A low-voltage irregular conductor and its manufacturing method

Abstract

This invention provides a low-voltage shaped conductor and its manufacturing method, belonging to the field of wire and cable technology. The manufacturing method involves polishing the contact surfaces of the drawn shaped conductor used for stranding, resulting in a tighter contact between the two conductors and reducing the risk of increased resistance or point discharge due to gaps between them. Furthermore, before the polishing process, the surface quality of the contact surfaces of the shaped conductor is continuously monitored. Based on the monitored surface quality, the working parameters for the polishing process are calculated, thereby improving the efficiency of continuous processing.

Description

Technical Field

[0001] This invention belongs to the field of wire and cable technology, and more specifically, relates to a low-voltage irregular conductor and its production method. Background Technology

[0002] In low-voltage power transmission and industrial applications, irregularly shaped conductors optimize space utilization and improve conductivity through their cross-sectional design. However, in practical applications, the key performance characteristics of irregularly shaped conductors depend not only on their material properties and geometry but also closely on the surface quality, particularly the flatness and smoothness of the lateral contact surfaces. When two irregularly shaped conductors are twisted together, if there is significant surface roughness, protrusions, or depressions on the contact surfaces, preventing a tight fit, a series of quality and usage-related problems will arise. For example, it may increase the contact resistance between the two or more conductors, thereby increasing the overall internal resistance of the cable, or it may increase the risk of partial discharge between the conductors.

[0003] Therefore, the surface quality of the contact surface of irregularly shaped conductors is directly related to the conductor's electrical performance, thermal stability, and long-term reliability.

[0004] A review of relevant publicly available technologies reveals several key technologies. One proposed technology, CN115312251A, describes a composite multilayer cable employing shaped conductors. By designing a special shaped conductor shape and using environmentally friendly materials, the cable's environmental performance is improved. Another proposed technology, WO2018107537A1, describes a large-section submarine power transmission cable using shaped conductors. The designed shaped conductor shape gives the cable a better internal resistivity and makes it suitable for manufacturing large-section cables. Finally, KR1020140004030A proposes filling the gaps between the shaped conductors with a specific material, resulting in a tighter twist and higher strength.

[0005] The above technical solutions all propose several optimization techniques to improve the performance of cables using non-standard conductors. However, for applications with higher requirements, further improvements to the relevant technologies are still needed.

[0006] The foregoing description of the background art is intended only to facilitate understanding of the invention. This description does not endorse or acknowledge any common general knowledge in the materials mentioned. Summary of the Invention

[0007] The purpose of this invention is to provide a low-voltage shaped conductor and its manufacturing method, belonging to the field of wire and cable technology. The manufacturing method involves polishing the contact surfaces of the drawn shaped conductor used for stranding, resulting in a tighter contact between the two conductors and reducing the risk of increased resistance or point discharge due to gaps between them. Furthermore, before the polishing process, the surface quality of the contact surfaces of the shaped conductor is continuously monitored. Based on the monitored surface quality, the working parameters for the polishing process are calculated, thereby improving the efficiency of continuous processing.

[0008] This invention adopts the following technical solution: a method for producing low-voltage irregular conductors, wherein the method is applied to the preparation of quadrilateral single-strand irregular conductors; the method includes the following steps:

[0009] S100: The conductor material is drawn and shaped using a wire drawing die to obtain a shaped conductor with a specified cross-sectional shape;

[0010] S200: Clean the surface of the shaped conductor;

[0011] S300: By continuously inspecting at least two lateral contact surfaces of the formed conductor, the flatness index of the formed conductor over a predetermined length is continuously evaluated.

[0012] S400: Sets the operating parameters of the rapid polishing section based on the flatness index of the current shaped conductor;

[0013] S500: Rapid polishing of the lateral contact surfaces of the corresponding shaped conductors;

[0014] S600: Inspects the surface quality of the lateral contact surface of the formed conductor after polishing to ensure that it meets the predetermined requirements.

[0015] Preferably, in step S300, the continuous surface inspection employs one or more of the following inspection methods: visual inspection, ultrasonic inspection, and eddy current inspection.

[0016] Preferably, in steps S400 and S500, the rapid polishing is performed using plasma polishing.

[0017] Preferably, the operating parameters of the rapid polishing process include at least one of the following parameters: operating voltage, operating current, air pressure, polishing speed, polishing temperature, and plasma frequency.

[0018] Preferably, the forming conductor includes being controlled and guided by a guiding device, which moves the forming conductor along its own length direction by clamping the non-contact surface of the forming conductor, and exposes the lateral contact surface of the forming conductor to the processing space of the relevant processing device in steps S300, S400, and S500.

[0019] Meanwhile, a low-voltage irregular conductor is proposed, which is prepared using the aforementioned production method.

[0020] Meanwhile, a low-voltage cable is proposed, which is prepared by stranding multiple strands of the aforementioned low-voltage shaped conductor.

[0021] The beneficial effects achieved by this invention are:

[0022] 1. This technical solution utilizes plasma polishing technology to improve the flatness and smoothness of the contact surface of irregularly shaped conductors, reducing contact gaps and resistance unevenness during conductor stranding. A flat contact surface effectively reduces contact resistance, minimizes localized heating and power transmission losses, and avoids the risk of partial discharge due to concentrated electric fields. Furthermore, a uniform contact surface enhances the mechanical stability of the stranded conductors, preventing deformation or microcracks under high tension and high temperature conditions, thus extending the conductor's service life. This refined surface treatment significantly improves the electrical performance and reliability of the conductor in power transmission systems.

[0023] 2. This technical solution improves the production efficiency of irregularly shaped conductors by introducing a continuous surface inspection process and adjusting the working parameters of the polishing process in real time based on the inspection of the contact surface of the irregularly shaped conductor.

[0024] 3. The polishing component of this technical solution improves the efficiency of plasma polishing by setting a polishing nozzle with an air wall formed by a specific fast airflow, thus avoiding the waste of polishing material caused by a main open nozzle. Attached Figure Description

[0025] The invention will be further understood from the following description taken in conjunction with the accompanying drawings. The components in the drawings are not necessarily drawn to scale, but rather the emphasis is on illustrating the principles of the embodiments. In different views, the same reference numerals designate corresponding parts.

[0026] Reference numerals: 10-Forming conductor; 200-Production device; 201-Fixed base; 202-Base; 203-Roller; 210-Detection module; 220-Raw material supply source; 230-Polishing component; 227-Seal; 231-Electrolyte inlet; 232-Electrolyte channel; 233-Power input; 234-Core; 249-Injection port; 250-Outer sleeve; 251-Gas input; 255-Core; 256-Ejection port 259-Air gap; 280-Motion mechanism; 520-Guide rail assembly; 510-Detection element; 530-Data acquisition unit; 540-Feedback interface; 550-Temperature control and environmental adaptation unit; 700-Computer system; 702-Bus; 704-Processor; 706-Main memory; 708-Read-only memory; 710-Storage device; 712-Display; 714-Input device; 716-Cursor control device; 718-Network device;

[0027] Figure 1 This is a schematic diagram of the production steps of the low-voltage irregular conductor described in an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of a production apparatus used in the production method according to an embodiment of the present invention;

[0029] Figure 3 This is a frontal cross-sectional schematic diagram of the movement direction of the roller and the forming conductor in an embodiment of the present invention;

[0030] Figure 4 This is an exploded cross-sectional view of the polishing assembly described in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the outer sleeve in section AA according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the architecture of the detection module described in an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the architecture of the control module described in an embodiment of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to its embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention. Other systems, methods, and / or features of this embodiment will become apparent to those skilled in the art after reviewing the following detailed description. All such additional systems, methods, features, and advantages are intended to be included within this specification, within the scope of the invention, and protected by the appended claims. Further features of the disclosed embodiments are described in the following detailed description, and these features will become apparent from the following detailed description.

[0035] In the accompanying drawings of this invention, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation. Because the invention is constructed and operated in a specific orientation, the terms describing positional relationships in the drawings are for illustrative purposes only and should not be construed as limiting this patent. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0036] Example 1: Exemplary, as shown in the appendix Figure 1 As shown, a method for producing low-voltage irregular conductors is proposed. This method is applied to the preparation of quadrilateral single-strand irregular conductors. The method includes the following steps:

[0037] S100: The conductor material is drawn and shaped using a wire drawing die to obtain a shaped conductor with a specified cross-sectional shape;

[0038] S200: Clean the surface of the shaped conductor;

[0039] S300: By continuously inspecting at least two lateral contact surfaces of the formed conductor, the flatness index of the formed conductor over a predetermined length is continuously evaluated.

[0040] S400: Sets the operating parameters of the rapid polishing section based on the flatness index of the current shaped conductor;

[0041] S500: Rapid polishing of the lateral contact surfaces of the corresponding shaped conductors;

[0042] S600: Inspects the surface quality of the lateral contact surface of the formed conductor after polishing to ensure that it meets the predetermined requirements.

[0043] Preferably, in step S300, the continuous surface inspection employs one or more of the following inspection methods: visual inspection, ultrasonic inspection, and eddy current inspection.

[0044] Preferably, in steps S400 and S500, the rapid polishing is performed using plasma polishing.

[0045] Preferably, the operating parameters of the rapid polishing process include at least one of the following parameters: operating voltage, operating current, air pressure, polishing speed, polishing temperature, and plasma frequency.

[0046] Preferably, the forming conductor includes being controlled and guided by a guiding device, which moves the forming conductor along its own length direction by clamping the non-contact surface of the forming conductor, and exposes the lateral contact surface of the forming conductor to the processing space of the relevant processing device in steps S300, S400, and S500.

[0047] Meanwhile, a low-voltage irregular conductor is proposed, which is prepared using the aforementioned production method.

[0048] Meanwhile, a low-voltage cable is proposed, which is prepared by stranding multiple strands of the aforementioned low-voltage shaped conductor.

[0049] Further details are attached. Figure 2 and attached Figure 3 The diagram illustrates, by way of example, a production apparatus 200 used for continuous inspection and polishing of irregularly shaped conductors in one embodiment. In this example, the shaped conductor 10 is an irregularly shaped conductor with a trapezoidal cross-section, formed by a drawing die. The cross-sectional shape of the shaped conductor 10 is described herein as merely an illustrative example and is not intended to limit the scope of this technical solution.

[0050] Furthermore, the production apparatus 200 is used to simultaneously perform continuous surface inspection and plasma polishing on two or more lateral contact surfaces of the formed conductor 10. The production apparatus 200 can be connected to the drawing process; after the formed conductor 10 is formed by the drawing die, it is immediately connected to the production apparatus 200. Alternatively, in some embodiments, the production apparatus 200 can also be set up independently as a separate processing thread, which is not limited here.

[0051] The production apparatus 200 includes a fixed base 201, a detection module 210, at least two polishing components 230, a motion mechanism 280 for driving the polishing components 230 to move, and a control module (not shown in the figure) for controlling the coordinated operation of the various modules and components of the production apparatus 200. The polishing components 230 are fixedly connected to the motion mechanism 280 through a connecting mechanism and achieve directional movement under the control of the motion mechanism 280, so as to perform independent processing on different positions of the surface of the formed conductor when necessary.

[0052] For example, the fixing base 201 is used to assist in positioning the shaped conductor 10 in the direction of conductor 10 movement, and simultaneously pulls the shaped conductor 10 to move continuously in the direction of movement. The fixing base 201 and the motion mechanism 280 cooperate with each other, allowing the polishing assembly 230 to continuously polish the shaped conductor 10 without moving; and when needed, at least one polishing assembly 230 can be controlled to move independently to achieve independent polishing position processing. Preferably, the fixing base 201 may include a base 202 and a roller 203. Furthermore, other fixing elements such as bolts, nuts, washers, or clamps can be used to fix the shaped conductor 10 laterally.

[0053] As attached Figure 3 As shown, the rollers 203 are a set of two, one above and one below, arranged on the upper and lower end faces of the forming conductor 10, respectively. They apply a certain pressure to the upper and lower end faces of the forming conductor 10 and simultaneously pull the forming conductor 10 towards the subsequent detection module 210 and polishing assembly 230. Preferably, the materials of each component in the fixing base 201 are made of insulating materials, thereby reducing current leakage during the polishing process and ensuring the safety and stability of the electrolysis process.

[0054] Further details are attached. Figure 4 and attached Figure 5 The image shown is an exploded cross-sectional view of the polishing assembly 230. The polishing assembly 230 is configured to be connected to an electrolyte supply source and a gas supply source for jetting. The polishing assembly 230 includes a core 234, which includes an electrolyte input terminal 231, a gas input terminal 251, and a power input terminal.

[0055] 233. The electrolyte input terminal 231 is connected to the electrolyte supply source to ensure a stable supply of electrolyte to the mixing module 220. The gas input terminal 251 is connected to the gas supply source. (See attached...) Figure 4 The electrolyte supply source and the gas supply source are connected and collectively referred to as raw material supply source 220. Upon receiving the gas, the polishing assembly 230 can adjust the gas flow rate and pressure to create a stable gas flow state. The power input terminal 233 is connected to a power supply to provide high-voltage electrical energy to support the electrolytic reaction of the electrolyte on the surface of the target object.

[0056] Furthermore, the polishing assembly 230 has an electrolyte channel 232 inside, from which the electrolyte flows to the front spray nozzle 249 and is sprayed out at a stable speed under high pressure.

[0057] For example, multiple fixing holes 228 may be provided at multiple locations on the polishing assembly 230, which can be used to fix the polishing assembly 230 to the motion mechanism 280 when needed.

[0058] On the other hand, the polishing assembly 230 is provided with a duckbill-shaped outer sleeve 250, and a core 255 is provided in the middle of the outer sleeve 250. There is a certain gap between the outer sleeve 250 and the core 255 to form an air gap 259. The gas input from the gas input end 251 passes through the air gap 259 under a certain pressure, which increases the gas pressure and flow rate, forming a high-speed jet of air. After exiting the outer sleeve 250, a stable gas wall is formed, which confines the electrolyte jet from the injection port 249 to the designated polishing area and prevents it from spreading to areas that do not need polishing. Preferably, the injection port 249 is elongated, and the width w of the injection port 249 is similar to the side height of the formed conductor 10 as shown in the figure, so that the electrolyte substantially covers the side height h of the formed conductor 10 when it is ejected.

[0059] Preferably, the maximum diameter of the injection port 249 is located at the end of the injection port 249. That is, the diameter of the injection port 249 gradually increases towards the tail end of the injection port 249. In other words, in a longitudinal section parallel to the ejection direction 256, the profile of the inner wall of the injection port 249 can be basically a slope.

[0060] In addition, the various components of the injection module are sealed together by a seal 227, which can be an O-ring, an elastic ring, or an insulating gasket, to ensure airtightness and insulation between the components.

[0061] In the device, the motion mechanism 280 controls the position and direction of the spray module, ensuring that the spray nozzle 249 is accurately aligned with the target area. The spray nozzle 249 preferably includes a horizontal motion module, a vertical motion module, and a rotary motion module, capable of moving along multiple axes. The motion mechanism 280 includes related power components for driving, such as motors, gears, and conveyor belts, as well as control software for controlling these power components, such as spatial position control software, error logging software, and communication software, to enable coordinated operation of the power components and support high-precision positioning and dynamic adjustment. In practical applications, through the control of the motion mechanism 280, the polishing assembly 230 can flexibly adjust the spray direction and spray distance to adapt to different shapes and sizes of the shaped conductor 10.

[0062] During the polishing process, the forming conductor 10 is first fixed on the mounting base 201 and grounded using a conductive element to ensure circuit integrity. Subsequently, the supply of electrolyte and gas is regulated by the control system. The electrolyte is delivered to the injection port 249 through the electrolyte communication port 231, while the gas is delivered to the gas outlet 259 through the gas communication port 251, forming a protective gas wall. A high-voltage current is applied to the electrolyte through the power input terminal 233, activating the electrolyte to undergo an electrolytic reaction on the target object surface. At this time, the electrolyte reacts chemically with the metal surface, removing minor protrusions and defects, and improving flatness. The gas wall forms a stable protective barrier in the polishing area, reducing interference from the external environment and preventing the electrolyte from diffusing into non-polished areas. Furthermore, the shape of the injection port and gas outlet of the injection module is optimized to minimize mutual interference between the jet stream and the gas wall, reducing turbulence and improving the uniformity and stability of the polishing process.

[0063] The entire polishing process can be monitored and dynamically adjusted in real time by a control system. This system can regulate key parameters such as electrolyte temperature and flow rate, gas pressure and velocity, and power supply voltage and current to adapt to target objects of different materials and shapes. Furthermore, the control system can be integrated with a continuous surface inspection system to monitor the surface smoothness index of the target object in real time and make dynamic adjustments based on the inspection data to ensure that the polishing effect meets the expected standards.

[0064] For example, the detection module 210 is used to continuously detect the lateral contact surface or other target areas of the formed conductor 10, thereby providing reliable reference data for the subsequent polishing process. The detection module 210 evaluates the flatness and surface smoothness of the lateral contact surface of the formed conductor 10 through real-time acquired surface data, and transmits the relevant information to the control module, thereby adjusting the operating parameters of the polishing assembly 230 to ensure that the polishing effect meets the expected standards.

[0065] Preferred options are listed below. Figure 6 As shown, the detection module 210 consists of multiple components to implement the detection function, including:

[0066] The detection element 510 is used to directly acquire morphological information of the surface of the formed conductor 10. Optionally, the detection element can be one or more of the following sensors: laser displacement sensor, eddy current sensor, ultrasonic sensor, optical camera. The detection elements can be flexibly replaced or combined according to different detection requirements and the material and shape characteristics of the formed conductor. Furthermore, by configuring evaluation algorithms such as image algorithms and optical signal algorithms, the smoothness of the current detection surface can be analyzed.

[0067] The guide rail assembly 520 supports the horizontal, vertical, or rotational movement of the detection element to accommodate conductors with different cross-sectional shapes. Preferably, the guide rail assembly may include horizontal guide rails, vertical guide rails, a rotating base, etc. Preferably, the movement of the guide rail assembly is driven and controlled by a servo motor and an encoder, providing micron-level positioning accuracy to ensure accurate detection.

[0068] The data acquisition unit 530 is used to receive signals acquired by the detection head sensor and convert them into digital data that can be analyzed. The data acquisition unit includes:

[0069] Signal amplifier: Amplifies the signal output by the sensor to ensure signal clarity and stability.

[0070] Analog-to-digital converter (ADC): Converts analog signals into digital signals for easier subsequent processing.

[0071] Data processor: Calculates surface flatness index and smoothness parameters in real time and transmits the results to the control system.

[0072] Feedback interface 540 is used to enable bidirectional communication between the detection module 210 and the control module. The detection module 210 transmits the detected surface data to the control module, which then dynamically adjusts the operating parameters of the polishing assembly 230, such as the spray angle, polishing speed, and electrolyte flow rate. Simultaneously, the control system can also send commands to the detection module via the feedback interface, such as adjusting the operating mode or detection path of the detection head.

[0073] Temperature control and environmental adaptation unit 550: To improve detection accuracy, the detection module 210 is equipped with a temperature control and environmental adaptation unit 550 to reduce the interference of environmental factors on the detection results. Preferably, the temperature control and environmental adaptation unit 550 includes:

[0074] Temperature sensors are used to monitor the temperature of the detection environment and the conductor surface in real time, and adjust the operating temperature of the detection head based on feedback.

[0075] The dust cover is used to protect the detection head from contaminants such as dust and metal shavings, ensuring the accuracy of the test results.

[0076] The shock-resistant structure is used to reduce the interference of vibration on the testing process.

[0077] The operation of the production device 200 is as follows: When the formed conductor 10 is pulled into the detection module 210 by the fixing seat 201, the detection module begins to perform surface detection on its lateral contact surface or other target areas. The detection element is positioned on the surface of the formed conductor 10 by the guide rail assembly, and the corresponding sensor is activated according to the specific detection requirements. Taking a laser displacement sensor as an example, the laser emitter emits a laser beam towards the conductor surface, the beam is reflected on the conductor surface, and the reflected light is captured by the receiver. Based on the offset of the optical path, the height value of each point on the conductor surface is calculated, and the height data is transmitted to the data acquisition unit, where the data processor calculates the flatness index and smoothness parameters of the conductor surface. Other types of sensors (such as eddy current sensors and ultrasonic sensors) are also based on similar physical detection principles and use a non-contact method to capture surface data, which will not be elaborated here.

[0078] During the inspection process, the inspection module 210 transmits surface data to the control module in real time, which then determines whether the quality of the conductor surface meets the polishing requirements. If the inspection results show that there are obvious surface defects or unevenness in a certain area, the control system will send a command to the motion mechanism 280 to adjust the working parameters or spray direction of the polishing component 230 to specifically treat that area.

[0079] Example 2: This example should be understood as including at least all the features of any of the foregoing examples, and further improving upon them:

[0080] Furthermore, in a preferred embodiment, to improve detection efficiency, the detection module 210 continuously monitors the flatness index Q of the two lateral contact surfaces of the formed conductor 10, and controls the moving speed v of the formed conductor 10 based on the Q value, so that when the flatness index Q fluctuates, the moving speed v of the formed conductor 10 is reduced to increase the processing time of the formed conductor 10 through the polishing component 230.

[0081] The movement speed v is calculated as follows:

[0082]

[0083] In the above formula, Q is the flatness index, which represents the surface flatness index or quality fluctuation parameter of the formed conductor within a preset length obtained by the detection module. The preset length can be set by relevant technical personnel, for example, it can be 30cm, 50cm, 70cm, etc.

[0084] SQ min This is the minimum threshold for the flatness index; values ​​below this indicate that the surface quality of the current inspection area meets the preset requirements. SQ max This is the maximum threshold for the flatness index; values ​​exceeding this indicate that the surface quality is substandard.

[0085] The Q value is obtained through the following formula:

[0086] Q = W1·R a +W2·D+W3·ΔQ;

[0087] In the above formula, R a ΔQ is the arithmetic mean deviation of surface roughness, characterizing the degree of surface roughness. It represents the average absolute value of the distance from each point on the surface profile to the centerline within a specific sampling area. D is the number of surface defects per unit area. ΔQ is the smoothness index fluctuation parameter, representing the maximum variation of the detected smoothness index within a specified length interval. W1, W2, and W3 are respectively corresponding to R... a The calculation weights of D and ΔQ are determined, and preferably W1+W2+W3=1. W1, W2 and W3 can be specifically set by relevant technical personnel.

[0088] Among them, R a The calculation method is as follows:

[0089]

[0090] In the above formula, N is the total number of sampling points within the sampling area; z i z represents the surface height value of the i-th sampling point (i.e., the distance from the ideal surface; both positive and negative heights are taken as absolute values); avg This represents the average height of all sampling points within the sampling area.

[0091] The calculation method for D is as follows:

[0092] D = m / A;

[0093] In the above formula, m is the total number of surface defects detected within the sampling area A.

[0094] ΔQ is calculated by recording the highest mass parameter value Q within a specified length L. max and the lowest quality parameter value Q min The difference, that is:

[0095] ΔQ=Q max -Q min ;

[0096] A smaller ΔQ indicates a more stable surface quality, while a larger ΔQ indicates greater fluctuations in surface quality, requiring adjustment of the moving speed.

[0097] Preferably, when the detection module 210 detects significant fluctuations in the surface quality of the formed conductor, the relevant operating parameters of the polishing assembly 230 need to be adjusted synchronously to increase the polishing intensity and ensure effective repair and improvement of the surface quality at low speeds. The polishing effect can be further improved by adjusting operating parameters such as operating voltage, electrolyte flow rate, gas flow rate, and spray angle.

[0098] Example 3: This example should be understood as including at least all the features of any of the foregoing examples, and further improving upon them;

[0099] For example, as shown in the appendix Figure 7 The following diagram illustrates an implementation of the computer system 700 used in the control module; the computer system 700 can be used to implement the necessary functions of the control module.

[0100] For example, computer system 700 includes bus 702 or other communication mechanism for transmitting information, and one or more processors 704 coupled to bus 702 for processing information; processor 704 may be, for example, one or more general-purpose microprocessors.

[0101] The computer system 700 also includes a main memory 706, such as random access memory (RAM), cache and / or other dynamic storage devices, coupled to a bus 702 for storing information and instructions to be executed by the processor 704; the main memory 706 may also be used to store temporary variables or other intermediate information during the execution of instructions executed by the processor 704; when these instructions are stored in a storage medium accessible to the processor 704, the computer system 700 presents itself as a dedicated machine customized to perform the operations specified in the instructions;

[0102] The computer system 700 may also include a read-only memory (ROM) 708 or other static storage device coupled to the bus 702 for storing static information and instructions of the processor 704; wherein a storage device 710, such as a disk, optical disk or USB drive (flash drive), is coupled to the bus 702 for storing information and instructions.

[0103] Furthermore, the bus 702 may also include a display 712 for displaying various information, data, media, etc., and an input device 714 for allowing users of the computer system 700 to control, manipulate, and / or interact with the computer system 700.

[0104] A preferred method of interacting with the management system may be through a cursor control device 716, such as a computer mouse or a similar control / navigation mechanism;

[0105] Furthermore, the computer system 700 may also include a network device 718 coupled to the bus 702; wherein the network device 718 may include components such as wired network cards, wireless network cards, switching chips, routers, switches, etc.

[0106] Generally speaking, the terms “engine,” “component,” “system,” and “database” used in this article can refer to the logic embodied in hardware or firmware, or to a set of software instructions that may have entries and exit points, written in programming languages ​​such as Java, C, or C++; software components can be compiled and linked into executable programs and installed in dynamic link libraries, or can be written in interpreted programming languages ​​(such as BASIC, Perl, or Python); it should be understood that software components can be called from other components or from themselves, and / or can be called in response to detected events or interrupts;

[0107] Software components configured to execute on a computing device may be provided on a computer-readable medium, such as an optical disc, digital video disc, flash drive, magnetic disk, or any other tangible medium, or as a digital download (and may be initially stored in a compressed or installable format, requiring installation, decompression, or decryption prior to execution); such software code may be stored, in part or in whole, on a memory device executing the computing device; software instructions may be embedded in firmware, such as an EPROM; it should also be understood that hardware components may consist of connected logic units (e.g., gates and flip-flops), and / or may consist of programmable units (e.g., programmable gate arrays or processors);

[0108] The computer system 700 includes technologies described herein that can be implemented using custom hardwired logic, one or more ASICs or FPGAs, firmware and / or program logic, which, when combined with the computer system, enables the computer system 700 to become a dedicated computing device.

[0109] According to one or more embodiments, the techniques described herein are executed by a computer system 700 in response to a processor 704 executing one or more sequences of one or more instructions contained in main memory 706; such instructions may be read into main memory 706 from another storage medium such as storage device 710; execution of the sequence of instructions contained in main memory 706 causes processor 704 to perform the processing steps described herein; in alternative embodiments, hardwired circuitry may be used in place of or in combination with software instructions.

[0110] As used herein, the term "non-transitory medium" and similar terms refer to any medium that stores data and / or instructions that enable a machine to operate in a particular manner; such non-transitory medium may include non-volatile medium and / or volatile medium; non-volatile medium includes, for example, optical discs or magnetic disks, such as storage device 710; volatile medium includes dynamic memory, such as main memory 706.

[0111] Common forms of non-transitory media include, for example, floppy disks, hard disks, solid-state drives, magnetic tapes or any other magnetic data storage media, CD-ROMs, any other optical data storage media, any physical media with a hole pattern, RAM, PROM and EPROM, FLASH-EPROM, NVRAM, any other memory chips or cartridges and their network versions.

[0112] Non-transient media are different from transmission media, but can be used in conjunction with transmission media; transmission media participate in information transmission between non-transient media; for example, transmission media include coaxial cables, copper wires and optical fibers, including the wires that constitute bus 702; transmission media can also take the form of sound waves or light waves, such as radio waves and infrared data communication.

[0113] While the invention has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the invention. That is, the methods, systems, and devices discussed above are examples. Various configurations can be appropriately omitted, substituted, or added to various processes or components. For example, in alternative configurations, methods can be performed in a different order than those described, and / or various components can be added, omitted, and / or combined. Moreover, features described with respect to certain configurations can be combined in various other configurations, such as different aspects and elements of the configuration can be combined in a similar manner. Furthermore, the elements therein can be updated as the technology develops; that is, many elements are examples and do not limit the scope of this disclosure or the claims.

[0114] Specific details are provided in the specification to offer a thorough understanding of exemplary configurations, including implementations. However, configurations can be practiced without these specific details; for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail to avoid obscuring the configuration. This description provides only exemplary configurations and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes can be made to the function and arrangement of the elements without departing from the spirit or scope of this disclosure.

[0115] In summary, the above detailed description is intended to be illustrative rather than restrictive, and it should be understood that these embodiments are for illustrative purposes only and not for limiting the scope of protection of the invention. After reading the description of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent changes and modifications also fall within the scope defined by the claims of this invention.

Claims

1. A method for producing low-voltage irregular conductors, characterized in that, The production method is applied to the preparation of quadrilateral single-strand irregular conductors; the production method includes the following steps: S100: The conductor material is drawn and shaped using a wire drawing die to obtain a shaped conductor with a specified cross-sectional shape; S200: Clean the surface of the shaped conductor; S300: By continuously inspecting at least two lateral contact surfaces of the formed conductor, the flatness index of the formed conductor over a predetermined length is continuously evaluated. S400: Sets the operating parameters of the rapid polishing section based on the flatness index of the current shaped conductor; S500: Rapid polishing of the lateral contact surface of the formed conductor in section A; S600: Inspect the surface quality of the lateral contact surface of the formed conductor after polishing to ensure that it meets the predetermined requirements; The method employs a production device to continuously inspect and polish the conductor. The production apparatus includes a fixed base, a detection module, at least two polishing components, and a motion mechanism for driving the polishing components to move. The detection module continuously monitors the flatness index Q of the two lateral contact surfaces of the forming conductor, and controls the moving speed v of the forming conductor based on the Q value, so that when the flatness index Q fluctuates, the moving speed v of the forming conductor is reduced to increase the processing time of the forming conductor through the polishing component. The movement speed v is calculated as follows: ； Where Q is the flatness index, which represents the surface flatness index or quality fluctuation parameter of the formed conductor in a preset length obtained by the detection module; SQ min This is the minimum threshold for the flatness index; a value below this indicates that the surface quality of the current inspection area meets the preset requirements. (SQ) max This is the maximum threshold for the flatness index; values ​​exceeding this indicate that the surface quality is substandard. The Q value is obtained through the following formula: Q=W1×R a +W2×D+W3×ΔQ; Among them, R a is the arithmetic mean deviation of surface roughness, characterizing the degree of surface roughness; it represents the average absolute value of each point on the surface profile from the centerline within a specific sampling area; D is the number of surface defects per unit area; ΔQ is the smoothness index fluctuation parameter, representing the maximum change in the detected smoothness index within a specified length interval; W1, W2, and W3 are respectively corresponding to R a The weights of , D and ΔQ are calculated, and W1+W2+W3=1; Among them, R a The calculation method is as follows: ； Where N is the total number of sampling points within the sampling area; z i Let z be the surface height value of the i-th sampling point, i.e., the distance from the ideal surface; both positive and negative heights are taken as absolute values. avg This represents the average height of all sampling points within the sampling area. The calculation method for D is as follows: D = m / A; In the above formula, m is the total number of surface defects detected within the sampling area A; ΔQ is calculated by recording the highest mass parameter value Q within a specified length L. max and the lowest quality parameter value Q min The difference, that is: ΔQ=Q max -Q min ; A smaller ΔQ indicates a more stable surface quality, while a larger ΔQ indicates greater fluctuations in surface quality, requiring adjustment of the moving speed.

2. The production method as described in claim 1, characterized in that, In step S300, the continuous surface inspection employs one or more of the following inspection methods: visual inspection, ultrasonic inspection, and eddy current inspection.

3. The production method as described in claim 2, characterized in that, In steps S400 and S500, the rapid polishing is performed using plasma polishing.

4. The production method as described in claim 3, characterized in that, The operating parameters of the rapid polishing process include at least one of the following parameters: operating voltage, operating current, air pressure, polishing speed, polishing temperature, and plasma frequency.

5. The production method as described in claim 4, characterized in that, The forming conductor to be processed includes being controlled and guided by a guiding device, moving the forming conductor along its length by clamping its non-contact surface, and exposing the lateral contact surface of the forming conductor to the processing space of the relevant processing device in steps S300, S400, and S500.

6. A low-voltage irregular conductor, characterized in that, The irregular conductor is prepared using the production method described in claim 5.

7. A low-voltage cable, characterized in that, The low-voltage cable comprises a cable prepared by stranding multiple strands of the irregularly shaped conductor as described in claim 6.

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