Chip test fixture

Abstract

A chip test fixture disclosed by the present invention comprises a PCB, a base, a turntable and pressing plates, the base is arranged on the PCB, the base is provided with an installation groove, a positioning hole, a conductive contact block and a first buckle structure, the installation groove is used for installing a chip, the chip can be rapidly and accurately installed in place through the arranged installation groove, and the turntable is matched with the plurality of pressing plates, so that the chip can be rapidly and accurately installed in place. The pressing plates can press chips of different specifications, an operator can conveniently and rapidly replace the pressing plates for the chips and test the chips, the arranged pressing plates are evenly distributed in the circumferential direction of the rotary disc, the pressing plates can be conveniently switched when the chips are tested, reliable contact with the conductive contact blocks is guaranteed through the arranged elastic contact pins, and the reliability of the chips is improved. Compared with the prior art, errors in the testing process are reduced, the elastic contact pins can be inserted into the positioning holes so that the rotating disc can be fixed conveniently, in-place sensing can be provided conveniently, and due to the high efficiency and universality of the whole jig, the requirements for different types of chip testing jigs can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and in particular to a chip testing fixture. Background Art

[0002] A chip test fixture is a special device used to test the performance and function of semiconductor chips to ensure that the chips meet design standards during the manufacturing process.

[0003] Existing chip test fixtures can usually only test a single type of chip. When the chip is replaced, the fixture needs to be readjusted or replaced, which is inefficient. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a chip test fixture that can improve test efficiency.

[0005] A chip testing fixture according to an embodiment of the present invention comprises a PCB board, a base, a turntable and a pressing plate, wherein the base is arranged on the PCB board, and the base is provided with a mounting groove, a positioning hole, a conductive contact block and a first buckle structure, wherein the mounting groove is used to mount the chip, and the positioning holes are provided with a plurality of conductive contact blocks, which are arranged in the positioning holes and correspond to the positioning holes one by one, wherein one end of the conductive contact block is electrically connected to the PCB board, and the other end of the conductive contact block is lower than the positioning hole; the turntable is rotatably connected to the base, and the end of the turntable close to the base is provided with a plurality of sets of elastic contact blocks. Contact pins, each group of the elastic contact pins includes a plurality of the elastic contact pins, the elastic contact pins are used to be inserted into the positioning holes to contact the other end of the conductive contact block; a plurality of pressure plates are provided, the pressure plates are hinged on the turntable, the plurality of pressure plates are evenly distributed along the circumference of the turntable, a second snap-fit ​​structure is provided at one end of the pressure plate away from the turntable, the second snap-fit ​​structure is used to snap-fit ​​and connect to the first snap-fit ​​structure, a plurality of contact pins are provided on one side of the pressure plate for contacting the chip, one end of the contact pin is used to electrically connect the elastic contact pin, and the other end of the contact pin is used to contact the contact on the chip.

[0006] At least the following beneficial effects are achieved: the installation groove is provided to facilitate quick and accurate installation of the chip; the cooperation between the turntable and the plurality of pressure plates enables the pressure plates to crimp chips of different specifications, which facilitates the operator to quickly replace the pressure plates for the chips and test the chips; the pressure plates are evenly distributed along the circumference of the turntable, which facilitates switching the pressure plates when testing the chips; because the pressure plates mainly serve to electrically connect the chips, different chips can be tested by switching different pressure plates; the elastic contact pins ensure reliable contact with the conductive contact blocks, reducing errors during the test; and the elastic contact pins can be inserted into the positioning holes to facilitate fixing the turntable and providing in-place sensing; due to the high efficiency and versatility of the entire fixture, the demand for different types of chip testing fixtures can be reduced, thereby reducing production costs, eliminating the trouble of replacing fixtures, and improving test efficiency.

[0007] According to some embodiments of the present invention, a pressure regulating device is further included, wherein the pressure regulating device is arranged on the base, the pressure regulating device is transmission-connected to the pressure plate, and the pressure regulating device is used to drive the pressure plate to press the chip in the installation slot. The pressure regulating device is arranged to adjust the pressure of the pressure plate, thereby ensuring that the pressure of the pressure plate on the chip can be quantified, so as to facilitate the adjustment of pressure parameters when testing the chip.

[0008] According to some embodiments of the present invention, the pressure regulating device includes a bracket, a motor, a pressure block and a screw rod, the bracket is arranged on the base, the motor is arranged on the bracket, the pressure block is vertically slidably connected to the bracket, the motor is transmission-connected to the screw rod, the screw rod is rotationally connected to the bracket, the pressure block is threadedly connected to the screw rod, and the motor is used to drive the pressure block to press the pressure plate. The pressure regulating device has a simple structure and relies on the drive of the screw rod to make the pressure adjustment more precise. The pressure block is threadedly connected to the screw rod to reduce the shaking of the pressure block and ensure the smooth progress of the pressure regulation process.

[0009] According to some embodiments of the present invention, the pressure regulating device also includes a pressure sensor, which is arranged on the pressure plate. The pressure block is used to press the pressure sensor, and the pressure sensor is electrically connected to the motor through the PCB board. The setting of the pressure sensor enables the motor to adaptively adjust the pressure according to demand, thereby facilitating automatic control of the pressure.

[0010] According to some embodiments of the present invention, a temperature regulating component is provided on the base, and the temperature regulating component is used to regulate the temperature in the mounting groove. The temperature regulating component is provided to simulate the temperature change of the environment and provide a temperature environment for chip testing.

[0011] According to some embodiments of the present invention, the temperature regulating component includes a heat sink and a semiconductor refrigeration plate, the semiconductor refrigeration plate has two temperature ends, one temperature end is placed in the base, and the other temperature end is placed in the heat sink, the semiconductor refrigeration plate is electrically connected to the temperature regulating component, the temperature regulating component is arranged on a PCB board, the temperature regulating component is used to control the temperature of the semiconductor refrigeration plate, the temperature regulating component has a simple structure, and the temperature is adjusted by using the semiconductor refrigeration plate.

[0012] According to some embodiments of the present invention, a heat dissipation copper mesh is embedded in the base, the heat dissipation copper mesh is arranged around the circumference of the mounting groove, the heat dissipation copper mesh is connected to one of the temperature ends of the semiconductor refrigeration plate, and the heat dissipation copper mesh facilitates the distribution of temperature to the base to make the temperature evenly distributed.

[0013] According to some embodiments of the present invention, a shielding cover is further included, which is detachably connected to the base, and is used to cover the base, the turntable and the pressure plate. The shielding cover is provided to prevent external electromagnetic waves from interfering with the test process.

[0014] According to some embodiments of the present invention, a heat-insulating layer is provided in the installation groove, and the heat-insulating layer is provided to facilitate heat-insulating the installation groove.

[0015] According to some embodiments of the present invention, a transition fillet is provided at an edge of the positioning hole, and the transition fillet facilitates the elastic contact needle to enter the positioning hole.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A schematic diagram of the structure of a chip test fixture according to an embodiment of the present invention; Figure 2 An exploded diagram of a chip testing fixture according to an embodiment of the present invention; Figure 3 for Figure 2 The enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the structure of a chip test fixture from an upward angle according to an embodiment of the present invention; Figure 5 Schematic diagram of a temperature regulating component on a chip testing fixture according to an embodiment of the present invention.

[0018] Reference numerals: PCB board 100; Base 200, mounting slot 210; Positioning hole 220, transition fillet 221; Conductive contact block 230, first snap structure 240; Temperature adjustment component 250, radiator 251, semiconductor cooling sheet 252; Heat dissipation copper mesh 260, elastic contact pin 270; Rotating disk 300, pressing plate 400, second buckle structure 410, contact foot 420; Pressure regulating device 500, bracket 510, motor 520, pressing block 530, screw rod 540, pressure sensor 550; Shielding cover 600. DETAILED DESCRIPTION

[0019] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0022] Reference Figures 1 to 5The present invention discloses a chip testing fixture, including a PCB board 100, a base 200, a turntable 300 and a pressing plate 400. The base 200 is arranged on the PCB board 100, and is provided with a mounting groove 210, a positioning hole 220, a conductive contact block 230 and a first buckle structure 240. The mounting groove 210 is used to install the chip, and the positioning holes 220 are provided with a plurality of conductive contact blocks 230. The conductive contact blocks 230 are arranged in the positioning holes 220 and are arranged one by one with the positioning holes 220. One end of the conductive contact block 230 is electrically connected to the PCB board 100, and the other end of the conductive contact block 230 is lower than the positioning hole 220. The turntable 300 is rotatably connected to the base 200, and one end of the turntable 300 close to the base 200 is provided with a conductive contact block 230. A plurality of groups of elastic contact pins 270, each group of elastic contact pins 270 includes a plurality of elastic contact pins 270, and the elastic contact pins 270 are used to be inserted into the positioning holes 220 to contact the other end of the conductive contact block 230; a plurality of pressure plates 400 are provided, and the pressure plates 400 are hinged on the turntable 300, and the plurality of pressure plates 400 are evenly distributed along the circumference of the turntable 300, and a second snap-fit ​​structure 410 is provided at one end of the pressure plate 400 away from the turntable 300, and the second snap-fit ​​structure 410 is used to snap-fit ​​and connect to the first snap-fit ​​structure 240, and a plurality of contact pins 420 are provided on one side of the pressure plate 400 for contacting the chip, and one end of the contact pin 420 is used to electrically connect to the elastic contact pin 270, and the other end of the contact pin 420 is used to contact the contact on the chip.

[0023] It should be understood that the provided installation groove 210 facilitates the quick and accurate installation of the chip. The cooperation between the turntable 300 and a plurality of pressure plates 400 enables the pressure plate 400 to crimp chips of different specifications, which facilitates the operator to quickly replace the pressure plate 400 for the chip and test the chip. The provided pressure plates 400 are evenly distributed along the circumference of the turntable 300, which facilitates the switching of the pressure plates 400 when testing the chip. Because the pressure plate 400 mainly serves to electrically connect the chip, different chips can be tested by switching different pressure plates 400. The provided elastic contact pins 270 ensure reliable contact with the conductive contact block, reducing errors during the test process, and also enable the elastic contact pins 270 to be inserted into the positioning holes 220 for fixing the turntable 300 and providing in-place sensing. Due to the high efficiency and versatility of the entire fixture, the demand for different types of chip testing fixtures can be reduced, thereby reducing production costs, eliminating the trouble of replacing fixtures, and improving test efficiency.

[0024] It should be noted that each pressure plate 400 is connected to the turntable 300 via a standard interface, so that the replacement time of a single pressure plate is ≤15s, which is 6 times more efficient than overall disassembly and maintenance.

[0025] Reference Figure 2, and also includes a pressure regulating device 500, which is arranged on the base 200, and the pressure regulating device 500 is transmission-connected to the pressing plate 400, and the pressure regulating device 500 is used to drive the pressing plate 400 to press the chip in the installation groove 210. The set pressure regulating device 500 realizes the pressure adjustment of the pressing plate 400, ensures that the pressure of the pressing plate 400 on the chip can be quantified, and is convenient for adjusting the pressure parameters when testing the chip. The pressure regulating device 500 includes a bracket 510, a motor 520, a pressing block 530 and a screw 540, and the bracket 510 is arranged on the base 200, The motor 520 is arranged on the bracket 510, and the pressure block 530 is connected to the bracket 510 along the vertical sliding direction. The motor 520 is connected to the screw rod 540 for transmission, and the screw rod 540 is rotatably connected to the bracket 510. The pressure block 530 is threadedly connected to the screw rod 540. The motor 520 is used to drive the pressure block 530 to press the pressure plate 400. The pressure regulating device 500 has a simple structure and relies on the drive of the screw rod 540 to make the pressure adjustment more precise. The pressure block 530 is threadedly connected to the screw rod 540 to reduce the shaking of the pressure block 530 and ensure the smooth progress of the pressure regulation process.

[0026] In some embodiments, the pressure regulating device 500 can also be directly driven by a cylinder, using the shaft of the cylinder to drive the pressure block 530 to press the pressure plate 400, so that the pressure plate 400 presses the chip. In addition, the pressure regulating device 500 also includes a pressure sensor 550, and the pressure sensor 550 is arranged on the pressure plate 400. The pressure block 530 is used to press the pressure sensor 550. The pressure sensor 550 is electrically connected to the motor 520 through the PCB board 100. The set pressure sensor 550 enables the motor 520 to adaptively adjust the pressure according to demand, which is convenient for automatic control of pressure. It can be understood that the PCB board 100 integrates a control module, and the pressure sensor 550 and the motor 520 are connected through the control module. The action of the motor 520 is controlled by preset parameters, thereby automatically regulating the pressure.

[0027] Reference Figure 2 and Figure 5A temperature regulating component 250 is arranged on the base 200. The temperature regulating component 250 is used to regulate the temperature in the mounting groove 210. The temperature regulating component 250 simulates the temperature change of the environment and provides a temperature environment for chip testing. The temperature regulating component 250 includes a radiator 251 and a semiconductor refrigeration sheet 252. The semiconductor refrigeration sheet 252 has two temperature ends, one of which is arranged in the base 200, and the other is arranged in the radiator 251. The semiconductor refrigeration sheet 252 is electrically connected to the temperature regulating component 250. The temperature regulating component 250 is arranged on the PCB board 100. The temperature regulating component 250 is used to control the temperature of the semiconductor refrigeration sheet 252. The structure of the temperature regulating component 250 is simple, and the temperature is adjusted by using the semiconductor refrigeration sheet 252. It can be understood that the semiconductor refrigeration chip 252 can achieve the switching between cooling and heating by changing the voltage direction. The specific connection of the wires belongs to conventional technology. By switching the cooling and heating of the semiconductor refrigeration chip 252 and adjusting the cooling and heating power, the temperature in the installation slot 210 is always maintained within the preset temperature range. That is, when the temperature rises during testing, it can be cooled by the semiconductor refrigeration chip 252, and when the ambient temperature is too low, it can be heated by the semiconductor refrigeration chip 252. The radiator 251 is a necessary component, which plays the function of temperature exchange. The radiator 251 not only includes cooling fins, but also includes other necessary components such as fans. That is, the components required for the normal operation of the semiconductor refrigeration chip 252 are all conventional settings.

[0028] In some embodiments, a heat dissipation copper mesh 260 is embedded in the base 200, and the heat dissipation copper mesh 260 is arranged around the circumference of the installation groove 210. The heat dissipation copper mesh 260 is connected to one of the temperature ends of the semiconductor cooling plate 252. The heat dissipation copper mesh 260 is convenient for distributing the temperature to the base 200 to make the temperature evenly distributed. It can be understood that the heat dissipation copper mesh 260 allows the temperature generated by the semiconductor cooling plate 252 to be evenly distributed on the heat dissipation copper mesh 260, and due to the installation method of the heat dissipation copper mesh 260, the surrounding areas of the installation groove 210 can withstand a certain temperature, thereby ensuring the uniformity of the temperature in the installation groove 210 and reducing errors in the chip testing process.

[0029] Reference Figures 1 to 4 , and also includes a shielding cover 600, which is detachably connected to the base 200, and is used to shield the base 200, the turntable 300 and the pressing plate 400. The shielding cover 600 is set to prevent external electromagnetic waves from interfering with the test process.

[0030] In some embodiments, an insulation layer (not shown in the figure) is provided in the installation groove 210, and the insulation layer is provided to facilitate insulation of the installation groove 210. It can be understood that the insulation layer includes a microporous alumina coating, an aerogel composite coating or a graphene coating.

[0031] Reference Figure 3 The edge of the positioning hole 220 is provided with a transition fillet 221, and the transition fillet 221 is provided to facilitate the elastic contact pin 270 to enter the positioning hole 220. It can be understood that the transition fillet 221 can not only play a transition and guiding role for the elastic contact pin 270, but also make the elastic contact pin 270 relatively smooth when entering the positioning hole 220, thereby reducing the rigid collision between the positioning hole 220 and the elastic contact pin 270, and making the elastic contact pin 270 feel softer in the positioning hole 220, which is convenient for operation.

[0032] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0033] Of course, the present invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip testing fixture, characterized in that: include: PCB board (100); A base (200) is arranged on the PCB board (100), and the base (200) is provided with a mounting groove (210), a positioning hole (220), a conductive contact block (230) and a first buckle structure (240); the mounting groove (210) is used to install a chip, a plurality of the positioning holes (220) are provided, the conductive contact blocks (230) are arranged in the positioning holes (220) and are arranged one-to-one with the positioning holes (220), one end of the conductive contact block (230) is electrically connected to the PCB board (100), and the other end of the conductive contact block (230) is lower than the positioning hole (220); a rotating disk (300) rotatably connected to the base (200); a plurality of groups of elastic contact pins (270) are arranged at one end of the rotating disk (300) close to the base (200); each group of the elastic contact pins (270) includes a plurality of the elastic contact pins (270); the elastic contact pins (270) are used to be inserted into the positioning holes (220) to contact the other end of the conductive contact block (230); A plurality of pressure plates (400) are provided, wherein the pressure plates (400) are hinged on the rotating disk (300), and the plurality of pressure plates (400) are evenly distributed along the circumference of the rotating disk (300); a second buckle structure (410) is provided at one end of the pressure plate (400) away from the rotating disk (300), and the second buckle structure (410) is used for buckling and connecting with the first buckle structure (240); a plurality of contact pins (420) are provided on one side of the pressure plate (400) for contacting the chip, and one end of the contact pin (420) is used for electrically connecting to the elastic contact pin (270), and the other end of the contact pin (420) is used for contacting a contact point on the chip.

2. The chip testing fixture according to claim 1, characterized in that: It also includes a pressure regulating device (500), the pressure regulating device (500) being arranged on the base (200), the pressure regulating device (500) being transmission-connected to the pressing plate (400), and the pressure regulating device (500) being used to drive the pressing plate (400) to press the chip in the installation groove (210).

3. The chip testing fixture according to claim 2, characterized in that: The pressure regulating device (500) comprises a bracket (510), a motor (520), a pressure block (530) and a screw rod (540); the bracket (510) is arranged on the base (200); the motor (520) is arranged on the bracket (510); the pressure block (530) is connected to the bracket (510) in a vertical sliding manner; the motor (520) is connected to the screw rod (540) in a driving manner; the screw rod (540) is connected to the bracket (510) in a rotatable manner; the pressure block (530) is threadedly connected to the screw rod (540); and the motor (520) is used to drive the pressure block (530) to press the pressure plate (400).

4. The chip testing fixture according to claim 3, characterized in that: The voltage regulating device (500) further comprises a pressure sensor (550), wherein the pressure sensor (550) is arranged on the pressing plate (400), the pressing block (530) is used to press the pressure sensor (550), and the pressure sensor (550) is electrically connected to the motor (520) via the PCB board (100).

5. The chip testing fixture according to any one of claims 1 to 4, characterized in that: A temperature adjustment component (250) is provided on the base (200), and the temperature adjustment component (250) is used to adjust the temperature in the installation groove (210).

6. The chip testing fixture according to claim 5, characterized in that: The temperature regulating component (250) comprises a heat sink (251) and a semiconductor cooling sheet (252); the semiconductor cooling sheet (252) has two temperature ends, one of which is disposed in the base (200) and the other of which is disposed in the heat sink (251); the semiconductor cooling sheet (252) is electrically connected to the temperature regulating component (250); the temperature regulating component (250) is disposed on a PCB board (100); and the temperature regulating component (250) is used to control the temperature of the semiconductor cooling sheet (252).

7. The chip testing fixture according to claim 6, characterized in that: A heat dissipation copper mesh (260) is embedded in the base (200), the heat dissipation copper mesh (260) is arranged around the circumference of the installation groove (210), and the heat dissipation copper mesh (260) is connected to one of the temperature ends of the semiconductor cooling plate (252).

8. The chip testing fixture according to claim 7, characterized in that: It also comprises a shielding cover (600), the shielding cover (600) being detachably connected to the base (200), the shielding cover (600) being used to cover the base (200), the rotating disk (300) and the pressing plate (400).

9. The chip testing fixture according to claim 1, characterized in that: A heat-insulating layer is provided in the installation groove (210).

10. The chip testing fixture according to claim 1, characterized in that: The edge of the positioning hole (220) is provided with a transition fillet (221).

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