic projection inspection on the edge of the wafer.

[0051] In this embodiment, if Figure 1 As shown, since a lifting assembly 2 is respectively arranged on both sides of the loading platform 1 along the first direction X, the two lifting assemblies 2 are respectively connected to the loading platform 1 through a connecting assembly 3, and the connecting assembly 3 can be elastically retracted. In the process of adjusting the angle of the loading platform 1 by one lifting end 201 rising and the other falling (or one lifting end 201 remains stationary and the other rises or falls), since the connecting assembly 3 can be elastically retracted, the displacement difference caused by the increase in the distance between the two lifting ends 201 can be absorbed; and the two lifting ends 201 can be adjusted. The lifting end 201 on the component 2, the first end and the second end of the connecting component 3 are always kept in a straight line, ensuring the accuracy of adjusting the tilt angle of the stage 1; at the same time, since the first end and the second end of the connecting component 3 can be circumferentially limited around the second direction Y, the stage 1 can be prevented from rotating around the second direction Y, so that the stage 1 remains stable, thereby realizing the tilt adjustment of the stage 1, allowing the imaging device to perform orthographic projection detection on the edge of the wafer, thereby improving the imaging clarity of the imaging device on the warped part of the wafer, so as to obtain the defect information of the wafer.

[0052] In one embodiment, Figure 2 As shown, the connection component 3 includes at least two rigid parts 301 and an elastic telescopic part 302. The multiple rigid parts 301 are hinged in series in sequence, and the two ends of the elastic telescopic part 302 are respectively connected to the two rigid parts 301 so that the first end and the second end of the connection component 3 have a tendency to approach each other.

[0053] It should be explained that the rigid parts 301 are two parts whose shapes are difficult to change, such as connecting rods, chain links, etc. After multiple rigid parts 301 are hinged through the rotating shaft 103, they can only be folded, and the first end and the second end of the connecting component 3 will not rotate relative to each other around the second direction Y.

[0054] Specifically, the number of rigid members 301 may be 2 to 4, preferably 2. Figure 1 shown.

[0055] The elastic telescopic member 302 can be a spring or an elastic rubber with a certain amount of expansion and contraction, and the two ends of the elastic telescopic member 302 can be connected to any two of the multiple rigid members 301, so that the first end and the second end of the connecting component 3 tend to be relatively close.

[0056] In this embodiment, if Figure 2 As shown, the connection component 3 includes at least two rigid parts 301 and an elastic telescopic part 302. The two ends of the elastic telescopic part 302 are respectively connected to the two rigid parts 301, so that the first end and the second end of the connection component 3 tend to approach each other, thereby realizing elastic telescoping of the connection component 3 and circumferential limitation of the first end of the connection component 3 relative to the second end around the second direction Y. The structure is simple and easy to manufacture.

[0057] In some embodiments not shown, not shown in the figures, the connecting assembly 3 includes a first tube body, a second tube body and an elastic member, the first tube body and the second tube body are slidably connected, and the first tube body and the second tube body are connected by the elastic member for reset, wherein the cross-sections of the first tube body and the second tube body are adaptive multiple deformations, such as triangles, squares, regular pentagons, etc.

[0058] More specifically, the elastic member can be arranged on the outside of the first tube body and the second tube body, and connected to the outer wall of the first tube body and the outer wall of the second tube body; the elastic member can also be fixedly arranged on the inside of the first tube body, and the second tube body is slidably sleeved in the second tube body, and the elastic member can be extended and retracted in the first tube body, and the elastic member is connected to one end of the second tube body located in the first tube body.

[0059] In one embodiment, Figure 2 As shown, the number of rigid parts 301 in each connecting component 3 is two. Specifically, the rigid parts 301 can be metal rods or plastic rods with high deformation resistance, etc. The first ends of the two rigid parts 301 are hinged through the rotating shaft 103, and the part of one rigid part 301 away from its first end is connected to one end of the elastic telescopic part 302, and the part of the other rigid part 301 away from its first end is connected to the other end of the elastic telescopic part 302.

[0060] In this embodiment, the connection assembly 3 has only two rigid parts 301 , which has a simpler structure and lower cost, and can reduce the production cost of the wafer defect inspection platform.

[0061] In one embodiment, Figure 1As shown, the wafer defect detection platform also includes a first rotation drive component 4, specifically, the first rotation drive component 4 is a motor, and specifically a stepping motor or the like; the stage 1 includes a stage body 101 and a turntable 102, the turntable 102 is located on the stage body 101, and is connected to the stage body 101, the turntable 102 is used to carry the wafer, and the turntable 102 can be rotatably connected to the rotating end of the first rotation drive component 4 to rotate relative to the stage body 101.

[0062] Specifically, the turntable 102 is connected to the stage body 101 by rotation and sliding to realize the rotation of the turntable 102; the turntable 102 can also be lifted and lowered to separate it from the stage body 101 to realize the rotation of the turntable 102.

[0063] In specific use, when the imaging device images a portion of the edge of the wafer and needs to image other parts of the wafer, the turntable 102 can be rotated at equal angles by controlling the first rotating drive component 4 to rotate at a certain angle, such as rotating at a fixed angle for the first time and rotating at a fixed angle again for the next time; the angle of each rotation can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150° and 180°.

[0064] In this embodiment, if Figure 1 As shown, by configuring the stage 1 to be composed of a stage body 101 and a turntable 102, and the turntable 102 is rotationally connected to the first rotating drive component 4, the turntable 102 is rotated, so that the wafer on the turntable 102 can be rotated under the drive of the first rotating component, so that the wafer can be adjusted at a certain angle, which is convenient for the imaging device to image different edge parts of the wafer.

[0065] In a specific embodiment, a through hole is provided on the carrier body 101, and a rotating shaft 103 is provided on the surface of the turntable 102 close to the carrier body 101. The rotating shaft 103 passes through the through hole and is rotatably connected to the rotating end of the first rotating drive component 4. The rotating end of the first rotating drive component 4 can be rotatably connected to or separated from the rotating shaft 103.

[0066] Specifically, the rotating end of the first rotary drive component 4 can be rotatably connected or separated from the rotating shaft 103 , which can be achieved through a connecting piece with a telescopic function, or by lifting and lowering the first rotary drive component 4 as a whole.

[0067] In this embodiment, the rotating end of the first rotating drive component 4 can be rotatably connected or separated from the rotating shaft 103, so that when the turntable 102 needs to be rotated, the rotating end of the first rotating drive component 4 can be rotatably connected to the rotating shaft 103; when the angle of the worktable 1 needs to be adjusted, the rotating end of the first rotating drive component 4 can be separated from the rotating shaft 103 to prevent the first rotating drive component 4 from affecting the angle adjustment of the worktable 1.

[0068] In a more specific embodiment, Figure 1 As shown, the first rotary drive component 4 includes a rotary component body 401 and an adapter 402. The adapter 402 can be extended and retracted along its axial direction. One end of the adapter 402 is fixedly connected to the rotating end of the rotary component body 401, and the other end of the adapter 402 is rotationally connected or separated from the rotating shaft 103 through extension and retraction.

[0069] Specifically, the adapter 402 may be a lifting bearing, or a rod that is retracted and extended by hydraulic pressure or pneumatic pressure.

[0070] In this embodiment, a retractable adapter 402 is provided to realize the rotation connection or separation between the rotating component body 401 and the rotating shaft 103, which has a simple structure and is easy to manufacture.

[0071] In one embodiment, a first cavity and a second cavity are provided in the turntable 102, a plurality of first adsorption holes are arranged at a portion of the turntable 102 for contacting with the wafer, and the plurality of first adsorption holes are all connected to the first cavity, a plurality of second adsorption holes are arranged at a portion of the turntable 102 for contacting with the carrier body 101, and the plurality of second adsorption holes are all connected to the second cavity, and the first cavity and the second cavity are both used to be connected to a vacuum pumping device.

[0072] Specifically, the number, diameter and arrangement of the first adsorption holes and the second adsorption holes can be selected and set according to actual needs.

[0073] It should be noted that the first adsorption hole can directly adsorb the wafer, or an adsorption plate can be embedded in the adsorption hole to adsorb the wafer. This solution has a better adsorption effect. Similarly, the second adsorption hole can directly adsorb the carrier body 101, or an adsorption plate can be embedded in the adsorption hole to be adsorbed and connected with the carrier body 101. This solution has a better adsorption effect.

[0074] In this embodiment, a first cavity and a second cavity are arranged in the turntable 102, and the first adsorption hole for adsorbing the wafer is connected to the first cavity, and the second adsorption hole for adsorption connection with the stage body 101 is connected to the second cavity, so that the vacuum equipment provides different vacuum degrees to the first cavity and the second cavity, that is, different sizes of adsorption forces, and can adjust the adsorption force of different wafers to prevent the wafer from deforming, and can maintain the adsorption connection strength between the turntable 102 and the stage body 101.

[0075] In one embodiment, Figure 1 and Figure 3 As shown, the lifting assembly 2 includes a guide rail column 202, a lead screw 203 and a slider 204; the specific solution is as follows.

[0076] An accommodating cavity 2021 is arranged inside the guide rail column 202 along its axial direction, that is, the guide rail column 202 can be directly made of a hollow steel pipe or a hollow pipe of other materials; a limiting groove is arranged on the outer wall surface of the guide rail column 202, and the limiting groove extends along the axial direction of the guide rail column 202, and the limiting groove is connected to the accommodating cavity 2021.

[0077] Both ends of the lead screw 203 are rotatably disposed in the accommodating cavity 2021 via bearings, and the axial direction of the lead screw 203 is parallel to or coincides with the axial direction of the guide rail column 202 .

[0078] One end of the slider 204 is located in the accommodating cavity 2021 and is screwed to the lead screw 203 through a thread. The other end of the slider 204 passes through the limiting groove and is located outside the guide rail column 202 and is hinged to the connecting component 3 through the rotating shaft 103.

[0079] In this embodiment, if Figure 1 and Figure 3 As shown, the lifting assembly 2 includes a guide column 202, a lead screw 203 and a slider 204. Since the slider 204 is threadedly connected to the lead screw 203, the lead screw 203 can only move up and down along the axial direction of the guide column 202 under the restriction of the limit groove by driving the lead screw 203 to rotate. The structure is simple and easy to manufacture. At the same time, the driving method of the slider 204 by the lead screw 203 can enable the slider 204 to move up and down accurately, which can improve the angle adjustment accuracy of the worktable 1.

[0080] In one embodiment, Figure 1As shown, the wafer defect detection platform also includes a fixed frame 5, two transmission wheels 6, an annular transmission member 7 and a second rotation drive component 8. Specifically, the second rotation drive component 8 is a stepping motor; the annular transmission member 7 can be a belt, a chain or a transmission belt, etc., preferably a belt; the two guide rail columns 202 are fixedly connected to the fixed frame 5 by bolts, and the two lead screws 203 are coaxially connected to a transmission wheel 6 at one end close to the fixed frame 5, and the second rotation drive component 8 is transmission connected to any one of the transmission wheels 6, and the two transmission wheels 6 are transmission connected through the annular transmission member 7.

[0081] Specifically, the fixing frame 5 may have a closed outer skin, such as iron sheet, plastic plate, etc., to prevent dust.

[0082] In this embodiment, by fixing two lifting assemblies 2 on a fixed frame 5, the lead screws 203 in the two lifting assemblies 2 are connected by a ring transmission member 7 and driven by a second rotary drive assembly 8, the lead screws 203 in the two lifting assemblies 2 can be rotated in opposite directions, that is, the lifting end 201 of one lifting assembly 2 rises and the lifting end 201 of the other lifting assembly 2 descends synchronously, thereby quickly and accurately adjusting the angle of the stage 1.

[0083] In one embodiment, the wafer defect detection platform also includes a measuring instrument and a controller. The measuring instrument is used to measure the warpage of the wafer. Specifically, the measuring instrument can be a molding device, that is, an imaging device with the function of measuring the warpage of the wafer; the controller can be a module with data calculation and processing functions such as a single-chip microcomputer and a computer. The controller is connected to the measuring instrument and the second rotation drive component 8. The controller can send an action signal to the second rotation drive component 8 according to the measurement result of the measuring instrument.

[0084] During specific use, the measuring instrument detects the warping of the wafer and transmits it to the controller through electrical signals or wireless signals. The controller analyzes it and generates an action signal for the second rotating drive component 8 based on the operating parameters of the lifting component 2, and sends the action signal to the second rotating drive component 8. The second rotating drive component 8 receives the action signal and executes the action signal to achieve angle adjustment of the wafer on the stage 1.

[0085] In this embodiment, by providing a measuring instrument and a controller, the angle of the stage 1 can be adjusted automatically, thereby improving the automation and intelligence of the wafer defect detection stage.

[0086] The following embodiment illustrates the overall solution of this application.

[0087] Embodiment, on the one hand, provides a wafer defect detection stage, such as Figure 1As shown, it includes a loading platform 1, a lifting component 2, a connecting component 3, a first rotating drive component 4, a fixing frame 5, a transmission wheel 6, an annular transmission member 7 and a second rotating drive component 8; the specific scheme is as follows.

[0088] The stage 1 is used to carry wafers for testing. Specifically, the shape of the stage 1 can be any shape such as round, square, rectangular, etc., preferably round. A restriction surface such as a circular groove can be set on the stage 1 to limit the position of the wafer to prevent it from falling.

[0089] like Figure 1 As shown, two lifting assemblies 2 are provided, which are respectively located on both sides of the loading platform 1 along the first direction X, and each lifting assembly 2 is provided with a lifting end 201; specifically, the lifting end 201 on the lifting assembly 2 has the function of moving up and down, and there are many specific implementation methods, such as connecting ropes to the lifting ends 201, and moving the lifting ends 201 up and down by the lifting ropes, or other methods, as long as the up and down movement of the lifting ends 201 can be achieved.

[0090] like Figure 1 As shown, two connecting components 3 are provided. In one connecting component 3, the first end thereof is hinged to the lifting end 201 of one lifting component 2, and the second end thereof is hinged to one end of the loading platform 1 along the first direction X; in the other connecting component 3, the first end thereof is hinged to the lifting end 201 of another lifting component 2, and the second end thereof is hinged to the other end of the loading platform 1 along the first direction X; that is, the two connecting components 3 are respectively used to connect the lifting ends 201 of the two lifting components 2 with the two ends of the loading platform 1 along the first direction X.

[0091] Among them, at least one of the two connecting components 3 can be elastically extended and retracted along the second direction Y; at least one of the two connecting components 3 has its first end and second end capable of circumferentially limiting around the second direction Y, wherein the second direction Y is the direction from the first end of the connecting component 3 toward its second end.

[0092] It should be noted that the above “at least one of the two connecting components 3 can be elastically extended and retracted along the second direction Y” means that the connecting component 3 can be extended and retracted along the second direction Y and can be reset under the action of elastic force.

[0093] The above “its first end and the second end can be circumferentially limited around the second direction Y” means that the first end and the second end of the connecting component 3 cannot rotate relative to each other around the second direction Y to maintain the stability of the worktable 1 and prevent it from rotating around the second direction Y.

[0094] It should also be noted that if Figure 2As shown, the "second direction Y" is the direction from the first end to the second end of the connecting component 3; that is, each connecting component 3 has a second direction Y; generally speaking, the second directions Y of the two components are the same, because the first ends and the second ends of the two connecting components 3 are on a straight line.

[0095] The specific schemes of the two connecting components 3 can be: Scheme 1: one connecting component 3 is a connecting rod (cannot be extended or retracted), and the other connecting component 3 is a spring retractable component; Scheme 2: one connecting component 3 can be extended or retracted, and its first end and second end can be circumferentially limited around the second direction Y, and the other connecting component 3 is not limited; Scheme 3: both connecting components 3 can be extended or retracted, and their first end and second end can be circumferentially limited around the second direction Y; Scheme 3 is the preferred scheme.

[0096] More specifically, Figure 2 As shown, the connection component 3 includes at least two rigid parts 301 and an elastic telescopic part 302. The multiple rigid parts 301 are hinged in series in sequence, and the two ends of the elastic telescopic part 302 are respectively connected to the two rigid parts 301 so that the first end and the second end of the connection component 3 have a tendency to approach each other.

[0097] It should be explained that the rigid parts 301 are two parts whose shapes are difficult to change, such as connecting rods, chain links, etc. After multiple rigid parts 301 are hinged through the rotating shaft 103, they can only be folded, and the first end and the second end of the connecting component 3 will not rotate relative to each other around the second direction Y.

[0098] Specifically, the number of rigid members 301 may be 2 to 4, preferably 2. Figure 1 shown.

[0099] The elastic telescopic member 302 can be a spring or an elastic rubber with a certain amount of expansion and contraction, and the two ends of the elastic telescopic member 302 can be connected to any two of the multiple rigid members 301, so that the first end and the second end of the connecting component 3 tend to be relatively close.

[0100] More specifically, Figure 2 As shown, the number of rigid parts 301 in each connecting component 3 is two. Specifically, the rigid parts 301 can be metal rods or plastic rods with high deformation resistance, etc. The first ends of the two rigid parts 301 are hinged through the rotating shaft 103, and the part of one rigid part 301 away from its first end is connected to one end of the elastic telescopic part 302, and the part of the other rigid part 301 away from its first end is connected to the other end of the elastic telescopic part 302.

[0101] More specifically, Figure 1As shown, the wafer defect detection platform also includes a first rotation drive component 4, specifically, the first rotation drive component 4 is a motor, and specifically a stepping motor or the like; the stage 1 includes a stage body 101 and a turntable 102, the turntable 102 is located on the stage body 101, and is connected to the stage body 101, the turntable 102 is used to carry the wafer, and the turntable 102 can be rotatably connected to the rotating end of the first rotation drive component 4 to rotate relative to the stage body 101.

[0102] Specifically, the turntable 102 is connected to the stage body 101 by rotation and sliding to realize the rotation of the turntable 102; the turntable 102 can also be lifted and lowered to separate it from the stage body 101 to realize the rotation of the turntable 102.

[0103] In specific use, when the imaging device images a portion of the edge of the wafer and needs to image other parts of the wafer, the turntable 102 can be rotated at equal angles by controlling the first rotating drive component 4 to rotate at a certain angle, such as rotating at a fixed angle for the first time and rotating at a fixed angle again for the next time; the angle of each rotation can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150° and 180°.

[0104] To be more specific, a through hole is provided on the carrier body 101, and a rotating shaft 103 is provided on the surface of the turntable 102 close to the carrier body 101. The rotating shaft 103 passes through the through hole and is rotatably connected to the rotating end of the first rotating drive component 4. The rotating end of the first rotating drive component 4 can be rotatably connected to or separated from the rotating shaft 103.

[0105] Specifically, the rotating end of the first rotary drive component 4 can be rotatably connected or separated from the rotating shaft 103 , which can be achieved through a connecting piece with a telescopic function, or by lifting and lowering the first rotary drive component 4 as a whole.

[0106] More specifically, Figure 1 As shown, the first rotary drive component 4 includes a rotary component body 401 and an adapter 402. The adapter 402 can be extended and retracted along its axial direction. One end of the adapter 402 is fixedly connected to the rotating end of the rotary component body 401, and the other end of the adapter 402 is rotationally connected or separated from the rotating shaft 103 through extension and retraction.

[0107] Specifically, the adapter 402 may be a lifting bearing, or a rod that is retracted and extended by hydraulic pressure or pneumatic pressure.

[0108] To be more specific, a first cavity and a second cavity are provided in the turntable 102, a plurality of first adsorption holes are arranged at a portion of the turntable 102 for contacting with the wafer, and the plurality of first adsorption holes are all connected to the first cavity, a plurality of second adsorption holes are arranged at a portion of the turntable 102 for contacting with the carrier body 101, and the plurality of second adsorption holes are all connected to the second cavity, and the first cavity and the second cavity are both used to be connected to the vacuum extraction equipment.

[0109] Specifically, the number, diameter and arrangement of the first adsorption holes and the second adsorption holes can be selected and set according to actual needs.

[0110] It should be noted that the first adsorption hole can directly adsorb the wafer, or an adsorption plate can be embedded in the adsorption hole to adsorb the wafer. This solution has a better adsorption effect. Similarly, the second adsorption hole can directly adsorb the carrier body 101, or an adsorption plate can be embedded in the adsorption hole to be adsorbed and connected with the carrier body 101. This solution has a better adsorption effect.

[0111] More specifically, Figure 1 and Figure 3 As shown, the lifting assembly 2 includes a guide rail column 202, a lead screw 203 and a slider 204; a receiving cavity 2021 is arranged in the guide rail column 202 along its axial direction, that is, the guide rail column 202 can be directly made of a hollow steel pipe or a hollow pipe of other materials; a limiting groove is arranged on the outer wall surface of the guide rail column 202, the limiting groove extends along the axial direction of the guide rail column 202, and the limiting groove is connected with the receiving cavity 2021. Both ends of the lead screw 203 are rotatably arranged in the receiving cavity 2021 through bearings, and the axial direction of the lead screw 203 is parallel to or coincides with the axial direction of the guide rail column 202. One end of the slider 204 is located in the receiving cavity 2021 and is screwed to the lead screw 203 through a thread, and the other end of the slider 204 passes through the limiting groove and is located outside the guide rail column 202, and is hinged to the connecting assembly 3 through the rotating shaft 103.

[0112] More specifically, Figure 1 As shown, the wafer defect detection platform also includes a fixed frame 5, two transmission wheels 6, an annular transmission member 7 and a second rotation drive component 8. Specifically, the second rotation drive component 8 is a stepping motor; the annular transmission member 7 can be a belt, a chain or a transmission belt, etc., preferably a belt; the two guide rail columns 202 are fixedly connected to the fixed frame 5 by bolts, and the two lead screws 203 are coaxially connected to a transmission wheel 6 at one end close to the fixed frame 5, and the second rotation drive component 8 is transmission connected to any one of the transmission wheels 6, and the two transmission wheels 6 are transmission connected through the annular transmission member 7.

[0113] Specifically, the fixing frame 5 may have a closed outer skin, such as iron sheet, plastic plate, etc., to prevent dust.

[0114] To be more specific, the wafer defect detection platform also includes a measuring instrument and a controller. The measuring instrument is used to measure the warpage of the wafer. Specifically, the measuring instrument can be a molding device, that is, an imaging device with the function of measuring the warpage of the wafer; the controller can be a module with data calculation and processing functions such as a single-chip microcomputer and a computer. The controller is connected to the measuring instrument and the second rotation drive component 8, and the controller can send an action signal to the second rotation drive component 8 according to the measurement result of the measuring instrument.

[0115] In the specific use process, such as Figure 1 As shown, in the initial stage of use, the lifting ends 201 of the two lifting assemblies 2 are kept at the same horizontal height to keep the stage 1 horizontal, and then a wafer is placed on the stage 1 and inspected using an imaging device.

[0116] The measuring instrument detects the warpage of the wafer and transmits it to the controller through an electrical signal or a wireless signal. The controller analyzes it and generates an action signal for the second rotating drive component 8 based on the operating parameters of the lifting component 2, and sends the action signal to the second rotating drive component 8. The second rotating drive component 8 receives the action signal and executes the action signal to achieve angle adjustment of the wafer on the stage 1.

[0117] When the imaging device images a portion of the edge of the wafer and needs to image other parts of the wafer, the controller can be used to control the first rotation drive component 4 to rotate a certain angle to make the turntable 102 rotate at equal angle intervals, such as rotating a fixed angle for the first time and rotating a fixed angle again for the next time; the angle of each rotation can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150° and 180°.

[0118] According to an embodiment of the present application, on the other hand, a method for using the wafer defect detection stage in any one of the above embodiments is provided, such as Figure 1 As shown, including:

[0119] A wafer is placed on stage 1 .

[0120] The warpage of the wafer edge is measured by an imaging device; specifically, the imaging device may be a SEM imaging device.

[0121] According to the warping degree, the lifting end 201 in at least one lifting assembly 2 is controlled to rise or fall to adjust the angle of the stage 1 so that the depth of field of the imaging device when imaging the wafer edge is consistent.

[0122] Specifically, during use, the lifting end 201 of any one lifting assembly 2 can be controlled to move, or the lifting ends 201 of two lifting assemblies 2 can be controlled to move simultaneously to adjust the angle of the loading platform 1.

[0123] Beneficial effect: Since this method uses a wafer defect detection platform and has the same effect as a wafer defect detection platform, it will not be described in detail here.

[0124] Furthermore, the wafer defect detection platform also includes a first rotation drive component 4, specifically, the first rotation drive component 4 is a motor, and specifically a stepping motor, etc.; the stage 1 includes a stage body 101 and a turntable 102, the turntable 102 is located on the stage body 101, connected to the stage body 101, and the turntable 102 is used to carry the wafer.

[0125] A through hole is provided on the stage body 101 , and a rotating shaft 103 is provided on the surface of the turntable 102 close to the stage body 101 . The rotating shaft 103 passes through the through hole and is rotatably connected to the rotating end of the first rotating driving component 4 .

[0126] The first rotary drive assembly 4 includes a rotary assembly body 401 and an adapter 402. The adapter 402 can be extended and retracted along its axial direction. One end of the adapter 402 is fixedly connected to the rotating end of the rotary assembly body 401, and the other end of the adapter 402 is rotationally connected or separated from the rotating shaft 103 through extension and retraction.

[0127] In a specific use process, after the imaging device has imaged a portion of the edge of the wafer, when it is necessary to image other parts of the wafer, the adapter 402 is controlled to extend so that the turntable 102 rises and separates from the stage body 101 .

[0128] The first rotary drive assembly 4 is controlled to rotate at a certain angle to make the turntable 102 rotate at equal angle intervals, such as rotating at a fixed angle for the first time and rotating at a fixed angle again for the next time; the angle of each rotation can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150° and 180°.

[0129] The adapter 402 is controlled to shrink so that the turntable 102 fits the carrier body 101 .

[0130] The warpage of the wafer edge is measured again by an imaging device; specifically, the imaging device may be a SEM imaging device.

[0131] According to the warping degree, the lifting end 201 in at least one lifting assembly 2 is controlled to rise or fall to adjust the angle of the stage 1 so that the depth of field of the imaging device when imaging the wafer edge is consistent.

[0132] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A wafer defect detection stage, characterized in that: include: Stage (1); Two lifting assemblies (2) are respectively located on two sides of the loading platform (1) along the first direction (X), and each of the lifting assemblies (2) is provided with a lifting end (201); Two connecting assemblies (3) are provided, wherein a first end of one of the connecting assemblies (3) is hinged to the lifting end (201) of one of the lifting assemblies (2), and a second end of the connecting assemblies is hinged to one end of the loading platform (1) along the first direction (X); and a first end of the other connecting assemblies (3) is hinged to the lifting end (201) of another of the lifting assemblies (2), and a second end of the other end of the loading platform (1) along the first direction (X); At least one of the two connecting components (3) is capable of elastically extending and contracting along the second direction (Y); at least one of the two connecting components (3) has a first end and a second end that are capable of circumferentially limiting positions around the second direction (Y), wherein the second direction (Y) is the direction from the first end of the connecting component (3) toward the second end thereof.

2. The wafer defect detection stage according to claim 1, characterized in that: The connection assembly (3) comprises at least two rigid parts (301) and an elastic telescopic part (302), wherein the plurality of rigid parts (301) are hinged in series in sequence, and the two ends of the elastic telescopic part (302) are respectively connected to the two rigid parts (301), so that the first end and the second end of the connection assembly (3) have a tendency to approach each other.

3. The wafer defect detection stage according to claim 1 or 2, characterized in that: It also includes a first rotation drive component (4), the object platform (1) includes a platform body (101) and a turntable (102), the turntable (102) is located on the platform body (101) and is connected to the platform body (101), the turntable (102) is used to carry wafers, and the turntable (102) can be rotatably connected to the rotating end of the first rotation drive component (4) so ​​as to rotate relative to the platform body (101).

4. The wafer defect detection stage according to claim 3, characterized in that: The carrier body (101) is provided with a through hole, and the surface of the turntable (102) close to the carrier body (101) is provided with a rotating shaft (103), and the rotating shaft (103) passes through the through hole and is rotatably connected to the rotating end of the first rotating drive component (4), and the rotating end of the first rotating drive component (4) can be rotatably connected to or separated from the rotating shaft (103).

5. The wafer defect detection stage according to claim 4, characterized in that: The first rotating drive component (4) comprises a rotating component body (401) and an adapter (402), wherein the adapter (402) is capable of being telescopically extended along its axial direction, one end of the adapter (402) is fixedly connected to the rotating end of the rotating component body (401), and the other end of the adapter (402) is rotationally connected to or separated from the rotating shaft (103) through telescopic operation.

6. The wafer defect detection stage according to claim 3, characterized in that: A first cavity and a second cavity are arranged in the turntable (102); a plurality of first adsorption holes are arranged at a portion of the turntable (102) for contacting the wafer, and the plurality of first adsorption holes are all connected to the first cavity; a plurality of second adsorption holes are arranged at a portion of the turntable (102) for contacting the carrier body (101), and the plurality of second adsorption holes are all connected to the second cavity; the first cavity and the second cavity are both used to be connected to a vacuum extraction device.

7. The wafer defect detection stage according to claim 1 or 2, characterized in that: The lifting assembly (2) comprises: A guide rail column (202), wherein a receiving cavity (2021) is arranged in the guide rail column (202) along its axial direction, and a limiting groove is arranged on the outer wall surface of the guide rail column (202), wherein the limiting groove extends along the axial direction of the guide rail column (202), and the limiting groove is in communication with the receiving cavity (2021); A lead screw (203), the lead screw (203) being rotatably disposed in the accommodating cavity (2021), and the axial direction of the lead screw (203) being parallel to or coincident with the axial direction of the guide rail column (202); A slider (204), one end of which is located in the accommodating cavity (2021) and is threadedly connected to the lead screw (203), and the other end of which passes through the limiting groove and is located outside the guide rail column (202) and is hinged to the connecting component (3).

8. The wafer defect detection stage according to claim 7, characterized in that: The invention also comprises a fixed frame (5), two transmission wheels (6), an annular transmission member (7) and a second rotation drive assembly (8); the two guide rail columns (202) are connected to the fixed frame (5); one end of the two lead screws (203) close to the fixed frame (5) is coaxially connected to one of the transmission wheels (6); the second rotation drive assembly (8) is transmission-connected to any one of the transmission wheels (6); and the two transmission wheels (6) are transmission-connected via the annular transmission member (7).

9. The wafer defect detection stage according to claim 8, characterized in that: It also includes a measuring instrument and a controller, wherein the measuring instrument is used to measure the warpage of the wafer, and the controller is connected to the measuring instrument and the second rotation drive component (8), and the controller can send an action signal to the second rotation drive component (8) according to the measurement result of the measuring instrument.

10. A method for using the wafer defect detection stage according to any one of claims 1 to 9, characterized in that: include: Placing a wafer on a stage (1); Measure the warpage of the wafer edge; According to the degree of warping, a lifting end (201) in at least one lifting component (2) is controlled to rise or fall, so as to adjust the angle of the stage (1) so that the depth of field of the imaging device when imaging the edge of the wafer is consistent.

Images