Electronic chip packaging device

Abstract

The invention relates to the technical field of chip packaging, and discloses an electronic chip packaging device which comprises a workbench, the top of the workbench is provided with control equipment, the control equipment is connected with a support, the bottom of the support is provided with a pair of installation shells, the installation shells are internally provided with extrusion equipment used for extruding glue, and the extrusion equipment is connected with the support. And an extrusion pipe is arranged at the bottom of the extrusion equipment and extends out of the mounting shell. Pressure can be applied to the glue at the junction of the ends of the second layer of glue and the first layer of glue in the cofferdam glue laying process, so that pressure is generated on the glue to enable the glue to move downwards, the leakproofness of the junction of the ends of the second layer of glue and the first layer of glue can be improved, and the glue can be supported by the conveying belt in the pressure applying process; the glue can be prevented from collapsing towards one side, and due to the fact that the conveying belt is cleaned in advance, the situation that the glue of the cofferdam is polluted by dust on the conveying belt is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of chip packaging, and in particular relates to an electronic chip packaging device. Background Art

[0002] Chip packaging is the shell used to install semiconductor integrated circuit chips. It has the functions of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. Chip packaging is a bridge between the internal world of the chip and the external circuit. The contacts of the chip are connected to the pins of the package shell with wires, and the pins are connected to other devices through wires on the printed circuit board. Packaging plays an important role in CPU and other LSI integrated circuits. The number of pins increases, the pin spacing decreases, the weight decreases, the reliability increases, and the use is more convenient.

[0003] The cofferdam packaging method, one of the chip packaging methods, refers to building a cofferdam outside the chip with cofferdam glue, and then injecting packaging glue into the cofferdam to encapsulate the chip. However, in actual operation, the first layer of cofferdam glue will be laid on the path at the beginning. When the second layer is about to be laid, the glue will combine with the end of the first layer to form a stack and then form the second layer. However, due to the stacking, the glue will extend downward at the junction of the end of the first layer of glue and the second layer of glue. However, since the first layer of glue hardens before the second layer of glue, the end of the first layer of glue will support the second layer of glue, which will cause the second layer of glue to spread and fail to completely seal the gap at the junction with the first layer of glue. Therefore, the cofferdam is prone to not being completely sealed. When the sealing glue is injected later, the sealing glue is prone to leakage, causing the part outside the cofferdam to flow, affecting the circuit board around the chip. Summary of the invention

[0004] In view of the above problems, the present invention provides an electronic chip packaging device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An electronic chip packaging device comprises a workbench, wherein a manipulation device is provided on the top of the workbench, a bracket is connected to the manipulation device, a pair of mounting shells are provided at the bottom of the bracket, an extrusion device for extruding glue is provided inside the mounting shells, an extrusion tube is provided at the bottom of the extrusion device, the extrusion tube extends to the outside of the mounting shells, a rectangular tube is fixedly connected to the bottom of one of the mounting shells, an air injection machine is fixedly installed on the outside of the bracket, a heating box is connected to the output end of the air injection machine, the heating box is fixed outside the bracket, an electric heating network is provided inside the heating box, the bottom of the heating box is connected to the rectangular tube through a conduit, and an anti-collapse component is provided outside the mounting shell for preventing the glue squeezed out of the extrusion tube from collapsing to one side.

[0007] Furthermore, the anti-collapse component includes connecting plates symmetrically arranged on both sides of one of the mounting shells, a conveyor belt is provided at the bottom of the connecting plate, and the conveyor belt is a steel conveyor belt. A heating plate is fixedly installed at the bottom of the connecting plate, and the heating plate is located inside the conveyor belt. Inclined surfaces are provided at the lower parts of both sides of the mounting shell, and a pulling component for driving the connecting plate to slide along the inclined surface is provided on the outside of the mounting shell. Guide rollers for supporting the conveyor belt are symmetrically rotatably installed on the bottom of the connecting plate, a cleaning component for cleaning the conveyor belt is provided on the outside of the conveyor belt, and a rotating component for driving the guide roller to rotate is provided on the outside of the guide roller.

[0008] Furthermore, the cleaning assembly includes a pipe fixedly installed on the outside of the connecting plate, a collecting port is opened on the side of the pipe close to the conveyor belt, a dust collection device is fixedly installed on the outside of the bracket, and the output end of the dust collection device is connected to the corresponding pipe through a hose.

[0009] Furthermore, the rotating assembly includes a first bevel gear fixedly mounted on the top of one of the two adjacent guide rollers, the first bevel gear is located above the connecting plate, and a second bevel gear that cooperates with the first bevel gear is rotatably mounted on the top of the connecting plate through a side plate, a hard rubber wheel is provided on the outer fixed sleeve of the second bevel gear, and a friction assembly for driving the hard rubber wheel to rotate is provided on the outside of the mounting shell.

[0010] Furthermore, the friction assembly includes an inclined plate arranged above the second bevel gear, the inclined plate is made of hard rubber, the inclined plate is arranged parallel to the inclined surface of the mounting shell, an inclined guide surface is provided at one end of the inclined plate close to the second bevel gear, and a clamping assembly is provided on the outer side of the inclined plate for clamping it to the hard rubber wheel.

[0011] Furthermore, the clamping assembly includes a fixed plate fixedly mounted on the outside of the mounting shell, a pair of sliding rods are slidably inserted on the outside of the fixed plate, the cross-section of the sliding rod is T-shaped, one end of the sliding rod is fixedly connected to the inclined plate, and a first spring is sleeved on the outside of the sliding rod and located between the inclined plate and the fixed plate. When the connecting plate is at the bottom, the hard rubber wheel does not contact the inclined plate.

[0012] Furthermore, the pulling assembly includes a fixed skateboard fixedly connected to the top of the connecting plate, an oblique groove is opened on the inclined surface of the mounting shell, the skateboard is slidably arranged in the oblique groove, a limit rod is fixedly installed in the oblique groove, the skateboard sliding sleeve is arranged outside the limit rod, and a second spring is arranged outside the limit rod, a motor corresponding to the skateboard is fixedly installed on the outside of the mounting shell, a take-up wheel is fixedly installed on the output shaft of the motor, and the take-up wheel is fixedly connected to the skateboard through a pull wire.

[0013] Furthermore, the center lines of the rectangular tube and the extruded tube are on the same horizontal line.

[0014] Technical effects and advantages of the present invention:

[0015] 1. The present invention can realize the application of pressure on the glue at the junction of the second layer of glue and the end of the first layer of glue during the laying process of the cofferdam glue, so that the glue is pressed to move downward, so that the airtightness of the junction between the second layer of glue and the end of the first layer of glue can be improved;

[0016] 2. The present invention can rely on the support of the conveyor belt to the glue during the pressure application process, so that the glue can be prevented from collapsing to one side, and because the conveyor belt is cleaned in advance, the dust on the conveyor belt will not contaminate the glue on the cofferdam. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic structural diagram of an electronic chip packaging device according to an embodiment of the present invention is shown;

[0018] Figure 2 A schematic diagram showing the structure of a bracket according to an embodiment of the present invention is shown;

[0019] Figure 3 The embodiment of the present invention is shown Figure 2 The enlarged structural diagram at A in the middle;

[0020] Figure 4 The structure of the installation shell of the embodiment of the present invention is shown in FIG. Figure 1 ;

[0021] Figure 5 The embodiment of the present invention is shown Figure 4 The enlarged structural diagram at B in the middle;

[0022] Figure 6 A schematic diagram showing the structure of the inclined plate according to an embodiment of the present invention is shown;

[0023] Figure 7 The structure of the installation shell of the embodiment of the present invention is shown in FIG. Figure 2 ;

[0024] In the figure: 1. workbench; 2. bracket; 3. mounting shell; 4. extrusion tube; 5. rectangular tube; 6. conduit; 7. heating box; 8. gas injection machine; 9. connecting plate; 10. conveyor belt; 11. heating plate; 12. slide plate; 13. limit rod; 14. second spring; 15. motor; 16. take-up wheel; 17. pull wire; 18. guide roller; 19. pipeline; 20. dust collection equipment; 21. first bevel gear; 22. second bevel gear; 23. inclined plate; 24. inclined guide surface; 25. fixed plate; 26. slide rod; 27. first spring. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0026] The present invention provides an electronic chip packaging device, such as Figures 1 to 7 As shown, it includes a workbench 1, a manipulation device is provided on the top of the workbench 1, and a bracket 2 is connected to the manipulation device. The manipulation device is a manipulation device on the chip cofferdam packaging device in the prior art, which is used to move the device for extruding glue along a specified path. A pair of mounting shells 3 are provided at the bottom of the bracket 2, and an extrusion device for extruding glue is provided inside the mounting shell 3. The extrusion device is an extrusion device for extruding cofferdam glue on the chip cofferdam packaging device in the prior art. An extrusion tube 4 is provided at the bottom of the extrusion device, and the extrusion tube 4 extends to the outside of the mounting shell 3. A rectangular tube 5 is fixedly connected to the bottom of one of the mounting shells 3, and a gas injection machine 8 is fixedly installed on the outside of the bracket 2. The output end of the gas injection machine 8 is connected to a heating box 7, which is fixed outside the bracket 2. An electric heating network is provided inside the heating box 7, and the bottom of the heating box 7 is connected to the rectangular tube 5 through a conduit 6. The outside of the mounting shell 3 is provided with an anti-collapse component for preventing the glue extruded by the extrusion tube 4 from collapsing to one side.

[0027] When in use, the cofferdam glue is extruded through the extrusion device in cooperation with the extrusion tube 4, and the extrusion tube 4 is moved along the specified path in cooperation with the operating device, so that the extruded cofferdam glue forms a cofferdam outside the chip, and then another extrusion device and the extrusion tube 4 are cooperated to inject sealing glue into the cofferdam, so that the sealing glue cooperates with the cofferdam glue to encapsulate the chip. With the movement of the extrusion tube 4 that extrude the cofferdam glue, the first layer of cofferdam glue will be laid on the path at first. When the second layer is about to be laid, the glue will be stacked when combined with the end of the first layer and then form the second layer. However, due to the stacking, the glue will extend downward at the junction of the end of the first layer of glue and the second layer of glue. However, since the first layer of glue hardens before the second layer of glue, the end of the first layer of glue will support the second layer of glue, which will cause the second layer of glue to spread. The delay cannot completely seal the gap at the junction with the first layer of glue, so the cofferdam is prone to not being completely sealed. When the sealing glue is injected later, the sealing glue is prone to leakage, causing it to flow outside the cofferdam and affect the circuit board around the chip. Therefore, the electric heating network is turned on in advance. When the second layer of glue is about to be squeezed out to the end position of the first layer of glue, the air injection machine 8 is started to blow air. The air is heated by the electric heating network and enters the conduit 6, and then enters the rectangular tube 5 to blow air to the glue. When the glue is squeezed out to the end of the first layer of glue, the glue is squeezed downward by the airflow, which generates pressure on the glue to make it move downward, thereby improving the airtightness of the junction between the second layer of glue and the end of the first layer of glue. The anti-collapse component can prevent the glue from collapsing to one side due to the influence of the airflow, so that the cofferdam can be formed smoothly.

[0028] like Figures 3 to 7 As shown, the anti-collapse component includes a connecting plate 9 symmetrically arranged on both sides of one of the mounting shells 3, a conveyor belt 10 is provided at the bottom of the connecting plate 9, and the conveyor belt 10 is a steel conveyor belt. A heating plate 11 is fixedly installed at the bottom of the connecting plate 9, and the heating plate 11 is an electric heating plate in the prior art. The heating plate 11 is located inside the conveyor belt 10, and inclined surfaces are provided at the lower parts of both sides of the mounting shell 3. A pulling component for driving the connecting plate 9 to slide along the inclined surface is provided on the outside of the mounting shell 3. A guide roller 18 for supporting the conveyor belt 10 is symmetrically rotatably installed at the bottom of the connecting plate 9, a cleaning component for cleaning the conveyor belt 10 is provided on the outside of the conveyor belt 10, and a rotating component for driving the guide roller 18 to rotate is provided on the outside of the guide roller 18.

[0029] As the airflow exerts pressure on the glue, the glue tends to collapse to one side when moving downward. When laying the first layer, turn on the heating plate 11 in advance to heat the conveyor belt 10 so that the temperature of the conveyor belt 10 is consistent with the temperature of the cofferdam glue. The connecting plate 9 is driven by the pulling component to move the conveyor belt 10 along the inclined surface, so that the two conveyor belts 10 are separated and rise, so that when the glue is laid at the corner, the conveyor belt 10 will not contact the cofferdam glue at the corner. As the conveyor belt 10 rises, the rotating component drives the guide roller 18 to rotate, thereby rotating the conveyor belt 10, and cooperates with the cleaning component to clean the fine dust on the surface of the conveyor belt 10. When the glue is laid to the end of the first layer of glue and before the second layer is laid, the connecting plate 9 is lowered to reset it, so that the conveyor belt 10 is reset and located on both sides of the cofferdam glue. Then the airflow squeezes the second layer of glue and the first layer of glue. When the water end position is reached, the conveyor belt 10 can support the glue to prevent the glue from collapsing to one side. Since the temperature of the conveyor belt 10 is consistent with that of the glue, when the glue contacts the conveyor belt 10, there will be no adhesion. Moreover, since the conveyor belt 10 can rotate, the glue is less likely to adhere to the conveyor belt 10. Moreover, since the conveyor belt 10 is cleaned in advance, dust on the conveyor belt 10 will not contaminate the cofferdam glue. After the pressure on the junction of the second layer of glue and the first layer of glue is applied, the pulling assembly drives the connecting plate 9 to rise, so that the two conveyor belts 10 are separated to avoid subsequent collisions at the corners of the cofferdam glue and the corners of the cofferdam glue. Subsequently, whenever the glue moves to the position of the end of the first layer of glue, the above operation will be repeated to apply pressure to the glue, so as to further improve the airtightness of the junction of the second layer of glue and the first layer of glue.

[0030] like Figures 2 to 3 As shown, the cleaning component includes a pipe 19 fixedly installed on the outside of the connecting plate 9, a collecting port is opened on the side of the pipe 19 close to the conveyor belt 10, a dust collection device 20 is fixedly installed on the outside of the bracket 2, and the output end of the dust collection device 20 is connected to the corresponding pipe 19 through a hose, and the dust collection device 20 is a miniature vacuum cleaner.

[0031] The dust collecting device 20 is started to cooperate with the hose to extract the air in the pipe 19, thereby generating suction at the collection port, so that the dust on the surface of the conveyor belt 10 rotating through the collection port is extracted and collected, so as to clean the conveyor belt 10.

[0032] like Figures 4 to 5 As shown, the rotating assembly includes a first bevel gear 21 fixedly mounted on the top of one of the two adjacent guide rollers 18, the first bevel gear 21 is located above the connecting plate 9, and a second bevel gear 22 that cooperates with the first bevel gear 21 is rotatably mounted on the top of the connecting plate 9 through a side plate, a hard rubber wheel is provided on the outer fixed sleeve of the second bevel gear 22, and a friction assembly for driving the hard rubber wheel to rotate is provided on the outside of the mounting shell 3.

[0033] When the connecting plate 9 rises obliquely upward, it moves with the guide roller 18, the first bevel gear 21, the side plate, the second bevel gear 22, and the hard rubber wheel. When the hard rubber wheel contacts the inclined plate 23, the hard rubber wheel rotates with the movement due to friction, and rotates with the second bevel gear 22, and then cooperates with the first bevel gear 21 to rotate with the guide roller 18, so that the conveyor belt 10 is driven to rotate.

[0034] like Figure 5 As shown, the friction assembly includes an inclined plate 23 arranged above the second bevel gear 22. The inclined plate 23 is made of hard rubber. The inclined plate 23 is arranged parallel to the inclined surface of the mounting shell 3. An inclined guide surface 24 is provided at one end of the inclined plate 23 close to the second bevel gear 22. A clamping assembly for clamping the inclined plate 23 with the hard rubber wheel is provided on the outer side of the inclined plate 23.

[0035] The hard rubber wheel contacts the inclined guide surface 24 to squeeze the inclined plate 23, and the squeezing component provides a reaction force, so that the inclined plate 23 and the hard rubber wheel are in close contact to avoid slipping, ensuring that the hard rubber wheel can rotate by friction when moving along the inclined plate 23, thereby ensuring the rotation of the conveyor belt 10.

[0036] like Figure 5 As shown, the clamping assembly includes a fixed plate 25 fixedly mounted on the outside of the mounting shell 3, a pair of slide rods 26 are slidably inserted on the outside of the fixed plate 25, the cross-section of the slide rod 26 is T-shaped, one end of the slide rod 26 is fixedly connected to the inclined plate 23, and a first spring 27 is sleeved on the outside of the slide rod 26 and located between the inclined plate 23 and the fixed plate 25. When the connecting plate 9 is at the bottom, the hard rubber wheel does not contact the inclined plate 23.

[0037] When the connecting plate 9 moves obliquely upward, the hard rubber wheel cooperates with the oblique guide surface 24 to squeeze the inclined plate 23, and the inclined plate 23 moves with the slide bar 26 to compress the first spring 27. The first spring 27 provides a reaction force, so that the inclined plate 23 can be in close contact with the hard rubber wheel.

[0038] like Figure 3 As shown, the pulling assembly includes a fixed skateboard 12 fixedly connected to the top of the connecting plate 9, an oblique groove is opened on the inclined surface of the mounting shell 3, the skateboard 12 is slidably arranged in the oblique groove, a limiting rod 13 is fixedly installed in the oblique groove, the skateboard 12 is slidably sleeved outside the limiting rod 13, and a second spring 14 is arranged outside the limiting rod 13, and a motor 15 corresponding to the skateboard 12 is fixedly installed on the outside of the mounting shell 3, and a take-up wheel 16 is fixedly installed on the output shaft of the motor 15, and the take-up wheel 16 is fixedly connected to the skateboard 12 through a pull wire 17.

[0039] Starting the motor 15 makes its output shaft rotate forward, which drives the take-up wheel 16 to rotate, so that the take-up wire 17 is wound up, and then the slide plate 12 and the connecting plate 9 are pulled up. As the connecting plate 9 rises, the second spring 14 is compressed to deform it. Starting the motor 15 makes its output shaft reverse, and the second spring 14 releases its force to drive the slide plate 12 and the connecting plate 9 down.

[0040] like Figure 4 As shown, the center line of the rectangular tube 5 and the extruded tube 4 are on the same horizontal line.

[0041] After the glue is squeezed out, the airflow blown out of the rectangular tube 5 can pressurize the glue, and the temperature of the airflow blown out of the rectangular tube 5 is consistent with the temperature of the glue in the cofferdam.

[0042] Working principle: When in use, the cofferdam glue is extruded through the extrusion device in cooperation with the extrusion tube 4, and the extrusion tube 4 is moved along the specified path in cooperation with the operating device, so that the extruded cofferdam glue forms a cofferdam outside the chip, and then another extrusion device and the extrusion tube 4 are cooperated to inject sealing glue into the cofferdam, so that the sealing glue and the cofferdam glue encapsulate the chip. With the movement of the extrusion tube 4 that extrude the cofferdam glue, the first layer of cofferdam glue will be laid on the path at first. When the second layer is about to be laid, the glue will be stacked when combined with the end of the first layer, and then the second layer will be formed. However, due to the generation of stacking, the glue will extend downward at the junction of the end of the first layer of glue and the second layer of glue. However, since the first layer of glue hardens before the second layer of glue, the end of the first layer of glue will be against The second layer of glue is used for support, which will result in the second layer of glue not being able to completely seal the gap at the junction with the first layer of glue when it spreads. Therefore, the cofferdam is prone to not being completely sealed. When the sealing glue is subsequently injected, the sealing glue is prone to leakage, causing it to flow to the outside of the cofferdam and affect the circuit board around the chip. Therefore, the electric heating network is turned on in advance. When the second layer of glue is about to be squeezed out to the end position of the first layer of glue, the air injection machine 8 is started to blow air. The air is heated by the electric heating network and enters the conduit 6, and then enters the rectangular tube 5 to blow air to the glue. When the glue is squeezed out to the end of the first layer of glue, the glue is squeezed downward by the airflow, which generates pressure on the glue to make it move downward, so that the airtightness of the junction between the second layer of glue and the end of the first layer of glue can be improved.

[0043] As the airflow exerts pressure on the glue, the glue tends to collapse to one side when it moves downward. When laying the first layer, the heating plate 11 is turned on in advance to heat the conveyor belt 10 so that the temperature of the conveyor belt 10 is consistent with the temperature of the cofferdam glue. The connecting plate 9 is driven by the pulling component to move the conveyor belt 10 along the inclined surface, so that the two conveyor belts 10 are separated and rise. When the glue is laid at the corner, the conveyor belt 10 will not contact the cofferdam glue at the corner. As the conveyor belt 10 rises, the connecting plate 9 rises obliquely upward, carrying the guide roller 18, the first bevel gear 21, the side plate, the second bevel gear 22, and the hard rubber wheel with it. When the hard rubber wheel and the inclined plate 23 is in conflict with each other. With the movement, the hard rubber wheel rotates by relying on friction, driving the second bevel gear 22 to rotate, and then cooperating with the first bevel gear 21 to rotate the guide roller 18, so that the driving conveyor belt 10 rotates. The hard rubber wheel cooperates with the inclined guide surface 24 to squeeze the inclined plate 23. The inclined plate 23 moves with the slide bar 26 to compress the first spring 27. The first spring 27 provides a reaction force, so that the inclined plate 23 can be in close contact with the hard rubber wheel to avoid slipping, thereby ensuring the rotation of the conveyor belt 10. The dust collection device 20 is started to cooperate with the hose to extract the air in the pipe 19, so that suction is generated at the collection port, so that the rotating passing The dust on the surface of the conveyor belt 10 at the collection port is extracted and collected to clean the conveyor belt 10. The conveyor belt 10 is raised so that it will not contact the glue of the cofferdam at the corner. When the glue is laid to the end of the first layer of glue and before the second layer is laid, the connecting plate 9 is lowered by pulling the assembly to reset it, so that the conveyor belt 10 is reset to both sides of the cofferdam glue. Then, when the airflow squeezes the second layer of glue and the end of the first layer of glue, the conveyor belt 10 can support the glue to prevent the glue from collapsing to one side. Since the temperature of the conveyor belt 10 is consistent with that of the glue, when the glue contacts the conveyor belt 10, it will not stick. , and because the conveyor belt 10 can rotate, the glue is less likely to stick to the conveyor belt 10, and because the conveyor belt 10 is cleaned in advance, the dust on the conveyor belt 10 will not contaminate the cofferdam glue. After the pressure on the junction of the second layer of glue and the first layer of glue is completed, the pulling component drives the connecting plate 9 to rise, so that the two conveyor belts 10 are separated, avoiding subsequent collisions at the corners of the cofferdam glue and the corners of the conveyor belt 10 and the cofferdam glue. Whenever the glue moves to the position of the end of the first layer of glue, the above operation will be repeated to apply pressure to the glue, so as to further improve the airtightness of the junction of the second layer of glue and the first layer of glue.

[0044] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. An electronic chip packaging device, comprising a workbench (1), characterized in that: The top of the workbench (1) is provided with a manipulation device, the manipulation device is connected to a bracket (2), a pair of mounting shells (3) are provided at the bottom of the bracket (2), an extrusion device for extruding glue is provided inside the mounting shell (3), an extrusion tube (4) is provided at the bottom of the extrusion device, the extrusion tube (4) extends to the outside of the mounting shell (3), a rectangular tube (5) is fixedly connected to the bottom of one of the mounting shells (3), an air injection machine (8) is fixedly installed on the outside of the bracket (2), the output end of the air injection machine (8) is connected to a heating box (7), the heating box (7) is fixed outside the bracket (2), an electric heating network is provided inside the heating box (7), the bottom of the heating box (7) is connected to the rectangular tube (5) through a conduit (6), and an anti-collapse component is provided on the outside of the mounting shell (3) for preventing the glue extruded by the extrusion tube (4) from collapsing to one side.

2. The electronic chip packaging device according to claim 1, characterized in that: The anti-collapse component comprises a connecting plate (9) symmetrically arranged on both sides of one of the mounting shells (3); a conveyor belt (10) is provided at the bottom of the connecting plate (9); the conveyor belt (10) is a steel conveyor belt; a heating plate (11) is fixedly installed at the bottom of the connecting plate (9); the heating plate (11) is located inside the conveyor belt (10); inclined surfaces are provided at the lower parts of both sides of the mounting shell (3); a pulling component for driving the connecting plate (9) to slide along the inclined surface is provided on the outside of the mounting shell (3); a guide roller (18) for supporting the conveyor belt (10) is symmetrically rotatably installed at the bottom of the connecting plate (9); a cleaning component for cleaning the conveyor belt (10) is provided on the outside of the conveyor belt (10); and a rotating component for driving the guide roller (18) to rotate is provided on the outside of the guide roller (18).

3. The electronic chip packaging device according to claim 2, characterized in that: The cleaning assembly comprises a pipe (19) fixedly mounted on the outside of the connecting plate (9), a collecting port being provided on a side of the pipe (19) close to the conveyor belt (10), a dust collecting device (20) being fixedly mounted on the outside of the bracket (2), and an output end of the dust collecting device (20) being connected to the corresponding pipe (19) via a hose.

4. The electronic chip packaging device according to claim 3, characterized in that: The rotating assembly comprises a first bevel gear (21) fixedly mounted on the top of one of the two adjacent guide rollers (18), the first bevel gear (21) being located above the connecting plate (9), a second bevel gear (22) cooperating with the first bevel gear (21) being rotatably mounted on the top of the connecting plate (9) via a side plate, a hard rubber wheel being provided on the outer fixed sleeve of the second bevel gear (22), and a friction assembly for driving the hard rubber wheel to rotate being provided on the outside of the mounting shell (3).

5. The electronic chip packaging device according to claim 4, characterized in that: The friction assembly comprises an inclined plate (23) arranged above the second bevel gear (22); the inclined plate (23) is made of hard rubber; the inclined plate (23) is arranged parallel to the inclined surface of the mounting shell (3); an inclined guide surface (24) is arranged at one end of the inclined plate (23) close to the second bevel gear (22); and a clamping assembly for clamping the inclined plate (23) with the hard rubber wheel is arranged on the outer side of the inclined plate (23).

6. The electronic chip packaging device according to claim 5, characterized in that: The clamping assembly comprises a fixing plate (25) fixedly mounted on the outside of the mounting shell (3); a pair of slide bars (26) are slidably inserted on the outside of the fixing plate (25); the cross section of the slide bar (26) is T-shaped; one end of the slide bar (26) is fixedly connected to the inclined plate (23); a first spring (27) is sleeved on the outside of the slide bar (26) and located between the inclined plate (23) and the fixing plate (25); when the connecting plate (9) is located at the bottom, the hard rubber wheel does not contact the inclined plate (23).

7. The electronic chip packaging device according to claim 6, characterized in that: The pulling assembly comprises a fixed slide plate (12) fixedly connected to the top of the connecting plate (9); an inclined groove is provided on the inclined surface of the mounting shell (3); the slide plate (12) is slidably arranged in the inclined groove; a limit rod (13) is fixedly installed in the inclined groove; the slide plate (12) is slidably sleeved outside the limit rod (13); a second spring (14) is provided on the outer sleeve of the limit rod (13); a motor (15) corresponding to the slide plate (12) is fixedly installed on the outside of the mounting shell (3); a take-up wheel (16) is fixedly installed on the output shaft of the motor (15); and the take-up wheel (16) is fixedly connected to the slide plate (12) via a pull wire (17).

8. The electronic chip packaging device according to claim 7, characterized in that: The center lines of the rectangular tube (5) and the extruded tube (4) are on the same horizontal line.

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