Semiconductor wafer processing positioning device and method

Abstract

This invention discloses a semiconductor wafer processing positioning device and method, relating to the field of semiconductor wafer processing technology. It includes a main cabinet, a movable base slidably disposed at the center of the top surface of the main cabinet, and a wafer support platform slidably disposed on the top surface of the movable base. The wafer support platform automatically adsorbs and fixes or automatically releases adsorption of semiconductor wafers. A positioning mechanism is disposed at the edge of the top surface of the main cabinet. The positioning mechanism collects edge feature points of the semiconductor wafer in real time and controls the movable base and wafer support platform to adjust the position of the semiconductor wafer based on these edge feature points. By controlling the movable base and wafer support platform to adjust the position of the semiconductor wafer, the current positional deviation of the semiconductor wafer is offset, moving the current semiconductor wafer to a preset position, ensuring accurate positioning of the current semiconductor wafer during processing, and improving the processing precision of the current semiconductor wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer processing technology, and more specifically to a semiconductor wafer processing positioning device and method. Background Technology

[0002] Precise positioning is crucial during semiconductor wafer fabrication, as it directly impacts the accuracy and consistency of wafer processing, thereby improving chip performance and yield. Wafer positioning involves edge finding and center positioning. Precise positioning technology ensures the wafer's accurate placement during processing, preventing errors and performance degradation caused by positional deviations.

[0003] Existing semiconductor wafer positioning devices, such as the semiconductor wafer positioning device and method disclosed in patent application CN116598245A, include a base, a hydraulic push rod, a moving component, and a photomask. The hydraulic push rod is fixedly mounted on the upper end of the base, and the moving component is fixedly mounted on the upper end of the hydraulic push rod. A rotating plate is rotatably mounted on the upper end of the base plate, and a drive groove is formed inside the upper end of the rotating plate. A drive motor is fixedly mounted on the upper end of the plate, and a drive wheel is fixedly mounted on the output end of the drive motor. This semiconductor wafer positioning device achieves positioning through mechanical collision, which is not suitable for the brittle materials of semiconductor wafers, and the positioning is not accurate enough. Summary of the Invention

[0004] In order to overcome the above-mentioned technical problems, the purpose of this invention is to provide a semiconductor wafer processing positioning device and method to solve the problem that inaccurate positioning of semiconductor wafers during processing leads to poor processing consistency in the prior art.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] The first aspect of the present invention is to provide a semiconductor wafer processing positioning device, including a main cabinet, a movable seat slidably disposed at the center of the top surface of the main cabinet, and a wafer support platform slidably disposed on the top surface of the movable seat. The wafer support platform automatically adsorbs and fixes or automatically releases adsorption of semiconductor wafers. A positioning mechanism is disposed at the edge of the top surface of the main cabinet. The positioning mechanism collects edge feature points of the semiconductor wafers in real time and controls the movable seat and the wafer support platform to adjust the position of the semiconductor wafers based on the edge feature points of the semiconductor wafers.

[0007] As a further aspect of the present invention: the main cabinet of the device includes a main cabinet body, and a Y-axis track is fixedly connected to the top surface of the main cabinet body. A Y-axis screw is installed inside the Y-axis track through a bearing.

[0008] As a further aspect of the present invention: the movable seat includes two sets of X-axis tracks, and track sliders are fixedly connected to the bottom surfaces of both ends of the two sets of X-axis tracks. The track sliders are engaged with the Y-axis screws.

[0009] As a further aspect of the present invention: the wafer support platform includes a movable plate, with movable tracks fixedly connected to both ends of the bottom surface of the movable plate, the movable tracks matching the X-axis track, and a wafer disk installed at the center of the top surface of the movable plate, with an adsorption groove formed on the top surface of the wafer disk.

[0010] As a further aspect of the present invention: a synchronization mechanism is bolted to the center of the bottom surface of the movable plate, and an automatic adsorption mechanism is installed at the center of the bottom surface of the movable plate.

[0011] As a further embodiment of the present invention: the positioning mechanism includes a movable horizontal arm, with movable columns fixedly connected to both ends of the movable horizontal arm, a fixed seat provided at the bottom end of the movable column, a fixed rail installed on the top of the fixed seat, the fixed rail being movably connected to the bottom end of the movable column, a mechanism rail opened on one side of the movable horizontal arm, a positioning monitoring mechanism provided inside the mechanism rail, a piston rod fixedly connected to the bottom of the movable column, and a cylinder shell nested on the outside of the piston rod.

[0012] As a further aspect of the present invention: the positioning and monitoring mechanism includes a main body, an installation plate fixedly connected to the inner side of the main body, a movable slider fixedly connected to the side of the installation plate away from the main body, a hydraulic push rod installed at the top of the main body, and a data acquisition component connected to the bottom end of the hydraulic push rod.

[0013] As a further aspect of the present invention: a movable acquisition head is installed at the center of the bottom surface of the acquisition component, and fixed acquisition heads are installed on both sides of the bottom surface of the acquisition component near the movable acquisition head.

[0014] As a further aspect of the present invention: the automatic adsorption mechanism includes a support base, a pressure column is inserted into the top surface of the support base, a spring column is connected to the bottom end of the pressure column, and a side connecting groove is provided inside the support base near the side of the pressure column, the side connecting groove being in communication with the bottom environment of the support base.

[0015] A second aspect of the present invention is to provide a semiconductor wafer processing positioning method, implemented based on the above-described semiconductor wafer processing positioning apparatus, comprising the following steps:

[0016] S1: The semiconductor wafer is transported to the top surface of the wafer support platform by a robotic arm, and the wafer support platform automatically adsorbs and fixes the semiconductor wafer by negative pressure;

[0017] S2: The positioning mechanism moves to the top surface of the wafer support platform and collects edge feature points of the semiconductor wafer. The number of edge feature points of the semiconductor wafer is at least three.

[0018] S3: Based on the coordinates of the edge feature points of the three semiconductor wafers, use the moving base and wafer support platform to adjust the position of the semiconductor wafers so that the semiconductor wafers reach the set position;

[0019] S4: The positioning mechanism re-collects the edge feature points of the semiconductor wafer, and uses the re-collected edge feature points of the semiconductor wafer to check the accuracy of the moving base and wafer support platform in adjusting the semiconductor wafer.

[0020] The beneficial effects of this invention are:

[0021] 1. In this invention, three edge feature points of a semiconductor wafer are collected by a positioning mechanism, and the three edge feature points are located at different positions. Then, the coordinates of the three edge feature points are compared with the preset coordinate information of the semiconductor wafer to obtain the current position deviation of the semiconductor wafer. Then, the position of the semiconductor wafer is adjusted by controlling the moving base and the wafer support platform to offset the current position deviation of the semiconductor wafer, so that the current semiconductor wafer moves to the preset position, ensuring the accurate position of the current semiconductor wafer during processing and improving the processing accuracy of the current semiconductor wafer.

[0022] 2. In this invention, the elastic force provided by the spring column to the pressure column is greater than the weight of the pressure column but less than the total weight of the pressure column and the semiconductor wafer. When the semiconductor wafer is placed on the top surface of the wafer disk, the semiconductor wafer will press the pressure column downward. When the pressure column presses downward, it can seal the side connection groove on the one hand and open the synchronization mechanism on the other. Specifically, a set of electrodes can be installed between the pressure column and the spring column. When the pressure column moves downward, it will connect the electrodes of the synchronization mechanism, so the synchronization mechanism will be automatically opened. The specific installation position of the electrodes can be adapted by those skilled in the art according to the specifications of the pressure column and the spring column, ensuring that the starting circuit of the synchronization mechanism can be activated after the pressure column moves downward. When the synchronization mechanism is opened, the synchronization mechanism can draw air from the adsorption groove, so that the inside of the adsorption groove forms a negative pressure state. The semiconductor wafer is affected by the air pressure and will also stick tightly to the top surface of the moving plate, preventing the semiconductor wafer from sliding on the top surface of the moving plate and improving the stability of the semiconductor wafer on the top surface of the moving plate. Attached Figure Description

[0023] The invention will now be further described with reference to the accompanying drawings:

[0024] Figure 1 This is a schematic diagram of the semiconductor wafer processing positioning device of the present invention;

[0025] Figure 2 This is a top view of the semiconductor wafer processing positioning device of the present invention;

[0026] Figure 3 This is a structural schematic diagram of the main cabinet of the device in this invention;

[0027] Figure 4 This is a schematic diagram of the structure of the moving base and wafer support platform in this invention;

[0028] Figure 5 This is a schematic diagram of the movable base in this invention;

[0029] Figure 6 This is a schematic diagram of the wafer support platform in this invention;

[0030] Figure 7 This is a cross-sectional view of the wafer support platform in this invention;

[0031] Figure 8 This is a schematic diagram of the internal structure of the automatic adsorption mechanism in this invention;

[0032] Figure 9 This is a schematic diagram of the positioning mechanism in this invention;

[0033] Figure 10 This is a schematic diagram of the positioning and monitoring mechanism in this invention;

[0034] Figure 11 This is the front view of the positioning and monitoring mechanism in this invention;

[0035] Figure 12 This is a schematic diagram of the upward-facing structure of the positioning and monitoring mechanism in this invention;

[0036] Figure 13 This is a bottom view of the positioning and monitoring mechanism in this invention;

[0037] Figure 14 This is a schematic diagram of the structure of the cylinder shell and piston rod in this invention.

[0038] Reference numerals: 1. Main cabinet; 11. Main cabinet body; 12. Y-axis track; 13. Y-axis screw; 14. Connecting slot; 2. Movable seat; 21. X-axis track; 22. Track slider; 23. Connecting rod; 3. Wafer support platform; 31. Movable plate; 311. Control board; 32. Wafer disk; 33. Adsorption tank; 34. Movable track; 35. Synchronization mechanism; 36. Automatic adsorption mechanism; 361. Support seat; 362. Pressure column; 3621. Column connecting slot; 363. Spring column; 364. Side connecting groove; 4. Positioning mechanism; 41. Moving cross arm; 42. Moving column; 43. Fixed seat; 44. Fixed track; 45. Positioning monitoring mechanism; 451. Mechanism body; 452. Mounting plate; 453. Moving slider; 454. Hydraulic push rod; 455. Acquisition assembly; 4551. Fixed acquisition head; 4552. Movable acquisition head; 456. Limit slider; 46. Mechanism track; 47. Cylinder housing; 48. Piston rod. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Example 1

[0041] like Figure 1 - Figure 13As shown, this invention discloses a semiconductor wafer processing positioning device, including a main cabinet 1. The main cabinet 1 is installed at a position adaptively selected by those skilled in the art based on the processing progress and specifications of the semiconductor wafers. A movable base 2 is slidably disposed at the center of the top surface of the main cabinet 1, and a wafer support platform 3 is slidably disposed on the top surface of the movable base 2. It should be noted that the wafer support platform 3 is used to support the semiconductor wafers and uses negative pressure to adsorb and fix the semiconductor wafers, ensuring that the semiconductor wafers do not shift during processing and improving the accuracy of semiconductor wafer processing. The movable base 2 works in conjunction with the wafer support platform 3 to adjust the semiconductor wafers. The horizontal position of the wafer ensures that the semiconductor wafer is in the set processing position during processing. Those skilled in the art can establish a plane rectangular coordinate system with the center of the top surface of the main cabinet 1 as the origin. Then, the coordinate information of the semiconductor wafer, including the coordinate information of the edge points of the semiconductor wafer, can be determined according to the specifications of the semiconductor wafer. The wafer support platform 3 automatically adsorbs and fixes or automatically releases the adsorption of the semiconductor wafer. A positioning mechanism 4 is set at the edge of the top surface of the main cabinet 1. The positioning mechanism 4 collects the edge feature points of the semiconductor wafer in real time. Based on the edge feature points of the semiconductor wafer, the moving seat 2 and the wafer support platform 3 are controlled to adjust the position of the semiconductor wafer.

[0042] In use, a robotic arm or other equipment is first used to transport the semiconductor wafer to the top surface of the wafer support platform 3. After the semiconductor wafer is placed on the wafer support platform 3, the platform automatically uses negative pressure to adsorb and fix the wafer by sensing its gravity. Then, the positioning mechanism 4 automatically moves to the top surface of the wafer support platform 3 to collect the edge feature points of the semiconductor wafer. The positioning mechanism 4 can collect the edge feature points of the semiconductor wafer through laser acquisition, image acquisition, or infrared light, etc. The specific method is selected by those skilled in the art according to the specifications of the positioning mechanism 4. The edge feature points of the semiconductor wafer collected by the positioning mechanism 4 can be used to establish a plane with the center of the top surface of the main cabinet 1 as the origin. In the angular coordinate system, the coordinates of the edge feature points of the semiconductor wafer are obtained. In order to accurately obtain the position of the semiconductor wafer, the number of edge feature points collected should not be less than three, that is, three edge feature points of the semiconductor wafer collected by the positioning mechanism 4, and the three edge feature points are in different positions. Then, the coordinates of the three edge feature points are compared with the preset coordinate information of the semiconductor wafer to obtain the current position deviation of the semiconductor wafer. Then, the position of the semiconductor wafer is adjusted by controlling the moving seat 2 and the wafer support platform 3 to offset the current position deviation of the semiconductor wafer, so that the current semiconductor wafer moves to the preset position, ensuring the accurate position of the current semiconductor wafer during processing and improving the processing accuracy of the current semiconductor wafer.

[0043] like Figure 1 - Figure 3 As shown, the main cabinet 1 of the device includes a main cabinet body 11. A Y-axis rail 12 is fixedly connected to the top surface of the main cabinet body 11. A Y-axis screw 13 is installed inside the Y-axis rail 12 through a bearing. A connecting groove 14 is opened at the center of the top surface of the main cabinet body 11.

[0044] It should be noted that the Y-axis screw 13 can rotate freely inside the Y-axis track 12. A motor is bolted to one end of the Y-axis track 12. The output shaft of the motor is connected to the Y-axis screw 13 through a coupling and a worm gear reducer. When the motor is turned on, the output shaft of the motor will directly drive the Y-axis screw 13 through the coupling and the worm gear reducer, causing the Y-axis screw 13 to rotate.

[0045] Additionally, it should be noted that an infrared sensor can be installed inside the main cabinet body 11. The infrared sensor directly senses the position of the wafer support platform 3 through the connecting slot 14. When the robotic arm or other equipment transports the semiconductor wafer to the top surface of the wafer support platform 3, the infrared sensor collects and records the adjustment trajectory of the wafer support platform 3. Then, when the robotic arm or other equipment transports the semiconductor wafer to the top surface of the wafer support platform 3 again, the position of the semiconductor wafer is directly adjusted according to the adjustment trajectory of the wafer support platform 3 collected by the infrared sensor, thereby improving the efficiency of semiconductor wafer position adjustment.

[0046] like Figure 3 , Figure 4 and Figure 5 As shown, the movable seat 2 includes two sets of X-axis rails 21. Rail sliders 22 are fixedly connected to the bottom surfaces of both ends of the two sets of X-axis rails 21. The rail sliders 22 engage with the Y-axis screw 13. It should be noted that the inner side of the rail sliders 22 has threaded grooves that engage with the Y-axis screw 13. When the motor is turned on, the motor's output shaft directly drives the Y-axis screw 13 through a coupling and a worm gear reducer, causing the Y-axis screw 13 to rotate. The rotating Y-axis screw 13 then cooperates with the rail sliders 22, causing the rail sliders 22 to move along the axis of the Y-axis screw 13. The moving rail sliders 22 then drive the two sets of X-axis rails 21, allowing the two sets of X-axis rails 21 to move along the axis of the Y-axis screw 13, thus achieving automatic movement of the two sets of X-axis rails 21. The two sets of X-axis rails 21 are fixedly connected by a connecting rod 23, ensuring synchronous movement of the two sets of X-axis rails 21.

[0047] It should also be noted that the Y-axis screw 13 and the track slider 22 here use a lead screw and nut transmission method, or an electric push rod method can be used. The specific method should be adapted by those skilled in the art according to the specific specifications of the main cabinet 1 of the device, so as to ensure that the two sets of X-axis tracks 21 can move along the Y-axis direction.

[0048] like Figure 5 and Figure 6 As shown, the wafer support platform 3 includes a movable plate 31. Movable rails 34 are fixedly connected to both ends of the bottom surface of the movable plate 31. The movable rails 34 are matched with the X-axis rail 21. A wafer disk 32 is installed at the center of the top surface of the movable plate 31. An adsorption groove 33 is opened on the top surface of the wafer disk 32. It should be noted that the drive between the movable rail 34 and the X-axis rail 21 can be achieved by using a lead screw and nut or an electric push rod, ensuring that the movable plate 31 can move along the X-axis direction on the X-axis rail 21 via the movable rail 34. The specific method can be adapted by those skilled in the art according to the specific actual situation.

[0049] like Figure 7 As shown, a synchronization mechanism 35 is bolted to the center of the bottom surface of the movable plate 31, and an automatic adsorption mechanism 36 is installed at the center of the bottom surface of the movable plate 31.

[0050] It should be noted that the output end of the synchronization mechanism 35 is connected to the adsorption tank 33. The top surface of the moving plate 31 is connected to the control plate 311 via a push rod. The top surface of the control plate 311 is connected to the wafer disk 32 via a push rod. When the push rod between the moving plate 31 and the control plate 311 is opened, the push rod can drive the control plate 311, causing the control plate 311 to move on the top surface of the moving plate 31. When the push rod between the control plate 311 and the wafer disk 32 is opened, the push rod can drive the wafer disk 32, causing the wafer disk 32 to move on the top surface of the moving plate 31. In this way, the wafer disk 32 can be transported to the front of the main cabinet body 11, which facilitates the picking and placing of semiconductor wafers on the wafer disk 32.

[0051] Example 2

[0052] like Figure 6 , Figure 7 and Figure 8 As shown, the automatic adsorption mechanism 36 includes a support base 361, a pressure column 362 is inserted into the top surface of the support base 361, a spring column 363 is connected to the bottom end of the pressure column 362, and a side connection groove 364 is provided inside the support base 361 near the side of the pressure column 362, and the side connection groove 364 is in communication with the external environment.

[0053] It should be noted that the elastic force provided by the spring post 363 to the pressure post 362 is greater than the weight of the pressure post 362 but less than the total weight of the pressure post 362 and the semiconductor wafer. When the semiconductor wafer is placed on the top surface of the wafer disk 32, the semiconductor wafer will press the pressure post 362 downward. When the pressure post 362 is pressed downward, the post connecting groove 3621 on the side of the pressure post 362 will connect with one end of the inner side of the side connecting groove 364. In this way, the post connecting groove 3621 can communicate with the bottom environment of the support base 361 through the side connecting groove 364.

[0054] Example 3

[0055] like Figure 9 - Figure 13 As shown, the positioning mechanism 4 includes a movable horizontal arm 41, with movable columns 42 fixedly connected to both ends of the movable horizontal arm 41. A fixed seat 43 is provided at the bottom end of the movable column 42, and a fixed rail 44 is installed on the top of the fixed seat 43. The fixed rail 44 is movably connected to the bottom end of the movable column 42. A mechanism rail 46 is provided on the front of the movable horizontal arm 41, and a positioning monitoring mechanism 45 is provided inside the mechanism rail 46.

[0056] It should be noted that the fixed base 43 is fixedly installed on the top surface of the main cabinet body 11 by bolts, while the fixed rail 44 can be installed on the top of the fixed base 43 by bearings. The fixed rail 44 can be a screw. A drive motor can be bolted to one end of the fixed base 43. The output shaft of the drive motor is directly connected to one end of the screw through a coupling and a worm gear reducer. When the drive motor is turned on, the output shaft of the drive motor can transmit power to the screw through the coupling and the worm gear reducer, driving the screw to rotate. In addition, it should be noted that a ball nut that fits with the screw is installed at the bottom of the movable column 42. The ball nut is nested on the outside of the screw. When the screw rotates, the rotating screw will drive the ball nut to move. The moving ball nut will drive the movable cross arm 41 through the movable column 42, so that the movable cross arm 41 can move along the axis of the screw.

[0057] The driving method of the mechanism track 46 and the positioning monitoring mechanism 45 is the same as that of the moving column 42 and the fixed track 44. They are all driven by a lead screw and nut to ensure that the positioning monitoring mechanism 45 can move along the track direction of the mechanism track 46. This will not be elaborated here.

[0058] like Figure 9 - Figure 13 As shown, the positioning monitoring mechanism 45 includes a main body 451. A mounting plate 452 is fixedly connected to the inner side of the main body 451. A movable slider 453 is fixedly connected to the side of the mounting plate 452 away from the main body 451. A hydraulic push rod 454 is installed at the top of the main body 451. A data acquisition component 455 is connected to the bottom of the hydraulic push rod 454. It should be noted that the hydraulic push rod 454 can directly drive the data acquisition component 455 and adjust the position of the data acquisition component 455 so that the data acquisition component 455 can more accurately acquire the edge position point of the semiconductor wafer. A limit slider 456 is fixedly connected to one side of the data acquisition component 455. A limit groove matching the limit slider 456 is opened on the inner side of the main body 451 near the limit slider 456. The stability of the data acquisition component 455 during movement is ensured by the cooperation between the limit slider 456 and the limit groove.

[0059] like Figure 9 - Figure 13 As shown, a movable acquisition head 4552 is installed at the center of the bottom surface of the acquisition component 455, and fixed acquisition heads 4551 are installed on both sides of the bottom surface of the acquisition component 455 near the movable acquisition head 4552. It should be noted that the movable acquisition head 4552 and the two fixed acquisition heads 4551 can collect the coordinates of three edge points of the semiconductor wafer. In addition, it should be noted that the position of the movable acquisition head 4552 can be adjusted according to the specifications of the semiconductor wafer, so that the acquisition component 455 can collect semiconductor wafers of different specifications, improving adaptability. Furthermore, when collecting semiconductor wafers of the same specifications, the positions of the movable acquisition head 4552 and the two fixed acquisition heads 4551 do not need to be adjusted, as long as the movable acquisition head 4552 and the two fixed acquisition heads 4551 are on the edge arc of the semiconductor wafer. The movable acquisition head 4552 and the two fixed acquisition heads 4551 can be laser sensors, cameras, or infrared sensors, etc., which can be selected by those skilled in the art according to the specific semiconductor wafer processing technology.

[0060] After the semiconductor wafer is placed on the wafer support platform 3, the acquisition component 455 can move to the top surface of the wafer support platform 3 and acquire the coordinates of the three edge positions of the semiconductor wafer in real time. Based on the real-time acquisition of the coordinates of the three edge positions of the semiconductor wafer and the preset coordinate information of the semiconductor wafer, the position deviation of the semiconductor wafer is determined. Then, the semiconductor wafer is moved by the moving base 2 and the wafer support platform 3 to compensate for the position deviation of the semiconductor wafer, so that the position of the semiconductor wafer is in the preset position, ensuring the accuracy of the processing position of the semiconductor wafer.

[0061] like Figures 1-14As shown, a piston rod 48 is connected to the bottom of the movable column 42 near the inner cavity of the main cabinet body 11. A cylinder housing 47 is nested on the outside of the piston rod 48. One end of the cylinder housing 47 is fixedly connected to the inner wall of the main cabinet body 11. The cylinder housing 47 is connected to the inner cavity of the synchronization mechanism 35 through an air pipe passing through the connecting groove 14. When the movable column 42 moves, it will drive the piston rod 48 at the bottom to move. The moving piston rod 48 will increase the volume of the inner cavity of the cylinder housing 47 through the piston, thereby reducing the air pressure in the inner cavity of the cylinder housing 47. Since the cylinder housing 47 is connected to the inner cavity of the synchronization mechanism 35 through an air pipe, the synchronization mechanism 35... The air pressure inside cavity 5 will also decrease. At this time, since the synchronization mechanism 35 is connected to the bottom environment of the support 361, the synchronization mechanism 35 can reduce the air pressure of the bottom environment of the support 361. Since the column connecting groove 3621 is connected to the bottom environment of the support 361 through the side connecting groove 364, the air pressure in the adsorption groove 33 will be reduced, so that the semiconductor wafer is adsorbed on the top surface of the wafer disk 32, ensuring the temperature of the semiconductor wafer. In addition, it should be noted that a one-way valve is set inside the synchronization mechanism 35 to prevent air in the air pipe from entering the bottom environment of the support 361 through the one-way valve inside the synchronization mechanism 35.

[0062] When the semiconductor wafer needs to be removed after processing, the push rod between the moving plate 31 and the control plate 311 is opened. This push rod drives the control plate 311 to move on the top surface of the moving plate 31. The push rod between the control plate 311 and the wafer disk 32 is also opened. This push rod drives the wafer disk 32 to move on the top surface of the moving plate 31. This allows the wafer disk 32 to be transported to the front of the main cabinet body 11. When the wafer disk 32 and the control plate 311 are misaligned, the bottom of the adsorption tank 33 is suspended. Therefore, the air pressure in the adsorption tank 33 is automatically restored, ensuring that the semiconductor wafer is automatically released from adsorption, making it easy to pick up the semiconductor wafer. When a new semiconductor wafer is placed, when the wafer disk 32 returns to the top surface of the control plate 311, the control plate 311 and the semiconductor wafer will reseal the adsorption tank 33, ensuring that the adsorption tank 33 can adsorb new semiconductor wafers again.

[0063] Example 4

[0064] like Figure 1 - Figure 13 As shown, this invention discloses a semiconductor wafer processing positioning method, implemented based on the aforementioned semiconductor wafer processing positioning device, comprising the following steps:

[0065] S1: The semiconductor wafer is transported to the top surface of the wafer support platform 3 by a robotic arm, and the wafer support platform 3 automatically adsorbs and fixes the semiconductor wafer by negative pressure.

[0066] Specifically, a Cartesian coordinate system is established with the center of the top surface of the main cabinet 1 as the origin. Then, the coordinate information of the semiconductor wafer, including the coordinates of its edge points, can be determined based on its specifications. A robotic arm or other equipment is used to transport the semiconductor wafer to the top surface of the wafer support platform 3. The spring force provided by the spring column 363 to the pressure column 362 is greater than the weight of the pressure column 362 but less than the total weight of the pressure column 362 and the semiconductor wafer. When the semiconductor wafer is placed on the top surface of the wafer disk 32, it presses the pressure column 362 downwards. When the pressure column 362 presses downwards, it seals the side connection groove 364 and, on the other hand,... To open the synchronization mechanism 35, a set of electrodes can be installed between the pressure column 362 and the spring column 363. When the pressure column 362 moves downward, it will connect the electrodes of the synchronization mechanism 35, and the synchronization mechanism 35 will automatically open. The specific installation position of the electrodes can be adapted by those skilled in the art according to the specifications of the pressure column 362 and the spring column 363, ensuring that the starting circuit of the synchronization mechanism 35 can be activated after the pressure column 362 moves downward. When the synchronization mechanism 35 is opened, it can draw air from the adsorption tank 33, so that the inside of the adsorption tank 33 forms a negative pressure state. The semiconductor wafer will be tightly attached to the top surface of the moving plate 31 due to the influence of air pressure.

[0067] S2: The positioning mechanism 4 moves to the top surface of the wafer support platform 3 and collects edge feature points of the semiconductor wafer. The number of edge feature points of the semiconductor wafer is at least three.

[0068] After the drive motor is turned on, the output shaft of the drive motor can transmit power to the screw through the coupling and worm gear reducer, driving the screw to rotate. It should also be noted that a ball nut that engages with the screw is installed at the bottom of the movable column 42. This ball nut is nested on the outside of the screw. When the screw rotates, the rotating screw will drive the ball nut to move, and the moving ball nut will drive the movable cross arm 41 through the movable column 42, allowing the movable cross arm 41 to move along the axis of the screw. The driving method of the mechanism track 46 and the positioning monitoring mechanism 45 is the same as that of the movable column 42 and the fixed track 44, all using a lead screw and nut drive to ensure that the positioning monitoring mechanism 45 can move along the track direction of the mechanism track 46. Further details are omitted here. This moves the acquisition component 455 to the top surface of the semiconductor wafer, and the movable acquisition head 4552 and the two sides... The fixed acquisition head 4551 can acquire the coordinates of three edge points of the semiconductor wafer. It should also be noted that the movable acquisition head 4552 can adjust its position according to the specifications of the semiconductor wafer, allowing the acquisition component 455 to acquire semiconductor wafers of different specifications, thus improving adaptability. Furthermore, when acquiring semiconductor wafers of the same specifications, the positions of the movable acquisition head 4552 and the two fixed acquisition heads 4551 do not need to be adjusted; they only need to be positioned on the edge arc of the semiconductor wafer. The movable acquisition head 4552 and the two fixed acquisition heads 4551 can be laser sensors, cameras, or infrared sensors, etc., selected by those skilled in the art based on the specific semiconductor wafer processing technology. The acquisition component 455 acquires the coordinates of the three edge points of the semiconductor wafer in real time.

[0069] S3: Based on the coordinates of the edge feature points of the three semiconductor wafers, the position of the semiconductor wafers is adjusted using the moving base 2 and the wafer support platform 3 so that the semiconductor wafers reach the set position.

[0070] Specifically, the coordinates of the three edge points of the semiconductor wafer are collected in real time and compared with the preset coordinate information of the semiconductor wafer to determine the positional deviation of the semiconductor wafer. Then, the semiconductor wafer is moved by the moving base 2 and the wafer support platform 3 to offset the positional deviation of the semiconductor wafer, so that the position of the semiconductor wafer is in the preset position, thus ensuring the accuracy of the processing position of the semiconductor wafer.

[0071] S4: The positioning mechanism 4 re-collects the edge feature points of the semiconductor wafer, and uses the re-collected edge feature points of the semiconductor wafer to check the accuracy of the moving base 2 and the wafer support platform 3 to adjust the semiconductor wafer.

[0072] Specifically, after the moving base 2 and the wafer support platform 3 have adjusted the position of the semiconductor wafer, the positioning mechanism 4 is used again to collect the edge feature points of the semiconductor wafer. The edge feature points of the semiconductor wafer collected again are compared with the preset coordinate information of the semiconductor wafer to determine whether the position of the semiconductor wafer is accurate, thereby verifying the accuracy of the moving base 2 and the wafer support platform 3 in adjusting the position of the semiconductor wafer.

[0073] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A semiconductor wafer processing positioning device, characterized in that, include: Main cabinet (1); The movable seat (2) is slidably positioned at the center of the top surface of the main cabinet (1) of the device; A wafer support platform (3) is slidably disposed on the top surface of a movable base (2). The wafer support platform (3) automatically adsorbs and fixes or automatically releases adsorbed semiconductor wafers. The positioning mechanism (4) is set at the top edge of the main cabinet (1) of the device. The positioning mechanism (4) collects edge feature points of the semiconductor wafer in real time and controls the moving seat (2) and the wafer support platform (3) to adjust the position of the semiconductor wafer based on the edge feature points of the semiconductor wafer. The positioning mechanism (4) includes a movable horizontal arm (41), with movable columns (42) fixedly connected to both ends of the movable horizontal arm (41). A fixed seat (43) is provided at the bottom end of the movable column (42), and a fixed rail (44) is installed on the top of the fixed seat (43). The fixed rail (44) is movably connected to the bottom end of the movable column (42). A mechanism rail (46) is opened on one side of the movable horizontal arm (41), and a positioning monitoring mechanism (45) is provided inside the mechanism rail (46). The positioning monitoring mechanism (45) includes a main body (451), an mounting plate (452) is fixedly connected to the inner side of the main body (451), a movable slider (453) is fixedly connected to the side of the mounting plate (452) away from the main body (451), a hydraulic push rod (454) is installed at the top of the main body (451), a data acquisition component (455) is connected to the bottom end of the hydraulic push rod (454), a movable data acquisition head (4552) is installed at the center of the bottom surface of the data acquisition component (455), and fixed data acquisition heads (4551) are installed on both sides of the bottom surface of the data acquisition component (455) near the movable data acquisition head (4552). A piston rod (48) is connected to the bottom of the movable column (42) near the inner cavity of the main cabinet body (11). A cylinder shell (47) is nested on the outside of the piston rod (48). One end of the cylinder shell (47) is fixedly connected to the inner wall of the main cabinet body (11). The cylinder shell (47) passes through the connecting groove (14) through the air pipe and is connected to the inner cavity of the synchronization mechanism (35). A one-way valve is set inside the synchronization mechanism (35). The wafer support platform (3) includes a movable plate (31), and movable rails (34) are fixedly connected to both ends of the bottom surface of the movable plate (31). The movable rails (34) are matched with the X-axis rails (21). A wafer disk (32) is installed at the center of the top surface of the movable plate (31), and an adsorption groove (33) is opened on the top surface of the wafer disk (32). A synchronization mechanism (35) is bolted to the center of the bottom surface of the movable plate (31), and an automatic adsorption mechanism (36) is installed at the center of the bottom surface of the movable plate (31). The automatic adsorption mechanism (36) includes a support base (361), a pressure column (362) is inserted into the top surface of the support base (361), a spring column (363) is connected to the bottom end of the pressure column (362), and a side connecting groove (364) is provided inside the support base (361) near the side of the pressure column (362), the side connecting groove (364) is in communication with the external environment. The side connecting groove (364) is connected to the external environment as follows: the side connecting groove (364) is connected to the bottom environment of the support base (361), and the column connecting groove (3621) is connected to the bottom environment of the support base (361) through the side connecting groove (364).

2. The semiconductor wafer processing positioning device according to claim 1, characterized in that, The main cabinet (1) of the device includes a main cabinet body (11), and a Y-axis rail (12) is fixedly connected to the top surface of the main cabinet body (11). A Y-axis screw (13) is installed inside the Y-axis rail (12) through a bearing.

3. The semiconductor wafer processing positioning device according to claim 2, characterized in that, The movable seat (2) includes two sets of X-axis tracks (21), and the bottom surfaces of the two sets of X-axis tracks (21) are fixedly connected to track sliders (22), which are engaged with Y-axis screws (13).

4. A semiconductor wafer processing positioning method, implemented based on the semiconductor wafer processing positioning device according to any one of claims 1-3, characterized in that, Includes the following steps: S1: The semiconductor wafer is transported to the top surface of the wafer support platform (3) by a robotic arm, and the wafer support platform (3) automatically adsorbs and fixes the semiconductor wafer by negative pressure; S2: The positioning mechanism (4) moves to the top surface of the wafer support platform (3) and collects edge feature points of the semiconductor wafer. The number of edge feature points of the semiconductor wafer is at least three. S3: Based on the coordinates of the edge feature points of the three semiconductor wafers, use the moving base (2) and the wafer support platform (3) to adjust the position of the semiconductor wafers so that the semiconductor wafers reach the set position; S4: The positioning mechanism (4) collects the edge feature points of the semiconductor wafer again, and checks the accuracy of the moving seat (2) and the wafer support platform (3) by collecting the edge feature points of the semiconductor wafer again.

Images