Wafer box drying device and wafer box processing equipment

Abstract

The invention relates to a wafer box drying device and wafer box processing equipment. Comprising a box body provided with a first opening formed in one end of a first direction; the box cover covers the first opening, so that a containing cavity is defined by the box cover and the box body; the accommodating cavity is used for accommodating the separated box body and box cover; wherein under the dry condition, the containing cavity is in a vacuum environment, the box cover is detachably fixed to the inner wall of the box cover, the outer surface of the box cover faces the inner wall of the box cover, and the box body is placed on any inner wall of the box body and is separated from the box cover; the heating assembly comprises a first heating piece and a second heating piece, the radiation range of the first heating piece at least can cover the inner surface of the box body so as to dry the box body, and the radiation range of the second heating piece can cover the inner surface of the box cover so as to dry the box cover. According to the technical scheme, the cleanliness and dryness of the box cover can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a wafer box drying device and a wafer box processing equipment. Background Art

[0002] Wafer boxes are mainly used to place and transport wafers in semiconductor production. In order to simplify transportation and minimize the risk of contamination, chip manufacturers use wafer boxes to transport and store wafers. Therefore, wafer boxes need to be processed, including cleaning, after each use.

[0003] The wafer box processing process includes loading, cleaning, drying, unloading, etc. In the prior art, the drying speed and drying effect of the wafer box drying device after cleaning cannot meet the needs of use, and improvement is urgently needed. Summary of the invention

[0004] In view of this, the present application provides a wafer box drying device and a wafer box processing equipment to solve at least one problem existing in the background technology.

[0005] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a wafer box drying device, wherein the wafer box comprises a box body and a box cover, and the wafer box drying device comprises:

[0007] The box body has a first opening opened at one end in a first direction;

[0008] A box cover is covered on the first opening to form a receiving cavity with the box body; the receiving cavity is used to receive the box body and the box cover after separation; wherein, in a dry state, the receiving cavity is a vacuum environment, the box cover is detachably fixed to the inner wall of the box cover, the outer surface of the box cover is arranged toward the inner wall of the box cover, the box body is placed on any inner wall of the box body, and is separated from the box cover;

[0009] The heating assembly includes a first heating element and a second heating element, wherein the radiation range of the first heating element can at least cover the inner surface of the box body to dry the box body, and the radiation range of the second heating element can cover the inner surface of the box cover to dry the box cover.

[0010] In combination with the first aspect of the present application, in an optional embodiment, at least two second heating elements are provided, and at least one second heating element is provided on each side of the box cover.

[0011] In combination with the first aspect of the present application, in an optional implementation manner, the radiation range of any one of the second heating elements covers at least half of the surface area of ​​the box cover.

[0012] In combination with the first aspect of the present application, in an optional implementation, the wafer box drying device further includes two control components that are communicatively connected to the first heating element and the second heating element respectively.

[0013] In combination with the first aspect of the present application, in an optional embodiment, the second heating element is arranged on the first box body side walls on both sides of the box cover; the orthographic projection of the box cover on the first box body side walls has no overlap with the second heating element.

[0014] In combination with the first aspect of the present application, in an optional embodiment, the second heating element has a radiation surface, which is a concave arc surface, so that at least half of the heat radiation of the second heating element radiates to the box cover, and the other part radiates to the outer surface of the box body.

[0015] In combination with the first aspect of the present application, in an optional embodiment, the second heating element has a radiation surface; the radiation surface is inclined toward the box cover, and there is an angle between the radiation surface and the inner wall surface of the box where the second heating element is located; the angle is 15 degrees to 30 degrees.

[0016] In combination with the first aspect of the present application, in an optional embodiment, the radiation surface is a concave arc surface; the two ends of the concave arc surface are connected to form a connecting line, the concave arc surface has a perpendicular bisector that bisects the arc length of the concave arc surface and is perpendicular to the connecting line, the perpendicular bisector and the concave arc surface have an intersection, and the angle is formed between the plane where the tangent of the concave arc surface passing through the intersection is located and the inner wall surface of the box where the second heating element is located.

[0017] In combination with the first aspect of the present application, in an optional embodiment, the length of the second heating element on the first box side wall is greater than or equal to the length of the orthographic projection of the box cover on the first box side wall.

[0018] In a second aspect, an embodiment of the present application provides a wafer box processing device, including:

[0019] A wafer box drying device as described above;

[0020] A conveying device is used to place the wafer box into the accommodating cavity.

[0021] The wafer box drying device and wafer box processing equipment provided in the embodiments of the present application include: a box body, having a first opening opened at one end in a first direction; a box cover, covering the first opening to form a containing cavity with the box body; the containing cavity is used to contain the separated box body and the box cover; wherein, in the drying state, the containing cavity is a vacuum environment, the box cover is detachably fixed to the inner wall of the box cover, the outer surface of the box cover is arranged toward the inner wall of the box cover, the box body is placed on any inner wall of the box body and is separated from the box cover; a heating component includes a first heating element and a second heating element, the radiation range of the first heating element can at least cover the inner surface of the box body to dry the box body, and the radiation range of the second heating element can cover the inner surface of the box cover to dry the box cover. It can be seen that the wafer box drying device and wafer box processing equipment of the embodiment of the present application include a first heating element and a second heating element. In the case of drying, when the accommodating chamber is in a vacuum environment, the radiation range of the first heating element can at least cover the inner surface of the box body to dry the box body, and the radiation range of the second heating element can cover the inner surface of the box cover, which can effectively dry the box cover and improve the cleanliness and dryness of the box cover. Therefore, the wafer box drying device and wafer box processing equipment of the embodiment of the present application can improve the cleanliness and dryness of the box cover.

[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0024] Figure 1 A schematic diagram of a first embodiment of a wafer box drying device provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of wafers being loaded into a wafer box;

[0026] Figure 3 A schematic diagram of a wafer box drying device provided in an embodiment of the present application after an outer wall is cut off;

[0027] Figure 4 A schematic diagram of wafer defects after the wafer is statically placed in a wafer box that has been dried in the prior art for one week;

[0028] Figure 5 A schematic diagram of wafer defects after a wafer is statically placed in a wafer box that has been dried by the wafer box drying device provided in an embodiment of the present application for one week;

[0029] Figure 6 A schematic diagram of a second embodiment of a wafer box drying device provided in an embodiment of the present application;

[0030] Figure 7 for Figure 6 A local enlarged schematic diagram of point I in the middle;

[0031] Figure 8 A schematic diagram of a third embodiment of a wafer box drying device provided in an embodiment of the present application;

[0032] Fig. 9 A schematic diagram of a fourth embodiment of a wafer box drying device provided in an embodiment of the present application;

[0033] Fig.10 This is a schematic diagram of a fifth embodiment of the wafer box drying device provided in an embodiment of the present application.

[0034] Description of reference numerals:

[0035] 10. First wafer; 11. Box body; 12. Box cover; 21. Box body; 211. First opening; 212. First box body side wall; 22. Box cover; 31. First heating element; 32. Second heating element; 322. Radiation surface; 33. Radiation overlap area. DETAILED DESCRIPTION

[0036] In order to make the technical solutions and beneficial effects of the present application more obvious and easy to understand, the following is a detailed description by listing specific embodiments. The drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which the present application belongs.

[0037] In the description of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of simplified description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0038] In this application, the terms "first" and "second" are used only for the purpose of clear description and should not be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly include at least one of the features. In the description of this application, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly defined, the terms "install", "connect", "connect", "fix", "set", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present application, unless otherwise clearly defined, a first feature being “on”, “above”, “above”, “below”, “below”, “below” or “below” a second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact with each other through an intermediate medium. Moreover, a first feature being “on”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0041] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0042] The applicant of this application found in the research and development that in the current wafer box drying device, reference Figure 1, the box body 11 is placed upside down in the accommodating cavity of the box body 21, and the box cover 12 is installed on the inner wall of the box cover 22. However, since the box body 11 has an inner cavity for accommodating wafers, it is the main target of the drying process. Therefore, the box body 21 is only provided with a heating element on the inner wall corresponding to the box body 11, that is, the first heating element 31, part of the heating element is located in the inner cavity of the box body 11, and part of the heating element is located above the box body 11, so as to dry the box body 11. However, when drying the wafer box, the accommodating cavity of the box body 21 is sucked into a vacuum cavity, and there is no fluid in the vacuum cavity, so heat convection cannot be carried out, and the heat radiation is basically blocked by the box body 11, and the second heating element 32 is not provided. As a result, the box cover 12 cannot be effectively dried. When the cleanliness requirements of the wafer box are gradually increased, the dryness of the box cover 12 is not enough, which affects the processing quality of the wafer.

[0043] For example, Figure 2 The figure is a schematic diagram of wafers loaded into a wafer box. When a wafer box is dried in the above manner using a vacuum drying device in the prior art, after a number of wafer products are placed in it, since the inner surface of the box cover 12 is also provided with a number of support grooves for supporting the wafers, and the prior art only dries the box body 11, liquid is present on the inner surface of the box cover 12. During the drying and heating process of the wafers, the temperature inside the entire box body 11 rises, and the liquid on the box cover 12 is heated to form steam, which moves upward to the top of the horizontally placed wafer box, resulting in the surface of the first wafer 10 at the top being not dry enough, which is prone to many defects, such as Figure 4 As shown, Figure 4 This is a schematic diagram of wafer defects after the wafer is statically placed in a wafer box that has been dried in the prior art for one week.

[0044] In order to solve the above problems, the present application provides a wafer box processing device, which includes a wafer box drying device, which can improve the drying effect of the entire wafer box, and load a plurality of wafers into the wafer box dried by the wafer box drying device, without the problem of wafer defects. For specific reference Figure 5 As shown, Figure 5 This is a schematic diagram of defects after a wafer is statically placed in a wafer box for one week after being dried by the wafer box drying device provided in an embodiment of the present application. Figure 4 and Figure 5 The dot-shaped patterns on the wafer surface are defects, such as water stains. Figure 4 and Figure 5 It can be seen that the use of the wafer box drying device provided in the embodiment of the present application to dry the wafer box greatly improves the drying effect.

[0045] The present application provides a wafer box drying device. Figure 1 and Figure 3, the wafer box drying device comprises:

[0046] The box body 21 has a first opening 211 opened at one end in a first direction;

[0047] The box cover 22 is covered on the first opening 211 to form a receiving cavity with the box body 21; the receiving cavity is used to receive the box body 11 and the box cover 12 after separation; wherein, in a dry state, the receiving cavity is a vacuum environment, the box cover 12 is detachably fixed to the inner wall of the box cover 22, the outer surface of the box cover is arranged toward the inner wall of the box cover, the box body 11 is placed on any inner wall of the box body 21, and is separated from the box cover 12;

[0048] The heating assembly includes a first heating element 31 and a second heating element 32. The radiation range of the first heating element 31 can at least cover the inner surface of the box body 11 to dry the box body 11. The radiation range of the second heating element 32 can cover the inner surface of the box cover 12 to dry the box cover 12.

[0049] It can be understood that the first direction can be the up-down direction of the box body 21, or the side direction of the box body 21. This embodiment is described by taking the side direction of the box body 21 as an example. It can be understood that if the first direction is the up-down direction, other structures can be adjusted accordingly. Figure 3 It is marked as the X direction. It should be noted that the first direction is two directions of a straight line. For simplicity, there is only one arrow in the direction in the figure, and the same is true for other directions.

[0050] Specifically, the process of placing the wafer box into the box body 21 may include: opening the box cover 22, clamping the wafer box body 11 by a robot arm, so that the box cover 12 of the wafer box is docked with the unlocking mechanism on the box cover 22, and the rotating mechanism drives the unlocking mechanism to rotate to realize the unlocking of the wafer box cover 12 and the box body 11. The box cover 12 is fixed on the box cover 22, and the robot arm clamps the wafer box body 11, and places the box body 11 in an upside-down manner in the box body 21, that is, the inner cavity of the box body 11 faces the bottom wall of the box body 21.

[0051] It is understandable that in order to keep the wafer box clean and improve the drying effect of the wafer box, the accommodating chamber is in a vacuum environment during drying. This is also the premise for the above technical solution in the embodiment of the present application, that is, in the absence of thermal convection, the second heating element 32 is added to dry the box cover 12 alone by radiation, thereby improving the cleanliness and dryness of the box cover 12.

[0052] It is understandable that in order to further improve the drying effect on the box body and the box cover, multiple first heating elements 31 and second heating elements 32 can be provided. It is understandable that the radiation range of the first heating element 31 can at least cover the inner surface of the box body 11, and part of the outer surface of the box body 11 can be dried by the second heating element 32, so it is not necessary to cover all of it.

[0053] It can be understood that at least one first heating element 31 is disposed in the inner cavity of the box body 11 for drying the inner surface of the box body. In this embodiment, at least one first heating element 31 is located outside the box body 11 for drying the outer surface of the box body, and this embodiment only shows one first heating element 31 located above the box body 11. Of course, first heating elements 31 may also be disposed on other side walls of the box body 21 to dry all surfaces of the box body, or other arrangements may be used, as long as the radiation range can cover the surface of the box body 11.

[0054] It is understandable that the position of the second heating element 32 is not limited, as long as the radiation range covers the surface of the box cover 12.

[0055] In some other embodiments of the present application, at least two second heating elements 32 are provided, and at least one second heating element 32 is provided on each side of the box cover 12 .

[0056] In this way, the box cover 12 can be radiated more comprehensively. In this embodiment, one second heating element 32 is provided on each side of the box cover 12. In this way, the radiation is more uniform and the drying process is more effective.

[0057] In some other embodiments of the present application, the radiation range of any one of the second heating elements 32 covers at least half of the surface area of ​​the box cover 12 .

[0058] This embodiment can be divided into two cases. The first case is that the radiation range of the second heating element 32 just covers half of the surface area of ​​the box cover 12. In this way, the two second heating elements 32 work together to cover the entire surface area of ​​the box cover 12, but the radiation ranges of the two second heating elements 32 do not overlap. Figure 8 In this way, it is possible to avoid the situation where the surface of the box cover 12 in the middle area between the two second heating elements 32 is not radiated.

[0059] The second situation is that the radiation range of the second heating element 32 covers more than half of the surface area of ​​the box cover 12, that is, the coverage ranges of the two second heating elements 32 overlap, forming a radiation overlap area 33, refer to Fig. 9Since the distances from the second heating element 32 to the box cover are different at different locations, the heat flux absorbed by different locations of the box cover 12 is also uneven, that is, the heat flux absorbed by the middle area of ​​the box cover 12 is less than the heat flux absorbed by the edge of the box cover 12, resulting in poor drying effect in the middle area of ​​the box cover 12. Fig. 9 By setting the coverage of the two second heating elements 32 to have a radiation overlap area 33, the middle area of ​​the box cover 12 can absorb the radiation of the two second heating elements 32 at the same time, so as to reduce the uneven drying effect between the middle area and the edge of the box cover 12, thereby ensuring the drying effect of the entire box cover 12.

[0060] Specifically, the second heating element 32 may be an infrared heater, so that the drying process can be better performed by radiation.

[0061] In some other embodiments of the present application, the wafer box drying device further includes two control components respectively communicating with the first heating element 31 and the second heating element 32 .

[0062] That is, one control component controls the operation of the first heating element 31, and another control component controls the operation of the second heating element 32. In this way, the first heating element 31 and the second heating element 32 can be controlled separately to achieve different heating times and heating powers, and the drying process can be performed more flexibly.

[0063] In some other embodiments of the present application, the second heating element 32 is disposed on the first box side walls 212 on both sides of the box cover 22 ; the orthographic projection of the box cover 12 on the first box side walls 212 has no overlap with the second heating element 32 .

[0064] It is understandable that when the wafer is placed in the wafer box, the end surface of the box cover 12 will contact the wafer, so the end surface of the box cover is the main area for drying. This arrangement can make the radiation range of the second heating element 32 fall on the end surface of the box cover 12 without being blocked by the side wall of the box cover 12, which will affect the drying process of the end surface of the box cover 12. Figure 6 As shown, in this embodiment, the dot-dash line in the figure is the boundary line of the two second heating elements 32, which can be understood as the end of the second heating element 32 is tangent to the end surface of the box cover. In other embodiments, there may be a distance between the orthographic projection of the box cover 12 on the first box side wall 212 and the second heating element 32, and the position thereof is not specifically limited here, and can be adjusted according to actual needs.

[0065] Furthermore, the box body 11 can be placed upside down on one of the first box side walls 212, that is, one of the first heating elements 31 is installed on one of the first box side walls 212, and the other of the first heating elements 31 is installed on the other first box side wall 212, and both are spaced apart from the second heating element 32. In this way, the heating elements on the same box side wall can unify the circuit routing and reduce the circuit routing channels.

[0066] In some other embodiments of the present application, the second heating element 32 has a radiation surface 322, and the radiation surface 322 is a concave arc surface, so that at least part of the heat radiation of the second heating element 32 radiates to the box cover 12, and the other part radiates to the outer surface of the box body 11.

[0067] With this arrangement, there is no need to separately set up a first heating element for drying the side of the box body close to the box cover, which reduces the space occupied by the drying device and does not affect the drying process of the box cover 12. However, due to the presence of many irregular structures on the outer surface of the wafer box, there are dead corners at the irregular structures that cannot be completely dried. Therefore, in other embodiments, on the basis that each outer surface of the wafer box is provided with sufficient first heating elements 31, the radiation of the first heating element 31 and the second heating element 32 can be superimposed on one side of the box body close to the cover body, thereby ensuring the drying effect. It should be noted that the concave curvature of the radiation surface 322 can be set according to actual conditions, and the curvature of the concave arc radiation surface 322 is not specifically limited here.

[0068] In some other embodiments of the present application, the second heating element 32 has a radiation surface 322 ; the radiation surface is tilted toward the box cover 12 , so that there is an angle between the radiation surface 322 and the inner wall surface of the box where the second heating element 32 is located.

[0069] In this way, the radiation can be directed toward the surface of the box cover 12, the radiation distance can be reduced, and the radiation drying effect can be improved. In this embodiment, the angle range is 15 degrees to 30 degrees.

[0070] Furthermore, in this embodiment, the radiation surface 322 can be a concave arc surface or a plane. When the radiation surface 322 is a concave arc surface, the two ends of the concave arc surface are connected to form a connecting line, and the concave arc surface has a perpendicular bisector that bisects the arc length of the concave arc surface and is perpendicular to the connecting line. The perpendicular bisector and the concave arc surface have an intersection, and the angle is formed between the plane where the tangent of the concave arc surface passing through the intersection is located and the inner wall surface of the box where the second heating element 32 is located. The advantage of this arrangement is that the radiation lines can be relatively concentrated to the surface of the box cover 12, further improving the radiation drying effect. It can be understood that since the concave arc surface itself has the characteristic of gathering the radiation lines inward, the radiation surface is not inclined, and it can also play a role in improving the radiation drying effect. In this embodiment, the two are superimposed, and the radiation drying effect is better. When the radiation surface 322 is a concave arc surface, the angle is marked as A, refer to Figure 6 and Figure 7 .

[0071] In other embodiments, the radiation surface 322 may also be a plane. When the radiation surface 322 is a plane, the angle is the angle between the radiation surface and the inner wall of the box where the second heating element 32 is located, which can also achieve the above effect. When the radiation surface 322 is a plane, the angle is marked as B, see Fig.10 .

[0072] In some other embodiments of the present application, the length of the second heating element 32 on the first box side wall 212 is greater than or equal to the orthographic projection length of the box cover 12 on the first box side wall 212 .

[0073] refer to Figure 3 , the length of the second heating element 32 on the first box side wall 212 is measured along the Y direction. In this way, the box cover 12 can be fully radiated in the Y direction. It can be understood that a plurality of second heating elements 32 can be provided in the Y direction, and the length of the second heating element 32 on the first box side wall 212 can be the outer end distance of the two outermost second heating elements 32.

[0074] The embodiment of the present application also provides a wafer box processing device, including:

[0075] A wafer box drying device as described above;

[0076] A conveying device is used to place the wafer box into the accommodating cavity.

[0077] Specifically, the conveying device may be a robot.

[0078] The wafer box processing equipment of the embodiment of the present application includes a first heating element 31 and a second heating element 32. The radiation range of the first heating element 31 can cover the surface of the box body 11 to dry the surface of the box body 11. The radiation range of the second heating element 32 can cover the surface of the box cover 12 and can effectively dry the box cover 12 to improve the cleanliness and dryness of the box cover 12.

[0079] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the technical solution of the present application. Various modifications and changes can also be made on the basis of the above embodiments without departing from the scope disclosed in the present application. Similarly, the various technical features of the above embodiments can also be combined arbitrarily to form other embodiments of the present application that may not be clearly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A wafer box drying device, the wafer box comprising a box body and a box cover, characterized in that: The wafer box drying device comprises: The box body has a first opening opened at one end in a first direction; A box cover is covered on the first opening to form a receiving cavity with the box body; the receiving cavity is used to receive the box body and the box cover after separation; wherein, in a dry state, the receiving cavity is a vacuum environment, the box cover is detachably fixed to the inner wall of the box cover, the outer surface of the box cover is arranged toward the inner wall of the box cover, the box body is placed on any inner wall of the box body, and is separated from the box cover; The heating assembly includes a first heating element and a second heating element, wherein the radiation range of the first heating element can at least cover the inner surface of the box body to dry the box body, and the radiation range of the second heating element can cover the inner surface of the box cover to dry the box cover.

2. The wafer box drying device according to claim 1, characterized in that: At least two second heating elements are provided, and at least one second heating element is provided on each side of the box cover.

3. The wafer box drying device according to claim 2, characterized in that: The radiation range of any one of the second heating elements covers at least half of the surface area of ​​the box cover.

4. The wafer box drying device according to claim 1, characterized in that: The wafer box drying device also includes two control components that are respectively communicatively connected to the first heating element and the second heating element.

5. The wafer box drying device according to claim 1, characterized in that: The second heating element is arranged on the first box body side walls on both sides of the box cover; the orthographic projection of the box cover on the first box body side walls does not overlap with the second heating element.

6. The wafer box drying device according to claim 1, characterized in that: The second heating element has a radiation surface, which is a concave arc surface, so that at least half of the heat radiation of the second heating element radiates to the box cover, and the other part radiates to the outer surface of the box body.

7. The wafer box drying device according to claim 1, characterized in that: The second heating element has a radiation surface; the radiation surface is tilted toward the box cover, and there is an angle between the radiation surface and the inner wall of the box where the second heating element is located; the angle is 15 degrees to 30 degrees.

8. The wafer box drying device according to claim 7, characterized in that: The radiation surface is a concave arc surface; the two ends of the concave arc surface are connected to form a connecting line, the concave arc surface has a perpendicular bisector that bisects the arc length of the concave arc surface and is perpendicular to the connecting line, the perpendicular bisector and the concave arc surface have an intersection, and the angle is formed between the plane where the tangent of the concave arc surface passing through the intersection is located and the inner wall surface of the box where the second heating element is located.

9. The wafer box drying device according to claim 5, characterized in that: The length of the second heating element on the first box side wall is greater than or equal to the orthographic projection length of the box cover on the first box side wall.

10. A wafer box processing device, characterized in that: include: The wafer box drying device according to any one of claims 1 to 9; A conveying device is used to place the wafer box into the accommodating cavity.

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