Coil component

Abstract

The present disclosure provides a coil assembly including: a main body; the supporting component is arranged in the main body; a coil disposed on the support member and including a lower surface in contact with the support member and an upper surface opposite to the lower surface; an insulating wall covering a side surface of the coil and filling a gap between turns of the coil; an insulating film disposed between adjacent insulating walls and covering the upper surface of the coil; and an external electrode disposed on the main body. The insulating wall includes a plurality of layers with interfaces therebetween. A height of the insulating wall is greater than or equal to a height of an upper surface of the insulating film.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0131516 filed on October 4, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] An inductor (coil component) is a representative passive electronic component used in electronic devices together with a resistor and a capacitor.

[0004] As electronic devices are increasingly being made more high-performance and miniaturized, the number of electronic components used in the electronic devices is increasing and their sizes are decreasing.

[0005] On the other hand, in order to improve the inductance characteristics of the coil assembly within a limited size, it is advantageous to increase the number of turns of the coil, increase the area of ​​the central core, and increase the effective volume of the magnetic material.

[0006] Coils with high aspect ratios may be suitable for achieving the above characteristics, but problems such as difficulty in plating processes and leakage of current through the magnetic material between adjacent turns may arise. Summary of the invention

[0007] An aspect of the present disclosure is to easily form a coil having a high aspect ratio through an insulating wall and prevent current leakage between adjacent turns.

[0008] An aspect of the present disclosure is to improve inductance characteristics of a coil component by securing a space in a body in which a magnetic material may be disposed.

[0009] According to one aspect of the present disclosure, a coil component includes: a main body including a first surface and a second surface opposite to each other in a first direction; a support member disposed in the main body and having one surface and another surface opposite to each other in the first direction; a coil disposed on the support member, having multiple turns, and including a lower surface in contact with the support member, an upper surface opposite to the lower surface, and a side surface connecting the upper surface and the lower surface; an insulating wall covering the side surface of the coil and filling between the turns of the coil; an insulating film disposed between the insulating walls and covering the upper surface of the coil; and an external electrode disposed on the main body and connected to the coil. The insulating wall includes a plurality of layers, and an interface is disposed between the layers of the insulating wall. Relative to one surface of the support member, the height of the insulating wall in the first direction is greater than or equal to the height of the upper surface of the insulating film in the first direction.

[0010] According to one aspect of the present disclosure, a coil component includes: a main body including a first surface and a second surface opposite to each other in a first direction; a support member disposed in the main body; a coil disposed on the support member, having a plurality of turns, and including a lower surface in contact with the support member and an upper surface opposite to the lower surface in the first direction; an insulating wall disposed between the turns of the coil; an insulating film disposed between the insulating walls and between the upper surface of the coil and the main body; and an external electrode disposed on the main body and connected to the coil. The insulating wall includes a plurality of layers, and interfaces are provided between the layers of the insulating wall. The upper surface of the coil has a concave shape toward the support member.

[0011] According to one aspect of the present disclosure, a coil component includes: a support member; a coil disposed on a surface of the support member, the coil having a lower surface contacting the surface of the support member and an upper surface opposite to the lower surface in a first direction, and the coil including multiple turns with gaps between the multiple turns; an insulating wall disposed in the gaps between the multiple turns and including multiple layers with interfaces between the multiple layers, the line width of the insulating wall being the smallest at the interface; and an insulating film disposed on the upper surface of the coil. The distance between the upper surface of the insulating film and the surface of the support member is less than or equal to the distance between the upper surface of the insulating wall and the surface of the support member. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically showing a coil component according to a first embodiment; Figure 2 is along Figure 1 A cross-sectional view taken along line I-I'; Figure 3 yes Figure 2 Magnified view of the A1 region in ; Figure 4 is along Figure 1 A cross-sectional view taken along line II-II'; Figure 5 The coil assembly of the first modification of the first embodiment is shown and is Figure 4 The corresponding diagram; Figure 6 A coil assembly of a second variation of the first embodiment is shown and is Figure 3 A diagram of the A2 region corresponding to the A1 region; Figure 7 The coil assembly of the third variation of the first embodiment is shown and is Figure 3 A diagram of the A3 area corresponding to the A1 area; Figure 8 A coil assembly of a fourth variation of the first embodiment is shown and is Figure 3 A diagram of the A4 area corresponding to the A1 area; Fig. 9 A coil assembly according to a second embodiment is shown and is Figure 2 The corresponding diagram; Fig.10 yes Fig. 9 A magnified view of region B; Fig.11 A coil assembly of a modification of the second embodiment is shown and corresponds to Fig.10 A diagram of the B' region of the B region; Fig.12 is a schematic diagram showing the manufacturing Figure 4 A diagram of a portion of a process for producing a coil assembly as shown in FIG. 1 ; and Fig.13 is a schematic diagram showing the manufacture of a Figure 7 A diagram showing a portion of a process for producing a coil assembly of a coil having a multilayer structure. DETAILED DESCRIPTION

[0013] The terms used in this application are only used to describe specific embodiments and are not intended to limit the present disclosure. Unless the context clearly specifies otherwise, singular expressions also include plural expressions. In this application, terms such as "including" or "having" are intended to specify the features, quantity, steps, operations, components, parts or their combinations described in the specification, and it should be understood that this does not exclude the possibility of adding or having one or more other features, quantities, steps, operations, components, parts or their combinations. Throughout the specification, "on ... " means to be positioned above or below the target portion, and does not necessarily mean to be positioned on the upper side relative to the direction of gravity.

[0014] In addition, the term “coupled” not only means a case where the respective components are in direct physical contact in a contact relationship between the respective components, but is also used as a concept covering even a case where other components are interposed between the respective components and the respective components are in contact with the other components, respectively.

[0015] The size (eg, thickness) of each component shown in the drawings is arbitrarily indicated for convenience of description, and thus the present disclosure is not necessarily limited thereto.

[0016] In the drawings, a T(1) direction may be defined as a first direction or a thickness direction, an L(2) direction may be defined as a second direction or a length direction, and a W(3) direction may be defined as a third direction or a width direction.

[0017] Hereinafter, a coil component according to an embodiment will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and a repeated description thereof will be omitted.

[0018] Various types of electronic components are used in electronic devices, and in these electronic components, various types of coil components may be appropriately used to remove noise and the like.

[0019] For example, in electronic devices, the coil component can be used as a power inductor, a high-frequency inductor, a general magnetic bead, a high-frequency magnetic bead (for example, a magnetic bead suitable for a GHz frequency band), a common mode filter, etc.

[0020] First embodiment Figure 1 is a perspective view schematically showing a coil component according to a first embodiment. Figure 2 is along Figure 1 A cross-sectional view taken along line I-I'. Figure 3 yes Figure 2 Magnified view of the A1 region in . Figure 4 is along Figure 1 A cross-sectional view taken along line II-II'.

[0021] On the other hand, in order to more clearly show the connection between components, Figure 1 The insulating film 500 and the outer insulating layer applicable to this embodiment are omitted.

[0022] Reference Figures 1 to 4 , the coil component 1000 according to the present embodiment may include a body 100 , a support member 200 , a coil 300 , an insulating wall 400 , an insulating film 500 , and external electrodes 610 and 620 .

[0023] The coil component 1000 according to the present embodiment may stably form a coil having a high aspect ratio by including the insulating wall 400 filled between the turns of the coil 300 , thereby improving insulation reliability between the turns.

[0024] In addition, by forming the insulating wall 400 in multiple layers, the coil 300 with a higher aspect ratio can be formed, so that the inductance can be increased as the number of turns of the coil 300 increases within a limited size, and the direct current resistance (Rdc) characteristics can also be improved as the cross-sectional area of ​​the coil 300 increases.

[0025] On the other hand, the coil component 1000 according to the present embodiment may include an insulating film 500 covering the upper surface of the coil 300. By forming the height of the upper surface of the insulating film 500 to be the same as or lower than the height of the end of the insulating wall 400, more space in which the magnetic material of the body 100 can be arranged is ensured, and as the effective volume increases, the inductance characteristics can be improved.

[0026] In this embodiment, the line width LWw of the insulating wall 400 set between each turn of the coil 300 is in the range of 3μm to 8μm, the thickness Tf of the insulating film 500 in the first direction T is in the range of 6μm to 8μm, and the thickness Ts of the support member 200 in the first direction T may be less than or equal to 50μm, but is not limited thereto.

[0027] Hereinafter, main components constituting the coil component 1000 according to the present embodiment will be described in detail.

[0028] The body 100 has the appearance of the coil component 1000 according to the present embodiment, and the support member 200 , the coil 300 , the insulating wall 400 , and the insulating film 500 may be embedded in the body 100 .

[0029] The body 100 may be entirely formed in a hexahedral shape.

[0030] The main body 100 has a first surface 101 and a second surface 102 opposite to each other in a thickness direction T (first direction), a third surface 103 and a fourth surface 104 opposite to each other in a length direction L (second direction), and a fifth surface 105 and a sixth surface 106 opposite to each other in a width direction W (third direction). Each of the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the main body 100 corresponds to a wall surface of the main body 100 connecting the first surface 101 and the second surface 102 of the main body 100.

[0031] For example, the body 100 may be formed so that the coil component 1000 having the external electrodes 610 and 620 formed thereon has a length of 2.5 mm, a width of 2.0 mm, and a thickness of 0.8 mm, or a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.6 mm, or a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.6 mm, or a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.4 mm, or a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm, or a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, but the present disclosure is not limited thereto. On the other hand, the above exemplary values ​​of the length, width, and thickness of the coil component 1000 refer to values ​​that do not reflect process errors, and values ​​within a range that can be identified as process errors should be considered to correspond to the above exemplary values.

[0032] Based on an optical microscope image or a scanning electron microscope (SEM) image of a length direction L-thickness direction T cross section taken from the central portion of the coil component 1000 in the width direction W, the length of the coil component 1000 may refer to: the maximum value of the size of a plurality of line segments obtained by connecting the two outermost boundary lines of the coil component 1000 shown in the image that are opposite to each other in the length direction L, and the plurality of line segments are parallel to the length direction L and spaced apart from each other in the thickness direction. Optionally, the length of the coil component 1000 may refer to the minimum value of the size of the plurality of line segments. Optionally, the length of the coil component 1000 may refer to the arithmetic mean of at least three of the sizes of the plurality of line segments. In this case, the plurality of line segments parallel to the length direction L may be spaced apart from each other equidistantly in the thickness direction T, but the present disclosure is not limited thereto.

[0033] Based on an optical microscope image or a scanning electron microscope (SEM) image of a length direction L-thickness direction T cross section taken from the central portion of the coil component 1000 in the width direction W, the thickness of the coil component 1000 may refer to: the maximum value of the size of a plurality of line segments obtained by connecting the two outermost boundary lines of the coil component 1000 shown in the image that are opposite to each other in the thickness direction T, and the plurality of line segments are parallel to the thickness direction T and spaced apart from each other in the length direction L. Optionally, the thickness of the coil component 1000 may refer to the minimum value of the size of the plurality of line segments. Optionally, the thickness of the coil component 1000 may refer to the arithmetic mean of at least three of the sizes of the plurality of line segments. In this case, the plurality of line segments parallel to the thickness direction T may be spaced apart from each other equidistantly in the length direction L, but the present disclosure is not limited thereto.

[0034] Based on an optical microscope image or a scanning electron microscope (SEM) image of a length direction L-width direction W cross section taken from the central portion of the coil component 1000 in the thickness direction T, the width of the coil component 1000 may refer to: the maximum value of the size of a plurality of line segments obtained by connecting the two outermost boundary lines of the coil component 1000 shown in the image that are opposite to each other in the width direction W, and the plurality of line segments are parallel to the width direction W and spaced apart from each other in the length direction L. Optionally, the width of the coil component 1000 may refer to the minimum value of the size of the plurality of line segments. Optionally, the width of the coil component 1000 may refer to the arithmetic mean of at least three of the sizes of the plurality of line segments. In this case, the plurality of line segments parallel to the width direction W may be spaced apart from each other equidistantly in the length direction L, but the present disclosure is not limited thereto.

[0035] Optionally, each of the length, width and thickness of the coil assembly 1000 can be measured by a micrometer measurement method. The micrometer measurement method can be performed by the following method using a micrometer with metrological repeatability and reproducibility (R&R): setting a zero point, inserting the coil assembly 1000 according to the present embodiment between the tips of the micrometer, and rotating the measuring rod of the micrometer. On the other hand, in the measurement of the length of the coil assembly 1000 performed by the micrometer measurement method, the length of the coil assembly 1000 may refer to a value measured once, or may refer to an arithmetic mean of values ​​measured multiple times. This measurement method is also applicable to the width and thickness of the coil assembly 1000.

[0036] The main body 100 may include a magnetic material and a resin. In detail, the main body 100 may be formed by laminating one or more magnetic composite sheets in which a magnetic material is dispersed in a resin. However, the main body 100 may have a structure other than a structure in which a magnetic material is dispersed in a resin. For example, the main body 100 may be formed of a magnetic material such as ferrite or may be formed of a non-magnetic material.

[0037] The magnetic material can be ferrite or magnetic metal particles.

[0038] The ferrite may be, for example, at least one of spinel ferrites (such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, Ni-Zn, etc.), hexagonal ferrites (such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co and Ba-Ni-Co, etc.), garnet ferrites (such as Y, etc.) and Li-based ferrites.

[0039] The magnetic metal particles may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic metal particles may be at least one of pure iron particles, Fe-Si alloy particles, Fe-Si-Al alloy particles, Fe-Ni alloy particles, Fe-Ni-Mo alloy particles, Fe-Ni-Mo-Cu alloy particles, Fe-Co alloy particles, Fe-Ni-Co alloy particles, Fe-Cr alloy particles, Fe-Cr-Si alloy particles, Fe-Si-Cu-Nb alloy particles, Fe-Ni-Cr alloy particles, and Fe-Cr-Al alloy particles.

[0040] The magnetic metal particles may be amorphous or crystalline. For example, the magnetic metal particles may be Fe-Si-B-Cr based amorphous alloy particles, but are not necessarily limited thereto.

[0041] The ferrite and the magnetic metal particles may have an average diameter of about 0.1 μm to 30 μm, but the present disclosure is not limited thereto.

[0042] The body 100 may include two or more types of magnetic materials dispersed in the resin. In this case, the different types of magnetic materials mean that the magnetic materials dispersed in the resin are distinguished from each other by any one of average diameter, composition, crystallinity, and shape.

[0043] The resin may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but is not limited thereto.

[0044] The body 100 has a core 110 passing through the support member 200 and the coil 300. The core 110 may be formed by filling a through hole of the support member 200 with a magnetic composite sheet, but is not limited thereto.

[0045] The support member 200 may be disposed within the body 100. The support member 200 is configured to support the coil 300 and the insulating wall 400. On the other hand, the support member 200 may be excluded according to embodiments, such as when the coil 300 corresponds to a winding type coil or has a coreless structure.

[0046] The support member 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed of an insulating material formed by impregnating a reinforcing material such as glass fiber or an inorganic filler in the above insulating resin. For example, the support member 200 may include a prepreg, an Ajinomoto Build-up Film (ABF), FR-4, a bismaleimide triazine (BT) resin, a photosensitive dielectric (PID), and a copper clad laminate (CCL), but the present disclosure is not limited thereto.

[0047] As the inorganic filler, at least one selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3) can be used.

[0048] When the support member 200 is formed of an insulating material including a reinforcing material, the support member 200 can provide more excellent rigidity. When the support member 200 is formed of an insulating material not including glass fiber, by reducing the total thickness of the support member 200 and the coil 300 (referring to the thickness of the coil 300 and the support member 200 between the support member 200 and the coil 300), Figure 1 When the support member 200 is formed of an insulating material including a photosensitive insulating resin, the number of processes for forming the coil 300 is reduced, which can help reduce production costs and form a fine via hole 320.

[0049] The thickness Ts of the support member 200 in the first direction T may be less than or equal to 50 μm, and in detail, may be in the range of 10 μm to 50 μm, but is not limited thereto.

[0050] In the coil component 1000 according to the present embodiment, the thickness Ts of the support member 200 is formed to be as thin as less than or equal to 50 μm, thereby ensuring space for the magnetic material to form the coil 300 with a high aspect ratio within the same size, and since space for the magnetic material can be ensured in the main body 100, the effective volume can be increased and the inductance characteristics can be improved.

[0051] The coil 300 of the present embodiment may be disposed on the support member 200. In addition, the coil 300 of the present embodiment may be insulated from the body 100 by the insulating wall 400 and the insulating film 500.

[0052] The coil 300 is embedded in the body 100 and exhibits characteristics of a coil component. For example, when the coil component 1000 according to the present embodiment is used as a power inductor, the coil 300 stores an electric field as a magnetic field to maintain an output voltage, thereby stabilizing power of an electronic device.

[0053] The coil 300 is formed on at least one of the two opposite surfaces of the support member 200 and may form a plurality of turns. The coil 300 may include a lower surface in contact with the support member 200, an upper surface opposite to the lower surface, and a side surface connecting the upper surface and the lower surface, and the side surface of the coil 300 may be covered by the insulating wall 400, and the upper surface of the coil 300 may be covered by the insulating film 500.

[0054] Reference Figure 3 The coil component 1000 according to the present embodiment has the insulating wall 400 formed of a plurality of layers. In this case, the side surface of the coil 300 may include at least one protrusion P1 protruding toward the interface Iw between the layers of the insulating wall 400.

[0055] Regarding the protrusion P1, when the various layers of the insulating wall 400 are stacked sequentially, a region where the line width LWw of the insulating wall 400 is narrowed may be generated in the interface Iw region of each layer, and then, when the coil 300 is formed by electrolytic plating, the metal component fills the region, thereby forming the protrusion P1.

[0056] When the protrusion P1 is formed on the side of the coil 300, the line width LWc at each turn of the coil 300 may be the largest in the region adjacent to the protrusion P1. For example, the line width LWw of the insulating wall 400 in the region adjacent to the protrusion P1 may be the smallest, and accordingly, the line width LWc of the coil 300 in the region adjacent to the protrusion P1 may be the largest.

[0057] In this case, based on an optical microscope image or a scanning electron microscope (SEM) image of a first direction T-second direction L cross section taken from a central portion of the coil component 1000 in the third direction W, as an example, the line width LWc of the coil 300 may refer to an arithmetic mean of at least three of the respective dimensions of a plurality of line segments connecting two outermost boundary lines in the second direction L of a single turn of the first coil pattern 311 shown in the image and spaced apart from each other in the first direction T. In this case, the plurality of line segments may be spaced apart from each other at equal distances, but the present disclosure is not limited thereto.

[0058] On the other hand, the line width LWw of the insulating wall 400 may also be measured in a similar manner.

[0059] The coil 300 of the present embodiment may include coil patterns 311 and 312 , a via 320 , and lead-out portions 331 and 332 .

[0060] For details, refer to Figure 2 and Figure 4The coil 300 of this embodiment may include a first coil pattern 311 arranged on one surface of the support member 200, a first lead-out portion 331 extending from an outer end of the first coil pattern 311 to the third surface 103 of the body 100, a second coil pattern 312 arranged on another surface of the support member 200, a second lead-out portion 332 extending from an outer end of the second coil pattern 312 to the fourth surface 104 of the body 100, and a via 320 connecting the first coil pattern 311 and the second coil pattern 312.

[0061] Reference Figures 1 to 4 The first coil pattern 311 and the second coil pattern 312 are disposed on two surfaces of the support member 200 opposite to each other in the first direction T, and may be in the form of a planar spiral forming a plurality of turns around the core 110 of the body 100 .

[0062] The first coil pattern 311 may be disposed on one surface of the support member 200 to form a plurality of turns around the core 110. An end of an outermost turn of the first coil pattern 311 may be connected to a first lead-out portion 331 extending to the third surface 103 of the body 100.

[0063] In addition, the second coil pattern 312 may be disposed on another surface of the support member 200 to form a plurality of turns around the core 110 as an axis. An end of the outermost turn of the second coil pattern 312 may be connected to the second lead-out portion 332 extending to the fourth surface 104 of the body 100.

[0064] The insulating wall 400 may be disposed between the respective turns of the coil patterns 311 and 312. The insulating wall 400 may prevent a short circuit or current leakage between adjacent turns by filling a space between the respective turns of the coil patterns 311 and 312.

[0065] In addition, the insulating film 500 is disposed on the upper surfaces of the coil patterns 311 and 312 between the insulating walls 400 so that the coil patterns 311 and 312 can be insulated from the body 100 .

[0066] Reference Figure 1 and Figure 2 The lead-out portions 331 and 332 may extend from the coil patterns 311 and 312 to the third surface 103 or the fourth surface 104 of the body 100 .

[0067] In detail, the first lead-out portion 331 may be connected to the outer end of the first coil pattern 311, extend to the third surface 103 of the body 100, and be connected to the first external electrode 610. In addition, the second lead-out portion 332 may be connected to the outer end of the second coil pattern 312 and extend to the fourth surface 104 of the body 100 to be connected to the second external electrode 620.

[0068] Reference Figure 4The coil 300 of the present embodiment may further include a via 320 connecting the first coil pattern 311 and the second coil pattern 312. In detail, the via 320 may pass through the support member 200 and connect the inner ends of the innermost turns of each of the first coil pattern 311 and the second coil pattern 312 to each other.

[0069] On the other hand, the via hole 320 of the present embodiment may have a circular shape based on the LW cross section, and the diameter may decrease from one surface toward the inside of the support member 200, and then increase again from the inside toward the other surface. For example, the cross-sectional area of ​​the via hole 320 on the LW cross section may be the smallest inside the support member 200.

[0070] When a via hole is processed in the support member 200, the above-mentioned features can be realized by irradiating laser from both sides of the support member 200 so that the via hole 320 can be provided. However, the scope of the present disclosure is not limited thereto, and may vary according to the thickness Ts of the support member 200, the intensity and time of the irradiated laser, etc. For example, the via hole 320 may be formed in a cylindrical shape or a conical shape.

[0071] Since the coil 300 includes the above-described configuration, a signal input to the first external electrode 610 may be output to the second external electrode 620 through the first lead-out portion 331, the first coil pattern 311, the via 320, the second coil pattern 312, and the second lead-out portion 332. With this structure, each component of the coil 300 may function as a single coil connected between the first external electrode 610 and the second external electrode 620.

[0072] At least one of the coil patterns 311 and 312 , the via 320 , and the lead-out portions 331 and 332 may include at least one conductive layer.

[0073] For example, when the first coil pattern 311, the via 320 and the first lead-out portion 331 are formed by plating on one surface of the support member 200, each of the first coil pattern 311, the via 320 and the first lead-out portion 331 may include a seed layer and an electroplating layer. The seed layer may be formed by an electroless plating method or a vapor deposition method (such as sputtering). Each of the seed layer and the electroplating layer may have a single-layer structure or a multi-layer structure. The multi-layer electroplating layer may be formed with a conformal film structure in which one electroplating layer is covered by another electroplating layer, and may also be formed into a shape in which another electroplating layer is laminated only on one surface of one electroplating layer. The seed layer of the first coil pattern 311, the seed layer of the via 320 and the seed layer of the first lead-out portion 331 may be formed as one body so that no boundary is formed between them, but the present disclosure is not limited thereto. The plating layer of the first coil pattern 311 , the plating layer of the via hole 320 , and the plating layer of the first lead-out portion 331 may be integrally formed such that no boundary is formed therebetween, but the present disclosure is not limited thereto.

[0074] Each of the coil patterns 311 and 312 , the via 320 , and the lead-out portions 331 and 332 may include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or alloys thereof, but is not limited thereto.

[0075] Reference Figures 1 to 4 The coil component 1000 according to the present embodiment may include an insulating wall 400 covering a side of the coil 300 and filling between turns of the coil 300 .

[0076] The insulating wall 400 may be used as a plating resist when the coil 300 is formed by electrolytic plating, and may be configured to remain without being removed even after the coil 300 is formed, thereby increasing the insulation between the coil 300 and the body 100 and preventing short circuits or current leakage between adjacent turns of the coil 300.

[0077] Reference Figure 3 , the insulating wall 400 of the present embodiment may be formed to include a plurality of layers, and the interface Iw may be formed between the respective layers of the insulating wall 400. In order to form the coil 300 having a high aspect ratio, the height Hw of the insulating wall 400 must also be formed high. In order to maintain stable arrangement and alignment of the insulating wall 400, it may be preferable to form the insulating wall 400 in multiple layers as in the present embodiment.

[0078] In this case, the height Hw of the insulating wall 400 is based on one surface or the other surface of the support member 200 in contact with the insulating wall 400. For example, the height Hw of the insulating wall 400 provided on one surface of the support member 200 may be a value obtained by measuring the distance from the one surface of the support member 200 to the end of the insulating wall 400 in the first direction T. In addition, the height Hw of the insulating wall 400 provided on the other surface of the support member 200 may be a value obtained by measuring the distance from the other surface of the support member 200 to the end of the insulating wall 400 in the first direction T.

[0079] For example, the height Hw of the insulating wall 400 may refer to: based on an optical microscope image or a scanning electron microscope (SEM) image of a first direction T-second direction L cross section taken from a central portion of the coil component 1000 in the third direction W, the arithmetic mean of at least three values ​​of respective dimensions of a plurality of line segments connecting two outermost boundary lines of the insulating wall 400 shown in the image that are opposite to each other in the first direction T and spaced apart from each other in the second direction L. In this case, the plurality of line segments may be spaced apart from each other at equal distances, but the scope of the present disclosure is not limited thereto.

[0080] In the case of the coil component 1000 of the present embodiment, the height Hw of the insulating wall 400 in the first direction T may be equal to or higher than the height Hf of the upper surface of the insulating film 500 in the first direction T. For example, the end of the insulating wall 400 may be coplanar with the insulating film 500 or may protrude beyond the insulating film 500 .

[0081] Reference Figure 3 , the line width LWw of the insulating wall 400 may be smallest at the interface Iw between the layers of the insulating wall 400. Therefore, the side surface of the coil 300 may include a protrusion P1 in a region adjacent to the interface Iw between the layers of the insulating wall 400.

[0082] On the other hand, the number of protrusions P1 formed on the side of each turn of the coil 300 may be less than the number of layers included in the insulating wall 400 .

[0083] In the coil component 1000 according to the present embodiment, the line width LWw of the insulating wall 400 filled between the turns of the coil 300 may be in the range of 3 μm to 8 μm.

[0084] [Table 1]

[0085] Table 1 above is a table showing whether a short circuit or current leakage defect occurs between adjacent turns of the coil 300 and the rate of change of the inductance capacity as the line width LWw of the insulating wall 400 of the coil component 1000 changes. The sample used in the experiment is a coil component 1000 with a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm. The number of turns of the coil 300 is 10.5 turns, and the line width LWw of the standard insulating wall 400 is set to 10 μm. Five samples are used in each experimental example, and if any short circuit or current leakage occurs, it is marked as "NG", and if no short circuit or current leakage occurs, it is marked as "OK". Regarding the rate of change of inductance capacity (Ls), the case where the increase is 3% or more compared to the standard capacity is set as an effective effect, and the arithmetic mean of the 5 samples is recorded.

[0086] Referring to Table 1, when the line width LWw of the insulating wall 400 is less than 3 μm, short circuit or current leakage occurs between adjacent turns of the coil 300. On the other hand, when the line width LWw of the insulating wall 400 exceeds 8 μm, the change rate of the inductance capacitance (Ls) relative to the reference capacitance is less than 3%.

[0087] Therefore, when the line width LWw of the insulating wall 400 filled between each turn of the coil 300 is formed to be greater than or equal to 3μm and less than or equal to 8μm, it can have an effective effect of increasing the inductance capacity (Ls) by 3% or more while preventing a short circuit or current leakage between adjacent turns of the coil 300.

[0088] Reference Figure 1 and Figure 2 The insulating wall 400 of this embodiment may be provided to contact at least one of the third surface 103 and the fourth surface 104 of the body 100. The insulating wall 400 may be provided to fill the area between the turns of the coil 300 and the area on the support member 200 where the coil 300 is not formed.

[0089] For example, the insulating wall 400 may be provided with a wide line width in a region centered on the support member 200 and opposite to the lead-out portions 331 and 332. In addition, the insulating wall 400 may also cover the inner surface of the innermost turn of the coil 300 and may also cover the outer surface of the outermost turn.

[0090] The insulating wall 400 may be a known resist film, and may be formed by stacking and curing resist films or by coating and curing resist films, but is not limited thereto.

[0091] As a method of stacking resist films, for example, a method can be used in which, after a hot press process of pressing at high temperature for a certain time and then reducing pressure and cooling to room temperature, the temperature is then lowered by a cold press process to separate working tools or the like.

[0092] As a method of applying the resist film, for example, a screen printing method of applying ink by extrusion, a spray printing method of applying ink by spraying, or the like can be used.

[0093] Thereafter, the insulating wall 400 may be formed by applying a photolithography method to the semi-cured resist film.

[0094] Reference Figures 2 to 4 The coil component 1000 according to the present embodiment may include an insulating film 500 disposed between the insulating walls 400 and covering the upper surface of the coil 300 .

[0095] The insulating film 500 is a component that insulates between the upper surface of the coil 300 and the body 100. Since the coil component 1000 according to this embodiment has a double insulating structure of the insulating wall 400 and the insulating film 500, the insulation reliability between the coil 300 and the body 100 can be improved.

[0096] Reference Figure 2 and Figure 3 , a height Hf of the insulating film 500 of the present embodiment based on one surface of the support member 200 may be formed to be equal to or lower than a height Hw of the insulating wall 400 .

[0097] In the coil component 1000 according to the present embodiment, the height Hf of the insulating film 500 is formed to be equal to or lower than the height Hw of the insulating wall 400, so that compared with the case where the insulating film 500 covers both the upper surface of the insulating wall 400 and the upper surface of the coil 300, the height of the insulating film 500 is formed lower, thereby ensuring more space for arranging magnetic materials within the main body 100, and increasing the effective volume, thereby improving the inductance characteristics.

[0098] In the coil component 1000 according to the present embodiment, the thickness Tf of the insulating film 500 in the first direction T may be in the range of 6 μm to 8 μm.

[0099] [Table 2]

[0100] Table 2 above shows whether the defect of the magnetic material of the main body 100 penetrating into the coil 300 and the rate of change of the effective volume occur as the thickness Tf of the insulating film 500 of the coil component 1000 changes. The sample used in the experiment has a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm. The number of turns of the coil 300 is 10.5 turns, and the thickness Tf of the standard insulating film 500 is set to 11 μm. Five samples are used in each experimental example, and if any penetration defect occurs, it is marked as "NG", and if no penetration defect occurs, it is marked as "OK". In the case of the effective volume change rate, the situation where the volume increases by 3% or more relative to the standard is set as an effective effect, and the arithmetic mean of the 5 samples is recorded.

[0101] Referring to Table 2, when the thickness Tf of the insulating film 500 is less than 6 μm, the defect of the magnetic material of the body 100 penetrating into the coil 300 occurs. On the other hand, when the thickness Tf of the insulating film 500 exceeds 8 μm, the change rate of the effective volume compared with the reference volume is less than 3%.

[0102] Therefore, when the thickness Tf of the insulating film 500 covering the upper surface of the coil 300 is formed to be 6 μm to 8 μm, a short circuit caused by the penetration of magnetic material between the upper surface of the coil 300 and the body 100 is prevented, and the effective volume of the coil component 1000 is increased by 3% or more.

[0103] The insulating film 500 may include a known insulating material such as polyparaxylene, may be formed by a method such as vapor deposition, but is not limited thereto, and may also be formed by stacking an insulating film on the upper surface of the coil 300 between the insulating walls 400 .

[0104] Reference Figure 1 and Figure 2, the external electrodes 610 and 620 may be disposed on the body 100 and connected to the coil 300. In detail, the first external electrode 610 may be disposed on the third surface 103 of the body 100 and contact-connected to the first lead-out portion 331, and the second external electrode 620 may be disposed on the fourth surface 104 of the body 100 and contact-connected to the second lead-out portion 332.

[0105] The first external electrode 610 may be disposed on the third surface 103 of the body 100 and extend to at least a portion of the first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the body 100. In addition, the second external electrode 620 may be disposed on the fourth surface 104 of the body 100 and extend to at least a portion of the first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the body 100.

[0106] When the coil component 1000 according to the present embodiment is mounted on a circuit board, the external electrodes 610 and 620 electrically connect the coil component 1000 to the circuit board, etc. For example, the first and second external electrodes 610 and 620 extending to the first surface 101 of the body 100 and spaced apart from each other may be electrically connected to a connection portion of the circuit board.

[0107] The external electrodes 610 and 620 may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), alloys thereof, etc., but the present disclosure is not limited thereto.

[0108] Each of the external electrodes 610 and 620 may be formed of a plurality of layers. For example, the first external electrode 610 may include a first layer in contact with the first lead-out portion 331 and a second layer disposed on the first layer. In this case, the first layer may be a conductive resin layer containing conductive particles (containing at least one of copper (Cu) and silver (Ag)) and an insulating resin, or may be a copper (Cu) plating layer. The second layer may have a double-layer structure of a nickel (Ni) plating layer / a tin (Sn) plating layer.

[0109] On the other hand, the coil component 1000 according to the present embodiment may further include an outer insulating layer covering the first surface 101 , the second surface 102 , the fifth surface 105 , and the sixth surface 106 of the body 100 excluding the areas where the external electrodes 610 and 620 are disposed.

[0110] For example, the outer insulating layer may be formed by coating and curing an insulating material including an insulating resin on the surface of the body 100. In this case, the insulating layer may include at least one of a thermoplastic resin (such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic resin), a thermosetting resin (such as phenol resin, epoxy resin, urethane resin, melamine resin, and alkyd resin), and a photosensitive insulating resin.

[0111] Modification of the First Embodiment Figure 5 The coil assembly 1000' relates to a first variation of the first embodiment and is Figure 4 The corresponding diagram.

[0112] Will Figure 5 and Figure 4 By comparison, the shape of the via hole 320 in the coil assembly 1000' of the present variation is similar to that of the coil assembly 1000' of the present variation. Figure 4 The shapes of the via holes 320 are different.

[0113] Therefore, when describing the coil component 1000' of the present modification, only the shape of the via hole 320 that is different from the first embodiment will be described. For the remaining configuration of the coil component 1000' of the present modification, the description in the first embodiment can be applied as it is.

[0114] Reference Figure 5 The via hole 320 of this modified example may have a circular shape based on the LW cross section, and may have a shape in which the diameter decreases from one surface to the other surface of the support member 200. For example, the cross-sectional area of ​​the via hole 320 in the LW cross section may be the smallest on the other surface of the support member 200, and the via hole 320 may have a tapered shape.

[0115] When processing the via hole in the support member 200 , the via hole 320 having the above-described features may be realized by irradiating laser on only one surface of the support member 200 .

[0116] On the other hand, in the case of a thin support member 200, through holes are easily formed even if laser is irradiated from only one surface, and therefore, it is preferable that the thickness Ts′ of the support member 200 of the present modified example is thinner than the thickness Ts of the support member 200 of the first embodiment.

[0117] The coil component 1000 ′ according to the present variation can reduce the risk of voids occurring within the via hole 320 when metal is formed in a narrow via hole during formation of the coil 300 by a plating process.

[0118] Figure 6 A coil assembly relating to a second variation of the first embodiment and Figure 3Schematic diagram of the A1 area corresponding to the A2 area.

[0119] Will Figure 6 and Figure 3 In comparison, the difference is that the end of the insulating wall 400 protrudes further than the upper surface Ef of the insulating film 500 in the present modified example.

[0120] Therefore, when describing the coil component of the present modification, only the insulating wall 400 and the insulating film 500 that are different from the first embodiment are described. For the remaining configuration of the coil component of the present modification, the description in the first embodiment can be applied as it is.

[0121] Reference Figure 6 In this modified example, the height Hf of the insulating film 500 based on one surface of the support member 200 may be formed to be lower than the height of the end of the insulating wall 400. For example, the upper surface Ef of the insulating film 500 may be formed between the insulating walls 400 and formed closer to the support member 200 than the end of the insulating wall 400.

[0122] In the case of this modification, the insulating film 500 is formed between the insulating walls 400 closer to the support member 200 than the ends of the insulating walls 400 to ensure a space for the magnetic material of the body 100, so as the effective volume is further increased, the inductance characteristics can be further improved.

[0123] Figure 7 A coil assembly relating to a third variation of the first embodiment and Figure 3 Schematic diagram of the A1 area corresponding to the A3 area.

[0124] Will Figure 7 and Figure 3 In comparison, the present modified example is different from the first embodiment in that the coil 300 includes a plurality of layers.

[0125] Therefore, when describing the coil component of the present modification, only the multilayer structure of the coil 300 which is different from the first embodiment will be described. For the remaining configurations of these embodiments, the description in the first embodiment can be applied as it is.

[0126] Reference Figure 7 In this modified example, the coil 300 includes a plurality of layers, and the interface 1c may be formed between the respective layers of the coil 300. For example, the interface 1c may be formed between the respective layers in the first coil pattern 311.

[0127] In addition, the line width at each turn of the coil 300 may be maximum at the interface Ic of the coil 300 .

[0128] Furthermore, the interface Ic of the coil 300 is located at the same level as the interface Iw of the insulating wall 400 so that they can be coplanar with each other.

[0129] The above-mentioned features of this modified example can be realized by, for example, firstly providing one layer of the insulating wall 400 having a multi-layer structure, and then providing one layer of the coil 300 also having a multi-layer structure, and repeating the process. However, the present disclosure is not limited thereto, and even if the coil 300 forming process is separated, the coil 300 can be integrally formed without forming an interface between the layers.

[0130] Figure 8 A coil component relating to a fourth variation of the first embodiment and Figure 3 A1 area corresponds to A4 area in the figure.

[0131] Will Figure 8 and Figure 3 In comparison, the insulating film 500 of the present modification is different in that the upper surface Ef has a concave shape.

[0132] Therefore, in describing the coil component of the present modification, only the shape of the upper surface Ef of the insulating film 500 that is different from the first embodiment will be described. For the remaining configurations of these embodiments, the description in the first embodiment can be applied as it is.

[0133] Reference Figure 8 In this modified example, the upper surface Uc of the coil 300 may have a concave shape toward the support member 200. For example, the upper surface Uc of the first coil pattern 311 may be formed to be concave in the first direction T.

[0134] In addition, the upper surface Ef of the insulating film 500 may be concave toward the support member 200 along the shape of the upper surface Uc of the coil 300. For example, the insulating film 500 may be conformally disposed along the shape of the upper surface Uc of the first coil pattern 311 and formed to be concave in the first direction T.

[0135] In the case of this variation, the insulating film 500 covers the ends of the insulating wall 400 and the area between adjacent insulating walls 400, so that the insulation between the coil 300 and the main body 100 can be improved, and by arranging the magnetic material of the main body 100 in the area formed as a concave shape on the upper surface Ef of the insulating film 500, the effective volume can be increased and the inductance characteristics can be improved.

[0136] Second embodiment and its variations Fig. 9 A coil assembly 2000 according to a second embodiment is shown and is Figure 2 The corresponding figure. Fig.10 yes Fig. 9 Magnified view of area B.

[0137] Compare Fig. 9 and Figure 2 as well as Fig.10 and Figure 3 In the coil component 2000 according to the present embodiment, the difference lies in that the insulating wall 400 has a three-layer structure, the upper surface Uc of the coil 300 has a concave shape, and two or more protrusions P1 and P2 are formed on the side of each turn of the coil 300.

[0138] Therefore, when describing this embodiment, only the three-layer structure of the insulating wall 400, the shape of the upper surface Uc of the coil 300, and the protrusions P1 and P2 formed on the side of each turn of the coil 300, which are different from the structure of the first embodiment, will be described, and for the remaining components of this embodiment, the description in the first embodiment can be applied as is.

[0139] Reference Fig. 9 and Fig.10 , the insulating wall 400 of this embodiment may be formed of three or more layers.

[0140] Since the insulating wall 400 is formed of three or more layers, the aspect ratio of the coil 300 disposed between the insulating walls 400 can become higher. As the number of turns increases within the limited size of the coil component 2000, the inductance can be increased, and as the surface area of ​​the coil 300 increases, Rdc can also be reduced.

[0141] Reference Fig.10 , the coil component 2000 of the present embodiment may have a concave shape in which the upper surface Uc of the coil 300 is concave toward the supporting member 200 .

[0142] On the other hand, the insulating film 500 of the present embodiment may be formed flatly at the same height as the end of the insulating wall 400. For example, the insulating film 500 is not formed conformally according to the shape of the upper surface Uc of the coil 300, but may be provided to fill the space between the insulating walls 400 on the upper surface Uc of the coil 300.

[0143] The coil component 2000 according to the present embodiment may improve insulation reliability between the body 100 and the coil 300 by thickly arranging the insulation film 500 in a region where insulation between the body 100 and the coil 300 is weak.

[0144] On the other hand, in the present embodiment, two or more protrusions P1 and P2 may be formed on the side of each turn of the coil 300. For example, since the insulating wall 400 has a three-layer structure, at least two protrusions P1 and P2 may be formed on the side of the coil 300 in an area adjacent to the interface between the layers of the insulating wall 400.

[0145] Fig.11 A coil assembly related to a modification of the second embodiment and Fig.10The B region corresponds to the B' region of the diagram.

[0146] Will Fig.11 and Fig.10 In comparison, the coil 300 of the present modification is different from the second embodiment in that it includes a plurality of layers.

[0147] Therefore, when describing the coil component of the present modification, only the multilayer structure of the coil 300 which is different from the second embodiment will be described. For the remaining configurations of these embodiments, the description in the second embodiment can be applied as it is.

[0148] Reference Fig.11 In this modified example, the coil 300 may be formed of three or more layers, and the interface 1c may be formed between the layers of the coil 300. For example, the interface 1c may be formed between the layers in the first coil pattern 311.

[0149] In addition, the line width at each turn of the coil 300 may be maximum at the interface Ic of the coil 300 .

[0150] Furthermore, the interface Ic of the coil 300 is located at the same height as the interface Iw of the insulating wall 400 so that they can be coplanar with each other.

[0151] The above-mentioned features of this modified example can be realized by, for example, firstly providing one layer of the insulating wall 400 having a three-layer structure, and then providing one layer of the coil 300 also having a three-layer structure, and repeating the process. However, the present disclosure is not limited thereto, and even if the coil 300 forming process is separated, the coil 300 can be formed integrally without forming an interface between the layers.

[0152] Process for manufacturing coil assembly Fig.12 is a schematic diagram showing the manufacturing Figure 4 1 is a diagram of a portion of a process of making a coil assembly 1000 shown in FIG.

[0153] Reference Fig.12 First, the support member 200 may be prepared, and the via holes VH may be processed at positions where the via holes 320 are to be arranged.

[0154] Next, after stacking the resist film in multiple layers, the resist film may be patterned by exposure and development to form the insulating wall 400 corresponding to the shape of the coil 300. In this case, the insulating wall 400 has two or more layers, and an interface may be formed between the respective layers.

[0155] Next, the coil 300 may be formed by electrolytic plating. For example, the first coil pattern 311 and the second coil pattern 312 may be disposed to fill the space between the insulating walls 400, and the via hole 320 may also be integrally formed.

[0156] Next, the insulating film 500 may be disposed on each of the upper surfaces of the first coil pattern 311 and the second coil pattern 312. In this case, the upper surface of the insulating film 500 may be formed not to protrude beyond the end of the insulating wall 400.

[0157] Fig.13 is a schematic diagram showing the manufacture of a Figure 7 FIG. 1 is a diagram showing a portion of a process for producing a coil assembly of a coil 300 having a stacked structure.

[0158] Reference Fig.13 First, the support member 200 may be prepared, and the via holes VH may be processed at positions where the via holes 320 are to be arranged.

[0159] Next, after the resist film is arranged in a single layer, the resist film may be patterned by exposure and development to form a first layer of the insulating wall 400 corresponding to the shape of the first layer of the coil 300 .

[0160] Next, the first layer of the coil 300 may be formed by electrolytic plating. For example, the first coil pattern 311 and the second coil pattern 312 may be provided to fill the space between the insulating walls 400, and the via 320 may also be integrally formed. In this case, the coil 300 may be formed at the same height as the end of the insulating wall 400 or at a lower height.

[0161] Next, a resist film may be disposed in a single layer on the first layer of each of the coil 300 and the insulating wall 400 , and then the resist film may be patterned by exposure and development to form a second layer of the insulating wall 400 corresponding to the shape of the second layer of the coil 300 .

[0162] Next, the second layer of the coil 300 may be formed by electrolytic plating. For example, the second layer of each of the first coil pattern 311 and the second coil pattern 312 may be provided to fill the space between the second layers of the insulating wall 400. An interface may be formed between the first and second layers of the coil 300.

[0163] Next, the insulating film 500 may be disposed on each of the upper surfaces of the first coil pattern 311 and the second coil pattern 312. In this case, the upper surface of the insulating film 500 may be formed not to protrude beyond the end of the insulating wall 400.

[0164] As described above, according to the embodiment, a coil having a high aspect ratio can be easily formed through an insulating wall, and current leakage between adjacent turns can be prevented.

[0165] According to the embodiment, the inductance characteristic of the coil component may be improved by securing a space in the body where a magnetic material may be disposed.

[0166] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: main body; a support member disposed in the body and having a first surface and a second surface opposite to each other in a first direction; a coil disposed on at least one of the first surface and the second surface of the support member and protruding from the corresponding surface of the support member in the first direction, the coil having a plurality of turns and including a lower surface in contact with the corresponding surface of the support member and an upper surface opposite to the lower surface; an insulating wall filling gaps between adjacent turns of the coil; an insulating film, disposed between adjacent insulating walls and covering the upper surface of the coil; as well as an external electrode disposed on the body and connected to the coil, The insulating wall includes a plurality of layers, and interfaces are provided between the plurality of layers. A height of the insulating wall from the corresponding surface of the support member in the first direction is greater than or equal to a height of an upper surface of the insulating film from the corresponding surface of the support member in the first direction.

2. The coil assembly according to claim 1, wherein: A line width of the insulating wall is smallest at an interface between adjacent layers of the plurality of layers of the insulating wall.

3. The coil assembly according to claim 1, wherein: The insulating wall includes three or more layers.

4. The coil assembly according to claim 1, wherein: A line width of the insulating wall filled between the adjacent turns of the coil is in the range of 3 μm to 8 μm.

5. The coil assembly according to claim 1, wherein: The thickness of the insulating film in the first direction is in a range of 6 μm to 8 μm.

6. The coil assembly according to claim 1, wherein: The coil further includes a side surface connecting the lower surface of the coil and the upper surface of the coil, and the side surface of the coil includes at least one protrusion protruding toward the interface of the insulating wall.

7. The coil assembly according to claim 6, wherein: The line width at each turn of the coil is greatest in a region adjacent to the protrusion.

8. The coil assembly according to claim 1, wherein: The upper surface of the coil is recessed toward the supporting member.

9. The coil assembly according to claim 8, wherein: The upper surface of the insulating film is recessed toward the supporting member along a shape of the upper surface of the coil.

10. The coil assembly according to claim 1, wherein: The coil includes a plurality of layers, and adjacent layers of the plurality of layers of the coil have interfaces therebetween.

11. The coil assembly according to claim 10, wherein: The line width of the coil is largest at the interface of the coil.

12. The coil assembly according to claim 10, wherein: The coil is formed of three or more layers.

13. The coil assembly according to claim 10, wherein: The interface of the insulating wall and the interface of the coil are coplanar with each other.

14. The coil assembly according to claim 1, wherein: The thickness of the supporting member in the first direction is less than or equal to 50 μm.

15. The coil assembly according to claim 1, wherein: The body further includes a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and The coil includes a first coil pattern arranged on the first surface of the support member, a first lead-out portion extending from an outer end of the first coil pattern to the third surface, a second coil pattern arranged on the second surface of the support member, a second lead-out portion extending from an outer end of the second coil pattern to the fourth surface, and a via connecting the first coil pattern and the second coil pattern.

16. The coil assembly according to claim 15, wherein: The insulating wall is in contact with at least one of the third surface and the fourth surface.

17. The coil assembly according to claim 15, wherein: In a cross section of the coil component perpendicular to the second direction and passing through the via hole, a cross-sectional area of ​​the via hole is smallest at the second surface of the support member.

18. The coil assembly according to claim 15, wherein: In a cross section of the coil component perpendicular to the second direction and passing through the via hole, a cross-sectional area of ​​the via hole is smallest at an inner side of the support member.

19. A coil assembly, comprising: main body; A supporting member, disposed in the main body; a coil disposed on the support member, having a plurality of turns, and including a lower surface in contact with the support member and an upper surface opposite to the lower surface in a first direction; An insulating wall is provided between each turn of the coil; an insulating film disposed between the insulating walls and interposed between the upper surface of the coil and the body; as well as an external electrode disposed on the body and connected to the coil, The insulating wall comprises a plurality of layers, and an interface is provided between the plurality of layers, and the line width of the insulating wall is the smallest at the interface, and The upper surface of the coil has a concave shape toward the supporting member.

20. The coil assembly of claim 19, wherein: The line width of the insulating wall provided between the turns of the coil is in the range of 3 μm to 8 μm, the thickness of the insulating film in the first direction is in the range of 6 μm to 8 μm, and the thickness of the supporting member in the first direction is less than or equal to 50 μm.

21. A coil assembly, comprising: Supporting members; a coil disposed on a surface of the support member, the coil having a lower surface contacting the surface of the support member and an upper surface opposite to the lower surface in a first direction, and the coil including a plurality of turns with gaps therebetween; an insulating wall disposed in the gap between the plurality of turns and comprising a plurality of layers, wherein interfaces are provided between the plurality of layers, and a line width of the insulating wall is minimum at the interface; an insulating film disposed on the upper surface of the coil, The distance between the upper surface of the insulating film and the surface of the supporting member is less than or equal to the distance between the upper surface of the insulating wall and the surface of the supporting member.

22. The coil component of claim 21, further comprising a main body, wherein the support member and the coil are embedded in the main body, wherein: The insulating film electrically insulates the coil from the body.

23. The coil assembly of claim 21, wherein: A width of at least one of the turns of the coil is greatest at an interface between the layers adjacent to the insulating wall.

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