Full-automatic rapid annealing equipment for wafer

Abstract

The invention relates to the technical field of wafer processing, in particular to full-automatic rapid annealing equipment for wafers. The full-automatic rapid annealing equipment for the wafer comprises a wafer boat platform, a wafer is placed on the wafer boat platform; the robot for transferring the wafer is arranged beside the wafer boat platform; the wafer cooling station is arranged beside the robot; a plurality of wafers can be placed on the positioning frame of the wafer cooling station; the feeding mechanism is arranged beside the robot and comprises a bearing plate and an ejector pin; the robot loads the wafer on the wafer boat platform to the ejector pin; the process furnace is arranged beside the feeding mechanism; the process furnace comprises a furnace body, a furnace door, a heating piece and a carrying disc assembly. The ejector pin loads the wafer to the loading disc assembly. And the positioning frame can accommodate a large number of wafers, so that the cooling and feeding efficiency can be improved. And the ejector pin descends to load the wafer to the loading disc assembly, so that the accuracy of wafer loading is ensured. A plurality of wafers can be placed on the carrying disc assembly, and the process furnace can heat the plurality of wafers, so that the processing efficiency can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a fully automatic rapid annealing device for wafers. Background Art

[0002] The main purpose of wafer annealing is to relieve stress, repair lattice defects, activate doping atoms, and improve the electrical and mechanical properties of the material. Specifically, annealing changes the physical and chemical properties of the material by heating the wafer and keeping it at a certain temperature, and then slowly cooling it. This process is usually carried out in a specialized furnace.

[0003] For example, Chinese patent application number: CN202320081217.4 discloses a semiconductor rapid annealing furnace structure. This design has at least the following problems: 1. The manipulator grabs the wafer in the wafer container, places it in the positioner for positioning, and then places it in the heater for heating. The utility model is provided with two groups of heaters on the left and right sides of the manipulator, sharing a positioner. There is only one positioner, and it takes a long time to wait for positioning and cooling, which affects production efficiency. 2. The manipulator grabs the wafer in the wafer container, places it in the positioner for positioning, and then places it in the heater for heating. The wafer needs to be slowly placed in the wafer tray. During this process, the wafer is very thin. When the manipulator loads the wafer, the wafer may not be accurately placed in the wafer tray. Summary of the invention

[0004] In view of this, the present invention aims to overcome the deficiencies in the prior art, and its main purpose is to provide a fully automatic rapid annealing equipment for wafers, wherein the positioning frame can position and cool multiple wafers to improve processing efficiency; at the same time, the ejector pins can accurately load the wafers onto the carrier assembly, thereby overcoming the deficiencies in the prior art.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions: The present application provides a fully automatic rapid annealing device for wafers, comprising a wafer boat platform; wafers are placed on the wafer boat platform; a robot is arranged on the side of the wafer boat platform, and the robot can transfer wafers; a wafer cooling station is arranged on the side of the robot; the wafer cooling station comprises a positioning frame, and the positioning frame can hold one or more wafers; a loading mechanism is arranged on the side of the robot, and the loading mechanism comprises a carrying plate and a ejector pin arranged on the carrying plate; the robot can load the wafers on the wafer boat platform onto the ejector pin; a process furnace is arranged on the side of the loading mechanism; the process furnace comprises a furnace body, a furnace door that can be opened and closed and arranged on the furnace body, a heating element arranged in the furnace body, and a carrier plate assembly arranged on the furnace door; the ejector pin can load the wafers onto the carrier plate assembly.

[0006] Preferably, the wafer boat platform includes a first base plate, a wafer boat box, and a first sensor; a first positioning column and a second positioning column are provided on the first base plate; a plurality of first wafer slots are provided in the wafer boat box, and the wafers are inserted into the first wafer slots; a flange is provided on the wafer boat box; the wafer boat box is embedded between the first positioning column and the second positioning column, and the first positioning column blocks the flange; the first sensor faces the wafer in the wafer boat box.

[0007] Preferably, the robot includes a liftable second base, a first robotic arm and a second robotic arm arranged on the second base; a first pallet is arranged on the first robotic arm, and a second pallet is arranged on the second robotic arm; the first pallet and the second pallet can lift the wafer.

[0008] Preferably, a plurality of layer plates are arranged in the positioning frame, and third positioning pillars are arranged on the layer plates, and the wafer is placed on the layer plates; the third positioning pillars block the outer circumference of the wafer, and the third positioning pillars position the wafer.

[0009] Preferably, a gas nozzle is provided on the side of the positioning frame, and the gas nozzle sprays nitrogen to cool the wafer on the positioning frame; and a plurality of rows of air holes are provided on the positioning frame to cool the wafer.

[0010] Preferably, the feeding mechanism further comprises a first linear module; a carrying plate is arranged on the first linear module, and at least three ejectors are arranged on the carrying plate, and the ejectors can pass through the carrier assembly.

[0011] Preferably, the process furnace also includes a door locking device, which includes a first locking rod arranged on the furnace body, a second locking rod and a lock buckle arranged on the furnace door, and a sliding rod connected to the furnace door, the lock buckle is buckled on the first locking rod; the first locking rod and the second locking rod are pressed together; the sliding rod drives the furnace door to open or close.

[0012] Preferably, the carrier assembly includes a quartz bracket, a silicon carbide carrier, and a first thermometer; the first thermometer is arranged on the quartz bracket; the quartz bracket is arranged on the furnace door; the quartz bracket is provided with a supporting ear, and the supporting ear supports the silicon carbide carrier; the silicon carbide carrier is provided with a second wafer groove, and the wafer is placed in the second wafer groove, and the ejector pin can pass through the second wafer groove to lift the wafer.

[0013] Preferably, the inner wall of the furnace body is plated with a metal reflective layer; a heating element is arranged on the inner wall of the furnace body; a second thermometer is arranged in the furnace body, and a vacuum extraction interface, a cooling exhaust port, and a protective gas injection port are arranged on the furnace body and are connected to the chamber inside the furnace body.

[0014] Preferably, there is one wafer boat platform, one wafer cooling station and one robot, process furnaces and loading mechanisms are provided on both sides of the robot, and the wafer boat platform, the wafer cooling station and the robot are arranged between the process furnace and the loading mechanism.

[0015] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that the positioning frame can accommodate a large number of wafers without waiting, which helps to improve the efficiency of cooling and loading. The ejector loads the wafer to the carrier assembly by descending, which helps to ensure the accuracy of wafer loading. In addition, the carrier assembly can place multiple wafers at a time, and multiple wafers can be heated at a time, which helps to improve processing efficiency.

[0016] During operation: 1. A large number of wafers are placed on the wafer boat platform; the robot places multiple wafers on the wafer boat platform into the positioning frame for positioning. 2. The robot places the positioned wafers onto the ejector pins of the loading mechanism, and the ejector pins descend and the wafers fall smoothly and accurately onto the carrier assembly. 3. The furnace door is closed, and the heating element in the furnace body heats the wafers. 4. After the wafers are heated, the furnace door is opened, the ejector pins lift the wafers, and the robot places the wafers on the ejector pins onto the positioning frame for cooling. 5. After cooling, the robot places the cooled wafers back onto the wafer boat platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention.

[0018] Figure 2 The embodiment of the present invention Figure 1 Schematic diagram of some structures.

[0019] Figure 3 The embodiment of the present invention Figure 2 Schematic diagram from top view.

[0020] Figure 4 Schematic diagram of a wafer boat platform according to an embodiment of the present invention.

[0021] Figure 5 It is a schematic diagram of a process furnace according to an embodiment of the present invention.

[0022] Figure 6 It is a schematic diagram of a feeding mechanism according to an embodiment of the present invention.

[0023] Figure 7 It is a schematic cross-sectional view of a positioning frame according to an embodiment of the present invention.

[0024] Figure 8 Schematic diagram of a heating plate according to an embodiment of the present invention.

[0025] Fig. 9 It is a schematic diagram of the structure of the furnace door part of an embodiment of the present invention.

[0026] Fig.10 It is a schematic diagram of a cooling pipe according to an embodiment of the present invention.

[0027] Fig.11 It is a front view schematic diagram of a process furnace according to an embodiment of the present invention.

[0028] Fig.12 It is a schematic cross-sectional view of a process furnace according to an embodiment of the present invention.

[0029] Description of the accompanying drawings: 10. Wafer boat platform; 11. First base plate; 12. First positioning column; 13. Second positioning column; 14. First sensor; 15. Wafer; 16. Wafer boat box; 17. First wafer slot; 18. Flange; 20. Wafer cooling station; 21. Positioning frame; 22. Air hole; 23. Shelf; 24. Third positioning column; 25. Air nozzle; 30. Robot; 31. Second base; 32. First robotic arm; 33. Second robotic arm; 34. First support plate; 35. Second support plate; 36. Vacuum suction hole; 310. Heating plate; 311. Metal plate; 312. Metal frame; 40. Loading mechanism; 41. First a straight line module; 42, a third sensor; 43, a carrier plate; 44, a ejector pin; 410, a carrier plate assembly; 411, a quartz bracket; 412, a supporting ear; 413, a silicon carbide carrier plate; 414, a second wafer slot; 415, a first thermometer; 50, a process furnace; 510, a furnace door; 511, a door lock device; 512, a first locking rod; 513, a second locking rod; 514, a first cylinder; 515, a lock; 516, a push rod; 520, a furnace body; 521, a furnace body; 522, an upper furnace plate; 523, a lower furnace plate; 524, a chamber; 525, a cooling tube; 526, an exhaust hole; 527, a second thermometer; 528, a heating element. DETAILED DESCRIPTION

[0030] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0031] Please refer to Figures 1 to 12 As shown, it shows the specific structure of a preferred embodiment of the present invention, which is a fully automatic rapid annealing equipment for wafers.

[0032] Among them, a plurality of wafers 15 can be placed on the positioning frame 21, which can be used for positioning and cooling the wafers 15, and helps to improve production efficiency. The ejector pins 44 descend, so that the wafers 15 fall accurately onto the carrier assembly 410, ensuring the accuracy of wafer loading.

[0033] The present application provides a fully automatic rapid annealing device for wafers, comprising a wafer boat platform 10; a wafer 15 is placed on the wafer boat platform 10; a robot 30 is arranged on the side of the wafer boat platform 10, and the robot 30 can transfer the wafer 15; a wafer cooling station 20 is arranged on the side of the robot 30; the wafer cooling station 20 includes a positioning frame 21, and the positioning frame 21 can place one or more wafers 15; a loading mechanism 40 is arranged on the side of the robot 30, and the loading mechanism 40 includes a carrier plate 43 and a pin 44 arranged on the carrier plate 43; the robot 30 can load the wafer 15 on the wafer boat platform 10 onto the pin 44; a process furnace 50 is arranged on the side of the loading mechanism 40; the process furnace 50 includes a furnace body 520, a furnace door 510 that can be opened and closed and arranged on the furnace body 520, a heating element 528 arranged in the furnace body 520, and a carrier assembly 410 arranged on the furnace door 510; the pin 44 can load the wafer 15 onto the carrier assembly 410. Several wafer boat boxes 16 are arranged on the wafer boat platform 10, and a single wafer boat box 16 can hold many wafers 15. After the wafer 15 is loaded into the wafer boat box 16, the wafer boat box 16 is placed on the wafer boat platform 10. The robot 30 is used to transfer the wafer 15, and the wafer 15 can be transferred between the wafer boat platform 10, the wafer cooling station 20, and the loading mechanism 40. A multi-layer plate 23 is arranged in the positioning frame 21, and a plurality of wafers 15 can be placed in the positioning frame 21. The first and second pallets 34 and 35 of the robot 30 are left between the wafers 15 and 15, and can be extended into the positioning frame 21 to place the wafer 15 into the positioning frame 21, or to take the wafer 15 out of the positioning frame 21. The ejector pin 44 extends from the carrier plate 43 and can pass through the carrier assembly 410, so that it is convenient for the robot 30 to place the wafer 15 on the ejector pin 44. When the ejector pin 44 descends, the wafer 15 will fall on the silicon carbide carrier 413. This design allows the wafer 15 to fall accurately on the silicon carbide carrier 413 to prevent it from shifting.

[0034] Preferred working steps: 1. Workers or manipulators place a large number of wafers in layers in the wafer boat box 16 of the wafer boat platform 10, so that the robot 30 can easily obtain the wafers 15. 2. The robot 30 places multiple wafers 15 in the wafer boat box 16 in layers into the positioning frame 21, and the wafers 15 are positioned. 3. The furnace door 510 is opened, and the ejector pins 44 on the carrier plate 43 pass through the silicon carbide carrier 413 of the carrier assembly 410, and then the robot 30 places the positioned wafer 15 on the ejector pins 44, and the ejector pins 44 are gently lowered, so that the wafer 15 falls smoothly and accurately on the carrier assembly 410. 4. The furnace door 510 is closed, and the heating element 528 in the furnace body 520 heats the wafer 15. 4. After the wafer 15 is heated, the furnace door 510 is opened, the ejector pins 44 lift the wafer, and then the robot 30 places the wafer 15 on the ejector pins 44 on the positioning frame 21 for cooling. 5. After cooling is completed, the robot 30 places the cooled wafer 15 back onto the wafer boat platform 10 .

[0035] Preferably, the wafer boat platform 10 includes a first bottom plate 11, a wafer boat box 16, and a first sensor 14; the first bottom plate 11 is provided with a first positioning column 12 and a second positioning column 13; a plurality of first wafer slots 17 are provided in the wafer boat box 16, and the wafer 15 is inserted into the first wafer slot 17; a flange 18 is provided on the wafer boat box 16; the wafer boat box 16 is embedded between the first positioning column 12 and the second positioning column 13, and the first positioning column 12 blocks the flange 18; the first sensor 14 faces the wafer 15 in the wafer boat box 16. Preferably, the first positioning column 12 and the second positioning column 13 are arranged in an isosceles trapezoid shape. The structure of the wafer boat box 16 is adapted to the shape of the arrangement of the first positioning column 12 and the second positioning column 13. The structure of the first wafer slot 17 is in the shape of an isosceles trapezoid. The left and right first wafer slots 17 cooperate so that the wafer 15 can be placed in layers in the wafer boat box 16. At the same time, there is a certain gap between the wafer 15 and the inner wall of the first wafer slot 17. This design facilitates the robot 30 to lift the wafer 15 and then obtain the wafer 15. When the wafer boat box 16 is loaded, the wafer boat box 16 is embedded between the first positioning column 12 and the second positioning column 13, and the first positioning column 12 blocks the flange 18, so that the positioning and fixation of the wafer boat box 16 can be completed. This structure is very simple. The first sensor 14 is preferably a photoelectric sensor, which can sense the wafer 15 in the wafer boat box 16, which facilitates the coordinated work between various systems. In this embodiment, the structure of the wafer boat box 16 is in the shape of an isosceles trapezoid. This design allows the wafer 15 to be taken out from only one direction, which can prevent the wafer 15 from falling, and the structure is very clever. The wafer boat box 16 is arranged in an arc shape on the first bottom plate 11. This design can accommodate more wafer boat boxes 16.

[0036] Preferably, the robot 30 includes a second base 31 that can be raised and lowered, a first mechanical arm 32 and a second mechanical arm 33 that are arranged on the second base 31; a first support plate 34 is arranged on the first mechanical arm 32, and a second support plate 35 is arranged on the second mechanical arm 33; the first support plate 34 and the second support plate 35 can lift the wafer 15. The second base 31 can be raised and lowered and rotated, and the second base 31 is raised and lowered by a screw rod, and the second base 31 is rotated by a servo motor. The first mechanical arm 32 and the second mechanical arm 33 can move on the second base 31. The first support plate 34 and the second support plate 35 can lift the wafer 15 and then take the wafer 15 out. Preferably, the first support plate 34 and the second support plate 35 are both provided with a vacuum suction hole 36, which is connected to a vacuum pump through a first pipe. After the first support plate 34 and the second support plate 35 lift the wafer 15, the vacuum suction hole 36 sucks the wafer 15 to prevent the wafer 15 from falling and shifting during movement. Preferably, the vacuum hole 36 can be used for suction or blowing, and the air pressure of suction and blowing can be set according to needs. Fig. 9As shown, the first support plate 34 and the second support plate 35 are heating plates 310, and the heating plates 310 include metal plates 311 and a U-shaped metal heating frame 315 sandwiched between the metal plates 311. The vacuum suction hole 36 is arranged on the metal plate 311, and the first pipe is arranged on the inner side of the metal plate 311. The metal heating frame 315 can be powered on for heating, and the U-shaped structure is convenient for connecting wires. The metal plate 311 is polished and has a very smooth surface. This design can avoid scratching the wafer 15, and at the same time, after polishing, it can prevent the wafer 15 from sliding on the metal plate 311. The wafer 15 and the metal plate 311 are very smooth, and the wafer 15 is prevented from sliding on the first support plate 34 and the second support plate 35 through the negative pressure effect, intermolecular force, adhesion phenomenon, etc. The metal heating frame 315 can generate heat after being powered on, so that the metal plate 311 can also be heated. This design can make the temperature of the metal plate 311 close to or the same as the temperature of the heated wafer 15. The influence of the temperature of the first support plate 34 and the second support plate 35 on the wafer 15 is reduced. After the wafer 15 is taken out, it is uniformly cooled on the positioning frame 21, which can better ensure the quality of annealing.

[0037] Preferably, a plurality of layers 23 are arranged in the positioning frame 21, and a third positioning column 24 is arranged on the layer plate 23, and the wafer 15 is placed on the layer plate 23; the third positioning column 24 blocks the outer periphery of the wafer 15, and the third positioning column 24 positions the wafer 15. The layer plate 23 is arranged in the positioning frame 21 by screws or clamping. The layer plate 23 has multiple layers, so multiple layers of wafers 15 can be placed in the positioning frame 21. The column body of the third positioning column 24 is cylindrical, and the top of the third positioning column 24 is hemispherical or arc-shaped. This design facilitates the wafer 15 to be limited by the third positioning column 24. Two third positioning columns 24 are arranged on the layer plate 23 in this embodiment. The four third positioning columns 24 limit the four sides of the wafer 15, so that the wafer 15 can be positioned, so as to facilitate the subsequent accurate loading of the wafer 15. The wafer cooling station 20 is also provided with a CCD camera, which faces the wafer and detects the wafer.

[0038] Preferably, a gas nozzle 25 is provided on the side of the positioning frame 21, and the gas nozzle 25 sprays nitrogen to cool the wafer 15 on the positioning frame 21; and a plurality of rows of air holes 22 are provided on the positioning frame 21 to cool the wafer. The layer plate 23 separates the upper and lower rows of air holes 22, and the air holes 22 are connected to the second pipeline. The air holes 22 spray cooling gas to cool each layer of the wafer 15. The upper and lower surfaces of each layer of the wafer 15 can be cooled by the gas sprayed by the air holes 22. This design enables the wafer 15 to be cooled quickly and evenly, ensuring the cooling quality. The air holes 22 can spray nitrogen to cool the wafer 15. The second pipeline and the gas nozzle 25 are connected to the gas cabinet, and the gas cabinet provides nitrogen and / or air. The gas cabinet in this embodiment provides nitrogen, and the quality of nitrogen cooling is better and the cooling is faster. There are several columns of gas nozzles 25, and each positioning frame 21 corresponds to at least two columns of gas nozzles 25. There are at least three gas nozzles 25 in each column. The gas nozzle 25 sprays nitrogen to cool the wafer 15. Each row of gas nozzles 25 and gas holes 22 can be individually controlled by a solenoid valve.

[0039] Preferably, the loading mechanism 40 also includes a first linear module 41; a carrying plate 43 is arranged on the first linear module 41, and at least three ejector pins 44 are arranged on the carrying plate 43, and the ejector pins 44 can pass through the carrier assembly 410. The first linear module 41 is a module driven by a screw servo motor. In this embodiment, three ejector pins 44 are grouped together and arranged in an equilateral triangle, that is, three ejector pins 44 lift up a wafer 15. This structure helps to ensure the stability of the wafer 15. A third sensor 42 is provided on the track of the first linear module 41, which can be used to determine the position of the carrying plate 43, and then control the lifting and lowering amplitude of the ejector pin 44. The robot 30 holds the wafer 15 and then gently places it on the ejector pin 44. This design can prevent the wafer 15 from shifting with good precision.

[0040] Please refer to Figure 5 , Fig.10As shown, preferably, the process furnace 50 further includes a door lock device 511, which includes a first lock rod 512 arranged on the furnace body 520, a second lock rod 513 and a lock buckle 515 arranged on the furnace door 510, and a push rod 516 connected to the furnace door 510, wherein the lock buckle 515 is buckled on the first lock rod 512, so that the first lock rod 512 and the second lock rod 513 are pressed together; and the push rod 516 drives the furnace door 510 to open or close. In this embodiment, at least one of the first lock rod 512 and the second lock rod 513 is provided with an elastic rubber shell, which can enhance the firmness of the closure. A sealing groove is provided at the opening of the furnace body 520, and a high temperature resistant sealing ring is provided in the sealing groove. A sealing block is provided on the inner side of the furnace door 510, and when the furnace door 510 is closed, the sealing block presses the sealing ring, thereby ensuring the sealing of the process furnace 50. The inner wall of the process furnace 50 can be evacuated. When the wafer 15 is heated, the process furnace 50 is evacuated and nitrogen is injected for protection. The lock 515 is driven by the first cylinder 514 to move. When the furnace door 510 is closed, the first locking rod 512 and the second locking rod 513 are pressed together, and the lock 515 is hooked on the first locking rod 512, so that the tightness of the furnace door 510 can be ensured to prevent air leakage. The push rod 516 is driven by the second cylinder, and the push rod 516 drives the furnace door 510 to open or close.

[0041] Preferably, the carrier assembly 410 includes a quartz support 411, a silicon carbide carrier 413, and a first thermometer 415; the first thermometer 415 is arranged on the quartz support 411; the quartz support 411 is arranged on the furnace door 510; the quartz support 411 is provided with a supporting ear 412, and the supporting ear 412 supports the silicon carbide carrier 413; the silicon carbide carrier 413 is provided with a second wafer groove 414, and the wafer 15 is placed in the second wafer groove 414, and the ejector pin 44 can pass through the second wafer groove 414 to lift the wafer 15. Stone has good heat resistance and is not easy to break due to temperature changes. Preferably, the quartz support 411 is artificially made. A metal frame made of high-temperature alloy material is arranged inside the quartz support 411, and this design can prevent the quartz support from breaking. Quartz glass has a wide range of heat-resistant temperatures, and the commonly used temperature is 1100°C to 1200°C, and the short-term use temperature can even reach 1400°C. Silicon carbide is a material with good thermal conductivity. Silicon carbide has a high thermal conductivity, specifically about 150 W / mK, which makes it perform well in high-temperature environments and can effectively conduct heat. The first thermometer 415 can be used to detect the temperature inside the furnace and the quartz bracket 411. A ceramic mounting frame is provided on the inner side of the furnace door 510. The main body of the quartz bracket 411 is a frame-shaped structure, and at least two mounting feet extend from the main body. The mounting feet are inserted into the ceramic mounting frame on the inner side of the furnace door 510, and bolts or latches lock the mounting feet and the ceramic mounting frame 418 together. The ceramic mounting frame has good heat resistance, is easy to install, and reduces the impact of temperature on the furnace door 510. The supporting ear 412 provided on the quartz bracket 411 has a fourth positioning column 416. The supporting ear 412 supports the silicon carbide carrier 413, and the fourth positioning column is inserted into the silicon carbide carrier 413 to prevent the silicon carbide carrier 413 from moving. The supporting ear 412 is integrally formed from the quartz bracket 411. This structure has good temperature stability and will not loosen. An avoidance hole 417 is provided on the groove wall of the first wafer groove 17, and the ejector pin 44 can pass through the avoidance hole 417. When the silicon carbide carrier 413 needs to be replaced, it is only necessary to lift the silicon carbide carrier 413. This assembly structure is very simple and easy to disassemble and assemble.

[0042] Preferably, the inner wall of the furnace body 520 is plated with a metal reflective layer; the upper inner wall and the lower inner wall of the furnace body 520 are provided with a heating element 528; the furnace body 520 is provided with a second thermometer 527, and the furnace body 520 is provided with a vacuum interface, a cooling exhaust port, and a protective gas injection port connected to the chamber 524 inside the furnace body 520. The reflective layer is a gold-plated layer, which has a good heat reflection effect. The vacuum interface and the protective gas injection port can be controlled by a solenoid valve to evacuate or inject protective gas, that is, a hole is opened on the furnace body to complete the vacuum and gas injection. Preferably, an insulating layer is also provided between the reflective layer and the furnace wall, and the insulating layer is ceramic fiber or aluminum silicate fiber, which can improve the insulation performance, prevent the furnace body 520 from overheating, and save more energy. Therefore, the gold-plated layer and the insulating layer cooperate to achieve energy saving and temperature control. Among them, gold is plated on the ceramic by chemical plating or vacuum plating. The furnace body 520 includes a furnace body 521, an upper furnace plate 522, and a lower furnace plate 523, and the upper furnace plate 522 and the lower furnace plate 523 are fastened to the furnace body 521. The furnace body 521, the upper furnace plate 522, and the lower furnace plate 523 are internally penetrated with a liquid cooling tube 529, and the liquid cooling tube can cool the process furnace 50. The heating element 528 is a halogen infrared lamp tube, which has an extremely fast heating rate, and the process range covers 25-1250°C. In this embodiment, the upper inner wall and the lower inner wall of the furnace body 520 are provided with a heating element 528, and of course, the inner side wall of the furnace body 520 can also be provided with a heating element. The second thermometer 527 is arranged at the bottom of the furnace body 520 to measure the problem in the furnace body 520. The second thermometer 527 is inserted into the furnace body 520 from the bottom of the process furnace 50 to ensure the temperature measurement accuracy. The first thermometer 415 and the second thermometer 527 can cooperate to more accurately measure the temperature in the furnace. The furnace body 520 is also provided with a cooling tube 525, which spans the upper and lower sides of the quartz support 411. The cooling tube 525 is provided with a plurality of exhaust holes 526, and the hot gas in the furnace is extracted from the exhaust holes 526 by the air pump, so that the temperature in the furnace can be well controlled. Since the cooling tube 525 spans the upper and lower sides of the quartz support 411, the hot gas in the furnace can be directly extracted when exhausting, and the temperature in the furnace can be quickly controlled. In particular, the cooling tube 525 under this design can control the temperature of the wafer 15 very sensitively, which helps to ensure the temperature of the wafer 15 and the quality of heating the wafer 15. The cooling tube 525 can be exhausted by exhausting at one end or at both ends. Among them, the aperture of the exhaust hole 526 gradually decreases along the air flow direction. For example, when exhausting at both ends, the aperture of the exhaust hole 526 in the middle of the cooling tube 525 is the largest, and gradually decreases toward the two ends. For another example, when one-end extraction is adopted, the aperture of the farthest end of the cooling tube 525 is the largest and gradually becomes smaller along the airflow direction.The aperture of the exhaust hole 526 gradually decreases along the direction of the air flow. This structure can play a role in regulating the air flow, which helps to make the exhaust in the entire furnace body 520 more uniform, the overall temperature will be more stable, the cooling effect will be better, and the temperature control will be more sensitive.

[0043] The vacuum interface is connected to a vacuum pump through a pipeline, and the vacuum pump evacuates the interior of the process furnace 50. After the vacuum is completed, the gas cabinet injects protective gas (nitrogen or inert gas) from the protective gas injection port. When the concentration of the protective gas reaches the requirement, the heating element 528 heats the wafer 15.

[0044] Preferably, there is one wafer boat platform 10, one wafer cooling station 20, and one robot 30, and a process furnace 50 and a loading mechanism 40 are arranged on both sides of the robot 30, and the wafer boat platform 10, the wafer cooling station 20, and the robot 30 are arranged between the process furnace 50 and the loading mechanism 40. This design has two process furnaces 50 and loading mechanisms 40, which cooperate with the wafer boat platform 10, the wafer cooling station 20, and the robot 30. This design can improve the utilization rate between the mechanisms and save equipment costs.

[0045] In summary, the design focus of the present invention is that its positioning frame 21 can hold multiple layers of wafers 15, and can position and cool many wafers 15 at the same time. This design helps to improve the efficiency of cooling and loading. At the same time, the ejector pin 44 loads the wafer 15 to the carrier assembly 410 by descending, which helps to ensure the accuracy of wafer loading and the wafer will not shift during the loading process. In addition, the single silicon carbide carrier 413 of the carrier assembly 410 can hold multiple wafers 15, and multiple wafers 15 can be heated at a time, which is more helpful to improve processing efficiency.

[0046] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A fully automatic rapid annealing device for wafers, characterized in that: Comprising a wafer boat platform; wafers are placed on the wafer boat platform; The robot is set on the side of the wafer boat platform, and the robot can transfer the wafer; The wafer cooling station is arranged beside the robot; the wafer cooling station comprises a positioning frame, and the positioning frame can hold one or more wafers; The loading mechanism is arranged at the side of the robot, and the loading mechanism includes a carrying plate and an ejector pin arranged on the carrying plate; the robot can load the wafer on the wafer boat platform onto the ejector pin; The process furnace is arranged beside the loading mechanism; the process furnace comprises a furnace body, a furnace door which can be opened and closed and arranged in the furnace body, a heating element arranged in the furnace body, and a tray assembly arranged in the furnace door; the ejector pin can load the wafer onto the tray assembly.

2. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: The wafer boat platform includes a first base plate, a wafer boat box, and a first sensor; a first positioning column and a second positioning column are arranged on the first base plate; a plurality of first wafer slots are arranged in the wafer boat box, and wafers are inserted into the first wafer slots; a flange is arranged on the wafer boat box; the wafer boat box is embedded between the first positioning column and the second positioning column, and the first positioning column blocks the flange; the first sensor faces the wafer in the wafer boat box.

3. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: The robot comprises a liftable second base, a first mechanical arm and a second mechanical arm arranged on the second base; a first support plate is arranged on the first mechanical arm, and a second support plate is arranged on the second mechanical arm; the first support plate and the second support plate can lift the wafer.

4. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: A plurality of layer plates are arranged in the positioning frame, and third positioning columns are arranged on the layer plates. The wafer is placed on the layer plates; the third positioning columns block the outer periphery of the wafer, and the third positioning columns position the wafer.

5. The fully automatic rapid annealing equipment for wafers according to claim 4, characterized in that: A gas nozzle is arranged on the side of the positioning frame, and the gas nozzle sprays nitrogen to cool the wafer on the positioning frame; a plurality of rows of air holes are arranged on the positioning frame to cool the wafer.

6. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: The feeding mechanism also includes a first linear module; a bearing plate is arranged on the first linear module, and at least three ejectors are arranged on the bearing plate, and the ejectors can pass through the carrier assembly.

7. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: The process furnace also includes a door locking device, which includes a first locking rod arranged on the furnace body, a second locking rod and a lock buckle arranged on the furnace door, and a sliding rod connected to the furnace door, the lock buckle is buckled on the first locking rod; the first locking rod and the second locking rod are pressed together; the sliding rod drives the furnace door to open or close.

8. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: The carrier assembly includes a quartz support, a silicon carbide carrier, and a first thermometer; the first thermometer is arranged on the quartz support; the quartz support is arranged on the furnace door; the quartz support is provided with a supporting ear, and the supporting ear supports the silicon carbide carrier; the silicon carbide carrier is provided with a second wafer groove, and the wafer is placed in the second wafer groove, and the ejector pin can pass through the second wafer groove to lift the wafer.

9. The fully automatic rapid annealing equipment for wafers according to claim 1, characterized in that: The inner wall of the furnace body is plated with a metal reflective layer; the inner wall of the furnace body is provided with a heating element; the furnace body is provided with a second thermometer, and the furnace body is provided with a vacuum interface, a cooling exhaust port, and a protective gas injection port connected to the chamber inside the furnace body.

10. A wafer full-automatic rapid annealing equipment according to any one of claims 1 to 9, characterized in that: There is one wafer boat platform, one wafer cooling station and one robot respectively. Process furnaces and loading mechanisms are arranged on both sides of the robot. The wafer boat platform, the wafer cooling station and the robot are arranged between the process furnaces and the loading mechanisms.

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