Enamel painted porcelain defect identification method and system based on nondestructive testing technology and computer equipment

Abstract

The invention relates to the technical field of enamel painted porcelain, and particularly discloses an enamel painted porcelain defect identification method and system based on a nondestructive testing technology and computer equipment. The method comprises the steps of firstly obtaining surface connection state feature information and internal stress distribution feature information, obtaining connection position curved surface information and connection position groove information according to the surface connection state feature information, obtaining connection position curvature and surface roughness according to the connection position curved surface information, obtaining a groove density proportion according to the connection position groove information, and obtaining the internal stress distribution feature information according to the groove density proportion. Obtaining a stress dispersion degree value according to the internal stress distribution characteristic information, obtaining a multi-layer structure connection stress according to the curvature and the surface roughness of the connection part, obtaining a structure integrity coefficient according to the multi-layer structure connection stress, the groove density proportion and the stress dispersion degree value, and carrying out defect identification on the enamel painted porcelain; in this way, defect judgment is carried out on the joint of the base and the bottle body through subdivision, and the problem that the identification error of enamel painted porcelain is increased due to the fact that curvature affects detection equipment can be avoided.

Description

Technical Field

[0001] The invention relates to the technical field of enamel colored porcelain, in particular to an enamel colored porcelain defect identification method, system and computer equipment based on non-destructive testing technology. Background Art

[0002] Enamel porcelain is a unique porcelain craft, also known as "porcelain enamel", is a high-end porcelain that combines oriental porcelain production technology and western enamel decoration techniques. It is a handicraft with blue as the background color on a copper body, pinched with copper wire, and then filled with red, yellow, blue, green and other colored glazes. After the production of enamel porcelain is completed, it is necessary to test the enamel porcelain. When testing enamel porcelain, it is necessary to use non-destructive testing technology to detect and judge whether there are defects in the enamel porcelain. Among them, non-destructive testing technologies mainly include optical microscopes, X-ray diffractometers and ultrasonic inspection technologies.

[0003] After the production of enamel porcelain is completed, it is usually necessary to inspect the enamel porcelain. However, the joint between the base and the bottle body usually has a certain curvature, and the irregular shape caused by this curvature will cause the detection medium (light, sound waves and X-rays) generated by the detection equipment to refract and reflect, which will lead to an increase in the error of the detection equipment in identifying the enamel porcelain. Therefore, an enamel porcelain defect identification method, system and computer equipment based on non-destructive testing technology are needed to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to provide a method, system and computer equipment for identifying enamel porcelain defects based on non-destructive testing technology to solve the technical problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A method for identifying defects of enamel colored porcelain based on non-destructive testing technology, comprising:

[0007] Acquire connection feature information of the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connection feature information includes surface connection state feature information and internal stress distribution feature information;

[0008] Acquire the curved surface information and the groove information of the joint according to the surface connection state characteristic information, and acquire the curvature and the surface roughness of the joint according to the curved surface information of the joint;

[0009] Obtaining the groove density ratio per unit area according to the groove information at the joint;

[0010] Acquire microcrystal stress arrangement information according to the internal stress distribution characteristic information, and acquire stress dispersion degree value according to the microcrystal stress arrangement information;

[0011] Obtaining the connection stress of the multilayer structure according to the curvature and surface roughness of the connection;

[0012] Obtaining a structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value;

[0013] Defects at the joint between the bottle body and the bottle bottom of the enamel porcelain are identified based on the structural integrity coefficient.

[0014] Preferably, the step of obtaining the curved surface information and the groove information of the joint according to the surface connection state characteristic information comprises:

[0015] Acquire the appearance information of the corresponding enamel porcelain according to the surface connection state characteristic information, and acquire the connection position between the bottle body and the bottle bottom according to the appearance information;

[0016] Based on the reference coherent light irradiating the connection position of the standard bottle body and the bottle bottom, a plurality of first reference reflection points are obtained, and the plurality of first reference reflection points are connected into a first light wave path;

[0017] Based on measuring the connection position of the bottle body and the bottle bottom irradiated by the coherent light, a plurality of first measurement reflection points are obtained, and the plurality of first measurement reflection points are connected into a second light wave path;

[0018] Comparing the first light wave path and the second light wave path at preset points to obtain an interference point spacing, and obtaining a drop value between the first light wave path and the second light wave path at a preset point according to the interference point spacing, and using the drop value as the surface information of the connection;

[0019] Screening the plurality of first reference reflection points and the plurality of first measurement reflection points at the same incident point position and different reflection point positions to obtain a plurality of groups of reference-reflection points;

[0020] sequentially acquiring a plurality of phase differences of a plurality of groups of reference-reflection points;

[0021] The wavelength and incident angle of the preset light wave are obtained, and a plurality of groove depths are calculated in sequence according to the plurality of phase differences, incident angles of the light wave and wavelengths, wherein the calculation formula is:

[0022]

[0023] Where, d represents the depth of the oth to kth grooves, γ represents the wavelength, represents the phase difference, θ represents the incident angle of the light wave, and o represents the number sequence of the groove depth, where o=1...k.

[0024] Preferably, the step of obtaining crystallite stress arrangement information according to the internal stress distribution characteristic information, and obtaining a stress dispersion degree value according to the crystallite stress arrangement information comprises:

[0025] Acquiring the crystal structure of the enamel porcelain according to the internal stress distribution characteristic information, and identifying multiple crystal plane diffraction peaks of the crystal structure of the enamel porcelain based on the diffraction spectrum;

[0026] Acquire multiple position offsets of the multiple crystal plane diffraction peaks based on the Bragg law, calculate multiple lattice strain values ​​according to the multiple position offsets, and use strain information corresponding to the multiple lattice strain values ​​as crystallite stress arrangement information;

[0027] Acquire a plurality of crystal plane stresses of the corresponding lattice according to the plurality of lattice strain values;

[0028] The average crystal plane stress is calculated according to the multiple crystal plane stresses, and the standard deviation of the crystal plane stress is calculated according to the multiple crystal plane stresses and the average crystal plane stress, wherein the calculation formula is:

[0029]

[0030] Where S represents the standard deviation of crystal plane stress, p(σ) l represents the lth crystal plane stress, N represents the number of crystal plane stresses, l represents the sequence number of crystal plane stresses, represents the average crystal plane stress;

[0031] The stress dispersion value is obtained according to the ratio of the crystal plane stress standard deviation to the average crystal plane stress.

[0032] Preferably, the step of obtaining the connection stress of the multilayer structure according to the curvature and surface roughness of the connection includes:

[0033] Obtaining a connecting layer between the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connecting layer comprises a glaze layer and an enamel layer;

[0034] obtaining glaze layer stress according to the glaze layer;

[0035] obtaining enamel layer stress according to the enamel layer;

[0036] Obtaining a corresponding curvature radius according to the curvature of the connection;

[0037] Acquire a surface roughness defect radius, a surface roughness peak value, and a surface valley value according to the surface roughness, and calculate a surface roughness amplitude according to a distance between the surface roughness peak value and the surface valley value;

[0038] The multi-layer structure connection stress is calculated according to the glaze layer stress, the enamel layer stress, the curvature radius and the surface roughness amplitude, wherein the calculation formula is:

[0039]

[0040] Where D(c) represents the connection stress of the multilayer structure, Y(σ)1 represents the stress of the glaze layer, Y(σ)2 represents the stress of the enamel layer, R represents the radius of curvature, H represents the amplitude of the surface roughness, r represents the radius of the surface roughness defect, represents the stress concentration factor caused by curvature, Represents the stress concentration factor caused by surface roughness.

[0041] Preferably, the step of obtaining the structural integrity coefficient according to the connection stress of the multi-layer structure, the groove density ratio and the stress dispersion value comprises:

[0042] Normalizing the multi-layer structure connection stress to obtain a normalized value of the multi-layer structure connection stress;

[0043] Normalizing the groove density ratio to obtain a groove density normalized value;

[0044] Normalizing the stress dispersion degree value to obtain a stress dispersion degree normalized value;

[0045] The structural integrity coefficient is calculated according to the normalized value of the multi-layer structure connection stress, the normalized value of the groove density, and the normalized value of the stress dispersion degree, wherein the calculation formula is:

[0046] C=1-[g(y)*W1+m(z)*W2+l(s)*(1-W1-W2)];

[0047] Among them, C represents the structural integrity coefficient, g(y) represents the normalized value of the multilayer structure connection stress, W1 represents the weight factor of the structural integrity coefficient, m(z) represents the normalized value of the groove density, W2 represents the weight factor of the normalized value of the groove density, and l(s) represents the normalized value of the stress dispersion degree.

[0048] Preferably, the step of identifying defects at the joint between the bottle body and the bottle bottom of the enamel colored porcelain according to the structural integrity coefficient comprises:

[0049] Calculating a structural integrity coefficient difference according to the structural integrity coefficient and a preset standard structural integrity coefficient;

[0050] Determining whether the structural integrity coefficient difference is less than a preset threshold;

[0051] When the complete difference is less than the preset threshold, it is determined that there is a defect at the connection between the bottle body and the bottom of the enamel porcelain.

[0052] The present application also provides an enamel porcelain defect identification system based on non-destructive testing technology, comprising:

[0053] The first acquisition module is used to acquire the connection feature information of the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connection feature information includes surface connection state feature information and internal stress distribution feature information;

[0054] A second acquisition module is used to acquire the connection curved surface information and the connection groove information according to the surface connection state characteristic information, and acquire the connection curvature and surface roughness according to the connection curved surface information;

[0055] A third acquisition module is used to acquire the groove density ratio per unit area according to the groove information of the joint;

[0056] A fourth acquisition module, used to acquire microcrystal stress arrangement information according to the internal stress distribution characteristic information, and acquire a stress dispersion degree value according to the microcrystal stress arrangement information;

[0057] A fifth acquisition module, used for acquiring the connection stress of the multilayer structure according to the curvature and surface roughness of the connection;

[0058] A sixth acquisition module, configured to acquire a structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value;

[0059] The first identification module is used to identify defects at the joint between the bottle body and the bottle bottom of the enamel porcelain according to the structural integrity coefficient.

[0060] Preferably, the second acquisition module includes:

[0061] A first acquisition unit is used to acquire the appearance information of the corresponding enamel porcelain according to the surface connection state characteristic information, and acquire the connection position of the bottle body and the bottle bottom according to the appearance information;

[0062] A first reference unit, configured to obtain a plurality of first reference reflection points by irradiating the connection position of the standard bottle body and the bottle bottom based on the reference coherent light, and connect the plurality of the first reference reflection points into a first light wave path;

[0063] A first measuring unit, configured to obtain a plurality of first measuring reflection points based on the connection position of the bottle body and the bottle bottom irradiated by measuring coherent light, and connect the plurality of first measuring reflection points into a second light wave path;

[0064] A first comparison unit is used to compare the first light wave path and the second light wave path at preset points to obtain an interference point spacing, and obtain a drop value between the first light wave path and the second light wave path at a preset point according to the interference point spacing, and use the drop value as the surface information of the connection;

[0065] A first screening unit, used for screening the plurality of first reference reflection points and the plurality of first measurement reflection points with the same incident point position and different reflection point positions to obtain a plurality of groups of reference-reflection points;

[0066] A second acquisition unit, used for sequentially acquiring a plurality of phase differences of a plurality of groups of reference-reflection points;

[0067] The first calculation unit is used to obtain the wavelength and incident angle of the preset light wave, and calculate the depths of the multiple grooves in sequence according to the multiple phase differences, incident angles of the light wave and wavelengths, wherein the calculation formula is:

[0068]

[0069] Where, d represents the depth of the oth to kth grooves, γ represents the wavelength, represents the phase difference, θ represents the incident angle of the light wave, and o represents the number sequence of the groove depth, where o=1...k.

[0070] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0071] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0072] The beneficial effects of the present application are as follows: the present invention first obtains the connection characteristic information of the bottle body and the bottom of the enamel colored porcelain, wherein the connection characteristic information includes surface connection state characteristic information and internal stress distribution characteristic information, and then obtains the connection surface information and the connection groove information according to the surface connection state characteristic information, and obtains the connection curvature and surface roughness according to the connection surface information, obtains the groove density ratio per unit area according to the connection groove information, and then obtains the stress dispersion degree value according to the internal stress distribution characteristic information, and then obtains the multi-layer structure connection stress according to the connection curvature and surface roughness, and at the same time obtains the structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion degree value, and finally, identifies the defects of the connection between the bottle body and the bottom of the enamel colored porcelain according to the structural integrity coefficient, so that the defect judgment of the connection between the base and the bottle body is carried out in a segmented manner, which can avoid the problem of curvature affecting the detection equipment and causing an increase in the identification error of the enamel colored porcelain. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Figure 1 The figure is a schematic diagram of a method flow of an embodiment of the present application.

[0074] Figure 2A schematic diagram of the system structure of an embodiment of the present application.

[0075] Figure 3 A schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0076] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0077] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0078] like Figure 1-3 As shown, the present application provides a method for identifying defects of enamel colored porcelain based on non-destructive testing technology, comprising:

[0079] S1. Obtaining connection feature information of the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connection feature information includes surface connection state feature information and internal stress distribution feature information;

[0080] S2, obtaining the connection curved surface information and the connection groove information according to the surface connection state characteristic information, and obtaining the connection curvature and surface roughness according to the connection curved surface information;

[0081] S3, obtaining the groove density ratio per unit area according to the groove information of the joint;

[0082] S4, obtaining microcrystal stress arrangement information according to the internal stress distribution characteristic information, and obtaining a stress dispersion degree value according to the microcrystal stress arrangement information;

[0083] S5, obtaining the connection stress of the multilayer structure according to the curvature and surface roughness of the connection;

[0084] S6. Obtaining a structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value;

[0085] S7. Identify defects at the joint between the bottle body and the bottle bottom of the enamel porcelain according to the structural integrity coefficient.

[0086] As described in the above steps S1-S7, after the production of enamel colored porcelain is completed, it is usually necessary to inspect the enamel colored porcelain. However, since the connection between the base and the bottle body usually has a certain curvature, the irregular shape caused by this curvature will cause the detection medium (light, sound waves and X-rays) generated by the detection equipment to refract and reflect, thereby increasing the error of the detection equipment in identifying the enamel colored porcelain. Therefore, the present invention first obtains the connection feature information of the bottle body and the bottom of the enamel colored porcelain, wherein the connection feature information includes surface connection state feature information and internal stress distribution feature information, and the internal stress distribution feature information is the key information used to describe the internal stress distribution status of the enamel colored porcelain, which is of great significance for judging its structural integrity and quality status. It is related to the internal microstructure layer of the enamel colored porcelain. The surfaces are interrelated, so by making surface and internal judgments on the joint between the base and the bottle body, it is possible to comprehensively judge whether the enamel colored porcelain has defects. At the same time, the fine cracks or unevenness in the surface connection state characteristic information may be the manifestation of external damage or production process problems, and the abnormal stress concentration in the internal stress distribution characteristic information may indicate that there are hidden dangers inside the structure. This information is crucial for judging the quality and potential defects of enamel colored porcelain. Then, the surface information and the groove information of the joint are obtained according to the surface connection state characteristic information, and the curvature and surface roughness of the joint are obtained according to the surface information of the joint. In this way, the surface information of the joint can reflect the geometric shape characteristics of the joint. The accurate acquisition of curvature is of great significance for analyzing stress distribution, optical reflection and other characteristics. Surface roughness directly affects the microscopic flatness of the surface, which is related to touch, glossiness and possible wear. Groove information (including groove depth, etc.) can reveal local defects on the surface, such as flaws in the production process or damage caused by later use. Since the groove depth information alone can only reflect local conditions, the groove density ratio can provide a more comprehensive description of surface irregularities. When combined with other parameters (such as multi-layer structure connection stress, stress dispersion value, etc.) for analysis, the structural integrity and quality status can be evaluated more accurately. Therefore, the groove density ratio per unit area is obtained based on the groove information at the connection. The groove density ratio can quantify the distribution of grooves on the surface of the connection from a macro perspective. A higher groove density may mean instability in the manufacturing process or more erosion or damage during use, which has a greater impact on the overall quality and appearance of enamel porcelain, because internal stress is one of the key factors affecting the structural stability of enamel porcelain.By obtaining the microcrystalline stress arrangement information and stress dispersion value, we can gain an in-depth understanding of the micromechanical state inside the material, which is crucial for accurately evaluating the structural integrity and predicting the development of potential defects. It is an important step in evaluating the quality of enamel porcelain from a microscopic perspective. Therefore, the microcrystalline stress arrangement information is obtained based on the internal stress distribution characteristic information, and the stress dispersion value is obtained based on the microcrystalline stress arrangement information. In this way, the microcrystalline stress arrangement information reveals the stress distribution at the microstructure level of the enamel porcelain crystal. The stress dispersion value quantifies the uniformity of the stress distribution. Uniform stress distribution helps to maintain the stability of the structure, while a larger stress dispersion degree may lead to local stress concentration and increase the risk of crack generation and expansion. Then, the multi-layer structure connection stress is obtained based on the curvature and surface roughness of the connection. In this way, the multi-layer structure connection stress comprehensively considers the influence of curvature and surface roughness on the stress between different structural layers at the connection. Accurately calculating the joint stress of the multi-layer structure can evaluate the stress condition of the joint structure in actual use, and determine whether there is a risk of structural damage caused by stress concentration. Next, the structural integrity coefficient is obtained according to the joint stress of the multi-layer structure, the groove density ratio and the stress dispersion value. The structural integrity coefficient provides a quantitative indicator to evaluate the structural integrity of the joint between the enamel porcelain bottle body and the bottom of the bottle by comprehensively considering multiple key factors. This coefficient can intuitively reflect the overall quality status of the joint, which is convenient for comparing and grading the quality of different enamel porcelains. Finally, the defect identification of the joint between the bottle body and the bottom of the enamel porcelain is carried out according to the structural integrity coefficient. In this way, the defect judgment of the joint between the base and the bottle body is carried out by segmentation, which can avoid the problem of curvature affecting the detection equipment and increasing the identification error of enamel porcelain.

[0087] In one embodiment, the step S2 of acquiring the connection curved surface information and the connection groove information according to the surface connection state characteristic information comprises:

[0088] S201, acquiring the appearance information of the corresponding enamel porcelain according to the surface connection state characteristic information, and acquiring the connection position between the bottle body and the bottle bottom according to the appearance information;

[0089] S202, irradiating the connection position of the standard bottle body and the bottle bottom with reference coherent light to obtain a plurality of first reference reflection points, and connecting the plurality of first reference reflection points into a first light wave path;

[0090] S203, obtaining a plurality of first measurement reflection points based on the connection position of the bottle body and the bottle bottom irradiated by the measurement coherent light, and connecting the plurality of first measurement reflection points into a second light wave path;

[0091] S204, comparing the first light wave path and the second light wave path at preset points to obtain an interference point spacing, and obtaining a drop value between the first light wave path and the second light wave path at a preset point according to the interference point spacing, and using the drop value as the surface information of the connection;

[0092] S205, screening the plurality of first reference reflection points and the plurality of first measurement reflection points at the same incident point position and at different reflection point positions to obtain a plurality of groups of reference-reflection points;

[0093] S206, sequentially acquiring a plurality of phase differences of a plurality of groups of reference-reflection points;

[0094] S207, obtaining a preset wavelength and incident angle of the light wave, and calculating a plurality of groove depths in sequence according to the plurality of phase differences, incident angles of the light wave and wavelengths, wherein the calculation formula is:

[0095]

[0096] Where, d represents the depth of the oth to kth grooves, γ represents the wavelength, represents the phase difference, θ represents the incident angle of the light wave, and o represents the number of groove depths, where o=1...k;

[0097] S208, using depth information corresponding to the depths of the plurality of grooves as groove information at the joint.

[0098] As described in the above steps S201-S208, the present invention first obtains the appearance information of the corresponding enamel colored porcelain according to the surface connection state characteristic information, and obtains the connection position of the bottle body and the bottle bottom according to the appearance information, thus clarifying the specific area for subsequent detection and analysis, that is, the connection position of the bottle body and the bottle bottom. The acquisition of appearance information helps to fully understand the overall appearance of the enamel colored porcelain, provides a basis for accurately locating the connection, and makes the subsequent detection of the connection more targeted. In order to accurately evaluate the actual measurement results, a standard is required for comparison.By establishing a standard light wave path under the irradiation of reference coherent light, the deviation between the actual joint and the ideal state can be more intuitively observed and quantified, thereby improving the accuracy and reliability of the detection. Then, based on the reference coherent light irradiating the joint position of the standard bottle body and the bottle bottom, a plurality of first reference reflection points are obtained, and the plurality of the first reference reflection points are connected into a first light wave path, so that the first reference reflection points and the first light wave path can reflect the reflection of light under the ideal state (the joint position of the standard bottle body and the bottle bottom), providing a standard for comparing the actual measurement results. Then, based on the measurement coherent light irradiating the joint position of the bottle body and the bottle bottom, a plurality of First measurement reflection points are selected, and the plurality of the first measurement reflection points are connected into a second light wave path, so that the light wave path information of the connection between the bottle body and the bottle bottom under actual measurement conditions is obtained, and the second light wave path reflects the influence of the real surface state of the connection on the light reflection, and the difference between the second light wave path and the first light wave path can directly reflect the surface irregularity (such as curvature, groove, etc.) of the connection, and then the first light wave path and the second light wave path are compared at preset points to obtain the interference point spacing, and the drop value of the first light wave path and the second light wave path at the preset point is obtained according to the interference point spacing, and the drop value is calculated. The value is used as the surface information of the joint. In this way, the surface characteristics of the joint are accurately quantified through the surface information of the joint. The interference point spacing and the drop value can accurately describe the undulation of the joint surface, that is, the curvature change. The surface information of the joint obtained in this way can be used for the subsequent calculation of curvature-related parameters (such as the radius of curvature), and then evaluate the influence of curvature on structure and performance. For example, when analyzing an enamel porcelain with a complex surface, accurate surface information is helpful to determine whether the design requirements have been met during the production process, as well as the influence of the surface shape on optical properties (such as light reflection and refraction), so as to evaluate Its quality is due to the fact that multiple first reference reflection points and multiple first measurement reflection points are screened at the same incident point position and different reflection point positions to obtain multiple groups of reference-reflection points, thus screening out key data points for calculating the groove depth. Through this screening method, we can focus on those points that have position differences between the standard and actual measurements. These points are related to surface defects such as grooves, laying the foundation for the subsequent accurate calculation of the groove depth. Among them, multiple first reference reflection points and multiple first measurement reflection points are screened at the same incident point position and different reflection point positions to obtain multiple groups of reference-reflection points. The purpose of this step is to screen out key data points related to surface defects such as grooves.Because in standard and actual measurements, these points with the same incident point but different reflection point positions are likely to be caused by differences in light reflection due to uneven factors such as grooves on the surface. Secondly, the drop value is to compare the first light wave path and the second light wave path at preset points to obtain the interference point spacing, and obtain the drop value of the first light wave path and the second light wave path at the preset points based on the interference point spacing. It serves as the surface information of the connection, reflecting the undulation of the surface at the connection, that is, the curvature change, and then obtain multiple phase differences of multiple groups of reference-reflection points in turn. In this way, the phase difference is a key intermediate parameter for calculating the groove depth. It reflects the phase change of the reference light and the measurement light after being reflected from the surface of the joint, and this phase change is closely related to the groove depth, providing necessary data support for the subsequent precise calculation of the groove depth. For example, in an optical interference measurement system, accurate phase difference measurement can be converted into precise calculation of the groove depth, thereby realizing quantitative evaluation of surface microscopic defects, which is of great significance for judging the surface quality of enamel porcelain. Finally, the wavelength and incident angle of the preset light wave are obtained, and multiple groove depths are calculated in turn according to the multiple phase differences, incident angles of the light wave and wavelengths. In this way, all the groove depth data are integrated to form complete information about the grooves at the joint. This information can be used to further analyze the distribution pattern of the grooves, depth change trends, etc., providing rich data support for comprehensive evaluation of the surface quality of the joint, and helping to have a deeper understanding of the microstructure and defects of the enamel porcelain surface.

[0099] In one embodiment, the step S4 of obtaining microcrystal stress arrangement information according to the internal stress distribution characteristic information, and obtaining a stress dispersion degree value according to the microcrystal stress arrangement information, comprises:

[0100] S401, obtaining the crystal structure of the enamel porcelain according to the internal stress distribution characteristic information, and identifying multiple crystal plane diffraction peaks of the crystal structure of the enamel porcelain based on the diffraction spectrum;

[0101] S402, obtaining a plurality of position offsets of a plurality of the crystal plane diffraction peaks based on the Bragg law, calculating a plurality of lattice strain values ​​according to the plurality of position offsets, and using strain information corresponding to the plurality of lattice strain values ​​as crystallite stress arrangement information;

[0102] S403, acquiring a plurality of crystal plane stresses of a corresponding lattice according to a plurality of the lattice strain values;

[0103] S404, calculating an average crystal plane stress according to the plurality of crystal plane stresses, and calculating a standard deviation of the crystal plane stress according to the plurality of crystal plane stresses and the average crystal plane stress, wherein the calculation formula is:

[0104]

[0105] Where S represents the standard deviation of crystal plane stress, p(σ) l represents the lth crystal plane stress, N represents the number of crystal plane stresses, l represents the sequence number of crystal plane stresses, represents the average crystal plane stress;

[0106] S405 , obtaining a stress dispersion value according to a ratio of the crystal plane stress standard deviation to the average crystal plane stress.

[0107] As described in the above steps S401-S405, based on non-destructive testing technologies such as X-ray diffraction, crystal structure information is mainly reflected by crystal plane diffraction peaks in the diffraction spectrum, wherein, when X-rays are irradiated on the crystal material, due to the regular arrangement of atoms in the crystal, the X-rays will be scattered, and at a specific angle, the scattered X-rays will interfere with each other and strengthen, thereby forming peaks with higher intensity on the diffraction spectrum, and these peaks are crystal plane diffraction peaks. In order to further study the stress arrangement of microcrystals, these diffraction peaks must first be accurately identified, wherein, the crystal has a regular atomic arrangement structure, and different crystal plane spacings and atomic arrangements will cause X-rays to diffract and strengthen at a specific angle, forming crystal plane diffraction peaks. The characteristics of each crystal plane diffraction peak, such as position, intensity and shape, are directly related to factors such as the orientation, atomic arrangement and crystal plane spacing of a specific crystal plane in the crystal, thereby establishing a connection between crystal structure and stress. This step is the basis for subsequent calculation of parameters such as lattice strain value and crystal plane stress, ensuring the accuracy and scientificity of the entire analysis process. On this basis, the present invention first obtains the crystal structure of enamel colored porcelain according to the internal stress distribution characteristic information, wherein the internal stress distribution characteristic information is obtained by analyzing the internal structure changes of enamel colored porcelain by X-ray diffractometer, and identifying multiple crystal plane diffraction peaks of the crystal structure of enamel colored porcelain based on the diffraction spectrum, so that the accurate identification of the crystal plane diffraction peaks in the crystal structure is the key starting point for obtaining the microcrystalline stress arrangement information. The position, intensity and shape of the crystal plane diffraction peaks are closely related to the crystal structure and the internal stress state. By identifying these diffraction peaks, the orientation and distribution of different crystal planes in the crystal can be determined, thereby providing basic data for analyzing microcrystalline stress. For example, when studying the microstructure of enamel colored porcelain, the appearance or absence of different crystal plane diffraction peaks and their relative intensity can reflect the proportion and arrangement of different mineral components in the crystal, which is of great significance for understanding the composition and performance of the material. At the same time, the position change of the diffraction peak can also preliminarily indicate whether there is lattice distortion caused by stress, because Bragg's law is the basic principle of X-ray diffraction analysis of crystal structure and stress. According to this law, there is a quantitative relationship between the position offset of the crystal plane diffraction peak and the change in lattice spacing (i.e., lattice strain value). By calculating the lattice strain value, the position change of the diffraction peak can be converted into microcrystalline deformation information with physical significance. This is the core step of obtaining microcrystalline stress arrangement information from diffraction spectrum data, which is crucial for accurately understanding the internal micromechanical state of the material. Then, based on the Bragg law, multiple position offsets of multiple crystal plane diffraction peaks are obtained, and multiple lattice strain values ​​are calculated according to multiple position offsets. The strain information corresponding to the multiple lattice strain values ​​is used as microcrystalline stress arrangement information, so that the position offset of the crystal plane diffraction peak is calculated using the Bragg law, and the change in lattice spacing can be accurately obtained, and then the lattice strain value is calculated. The lattice strain value directly reflects the microscopic deformation of the microcrystal under stress, and is an important part of the microcrystalline stress arrangement information.By obtaining the lattice strain values ​​of multiple crystal planes, the degree of stress deformation of the microcrystal in different directions can be understood, and then the corresponding multiple crystal plane stresses of the lattice can be obtained according to the multiple lattice strain values, so that the lattice strain value is converted into crystal plane stress, making the description of the stress condition of the microcrystal more intuitive and with practical physical significance. Crystal plane stress reflects the stress magnitude of the microcrystal on different crystal planes, which is of great significance for analyzing the directionality and inhomogeneity of stress distribution inside the material. Then, the average crystal plane stress is calculated according to the multiple crystal plane stresses, and the standard deviation of the crystal plane stress is calculated according to the multiple crystal plane stresses and the average crystal plane stress. Then the average crystal plane stress provides the average level of the microcrystal stress on the whole, which is a macroscopic description of the stress state of the microcrystal. The standard deviation of crystal plane stress quantifies the degree of discreteness of crystal plane stress relative to the average stress, reflecting the inhomogeneity of stress distribution. The combination of these two parameters can comprehensively evaluate the distribution characteristics of microcrystalline stress. Finally, the stress dispersion value is obtained according to the ratio of the standard deviation of the crystal plane stress to the average crystal plane stress. In this way, the stress dispersion value further normalizes the stress distribution inhomogeneity index, making it have a clearer physical meaning and comparability. This value can be directly used in combination with other parameters (such as multi-layer structure connection stress, groove density ratio, etc.) to jointly evaluate the structural integrity and quality status of enamel porcelain. For example, when comparing enamel porcelain from different batches or different production processes, the stress dispersion value can be used as a unified indicator to measure the quality differences in its internal stress distribution. A smaller stress dispersion value usually indicates that the internal stress distribution of the material is more uniform and the structural integrity is better; otherwise, there may be potential quality problems.

[0108] In one embodiment, the step S5 of obtaining the connection stress of the multilayer structure according to the curvature and surface roughness of the connection includes:

[0109] S501, obtaining a connecting layer between the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connecting layer includes a glaze layer and an enamel layer;

[0110] S502, obtaining glaze layer stress according to the glaze layer;

[0111] S503, obtaining enamel layer stress according to the enamel layer;

[0112] S504, obtaining a corresponding curvature radius according to the curvature of the connection;

[0113] S505, obtaining a surface roughness defect radius, a surface roughness peak value, and a surface valley value according to the surface roughness, and calculating a surface roughness amplitude according to a distance between the surface roughness peak value and the surface valley value;

[0114] S506, calculating the connection stress of the multilayer structure according to the glaze layer stress, the enamel layer stress, the radius of curvature and the amplitude of the surface roughness, wherein the calculation formula is:

[0115]

[0116] Where D(c) represents the connection stress of the multilayer structure, Y(σ)1 represents the stress of the glaze layer, Y(σ)2 represents the stress of the enamel layer, R represents the radius of curvature, H represents the amplitude of the surface roughness, r represents the radius of the surface roughness defect, represents the stress concentration factor caused by curvature, Represents the stress concentration factor caused by surface roughness.

[0117] As described in the above steps S501-S506, since the enamel colored porcelain is a multi-layer structure, the differences between different layers will lead to the complexity of stress distribution. In order to accurately calculate the connection stress of the multi-layer structure, the structural layers involved must be determined first so as to analyze the characteristics of each layer. This is the basic requirement based on the mechanical analysis of multi-layer structure materials, and provides a structural basis for subsequent steps. The present invention first obtains the connection layer of the bottle body and the bottom of the bottle of enamel colored porcelain, wherein the connection layer includes a glaze layer and an enamel layer, so that the specific structural level of the research object is clarified, and a basic framework is provided for the subsequent analysis of the connection stress of the multi-layer structure. The glaze layer and the enamel layer have different physical and chemical properties in the enamel colored porcelain. The interaction between them and their respective characteristics have an important influence on the stress distribution at the connection. For example, the glaze layer may mainly affect the overall structural strength and stability, while the characteristics of the enamel layer (such as hardness, thermal expansion coefficient, etc.) will affect the stress state of the surface. Understanding the composition of the connection layer helps to more accurately analyze the mechanism of stress generation and transmission, thereby better evaluating the structural integrity, and then obtain the glaze layer stress according to the glaze layer, so that the glaze layer stress is an important component of the connection stress of the multi-layer structure. Accurately obtaining the stress of the glaze layer can evaluate the stress state of the glaze layer itself at the joint, which is of great significance for judging whether there is a potential risk of rupture in the glaze layer and the stress matching between other layers. Then, the stress of the enamel layer is obtained according to the enamel layer. The glaze layer stress and the enamel layer stress are obtained by obtaining the internal structure changes through an optical microscope, and then analyzing the relationship between the internal structure changes and the preset stress to obtain the glaze layer stress and the enamel layer stress. For example, how much stress will cause the internal crystals to have how many positions, so the enamel layer stress is also a key part of the multi-layer structure joint stress. Understanding the enamel layer stress helps to evaluate the stability of the enamel layer at the joint and its ability to work with other layers. The stress state of the enamel layer will affect its surface flatness, color stability and other properties, and then affect the overall quality of the enamel porcelain. Then, the corresponding radius of curvature is obtained according to the curvature of the joint. The radius of curvature is an important parameter to describe the geometric shape of the joint, which is closely related to the degree of stress concentration. Accurately obtaining the radius of curvature can be used to subsequently calculate the impact of curvature on the stress of the multilayer structure connection, help evaluate the stress concentration area and stress distribution changes caused by curvature, and then obtain the surface roughness defect radius, surface roughness peak value and surface valley value according to the surface roughness, and calculate the surface roughness amplitude according to the distance between the surface roughness peak value and the surface valley value, so that the surface roughness related parameters fully describe the microscopic geometric characteristics of the surface at the connection. The surface roughness defect radius can reflect the size of the surface defect, and the surface roughness peak value and valley value and the roughness amplitude can reflect the degree of surface undulation.These parameters are of great significance for accurately evaluating the influence of surface roughness on the connection stress of multilayer structures. Based on the curved beam theory in elastic mechanics, firstly, for structures with curvature, the stress concentration factor can be expressed. This is a simplified expression. The actual situation may be more complicated and require consideration of more geometric and material factors). This coefficient reflects the amplification effect of curvature on the stress at the joint. For example, when the radius of curvature is small (i.e., the curvature is large) and the surface roughness amplitude is relatively large, the stress concentration coefficient will be large. Second: For surface roughness, it can be regarded as a series of tiny geometric defects. According to the stress concentration theory in fracture mechanics, when there are surface defects, the stress concentration coefficient can be expressed by the formula It is approximated by , where is the root radius of the surface roughness defect (assuming the rough shape is semicircular). This coefficient represents the stress amplification factor caused by surface roughness. Finally, the multi-layer structure connection stress is calculated based on the glaze layer stress, enamel layer stress, curvature radius and surface roughness amplitude. This comprehensively considers the stress of the glaze layer and the enamel layer, and the geometric characteristics of the connection (curvature radius and surface roughness amplitude). The multi-layer structure connection stress is calculated, which can accurately evaluate the overall stress state of the connection. This result can be directly used to determine whether there is a risk of structural damage caused by stress concentration at the connection, which provides a key basis for evaluating the structural integrity of enamel porcelain.

[0118] In one embodiment, the step S6 of obtaining the structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value includes:

[0119] S601, normalizing the connection stress of the multi-layer structure to obtain a normalized value of the connection stress of the multi-layer structure;

[0120] S602, normalizing the groove density ratio to obtain a groove density normalized value;

[0121] S603, normalizing the stress dispersion degree value to obtain a stress dispersion degree normalized value;

[0122] S604, calculating the structural integrity coefficient according to the normalized value of the connection stress of the multi-layer structure, the normalized value of the groove density, and the normalized value of the stress dispersion degree, wherein the calculation formula is:

[0123] C=1-[g(y)*W1+m(z)*W2+l(s)*(1-W1-W2)];

[0124] Among them, C represents the structural integrity coefficient, g(y) represents the normalized value of the multilayer structure connection stress, W1 represents the weight factor of the structural integrity coefficient, m(z) represents the normalized value of the groove density, W2 represents the weight factor of the normalized value of the groove density, and l(s) represents the normalized value of the stress dispersion degree.

[0125] As described in the above steps S601-S604, in the comprehensive evaluation of multiple factors, the dimensions and numerical ranges of each factor are often different. In order to make the multi-layer structure connection stress and other parameters (such as groove density ratio and stress discreteness value) in the same mathematical framework to perform reasonable weighted summation to calculate the structural integrity coefficient, it is necessary to normalize it. The present invention first normalizes the multi-layer structure connection stress to obtain the normalized value of the multi-layer structure connection stress. Such normalization maps the value of the multi-layer structure connection stress to a specific interval (usually 0 to 1 or -1 to 1, etc.), so that the multi-layer structure connection stress under different samples or different measurement conditions is comparable. This helps to avoid excessive dominance or neglect of certain factors due to the absolute size difference of stress values ​​when comprehensively evaluating the structural integrity coefficient, thereby more accurately reflecting the relative contribution of each factor to the structural integrity. For example, when comparing the structural integrity of a batch of enamel colored porcelain, due to differences in manufacturing processes, material properties and other factors, the original values ​​of the multi-layer structure connection stress may vary greatly. After normalization, they can be compared on the same scale, and the relative structural status of each sample in the whole can be evaluated more objectively, laying the foundation for the subsequent accurate calculation of the structural integrity coefficient. Then, the groove density ratio is normalized to obtain the groove density normalized value. Similar to the normalization of the multi-layer structure connection stress, the normalization of the groove density ratio makes this parameter have a unified comparison standard under different samples or measurement conditions. This helps to more accurately evaluate the relative importance of groove density in the structural integrity assessment and avoid unreasonable influence on the results due to differences in original data. For example, when analyzing the quality of different batches of enamel porcelain, the groove density ratio may vary due to different production processes or use environments. After normalization, the relative level of groove density in each sample can be more intuitively seen, as well as its influence on the structural integrity coefficient in combination with other factors, so as to more accurately judge the structural integrity status. Then, the stress dispersion degree value is normalized to obtain the stress dispersion degree normalized value. After the stress dispersion degree value is normalized, when comprehensively evaluating the structural integrity coefficient, the influence of stress distribution uniformity relative to other factors can be more accurately reflected. It enables the stress dispersion degree to work synergistically with parameters such as the multi-layer structure connection stress and the groove density ratio to jointly reflect the overall status of the structural integrity. For example, when evaluating the structural stability of an enamel porcelain, the normalization of the stress dispersion degree value allows it to be compared and weightedly calculated with other factors (such as stress magnitude and groove distribution) on the same order of magnitude.In this way, the comprehensive influence of stress at the micro and macro levels can be considered more comprehensively, providing a more scientific basis for judging whether there are potential defects in the structure. Finally, the structural integrity coefficient is calculated according to the normalized value of the multi-layer structure connection stress, the normalized value of the groove density, and the normalized value of the stress dispersion degree. The structural integrity coefficient is a comprehensive quantitative indicator, which comprehensively considers the influence of multiple key factors such as the multi-layer structure connection stress, the groove density ratio, and the stress dispersion degree value on the structural integrity of the connection between the body and the bottom of the enamel porcelain bottle. By calculating the structural integrity coefficient, the structural integrity of the enamel porcelain can be uniformly and objectively identified.

[0126] In one embodiment, the step S7 of identifying defects at the joint between the bottle body and the bottle bottom of the enamel colored porcelain according to the structural integrity coefficient comprises:

[0127] S701, calculating a structural integrity coefficient difference according to the structural integrity coefficient and a preset standard structural integrity coefficient;

[0128] S702, determining whether the structural integrity coefficient difference is less than a preset threshold;

[0129] When the complete difference is less than the preset threshold, it is determined that there is a defect at the connection between the bottle body and the bottom of the enamel porcelain.

[0130] As described in the above steps S701-S702, the present invention first calculates the difference of the structural integrity coefficient according to the structural integrity coefficient and the preset standard structural integrity coefficient, and then determines whether the difference of the structural integrity coefficient is less than the preset threshold value. When the complete difference is less than the preset threshold value, it is determined that there is a defect at the connection between the bottle body and the bottom of the enamel colored porcelain. In this way, by calculating the difference of the structural integrity coefficient, the degree of deviation between the structural integrity of the current enamel colored porcelain and the preset standard can be intuitively understood. This difference can quantitatively reflect the difference between the actual state of the connection and the ideal state (preset standard), and provides a clear numerical basis for subsequent judgment of whether there is a defect. At the same time, the setting of the preset threshold provides a clear boundary for judging whether there is a defect in the enamel colored porcelain. By comparing the difference of the structural integrity coefficient with the preset threshold value, the enamel colored porcelain can be quickly and accurately classified to determine whether it meets the quality requirements. If the difference is less than the preset threshold value, it means that the structural integrity of the connection is good and meets the standard; otherwise, there may be defects, which need further inspection or processing, and then the defect judgment of the connection between the base and the bottle body is carried out by subdivision, which can solve the problem of increased identification error of enamel colored porcelain caused by the influence of the detection equipment.

[0131] The present application also provides an enamel porcelain defect identification system based on non-destructive testing technology, comprising:

[0132] The first acquisition module 1 is used to acquire the connection feature information of the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connection feature information includes the surface connection state feature information and the internal stress distribution feature information;

[0133] The second acquisition module 2 is used to acquire the connection surface information and the connection groove information according to the surface connection state characteristic information, and acquire the connection curvature and surface roughness according to the connection surface information;

[0134] A third acquisition module 3 is used to obtain the groove density ratio per unit area according to the groove information of the joint;

[0135] A fourth acquisition module 4 is used to acquire microcrystal stress arrangement information according to the internal stress distribution characteristic information, and acquire a stress dispersion degree value according to the microcrystal stress arrangement information;

[0136] A fifth acquisition module 5 is used to acquire the connection stress of the multilayer structure according to the curvature and surface roughness of the connection;

[0137] A sixth acquisition module 6, for acquiring a structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value;

[0138] The first identification module 7 is used to identify defects at the joint between the bottle body and the bottle bottom of the enamel porcelain according to the structural integrity coefficient.

[0139] In one embodiment, the second acquisition module includes:

[0140] A first acquisition unit is used to acquire the appearance information of the corresponding enamel porcelain according to the surface connection state characteristic information, and acquire the connection position of the bottle body and the bottle bottom according to the appearance information;

[0141] A first reference unit, configured to obtain a plurality of first reference reflection points by irradiating the connection position of the standard bottle body and the bottle bottom based on the reference coherent light, and connect the plurality of the first reference reflection points into a first light wave path;

[0142] A first measuring unit, configured to obtain a plurality of first measuring reflection points based on the connection position of the bottle body and the bottle bottom irradiated by measuring coherent light, and connect the plurality of first measuring reflection points into a second light wave path;

[0143] A first comparison unit is used to compare the first light wave path and the second light wave path at preset points to obtain an interference point spacing, and obtain a drop value between the first light wave path and the second light wave path at a preset point according to the interference point spacing, and use the drop value as the surface information of the connection;

[0144] A first screening unit, used for screening the plurality of first reference reflection points and the plurality of first measurement reflection points with the same incident point position and different reflection point positions to obtain a plurality of groups of reference-reflection points;

[0145] A second acquisition unit, used for sequentially acquiring a plurality of phase differences of a plurality of groups of reference-reflection points;

[0146] The first calculation unit is used to obtain the wavelength and incident angle of the preset light wave, and calculate the depths of the multiple grooves in sequence according to the multiple phase differences, incident angles of the light wave and wavelengths, wherein the calculation formula is:

[0147]

[0148] Where, d represents the depth of the oth to kth grooves, γ represents the wavelength, represents the phase difference, θ represents the incident angle of the light wave, and o represents the number of groove depths, where o=1...k;

[0149] The depth information corresponding to the depths of the plurality of grooves is used as the groove information of the joint.

[0150] The present invention also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the above-mentioned method for identifying defects in enamel porcelain based on non-destructive testing technology are implemented.

[0151] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing related hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0152] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0153] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for identifying defects in enamel porcelain based on non-destructive testing technology, characterized in that: include: Acquire connection feature information of the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connection feature information includes surface connection state feature information and internal stress distribution feature information; Acquire the curved surface information and the groove information of the joint according to the surface connection state characteristic information, and acquire the curvature and the surface roughness of the joint according to the curved surface information of the joint; Obtaining the groove density ratio per unit area according to the groove information at the joint; Acquire microcrystal stress arrangement information according to the internal stress distribution characteristic information, and acquire stress dispersion degree value according to the microcrystal stress arrangement information; Obtaining the connection stress of the multilayer structure according to the curvature and surface roughness of the connection; Obtaining a structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value; Defects at the joint between the bottle body and the bottle bottom of the enamel porcelain are identified based on the structural integrity coefficient.

2. The method for identifying enamel porcelain defects based on nondestructive testing technology according to claim 1 is characterized in that: The step of obtaining the curved surface information and the groove information of the joint according to the surface connection state characteristic information comprises: Acquire the appearance information of the corresponding enamel porcelain according to the surface connection state characteristic information, and acquire the connection position between the bottle body and the bottle bottom according to the appearance information; Based on the reference coherent light irradiating the connection position of the standard bottle body and the bottle bottom, a plurality of first reference reflection points are obtained, and the plurality of first reference reflection points are connected into a first light wave path; Based on measuring the connection position of the bottle body and the bottle bottom irradiated by the coherent light, a plurality of first measurement reflection points are obtained, and the plurality of first measurement reflection points are connected into a second light wave path; Comparing the first light wave path and the second light wave path at preset points to obtain an interference point spacing, and obtaining a drop value between the first light wave path and the second light wave path at a preset point according to the interference point spacing, and using the drop value as the surface information of the connection; Screening the plurality of first reference reflection points and the plurality of first measurement reflection points at the same incident point position and different reflection point positions to obtain a plurality of groups of reference-reflection points; sequentially acquiring a plurality of phase differences of a plurality of groups of reference-reflection points; The wavelength and incident angle of the preset light wave are obtained, and a plurality of groove depths are calculated in sequence according to the plurality of phase differences, incident angles of the light wave and wavelengths, wherein the calculation formula is: Where, d represents the depth of the oth to kth grooves, γ represents the wavelength, represents the phase difference, θ represents the incident angle of the light wave, and o represents the number of groove depths, where o=1...k; The depth information corresponding to the depths of the plurality of grooves is used as the groove information of the joint.

3. The method for identifying enamel porcelain defects based on nondestructive testing technology according to claim 1 is characterized in that: The step of obtaining microcrystal stress arrangement information according to the internal stress distribution characteristic information, and obtaining a stress dispersion degree value according to the microcrystal stress arrangement information comprises: Acquiring the crystal structure of the enamel porcelain according to the internal stress distribution characteristic information, and identifying multiple crystal plane diffraction peaks of the crystal structure of the enamel porcelain based on the diffraction spectrum; Acquire multiple position offsets of the multiple crystal plane diffraction peaks based on the Bragg law, calculate multiple lattice strain values ​​according to the multiple position offsets, and use strain information corresponding to the multiple lattice strain values ​​as crystallite stress arrangement information; Acquire a plurality of crystal plane stresses of the corresponding lattice according to the plurality of lattice strain values; Calculating an average crystal plane stress according to the plurality of crystal plane stresses, and calculating a standard deviation of the crystal plane stress according to the plurality of crystal plane stresses and the average crystal plane stress; The stress dispersion value is obtained according to the ratio of the crystal plane stress standard deviation to the average crystal plane stress.

4. The method for identifying defects of enamel porcelain based on nondestructive testing technology according to claim 1 is characterized in that: The step of obtaining the connection stress of the multilayer structure according to the curvature and surface roughness of the connection part includes: Obtaining a connecting layer between the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connecting layer comprises a glaze layer and an enamel layer; obtaining glaze layer stress according to the glaze layer; obtaining enamel layer stress according to the enamel layer; Obtaining a corresponding curvature radius according to the curvature of the connection; Acquire a surface roughness defect radius, a surface roughness peak value, and a surface valley value according to the surface roughness, and calculate a surface roughness amplitude according to a distance between the surface roughness peak value and the surface valley value; The multi-layer structure connection stress is calculated according to the glaze layer stress, the enamel layer stress, the curvature radius and the surface roughness amplitude, wherein the calculation formula is: Where D(c) represents the connection stress of the multilayer structure, Y(σ)1 represents the stress of the glaze layer, Y(σ)2 represents the stress of the enamel layer, R represents the radius of curvature, H represents the amplitude of the surface roughness, r represents the radius of the surface roughness defect, represents the stress concentration factor caused by curvature, Represents the stress concentration factor caused by surface roughness.

5. The method for identifying enamel porcelain defects based on nondestructive testing technology according to claim 1 is characterized in that: The step of obtaining the structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value includes: Normalizing the multi-layer structure connection stress to obtain a normalized value of the multi-layer structure connection stress; Normalizing the groove density ratio to obtain a groove density normalized value; Normalizing the stress dispersion degree value to obtain a stress dispersion degree normalized value; The structural integrity coefficient is calculated according to the normalized value of the multi-layer structure connection stress, the normalized value of the groove density, and the normalized value of the stress dispersion degree, wherein the calculation formula is: C=1-[g(y)*W1+m(z)*W2+l(s)*(1-W1-W2)]; Among them, C represents the structural integrity coefficient, g(y) represents the normalized value of the multilayer structure connection stress, W1 represents the weight factor of the structural integrity coefficient, m(z) represents the normalized value of the groove density, W2 represents the weight factor of the normalized value of the groove density, and l(s) represents the normalized value of the stress dispersion degree.

6. The method for identifying enamel porcelain defects based on nondestructive testing technology according to claim 1 is characterized in that: The step of identifying defects at the joint between the bottle body and the bottle bottom of the enamel colored porcelain according to the structural integrity coefficient comprises: Calculating a structural integrity coefficient difference according to the structural integrity coefficient and a preset standard structural integrity coefficient; Determining whether the structural integrity coefficient difference is less than a preset threshold; When the complete difference is less than the preset threshold, it is determined that there is a defect at the connection between the bottle body and the bottom of the enamel porcelain.

7. A enamel porcelain defect identification system based on non-destructive testing technology, characterized in that: include: The first acquisition module is used to acquire the connection feature information of the bottle body and the bottle bottom of the enamel colored porcelain, wherein the connection feature information includes surface connection state feature information and internal stress distribution feature information; A second acquisition module is used to acquire the connection curved surface information and the connection groove information according to the surface connection state characteristic information, and acquire the connection curvature and surface roughness according to the connection curved surface information; A third acquisition module is used to acquire the groove density ratio per unit area according to the groove information of the joint; A fourth acquisition module, configured to acquire crystallite stress arrangement information according to the internal stress distribution characteristic information, and acquire a stress dispersion degree value according to the crystallite stress arrangement information; A fifth acquisition module, used for acquiring the connection stress of the multilayer structure according to the curvature and surface roughness of the connection; A sixth acquisition module, configured to acquire a structural integrity coefficient according to the multi-layer structure connection stress, the groove density ratio and the stress dispersion value; The first identification module is used to identify defects at the joint between the bottle body and the bottle bottom of the enamel porcelain according to the structural integrity coefficient.

8. The enamel porcelain defect identification system based on non-destructive testing technology according to claim 7 is characterized in that: The second acquisition module includes: A first acquisition unit is used to acquire the appearance information of the corresponding enamel porcelain according to the surface connection state characteristic information, and acquire the connection position of the bottle body and the bottle bottom according to the appearance information; A first reference unit, configured to obtain a plurality of first reference reflection points by irradiating the connection position of the standard bottle body and the bottle bottom based on the reference coherent light, and connect the plurality of the first reference reflection points into a first light wave path; A first measuring unit, configured to obtain a plurality of first measuring reflection points based on the connection position of the bottle body and the bottle bottom irradiated by measuring coherent light, and connect the plurality of first measuring reflection points into a second light wave path; A first comparison unit is used to compare the first light wave path and the second light wave path at preset points to obtain an interference point spacing, and obtain a drop value between the first light wave path and the second light wave path at a preset point according to the interference point spacing, and use the drop value as the surface information of the connection; A first screening unit, used for screening the plurality of first reference reflection points and the plurality of first measurement reflection points with the same incident point position and different reflection point positions to obtain a plurality of groups of reference-reflection points; A second acquisition unit, used for sequentially acquiring a plurality of phase differences of a plurality of groups of reference-reflection points; The first calculation unit is used to obtain the wavelength and incident angle of the preset light wave, and calculate the depths of the multiple grooves in sequence according to the multiple phase differences, incident angles of the light wave and wavelengths, wherein the calculation formula is: Where, d represents the depth of the oth to kth grooves, γ represents the wavelength, represents the phase difference, θ represents the incident angle of the light wave, and o represents the number sequence of the groove depth, where o=1...k.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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