Thermal analysis sensor based on upper and lower temperature difference induction

Abstract

The invention relates to a thermal analysis sensor based on upper and lower temperature difference induction, and belongs to the technical field of thermal analysis. The thermal analysis sensor includes: a first substrate; the N thermocouple monomers made of the first material are arranged in the first substrate in a penetrating manner; the N thermocouple monomers made of a second material are arranged in the first substrate in a penetrating manner; wherein the first end of each thermocouple monomer made of the first material is connected with the first end of one adjacent thermocouple monomer made of the second material, and the second end of each thermocouple monomer made of the first material is connected with the second end of the other adjacent thermocouple monomer made of the second material; and the N thermocouple monomers made of the first material and the N thermocouple monomers made of the second material in the first substrate are sequentially connected in series. Through up-and-down temperature difference detection, the heat transfer direction of sample reaction in the crucible can be better fitted, and the measurement accuracy is improved.

Description

Technical Field

[0001] The invention relates to the technical field of thermal analysis, in particular to a thermal analysis sensor based on upper and lower temperature difference induction. Background Art

[0002] Differential Scanning Calorimetry (DSC) is a high-precision analytical instrument used to study the thermal properties of materials. It can accurately capture the physical transformations (such as melting, crystallization, and glass transition) and chemical reactions (such as decomposition and curing) that occur during the heating or cooling process of materials by monitoring the heat flow difference between the sample and the reference under programmed temperature control conditions in real time. Differential scanning calorimeters are widely used in polymer materials, medicine, metals, ceramics and other fields. They can provide key data such as the melting point, phase change temperature, thermal effect (enthalpy change) and thermal stability of materials, providing important support for material research and development, quality control and process optimization. Its high sensitivity and accuracy make it an indispensable tool in the field of materials science and thermal analysis.

[0003] Thermocouple structure is the core component of differential scanning calorimeter, which is used to detect the temperature difference between the sample and the reference and convert it into a heat flow signal. Research on existing differential scanning calorimeters found that the internal thermocouple structure is usually arranged as thermocouples of different materials in the same insulation layer to achieve the detection of internal and external temperature differences, which has the disadvantages of low accuracy and low detection sensitivity. Summary of the invention

[0004] In order to solve the above-mentioned problems in the prior art, the present invention provides a thermal analysis sensor based on upper and lower temperature difference sensing.

[0005] In a first aspect, an embodiment of the present application provides a thermal analysis sensor based on upper and lower temperature difference sensing, comprising: a first substrate; N thermocouple monomers of a first material, which are arranged throughout the first substrate; the first ends of the N thermocouple monomers of the first material are located on the first surface of the first substrate, and the second ends of the N thermocouple monomers of the first material are located on the second surface of the first substrate; N is a positive integer; N thermocouple monomers of a second material, which are arranged throughout the first substrate; the first ends of the N thermocouple monomers of the second material are located on the first surface of the first substrate, and the second ends of the N thermocouple monomers of the second material are located on the second surface of the first substrate; wherein the first end of each thermocouple monomer of the first material is connected to the first end of an adjacent thermocouple monomer of the second material, and the second end of each thermocouple monomer of the first material is connected to the second end of another adjacent thermocouple monomer of the second material, so that the N thermocouple monomers of the first material and the N thermocouple monomers of the second material in the first substrate are connected in series in sequence.

[0006] Optionally, the first ends of the two connected thermocouple monomers in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in a concentric circle structure; the second ends of the two connected thermocouple monomers in the second surface of the first substrate form a lower surface thermoelectric junction; the second surface of the first substrate includes N lower surface thermoelectric junctions; the N lower surface thermoelectric junctions are arranged in a concentric circle structure.

[0007] Optionally, the concentric circle structure formed by the N upper surface thermoelectric junctions has an outer circle with a diameter of Q millimeters; Q is a positive number; wherein the range of Q is 3 to 10.

[0008] Optionally, the first ends of the two connected thermocouple monomers in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in at least one of a matrix structure or a polygonal structure; the second ends of the two connected thermocouple monomers in the second surface of the first substrate form a lower surface thermoelectric junction; the second surface of the first substrate includes N lower surface thermoelectric junctions; the N lower surface thermoelectric junctions are arranged in at least one of a matrix structure or a polygonal structure.

[0009] Optionally, the thickness of the first substrate is M millimeters; M is a positive number; and the range of M is 0.3-1.2.

[0010] Optionally, the thermal analysis sensor further comprises a base; the second surface of the first substrate is connected to the base; wherein the size of the first substrate is smaller than the size of the base, so that the first substrate forms a boss on the base.

[0011] Optionally, the first substrate corresponds to the sample measurement area of ​​the thermal analysis sensor; adjacent thermocouple monomers of the first material and the thermocouple monomers of the second material constitute a pair of thermocouples; N pairs of thermocouples form a thermopile; the thermal analysis sensor also includes a second substrate; the second substrate corresponds to the reference area of ​​the thermal analysis sensor; wherein the structure of the thermopile in the first substrate is the same as that of the thermopile in the second substrate, and the end of the thermopile in the first substrate is connected to the end of the thermopile in the second substrate.

[0012] Optionally, the first substrate and the second substrate are the same substrate.

[0013] Optionally, the thermal analysis sensor further includes a base; the second surface of the first substrate is connected to the base; and the size of the first substrate is the same as that of the base.

[0014] Optionally, the thermal analysis sensor has at least two sample measurement areas.

[0015] The beneficial effects of the present invention include: The thermal analysis sensor provided in the embodiment of the present application has N thermocouple monomers of the first material and N thermocouple monomers of the second material all arranged throughout the first substrate, and the N thermocouple monomers of the first material and the N thermocouple monomers of the second material in the first substrate are connected in series in sequence, so that the two thermoelectric junctions of the N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the first substrate. The upper surface of the first substrate contacts the heat source for measurement, that is, the present application provides a method of upper and lower temperature difference sensing detection, and the measurement is achieved by detecting the overall temperature difference of the two surfaces, that is, through the upper and lower temperature difference detection, it can be more in line with the heat transfer direction of the sample reaction in the crucible, and the measurement accuracy is improved. At the same time, through the arrangement of the upper and lower thermoelectric junctions, compared with the traditional arrangement of thermocouples on the same plane, the density of the thermoelectric junctions can be greatly increased, so that the upper surface can more completely capture the heat released by the sample reaction in the crucible, thereby improving the thermoelectric conversion coefficient of the heat flow measurement. In addition, the embodiment of the present application provides a through-type thermocouple structure, which can reduce the thermal measurement time constant. The thermal analysis sensor can capture transient temperature changes more quickly, detect smaller temperature difference changes per unit time, and improve thermal resolution and detection sensitivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a first thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a thermopile provided by an embodiment of the present invention; Figure 3 A schematic diagram of the layout of a first thermopile provided in an embodiment of the present invention; Figure 4 A schematic diagram of the layout of a second thermopile provided in an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a second thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention; Figure 6 A schematic diagram of the structure of a third thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention; Figure 7 A schematic diagram of the structure of a fourth thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention; Figure 8 A schematic diagram of the structure of a fifth thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention; Fig. 9 A schematic diagram of the structure of a sixth thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention; Fig.10 This is a schematic diagram of the structure of a seventh thermal analysis sensor based on upper and lower temperature difference sensing provided by an embodiment of the present invention.

[0017] Reference numerals: 100 - thermal analysis sensor; 10 - first substrate; 20 - thermocouple monomer of the first material; 30 - thermocouple monomer of the second material; 40 - second substrate; 50 - base; 60 - insulating protective layer. DETAILED DESCRIPTION

[0018] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0019] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0020] Thermocouple structure is the core component of differential scanning calorimeter, which is used to detect the temperature difference between the sample and the reference and convert it into a heat flow signal. Research on existing differential scanning calorimeters found that the internal thermocouple structure is usually arranged as thermocouples of different materials in the same insulation layer to achieve the detection of internal and external temperature differences, which has the disadvantages of low accuracy and low detection sensitivity.

[0021] In view of the above problems, the present application proposes the following embodiments to solve the above technical problems.

[0022] See also Figure 1 and Figure 2 The embodiment of the present application provides a thermal analysis sensor 100 based on upper and lower temperature difference sensing, including a first substrate 10, N thermocouple monomers 20 made of a first material, and N thermocouple monomers 30 made of a second material.

[0023] Wherein, N is a positive integer, and its number can be set according to demand, such as the value range of N can be 100~200, which is not limited in this application.

[0024] In terms of connection, N thermocouple monomers 20 of the first material are disposed throughout the first substrate 10. The first ends of the N thermocouple monomers 20 of the first material are located on the first surface of the first substrate 10. The second ends of the N thermocouple monomers 20 of the first material are located on the second surface of the first substrate 10. Here, the first end of the thermocouple monomer 20 of the first material and the second end of the thermocouple monomer 20 of the first material are opposite ends.

[0025] That is, the first substrate 10 includes a first surface and a second surface that are arranged opposite to each other, N thermocouple monomers 20 made of the first material are arranged between the first surface and the second surface of the first substrate 10, and the first ends of the N thermocouple monomers 20 made of the first material are close to the first surface of the first substrate 10, and the second ends of the N thermocouple monomers 20 made of the first material are close to the second surface of the first substrate 10.

[0026] In terms of connection, N thermocouple monomers 30 of the second material are also arranged throughout the first substrate 10. The first ends of the N thermocouple monomers 30 of the second material are located on the first surface of the first substrate 10. The second ends of the N thermocouple monomers 30 of the second material are located on the second surface of the first substrate 10. Here, the first end of the thermocouple monomer 30 of the second material and the second end of the thermocouple monomer 30 of the second material are opposite ends.

[0027] That is, the first substrate 10 includes a first surface and a second surface that are arranged opposite to each other, N thermocouple monomers 30 of the second material are arranged between the first surface and the second surface of the first substrate 10, and the first ends of the N thermocouple monomers 30 of the second material are close to the first surface of the first substrate 10, and the second ends of the N thermocouple monomers 30 of the second material are close to the second surface of the first substrate 10.

[0028] In one embodiment, the thermocouple monomers 20 of the first material and the thermocouple monomers 30 of the second material are both cylindrical structures, that is, the first substrate 10 includes 2N circular through holes to accommodate N thermocouple monomers 20 of the first material and N thermocouple monomers 30 of the second material.

[0029] Regarding the connection relationship between the thermocouple monomer 20 of the first material and the thermocouple monomer 30 of the second material, specifically, the first end of each thermocouple monomer 20 of the first material is connected to the first end of an adjacent thermocouple monomer 30 of the second material, and the second end of each thermocouple monomer 20 of the first material is connected to the second end of another adjacent thermocouple monomer 30 of the second material, so that the N thermocouple monomers 20 of the first material and the N thermocouple monomers 30 of the second material in the first substrate 10 are connected in series in sequence (such as Figure 2 series structure shown).

[0030] It can be understood that for any thermocouple monomer 20 of the first material, a thermocouple monomer 30 of the second material connected to its first end is different from a thermocouple monomer 30 of the second material connected to its second end, so that the thermocouple monomers of different materials are arranged in an alternating manner and connected in series in sequence.

[0031] It should be noted that the adjacent thermocouple monomers 20 of the first material and the thermocouple monomers 30 of the second material form a pair of thermocouples, so that the thermal analysis sensor 100 includes N pairs of thermocouples, and the N pairs of thermocouples form a thermopile. In order to facilitate understanding of the structure of the thermal analysis sensor 100 provided in the embodiment of the present application, therefore, Figure 1 The first substrate 10 is separated from the thermopile to show their connection relationship. Figure 2 , the complete structure of the thermopile formed in the first substrate 10 is shown.

[0032] In addition, it should be noted that the thermocouple monomer 20 of the first material and the thermocouple monomer 30 of the second material are two thermocouple monomers with different materials. In one embodiment, the first material is gold platinum palladium, and the second material is gold. The adjacent thermocouple monomers 20 of the first material and the thermocouple monomers 30 of the second material can be connected by gold. The first substrate 10 can be a ceramic plate, for example, the first substrate 10 can be a co-fired temperature-resistant ceramic sheet. Of course, this is not limited here, and other temperature-resistant insulating materials can also be used.

[0033] Of course, in actual applications, other thermocouple materials may also be used, as long as the first material and the second material are different, and the material of the metal column may be the same as any of the materials.

[0034] The principle of the thermal analysis sensor 100 based on upper and lower temperature difference sensing provided in the embodiment of the present application is described below.

[0035] When the thermal analysis sensor 100 is used for specific measurements, the first surface of the first substrate 10 is used as the side close to the crucible. The first ends of the two thermocouple monomers connected in the first surface of the first substrate 10 form an upper surface thermoelectric junction; that is, the first surface of the first substrate 10 includes N upper surface thermoelectric junctions. The second ends of the two thermocouple monomers connected in the second surface of the first substrate 10 form a lower surface thermoelectric junction. That is, the second surface of the first substrate 10 includes N lower surface thermoelectric junctions. It can be understood that the two thermoelectric junctions of the N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the first substrate 10, and then when there is a temperature difference between the two surfaces, there will be a thermoelectric potential, thereby achieving measurement.

[0036] In summary, the thermal analysis sensor 100 based on upper and lower temperature difference sensing provided in the embodiment of the present application has the following beneficial effects: The thermal analysis sensor 100 provided in the embodiment of the present application has N thermocouple monomers 20 of the first material and N thermocouple monomers 30 of the second material all arranged in the first substrate 10, and the N thermocouple monomers 20 of the first material and the N thermocouple monomers 30 of the second material in the first substrate 10 are connected in series in sequence, so that the two thermoelectric junctions of the N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the first substrate 10. The upper surface of the first substrate 10 contacts the heat source for measurement, that is, the present application provides a method of upper and lower temperature difference sensing detection, and the measurement is achieved by detecting the overall temperature difference of the two surfaces, that is, through the upper and lower temperature difference detection, it can be more in line with the heat transfer direction of the sample reaction in the crucible, and the measurement accuracy is improved. At the same time, through the arrangement of the upper and lower thermoelectric junctions, compared with the traditional arrangement of thermocouples on the same plane, the density of the thermoelectric junctions can be greatly increased, so that the upper surface can more completely capture the heat released by the sample reaction in the crucible, thereby improving the thermoelectric conversion coefficient of the heat flow measurement. In addition, the embodiment of the present application provides a through-type thermocouple structure, which can reduce the thermal measurement time constant. The thermal analysis sensor 100 can capture transient temperature changes more quickly, detect smaller temperature difference changes per unit time, and improve thermal resolution and detection sensitivity.

[0037] Optionally, in one embodiment, the N upper surface thermoelectric junctions are arranged in a concentric circle structure, and correspondingly, due to their serial connection relationship, the N lower surface thermoelectric junctions are also arranged in a concentric circle structure.

[0038] For details, please refer to Figure 3 , Figure 3 The figure shows the concentric circle structure of N upper surface thermoelectric junctions, which are connected in series to form 6 concentric circles of different diameters from the outside to the inside.

[0039] It should be noted that the arrangement of the thermoelectric junctions is formed into a concentric circle structure, so that the thermoelectric junctions are radially distributed from the inside to the outside on the first substrate 10, and can evenly cover the entire area of ​​the bottom of the crucible to be measured, avoiding the thermal field blind area caused by the linear arrangement. At the same time, the thermoelectric junctions of the concentric circle structure can also simultaneously measure the temperature difference at different radial positions, capture the radial heat flow distribution in real time, and provide more comprehensive thermal field information, such as being able to provide a high-resolution temperature distribution map. In addition, since the shape of the crucible is also usually a circular structure, the thermoelectric junctions arranged in a concentric circle structure can better fit the shape of the crucible, achieve matching with the circular heat source at the bottom of the crucible, and further improve the measurement accuracy. In addition, the concentric circle distribution makes the thermoelectric junctions symmetrically distributed in all directions in space, increases the stability of the thermal analysis sensor 100 in a complex environment, and can achieve more stable and reliable detection.

[0040] In one embodiment, the concentric circle structure formed by N upper surface thermoelectric junctions has a diameter of Q mm on the outer side of the concentric circle structure; Q is a positive number; wherein the range of Q is 3-10.

[0041] That is, the diameter of the outermost circle of the concentric circle structure formed by the N upper surface thermoelectric junctions ranges from 3 mm to 10 mm.

[0042] Wherein, different numbers of upper surface thermoelectric junctions are formed according to different diameters.

[0043] For example, the concentric circle structure can form 140 pairs of thermoelectric junctions within a diameter of 6.5 mm.

[0044] Optionally, in one embodiment, the N upper surface thermoelectric junctions are arranged in a matrix structure, and correspondingly, due to their serial connection, the N lower surface thermoelectric junctions are also arranged in a matrix structure.

[0045] For details, please refer to Figure 4 , Figure 4 What is shown is a matrix structure formed by the arrangement of N upper surface thermoelectric junctions.

[0046] It should be noted that the matrix structure arranges the thermoelectric junctions in a regular grid form, which can be effectively applied to the thermal field distribution of rectangular or square heat sources, and has high resolution in the X and Y directions.

[0047] Wherein, different numbers of upper surface thermoelectric junctions are formed according to different sizes of the matrix structure.

[0048] Exemplarily, the matrix structure can form 112 pairs of thermoelectric junctions within a diameter of 6.5 mm*6.5 mm.

[0049] In addition, the distribution form of the above-mentioned thermoelectric junctions can also be a polygonal structure, such as a triangular structure, a hexagonal structure, a pentagonal structure, etc., which is not limited here.

[0050] In one embodiment, the thickness of the first substrate 10 is M millimeters.

[0051] Among them, M is a positive number; the range of M is 0.3 mm~1.2 mm.

[0052] For example, in a specific application, the value of M is 0.6 mm. Then the thickness of the first substrate 10 is 0.6 mm. When a 0.1 mm insulating ceramic substrate is used to construct the first substrate 10, six insulating ceramic substrates can be stacked to form a first substrate 10 with a thickness of 0.6 mm.

[0053] Furthermore, the range of M can be 0.4 mm to 1 mm.

[0054] It should be noted that setting the thickness of the first substrate 10 to 0.4 mm to 1 mm can significantly increase the temperature difference between the upper surface (close to the heat source) and the lower surface (far away from the heat source) of the first substrate 10, thereby improving the sensitivity of the differential measurement, that is, a significant temperature difference can be achieved between the upper and lower surfaces, thereby enhancing the signal output.

[0055] In the embodiment of the present application, the first substrate 10 corresponds to the sample measurement area of ​​the thermal analysis sensor; the adjacent thermocouple monomers 20 of the first material and the thermocouple monomers 30 of the second material form a pair of thermocouples; N pairs of thermocouples form a thermopile. On this basis, the thermal analysis sensor 100 further includes a second substrate 40.

[0056] The second substrate 40 corresponds to the reference region of the thermal analysis sensor 100. The thermopile in the first substrate 10 has the same structure as the thermopile in the second substrate 40, and the end of the thermopile in the first substrate 10 is connected to the end of the thermopile in the second substrate 40. The structure of the first substrate 10 is also the same as that of the second substrate 40.

[0057] For easier understanding, please combine Figure 5 As shown, Figure 5 The thermopiles of the two substrates are separated for easier understanding.

[0058] Since the structure of the thermopile in the first substrate 10 is the same as that of the thermopile in the second substrate 40, the structure of the thermopile in the second substrate 40 can refer to the above-mentioned embodiment and the corresponding Figure 1 The explanation is not repeated here.

[0059] It should be noted that in the actual measurement process, the sample is placed in a crucible, and then the crucible is placed in the sample measurement area (i.e., the first surface of the first substrate 10), and an empty crucible is placed in the reference area (i.e., the first surface of the second substrate 40) for measurement.

[0060] See also Figure 6 and Figure 7 The thermal analysis sensor 100 further includes a base 50 .

[0061] The second surface of the first substrate 10 is connected to the base 50. The size of the first substrate 10 is smaller than that of the base 50, so that the first substrate 10 forms a boss on the base 50.

[0062] Correspondingly, the second surface of the second substrate 40 is also connected to the base 50. The size of the second substrate 40 is smaller than that of the base 50, so that the second substrate 40 forms a boss on the base 50.

[0063] Taking the boss formed on the first substrate 10 as an example, the first substrate 10 in the form of a boss can concentrate heat and reduce lateral heat diffusion, that is, the heat transfer of the sample to be tested on the first substrate 10 will not diffuse to the surrounding area, but diffuse vertically, thereby improving the heat utilization efficiency and reducing the heat loss, that is, it can reduce heat loss, and further amplify the temperature difference between the upper and lower surfaces to provide high-sensitivity measurement.

[0064] Please continue reading Figure 6 and Figure 7 In one embodiment, the thermal analysis sensor 100 may further include an insulating protective layer 60. The insulating protective layer 60 is disposed on the first substrate 10 and the second substrate 40, respectively.

[0065] See also Figure 8 In one embodiment, the first substrate 10 and the second substrate 40 may be the same substrate. Figure 8 In the description, the first substrate 10 is used.

[0066] In other words, the sample measurement region and the reference region of the thermal analysis sensor 100 are respectively on the same substrate.

[0067] Accordingly, see Fig. 9 , the second surface of the first substrate 10 is connected to the base 50 ; and the size of the first substrate 10 is the same as the size of the base 50 .

[0068] See also Fig.10 In one embodiment, the insulating protection layer 60 may also have the same size as the first substrate 10 and the base 50 .

[0069] Optionally, the thermal analysis sensor 100 may have at least two sample measurement regions. In other words, the thermal analysis sensor 100 may include at least two first substrates 10. It should be noted that the thermopile in each sample measurement region needs to be connected to the thermopile in the reference region.

[0070] Exemplarily, the number of sample measurement areas may be three, and the thermocouple structure of each sample measurement area is the same as the thermocouple structure provided in the aforementioned embodiment.

[0071] This method can be used to measure the thermal effects of multiple samples at the same time. Compared with traditional single sample measurement, it can greatly improve the measurement efficiency and reduce the number of measurement tests. At the same time, samples of the same batch can be measured under exactly the same thermal field and heating rate conditions, eliminating the error interference caused by experimental conditions.

[0072] The following is a description of the manufacturing process of the thermal analysis sensor 100 based on upper and lower temperature difference sensing provided in the embodiment of the present application.

[0073] In one embodiment, a plurality of pairs of through holes are provided on an insulating substrate (the first substrate 10 or the second substrate 40), two adjacent through holes are respectively filled with gold and gold-platinum paste, and then gold paste is printed on the upper and lower surfaces to connect the two ends of the through holes filled with gold and gold-platinum, thereby forming thermoelectric junctions on the two end surfaces of the through holes filled with gold-platinum. All the thermoelectric junctions are connected in series to form a thermopile under the connection of any one of the connection strips of the filling paste (gold paste or gold-platinum paste) printed on the upper and lower surfaces.

[0074] The arrangement shape of multiple pairs of through holes on the insulating substrate can be a concentric circle structure or a matrix structure. Under the current hole filling process, the concentric circle structure can form 140 pairs of thermoelectric junctions within the range of φ6.5mm; the matrix structure can form 112 pairs of thermoelectric junctions within the range of 6.5×6.5mm. At the same time, the arrangement shape is not limited to ray-shaped arrangement, polygonal arrangement, five-pointed star arrangement, etc. In the concentric circle structure, the number of through holes in the circle is the base number, with a total of six circles.

[0075] An insulating crucible placement layer may be further provided on the upper surface of the insulating substrate; and an insulating base layer may be further provided under the lower surface of the insulating substrate.

[0076] The thermal analysis sensor 100 is arranged in a left and right stack, and the left and right thermocouples are differentially connected in series to form a differential calorimetric structure. A sample crucible and a reference crucible are placed on the upper surfaces of the left and right thermoelectric stacks, respectively.

[0077] Two areas are symmetrically distributed on the insulating substrate, namely the sample measurement area and the reference area.

[0078] Holes are opened at equal intervals on an insulating substrate, and one of two adjacent holes is filled with one metal slurry, while the other hole is filled with another slurry.

[0079] Two different metal holes are connected on the upper surface of the insulating substrate using metal paste to form an upper surface thermoelectric junction.

[0080] Two different metal holes are connected on the lower surface of the insulating substrate using metal paste to form a lower surface thermoelectric junction.

[0081] Different metal holes are connected in series through the upper and lower surface metals to form a thermopile.

[0082] At least one pair of thermocouples is symmetrically distributed between the sample measurement area and the reference area to form a thermopile.

[0083] The two thermopiles are connected differentially, and finally the signals are output by two pins, thus realizing a differential heat flow sensor that senses the upper and lower temperature differences.

[0084] An insulating protective layer may be added to the upper surface of the thermal analysis sensor 100 to protect the metal on the upper surface, and an insulating protective layer may be added to the lower surface to protect the metal layer on the lower surface.

[0085] The slurry poured into the openings of the insulating substrate includes at least two different metal slurries.

[0086] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0087] In the description of the embodiments of the present invention, it needs to be understood that terms such as “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “center”, “top”, “bottom”, “top”, “bottom”, “inside”, “outside”, “inside”, and “outside” indicate orientation or positional relationships.

[0088] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "assemble" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0089] In the description of the embodiments of the present invention, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0090] In the description of the embodiments of the present invention, it should be understood that "-" and "~" represent a range between two values, and the range includes the endpoints. For example, "AB" represents a range greater than or equal to A and less than or equal to B. "A~B" represents a range greater than or equal to A and less than or equal to B.

[0091] In the description of the embodiments of the present invention, the term "and / or" herein is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " herein generally indicates that the associated objects before and after are in an "or" relationship.

[0092] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A thermal analysis sensor based on upper and lower temperature difference sensing, characterized in that: include: a first substrate; N thermocouple monomers made of a first material are arranged through the first substrate; The first ends of the N thermocouple monomers of the first material are located on the first surface of the first substrate, and the second ends of the N thermocouple monomers of the first material are located on the second surface of the first substrate; N is a positive integer; N thermocouple monomers made of a second material are arranged through the first substrate; The first ends of the N thermocouple monomers made of the second material are located on the first surface of the first substrate, and the second ends of the N thermocouple monomers made of the second material are located on the second surface of the first substrate; Among them, the first end of each thermocouple monomer of the first material is connected to the first end of an adjacent thermocouple monomer of the second material, and the second end of each thermocouple monomer of the first material is connected to the second end of another adjacent thermocouple monomer of the second material, so that the N thermocouple monomers of the first material and the N thermocouple monomers of the second material in the first substrate are connected in series in sequence.

2. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 1 is characterized in that: The first ends of the two connected thermocouple monomers in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; The N upper surface thermoelectric junctions are arranged in a concentric circle structure; The second ends of the two connected thermocouple monomers in the second surface of the first substrate form a lower surface thermoelectric junction; The second surface of the first substrate includes N lower surface thermoelectric junctions; The N bottom surface thermoelectric junctions are arranged in a concentric circle structure.

3. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 1, characterized in that: The concentric circle structure formed by the N upper surface thermoelectric junctions has an outer circle with a diameter of Q mm; Q is a positive number; Among them, the range of Q is 3~10.

4. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 1, characterized in that: The first ends of the two connected thermocouple monomers in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; The N upper surface thermoelectric junctions are arranged in at least one of a matrix structure or a polygonal structure; The second ends of the two connected thermocouple monomers in the second surface of the first substrate form a lower surface thermoelectric junction; The second surface of the first substrate includes N lower surface thermoelectric junctions; The N bottom surface thermoelectric junctions are arranged in at least one of a matrix structure or a polygonal structure.

5. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 1, characterized in that: The thickness of the first substrate is M millimeters; M is a positive number; The range of M is 0.3~1.

2.

6. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 1, characterized in that: The thermal analysis sensor also includes a base; The second surface of the first substrate is connected to the base; The size of the first substrate is smaller than that of the base, so that the first substrate forms a boss on the base.

7. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 1, characterized in that: The first substrate corresponds to the sample measurement area of ​​the thermal analysis sensor; the adjacent thermocouple monomers of the first material and the thermocouple monomers of the second material form a pair of thermocouples; N pairs of thermocouples form a thermopile; The thermal analysis sensor further includes a second substrate; The second substrate corresponds to the reference area of ​​the thermal analysis sensor; The thermopile in the first substrate has the same structure as the thermopile in the second substrate, and an end of the thermopile in the first substrate is connected to an end of the thermopile in the second substrate.

8. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 7, characterized in that: The first substrate and the second substrate are the same substrate.

9. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 8, characterized in that: The thermal analysis sensor also includes a base; The second surface of the first substrate is connected to the base; and the size of the first substrate is the same as that of the base.

10. The thermal analysis sensor based on upper and lower temperature difference sensing according to claim 8, characterized in that: The thermal analysis sensor has at least two sample measurement areas.

Images