Semiconductor wet etching device

Abstract

The invention discloses a semiconductor wet etching device, and particularly relates to the technical field of semiconductor manufacturing, the semiconductor wet etching device comprises a wafer, an etching pool and a clamping piece, the clamping piece is used for positioning and soaking the wafer in the etching pool, a placing rack is fixed on one side of the wafer, and the placing rack is used for taking and placing the clamping piece in the etching pool; the swinging assembly is used for carrying away the temperature generated by the reaction of the wafer in the corrosion pool and swinging the wafer in the corrosion pool to shake off impurities on the surface of the wafer, and the swinging assembly comprises a connecting ring frame arranged between the clamping piece and the placing frame and used for connection and a centering column installed on the clamping piece; through the arrangement of the swing assembly, the wafer and the clamping piece can keep swinging in the corrosion pool, so that the swinging of the wafer and the clamping piece can keep the surrounding corrosion liquid flowing, the flowing corrosion liquid can help take away heat and products from the surface of the wafer, and the reaction stability and efficiency are maintained.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a semiconductor wet etching device. Background Art

[0002] Semiconductor is a substance between conductor and non-conductor. Semiconductor materials are generally used to make various chips. Wafers are extracted from silicon materials, and then after the wafers are divided, transistors are etched on the wafers using equipment such as photolithography machines, so that they can be used as electronic component chips. In the semiconductor processing process, other material layers are easily attached to the surface of semiconductor materials. Therefore, a wet etching device is required. The device immerses the wafer in a corrosive liquid, and the corrosive liquid reacts chemically with the material on the surface of the wafer to remove the unnecessary material part. At present, in the wet etching process of wafers, a device is required. The clamping assembly inside the etching frame stably and accurately places the wafer in the etching frame, so that the etching liquid is in full contact with the wafer surface; the wafer is stably and accurately placed in the etching frame under the action of the clamping assembly, and the wafer and the etching liquid are kept in a static state by the clamping assembly, so that the etching liquid cannot flow between the wafer surface. However, the etching liquid undergoes a chemical reaction when in contact with the wafer, accompanied by the generation of heat and the formation of reaction products, resulting in the heat generated by the wafer on the etching liquid surface cannot be carried away in time, thereby causing local over-corrosion or under-corrosion on the wafer surface, affecting the stability of the semiconductor material reaction. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor wet etching device to solve the above-mentioned deficiencies in the technology.

[0004] In order to achieve the above-mentioned object, the present invention provides the following technical solutions: a semiconductor wet etching device, comprising a wafer, an etching pool and a clamping member, wherein the clamping member is used to position the wafer and immerse it in the etching pool, a placement rack is fixed on one side of the wafer, and the placement rack is used to take and place the clamping member in the etching pool;

[0005] The swing component is used to carry away the temperature generated by the reaction of the wafer in the corrosion pool, and to swing the wafer in the corrosion pool to shake off impurities on its surface. The swing component includes a connecting ring frame for connection arranged between the clamping member and the placement frame and a centering column installed on the clamping member, and one end of the connecting ring frame is a hollow structure. A slide groove is provided on the side of the connecting ring frame close to the clamping member, and the centering column and the slide groove are rotatably connected. A servo motor is installed on the top of the connecting ring frame, and a running component for connection is provided between the servo motor and the centering column, and the running component is used to rotate the centering column in the slide groove and keep the etching liquid around the wafer flowing. A displacement component for connection is provided between the slide groove and the running component, and the displacement component is used to push the wafer to move in the clamping member and move the wafer in the shielded part of the clamping member. Replacement, a flexible component that cooperates with the displacement component is arranged in the clamping part, and the flexible component is used to keep the wafer in two-point contact in the clamping part, and move the wafer downward in the clamping part to maintain a distance; and the swing of the centering column drives the clamping part and the wafer to swing synchronously inside the corrosion pool, so that the position of the wafer in the corrosion pool changes, and at the same time, the swing of the clamping part can keep the etching liquid around it flowing, and the flowing etching liquid can help take away the heat and products from the wafer surface, maintaining the stability and efficiency of the reaction. In addition, during the etching process of the wafer in the corrosion pool, the generated hydrogen bubbles are often adsorbed on the wafer surface to form a "pseudo mask" and produce conical hillocks, resulting in a rough surface. By swinging the wafer, the aggregation of hydrogen bubbles on the surface can be reduced, thereby improving the surface roughness and enhancing the wafer etching effect.

[0006] Preferably, the operating component includes two limiting rings symmetrically sleeved on the outside of the centering column and a column fixedly connected to the output end of the servo motor, the bottom end of the column is fixedly connected to a crank frame, the outsides of the two limiting rings are fixedly connected to connecting arms, the tops of the two connecting arms are jointly installed with a cross column, the bottom end of the crank frame is fixedly connected to a connecting seat, a centrifugal column is slidably connected in the connecting seat, the bottom end of the centrifugal column is fixedly connected to a moving sleeve, and the moving sleeve is slidably sleeved on the outside of the cross column; and the entire operating component is located in the hollow interior of the connecting ring frame, and the cross column is maintained between the connecting arm and the centering column. The distance between the movable sleeve and the horizontal column is kept in good connection to avoid mutual interference; in addition, the servo motor drives the crank frame to move in a circle in the connecting ring frame, and then the movable sleeve moves left and right along the horizontal column under the rotation of the crank frame, and the horizontal column moves back and forth along the connecting ring frame under the drive of the movable sleeve and the crank frame. At this time, the etching liquid around the wafer is moved in multiple directions, further improving the flow effect of the etching liquid around the wafer. At the same time, the flowing liquid can reduce the accumulation of sediment and impurities generated during the etching process on the wafer surface, promote the removal of heat and reaction products, and further improve the etching quality of the wafer.

[0007] Preferably, the displacement assembly includes a support plate slidably connected in the slide groove and an eccentric wheel fixedly connected to the outside of the connecting seat, a displacement frame is slidably connected to one side of the support plate, and the bottom of the displacement frame contacts the top of the wafer, one end of the displacement frame is fixedly connected to a displacement column, and one end of the displacement column passes through the support plate and is fixedly connected to a displacement disk matched with the eccentric wheel, a contact assembly is provided in the support plate, and the contact assembly is used to promote the stable contact between the displacement disk and the eccentric wheel, and a fitting assembly matched with the displacement assembly is provided on the connecting ring frame; the bottom of the displacement frame is matched with the wafer in a slope, so that the displacement frame can move along the engagement ring. The external horizontal movement of the ring frame contacts the wafer and pushes the wafer to move downward along the clamp, which is used to replace the restricted position of the wafer in the clamp, so that the restricted position on the wafer surface can contact and react with the etching liquid. At the same time, the movement of the wafer position in the clamp can cooperate with the flowing etching liquid, which is beneficial to the stable carrying away of the temperature generated on the wafer surface and improve the reaction speed of the wafer. In addition, the slope between the eccentric wheel and the displacement disk is coordinated, so that the rotation of the eccentric wheel fits the displacement disk and pushes the displacement disk to one side of the support plate, and then the movement of the displacement disk drives the displacement column to move synchronously.

[0008] Preferably, the resistance assembly includes a spring ring fixedly sleeved on the displacement column and a limiting groove provided in the support plate for the spring ring to move, a first spring is commonly connected between the limiting groove and the spring ring, and the first spring is sleeved on the outside of the displacement column; and the elastic force of the first spring itself can give a thrust to one side of the spring ring, so that the displacement disk and the eccentric wheel are misaligned and the displacement disk is automatically moved and reset, thereby ensuring the subsequent coordinated use of the eccentric wheel and the displacement disk and improving the convenience of using the device.

[0009] Preferably, the flexible component includes a flexible groove opened on one side of the clamping member and an ear groove symmetrically opened on the outside of the clamping member and communicating with the inside of the flexible groove. Two groups of limiting plates matching the wafer are symmetrically connected to one side of the flexible groove close to the ear groove. A side plate is installed on one side of the limiting plate, and the side plate contacts one side of the wafer. A pushing component matching the limiting plate is provided in the flexible groove, and the pushing component is used to make the side plate and the wafer flexibly contact each other. The two groups of limiting plates are symmetrically arranged inside the flexible groove, and there are two limiting plates inside each group, so that the number of the two groups of limiting plates is four, and they are symmetrically arranged in pairs in the flexible groove, and the number of the pushing components and the side plates is equal to the limiting plates. At the same time, the flexible groove is C shaped structure, and at the same time, the ear groove is used to maintain the upper and lower ends of the clamp and the flexible groove in a notched state, so that the wafer can achieve two-point contact at both ends inside the flexible groove and the ear groove, maintaining a stable connection between the wafer and the clamp, which is beneficial for the clamp to maintain a distance from the wafer through the flexible groove, and is convenient for the wafer to move inside the clamp and still maintain flow with the etching liquid, so that the flowing etching liquid carries away the heat of the wafer inside the clamp; in addition, the wafer moves downward along the clamp under the action of the flexible component and has a distance from the clamp, which is beneficial for the etching liquid to be more evenly distributed to every part of the wafer surface, helping to achieve a more consistent etching effect and reduce local over-corrosion or under-corrosion.

[0010] Preferably, a rotating groove is further provided on one side of the limiting plate, a rotating ring is fixedly connected to the side of the side plate away from the wafer, and the rotating ring is rotatably connected to the rotating groove, the side plate is an elliptical structure and the top is flat; and the side plate and the wafer are in point contact, which can reduce the contact area with the wafer, so that most of the wafer in the clamp is exposed to the inside of the corrosion pool, thereby improving the corrosion efficiency of the wafer, and the side plate keeps in contact with the downward moving wafer and drives the side plate to rotate, thereby avoiding scratches caused by hard contact of the wafer along the clamp, allowing the wafer to move downward stably along the flexible groove, thereby ensuring the corrosion quality of the wafer in the corrosion pool.

[0011] Preferably, the pushing assembly includes a centering groove provided in the flexible groove for the movement of the limiting plate and a guide column fixedly connected to the centering groove, a through groove for the insertion of the guide column is provided on one side of the limiting plate, a second spring is commonly connected between the guide column and the limiting plate, and the second spring is sleeved on the guide column; through the setting of the pushing assembly, the wafer can maintain elastic contact in the clamping member to avoid damage caused by hard pressure between the clamping member and the wafer, and at the same time, the wafer is restricted in the clamping member but not too tight, so that the displacement assembly can stably push the wafer to move downward along the clamping member, further promoting the heat on the surface of the wafer to be carried away, ensuring that the surface of the wafer can be stably reacted.

[0012] Preferably, the fitting assembly includes an extension column fixedly connected to the top of the support plate and a baffle fixedly connected to the outside of the connecting ring frame, the bottom end of the baffle is fixedly connected to a connecting tube, the inside of the connecting tube is fixedly connected to a plurality of upright frames, the bottom ends of the plurality of upright frames are fixedly connected to a plurality of flexible arc plates, the baffle and the connecting tube are both provided with movable grooves for the extension column to be inserted, and the plurality of flexible arc plates and the plurality of upright frames are located on the outside of the extension column, the external movable sleeve of the extension column is provided with a mounting tube, and the mounting tube and the connecting tube are threadedly connected, a resistance cavity matched with the plurality of flexible arc plates is formed in the mounting tube; and the slope between the resistance cavity and the plurality of flexible arc plates is matched, so that the mounting tube moves upward or downward along the connecting tube, which is used to drive the resistance cavity and the plurality of upright frames to move upward or downward. The mounting tubes contact and push or loosen several flexible arc plates, so that the several flexible arc plates can lock or open the outside of the extension column, and the several flexible arc plates, under the action of several uprights, make the several uprights partially expose the outside of the connecting tube, and the exposed parts of the several flexible arc plates are in contact with the conflicting cavity. In addition, the support plate can move it up or down along the inside of the slide groove under the action of the fitting component, which is conducive to regulating the contact surface between the displacement frame and the wafer, so that the displacement frame can maintain stable contact with the wafer, which is used to accurately push the wafer and move it downward along the clamping part, which helps to achieve a more consistent corrosion effect, and the bottom of the connecting tube has an external thread, and the inside of the mounting tube is provided with an internal thread, so that the connecting tube and the mounting tube are screwed together.

[0013] In the above technical solution, the technical effects and advantages provided by the present invention are:

[0014] 1. By setting the swing component, the wafer and the clamp can be kept swinging in the corrosion pool, so that the position of the wafer in the corrosion pool changes. At the same time, the swing of the wafer and the clamp can keep the surrounding corrosive liquid flowing. The flowing corrosive liquid can help take away the heat and products from the wafer surface, maintain the stability and efficiency of the reaction, avoid the occurrence of local over-corrosion or under-corrosion on the wafer surface, and improve the stability of the semiconductor material reaction.

[0015] 2. Through the arrangement of the operating components, wafers, clamps and centering columns, not only can the wafer be swung in the corrosion tank, but the corrosion liquid around the wafer can also be moved in multiple directions, further improving the flow effect of the corrosion liquid around the wafer, which is beneficial to the full contact between the wafer and the corrosion liquid. At the same time, the flowing liquid can reduce the accumulation of sediment and impurities generated during the corrosion process on the wafer surface, promote the removal of heat and reaction products, and further improve the corrosion quality of the wafer.

[0016] 3. By setting up the displacement component, the connecting seat, the wafer and the clamp, the restricted part of the wafer in the clamp can be replaced, so that the restricted part of the wafer surface can contact and react with the corrosive liquid. At the same time, the movement of the position of the wafer in the clamp can cooperate with the flowing corrosive liquid, which is beneficial to the stable carrying away of the temperature generated on the wafer surface, thereby improving the reaction speed of the wafer and the stability of the semiconductor material reaction.

[0017] 4. By setting up the flexible component, wafer, displacement component and clamp, the clamp maintains a distance from the wafer through the flexible groove, so that the wafer can move inside the clamp and still maintain flow with the etching liquid, so that the flowing etching liquid can carry away the heat of the wafer inside the clamp.

[0018] 5. By setting up the flexible component, wafer and clamp, the wafer moves downward along the clamp under the action of the flexible component and there is a distance between the wafer and the clamp, which is conducive to the corrosion liquid being more evenly distributed to every part of the wafer surface, helping to achieve a more consistent corrosion effect, reduce local over-corrosion or under-corrosion, and improve the stability of the semiconductor material reaction.

[0019] 6. By setting the pushing components, rotating grooves, side plates and wafers, point contact between the side plates and the wafers can be achieved, which can reduce the contact area with the wafers, so that most of the wafers in the clamps are exposed to the inside of the corrosion pool, thereby improving the corrosion efficiency of the wafers. In addition, the side plates are kept in contact with the wafers moving downward and drive the side plates to rotate, thereby avoiding scratches caused by hard contact of the wafers in the clamps, allowing the wafers to move steadily downward along the flexible grooves, thereby ensuring the corrosion quality of the wafers in the corrosion pool.

[0020] 7. Through the arrangement of the displacement assembly and the wafer, the support plate can be moved upward or downward along the inside of the slide groove under the action of the fitting assembly, which is beneficial to regulating the contact surface between the displacement frame and the wafer, so that the displacement frame can maintain stable contact with the wafer, and is used to accurately push the wafer and move it downward along the clamp, which helps to achieve a more consistent corrosion effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2It is a structural schematic diagram of the centering column of the present invention;

[0024] Figure 3 It is an exploded view of the operating components of the present invention;

[0025] Figure 4 A partial cross-sectional view of the support plate of the present invention;

[0026] Figure 5 It is a structural schematic diagram of the flexible groove of the present invention;

[0027] Figure 6 It is a structural schematic diagram of the side plate of the present invention;

[0028] Figure 7 It is a schematic diagram of the structure of the rotating tank of the present invention;

[0029] Figure 8 It is a schematic diagram of the structure of assembling the wafer and the flexible groove of the present invention;

[0030] Fig. 9 It is an exploded view of the bonding component of the present invention.

[0031] Description of reference numerals:

[0032] 1. Wafer; 11. Corrosion tank; 12. Placement rack; 13. Clamping parts;

[0033] 2. Swing assembly; 21. Connecting ring frame; 22. Slideway; 23. Centering column; 24. Servo motor;

[0034] 3. Operating assembly; 31. Vertical column; 32. Crank frame; 33. Limiting ring; 34. Connecting arm; 35. Moving sleeve; 36. Centrifugal column; 37. Connecting seat; 38. Horizontal column;

[0035] 4. displacement assembly; 41. displacement frame; 42. support plate; 43. limit groove; 44. displacement column; 45. first spring; 46. spring ring; 47. displacement disk; 48. eccentric wheel;

[0036] 5. Flexible component; 51. Flexible groove; 52. Ear groove; 53. Limiting plate; 54. Side plate; 55. Rotating groove; 56. Rotating ring; 57. Centering groove; 58. Guide column; 59. Second spring;

[0037] 6. Fitting assembly; 61. Extension column; 62. Baffle; 63. Connecting tube; 64. Mounting tube; 65. Resistance cavity; 66. Flexible arc plate; 67. Stand; 68. Moving groove. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0039] The present invention provides Figure 1-Figure 9 A semiconductor wet etching device shown includes a wafer 1, an etching pool 11 and a clamp 13, wherein the clamp 13 is used to position the wafer 1 and immerse it in the etching pool 11, a placement rack 12 is fixed on one side of the wafer 1, and the placement rack 12 is used to take and place the clamp 13 in the etching pool 11;

[0040] The swing assembly 2 is used to carry away the temperature generated by the reaction of the wafer 1 in the corrosion tank 11, and to swing the wafer 1 in the corrosion tank 11 to shake off the impurities on its surface. The swing assembly 2 includes a connecting ring frame 21 arranged between the clamping member 13 and the placement frame 12 for connection and a centering column 23 installed on the clamping member 13, and one end of the connecting ring frame 21 is arranged in a hollow structure. A slide groove 22 is provided on the side of the connecting ring frame 21 close to the clamping member 13, and the centering column 23 is rotatably connected to the slide groove 22. A servo motor 24 is installed on the top of the connecting ring frame 21, and the servo motor 24 and the centering column 23 are connected. A running component 3 for connection is provided between them, and the running component 3 is used to rotate the centering column 23 in the slide groove 22 and keep the etching liquid around the wafer 1 flowing. A displacement component 4 for connection is provided between the slide groove 22 and the running component 3, and the displacement component 4 is used to push the wafer 1 to move in the clamping part 13 and replace the blocked part of the wafer 1 in the clamping part 13. A flexible component 5 cooperating with the displacement component 4 is provided in the clamping part 13, and the flexible component 5 is used to keep the wafer 1 in two-point contact in the clamping part 13 and move the wafer 1 downward in the clamping part 13 to maintain a distance.

[0041] refer to Figure 1-Figure 4As shown, the operating component 3 includes two limiting rings 33 symmetrically sleeved on the outside of the centering column 23 and a column 31 fixedly connected to the output end of the servo motor 24, the bottom end of the column 31 is fixedly connected to a crank frame 32, the outsides of the two limiting rings 33 are fixedly connected to connecting arms 34, the tops of the two connecting arms 34 are jointly installed with a cross column 38, the bottom end of the crank frame 32 is fixedly connected to a connecting seat 37, a centrifugal column 36 is slidably connected in the connecting seat 37, the bottom end of the centrifugal column 36 is fixedly connected to a moving sleeve 35, and the moving sleeve 35 is slidably sleeved on the outside of the cross column 38; the displacement component 4 includes a support plate 42 slidably connected in the slide groove 22 and an eccentric wheel 48 fixedly connected to the outside of the connecting seat 37, one side of the support plate 42 is slidably connected to the A displacement frame 41 is connected, and the bottom of the displacement frame 41 contacts the top of the wafer 1. One end of the displacement frame 41 is fixedly connected to a displacement column 44, and one end of the displacement column 44 passes through the support plate 42 and is fixedly connected to a displacement disk 47 that matches the eccentric wheel 48. A contact component is provided in the support plate 42, and the contact component is used to promote stable contact between the displacement disk 47 and the eccentric wheel 48. A fitting component 6 that matches the displacement component 4 is provided on the connecting ring frame 21; the contact component includes a spring ring 46 fixedly sleeved on the displacement column 44 and a limiting groove 43 opened in the support plate 42 for the spring ring 46 to move. A first spring 45 is commonly connected between the limiting groove 43 and the spring ring 46, and the first spring 45 is sleeved on the outside of the displacement column 44.

[0042] refer to Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the flexible component 5 includes a flexible groove 51 opened on one side of the clamping member 13 and an ear groove 52 symmetrically opened on the outside of the clamping member 13 and communicating with the inside of the flexible groove 51. The side of the flexible groove 51 close to the ear groove 52 is symmetrically connected with two groups of limiting plates 53 matched with the wafer 1. A side plate 54 is installed on one side of the limiting plate 53, and the side plate 54 is in contact with one side of the wafer 1. A pushing component matched with the limiting plate 53 is arranged in the flexible groove 51, and the pushing component is used to make the side plate 54 and the wafer 1 flexibly contact each other; one side of the limiting plate 53 is also opened The rotating groove 55, the side of the side plate 54 away from the wafer 1 is fixedly connected with a rotating ring 56, and the rotating ring 56 is rotatably connected to the rotating groove 55, the side plate 54 is an elliptical structure and the top is flat; the pushing component includes a centering groove 57 opened in the flexible groove 51 for the limiting plate 53 to move and a guide column 58 fixedly connected in the centering groove 57, a through groove for the guide column 58 to be inserted into one side of the limiting plate 53, a second spring 59 is commonly connected between the guide column 58 and the limiting plate 53, and the second spring 59 is sleeved on the guide column 58.

[0043] refer to Figure 1 , Figure 2 and Fig. 9 As shown, the fitting component 6 includes an extension column 61 fixedly connected to the top of the support plate 42 and a baffle 62 fixedly connected to the outside of the connecting ring frame 21, the bottom end of the baffle 62 is fixedly connected to a connecting tube 63, the interior of the connecting tube 63 is fixedly connected to a plurality of upright frames 67, the bottom ends of the plurality of upright frames 67 are fixedly connected to a plurality of flexible arc plates 66, both the baffle 62 and the connecting tube 63 are provided with a movable groove 68 for inserting the extension column 61, and the plurality of flexible arc plates 66 and the plurality of upright frames 67 are located on the outside of the extension column 61, the external movable sleeve of the extension column 61 is provided with a mounting tube 64, and the mounting tube 64 is threadedly connected to the connecting tube 63, and a resistance cavity 65 matching the plurality of flexible arc plates 66 is formed in the mounting tube 64.

[0044] Through the above technical solution:

[0045] When in use;

[0046] In the first step, when the wafer 1 and the clamping member 13 are immersed in the corrosion tank 11, the servo motor 24 rotates to drive the column 31 to rotate synchronously, and then the column 31 rotates to drive the crank frame 32 to rotate synchronously, so that the crank frame 32 moves in a circle below the servo motor 24. At this time, the crank frame 32 rotates to drive the connecting seat 37 to rotate, and the connecting seat 37 rotates to contact the centrifugal column 36 inside and push the centrifugal column 36 to move, and the movement of the centrifugal column 36 drives the moving sleeve 35 to move along the horizontal column 38. The movable sleeve 35 moves horizontally to the left, and the connecting seat 37 is continuously rotated, so that the movable sleeve 35 moves along the cross column 38 and moves near the cross column 38 and the connecting arm 34, so that the movable sleeve 35 moves along the cross column 38 and contacts with the cross column 38, and pushes the cross column 38 to move inside the connecting ring frame 21, and then the cross column 38 moves inside the connecting ring frame 21 and moves along the arc on the centering column 23 under the action of the connecting arm 34 and the limit ring 33, so that the movement of the cross column 38 drives the centrifugal column 36 The movable sleeve 35 moves upward along the connecting seat 37. As the movable sleeve 35 continuously approaches the cross column 38 and one of the connecting arms 34, the cross column 38 moves to the inner depth of the connecting ring frame 21. Then, the connecting seat 37 rotates to drive the movable sleeve 35 to move horizontally along the cross column 38, so that the movable sleeve 35 moves to the right along the cross column 38, and the movable sleeve 35 approaches the other connecting arm 34 and the cross column 38 along the cross column 38, so that the movable sleeve 35 moves and drives the cross column 38 to swing back and forth in the connecting ring frame 21 with the centering column 23 as the center, so that the swing of the cross column 38 drives the centering column 23 to swing inside the slide 22, and then the wafer 1 and the clamping member 13 keep swinging in the etching pool 11 under the swing of the centering column 23, so that the etching liquid around the wafer 1 can be moved in multiple directions, so that the swing of the wafer 1 and the clamping member 13 can keep the etching liquid around them flowing, so that the flowing etching liquid can help take away the heat and products from the surface of the wafer 1, and maintain the stability and efficiency of the reaction.

[0047] In the second step, when the wafer 1 swings inside the corrosion pool 11 and the connecting seat 37 rotates, the connecting seat 37 rotates to drive the eccentric wheel 48 to rotate synchronously along the connecting ring frame 21, and then the outer side of the eccentric wheel 48 slowly approaches the outer side of the displacement plate 47 and forms a conflict with it. At this time, the eccentric wheel 48 and the displacement plate 47 conflict and push the displacement plate 47, and the displacement plate 47 moves to drive the displacement column 44 to move horizontally in the support plate 42 and the limiting groove 43, and the movement of the displacement column 44 drives the spring ring 46 to move synchronously along the limiting groove 43, so that the first spring 4 5 is squeezed between the limiting groove 43 and the spring ring 46, so that the displacement column 44 moves to push the displacement frame 41 to move, and then the displacement frame 41 and the swinging wafer 1 are matched with each other in slope, so that the displacement frame 41 moves horizontally to form a conflict with the outside of the wafer 1 and push the wafer 1 to move along the clamping member 13, so that the restricted part of the wafer 1 in the clamping member 13 can be replaced, so that the restricted part of the surface of the wafer 1 can contact and react with the etching liquid, and the flowing etching liquid can stably carry away the temperature generated on the surface of the wafer 1 while the wafer 1 moves.

[0048] In the third step, when the displacement frame 41 pushes the wafer 1 to move downward along the clamping member 13, first the elastic force of the second spring 59 itself can push one side of the limiting plate 53, and then the limiting plate 53 moves along the centering groove 57 to the inside of the flexible groove 51, and the limiting plate 53 moves the through groove opened on one side along the outside of the guide column 58 during the movement, and then the limiting plate 53 and the wafer 1 in the flexible groove 51 are restrained by the two ear grooves 52, so as to keep the wafer 1 at two points in the two ear grooves 52, so that the wafer 1 remains stable in the flexible groove 51 and the clamping member 13, and there is a distance between the wafer 1 and the flexible groove 51, so as to avoid the situation that the wafer 1 moves along the clamping member 13 and conflicts with the flexible groove 51, and ensure that the wafer 1 can move stably along the clamping member 13, so that the wafer 1 can still maintain the flow with the etching liquid when moving inside the clamping member 13, so that the flowing etching liquid carries away the heat of the wafer 1 inside the clamping member 13, which helps to achieve a more consistent etching effect.

[0049] In the fourth step, when the height between the displacement rack 41 and the wafer 1 needs to be adjusted, the installation cylinder 64 is rotated to screw it into and rotate with the connecting cylinder 63, and then the installation cylinder 64 moves downward along the outside of the connecting cylinder 63. At this time, the downward movement of the installation cylinder 64 drives the resistance cavity 65 to move downward synchronously, and the slope between the resistance cavity 65 and the plurality of flexible arc plates 66 is matched and slowly loses resistance, so that the external extrusion force of the plurality of flexible arc plates 66 and the extension column 61 is continuously weakened, and the extension column 61 is pulled to move it in the plurality of flexible arc plates 66, the plurality of vertical frames 67 and the moving groove 68, which is used to realize the upward or downward movement of the support plate 42 in the slide groove 22, thereby adjusting the height between the displacement rack 41 and the wafer 1, so that the displacement rack 41 can maintain stable contact with the wafer 1.

[0050] The above only describes certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, a person skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor wet etching device, comprising a wafer (1), an etching pool (11) and a clamp (13), wherein the clamp (13) is used to position the wafer (1) and immerse it in the etching pool (11), a placement rack (12) is fixed on one side of the wafer (1), and the placement rack (12) is used to take and place the clamp (13) in the etching pool (11), characterized in that: The swing assembly (2) is used to carry away the temperature generated by the reaction of the wafer (1) in the corrosion pool (11), and to swing the wafer (1) in the corrosion pool (11) to shake off the impurities on the surface of the wafer (1). The swing assembly (2) includes a connecting ring frame (21) arranged between the clamping member (13) and the placement frame (12) for connection, and a centering column (23) installed on the clamping member (13), and one end of the connecting ring frame (21) is arranged in a hollow structure. A slide groove (22) is provided on the side of the connecting ring frame (21) close to the clamping member (13). The centering column (23) and the slide groove (22) are rotatably connected. A servo motor (24) is installed on the top of the connecting ring frame (21). The servo motor (24) and the centering column (23) are connected to each other. A running component (3) for connection is provided between the two components, and the running component (3) is used to rotate the centering column (23) in the slide groove (22) and keep the etching liquid around the wafer (1) flowing. A displacement component (4) for connection is provided between the slide groove (22) and the running component (3), and the displacement component (4) is used to push the wafer (1) to move in the clamping member (13) and replace the shielding part of the wafer (1) in the clamping member (13). A flexible component (5) matched with the displacement component (4) is provided in the clamping member (13), and the flexible component (5) is used to keep the wafer (1) in two-point contact in the clamping member (13) and move the wafer (1) downward in the clamping member (13) to maintain a distance.

2. A semiconductor wet etching device according to claim 1, characterized in that: The operating assembly (3) comprises two limiting rings (33) symmetrically sleeved on the outside of the centering column (23) and a column (31) fixedly connected to the output end of the servo motor (24); the bottom end of the column (31) is fixedly connected to a crank frame (32); the outsides of the two limiting rings (33) are fixedly connected to connecting arms (34); the tops of the two connecting arms (34) are jointly mounted with a cross column (38); the bottom end of the crank frame (32) is fixedly connected to a connecting seat (37); a centrifugal column (36) is slidably connected in the connecting seat (37); the bottom end of the centrifugal column (36) is fixedly connected to a moving sleeve (35); and the moving sleeve (35) is slidably sleeved on the outside of the cross column (38).

3. A semiconductor wet etching device according to claim 2, characterized in that: The displacement assembly (4) comprises a support plate (42) slidably connected in the slide groove (22) and an eccentric wheel (48) fixedly connected to the outside of the connecting seat (37); a displacement frame (41) is slidably connected to one side of the support plate (42), and the bottom of the displacement frame (41) contacts the top of the wafer (1); a displacement column (44) is fixedly connected to one end of the displacement frame (41), and one end of the displacement column (44) passes through the support plate (42) and is fixedly connected to a displacement disk (47) matched with the eccentric wheel (48); a contact assembly is provided in the support plate (42), and the contact assembly is used to promote stable contact between the displacement disk (47) and the eccentric wheel (48); and a fitting assembly (6) matched with the displacement assembly (4) is provided on the connecting ring frame (21).

4. A semiconductor wet etching device according to claim 3, characterized in that: The abutment assembly comprises a spring ring (46) fixedly sleeved on the displacement column (44) and a limiting groove (43) provided in the support plate (42) for the spring ring (46) to move, a first spring (45) being connected between the limiting groove (43) and the spring ring (46), and the first spring (45) being sleeved on the outside of the displacement column (44).

5. The semiconductor wet etching device according to claim 1, characterized in that: The flexible component (5) comprises a flexible groove (51) provided on one side of the clamping member (13) and an ear groove (52) symmetrically provided on the outside of the clamping member (13) and communicating with the inside of the flexible groove (51); two groups of limiting plates (53) matching with the wafer (1) are symmetrically connected to one side of the flexible groove (51) close to the ear groove (52); a side plate (54) is installed on one side of the limiting plate (53), and the side plate (54) is in contact with one side of the wafer (1); a pushing component matching with the limiting plate (53) is provided in the flexible groove (51), and the pushing component is used to make the side plate (54) and the wafer (1) in flexible contact.

6. The semiconductor wet etching device according to claim 5, characterized in that: A rotation groove (55) is also provided on one side of the limiting plate (53); a rotation ring (56) is fixedly connected to the side of the side plate (54) away from the wafer (1); and the rotation ring (56) is rotationally connected to the rotation groove (55); the side plate (54) is an elliptical structure with a flat top.

7. The semiconductor wet etching device according to claim 5, characterized in that: The pushing assembly comprises a centering groove (57) provided in the flexible groove (51) for the limiting plate (53) to move, and a guide column (58) fixedly connected in the centering groove (57); a through groove for the guide column (58) to be inserted is provided on one side of the limiting plate (53); a second spring (59) is commonly connected between the guide column (58) and the limiting plate (53), and the second spring (59) is sleeved on the guide column (58).

8. The semiconductor wet etching device according to claim 3, characterized in that: The fitting component (6) comprises an extension column (61) fixedly connected to the top of the support plate (42) and a baffle (62) fixedly connected to the outside of the connecting ring frame (21); the bottom end of the baffle (62) is fixedly connected to a connecting tube (63); a plurality of vertical frames (67) are fixedly connected to the inside of the connecting tube (63); the bottom ends of the plurality of vertical frames (67) are fixedly connected to a plurality of flexible arc plates (66); the baffle (62) and the connecting tube (63) are both provided with a movable groove (68) for the extension column (61) to be inserted, and the plurality of flexible arc plates (66) and the plurality of vertical frames (67) are located outside the extension column (61); the outside of the extension column (61) is movably sleeved with a mounting tube (64), and the mounting tube (64) and the connecting tube (63) are threadedly connected; a resistance cavity (65) matching with the plurality of flexible arc plates (66) is formed inside the mounting tube (64).

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