Silicon wafer forming and cutting device for processing single crystal silicon wafers

Abstract

The invention relates to the technical field of single crystal silicon cutting, and discloses a silicon wafer forming and cutting device for single crystal silicon wafer processing, comprising a cutting unit including a rotating column, a cutting mechanism including an equidistant block, the equidistant block being a rectangular block with a hole in the middle, a total of five equidistant blocks, one side of each equidistant block is fixedly connected with a cutting knife, a sliding member is arranged at the center of the equidistant block near the top of a protective base, the inner ring of the sliding member is provided with a pattern matching the rotating column, a connecting rod is also arranged on the equidistant block, and the connecting rod is movably connected to the equidistant block, and a first fixing module and a second fixing module are arranged so that the single crystal silicon rod can be cut more smoothly, and the cutting precision of each single crystal silicon wafer is ensured to be consistent, the smoothness of the outer surface of the single crystal silicon rod is improved by arranging the first fixing module, and the uniform spacing distribution of the cutting knife is ensured to ensure the consistency of the thickness of the cut single crystal silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of single crystal silicon cutting, in particular to a silicon slice forming and cutting device for processing single crystal silicon slices. Background Art

[0002] As an important basic material, the demand for single crystal silicon wafers is growing. In the processing of single crystal silicon wafers, cutting is one of the key links, and the quality of cutting directly affects the performance and subsequent application of silicon wafers. Currently, the existing silicon wafer cutting devices have certain limitations in cutting accuracy, cutting efficiency, and damage control of silicon wafers, and it is difficult to meet the increasing production needs and quality standards. The purpose of the present invention is to provide a silicon wafer forming and cutting device for single crystal silicon wafer processing, which has a pre-grinding function and can clamp the single crystal silicon column, thereby improving the smoothness during cutting, and can cut the single crystal silicon column at equal intervals and in batches to improve cutting efficiency. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a silicon wafer forming and cutting device for processing single crystal silicon wafers.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a silicon wafer forming and cutting device for processing single crystal silicon wafers, comprising a motion unit, the motion unit comprising a moving guide rail, the moving guide rail is a long strip guide rail, the bottom of the moving guide rail is respectively fixedly connected to a first base and a second base, the top of the first base is fixedly connected to a fixing unit, the moving guide rail is sleeved with a cutting unit, the fixing unit comprises a first fixing module and a second fixing module, the first fixing module comprises a square plate, the square plate is a rectangular fixing plate, the square plate is fixedly connected to a clamping base plate, the The shape of the clamping base plate is "Ω", and a clamping base is connected to the clamping base plate, a clamping rod is movably sleeved between the clamping base and the clamping base plate, and three clamping rods are provided in total. A first movable pin and a second movable pin are also provided on the clamping base plate, a threaded rod is sleeved between the first movable pin and the second movable pin, a threaded column is provided on the threaded rod, a motor is provided on the threaded rod, a threaded sleeve matched with the threaded rod is provided on the first movable pin, a cylindrical pin is fixedly connected below the first movable pin and the second movable pin, and the first fixing module and the second fixing module have the same structure;

[0005] The cutting unit includes a rotating column, which passes through the protection base and is movably connected to both ends of the protection base. A raised thread is provided on the rotating column, and one end of the rotating column is connected to a motor. A fixed column is provided in the protection base. There are two fixed columns in total, and the two fixed columns are symmetrically distributed. A cutting mechanism is sleeved on the fixed column. The cutting mechanism includes an equidistant block, which is a rectangular block with a hole in the middle. There are five equidistant blocks in total, and a cutting knife is fixedly connected to one side of each equidistant block. A sliding member is provided at the center of the equidistant block near the top of the protection base, and the inner ring of the sliding member is provided with a pattern matching the rotating column. A connecting rod is also provided on the equidistant block, and the connecting rod is movably connected to the equidistant block. One end of the connecting rod on the equidistant block near the bottom of the motion unit is movably connected to the protection base.

[0006] Preferably, the fixing unit further comprises a fixing panel, a lower half of which is provided with a square hole, an upper half of which is fixedly connected to the first fixing module and the second fixing module, and a bottom of the fixing panel is fixedly connected to the first base.

[0007] Preferably, the clamping base plate includes a circular plate, a circular hole is opened at the center position of the circular plate, and a first set of bolts, a second set of bolts and a fourth set of bolts are fixedly connected on the circular plate. The first set of bolts, the second set of bolts and the fourth set of bolts have the same shape. A third set of bolts is arranged adjacent to the second set of bolts, and the third set of bolts is adapted to the cylindrical pin below the second movable pin.

[0008] Preferably, the clamping base includes a circular ring bottom, which is a circular ring column. A first rotating ring is fixedly connected to the top of the circular ring bottom. A rotating ear is fixedly connected to the outer ring of the first rotating ring, and the rotating ear is adapted to the cylindrical pin below the second movable pin. Three connecting columns are fixedly connected to the top of the first rotating ring, and a second rotating ring is fixedly connected to the top of the three connecting columns. The second rotating ring is provided with three evenly spaced circular holes.

[0009] Preferably, the clamping rod includes a clamping piece, a grinding disc is provided at one end of the clamping piece, the grinding disc is movably connected to the clamping piece, a driving motor is provided inside the grinding disc, the outer ring of the grinding disc is rough, a square sleeve is also sleeved on the clamping piece, a cylindrical pin is provided on the square sleeve, the cylindrical pin on the square sleeve is adapted to the circular hole opened on the second rotating ring, and a cylindrical pin is also fixedly connected to the other end of the clamping piece, and the cylindrical pins on the clamping piece are respectively sleeved with the first set of bolts, the second set of bolts and the fourth set of bolts.

[0010] Preferably, the protection base further includes an L-shaped plate, wherein two L-shaped plates are provided, and a back plate is fixedly provided between the two L-shaped plates.

[0011] Preferably, the cutting unit further comprises a guiding mechanism, the guiding mechanism is externally connected to a driving motor, the guiding mechanism is sleeved on a movable guide rail, and the guiding mechanism is adapted to the movable guide rail and can slide on the movable guide rail.

[0012] Preferably, the guiding mechanism comprises a connecting column, one end of which is fixedly connected to a speed change block, and the speed change block is sleeved on the movable guide rail.

[0013] Preferably, the cutting knife is made of diamond and has a sharp edge.

[0014] Compared with the prior art, the present invention provides a silicon wafer forming and cutting device for processing single crystal silicon wafers, which has the following beneficial effects:

[0015] 1. The silicon wafer forming and cutting device for processing single crystal silicon wafers is provided with a first fixing module and a second fixing module. Three clamping rods are provided in the first fixing module so that the clamping rods can perform a clamping movement on the single crystal silicon rod. The degree of clamping of the single crystal silicon rod by the first fixing module and the second fixing module is adjusted by adjusting the motor on the threaded rod, so that the single crystal silicon rod can be cut more smoothly, and uneven cutting of the single silicon wafer will not occur due to shaking or other conditions generated during the cutting process, thereby ensuring that the cutting accuracy of each single crystal silicon wafer is consistent and improving the cutting stability during the operation.

[0016] 2. The silicon wafer forming and cutting device for processing single crystal silicon wafers is provided with a first fixing module and a second fixing module. When the diameters of the two ends of the single crystal silicon rod to be cut are of unequal lengths, the motor on the threaded rod can be adjusted to adjust the different clamping degrees of the first fixing module and the second fixing module on the two ends of the single crystal silicon rod, so that single crystal silicon rods of uneven thickness can be cut more smoothly, thereby improving the cutting utilization rate of the single crystal silicon rods.

[0017] 3. The silicon wafer forming and cutting device for processing single crystal silicon wafers, when the single crystal silicon wafer is too thin, it is difficult to grind its outer ring alone. By arranging a motor in the grinding disc, the single crystal silicon rod can be pre-grinded before it is cut. When the outer surface of the single crystal silicon rod is rough and uneven, the grinding disc on the first fixed module can also be opened separately to grind the surface of the single crystal silicon rod to improve the smoothness of the outer surface of the single crystal silicon rod.

[0018] 4. The silicon wafer forming and cutting device for processing single crystal silicon wafers controls the travel speed of the guiding mechanism by adjusting the speed of the motor external to the guiding mechanism. When the single crystal silicon rod to be cut is difficult to cut, the travel speed of the guiding mechanism can be appropriately slowed down to ensure thorough cutting. When incomplete cutting occurs, the guiding mechanism can also be made to reciprocate to ensure that the single crystal silicon rod is completely cut.

[0019] 5. The silicon wafer forming and cutting device for processing single crystal silicon wafers satisfies the cutting thickness required for different single crystal silicon rods by setting the equidistant distribution of the cutting knives, and ensures the consistency of the thickness of the cut single crystal silicon wafers by setting the equidistant distribution of the cutting knives, thereby improving the consistency of the single crystal silicon wafer output.

[0020] 6. The silicon wafer forming and cutting device for processing single crystal silicon wafers can obtain multiple single crystal silicon wafers at one time by setting the cutting knives to be evenly spaced when the cutting knives cut the single crystal silicon rods, thereby improving the cutting efficiency of the single crystal silicon rods. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the overall back structure of the present invention;

[0023] Figure 3 It is a schematic diagram of the overall top view structure of the present invention;

[0024] Figure 4 It is a schematic diagram of the overall structure decomposition of the present invention;

[0025] Figure 5 This is a schematic structural diagram of the first fixing module of the present invention;

[0026] Figure 6 This is a schematic diagram of the structure decomposition of the first fixing module of the present invention;

[0027] Figure 7 This is a schematic diagram of the clamping base structure of the present invention;

[0028] Figure 8 This is a schematic diagram of the structure of the clamping rod of the present invention;

[0029] Fig. 9 This is a schematic diagram of the structure of the cutting unit of the present invention;

[0030] Fig.10 This is a schematic diagram of the structure decomposition of the cutting unit of the present invention;

[0031] Fig.11 It is a schematic diagram of the back structure of the cutting unit of the present invention.

[0032] In the figure: 100, fixing unit; 101, fixing panel; 102, first fixing module; 103, second fixing module; 104, square plate; 105, clamping base plate; 1051, first set of bolts; 1052, second set of bolts; 1053, third set of bolts; 1054, fourth set of bolts; 1055, round plate; 106, clamping base; 1061, circular ring bottom; 1062, rotating ear; 1063, first rotating ring; 1064, connecting column; 1065, second rotating ring; 107, clamping rod; 1071, clamping member; 1072, square sleeve; 1 073, grinding disc; 108, threaded rod; 109, first movable pin; 110, second movable pin; 200, moving unit; 201, first base; 202, moving guide rail; 203, second base; 300, cutting unit; 301, rotating column; 302, protective base; 3021, L-shaped plate; 3022, back plate; 3023, fixed column; 303, cutting mechanism; 3031, equidistant block; 3032, cutting knife; 3033, sliding member; 304, guiding mechanism; 3041, connecting rod; 3042, speed block; A, connecting rod. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Embodiment 1

[0035] See also Figure 1-Figure 5, a silicon wafer forming and cutting device for processing single crystal silicon wafers, comprising a motion unit 200, the motion unit 200 comprising a moving guide rail 202, the moving guide rail 202 being a long strip guide rail, the bottom of the moving guide rail 202 being respectively fixedly connected with a first base 201 and a second base 203, the top of the first base 201 being fixedly connected with a fixing unit 100, the moving guide rail 202 being sleeved with a cutting unit 300, the fixing unit 100 comprising a first fixing module 102 and a second fixing module 103, the first fixing module 102 comprising a square plate 104, the square plate 104 being a rectangular fixing plate, the square plate 104 being fixedly connected with a clamping base plate 105, the shape of the clamping base plate 105 being “ Ω”, a clamping base 106 is connected to the clamping base 105, a clamping rod 107 is movably sleeved between the clamping base 106 and the clamping base 105, and a total of three clamping rods 107 are provided. The clamping base 105 is also provided with a first movable pin 109 and a second movable pin 110, a threaded rod 108 is sleeved between the first movable pin 109 and the second movable pin 110, a threaded column is provided on the threaded rod 108, a motor is provided on the threaded rod 108, a threaded sleeve adapted to the threaded rod 108 is provided on the first movable pin 109, a cylindrical pin is fixedly connected below the first movable pin 109 and the second movable pin 110, and the first fixing module 102 and the second fixing module 103 have the same structure;

[0036] The cutting unit 300 includes a rotating column 301, which penetrates the protective base 302 and is movably connected to both ends of the protective base 302. The rotating column 301 is provided with a raised thread, and one end of the rotating column 301 is connected to a motor. A fixed column 3023 is provided in the protective base 302. There are two fixed columns 3023, which are symmetrically distributed. A cutting mechanism 303 is sleeved on the fixed column 3023. The cutting mechanism 303 includes an equidistant block 3031, which is a rectangular block with a hole in the middle. There are five equidistant blocks 3031 in total, and a cutting knife 3032 is fixedly connected to one side of each equidistant block 3031. A sliding member 3033 is arranged at the center of the equidistant block 3031 near the top of the protection base 302, and the inner ring of the sliding member 3033 is provided with a pattern matching the rotating column 301. A connecting rod A is also arranged on the equidistant block 3031, and the connecting rod A is movably connected to the equidistant block 3031. One end of the connecting rod A on the equidistant block 3031 near the bottom of the motion unit 200 is movably connected to the protection base 302.

[0037] By setting the first fixing module 102 and the second fixing module 103, when the diameters of the two ends of the single crystal silicon rod to be cut are not equal in length, the degree of clamping of the single crystal silicon rod by the first fixing module 102 and the second fixing module 103 can be adjusted by adjusting the motor on the threaded rod 108, so that the single crystal silicon rod can be cut more smoothly, thereby improving the cutting accuracy of the single crystal silicon rod and the stability during operation.

[0038] Embodiment 2

[0039] Based on the first embodiment, refer to Figure 4-Figure 8 The fixing unit 100 further includes a fixing panel 101, a square hole is opened in the lower half of the fixing panel 101, the upper half of the fixing panel 101 is fixedly connected to the first fixing module 102 and the second fixing module 103, and the bottom of the fixing panel 101 is fixedly connected to the first base 201.

[0040] The clamping base plate 105 includes a circular plate 1055, and a circular hole is opened at the center position of the circular plate 1055. A first set of bolts 1051, a second set of bolts 1052 and a fourth set of bolts 1054 are fixedly connected to the circular plate 1055. The first set of bolts 1051, the second set of bolts 1052 and the fourth set of bolts 1054 have the same shape. A third set of bolts 1053 is arranged adjacent to the second set of bolts 1052, and the third set of bolts 1053 is adapted to the cylindrical pin below the second movable pin 110.

[0041] The clamping base 106 includes a circular ring bottom 1061, which is a circular ring column. A first rotating ring 1063 is fixedly connected to the top of the circular ring bottom 1061. A rotating ear 1062 is fixedly connected to the outer ring of the first rotating ring 1063. The rotating ear 1062 is adapted to the cylindrical pin below the second movable pin 110. Three connecting columns 1064 are fixedly connected to the top of the first rotating ring 1063. A second rotating ring 1065 is fixedly connected to the top of the three connecting columns 1064. The second rotating ring 1065 is provided with three evenly spaced circular holes.

[0042] The clamping rod 107 includes a clamping piece 1071, one end of which is provided with a grinding disc 1073, and the grinding disc 1073 is movably connected to the clamping piece 1071. A driving motor is provided inside the grinding disc 1073, and the outer ring of the grinding disc 1073 is rough. A square sleeve 1072 is also sleeved on the clamping piece 1071, and a cylindrical pin is provided on the square sleeve 1072. The cylindrical pin on the square sleeve 1072 is adapted to the circular hole opened on the second rotating ring 1065. The other end of the clamping piece 1071 is also fixedly connected with a cylindrical pin, and the cylindrical pin on the clamping piece 1071 is respectively sleeved with the first set of bolts 1051, the second set of bolts 1052 and the fourth set of bolts 1054.

[0043] By setting the first fixing module 102 and the second fixing module 103, when the diameters of the two ends of the single crystal silicon rod to be cut are not equal in length, the clamping degree of the first fixing module 102 and the second fixing module 103 on the single crystal silicon rod can be adjusted by adjusting the motor on the threaded rod 108, so that the single crystal silicon rod can be cut more smoothly, and the cutting accuracy of the single crystal silicon rod and the stability during the operation are improved. At the same time, a motor is set in the grinding disc 1073. When the outer surface of the single crystal silicon rod is rough and uneven, the grinding disc 1073 on the first fixing module 102 can be turned on separately to grind the surface of the single crystal silicon rod to improve the smoothness of the outer surface of the single crystal silicon rod.

[0044] Implemented three

[0045] Based on the second embodiment, refer to Figure 9-11 The protection base 302 also includes an L-shaped plate 3021 , and two L-shaped plates 3021 are provided. A back plate 3022 is fixedly provided between the two L-shaped plates 3021 .

[0046] The cutting unit 300 further includes a guide mechanism 304 , which is externally connected to a driving motor. The guide mechanism 304 is sleeved on the movable guide rail 202 , and the guide mechanism 304 is adapted to the movable guide rail 202 and can slide on the movable guide rail 202 .

[0047] The guide mechanism 304 includes a connecting rod 3041 , one end of which is fixedly connected to a speed change block 3042 , and the speed change block 3042 is sleeved on the movable guide rail 202 .

[0048] The cutting knife 3032 is made of diamond, and the edge of the cutting knife 3032 is sharp.

[0049] By setting the connecting rod A, the equidistant blocks 3031 can make equidistant and variable distance movements until the distance between the equidistant blocks 3031 reaches the required cutting thickness. The motor on the rotating column 301 is turned off, and the motor on the guiding mechanism 304 is started. The travel speed of the guiding mechanism 304 is controlled by adjusting the motor speed. When the single crystal silicon rod to be cut is difficult to cut, the travel speed of the guiding mechanism 304 can be appropriately slowed down to ensure thorough cutting. When incomplete cutting occurs, the guiding mechanism 304 can also be made to reciprocate to ensure that the single crystal silicon rod is completely cut. By setting the equidistant distribution of the cutting knife 3032, the thickness of the single crystal silicon wafer cut is guaranteed to be consistent.

[0050] When in use, first put one end of the single crystal silicon column into the first fixing module 102 and the second fixing module 103. Taking the movement process of the first fixing module 102 as an example, the threaded rod 108 arranged in the first fixing module 102 is connected with a motor. When the motor is turned on, the threaded rod 108 starts to work. The threaded rod 108 is provided with a thread, and the thread drives the first movable pin 109 matched therewith to move. The first movable pin 109 slides on the threaded rod 108 along with the movement. A cylindrical pin is arranged below the first movable pin 109. The cylindrical pin below the first movable pin 109 is movably connected with the rotating ear 1062 on the clamping base 106. When the first movable pin 109 is in a state of being moved, the first movable pin 109 is in a state of being moved. When a movable pin 109 slides on the threaded rod 108, it drives the rotating ear 1062 movably connected thereto to rotate. The rotating ear 1062 is fixedly connected to the first rotating ring 1063. The first rotating ring 1063 starts to rotate along with the rotation of the rotating ear 1062. Three connecting columns 1064 are fixedly connected to the first rotating ring 1063, and the connecting column 1064 is fixedly connected to the second rotating ring 1065. When the first rotating ring 1063 rotates, the connecting column 1064 fixedly connected thereto also rotates accordingly. Similarly, the second rotating ring 1065 fixedly connected to the connecting column 1064 will also rotate along with the connecting column 1064.

[0051] In the previous step, the second rotating ring 1065 rotates, and a round hole adapted to the cylindrical pin on the square sleeve 1072 is opened on the second rotating ring 1065. Under the movement of the second rotating ring 1065, the square sleeve 1072 is driven to rotate, and the square sleeve 1072 is sleeved on the clamping member 1071. When the square sleeve 1072 rotates, the clamping member 1071 sleeved therewith will rotate. Since one end of the three clamping members 1071 is also provided with a cylindrical pin, and the three cylindrical pins are respectively sleeved with the first set bolt 1051, the second set bolt 1052 and the fourth set bolt 1054, when the three clamping members 1071 rotate, the first set bolt 1051, the second set bolt 1052 and the fourth set bolt 1054 will be respectively engaged. 052 and the fourth bolt 1054 are fixed point rotation, that is, the grinding disc 1073 movably connected with the clamping member 1071 is fixed point rotation, and the three grinding discs 1073 rotate simultaneously to clamp the single crystal silicon rods entering the first fixing module 102 and the second fixing module 103. By setting the first fixing module 102 and the second fixing module 103, when the diameters of the two ends of the single crystal silicon rod to be cut are not equal, the degree of clamping of the single crystal silicon rod by the first fixing module 102 and the second fixing module 103 can be adjusted by adjusting the motor on the threaded rod 108, so that the single crystal silicon rod can be cut more smoothly, and the cutting accuracy of the single crystal silicon rod and the stability during the operation are improved. At the same time, a motor is set in the grinding disc 1073. When the outer surface of the single crystal silicon rod is rough and uneven, the grinding disc 1073 on the first fixing module 102 can be opened separately to grind the surface of the single crystal silicon rod to improve the smoothness of the outer surface of the single crystal silicon rod.

[0052] When the first fixing module 102 and the second fixing module 103 are adjusted to a suitable tension, the cut part of the single crystal silicon rod reaches the cutting area. At this time, the motor connected to the rotating column 301 is turned on, and the rotating column 301 starts to rotate. The rotating column 301 is provided with a thread, which is adapted to the sliding piece 3033 provided on the equidistant block 3031. The equidistant block 3031 is sleeved on the fixed column 3023. Among the five equidistant blocks 3031, only the equidistant block 3031 close to the top of the protective base 302 is provided with a sliding piece 3033 adapted to the rotating column 301. When the rotating column 301 rotates, it drives the movement of the sliding piece 3033 adapted to the rotating column 301, and the sliding piece 3033 starts to move. By sleeved the equidistant block 3031 on the fixed column 3023, the sliding piece 3033 is moved. On the equidistant block 3031, the movement trajectory of the sliding member 3033 is converted into a linear motion on the rotating column 301, by movably connecting the connecting rod A on each equidistant block 3031, and movably connecting each connecting rod A, one end of the connecting rod A connected to the equidistant block 3031 close to the guiding mechanism 304 is fixedly connected to the L-shaped plate 3021, so that when the equidistant block 3031 provided with the sliding member 3033 performs linear motion, the connection relationship of the connecting rod A is utilized to cause the remaining four equidistant blocks 3031 to also start linear motion, and by providing the connecting rod A, the equidistant blocks 3031 perform equidistant variable distance motions, until the distance between the equidistant blocks 3031 reaches the required cutting thickness, the motor on the rotating column 301 is turned off, and the motor on the guiding mechanism 304 is started.

[0053] The guiding mechanism 304 starts to slide on the movable guide rail 202, and the cutting mechanism 303 fixedly connected to the guiding mechanism 304 slides along with the guiding mechanism 304. The cutting knife 3032 is fixedly connected to the equidistant block 3031, and the cutting knife 3032 touches the single crystal silicon rod and starts cutting. The travel speed of the guiding mechanism 304 is controlled by adjusting the motor speed. When the single crystal silicon rod to be cut is difficult to cut, the travel speed of the guiding mechanism 304 can be appropriately slowed down to ensure thorough cutting. When incomplete cutting occurs, the guiding mechanism 304 can also be made to reciprocate to ensure that the single crystal silicon rod is completely cut. By setting the equidistant distribution of the cutting knife 3032, the thickness of the cut single crystal silicon wafer is guaranteed to be consistent.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer forming and cutting device for processing single crystal silicon wafers, comprising a motion unit (200), the motion unit (200) comprising a moving guide rail (202), the moving guide rail (202) being a long strip-shaped guide rail, the bottom of the moving guide rail (202) being fixedly connected to a first base (201) and a second base (203), the top of the first base (201) being fixedly connected to a fixing unit (100), the moving guide rail (202) being sleeved with a cutting unit (300), characterized in that: The fixing unit (100) comprises a first fixing module (102) and a second fixing module (103), wherein the first fixing module (102) comprises a square plate (104), wherein the square plate (104) is a rectangular fixing plate, wherein a clamping base plate (105) is fixedly connected to the square plate (104), wherein the clamping base plate (105) is in the shape of "Ω", wherein a clamping base (106) is connected to the clamping base plate (105), wherein a clamping rod (107) is movably sleeved between the clamping base (106) and the clamping base plate (105), wherein three clamping rods (107) are provided in total, wherein the clamping base (106) is provided to the clamping base plate (105), ... The plate (105) is also provided with a first movable pin (109) and a second movable pin (110), a threaded rod (108) is sleeved between the first movable pin (109) and the second movable pin (110), a threaded column is provided on the threaded rod (108), a motor is provided on the threaded rod (108), a threaded sleeve matched with the threaded rod (108) is provided on the first movable pin (109), a cylindrical pin is fixedly connected below the first movable pin (109) and the second movable pin (110), and the first fixing module (102) and the second fixing module (103) have the same structure; The cutting unit (300) comprises a rotating column (301), the rotating column (301) passes through the protective base (302) and is movably connected to both ends of the protective base (302), a raised thread is arranged on the rotating column (301), one end of the rotating column (301) is connected to a motor, a fixed column (3023) is arranged in the protective base (302), there are two fixed columns (3023), the two fixed columns (3023) are symmetrically distributed, a cutting mechanism (303) is sleeved on the fixed column (3023), and the cutting mechanism (303) comprises an equidistant block (3031), and the equidistant block (3031) is a rectangular block with a hole in the middle. The equidistant blocks (3031) are provided with five equidistant blocks (3031), one side of each equidistant block (3031) is fixedly connected with a cutting knife (3032), a sliding member (3033) is provided at the center of the equidistant block (3031) near the top of the protection base (302), the inner ring of the sliding member (3033) is provided with a pattern matching the rotating column (301), and a connecting rod (A) is also provided on the equidistant block (3031), and the connecting rod (A) is movably connected to the equidistant block (3031), and one end of the connecting rod (A) on the equidistant block (3031) near the bottom of the motion unit (200) is movably connected to the protection base (302).

2. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The fixing unit (100) further comprises a fixing panel (101), wherein a square hole is provided in the lower half of the fixing panel (101), the upper half of the fixing panel (101) is fixedly connected to the first fixing module (102) and the second fixing module (103), and the bottom of the fixing panel (101) is fixedly connected to the first base (201).

3. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The clamping base plate (105) comprises a circular plate (1055), a circular hole is provided at the center of the circular plate (1055), a first set of bolts (1051), a second set of bolts (1052) and a fourth set of bolts (1054) are fixedly connected to the circular plate (1055), the first set of bolts (1051), the second set of bolts (1052) and the fourth set of bolts (1054) have the same shape, a third set of bolts (1053) is provided adjacent to the second set of bolts (1052), and the third set of bolts (1053) is adapted to the cylindrical pin below the second movable pin (110).

4. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The clamping base (106) includes a circular ring bottom (1061), which is a circular ring column. A first rotating ring (1063) is fixedly connected to the top of the circular ring bottom (1061). The outer ring of the first rotating ring (1063) is fixedly connected to a rotating ear (1062), and the rotating ear (1062) is adapted to the cylindrical pin below the second movable pin (110). Three connecting columns (1064) are fixedly connected to the top of the first rotating ring (1063). A second rotating ring (1065) is fixedly connected to the top of the three connecting columns (1064), and the second rotating ring (1065) is provided with three circular holes evenly spaced.

5. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The clamping rod (107) comprises a clamping piece (1071), one end of which is provided with a grinding disc (1073), the grinding disc (1073) being movably connected to the clamping piece (1071), the interior of which is provided with a driving motor, the outer ring of which is rough, the clamping piece (1071) is also sleeved with a square sleeve (1072), the square sleeve (1072) is provided with a cylindrical pin, the cylindrical pin on the square sleeve (1072) is adapted to the circular hole provided on the second rotating ring (1065), the other end of the clamping piece (1071) is also fixedly connected with a cylindrical pin, the cylindrical pin on the clamping piece (1071) is sleeved with the first sleeve bolt (1051), the second sleeve bolt (1052) and the fourth sleeve bolt (1054) respectively.

6. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The protection base (302) further comprises an L-shaped plate (3021), wherein two L-shaped plates (3021) are provided in total, and a back plate (3022) is fixedly provided between the two L-shaped plates (3021).

7. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The cutting unit (300) further comprises a guiding mechanism (304), the guiding mechanism (304) being externally connected to a driving motor, the guiding mechanism (304) being sleeved on the movable guide rail (202), and the guiding mechanism (304) being adapted to the movable guide rail (202) and being able to slide on the movable guide rail (202).

8. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 7, characterized in that: The guiding mechanism (304) comprises a connecting rod (3041), one end of which is fixedly connected to a speed change block (3042), and the speed change block (3042) is sleeved on the movable guide rail (202).

9. The silicon wafer forming and cutting device for processing single crystal silicon wafers according to claim 1, characterized in that: The cutting knife (3032) is made of diamond, and the edge of the cutting knife (3032) is sharp.

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