Thermal design acquisition method, device and electronic equipment for constellation satellite payload

Abstract

The present application proposes a method, device and electronic equipment for acquiring thermal design of a payload carried by a constellation satellite, including: acquiring the initial payload thermal design of the carried payload to construct an initial payload thermal mathematical model of the carried payload; acquiring first test data of the carried payload under a boundary temperature condition under a first test environment; acquiring second test data of the initial payload thermal mathematical model under a boundary temperature condition under a second test environment; iteratively adjusting the initial payload thermal mathematical model according to the first test data and the second test data to obtain a target payload thermal mathematical model of the carried payload; adjusting the initial payload thermal design of the carried payload according to the target payload thermal mathematical model to obtain the target payload thermal design of the carried payload and obtaining the integrated thermal design of the whole satellite according to the target payload thermal design. The development process of the whole satellite thermal design is streamlined, the development cost of the whole satellite thermal design is reduced, and the development acquisition cycle of the whole satellite thermal design is shortened.

Description

Technical Field

[0001] The present application relates to the technical field of satellite hardware thermal design, and in particular to a method, device and electronic equipment for obtaining thermal design of payloads carried by constellation satellites. Background Art

[0002] In the process of developing constellation satellites, the technical status can be fixed after the development of the first satellite is completed, so that subsequent satellites can be mass-produced according to the design of the first satellite. In this scenario, the development process can be streamlined. After the correctness of the thermal design of the first satellite is verified through the thermal balance test of the first satellite, the thermal balance test of subsequent satellites can be cancelled, thereby streamlining the satellite development process.

[0003] However, when subsequent satellites need to carry payloads different from those on the first satellite, there may be a large degree of difference between the nominal state of the satellite's hardware design and that of the first satellite. In related technologies, the entire satellite thermal design can be obtained based on a single-satellite development model, which is costly and takes a long time. Summary of the invention

[0004] The present application aims to solve one of the technical problems in the related art at least to some extent.

[0005] The first aspect of the present application proposes a method for obtaining a thermal design of a payload carried by a constellation satellite, comprising: obtaining an initial payload thermal design of the carried payload, and constructing an initial payload thermal mathematical model of the carried payload according to the initial payload thermal design, wherein the initial payload thermal mathematical model is a vacuum environment model in which the carried payload works, and the initial payload thermal design is obtained by inputting a thermal design boundary of the initial payload into the initial thermal design of the initial payload; obtaining first test data of the carried payload under a boundary temperature condition under a first test environment, wherein the first test environment is a test environment under a standard temperature of normal temperature and pressure; building a simulated second test environment for the initial payload thermal mathematical model, and obtaining second test data of the initial payload thermal mathematical model under the boundary temperature condition under the second test environment, wherein the second test environment is built based on the first test environment; iteratively adjusting the initial payload thermal mathematical model according to the first test data and the second test data to obtain a target payload thermal mathematical model of the carried payload; adjusting the initial payload thermal design of the carried payload according to the target payload thermal mathematical model to obtain the target payload thermal design of the carried payload, and obtaining the integrated thermal design of the whole satellite of the carried satellite according to the target payload thermal design.

[0006] According to the constellation satellite payload thermal design acquisition method of the embodiment of the present application, a corresponding initial payload thermal mathematical model is constructed according to the initial payload thermal design of the payload, and the first test data of the payload under the boundary temperature condition under the first test environment and the second test data of the initial payload thermal mathematical model under the boundary temperature condition under the second test environment are obtained. According to the first test data and the second test data, the initial payload thermal mathematical model is iteratively adjusted to obtain the target payload thermal mathematical model, and the initial payload thermal design of the payload is adjusted according to the target payload thermal mathematical model to obtain the target payload thermal design of the payload, and then the integrated thermal design of the whole satellite is obtained according to the target payload thermal design. In the present application, the thermal mathematical model of the payload is iteratively adjusted to replace the vacuum thermal balance test by the normal pressure thermal balance test, and then the thermal design of the payload is adjusted to obtain the target payload thermal design of the payload and then the integrated thermal design of the whole satellite, which simplifies the development process of the thermal design of the whole satellite, reduces the development cost of the thermal design of the whole satellite, shortens the development acquisition cycle of the thermal design of the whole satellite, and optimizes the acquisition method of the thermal design of the whole satellite.

[0007] The second aspect of the present application proposes a device for acquiring a thermal design of a payload carried by a constellation satellite, comprising: a construction module, used to acquire an initial payload thermal design of the payload, and to construct an initial payload thermal mathematical model of the payload according to the initial payload thermal design, wherein the initial payload thermal mathematical model is a vacuum environment model in which the payload works, and the initial payload thermal design is obtained by inputting a thermal design boundary of the initial payload into the initial thermal design of the initial payload; a first test module, used to acquire first test data of the payload under a boundary temperature condition under a first test environment, wherein the first test environment is a test environment at a standard temperature of normal temperature and pressure; a second test module, used to A simulated second test environment is built for the initial load thermal mathematical model, and second test data of the initial load thermal mathematical model under the boundary temperature condition under the second test environment is obtained, wherein the second test environment is built based on the first test environment; an adjustment module is used to iteratively adjust the initial load thermal mathematical model according to the first test data and the second test data to obtain a target load thermal mathematical model of the carried load; an acquisition module is used to adjust the initial load thermal design of the carried load according to the target load thermal mathematical model to obtain the target load thermal design of the carried load, and obtain the integrated thermal design of the whole satellite according to the target load thermal design.

[0008] The third aspect embodiment of the present application proposes an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, the method for acquiring thermal design of a payload carried by a constellation satellite as described in the first aspect embodiment of the present application is implemented.

[0009] The fourth aspect embodiment of the present application proposes a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, it implements the method for obtaining thermal design of a constellation satellite payload as described in the first aspect embodiment of the present application.

[0010] The fifth aspect embodiment of the present application proposes a computer program product. When the instruction processor in the computer program product executes, it implements the method for obtaining thermal design of the payload on board a constellation satellite as described in the first aspect embodiment of the present application.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0013] Figure 1 A schematic flow chart of a method for obtaining thermal design of a constellation satellite payload according to an embodiment of the present application;

[0014] Figure 2 A schematic flow chart of a method for obtaining thermal design of a constellation satellite payload according to another embodiment of the present application;

[0015] Figure 3 A schematic flow chart of a method for obtaining thermal design of a constellation satellite payload according to another embodiment of the present application;

[0016] Figure 4 This is a schematic diagram of the structure of a constellation satellite payload thermal design acquisition device according to an embodiment of the present application;

[0017] Figure 5 It is a block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0019] The following describes the constellation satellite payload thermal design acquisition method, device and electronic equipment of the embodiments of the present application with reference to the accompanying drawings.

[0020] Figure 1FIG. 1 is a flow chart of a method for obtaining thermal design of a constellation satellite payload according to an embodiment of the present application. Figure 1 As shown, the method for obtaining thermal design of the constellation satellite payload may include the following steps:

[0021] S101, obtaining an initial load thermal design of the carried load, and constructing an initial load thermal mathematical model of the carried load according to the initial load thermal design, wherein the initial load thermal mathematical model is a vacuum environment model in which the carried load works, and the initial load thermal design is obtained by inputting a thermal design boundary of the initial load into the initial thermal design of the initial load.

[0022] In an embodiment of the present application, the payload that needs to be carried on the satellite to be launched can be marked as the carried payload, and the thermal design of the carried payload before testing and optimization can be marked as the initial payload thermal design.

[0023] In order to reduce the test adjustment cost of the initial load thermal design of the carried load, a corresponding thermal mathematical model can be constructed for the carried load according to the initial load thermal design, and the constructed thermal mathematical model can be marked as the initial load thermal mathematical model of the carried load.

[0024] The initial load thermal mathematical model of the carried payload can be understood as a constructed working vacuum environment model of the carried payload.

[0025] In an embodiment of the present application, there is a preconfigured initial thermal design for the carried load. In this scenario, the thermal control design boundary of the carried load can be obtained and marked as the thermal design boundary of the carried load, and the thermal design boundary can be input into the preconfigured initial thermal design to obtain the initial load thermal design of the carried load.

[0026] Among them, the thermal design boundary of the load may include a high-temperature boundary temperature condition and a low-temperature boundary temperature control condition, which is not specifically limited here.

[0027] It should be noted that the initial load thermal mathematical model is constructed based on the thermal conduction relationship of the mounted load under the initial load thermal design. It can be understood that the initial load thermal mathematical model can describe the thermal conduction relationship between the various components in the mounted load with the initial load thermal design.

[0028] S102, obtaining first test data of a load under a boundary temperature condition in a first test environment, wherein the first test environment is a test environment under a standard temperature of normal temperature and pressure.

[0029] In an embodiment of the present application, the test environment at standard temperature of normal temperature and pressure can be marked as the first test environment, wherein the first test environment can be the test environment corresponding to the standard temperature box of normal temperature and pressure, or it can be other test environments that can provide standard temperature of normal temperature and pressure, and no specific limitation is made here.

[0030] In this scenario, the carried load can be placed in a first test environment for a thermal balance test, wherein the carried load can be operated in the first test environment to obtain relevant data of the carried load when it is in a boundary temperature condition as the first test data.

[0031] Among them, the first test data may include relevant data when the carried load is in a high temperature boundary temperature condition, such as the temperature values ​​of each characteristic point pre-set on the carried load when it is in a high temperature boundary temperature condition, and may also include relevant data when the carried load is in a low temperature boundary temperature condition, such as the temperature values ​​of each characteristic point on the carried load when it is in a low temperature boundary temperature condition. No specific limitation is made here.

[0032] S103, building a simulated second test environment for the initial load thermal mathematical model, and obtaining second test data of the initial load thermal mathematical model under a boundary temperature condition in the second test environment, wherein the second test environment is built based on the first test environment.

[0033] In an embodiment of the present application, the test environment built for the initial load thermal mathematical model can be marked as a second test environment, wherein the second test environment is built based on the first test environment at standard temperature and pressure.

[0034] In this scenario, a thermal balance test of the initial load thermal mathematical model can be performed in the second test environment, and relevant data of the initial load thermal mathematical model in the second test environment under the boundary temperature condition can be obtained as second test data.

[0035] A thermal mathematical model corresponding to the first test environment may be constructed, and the test environment provided by the model may be determined as the second test environment of the initial load thermal mathematical model.

[0036] Optionally, the thermal mathematical model corresponding to the second test environment can be controlled to adjust the test environment temperature of the initial load thermal mathematical model to the high temperature boundary temperature, and obtain relevant data obtained by the initial load thermal mathematical model based on the high temperature boundary temperature condition as the second test data.

[0037] Optionally, the thermal mathematical model corresponding to the second test environment can be controlled to adjust the test environment temperature of the initial load thermal mathematical model to the low temperature boundary temperature, and obtain relevant data publicly obtained by the initial load thermal mathematical model based on the low temperature boundary temperature as the second test data.

[0038] S104, iteratively adjusting the initial load thermal mathematical model according to the first test data and the second test data to obtain a target load thermal mathematical model of the carried load.

[0039] In an embodiment of the present application, the second test data may not match the first test data. In this scenario, the model parameters of the initial load thermal mathematical model can be iteratively adjusted so that the temperature value of the initial load thermal mathematical model under the boundary temperature condition can meet the preset temperature requirements.

[0040] In this scenario, the error value of the first test data based on the second test data obtained in the current round can be obtained, and the model control parameters of the initial load thermal mathematical model can be adjusted according to the error value, and the initial load thermal mathematical model after the control parameters are adjusted is returned to perform the next round of operation under the second test environment, and the second test data of the next round can be obtained.

[0041] Furthermore, the error value of the second test data of the next round is obtained based on the first test data, and the parameters of the initial load thermal mathematical model of the next round are continuously adjusted based on the error value until the iteration is completed to obtain the target load thermal mathematical model of the carried load.

[0042] It should be noted that the model control parameters may be physical quantity relationship parameters in the initial load thermal mathematical model, or may be corresponding parameters of other thermal design parameters in the initial load thermal mathematical model, which are not specifically limited here.

[0043] S105, adjusting the initial load thermal design of the carried payload according to the target payload thermal mathematical model to obtain the target load thermal design of the carried payload, and obtaining the integrated thermal design of the whole satellite according to the target load thermal design.

[0044] In the embodiment of the present application, after the target load thermal mathematical model is obtained, the initial load thermal design of the carried load can be adjusted according to the obtained target load thermal mathematical model.

[0045] Optionally, an adjusted part of the target load thermal mathematical model based on the initial load thermal mathematical model can be obtained, and the corresponding thermal design parameters of the adjusted part in the initial load thermal design can be obtained, and then the corresponding thermal design parameters in the initial load thermal design can be adjusted according to the model parameters in the target load thermal mathematical model, and the adjusted thermal design can be determined as the target load thermal design of the carried load.

[0046] Furthermore, the thermal design of the carrier satellite that the payload needs to be carried is obtained, and the thermal design of the carrier satellite and the thermal design of the target payload of the carrier are integrated to obtain the integrated thermal design of the entire satellite consisting of the carrier payload and the carrier satellite.

[0047] The present application proposes a method for acquiring the thermal design of a constellation satellite payload, which acquires the initial payload thermal design of the payload, and constructs the initial payload thermal mathematical model of the payload according to the initial payload thermal design, acquires the first test data of the payload under the boundary temperature condition under the first test environment, and the second test data of the initial payload thermal mathematical model under the boundary temperature condition under the second test environment, and iteratively adjusts the initial payload thermal mathematical model according to the first test data and the second test data to obtain the target payload thermal mathematical model, and adjusts the initial payload thermal design of the payload according to the target payload thermal mathematical model to obtain the target payload thermal design of the payload, and then obtains the integrated thermal design of the entire satellite according to the target payload thermal design. In the present application, the thermal mathematical model of the payload is iteratively adjusted by replacing the vacuum thermal balance test with the normal pressure thermal balance test, and then the thermal design of the payload is adjusted, and the target payload thermal design of the payload is obtained, and then the integrated thermal design of the entire satellite is obtained, which simplifies the development process of the thermal design of the entire satellite, reduces the development cost of the thermal design of the entire satellite, shortens the development and acquisition cycle of the thermal design of the entire satellite, and optimizes the method for acquiring the thermal design of the entire satellite.

[0048] In the above embodiment, the acquisition of the target load thermal design of the carried load can also be combined with Figure 2 Further understanding, Figure 2 FIG. 1 is a flow chart of a method for acquiring thermal design of a constellation satellite payload according to another embodiment of the present application. Figure 2 As shown, the method includes:

[0049] S201, iteratively adjusting the candidate load thermal mathematical model according to the first test data and the second test data to obtain a target load thermal mathematical model of the carried load.

[0050] Optionally, the model parameters of the initial load thermal mathematical model can be adjusted according to the first test data and the second test data, and the initial load thermal mathematical model with adjusted control parameters is returned to continue iterative testing in the second test environment until the test is completed to obtain an adjusted candidate load thermal mathematical model.

[0051] In an embodiment of the present application, a loss value of the second test data based on the first test data can be obtained, and the model parameters of the initial load thermal mathematical model can be adjusted according to the loss value, wherein the physical quantity relationship parameters of the initial load thermal mathematical model can be adjusted, and other model parameters can also be adjusted, which is not specifically limited here.

[0052] Furthermore, the initial load thermal mathematical model after control parameter adjustment continues to be iteratively tested in the second test environment, and the model control parameters of the initial load thermal mathematical model are adjusted and optimized in each iteration round to obtain an adjusted and optimized candidate load thermal mathematical model.

[0053] It should be noted that the second test data obtained by the candidate load thermal mathematical model in the second test environment can be matched with the first test data obtained by the carried load in the first test environment. When the second test data falls within the matching range corresponding to the first test data, it can be determined that the second test data matches the first test data.

[0054] Optionally, third test data of the candidate load thermal mathematical model under a boundary temperature condition under a third test environment is obtained, and in response to the third test data satisfying a preset temperature index requirement, the candidate load thermal mathematical model is determined to be the target load thermal mathematical model of the carried load.

[0055] In an embodiment of the present application, the vacuum test environment can be marked as a third test environment, wherein the third test environment can be controlled to simulate boundary temperature conditions, such as high temperature boundary temperature conditions and low temperature boundary temperature conditions, etc., so as to obtain test data of the candidate load thermal mathematical model under the boundary temperature conditions of the third test environment as the third test data.

[0056] Optionally, there is a preset temperature index requirement for the candidate load thermal mathematical model. It can be understood that when the temperature of the candidate load thermal mathematical model meets the temperature index requirement, it can be determined that the temperature generated by the carried load corresponding to the candidate load thermal mathematical model during operation is within a preset safety temperature range, and the temperature will not affect the operation of the carried load corresponding to the candidate load thermal mathematical model.

[0057] In this scenario, the temperature value of the candidate load thermal mathematical model included in the third test data under the boundary temperature condition can be compared with the preset temperature index requirement. If the third test data meets the temperature index requirement, the candidate thermal mathematical model obtained from the third test data can be determined as the target load thermal mathematical model of the carried load.

[0058] S202, adjusting the initial load thermal design of the onboard payload according to the target payload thermal mathematical model to obtain the target load thermal design of the onboard payload, and obtaining the integrated thermal design of the entire satellite according to the target load thermal design.

[0059] Optionally, the initial load design can be adjusted according to the target load thermal mathematical model to obtain an adjusted candidate load thermal design, and the candidate carrier star thermal design of the carrier star can be obtained, and the candidate carrier star thermal design and the candidate load thermal design can be thermally verified, and the target load thermal design of the carrier load can be obtained according to the verification results.

[0060] In an embodiment of the present application, the initial load design of the carried load can be adjusted based on the target load thermal mathematical model to obtain an adjusted candidate load thermal design, wherein the physical quantity relationship parameters in the initial load design can be adjusted, and other heat conduction relationship parameters can also be adjusted, and no specific restrictions are made here.

[0061] Furthermore, corresponding thermal design verification is performed on the candidate carrier star thermal design and the candidate payload thermal design in a preset test environment, and the verification results are used to identify whether the candidate payload thermal design can be determined as the target payload thermal design for the final use of the carrier payload, and to identify whether the candidate carrier star thermal design can be determined as the target carrier star thermal design for the final use of the carrier star.

[0062] Optionally, an initial satellite thermal design of an on-orbit satellite can be obtained, and the initial satellite design can be adjusted according to the candidate payload thermal design to obtain a candidate payload thermal design of the payload satellite, wherein the operating temperature of the candidate payload thermal mathematical design under the boundary temperature condition meets the preset temperature index requirements.

[0063] In an embodiment of the present application, the thermal design plan of the entire satellite in orbit can be obtained, and the thermal design plan of the entire satellite in orbit can be determined as the initial satellite thermal design of the carrier satellite that needs to be carried by the payload.

[0064] In this scenario, the initial satellite thermal design can be adjusted according to the candidate payload thermal design of the onboard payload, and then the adjusted candidate satellite thermal design of the onboard payload is obtained, wherein the relevant heat conduction parameters in the candidate payload thermal design and the corresponding heat conduction parameters in the initial satellite thermal design can be obtained, and the heat conduction parameters in the initial satellite thermal design are adjusted based on the heat conduction parameters in the candidate payload thermal design, so that the degree of fit between the two can be improved, and then the adjusted candidate satellite thermal design of the onboard satellite is obtained.

[0065] It should be noted that, for a satellite with a candidate satellite thermal design, when its operating temperature under the boundary temperature condition can meet the preset temperature index requirements, it can be understood that the operating temperature of the satellite with a candidate satellite thermal design under the boundary temperature condition will not affect the normal operation of the satellite.

[0066] Optionally, it is also possible to obtain an initial onboard star thermal mathematical model corresponding to the initial satellite thermal design of the in-orbit satellite, and adjust the initial onboard star thermal mathematical model according to the target payload thermal mathematical model corresponding to the candidate payload thermal design to obtain a candidate onboard star thermal mathematical model corresponding to the candidate onboard star design, wherein the operating temperature of the candidate onboard star thermal mathematical model under the boundary temperature condition meets the preset temperature index requirements.

[0067] In the embodiment of the present application, the thermal mathematical model of the entire satellite in orbit can also be obtained and marked as the initial onboard thermal mathematical model corresponding to the initial satellite thermal design.

[0068] Furthermore, the target load thermal mathematical model corresponding to the candidate load thermal design can be obtained to adjust the initial carrier star thermal mathematical model, wherein the initial carrier star thermal mathematical model can be adjusted accordingly according to the target load thermal design, wherein the relevant heat conduction parameters in the target load thermal design and the corresponding heat conduction parameters in the initial carrier star thermal mathematical model can be obtained, and the heat conduction parameters in the initial carrier star thermal mathematical model are adjusted based on the heat conduction parameters in the target load thermal design, so that the degree of fit between the two can be improved, and then the adjusted candidate carrier star thermal mathematical model is obtained.

[0069] It should be noted that the operating temperature of the candidate satellite thermal mathematical model under the boundary temperature condition can meet the preset temperature index requirements. It can be understood that the operating temperature of the satellite corresponding to the candidate satellite thermal mathematical model under the boundary temperature condition will not affect the normal operation of the satellite.

[0070] Optionally, a candidate integrated thermal design of a candidate mounted star thermal design and a candidate payload thermal design is obtained, and a thermal design verification is performed on the candidate integrated thermal design to obtain a verification result.

[0071] Among them, the candidate satellite thermal design and the candidate payload thermal design can be obtained for integration, and the integrated thermal design can be determined as the candidate integrated thermal design of the whole satellite consisting of the satellite payload and the satellite.

[0072] Furthermore, a thermal design verification is performed on the candidate integrated thermal design to obtain a verification result.

[0073] Optionally, a target payload thermal mathematical model is configured for the candidate onboard star thermal mathematical model to obtain a candidate integrated thermal mathematical model of the candidate integrated thermal design, and a thermal design verification is performed on the candidate integrated thermal mathematical model to obtain a verification result.

[0074] Among them, the layout position of the target payload thermal mathematical model in the candidate carrier star thermal mathematical model can be obtained, and the target payload thermal mathematical model is configured for the candidate carrier star thermal mathematical model based on the layout position to obtain the candidate carrier star integrated thermal mathematical model of the candidate integrated thermal design.

[0075] In an embodiment of the present application, the carrying position reserved by the carrying star for the carried payload can be obtained, and the layout position reserved by the candidate carrying star thermal mathematical model for the target payload thermal mathematical model can be determined based on the position.

[0076] Furthermore, the target load thermal mathematical model is configured at the layout position, thereby completing the configuration of the target load thermal mathematical model in the candidate carrier star thermal mathematical model, and determining the configured model as the candidate carrier star integrated thermal mathematical model of the candidate integrated thermal design.

[0077] Optionally, under a third test environment, a predicted temperature value of the candidate integrated thermal mathematical model under boundary temperature conditions is obtained, wherein the third test environment is a vacuum test environment, and, under the third test environment, a test temperature value of the candidate integrated thermal mathematical model under boundary temperature conditions is obtained.

[0078] In the embodiment of the present application, the candidate integrated thermal mathematical model can be tested and run in a vacuum test environment serving as a third test environment to obtain a temperature value of the candidate integrated thermal mathematical model under a boundary temperature condition as a test temperature value.

[0079] And, based on the temperature value prediction method under the boundary temperature condition in the related art, the temperature value of the candidate integrated thermal mathematical model under the boundary temperature condition is predicted as the predicted temperature value.

[0080] In this scenario, the test temperature value and the predicted temperature value may be compared, wherein when the test temperature value falls within the temperature value range corresponding to the predicted temperature value, it can be determined that the test temperature value and the predicted temperature value match.

[0081] Further, in response to the predicted temperature value and the tested temperature value matching, verification success is determined as a verification result of the candidate integrated thermal mathematical model.

[0082] Optionally, in response to the verification result indicating success, the initial satellite thermal design is adjusted according to the candidate integrated thermal mathematical model to obtain a target satellite thermal design for the satellite, and in response to the verification result indicating success, the candidate payload thermal design is determined as the target payload thermal design for the satellite.

[0083] It can be understood that when the verification result indicates success, it can be determined that the operating temperature generated by the satellite under the thermal design corresponding to the candidate integrated thermal mathematical model when operating in a vacuum environment will not affect the operation of the entire satellite carrying the payload.

[0084] In this scenario, the initial satellite design can be adjusted according to the candidate integrated thermal mathematical model, and the adjusted thermal design can be used as the target satellite thermal design for the satellite, and the candidate payload thermal design can be determined as the target payload thermal design for the payload.

[0085] Furthermore, the integrated thermal design of the satellite to be launched is obtained based on the target payload thermal design and the target satellite thermal design.

[0086] It should be noted that the verification result may indicate a verification failure. In this scenario, in response to the verification result indicating a verification failure, the process returns to modify the initial load thermal design of the carried load, and verifies the modified initial load thermal design until the verification is successful, thereby obtaining the target load thermal design of the carried load.

[0087] It can be understood that when the verification result indicates that the verification has failed, it can be determined that there may be a certain degree of abnormality in the design of the carried payload. In this scenario, it is possible to return to modify the initial load thermal design of the carried payload and obtain the modified initial load thermal design.

[0088] Furthermore, the modified initial load thermal design continues to be verified based on the method proposed in the above embodiment until the verification result indicates success, and the candidate load thermal design corresponding to the verification result indicating success is determined as the target load thermal design of the carried load.

[0089] The method for acquiring the thermal design of the payload of a constellation satellite proposed in the present application replaces the vacuum thermal balance test with a normal pressure thermal balance test, iteratively adjusts the thermal mathematical model of the payload, and further realizes the adjustment of the thermal design of the payload, obtains the target payload thermal design of the payload and then obtains the integrated thermal design of the whole satellite, which simplifies the research and development process of the thermal design of the whole satellite, reduces the research and development cost of the thermal design of the whole satellite, shortens the research and development acquisition cycle of the thermal design of the whole satellite, and optimizes the method for acquiring the thermal design of the whole satellite.

[0090] To better understand the above embodiments, Figure 3 , Figure 3 FIG. 1 is a flow chart of a method for acquiring thermal design of a constellation satellite payload according to another embodiment of the present application. Figure 3 As shown, the method includes:

[0091] In the embodiment of the present application, the initial load thermal design of the carried load is obtained, and the initial load thermal mathematical model of the carried load is constructed according to the initial load thermal design, such as Figure 3 As shown, the thermal balance test of the carried load and the initial load thermal mathematical model under the normal temperature and pressure test environment can be carried out respectively to obtain a first test result of the carried load and a second test result of the initial load thermal mathematical model.

[0092] Furthermore, the initial load thermal mathematical model of the carried load is adjusted according to the first test result and the second test result, so as to obtain the target load thermal mathematical model of the carried load.

[0093] Accordingly, the initial satellite thermal design and the initial payload thermal mathematical model of the entire on-orbit satellite are obtained, wherein the initial payload thermal mathematical model can be adjusted to obtain a candidate satellite thermal mathematical model, and a target payload thermal mathematical model can be configured for the candidate satellite thermal mathematical model to obtain a candidate integrated thermal mathematical model of the satellite.

[0094] Furthermore, the candidate integrated thermal mathematical model is verified to obtain a verification result, wherein when the verification result indicates that the verification is successful, it can be determined that the thermal design corresponding to the candidate carrier star thermal mathematical model included in the candidate integrated thermal mathematical model is the target carrier star thermal design of the carrier star, and the thermal design corresponding to the target load thermal mathematical model included in the candidate integrated thermal mathematical model is the target load thermal design of the carrier load.

[0095] Optionally, based on the target carrier star thermal design and the target payload thermal design, the thermal design of the entire carrier star configured with the carrier payload is obtained as a satellite to be launched.

[0096] The method for acquiring the thermal design of the payload of a constellation satellite proposed in the present application replaces the vacuum thermal balance test with a normal pressure thermal balance test, iteratively adjusts the thermal mathematical model of the payload, and further realizes the adjustment of the thermal design of the payload, obtains the target payload thermal design of the payload and then obtains the integrated thermal design of the whole satellite, which simplifies the research and development process of the thermal design of the whole satellite, reduces the research and development cost of the thermal design of the whole satellite, shortens the research and development acquisition cycle of the thermal design of the whole satellite, and optimizes the method for acquiring the thermal design of the whole satellite.

[0097] Corresponding to the constellation satellite payload thermal design acquisition methods proposed in the above-mentioned embodiments, an embodiment of the present application further proposes a constellation satellite payload thermal design acquisition device. Since the constellation satellite payload thermal design acquisition device proposed in the embodiment of the present application corresponds to the constellation satellite payload thermal design acquisition methods proposed in the above-mentioned embodiments, the implementation methods of the above-mentioned constellation satellite payload thermal design acquisition methods are also applicable to the constellation satellite payload thermal design acquisition device proposed in the embodiment of the present application, and will not be described in detail in the following embodiments.

[0098] In order to implement the above-mentioned embodiment, the present application also proposes a constellation satellite onboard payload thermal design acquisition device.

[0099] Figure 4 A schematic diagram of a thermal design acquisition device for a constellation satellite payload provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the constellation satellite payload thermal design acquisition device 400 includes: a construction module 41, a first test module 42, a second test module 43, an adjustment module 44 and an acquisition module 45.

[0100] A construction module 41 is used to obtain the initial load thermal design of the carried load, and to construct the initial load thermal mathematical model of the carried load according to the initial load thermal design, wherein the initial load thermal mathematical model is a vacuum environment model in which the carried load works, and the initial load thermal design is obtained by inputting the thermal design boundary of the initial load into the initial thermal design of the initial load. ;

[0101] A first test module 42 is used to obtain first test data of the load under a boundary temperature condition under a first test environment, wherein the first test environment is a test environment under a standard temperature of normal temperature and pressure;

[0102] The second test module 43 is used to build a simulated second test environment for the initial load thermal mathematical model and obtain second test data of the initial load thermal mathematical model under the boundary temperature condition under the second test environment, wherein the second test environment is built based on the first test environment;

[0103] An adjustment module 44, configured to iteratively adjust the initial load thermal mathematical model according to the first test data and the second test data, so as to obtain a target load thermal mathematical model of the carried load;

[0104] The acquisition module 45 is used to adjust the initial load thermal design of the carried payload according to the target payload thermal mathematical model, obtain the target load thermal design of the carried payload, and obtain the integrated thermal design of the whole satellite according to the target load thermal design.

[0105] According to one embodiment of the present application, the adjustment module 44 is also used to: adjust the model parameters of the initial load thermal mathematical model according to the first test data and the second test data, and return the initial load thermal mathematical model after the control parameters are adjusted to continue iterative testing in the second test environment until the test is completed, so as to obtain the adjusted candidate load thermal mathematical model; obtain the third test data of the candidate load thermal mathematical model under the boundary temperature condition in the third test environment; and determine that the candidate load thermal mathematical model is the target load thermal mathematical model of the carried load in response to the third test data satisfying the preset temperature index requirement.

[0106] According to one embodiment of the present application, the acquisition module 45 is also used to: adjust the initial payload design according to the target payload thermal mathematical model to obtain an adjusted candidate payload thermal design; obtain the candidate carrier star thermal design of the carrier star, and perform thermal design verification on the candidate carrier star thermal design and the candidate payload thermal design, and obtain the target payload thermal design of the carrier payload and the target carrier star thermal design of the carrier star according to the verification results; obtain the integrated thermal design of the entire satellite to be launched according to the target payload thermal design and the target carrier star thermal design.

[0107] According to one embodiment of the present application, the acquisition module 45 is also used to: obtain an initial satellite thermal design of the on-orbit satellite, and adjust the initial satellite design according to the candidate payload thermal design to obtain a candidate carrier star thermal design of the carrier star, wherein the operating temperature of the candidate carrier star thermal mathematical design under the boundary temperature condition meets the preset temperature index requirement; obtain the candidate carrier star thermal design and the candidate integrated thermal design of the candidate payload thermal design, and perform thermal design verification on the candidate integrated thermal design to obtain a verification result; in response to the verification result indicating that the verification is successful, determine that the candidate payload thermal design is the target payload thermal design of the carrier payload, and the candidate carrier star thermal design is the target carrier star thermal design of the carrier star.

[0108] According to one embodiment of the present application, the acquisition module 45 is also used to: obtain an initial onboard star thermal mathematical model corresponding to the initial satellite thermal design of the on-orbit satellite; adjust the initial onboard star thermal mathematical model according to the target payload thermal mathematical model corresponding to the candidate payload thermal design, and obtain a candidate onboard star thermal mathematical model corresponding to the candidate onboard star design, wherein the operating temperature of the candidate onboard star thermal mathematical model under the boundary temperature condition meets the preset temperature index requirement; configure the target payload thermal mathematical model for the candidate onboard star thermal mathematical model, and obtain a candidate integrated thermal mathematical model of the candidate integrated thermal design; and perform thermal design verification on the candidate integrated thermal mathematical model to obtain a verification result.

[0109] According to one embodiment of the present application, the acquisition module 45 is also used to: obtain the layout position of the target load thermal mathematical model in the candidate mounted star thermal mathematical model, and configure the target load thermal mathematical model for the candidate mounted star thermal mathematical model based on the layout position to obtain the candidate integrated thermal mathematical model of the candidate integrated thermal design; under a third test environment, obtain the predicted temperature value of the candidate integrated thermal mathematical model under the boundary temperature condition, wherein the third test environment is a vacuum test environment; under the third test environment, obtain the test temperature value of the candidate integrated thermal mathematical model under the boundary temperature condition; in response to the predicted temperature value and the test temperature value matching, determine that the verification is successful as the verification result of the candidate integrated thermal mathematical model.

[0110] According to one embodiment of the present application, the device also includes a modification module, which is used to: in response to the verification result indicating that the verification failed, return to modify the initial load thermal design of the carried load, and verify the modified initial load thermal design until the verification is successful, so as to obtain the target load thermal design of the carried load.

[0111] The constellation satellite payload thermal design acquisition device proposed in the present application acquires the initial payload thermal design of the payload, and constructs the initial payload thermal mathematical model of the payload according to the initial payload thermal design, acquires the first test data of the payload under the boundary temperature condition under the first test environment, and the second test data of the initial payload thermal mathematical model under the boundary temperature condition under the second test environment, iteratively adjusts the initial payload thermal mathematical model according to the first test data and the second test data, obtains the target payload thermal mathematical model, and adjusts the initial payload thermal design of the payload according to the target payload thermal mathematical model, obtains the target payload thermal design of the payload, and then obtains the whole satellite integrated thermal design according to the target payload thermal design. In the present application, the thermal mathematical model of the payload is iteratively adjusted by replacing the vacuum thermal balance test with the normal pressure thermal balance test, and then the thermal design of the payload is adjusted, the target payload thermal design of the payload is obtained, and then the integrated thermal design of the whole satellite is obtained, which simplifies the development process of the whole satellite thermal design, reduces the development cost of the whole satellite thermal design, shortens the development acquisition cycle of the whole satellite thermal design, and optimizes the acquisition method of the whole satellite thermal design.

[0112] In order to implement the above embodiments, the present application also proposes an electronic device, such as Figure 5 As shown, Figure 5 A block diagram of an electronic device according to an embodiment of the present application.

[0113] like Figure 5 As shown, the electronic device 500 includes: a memory 510 and a processor 520, a bus 530 connecting different components (including the memory 510 and the processor 520), the memory 510 stores a computer program, and when the processor 520 executes the program, the constellation satellite payload thermal design acquisition method described in the embodiment of the present application is implemented.

[0114] Bus 530 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor or a local bus using any of a variety of bus architectures. For example, these architectures include but are not limited to Industry Standard Architecture (ISA) bus, Micro Channel Architecture (MAC) bus, Enhanced ISA bus, Video Electronics Standards Association (VESA) local bus and Peripheral Component Interconnect (PCI) bus.

[0115] The electronic device 500 typically includes a variety of electronic device readable media. These media can be any available media that can be accessed by the electronic device 500, including volatile and non-volatile media, removable and non-removable media.

[0116] The memory 510 may also include computer system readable media in the form of volatile memory, such as random access memory (RAM) 540 and / or cache memory 550. The electronic device 500 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, the storage system 560 may be used to read and write non-removable, non-volatile magnetic media ( Figure 5 not shown, usually called a "hard drive"). Although Figure 5 Not shown, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk"), and an optical disk drive for reading and writing to a removable non-volatile optical disk (e.g., a CD-ROM, DVD-ROM, or other optical medium) may be provided. In these cases, each drive may be connected to bus 530 via one or more data medium interfaces. Memory 510 may include at least one program product having a set (e.g., at least one) of program modules that are configured to perform the functions of the various embodiments of the present application.

[0117] A program / utility 580 having a set (at least one) of program modules 570 may be stored, for example, in the memory 510, such program modules 570 including but not limited to an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment. The program modules 570 generally perform the functions and / or methods of the embodiments described herein.

[0118] The electronic device 500 may also communicate with one or more external devices 590 (e.g., keyboard, pointing device, display 591, etc.), one or more devices that enable a user to interact with the electronic device 500, and / or any device that enables the electronic device 500 to communicate with one or more other computing devices (e.g., network card, modem, etc.). Such communication may be performed through an input / output (I / O) interface 592. Furthermore, the electronic device 500 may also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN) and / or public network, such as the Internet) through a network adapter 593. Figure 5 As shown, the network adapter 593 communicates with other modules of the electronic device 500 via the bus 530. It should be understood that although Figure 5 Not shown, other hardware and / or software modules may be used in conjunction with electronic device 500, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0119] The processor 520 executes various functional applications and data processing by running the programs stored in the memory 510 .

[0120] It should be noted that the implementation process and technical principles of the electronic device of this embodiment refer to the aforementioned explanation of the method for obtaining the thermal design of the constellation satellite payload in the embodiment of the present application, and will not be repeated here.

[0121] In order to implement the above embodiments, the present application also proposes a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the method for obtaining thermal design of a constellation satellite payload proposed in the above embodiments is implemented.

[0122] In order to implement the above embodiments, the present application also provides a computer program product. When the instruction processor in the computer program product is executed, the method for obtaining the thermal design of the constellation satellite payload proposed in the above embodiments is executed.

[0123] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0124] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0125] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A method for obtaining thermal design of a constellation satellite payload, characterized in that: The method comprises: Acquire an initial load thermal design of the carried load, and construct an initial load thermal mathematical model of the carried load according to the initial load thermal design, wherein the initial load thermal mathematical model is a vacuum environment model in which the carried load works, and the initial load thermal design is obtained by inputting a thermal design boundary of the initial load into the initial thermal design of the initial load; Obtaining first test data of the carried load under a boundary temperature condition under a first test environment, wherein the first test environment is a test environment under a standard temperature of normal temperature and pressure; building a second test environment simulated for the thermal mathematical model of the initial load, and obtaining second test data of the thermal mathematical model of the initial load under the boundary temperature condition under the second test environment, wherein the second test environment is built based on the first test environment; Iteratively adjusting the initial load thermal mathematical model according to the first test data and the second test data to obtain a target load thermal mathematical model of the carried load; The initial load thermal design of the carried payload is adjusted according to the target payload thermal mathematical model to obtain the target load thermal design of the carried payload, and the whole satellite integrated thermal design of the carried satellite is obtained according to the target load thermal design.

2. The method according to claim 1, characterized in that The iteratively adjusting the candidate load thermal mathematical model according to the first test data and the second test data to obtain the target load thermal mathematical model of the carried load includes: According to the first test data and the second test data, adjusting the model parameters of the initial load thermal mathematical model, and returning to the initial load thermal mathematical model after the control parameters are adjusted to continue iterative testing in the second test environment until the test is completed, thereby obtaining an adjusted candidate load thermal mathematical model; Acquire third test data of the candidate load thermal mathematical model under the boundary temperature condition under a third test environment; In response to the third test data satisfying a preset temperature index requirement, the candidate load thermal mathematical model is determined to be the target load thermal mathematical model of the carried load.

3. The method according to claim 1, wherein the characteristic value is: The step of adjusting the initial load thermal design of the carried payload according to the target payload thermal mathematical model to obtain the target load thermal design of the carried payload, and obtaining the integrated thermal design of the whole satellite of the carried satellite according to the target load thermal design includes: Adjusting the initial load design according to the target load thermal mathematical model to obtain an adjusted candidate load thermal design; Acquire a candidate carrier star thermal design of a carrier star, perform thermal design verification on the candidate carrier star thermal design and the candidate payload thermal design, and obtain the target payload thermal design of the carrier payload and the target carrier star thermal design of the carrier star according to the verification results; The whole-satellite integrated thermal design of the satellite to be launched is obtained according to the target payload thermal design and the target satellite thermal design.

4. The method according to claim 3, characterized in that The step of obtaining a candidate carrier star thermal design of a carrier star, performing thermal design verification on the candidate carrier star thermal design and the candidate payload thermal design, and obtaining the target payload thermal design of the carrier payload and the target carrier star thermal design of the carrier star according to the verification results includes: Acquire an initial satellite thermal design of an on-orbit satellite, and adjust the initial satellite design according to the candidate payload thermal design to obtain the candidate payload thermal design of the payload satellite, wherein the operating temperature of the candidate payload thermal mathematical design under the boundary temperature condition meets the preset temperature index requirement; Obtaining a candidate integrated thermal design of the candidate onboard star thermal design and the candidate payload thermal design, and performing thermal design verification on the candidate integrated thermal design to obtain a verification result; In response to the verification result indicating a successful verification, the candidate payload thermal design is determined to be the target payload thermal design of the carried payload, and the candidate carried star thermal design is determined to be the target carried star thermal design of the carried star.

5. The method according to claim 4, characterized in that The step of obtaining the candidate integrated thermal design of the candidate onboard star thermal design and the candidate load thermal design, and performing thermal design verification on the candidate integrated thermal design to obtain a verification result includes: Acquire an initial satellite thermal mathematical model corresponding to the initial satellite thermal design of the on-orbit satellite; The initial onboard star thermal mathematical model is adjusted according to the target load thermal mathematical model corresponding to the candidate load thermal design to obtain a candidate onboard star thermal mathematical model corresponding to the candidate onboard star design, wherein the operating temperature of the candidate onboard star thermal mathematical model under the boundary temperature condition meets the preset temperature index requirement; The target load thermal mathematical model is configured for the candidate onboard star thermal mathematical model to obtain a candidate integrated thermal mathematical model of the candidate integrated thermal design, and thermal design verification is performed on the candidate integrated thermal mathematical model to obtain the verification result.

6. The method according to claim 5, characterized in that The configuring the target load thermal mathematical model for the candidate onboard star thermal mathematical model to obtain a candidate integrated thermal mathematical model for the candidate integrated thermal design, and performing thermal design verification on the candidate integrated thermal mathematical model to obtain the verification result includes: Acquire the layout position of the target load thermal mathematical model in the candidate mounted star thermal mathematical model, and configure the target load thermal mathematical model for the candidate mounted star thermal mathematical model based on the layout position to obtain the candidate integrated thermal mathematical model of the candidate integrated thermal design; Under a third test environment, obtaining a predicted temperature value of the candidate integrated thermal mathematical model under a boundary temperature condition, wherein the third test environment is a vacuum test environment; Under the third test environment, obtaining a test temperature value of the candidate integrated thermal mathematical model under the boundary temperature condition; In response to the predicted temperature value and the tested temperature value matching, verification success is determined as the verification result of the candidate integrated thermal mathematical model.

7. The method according to any one of claims 1 to 6, characterized in that: The method further comprises: In response to the verification result indicating that the verification has failed, returning to modify the initial load thermal design of the carried load, and verifying the modified initial load thermal design until the verification succeeds, thereby obtaining the target load thermal design of the carried load.

8. A constellation satellite payload thermal design acquisition device, characterized in that: The device comprises: A construction module, used for obtaining an initial load thermal design of a carried load, and constructing an initial load thermal mathematical model of the carried load according to the initial load thermal design, wherein the initial load thermal mathematical model is a vacuum environment model in which the carried load works, and the initial load thermal design is obtained by inputting a thermal design boundary of the initial load into the initial thermal design of the initial load; A first test module is used to obtain first test data of the load under a boundary temperature condition under a first test environment, wherein the first test environment is a test environment under a standard temperature of normal temperature and pressure; A second test module is used to build a simulated second test environment for the initial load thermal mathematical model, and obtain second test data of the initial load thermal mathematical model under the boundary temperature condition under the second test environment, wherein the second test environment is built based on the first test environment; an adjustment module, configured to iteratively adjust the initial load thermal mathematical model according to the first test data and the second test data, so as to obtain a target load thermal mathematical model of the carried load; The acquisition module is used to adjust the initial load thermal design of the carried payload according to the target payload thermal mathematical model, obtain the target load thermal design of the carried payload, and obtain the integrated thermal design of the whole satellite according to the target load thermal design.

9. An electronic device, characterized in that: The invention comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the program, the method for acquiring thermal design of payload carried by a constellation satellite as described in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, it implements the method for obtaining thermal design of a constellation satellite payload as described in any one of claims 1-7.

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