Transparent double-sided display lamp panel

Abstract

The invention discloses a transparent double-sided display lamp panel, and belongs to the field of display lamp panels, the transparent double-sided display lamp panel comprises a transparent circuit carrier plate, a front metal circuit and a back metal circuit are arranged on the front side and the back side of the circuit carrier plate in a mirroring manner, the back metal circuit is connected with the front metal circuit through TGV punching, and a plurality of columns of display pixels are arranged on the circuit carrier plate. The display pixels are connected with the front metal circuit or the back metal circuit, and each column of display pixels comprises a plurality of pixel points. According to the transparent double-sided display lamp panel, the ultra-high transmittance is achieved by adopting the transparent display circuit carrier plate, the PVD process manufacturing extremely-refined circuit design and the AMIC driving scheme; and a TGV is manufactured in a non-display area of the circuit carrier plate, and a back circuit is led to the front side, so that double-side display synchronous control is realized.

Description

Technical Field

[0001] The invention relates to the technical field of display light panels, and in particular to a transparent double-sided display light panel. Background Art

[0002] Transparent Display is a special display technology that allows light to pass through the screen, allowing users to see the objects or environment behind the display. This technology combines the functions of ordinary display screens with the characteristics of transparent materials. It can present images, videos and other content while maintaining a certain degree of transparency to make the background environment visible. Transparent display has a wide range of applications and can be used in a variety of scenarios such as augmented reality (AR), smart glass, billboards, and car HUD (Head-Up Display), providing users with a unique visual experience.

[0003] Most of the existing transparent displays are realized by grilles, crystal films, and "perforated boards", and their overall transparent display effect is poor, and they cannot achieve ultra-high transmittance or double-sided transparent display. Summary of the invention

[0004] The purpose of the present invention is to provide a transparent double-sided display light board, which adopts a transparent display circuit carrier, uses a PVD process to produce an extremely fine circuit design and an AMIC driving solution to achieve ultra-high transmittance; and makes a TGV through the non-display area of ​​the circuit carrier to lead the back circuit to the front to achieve double-sided display synchronous control.

[0005] To achieve the above-mentioned purpose, the present invention provides a transparent double-sided display light board, including a transparent circuit carrier board, the front and back sides of the circuit carrier board are mirror-imaged with a front metal circuit and a back metal circuit, the back metal circuit is connected to the front metal circuit through TGV punching, and a plurality of columns of display pixels are arranged on the circuit carrier board, the display pixels are connected to the front metal circuit or the back metal circuit, and each column of display pixels includes a plurality of pixel points.

[0006] Preferably, the circuit carrier is a high-transmittance glass substrate.

[0007] Preferably, each pixel is an active AMIC&RGB chip.

[0008] Preferably, the AMIC has GND, POWER, DATA, and DIN signal components, and the front metal circuit and the back metal circuit both include GND, POWER, DATA, and DIN circuits.

[0009] Preferably, POWER provides power for AMIC and R / G / B, GND provides a loop for AMIC, DIN assigns an address code to each AMIC, and DATA provides current and display signal transmission data for each AMIC.

[0010] Preferably, each column of display pixels shares one GND, POWER, DATA, DIN line.

[0011] Preferably, the back metal circuit is punched through TGV in the non-display area to the front side of the circuit carrier, and the GND, POWER, DATA, and DIN circuits of the back metal circuit are connected to the front metal circuit through the through holes formed by the back metal circuit.

[0012] Preferably, the TGV through holes are arranged in a rectangular array.

[0013] Preferably, the circuit of the transparent double-sided display light panel is manufactured using a PVD process.

[0014] Therefore, the present invention adopts the above-mentioned transparent double-sided display light board, and uses the PVD process to produce an extremely fine circuit design and AMIC driving solution, which greatly improves the transmittance; at the same time, a TGV is made in the non-display area of ​​the circuit carrier to lead the back circuit to the front, thereby realizing a double-sided display synchronous control solution. The solution of the present invention can not only improve the transparency of the product, but also realize double-sided transparent display.

[0015] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front structure of a transparent double-sided display light board according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the back structure of a transparent double-sided display light board according to an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of a TGV punching structure according to an embodiment of the present invention;

[0019] Figure 4 for Figure 3 An enlarged schematic diagram of point A. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages disclosed in the embodiments of the present invention clearer, the embodiments of the present invention are further described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the embodiments of the present invention and are not intended to limit the embodiments of the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions.

[0021] It should be noted that the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or devices.

[0022] Like reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0024] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Example

[0026] like Figure 1 , Figure 2 As shown, a transparent double-sided display light board described in the present invention includes a transparent circuit carrier (optionally a highly transparent glass substrate or other highly transparent materials), and the front and back sides of the circuit carrier are mirror-imaged with front metal circuits and back metal circuits.

[0027] The front metal circuit and the back metal circuit are completely mirrored; the metal circuit is a color that can be recognized by the human eye, such as gray, silver, Cu and other colors. The circuit surface can also be roughened to blur the ambient light through diffuse reflection to avoid human eye recognition and improve the transparent effect of human eye viewing. The metal circuit is prepared by magnetron sputtering (a type of PVD process) or by attaching a Cu film.

[0028] There are several columns of display pixels on the circuit board, and the display pixels are connected to the front metal circuit or the back metal circuit. Each column of display pixels includes several pixels. Each pixel is an active AMIC&RGB chip (AM IC&R / G / B flip chip or DMIP: AM IC and R / G / B chip 4 in one), which can be an integral or separate design. Among them, AMIC has GND, POWER, DATA, DIN and other signal components, among which POWER provides power for IC and R / G / B, GND provides a loop for it, DIN assigns address code to each IC, and DATA provides current and display signal transmission data for each IC; each column of display pixels shares a GND, POWER, DATA, DIN. Considering the IR DROP and IC cascade load capacity, each column can be divided into multiple GND, POWER, DATA, DIN components; in order to improve the transmittance of the light board, the number and width of the lines are reduced as much as possible.

[0029] A row of pixels share one GND, POWER, DATA, and DIN line, which simplifies the overall wiring. At the same time, the line width is designed with 10um to 1mm. According to different current-carrying capacity designs, the proportion of the line is reduced, thereby improving the product transmittance. At the same time, AMIC and RGB chips are used as pixels, with a size of 0.2mm*0.2mm to 2.0mm*2.0mm. AMIC and RGB chips of different sizes are selected according to the pixel spacing to reduce the area share of the pixels and further improve the product transmittance.

[0030] like Figure 3 , Figure 4 As shown, the back metal circuit is connected to the front metal circuit through TGV punching, wherein the back circuit is connected to the front of the light board through TGV punching in the bonding area (non-display area), and the GND, POWER, DATA, and DIN circuits on the back are connected to the bonding area; the electrical and signal connection with the external control circuit is realized in the bonding area through FPC bonding, and the front and back of the light board are controlled and lit synchronously; thereby realizing a double-sided display light board with the same transparency; wherein the arrangement of TGV can be a rectangular array arrangement to improve the processing effect, and the design can be optimized according to different product designs.

[0031] The TGV and glass-based ultra-fine circuit manufacturing processes of the present invention are both existing processes and can be quickly mass-produced.

[0032] Therefore, the present invention adopts the above-mentioned transparent double-sided display light board, and realizes ultra-high transmittance by adopting a transparent display circuit carrier, and manufacturing an extremely fine circuit design and an AMIC driving scheme through the PVD process; and manufacturing a TGV through the non-display area of ​​the circuit carrier to lead the back circuit to the front, thereby realizing synchronous control of double-sided display.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A transparent double-sided display light board, characterized in that: It includes a transparent circuit carrier board, the front and back sides of the circuit carrier board are mirror-imaged with front metal circuits and back metal circuits, the back metal circuits are connected to the front metal circuits through TGV punching, a plurality of columns of display pixels are arranged on the circuit carrier board, the display pixels are connected to the front metal circuits or the back metal circuits, and each column of display pixels includes a plurality of pixel points.

2. The transparent double-sided display light board according to claim 1, characterized in that: The circuit board is a high-transmittance glass substrate.

3. The transparent double-sided display light board according to claim 1, characterized in that: Each pixel is an active AMIC&RGB chip.

4. The transparent double-sided display light board according to claim 3, characterized in that: AMIC has GND, POWER, DATA, and DIN signal components. The front metal circuit and the back metal circuit both include GND, POWER, DATA, and DIN circuits.

5. The transparent double-sided display light board according to claim 4, characterized in that: POWER provides power for AMIC and R / G / B, GND provides a loop for AMIC, DIN assigns address codes to each AMIC, and DATA provides current and display signal transmission data for each AMIC.

6. The transparent double-sided display light board according to claim 5, characterized in that: Each column of display pixels shares a GND, POWER, DATA, and DIN line.

7. The transparent double-sided display light board according to claim 1, characterized in that: The back metal circuit is punched through TGV in the non-display area to the front side of the circuit carrier board, and the GND, POWER, DATA, and DIN circuits of the back metal circuit are connected to the front metal circuit through the through holes formed by the back metal circuit.

8. The transparent double-sided display light board according to claim 7, characterized in that: The TGV through holes are arranged in a rectangular array.

9. The transparent double-sided display light board according to claim 1, characterized in that: The circuit of the transparent double-sided display light board is made by PVD process.

Images