Semiconductor wafer processing positioning device and method

Abstract

The invention discloses a semiconductor wafer processing positioning device and method, and relates to the technical field of semiconductor wafer processing.The semiconductor wafer processing positioning device comprises a device main cabinet, a moving seat is slidably arranged in the middle of the top surface of the device main cabinet, and a wafer supporting platform is slidably arranged on the top surface of the moving seat; the wafer supporting platform fixes the semiconductor wafer through automatic adsorption or automatically releases adsorption of the semiconductor wafer, a positioning mechanism is arranged at the edge position of the top face of the device main cabinet, and the positioning mechanism collects edge feature points of the semiconductor wafer in real time. Controlling a moving seat and a wafer supporting platform to adjust the position of the semiconductor wafer based on the edge feature points of the semiconductor wafer; the position of the semiconductor wafer is adjusted by controlling the moving seat and the wafer supporting platform, the position deviation of the current semiconductor wafer is counteracted, the current semiconductor wafer is moved to the preset position, it is guaranteed that the position of the current semiconductor wafer is accurate when the current semiconductor wafer is machined, and the machining precision of the current semiconductor wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wafer processing positioning device and method. Background Art

[0002] During the processing of semiconductor wafers, its precise positioning is very important, because it will directly affect the accuracy and consistency of semiconductor wafer processing, thereby improving the performance and yield of the chip. Wafer processing positioning involves edge finding and center positioning of the wafer. Through precise positioning technology, the position of the wafer during the processing can be guaranteed to be accurate, avoiding processing errors and performance degradation caused by position deviation.

[0003] Existing semiconductor wafer processing positioning devices, for example, a semiconductor wafer positioning device and a semiconductor wafer processing positioning method disclosed in a patent application with publication number CN116598245A, include a base, a hydraulic push rod, a moving part and a mask sheet. A hydraulic push rod is fixedly mounted on the upper end of the base, and a moving part is fixedly mounted on the upper end of the hydraulic push rod. A rotating plate is rotatably mounted on the upper end of the base plate, and a driving groove is provided inside the upper end of the rotating plate. A driving motor is fixedly mounted on the upper end of the plate, and a driving wheel is fixedly mounted on the output end of the driving motor. The semiconductor wafer positioning device achieves positioning through mechanical collision, which is not suitable for use with brittle materials of semiconductor wafers, and the positioning is not accurate enough. Summary of the invention

[0004] In order to overcome the above technical problems, the purpose of the present invention is to provide a semiconductor wafer processing positioning device and method to solve the problem in the prior art that the semiconductor wafer is not accurately positioned during processing, resulting in poor processing consistency of the semiconductor wafer.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A first aspect of the present invention is to provide a semiconductor wafer processing positioning device, including a main cabinet of the device, a movable seat is slidably arranged in the middle position of the top surface of the main cabinet of the device, and a wafer support platform is slidably arranged on the top surface of the movable seat. The wafer support platform fixes or automatically releases the adsorption of semiconductor wafers by automatic adsorption. A positioning mechanism is arranged at the edge position of the top surface of the main cabinet of the device. The positioning mechanism collects edge feature points of the semiconductor wafer in real time, and controls the movable seat and the wafer support platform to adjust the position of the semiconductor wafer based on the edge feature points of the semiconductor wafer.

[0007] As a further solution of the present invention: the main cabinet of the device includes a main cabinet body, the top surface of the main cabinet body is fixedly connected with a Y-axis track, and the interior of the Y-axis track is installed with a Y-axis screw through a bearing.

[0008] As a further solution of the present invention: the moving seat includes two groups of X-axis tracks, and the bottom surfaces at both ends of the two groups of X-axis tracks are fixedly connected with track sliders, and the track sliders are matched with the Y-axis screw rod.

[0009] As a further solution of the present invention: the wafer supporting platform includes a movable plate, both ends of the bottom surface of the movable plate are fixedly connected with movable rails, the movable rails match the X-axis rails, a wafer disk is installed at the center position of the top surface of the movable plate, and an adsorption groove is opened on the top surface of the wafer disk.

[0010] As a further solution of the present invention: a synchronization mechanism is bolted to the center of the bottom surface of the movable plate, and an automatic adsorption mechanism is installed at the center of the bottom surface of the movable plate.

[0011] As a further solution of the present invention: the positioning mechanism includes a movable cross arm, both ends of the movable cross arm are fixedly connected with movable columns, the bottom end of the movable column is provided with a fixed seat, the top of the fixed seat is installed with a fixed track, the fixed track is movably connected to the bottom end of the movable column, one side of the movable cross arm is provided with a mechanism track, a positioning monitoring mechanism is provided in the mechanism track, the bottom of the movable column is fixedly connected with a piston rod, and the outer side of the piston rod is nested with a cylinder shell.

[0012] As a further solution of the present invention: the positioning monitoring mechanism includes a mechanism body, a mounting plate is fixedly connected to the inner side of the mechanism body, a movable slider is fixedly connected to the side of the mounting plate away from the mechanism body, a hydraulic push rod is installed at the top of the mechanism body, and a collection component is connected to the bottom of the hydraulic push rod.

[0013] As a further solution of the present invention: a movable collecting head is installed at the center of the bottom surface of the collecting component, and fixed collecting heads are installed at both sides of the bottom surface of the collecting component close to the movable collecting head.

[0014] As a further solution of the present invention: the automatic adsorption mechanism includes a support seat, a pressure column is inserted into the top surface of the support seat, the bottom end of the pressure column is connected to a spring column, and a side connecting groove is opened inside the support seat near the side of the pressure column, and the side connecting groove is connected to the bottom environment of the support seat.

[0015] A second aspect of the present invention is to provide a semiconductor wafer processing positioning method, which is implemented based on the above-mentioned semiconductor wafer processing positioning device and includes the following steps:

[0016] S1: The semiconductor wafer is transported to the top surface of the wafer support platform by a robotic arm, and the wafer support platform automatically adsorbs and fixes the semiconductor wafer by negative pressure;

[0017] S2: The positioning mechanism moves to the top surface of the wafer support platform to collect edge feature points of the semiconductor wafer, where the number of edge feature points of the semiconductor wafer is at least three;

[0018] S3: According to the coordinates of the edge feature points of the three semiconductor wafers, the position of the semiconductor wafer is adjusted using the moving seat and the wafer supporting platform so that the semiconductor wafer reaches the set position;

[0019] S4: The positioning mechanism collects edge feature points of the semiconductor wafer again, and checks the accuracy of the movable seat and the wafer support platform in adjusting the semiconductor wafer through the edge feature points of the semiconductor wafer collected again.

[0020] Beneficial effects of the present invention:

[0021] 1. In the present invention, three edge feature points of a semiconductor wafer are collected by a positioning mechanism, and the three edge feature points are in different positions. Then, the coordinates of the three edge feature points are compared with the preset coordinate information of the semiconductor wafer to obtain the position deviation of the current semiconductor wafer. Then, the position of the semiconductor wafer is adjusted by controlling the moving seat and the wafer support platform to offset the position deviation of the current semiconductor wafer, so that the current semiconductor wafer is moved to the preset position, thereby ensuring the accurate position of the current semiconductor wafer during processing and improving the processing accuracy of the current semiconductor wafer.

[0022] 2. In the present invention, the elastic force provided by the spring column to the pressure column is greater than the gravity of the pressure column and less than the total gravity of the pressure column and the semiconductor wafer. When the semiconductor wafer is placed on the top surface of the wafer disk, the semiconductor wafer will press the pressure column downward. When the pressure column is pressed downward, on the one hand, the side connecting groove can be sealed, and on the other hand, the synchronization mechanism can be opened. Specifically, a group of electrodes can be installed between the pressure column and the spring column. When the pressure column moves downward, the electrodes of the synchronization mechanism will be connected, so that the synchronization mechanism will automatically open. The installation position of the electrode is specifically selected by technical personnel in this field according to the specifications of the pressure column and the spring column to ensure that the starting circuit of the synchronization mechanism can be activated after the pressure column moves downward. When the synchronization mechanism is opened, the synchronization mechanism can suck the air in the adsorption groove to form a negative pressure state inside the adsorption groove. The semiconductor wafer is affected by the air pressure and will also be tightly attached to the top surface of the moving plate to prevent the semiconductor wafer from sliding sideways on the top surface of the moving plate, thereby improving the stability of the semiconductor wafer on the top surface of the moving plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings:

[0024] Figure 1 It is a structural schematic diagram of the semiconductor wafer processing positioning device of the present invention;

[0025] Figure 2 is a top view of the semiconductor wafer processing positioning device of the present invention;

[0026] Figure 3 It is a structural schematic diagram of the main cabinet body of the device in the present invention;

[0027] Figure 4 It is a structural schematic diagram of the moving seat and the wafer supporting platform in the present invention;

[0028] Figure 5 It is a structural schematic diagram of the mobile seat in the present invention;

[0029] Figure 6 It is a structural schematic diagram of the wafer support platform in the present invention;

[0030] Figure 7 is a cross-sectional view of a wafer support platform in the present invention;

[0031] Figure 8 It is a schematic diagram of the internal structure of the automatic adsorption mechanism of the present invention;

[0032] Fig. 9 It is a structural schematic diagram of the positioning mechanism in the present invention;

[0033] Fig.10 It is a structural schematic diagram of the positioning monitoring mechanism in the present invention;

[0034] Fig.11 It is a front view of the positioning monitoring mechanism of the present invention;

[0035] Fig.12 It is a schematic diagram of the structure of the positioning monitoring mechanism in the present invention;

[0036] Fig.13 It is a bottom view of the positioning monitoring mechanism of the present invention;

[0037] Fig.14 It is a structural schematic diagram of the cylinder shell and the piston rod in the present invention.

[0038] Reference numerals: 1. device main cabinet; 11. main cabinet body; 12. Y-axis track; 13. Y-axis screw; 14. connecting groove; 2. moving seat; 21. X-axis track; 22. track slider; 23. connecting rod; 3. wafer support platform; 31. moving plate; 311. control board; 32. wafer plate; 33. adsorption groove; 34. moving track; 35. synchronization mechanism; 36. automatic adsorption mechanism; 361. support seat; 362. pressure column; 3621. column connecting groove; 363. Spring column; 364. Side connecting groove; 4. Positioning mechanism; 41. Moving cross arm; 42. Moving column; 43. Fixed seat; 44. Fixed track; 45. Positioning monitoring mechanism; 451. Mechanism body; 452. Mounting plate; 453. Moving slider; 454. Hydraulic push rod; 455. Collection component; 4551. Fixed collection head; 4552. Movable collection head; 456. Limiting slider; 46. Mechanism track; 47. Cylinder shell; 48. Piston rod. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Example 1

[0041] like Figure 1 - Fig.13As shown, the present invention discloses a semiconductor wafer processing positioning device, including a device main cabinet 1. The device main cabinet 1 is adaptively selected and installed by a person skilled in the art according to the processing process progress of the semiconductor wafer and the specifications of the semiconductor wafer. A movable seat 2 is slidably arranged at the middle position of the top surface of the device main cabinet 1, and a wafer supporting platform 3 is slidably arranged on the top surface of the movable seat 2. It should be noted that the wafer supporting platform 3 is used to carry semiconductor wafers, and the semiconductor wafers will be adsorbed and fixed by negative pressure to ensure that the semiconductor wafers will not deviate during the processing process, thereby improving the accuracy of semiconductor wafer processing. The movable seat 2 cooperates with the wafer supporting platform 3 to adjust the semiconductor wafer The horizontal position of the piece ensures that the semiconductor wafer is in the set processing station during processing. Technical personnel in this field can establish a plane rectangular coordinate system with the center position of the top surface of the device main cabinet 1 as the origin, and then determine the coordinate information of the semiconductor wafer according to the specifications of the semiconductor wafer, including the coordinate information of the edge points of the semiconductor wafer. The wafer support platform 3 automatically fixes or automatically releases the adsorption of the semiconductor wafer, and a positioning mechanism 4 is arranged at the edge position of the top surface of the device main cabinet 1. The positioning mechanism 4 collects the edge feature points of the semiconductor wafer in real time, and controls the moving seat 2 and the wafer support platform 3 to adjust the position of the semiconductor wafer based on the edge feature points of the semiconductor wafer.

[0042] When in use, first use a robotic arm or other equipment to transport the semiconductor wafer to the top surface of the wafer support platform 3. After the semiconductor wafer is placed on the wafer support platform 3, the wafer support platform 3 automatically absorbs and fixes the semiconductor wafer through negative pressure through the gravity sensing of the semiconductor wafer. Then the positioning mechanism 4 automatically moves to the top surface of the wafer support platform 3 to collect edge feature points of the semiconductor wafer. The positioning mechanism 4 can collect edge feature points of the semiconductor wafer through laser collection, image collection or infrared light, etc., which is specifically selected by technicians in this field according to the specifications of the positioning mechanism 4. The edge feature points of the semiconductor wafer collected by the positioning mechanism 4 can be brought into a plane straight line established with the center position of the top surface of the device main cabinet 1 as the origin. In the angular coordinate system, the coordinates of the edge feature points of the semiconductor wafer are obtained. In order to accurately obtain the position of the semiconductor wafer, the number of edge feature points collected should be no less than three, that is, the three edge feature points of the semiconductor wafer collected by the positioning mechanism 4, and the three edge feature points are in different positions, and then the coordinates of the three edge feature points are compared with the preset coordinate information of the semiconductor wafer to obtain the position deviation of the current semiconductor wafer, and then the position of the semiconductor wafer is adjusted by controlling the moving seat 2 and the wafer support platform 3 to offset the position deviation of the current semiconductor wafer, so that the current semiconductor wafer is moved to the preset position, ensuring the accurate position of the current semiconductor wafer during processing and improving the processing accuracy of the current semiconductor wafer.

[0043] like Figure 1 - Figure 3 As shown, the main cabinet 1 of the device includes a main cabinet body 11, the top surface of the main cabinet body 11 is fixedly connected with a Y-axis track 12, the interior of the Y-axis track 12 is installed with a Y-axis screw 13 through a bearing, and a connecting groove 14 is opened at the center of the top surface of the main cabinet body 11;

[0044] It should be noted that the Y-axis screw 13 can rotate freely inside the Y-axis track 12. A motor is bolted to one end of the Y-axis track 12. The output shaft of the motor is connected to the Y-axis screw 13 through a coupling and a worm gear reducer. When the motor is turned on, the output shaft of the motor directly drives the Y-axis screw 13 through the coupling and the worm gear reducer to rotate the Y-axis screw 13.

[0045] It should also be noted that an infrared sensor can be installed inside the main cabinet body 11. The infrared sensor directly senses the position of the wafer support platform 3 through the connecting groove 14. When the robot arm or other equipment transports the semiconductor wafer to the top surface of the wafer support platform 3, the adjustment trajectory of the wafer support platform 3 is collected by the infrared sensor and recorded. Then, when the robot arm or other equipment transports the semiconductor wafer to the top surface of the wafer support platform 3 again, the position of the semiconductor wafer is directly adjusted according to the adjustment trajectory of the wafer support platform 3 collected by the infrared sensor, thereby improving the efficiency of semiconductor wafer position adjustment.

[0046] like Figure 3 , Figure 4 and Figure 5 As shown, the moving seat 2 includes two groups of X-axis rails 21, and the bottom surfaces of both ends of the two groups of X-axis rails 21 are fixedly connected with rail sliders 22, and the rail sliders 22 are matched with the Y-axis screw 13. It should be noted that the inner side of the rail slider 22 is provided with a thread groove that matches the Y-axis screw 13. When the motor is turned on, the output shaft of the motor will directly drive the Y-axis screw 13 through the coupling and the worm gear reducer to rotate the Y-axis screw 13. The rotating Y-axis screw 13 will cooperate with the rail slider 22 to move the rail slider 22 along the axis direction of the Y-axis screw 13. The moving rail slider 22 will drive the two groups of X-axis rails 21, so that the two groups of X-axis rails 21 can move along the axis direction of the Y-axis screw 13, realizing the automatic movement of the two groups of X-axis rails 21. The two groups of X-axis rails 21 are fixedly connected by a connecting rod 23 to ensure that the two groups of X-axis rails 21 move synchronously.

[0047] It should also be noted that the Y-axis screw 13 and the track slider 22 here use a screw nut transmission method, and an electric push rod method can also be used. The specific selection is made by technical personnel in this field according to the specific specifications of the main cabinet 1 of the device to ensure that the two sets of X-axis tracks 21 can move along the Y-axis direction.

[0048] like Figure 5 and Figure 6 As shown, the wafer supporting platform 3 includes a movable plate 31, and movable rails 34 are fixedly connected at both ends of the bottom surface of the movable plate 31, and the movable rails 34 match the X-axis rail 21. A wafer disk 32 is installed at the center position of the top surface of the movable plate 31, and an adsorption groove 33 is provided on the top surface of the wafer disk 32. It should be noted that the driving between the movable rail 34 and the X-axis rail 21 can adopt a lead screw nut method or an electric push rod method to ensure that the movable plate 31 can move along the X-axis direction on the X-axis rail 21 through the movable rail 34. The specific method is adaptively selected by technical personnel in this field according to the specific actual situation.

[0049] like Figure 7 As shown, a synchronization mechanism 35 is bolted to the center of the bottom surface of the moving plate 31 , and an automatic adsorption mechanism 36 is installed at the center of the bottom surface of the moving plate 31 .

[0050] It should be noted that the output end of the synchronization mechanism 35 is connected to the adsorption groove 33, and the top surface of the movable plate 31 is connected to the control board 311 through a push rod, and the top surface of the control board 311 is connected to the wafer disk 32 through the push rod. When the push rod between the movable plate 31 and the control board 311 is opened, the push rod can drive the control board 311 to move the control board 311 on the top surface of the movable plate 31. When the push rod between the control board 311 and the wafer disk 32 is opened, the push rod can drive the wafer disk 32 to move the wafer disk 32 on the top surface of the movable plate 31. In this way, the wafer disk 32 can be transported to the front of the main cabinet body 11, which is convenient for the placement and picking of semiconductor wafers on the wafer disk 32.

[0051] Example 2

[0052] like Figure 6 , Figure 7 and Figure 8 As shown, the automatic adsorption mechanism 36 includes a support seat 361, a pressure column 362 is inserted into the top surface of the support seat 361, the bottom end of the pressure column 362 is connected to a spring column 363, and a side connecting groove 364 is opened inside the support seat 361 near the side position of the pressure column 362, and the side connecting groove 364 is connected to the external environment.

[0053] It should be noted that the elastic force provided by the spring column 363 for the pressure column 362 is greater than the gravity of the pressure column 362 and less than the total gravity of the pressure column 362 and the semiconductor wafer. When the semiconductor wafer is placed on the top surface of the wafer disk 32, the semiconductor wafer will press the pressure column 362 downward. When the pressure column 362 is pressed downward, the column connecting groove 3621 on the side of the pressure column 362 will be connected to the inner end of the side connecting groove 364, so that the column connecting groove 3621 can be connected to the bottom environment of the support seat 361 through the side connecting groove 364.

[0054] Example 3

[0055] like Fig. 9 - Fig.13 As shown, the positioning mechanism 4 includes a movable cross arm 41, and both ends of the movable cross arm 41 are fixedly connected with movable columns 42, the bottom end of the movable column 42 is provided with a fixed seat 43, the top of the fixed seat 43 is installed with a fixed track 44, the fixed track 44 is movably connected to the bottom end of the movable column 42, and a mechanism track 46 is opened on the front side of the movable cross arm 41, and a positioning monitoring mechanism 45 is arranged in the mechanism track 46.

[0056] It should be noted that the fixed seat 43 is fixedly installed on the top surface of the main cabinet body 11 by bolts, and the fixed rail 44 can be installed on the top of the fixed seat 43 by bearings. The fixed rail 44 can be a screw, and a drive motor can be connected to one end of the fixed seat 43 by bolts. The output shaft of the drive motor is directly connected to one end of the screw through a coupling and a worm gear reducer. When the drive motor is turned on, the output shaft of the drive motor can transmit power to the screw through the coupling and the worm gear reducer to drive the screw to rotate. It should also be noted that a ball nut that fits the screw is installed at the bottom end of the movable column 42, and the ball nut is nested on the outside of the screw. When the screw rotates, the rotating screw will drive the ball nut to move, and the moving ball nut will drive the movable cross arm 41 through the movable column 42, so that the movable cross arm 41 can move along the axial direction of the screw.

[0057] The driving mode of the mechanism track 46 and the positioning monitoring mechanism 45 is the same as that of the movable column 42 and the fixed track 44. Both are driven by a lead screw nut to ensure that the positioning monitoring mechanism 45 can move along the track direction of the mechanism track 46. No further details will be given here.

[0058] like Fig. 9 - Fig.13 As shown, the positioning monitoring mechanism 45 includes a mechanism body 451, a mounting plate 452 is fixedly connected to the inner side of the mechanism body 451, a moving slider 453 is fixedly connected to the side of the mounting plate 452 away from the mechanism body 451, a hydraulic push rod 454 is installed on the top of the mechanism body 451, and a collection component 455 is connected to the bottom end of the hydraulic push rod 454. It should be noted that the hydraulic push rod 454 can directly drive the collection component 455 to adjust the position of the collection component 455 so that the collection component 455 can more accurately collect the edge position points of the semiconductor wafer, and a limiting slider 456 is fixedly connected to one side of the collection component 455. A limiting slide groove matching the limiting slider 456 is provided on the inner side surface of the mechanism body 451 near the limiting slider 456, and the stability of the collection component 455 during movement is ensured by the cooperation between the limiting slider 456 and the limiting slide groove.

[0059] like Fig. 9 - Fig.13 As shown, an active collection head 4552 is installed at the center position of the bottom surface of the collection component 455, and fixed collection heads 4551 are installed on both sides of the bottom surface of the collection component 455 close to the active collection head 4552. It should be noted that the active collection head 4552 and the fixed collection heads 4551 on both sides can collect the edge position point coordinates of three semiconductor wafers in total. It should also be noted that the active collection head 4552 can adjust the position according to the specifications of the semiconductor wafer, so that the collection component 455 can collect semiconductor wafers of different specifications to improve adaptability. In addition, when the active collection head 4552 and the fixed collection heads 4551 on both sides collect semiconductor wafers of the same specification, the position does not need to be adjusted, and it is sufficient to ensure that the active collection head 4552 and the fixed collection heads 4551 on both sides are on the edge arc of the semiconductor wafer. The active collection head 4552 and the fixed collection heads 4551 on both sides can be laser sensors, cameras or infrared sensors, etc., and the specific selection is made by those skilled in the art according to the specific semiconductor wafer processing technology.

[0060] When the semiconductor wafer is placed on the wafer support platform 3, the acquisition component 455 can move to the top surface of the wafer support platform 3 and acquire the coordinates of the three edge position points of the semiconductor wafer in real time, and compare the real-time acquired coordinates of the three edge position points of the semiconductor wafer with the preset coordinate information of the semiconductor wafer to determine the position deviation of the semiconductor wafer, and then move the semiconductor wafer through the moving seat 2 and the wafer support platform 3 to offset the position deviation of the semiconductor wafer, so that the position of the semiconductor wafer is at the preset position, thereby ensuring the accuracy of the processing position of the semiconductor wafer.

[0061] like Figure 1-Figure 14As shown, the bottom end of the movable column 42 is connected to a piston rod 48 near the inner cavity of the main cabinet body 11, and a cylinder shell 47 is nested on the outer side of the piston rod 48. One end of the cylinder shell 47 is fixedly connected to the inner wall of the main cabinet body 11. The cylinder shell 47 is connected to the inner cavity of the synchronization mechanism 35 through the air pipe passing through the connecting groove 14. When the movable column 42 moves, the movable column 42 will drive the piston rod 48 at the bottom to move. The moving piston rod 48 will increase the volume of the inner cavity of the cylinder shell 47 through the piston, thereby reducing the air pressure in the inner cavity of the cylinder shell 47. Since the cylinder shell 47 is connected to the inner cavity of the synchronization mechanism 35 through the air pipe, the synchronization mechanism 35 5 will also reduce the air pressure in the inner cavity. At this time, since the synchronization mechanism 35 is connected to the bottom environment of the support seat 361, the synchronization mechanism 35 can reduce the air pressure in the bottom environment of the support seat 361. Since the column connecting groove 3621 is connected to the bottom environment of the support seat 361 through the side connecting groove 364, the air pressure in the adsorption groove 33 will be reduced, so that the semiconductor wafer is adsorbed on the top surface of the wafer disk 32 to ensure the temperature of the semiconductor wafer. In addition, it should be noted that a one-way valve is provided inside the synchronization mechanism 35 to prevent the air in the air pipe from entering the bottom environment of the support seat 361 through the one-way valve inside the synchronization mechanism 35.

[0062] When the semiconductor wafer needs to be taken away after the processing process is completed, the push rod between the movable plate 31 and the control board 311 is opened, and the push rod can drive the control board 311 to move the control board 311 on the top surface of the movable plate 31. The push rod between the control board 311 and the wafer disc 32 is opened, and the push rod can drive the wafer disc 32 to move the wafer disc 32 on the top surface of the movable plate 31, so that the wafer disc 32 can be transported to the front of the main cabinet body 11. When the wafer disc 32 and the control board 311 are misaligned, the bottom of the adsorption groove 33 is in a suspended state, so the air pressure of the adsorption groove 33 is automatically restored, ensuring that the semiconductor wafer automatically releases the adsorption force, which is convenient for taking the semiconductor wafer. After placing a new semiconductor wafer, when the wafer disc 32 returns to the top surface of the control board 311, the control board 311 and the semiconductor wafer will reseal the adsorption groove 33 to ensure that the adsorption groove 33 can adsorb a new semiconductor wafer again.

[0063] Example 4

[0064] like Figure 1 - Fig.13 As shown, the present invention discloses a semiconductor wafer processing positioning method, which is implemented based on the above-mentioned semiconductor wafer processing positioning device and includes the following steps:

[0065] S1: The semiconductor wafer is transported to the top surface of the wafer support platform 3 by a robot arm, and the wafer support platform 3 automatically adsorbs and fixes the semiconductor wafer by negative pressure.

[0066] Specifically, a plane rectangular coordinate system is established with the center position of the top surface of the main cabinet 1 of the device as the origin, and then the coordinate information of the semiconductor wafer, including the coordinate information of the edge points of the semiconductor wafer, can be determined according to the specifications of the semiconductor wafer. A robotic arm or other equipment is used to transport the semiconductor wafer to the top surface of the wafer support platform 3. The spring column 363 provides an elastic force for the pressure column 362, which is greater than the gravity of the pressure column 362 and less than the total gravity of the pressure column 362 and the semiconductor wafer. When the semiconductor wafer is placed on the top surface of the wafer disk 32, the semiconductor wafer will press the pressure column 362 downward. When the pressure column 362 is pressed downward, on the one hand, the side connection groove 364 can be sealed, and on the other hand, In order to open the synchronization mechanism 35, specifically, a group of electrodes can be installed between the pressure column 362 and the spring column 363. When the pressure column 362 moves downward, the electrodes of the synchronization mechanism 35 will be connected, so that the synchronization mechanism 35 will automatically open. The installation position of the electrode is specifically selected by technical personnel in this field according to the specifications of the pressure column 362 and the spring column 363 to ensure that the starting circuit of the synchronization mechanism 35 can be activated after the pressure column 362 moves downward. When the synchronization mechanism 35 is opened, the synchronization mechanism 35 can suck the air in the adsorption groove 33 to form a negative pressure state inside the adsorption groove 33. The semiconductor wafer will be affected by the air pressure and will also be tightly attached to the top surface of the movable plate 31.

[0067] S2: The positioning mechanism 4 moves to the top surface of the wafer supporting platform 3 to collect edge feature points of the semiconductor wafer. The number of edge feature points of the semiconductor wafer is at least three.

[0068] After turning on the drive motor, the output shaft of the drive motor can transmit power to the screw through the coupling and the worm gear reducer to drive the screw to rotate. It should also be noted that a ball nut that fits the screw is installed at the bottom end of the movable column 42, and the ball nut is nested on the outside of the screw. When the screw rotates, the rotating screw will drive the ball nut to move, and the moving ball nut will drive the movable cross arm 41 through the movable column 42, so that the movable cross arm 41 can move along the axial direction of the screw. The driving method of the mechanism track 46 and the positioning monitoring mechanism 45 is the same as that of the movable column 42 and the fixed track 44. Both are driven by a lead screw nut to ensure that the positioning monitoring mechanism 45 can move along the track direction of the mechanism track 46. No further details are given here to move the collection component 455 to the top surface of the semiconductor wafer, and the movable collection head 4552 and the two sides The fixed acquisition head 4551 can collect the edge position point coordinates of three semiconductor wafers in total. It should also be noted that the movable acquisition head 4552 can adjust its position according to the specifications of the semiconductor wafer, so that the acquisition component 455 can collect semiconductor wafers of different specifications to improve adaptability. In addition, the movable acquisition head 4552 and the fixed acquisition heads 4551 on both sides do not need to be adjusted when collecting semiconductor wafers of the same specifications. It is sufficient to ensure that the movable acquisition head 4552 and the fixed acquisition heads 4551 on both sides are on the edge arc of the semiconductor wafer. The movable acquisition head 4552 and the fixed acquisition heads 4551 on both sides can be laser sensors, cameras or infrared sensors, etc., which are specifically selected by technicians in this field according to the specific semiconductor wafer processing technology. The acquisition component 455 collects the three edge position point coordinates of the semiconductor wafer in real time.

[0069] S3: According to the coordinates of the edge feature points of the three semiconductor wafers, the position of the semiconductor wafer is adjusted using the moving seat 2 and the wafer supporting platform 3 so that the semiconductor wafer reaches the set position.

[0070] Specifically, the position deviation of the semiconductor wafer is determined by comparing the real-time collected coordinates of the three edge position points of the semiconductor wafer with the preset coordinate information of the semiconductor wafer, and then the semiconductor wafer is moved by the moving seat 2 and the wafer support platform 3 to offset the position deviation of the semiconductor wafer, so that the position of the semiconductor wafer is at the preset position, thereby ensuring the accuracy of the processing position of the semiconductor wafer.

[0071] S4: the positioning mechanism 4 collects edge feature points of the semiconductor wafer again, and checks the accuracy of the movable seat 2 and the wafer supporting platform 3 in adjusting the semiconductor wafer through the edge feature points of the semiconductor wafer collected again.

[0072] Specifically, after the moving seat 2 and the wafer supporting platform 3 complete the position adjustment of the semiconductor wafer, the positioning mechanism 4 is used again to collect the edge feature points of the semiconductor wafer, and the edge feature points of the semiconductor wafer collected again are compared with the preset coordinate information of the semiconductor wafer to determine whether the position of the semiconductor wafer is accurate, so as to verify the accuracy of the moving seat 2 and the wafer supporting platform 3 in adjusting the position of the semiconductor wafer.

[0073] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A semiconductor wafer processing positioning device, characterized in that: include: A main device cabinet (1); A movable seat (2) is slidably arranged at the middle of the top surface of the device main cabinet (1); A wafer support platform (3) is slidably arranged on the top surface of the movable seat (2), and the wafer support platform (3) fixes or releases the semiconductor wafer by automatic adsorption; A positioning mechanism (4) is arranged at the edge of the top surface of the main cabinet (1) of the device, and the positioning mechanism (4) collects edge feature points of the semiconductor wafer in real time, and controls the moving seat (2) and the wafer support platform (3) to adjust the position of the semiconductor wafer based on the edge feature points of the semiconductor wafer; The positioning mechanism (4) comprises a movable cross arm (41), both ends of the movable cross arm (41) are fixedly connected to movable columns (42), the bottom end of the movable column (42) is provided with a fixed seat (43), the top of the fixed seat (43) is provided with a fixed track (44), the fixed track (44) is movably connected to the bottom end of the movable column (42), one side of the movable cross arm (41) is provided with a mechanism track (46), and a positioning monitoring mechanism (45) is provided in the mechanism track (46); The positioning monitoring mechanism (45) comprises a mechanism body (451), the inner side of which is fixedly connected to a mounting plate (452), a side of the mounting plate (452) away from the mechanism body (451) being fixedly connected to a movable slider (453), a top end of the mechanism body (451) being mounted with a hydraulic push rod (454), a bottom end of the hydraulic push rod (454) being connected to a collection assembly (455), a movable collection head (4552) being mounted at the center of the bottom surface of the collection assembly (455), and fixed collection heads (4551) being mounted on both sides of the bottom surface of the collection assembly (455) close to the movable collection head (4552).

2. The semiconductor wafer processing positioning device according to claim 1, characterized in that: The main cabinet (1) of the device comprises a main cabinet body (11), the top surface of the main cabinet body (11) is fixedly connected with a Y-axis track (12), and a Y-axis screw (13) is installed inside the Y-axis track (12) via a bearing.

3. The semiconductor wafer processing positioning device according to claim 2, characterized in that: The moving seat (2) comprises two groups of X-axis rails (21), and the bottom surfaces at both ends of the two groups of X-axis rails (21) are fixedly connected with rail sliders (22), and the rail sliders (22) are matched with the Y-axis screw rod (13).

4. The semiconductor wafer processing positioning device according to claim 3, characterized in that: The wafer support platform (3) comprises a movable plate (31), the two ends of the bottom surface of the movable plate (31) are fixedly connected with movable rails (34), the movable rails (34) match the X-axis rails (21), a wafer disk (32) is installed at the center of the top surface of the movable plate (31), and an adsorption groove (33) is provided on the top surface of the wafer disk (32).

5. The semiconductor wafer processing positioning device according to claim 4, characterized in that: A synchronization mechanism (35) is bolted to the center of the bottom surface of the movable plate (31), and an automatic adsorption mechanism (36) is installed at the center of the bottom surface of the movable plate (31).

6. The semiconductor wafer processing positioning device according to claim 5, characterized in that: The automatic adsorption mechanism (36) comprises a support seat (361), a pressure column (362) is inserted into the top surface of the support seat (361), a spring column (363) is connected to the bottom end of the pressure column (362), and a side connection groove (364) is provided inside the support seat (361) near the side of the pressure column (362), and the side connection groove (364) is connected to the external environment.

7. A semiconductor wafer processing positioning method, implemented based on the semiconductor wafer processing positioning device according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1: transporting the semiconductor wafer to the top surface of the wafer support platform (3) by means of a robotic arm, and the wafer support platform (3) automatically adsorbs and fixes the semiconductor wafer by means of negative pressure; S2: The positioning mechanism (4) moves to the top surface of the wafer support platform (3) to collect edge feature points of the semiconductor wafer, where the number of edge feature points of the semiconductor wafer is at least three; S3: According to the coordinates of the edge feature points of the three semiconductor wafers, the position of the semiconductor wafer is adjusted using the moving seat (2) and the wafer supporting platform (3) so that the semiconductor wafer reaches the set position; S4: The positioning mechanism (4) collects edge feature points of the semiconductor wafer again, and checks the accuracy of the movable seat (2) and the wafer support platform (3) to adjust the semiconductor wafer through the edge feature points of the semiconductor wafer collected again.

Images