Side glue filling device and method of electrostatic chuck

Abstract

The present invention discloses a device and method for filling glue on the side of an electrostatic chuck, the device comprising: an annular jig, which is sleeved on the side wall of the electrostatic chuck, the annular jig is provided with two through holes at intervals, the positions of the through holes correspond to the bonding layer of the electrostatic chuck; two conduits, both connected to the annular jig, and the two conduits correspond to the two through holes one by one, respectively, and any one of the two conduits is connected to an external glue filling tool to fill the bonding layer with glue. The present invention can achieve one-time filling and molding of the side filling by arranging the annular jig and the conduit, the glue layer is tightly bonded to the bonding interface, and the fixed-point repair and regeneration of the aging and corroded parts of the bonding layer can be achieved, without cutting the entire glue layer, and without any post-processing steps for the repaired glue layer, thereby reducing the renovation and regeneration cost of the electrostatic chuck.

Description

Technical Field

[0001] The present invention relates to the technical field of electrostatic chucks, and in particular to a side glue filling device and method for an electrostatic chuck. Background Art

[0002] The adsorption surface of the electrostatic chuck (ESC) can be bonded to the metal base support through a bonding layer such as glue. The bonding layer also serves as a temperature conduction channel to transfer the temperature of the adsorption surface to the metal base in a timely manner. As the wafer process develops towards higher RF power, the plasma process gas generated by high-power RF corrodes and degrades the glue of the ESC bonding layer more and more seriously, causing local aging and peeling of the bonding layer at an early stage. This aging and peeling can cause problems such as uneven temperature on the wafer surface and particle contamination from fragments of the bonding layer adhesion layer, which seriously shortens the service life of the electrostatic chuck. Among them, the outer ring glue layer of the bonding layer is corroded by the corrosive process gas first and ages and peels off.

[0003] In the prior art, the life of the electrostatic chuck caused by aging and corrosion of the bonding layer glue is usually regenerated by cutting the adsorption surface and the metal base, re-coating glue and then bonding. However, cutting the bonding layer is easy to damage the electrode connection parts, and the process of cutting the bonding layer and re-coating glue is cumbersome and has low work efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a side glue filling device and method for an electrostatic chuck. The purpose is to solve the problem that in the prior art of treating an electrostatic chuck with an aged or corroded bonding layer, cutting the bonding layer easily damages the electrode connection components, the process is relatively cumbersome, and the work efficiency is low, and local fixed-point repair is achieved for the aged or corroded parts of the bonding layer.

[0005] To achieve the above object, the present invention is implemented through the following technical solutions:

[0006] In one aspect, the present invention provides a side glue filling device for an electrostatic chuck, comprising:

[0007] An annular fixture is sleeved on the side wall of the electrostatic chuck, and two through holes are provided on the annular fixture at intervals, and the positions of the through holes correspond to the bonding layer of the electrostatic chuck;

[0008] The two conduits are both connected to the annular fixture, and the two conduits correspond to the two through holes one by one, respectively. Any one of the two conduits is connected to an external glue filling tool to fill the bonding layer with glue.

[0009] Preferably, the cross-section of the annular fixture is rectangular.

[0010] Preferably, the cross-section of the ring-shaped fixture is in a "ji" shape, the middle part of the ring-shaped fixture is concave inward, both sides of the ring-shaped fixture are straight, and both sides of the ring-shaped fixture are respectively attached to the ceramic outer side surface of the electrostatic chuck and the side wall of the metal base.

[0011] Preferably, the two conduits are respectively any one of a straight tube type and an L type.

[0012] Preferably, any one of the two conduits is in an L type.

[0013] Preferably, it further includes: a locking mechanism. The ring-shaped fixture is an annular structure with an opening. The locking mechanism is sleeved at the opening of the ring-shaped fixture, adjusts the ring-shaped fixture according to the outer diameter of the electrostatic chuck, and is used for sealing the opening of the ring-shaped fixture.

[0014] On the other hand, the present invention also provides a method for filling glue on the side of an electrostatic chuck, which is realized by using the above-mentioned side glue filling device for the electrostatic chuck. The method includes:

[0015] Step S1: Clean the side of the bonding layer of the electrostatic chuck to be filled with glue.

[0016] Step S2: Sleeve the ring-shaped fixture on the side wall of the electrostatic chuck, lock the ring-shaped fixture, connect an external glue filling tool to one of the two conduits, and use the external glue filling tool to fill glue into the bonding layer and heat it for curing and forming.

[0017] Step S3: Remove the ring-shaped fixture to complete the glue filling and repair of the bonding layer.

[0018] Preferably, step S1 further includes: placing the electrostatic chuck vertically or horizontally.

[0019] Preferably, any one of the two conduits is in an L type. The method includes: using the conduit in the L type as the discharge port, and connecting the other one of the two conduits to an external glue filling tool.

[0020] Preferably, both of the two conduits are in a straight tube type. The method includes: placing the electrostatic chuck vertically, and both conduits are vertically arranged, and connecting an external glue filling tool to the lower one of the two conduits.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention provides a device and method for filling glue on the side of an electrostatic chuck. The device can achieve one-time filling and molding of the side glue by arranging a ring-shaped fixture and a conduit. The glue layer is tightly bonded to the bonding interface, and the fixed-point repair and regeneration of the aged and corroded parts of the bonding layer can be achieved. There is no need to cut the entire glue layer, and no need to perform any post-processing steps on the repaired glue layer, which reduces the renovation and regeneration cost of the electrostatic chuck and speeds up the renovation efficiency of the electrostatic chuck. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0024] Figure 1 A schematic diagram of the structure of a side glue filling device of an electrostatic chuck provided in one embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the side glue filling process of the electrostatic chuck provided in the first embodiment of the present invention;

[0026] Figure 3 A schematic diagram of the side glue filling of the electrostatic chuck provided in the second embodiment of the present invention;

[0027] Figure 4 A schematic diagram of the side glue filling of the electrostatic chuck provided in the third embodiment of the present invention;

[0028] Figure 5 A schematic diagram of the structure of an L-shaped catheter provided by an embodiment of the present invention;

[0029] Figure 6 A schematic structural diagram of a ring-shaped fixture with a rectangular cross section provided by an embodiment of the present invention;

[0030] Figure 7 A schematic structural diagram of a ring-shaped fixture with a “J”-shaped cross section provided in one embodiment of the present invention.

[0031] Explanation of the reference numerals: 1-electrostatic suction cup; 2-annular fixture; 3-conduit; 4-external glue filling tool; 5-locking mechanism, 201-through hole. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-7The following description and specific embodiments will further elaborate on the side glue filling device and method of the electrostatic chuck proposed by the present invention. According to the following description, the advantages and features of the present invention will become clearer. It should be noted that the drawings are in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features, and advantages of the present invention more obvious and understandable, please refer to the drawings. It should be noted that the structures, scales, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical substance significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that the present invention can produce and the purpose that can be achieved, should still fall within the scope covered by the technical content disclosed by the present invention.

[0033] On the one hand, as shown in Figure 1 this embodiment provides a side glue filling device for an electrostatic chuck, including: a circular fixture 2 sleeved on the side wall of the electrostatic chuck 1, and two through holes 201 are spaced apart on the circular fixture 2. The positions of the through holes 201 correspond to the bonding layers of the electrostatic chuck 1; two conduits 3 are both connected to the circular fixture 2, and the two conduits 3 respectively correspond to the two through holes 201 one by one. Any one of the two conduits 3 is connected to an external glue filling tool 4, and the two conduits 3 respectively serve as the inlet and outlet of the external glue filling tool 4 to fill the bonding layer. A locking mechanism 5, the circular fixture 2 is an annular structure with an opening, and the locking mechanism 5 is sleeved at the opening of the circular fixture 2 to adjust the circular fixture 2 according to the outer diameter of the electrostatic chuck 1 and is used for sealing the opening of the circular fixture 2. The cross-section of the circular fixture 2 is any one of a rectangle and a "J" shape.

[0034] Specifically, the two conduits 3 are respectively any one of a straight tube type and an L type.

[0035] On the other hand, this embodiment also provides a side glue filling method for an electrostatic chuck, which is implemented by using the above-mentioned side glue filling device for an electrostatic chuck. The method includes:

[0036] Step S1: Clean the side of the bonding layer of the electrostatic chuck to be filled with glue, and place the electrostatic chuck 1 vertically or horizontally.

[0037] Step S2: The annular fixture 2 is mounted on the side wall of the electrostatic suction cup 1, and the inner side of the annular fixture 2 is tightly fitted with the outer side of the ceramic, the outer side of the metal base, and the outer side of the bonding layer by using the locking mechanism 5. The external glue filling tool 4 is connected to one of the two conduits 3, and the glue is filled into the bonding layer by using the external glue filling tool 4, and heated and cured to form.

[0038] Step S3: disassembling the annular fixture 2 to complete the glue filling and repair of the bonding layer.

[0039] Any one of the two conduits 3 is L-shaped, and the method comprises: connecting an external glue filling tool 4 to the L-shaped conduit 3 .

[0040] The two conduits 3 are both straight-cylindrical, and the method comprises: placing the electrostatic chuck 1 vertically, and the two conduits 3 are both vertically arranged, and the external glue filling tool 4 is connected to the lower one of the two conduits 3 .

[0041] The following is an introduction to the side glue filling device and method of the electrostatic chuck using a specific embodiment:

[0042] Embodiment 1

[0043] The present embodiment provides a side glue filling device for an electrostatic chuck, comprising: an annular fixture 2, which is sleeved on the side wall of the electrostatic chuck 1, and two through holes 201 are symmetrically opened on the annular fixture 2, and the positions of the through holes 201 correspond to the bonding layer of the electrostatic chuck 1; two conduits 3, both connected to the annular fixture 2, and the two conduits 3 correspond to the two through holes 201 one by one, and any one of the two conduits 3 is connected to an external glue filling tool 4 to fill the bonding layer. A locking mechanism 5, the annular fixture 2 is an annular structure with an opening, and the locking mechanism 5 is sleeved at the opening of the annular fixture 2, and the annular fixture 2 is adjusted according to the outer diameter of the electrostatic chuck 1, and is used for sealing the opening of the annular fixture 2. The two conduits 3 are both straight-cylindrical, and the cross-section of the annular fixture 2 is rectangular. The external glue filling tool 4 is connected to one of the conduits 3 located below.

[0044] The side glue filling method of the electrostatic chuck in this embodiment is as follows: Figure 2 As shown, including:

[0045] Step S1: Prepare the electrostatic chuck 1 to be repaired and clean the aged and corroded adhesive layer. Figure 2 (a) is a schematic diagram of placing the electrostatic chuck 1 of the glue to be repaired, and the electrostatic chuck 1 of the glue to be repaired is placed vertically.

[0046] Step S2: Reference Figure 2(b) is a schematic diagram of the side glue filling process of the electrostatic chuck, in which the annular fixture 2 is mounted on the side wall of the electrostatic chuck 1, and the locking mechanism 5 is used to lock and seal, so that a sealed space is formed between the outer side surface of the ceramic and the upper outer side surface of the metal base. Under the action of pressure F, the external glue filling tool 4 slowly squeezes the glue into the sealed space. When glue overflows from the conduit 3 located on the upper side, the external glue filling tool 4 stops squeezing the glue and heats and cures the side glue filling of the electrostatic chuck.

[0047] Step S3: Reference Figure 2 (c) is a schematic diagram of the electrostatic chuck 1 after glue repair, and the annular fixture 2 is disassembled to complete the side glue repair.

[0048] Embodiment 2

[0049] The present embodiment provides a side glue filling device for an electrostatic suction cup, comprising: an annular jig 2, which is sleeved on the side wall of the electrostatic suction cup 1, and two through holes 201 are symmetrically provided on the annular jig 2, and the positions of the through holes 201 correspond to the bonding layer of the electrostatic suction cup 1; two conduits 3, both connected to the annular jig 2, and the two conduits 3 correspond one-to-one to the two through holes 201, respectively, and any one of the two conduits 3 is connected to an external glue filling tool 4 to fill the bonding layer with glue. A locking mechanism 5, the annular jig 2 is an annular structure with an opening, and the locking mechanism 5 is sleeved on the opening of the annular jig 2, and the annular jig 2 is adjusted according to the outer diameter of the electrostatic suction cup 1, and is used for sealing the opening of the annular jig 2. The cross-section of the annular jig 2 is rectangular, and specific reference is made to FIG. Figure 6 As shown. Any one of the two conduits 3 is L-shaped, and the structure of the conduit 3 is as shown in FIG. Figure 5 As shown, the L-shaped conduit 3 serves as a discharge port (reference Figure 5 As shown), another catheter 3 of the two catheters (this catheter can be L-shaped or straight, Figure 5 The other one of the two catheters (3) is a straight-tube catheter) connected to an external glue filling tool (4).

[0050] The side glue filling method of the electrostatic chuck in this embodiment is as follows: Figure 3 and Figure 5 As shown, including:

[0051] Step S1: Prepare the electrostatic chuck 1 to be repaired and clean the aged and corroded adhesive layer. Figure 3 The schematic diagram of filling the electrostatic chuck 1 horizontally is shown, and the electrostatic chuck 1 to be filled with glue is placed horizontally.

[0052] Step S2: Place the ring fixture 2 on the side wall of the electrostatic chuck 1 and lock and seal it using the locking mechanism 5 to form a sealed space between the outer side of the ceramic and the outer side of the upper part of the metal base. The L-shaped conduit 3 serves as the discharge port, and the external caulking tool 4 is connected to the other conduit 3 of the two conduits (this conduit 3 can be L-shaped or straight cylindrical). Refer to Figure 5 as shown in Figure 5 Figure 5 , if the other conduit 3 of the two conduits 3 is selected as a straight cylindrical conduit 3, then the external caulking tool 4 is connected to the straight cylindrical conduit 3. Under the action of the pressure F, the external caulking tool 4 slowly squeezes the glue into the sealed space. When glue overflows from the L-shaped conduit 3, the external caulking tool 4 stops squeezing the glue and heats and cures the caulking area on the side of the electrostatic chuck. In this embodiment, targeted glue filling can also be performed on the locally corroded and aged bonding layer.

[0053] Step S3: Refer to Figure 3 as shown in

[0054] Embodiment III

[0055] This embodiment provides a side caulking device for an electrostatic chuck, including: a ring fixture 2 sleeved on the side wall of the electrostatic chuck 1. Two through holes 201 are symmetrically arranged on the ring fixture 2, and the positions of the through holes 201 correspond to the bonding layers of the electrostatic chuck 1. Two conduits 3 are both connected to the ring fixture 2, and the two conduits 3 respectively correspond to the two through holes 201 one by one. Any one of the two conduits 3 is connected to an external caulking tool 4 to caulk the bonding layer. A locking mechanism 5. The ring fixture 2 is an annular structure with an opening. The locking mechanism 5 is sleeved at the opening of the ring fixture 2 to adjust the ring fixture 2 according to the outer diameter of the electrostatic chuck 1 and is used for sealing the opening of the ring fixture 2. The cross-section of the ring fixture 2 is in a "several" shape. Specifically, refer to Figure 7 as shown in Figure 7 . The middle part of the ring fixture 2 is recessed inward. The two sides of the ring fixture 2 are straight, and the two sides of the ring fixture 2 are respectively attached to the outer ceramic side of the electrostatic chuck 1 and the side wall of the metal base. Any one of the two conduits 3 is L-shaped, and the L-shaped conduit 3 serves as the discharge port. The other conduit 3 of the two conduits is connected to the external caulking tool 4.

[0056] The side caulking method of the electrostatic chuck in this embodiment, refer to Figure 4 as shown in

[0057] Step S1: Prepare the electrostatic chuck 1 to be repaired and clean the aged and corroded glue layer. Refer to Figure 4The schematic diagram of filling the electrostatic chuck 1 horizontally is shown, and the electrostatic chuck 1 to be filled with glue is placed horizontally.

[0058] Step S2: The annular fixture 2 is mounted on the side wall of the electrostatic suction cup 1, and the locking mechanism 5 is used to lock and seal, so as to form a sealed space between the outer side surface of the ceramic and the outer side surface of the upper part of the metal base. The L-shaped conduit 3 is used as a discharge port, and the external glue filling tool 4 is connected to the other conduit 3 of the two conduits 3 (this conduit 3 can be L-shaped or straight-cylindrical). Under the action of pressure F, the external glue filling tool 4 slowly squeezes the glue into the sealed space. When glue overflows from the L-shaped conduit 3, the external glue filling tool 4 stops squeezing the glue, and heats and cures the glue filling on the side of the electrostatic suction cup.

[0059] Step S3: Reference Figure 4 As shown, the annular fixture 2 is disassembled to complete the side filling and repair. After the side filling and repair, a sealing ring is sleeved on the outer groove of the bonding layer so that the outer diameter of the bonding layer is consistent with the outer surface of the ceramic.

[0060] The side glue filling device and method of the electrostatic chuck in the above-mentioned embodiment 1 is a preferred technical solution of this embodiment.

[0061] In summary, this embodiment proposes a side glue filling device and method for an electrostatic suction cup, which can realize one-time filling and molding of the side glue filling, and the glue layer is tightly bonded to the bonding interface, so as to realize the fixed-point repair and regeneration of the aged and corroded parts of the bonding layer. There is no need to cut the entire glue layer, nor to perform any post-processing steps on the repaired glue layer, which reduces the refurbishment and regeneration cost of the electrostatic suction cup and speeds up the refurbishment efficiency of the electrostatic suction cup.

[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0063] It should be noted that the devices and methods disclosed in the embodiments of this article can also be implemented in other ways. The device implementation described above is only schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of this article. In this regard, each box in the flowchart or block diagram can represent a part of a module, program or code, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical function, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented by a dedicated hardware-based system for performing a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0064] In addition, the functional modules in the various embodiments of this document may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0065] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A side glue filling device for an electrostatic chuck, characterized in that: Comprising: A circular fixture, which is sleeved on the side wall of the electrostatic chuck. Two through holes are spaced apart on the circular fixture, and the positions of the through holes correspond to the bonding layers of the electrostatic chuck; Two conduits, both of which are connected to the circular fixture, and the two conduits respectively correspond to the two through holes one by one. Any one of the two conduits is connected to an external glue filling tool to fill glue into the bonding layer.

2. The side glue filling device of the electrostatic chuck according to claim 1, characterized in that: The cross-section of the circular fixture is rectangular.

3. The side glue filling device of the electrostatic chuck according to claim 1, characterized in that: The cross-section of the circular fixture is in a "ji" shape. The middle part of the circular fixture is recessed inward. The two sides of the circular fixture are straight, and the two sides of the circular fixture are respectively attached to the ceramic outer side surface and the side wall of the metal base of the electrostatic chuck.

4. The side glue filling device of the electrostatic chuck according to claim 1, characterized in that: Any one of the two conduits is in any one of a straight tube type and an L type.

5. The side glue filling device of the electrostatic chuck according to claim 4, characterized in that: Any one of the two conduits is in an L type.

6. The side glue filling device of the electrostatic chuck according to claim 1, characterized in that: Further comprising: A locking mechanism. The circular fixture is an annular structure with an opening. The locking mechanism is sleeved at the opening of the circular fixture, adjusts the circular fixture according to the outer diameter of the electrostatic chuck, and is used for sealing the opening of the circular fixture.

7. A method for filling the side of an electrostatic chuck with glue, characterized in that: It is realized by using the side glue filling device of the electrostatic chuck according to any one of claims 1-6. The method comprises: Step S1: Clean the side of the bonding layer of the electrostatic chuck to be repaired with glue; Step S2: Sleeve the circular fixture on the side wall of the electrostatic chuck, lock the circular fixture, connect an external glue filling tool to one of the two conduits, and use the external glue filling tool to fill glue into the bonding layer and heat it for curing and forming; Step S3: Dismantle the circular fixture to complete the glue filling and repair of the bonding layer.

8. The method for filling the side of an electrostatic chuck according to claim 7, wherein: Step S1 further comprises: placing the electrostatic chuck vertically or horizontally.

9. The method for filling the side of an electrostatic chuck according to claim 8, wherein: Any one of the two conduits is in an L type. The method comprises: using the conduit in the L type as the discharge port, and connecting the other one of the two conduits to an external glue filling tool.

10. The method for filling the side of an electrostatic chuck according to claim 8, wherein: Both of the two conduits are in a straight tube type. The method comprises: placing the electrostatic chuck vertically, and arranging both of the two conduits vertically. Connect an external glue filling tool to one of the two conduits located below.

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