Heat dissipation structure of high-power chip power supply module

Abstract

The invention discloses a heat dissipation structure of a high-power chip power supply module. The heat dissipation structure comprises a first mainboard, a second mainboard, a high-power chip module, a power supply module and a top heat dissipation device. The power supply module comprises at least one heating power element; the power supply module is provided with a heat dissipation surface; the heating power element is arranged adjacent to the heat dissipation surface. The heat dissipation structure further comprises a uniform temperature plate and a longitudinal heat conduction piece. The uniform temperature plate is in heat conduction connection with the heat dissipation surface; the uniform temperature plate is in heat conduction connection with the top heat dissipation device through the longitudinal heat conduction piece. According to the invention, the heating element in the power supply module is arranged at the position outside the pin surface, and an additional heat dissipation channel is provided, so that the influence of heating of the power supply module on the work of the load XPU is avoided; in addition, under the cooperation of the transverse heat conduction piece and the longitudinal heat conduction piece, the uniform temperature plate can conduct heat generated by the power supply module to the radiator more effectively while giving consideration to heat transfer and mechanical fastening capabilities.

Description

Technical Field

[0001] The invention belongs to the technical field of high-frequency power supply, and in particular relates to a heat dissipation structure of a high-power chip power supply module. Background Art

[0002] As AI computing power increases, computing chips such as CPU, TPU, GPU (hereinafter referred to as XPU) consume more and more power and current. In traditional smart cards, the power supply module and XPU are on the same side, that is, horizontal power delivery (LPD-Lateral Power Delivery) can no longer meet the XPU's increasing demand for power supply current, so the power supply module begins to turn to vertical power delivery (VPD-Vertical Power Delivery), that is, the power supply module is directly below the XPU.

[0003] At the same time, due to the increase in the number of XPU digital signals, the traditional vertical plug-in PCIE card-type smart card limits the signal and power processing of the XPU; large smart cards have begun to develop from vertical to horizontal; this article collectively refers to horizontal smart cards as OAM cards. Since the height between the horizontal smart card and the system motherboard is very limited, usually between 5mm and 10mm, the height must include the thickness of the power supply module and the thickness of the heat sink for heat dissipation of the power supply module, so the space left for the heat sink is very limited. The vertical power supply (hereinafter referred to as OAM-VPD) industry of horizontal smart cards is still in the exploratory stage, and there is no mature technology. The simplest way is to transfer the heat of the power supply module to the smart card motherboard, and then transfer it to the XPU side through the vias of the smart card motherboard, and dissipate heat through the XPU radiator. Therefore, the prior art usually sets the high-frequency power semiconductor of the power supply module on the side of the power supply module close to the smart card motherboard. The high-frequency power semiconductors of the power supply module include DrMos or SPS; DrMos is the abbreviation of the integrated semiconductor of the driver and Mosfet; SPS is the abbreviation of Smart Power Stage. The above structure not only makes the heat dissipation resistance of the power supply module very large, but also increases the temperature of the XPU, thereby affecting the processing capacity of the XPU.

[0004] Therefore, the present invention takes the lead in proposing an effective and practical overall solution for OAM-VPD power supply and heat dissipation. Summary of the invention

[0005] In view of this, one of the purposes of the present invention is to provide a heat dissipation structure of a power supply module of a high-power chip, specifically an OAM-VPD power supply and heat dissipation solution. By setting the heating element in the power supply module at a position other than the pin surface and providing an additional heat dissipation channel, the heat generated by the power supply module is prevented from affecting the operation of the XPU; and under the cooperation of the transverse heat conductive member and the longitudinal heat conductive member of the present invention, while taking into account the heat transfer capacity and the fastening capacity, the heat generated by the power supply module is more effectively conducted to the radiator.

[0006] To achieve the above-mentioned purpose, the first aspect of the present invention provides a heat dissipation structure of a high-power chip power supply module, comprising a first mainboard, a second mainboard, a high-power chip module, a power supply module and a top heat dissipation device, wherein the first mainboard comprises a first surface and a second surface relative to each other, the second mainboard comprises a third surface and a fourth surface relative to each other, the high-power chip module is arranged on the first surface, the power supply module is arranged on the second surface, an assembly formed by the first mainboard, the high-power chip module and the power supply module is horizontally assembled on the third surface of the second mainboard, the power supply module is located between the first mainboard and the second mainboard, the top heat dissipation device is thermally connected to the high-power chip module, the positions of the power supply module and the high-power chip module correspond vertically, and the power supply module comprises at least one heat-generating power element;

[0007] The power supply module has a heat dissipation surface, and the heat-generating power element is arranged adjacent to the heat dissipation surface;

[0008] The heat dissipation structure further comprises at least one temperature averaging plate, the temperature averaging plate is thermally connected to the heat dissipation surface, and the temperature averaging plate is thermally connected to the top heat dissipation device via a longitudinal heat conducting member.

[0009] Preferably, the heat dissipation structure also includes multiple fasteners; the longitudinal heat conductor is provided with multiple; the complex of the longitudinal heat conductor and the fastener is used to fasten the temperature spreader and the first mainboard to the top radiator; the longitudinal heat conductor includes a limit end, a cylindrical heat pipe and a fastening and fitting structure; the limit end and the fastening and fitting structure are respectively arranged at both ends of the cylindrical heat pipe; the limit end and the temperature spreader are in large-area thermal contact; the fastening and fitting structure and the fastener are fixedly connected; the cylindrical heat pipe passes through the first mainboard and the temperature spreader.

[0010] Preferably, the cylindrical heat pipe has a sealed cavity and a phase-change heat-conducting material is arranged in the sealed cavity, or the material of the cylindrical heat pipe includes at least one of graphene or carbon nanotubes.

[0011] Preferably, the temperature homogenizing plate may be made of copper, copper-graphite alloy, or an ultra-thin VC plate containing a phase change material.

[0012] Preferably, the limiting end is a cap; the fastener is a screw, and the fastening fitting structure has a thread; the top heat sink is provided with a plurality of stepped holes; the fastener and the fastening fitting structure are fixedly connected in the stepped hole; and a thermal conductive filler is provided in the gap between the inner wall of the stepped hole and the fastening fitting structure.

[0013] Preferably, the heat dissipation structure also includes a plurality of fasteners; a plurality of longitudinal heat conductive members are provided; the longitudinal heat conductive member includes a cylindrical heat pipe; the fasteners are used to fix the longitudinal heat conductive member on the top heat dissipation device; the longitudinal heat conductive member passes through the first mainboard, and the longitudinal heat conductive member and the temperature equalizing plate are fixedly connected by welding.

[0014] Preferably, the temperature homogenizing plate is arranged between the second mainboard and the power supply module, and the temperature homogenizing plate is thermally connected to the second mainboard.

[0015] Preferably, a through window is provided on the temperature homogenizing plate, and the input electrode of the power supply module is electrically connected to the second main board through the through window, and the temperature homogenizing plate and the second main board are thermally connected via a thermal conductive interface material.

[0016] Preferably, a mainboard through hole is provided on the second mainboard, a back heat dissipation device is arranged on the fourth surface, the temperature spreader has a heat column matching the shape of the mainboard through hole, and the temperature spreader is thermally connected to the back heat dissipation device through the bottom surface of the heat column.

[0017] Preferably, the power supply module is thermally connected to the third surface, the temperature equalizer is arranged on the fourth surface, the positions of the temperature equalizer and the power supply module correspond vertically, thermal vias are arranged in the second mainboard, the power supply module and the temperature equalizer are thermally connected through the thermal vias, and the longitudinal heat conductive component also runs through the second mainboard.

[0018] Preferably, the cross-section of the columnar heat pipe is circular, the fastener is a screw, and one end of the columnar heat pipe is further provided with a fastening and fitting structure with a thread.

[0019] Preferably, the cross-section of the cylindrical heat pipe is annular, the fastener is a screw passing through the cylindrical heat pipe, and the inner wall of the cylindrical heat pipe is provided with threads.

[0020] Preferably, it also includes a transverse heat conducting member; the transverse heat conducting member is arranged on a temperature balancing plate; the temperature balancing plate functions as a reinforcing rib.

[0021] Preferably, the transverse heat conductive member has a closed cavity and a phase-change heat conductive material is arranged in the closed cavity, or the material of the transverse heat conductive member includes at least one of graphene or carbon nanotubes.

[0022] Preferably, the heat dissipation structure also includes a shell and multiple fasteners; the temperature equalizer is arranged between the second mainboard and the power supply module, the second mainboard is provided with a mainboard through hole, a back heat dissipation device is arranged on the fourth surface, the temperature equalizer has a thermal column matching the shape of the mainboard through hole, and the temperature equalizer is thermally connected to the back heat dissipation device through the bottom surface of the thermal column; the fasteners are used to fix the top radiator, the first mainboard, and the second mainboard to the shell; the fasteners pass through the top radiator, the first mainboard, and the second mainboard; an elastic buffer layer is arranged between the back radiator and the shell.

[0023] Preferably, it also includes a transverse heat conductive member, which is arranged on the temperature equalizing plate; the longitudinal heat conductive member includes a flat longitudinal heat conductive member; the transverse heat conductive member and the flat longitudinal heat conductive member are formed into a bendable heat conductive member by integral molding or fixed connection, the longitudinal heat conductive member is arranged on at least one side of the first main board, and a mounting hole is provided at the end of the longitudinal heat conductive member, and the longitudinal heat conductive member is mounted on the top heat conductive component through a fastener.

[0024] Preferably, the bendable thermal conductive component has a closed cavity and a phase change thermal conductive material is arranged in the closed cavity, or the material of the bendable thermal conductive component includes at least one of graphene or carbon nanotubes; the width of the bendable thermal conductive component is not less than 10 mm, the thickness is less than 5 mm, and the thermal conductivity is not less than 1000 W / (m·K).

[0025] Preferably, the temperature homogenizing plate is provided with fins, the power supply module includes a plurality of sub-modules, the sub-modules are thermally connected to the temperature homogenizing plate; the sides of the sub-modules are thermally connected to the fins; the fins are used for side heat dissipation of the sub-modules;

[0026] The fins and the temperature averaging plate are integrally formed, or the fins and the temperature averaging plate are thermally connected.

[0027] Preferably, the top heat dissipation device includes a top liquid cooling plate, the temperature equalizing plate is a bottom liquid cooling plate, the longitudinal heat conductive member is a liquid guiding hose, the top liquid cooling plate, the bottom liquid cooling plate and the liquid guiding hose have an internally connected cooling liquid chamber, and the cooling liquid chamber is provided with cooling liquid.

[0028] Preferably, the cooling liquid chamber is a closed self-circulating chamber and the cooling liquid is a phase-change cooling liquid, or the cooling liquid chamber is connected to a cooling liquid pump fluid circuit.

[0029] The beneficial effects of the present invention are:

[0030] (1) The present invention arranges the heating element in the power supply module at a position other than the pin surface and provides an additional heat dissipation channel, thereby preventing the heating of the power supply module from affecting the operation of the XPU;

[0031] (2) The present invention more effectively conducts the heat of the power supply module to the main heat sink and / or the auxiliary heat sink within a limited height space by cooperating with the transverse heat conducting member and the longitudinal heat conducting member of the temperature vapor chamber. The present invention also carries out a heat and force composite structural design for the temperature vapor chamber and / or the longitudinal heat conducting member, thereby achieving the functions of heat transfer and fastening at the same time.

[0032] (3) The present invention further reduces the thickness of the high-power chip and the power supply module device while ensuring heat dissipation through the provision of a liquid cooling circulation system. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 It is a schematic diagram of the prior art;

[0035] FIG. 2A to FIG. 5B is a schematic diagram of Embodiment 1 of the present invention;

[0036] Figure 6 is a schematic diagram of a second embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of Embodiment 3 of the present invention;

[0038] Fig. 8A and Figure 8B It is a schematic diagram of the fourth embodiment of the present invention;

[0039] Fig.9A and Fig. 9B is a schematic diagram of Embodiment 5 of the present invention;

[0040] in:

[0041] 10 Main radiator; 11 auxiliary radiator; 12 screw; 14 stepped hole; 15 large diameter part; 21 XPU chip; 22 XPU substrate; 31 / 32 power supply module; 33 pin surface; 34 heat dissipation surface; 41 smart card motherboard; 42 system motherboard; 43 thermal via; 50 MOS; 51 sub-module; 60 high-speed signal connector; 70 temperature plate; 71 fin; 72 heat column; 80 longitudinal heat conductive part; 81 lateral heat conductive part; 90 thermal interface material; 100 chassis shell; 101 elastic buffer layer; 111 top liquid cooling plate; 112 bottom liquid cooling plate; 113 liquid guide hose; 114 support column. DETAILED DESCRIPTION

[0042] One of the core points of the present invention is to provide a heat dissipation structure for a power supply module of a high-power chip, by setting the heating elements in the power supply module at a position other than the pin surface and providing an additional heat dissipation channel, so as to avoid the heat generation of the power supply module affecting the operation of the XPU; and the temperature spreader of the present invention, with the cooperation of the transverse heat conductive parts and the longitudinal heat conductive parts, can more effectively conduct the heat of the power supply module to the radiator while taking into account the heat transfer and mechanical fastening capabilities.

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] like Figure 1 As shown, the commonly used OAM-VPD structure and heat dissipation structure include: a first mainboard, a second mainboard, a main heat sink 10, a high-power chip module, a high-speed signal connector 60 and a power supply module 31 / 32. The first mainboard is the smart card mainboard 41. At least one high-power chip module is installed on the upper surface of the first mainboard; the high-power chip module includes at least one XPU chip 21 and an XPU substrate 22; a high-speed signal connector 60 is arranged on both sides of the lower surface of the first mainboard, so that the high-power chip module can be directly or indirectly electrically connected to the second mainboard; the second mainboard is the system mainboard 42. A power supply module 31 is arranged on the upper surface of the first mainboard, and a horizontal power supply mode is adopted to supply power to the XPU; a power supply module 32 is arranged on the lower surface of the first mainboard, and a vertical power supply mode is adopted to supply power to the XPU. The main heat sink 10 is placed above the XPU and is arranged in contact with the heat dissipation surface of the XPU; the main heat sink 10 can also be called a top heat dissipation device, which dissipates heat for the XPU and the power supply module 31. The power supply module 32 is located on the lower surface of the first mainboard, so that the power supply module 32 is closer to the XPU, the transmission impedance is low, the dynamic response is fast, and the dynamic characteristic requirements of the XPU can be well met. However, due to the height limitation of the space between the first mainboard and the second mainboard, it is impossible to install a heat dissipation device for the power supply module 32. Therefore, a structure for dissipating heat for a power supply module adopting a vertical power supply mode is urgently needed.

[0045] Embodiment 1

[0046] like FIG. 2A to FIG. 2D As shown, Figure 2A A schematic diagram of a heat dissipation structure of a high-power chip and a power supply module thereof using a vertical power supply mode disclosed in this embodiment; Figure 2B for Figure 2A Exploded diagram of Figure 2C for Figure 2ASchematic diagram of the aa' section, Figure 2D Schematic diagram of the structure of the longitudinal heat conductor 80.

[0047] The heat dissipation structure of the high-power chip power supply module disclosed in this embodiment includes: a first mainboard, a main heat sink 10, a temperature homogenizing plate 70, and a heat and force complex.

[0048] The first mainboard is the smart card mainboard 41; at least one high-power chip module is installed on the upper surface of the first mainboard; the high-power chip module includes at least one XPU chip 21 and an XPU substrate 22; the power consumption of the XPU chip is usually greater than 500W. A high-speed signal connector 60 is arranged on each side of the lower surface of the first mainboard; the high-speed signal connector 60 can directly or indirectly electrically connect the high-power chip module to the second mainboard, which is the system mainboard 42. A power supply module 32 is also arranged on the lower surface of the first mainboard, and a low-voltage and high-current is provided to the XPU from the lower surface of the first mainboard to the upper surface of the first mainboard through the vias of the first mainboard; the power supply module 32 can be a single integrated module or a plurality of small module arrays indirectly integrated through the first mainboard, and the power consumption of the power supply module 32 is usually greater than 50W.

[0049] The main heat sink 10 is placed above the XPU and is arranged to fit the heat dissipation surface of the XPU; the main heat sink 10 may also be called a top heat dissipation device, which provides heat dissipation for the XPU;

[0050] The temperature plate 70 is used to conduct the heat of the power module 32 laterally and cooperate with other structural parts to further conduct the heat to the heat dissipation device; in this embodiment, a thermal interface material (not shown in the figure) is set between the temperature plate 70 and the heat dissipation surface of the power module 32 to even out the heat generated by the power module in the temperature plate 70, so as to facilitate the subsequent heat dissipation to the heat sink. The temperature plate 70 is usually fastened to the main heat sink 10 through four heat and force complexes that penetrate the smart card motherboard, and helps the main heat sink 10 to have good thermal contact with the XPU.

[0051] The heat and force complex includes a longitudinal heat conductor 80 and a screw 12. The main heat sink 10 includes a stepped hole 14 that runs through the top and bottom, and the temperature averaging plate 70 and the first main board both include corresponding straight holes that run through the top and bottom. The longitudinal heat conductor 80 passes through the straight holes of the temperature averaging plate 70 and the first main board from the temperature averaging plate side to reach the stepped hole 14 of the main heat sink 10; the screw 12 penetrates from the top of the main heat sink 10, and together with the longitudinal heat conductor 80, fixes the temperature averaging plate 70 and the main heat sink 10, provides mechanical fastening for the temperature averaging plate 70 and the main heat sink 10, and further mechanically fastens the XPU and the main heat sink 10; at the same time, the heat of the temperature averaging plate 70 is conducted to the main heat sink 10 through the longitudinal heat conductor 80. The cap of the longitudinal heat conductor 80 is in thermal contact with the temperature plate 70 over a large area, further increasing the thermal contact area between the longitudinal heat conductor 80 and the temperature plate; the large diameter portion 15 of the stepped hole 14 and the outer surface of the longitudinal heat conductor 80 are filled with fillers such as thermal grease to reduce the gap between the large diameter portion 15 and the outer surface of the longitudinal heat conductor 80, thereby reducing the conduction thermal resistance. The heat and force complex better realizes the mechanical fastening between the main heat sink 10 and the temperature plate 70, and realizes the heat dissipation of the power supply module through the temperature plate and the main heat sink 10.

[0052] In this embodiment, the heat generated by the power supply module 32 is transferred to the longitudinal heat conducting member 80 through the temperature averaging plate 70, and then transferred to the main heat sink 10 through the longitudinal heat conducting member 80. Preferably, the temperature averaging plate 70 and the longitudinal heat conducting member 80 are welded together to reduce the contact impedance between the two. Furthermore, the structure of the heat pipe integrated in the longitudinal heat conducting member 80 is cylindrical, and can be a hollow chamber structure, and the chamber structure is filled with a phase change material, such as Figure 2D As shown. When the heat is transferred to the longitudinal heat conductor 80, the internal phase change material changes from liquid to gas due to the heat, rises to the top of the longitudinal heat conductor 80, and then through the cooling of the main heat sink 10, the phase change material changes from gas to liquid, and flows back to the bottom of the longitudinal heat conductor 80. In this reciprocating cycle, the heat generated by the power supply module 32 is dissipated through the temperature averaging plate 70, the longitudinal heat conductor 80 and the main heat sink 10. Since the thickness of the temperature averaging plate is relatively thin, in order to meet the lateral conduction of heat, the temperature averaging plate can be copper, copper-graphite alloy, or an ultra-thin VC plate containing phase change material (VC plate is Vapor Chamber, similar to the cylindrical heat pipe in the longitudinal heat conductor), or a combination of a temperature averaging plate and a flat heat pipe that takes into account both heat transfer and fastening capabilities.

[0053] Since the power semiconductor, collectively referred to as MOS 50, is the device with the highest heat density in the entire power module 32, the position of the MOS 50 in the power module 32 of the present invention should be in contact with the temperature plate 70. Figure 3AAs shown, the side of the power supply module 32 that is in electrical contact with the smart card mainboard 41 is defined as the pin surface 33 or the bottom surface; the heat generated by the MOS 50 used in the power supply module 32 accounts for more than 50% of the total heat generated by the power supply module 32, so the MOS 50 should be arranged adjacent to other surfaces of the power supply module 32; for example, the top surface and the side surface of the power supply module are referred to as the heat dissipation surface 34, which is convenient for adding a heat dissipation channel ( Figure 3A The top side is shown facing downward and the bottom side is shown facing upward).

[0054] In a preferred embodiment, if FIG. 3B to FIG. 3E As shown, the power module 32 has multiple sub-modules 51, and the temperature plate 70 is in thermal contact not only with the top surface of the sub-module 51, but also with the side surface of the sub-module 51, thereby increasing the module heat dissipation channel, thereby solving the problem of the continuous increase in the heat density of the power module 32. Therefore, the temperature plate 70 also includes vertical fins 71; the temperature plate 70 and the vertical fins 71 are integrally formed, such as Figure 3B and Figure 3C In another embodiment, the vertical fins 71 are fixedly connected by gluing or welding, as shown in FIG. Figure 3D and Figure 3E The vertical fins 71 are thermally connected to the side of the submodule 51 through the heat-conducting connecting material, which increases the heat dissipation channel of the module 51, is conducive to improving the heat dissipation effect, and is more conducive to the uniformity of the temperature inside the submodule 51, avoiding the generation of hot spots. In the submodule 51, the side heat source can be a magnetic element or a MOS 50 installed on the side of the magnetic element. Figure 3C and Figure 3E shown.

[0055] In some other embodiments, as the power consumption of the XPU increases, the heat dissipation requirements of the power supply module 32 also increase, and the heat dissipation requirements of the power supply module cannot be met by the thermal connection between the heat and force complex and the main heat sink 10. Therefore, a continuous heat conduction path is required between the temperature vapor chamber 70 and the main heat sink 10 to further improve the heat conduction capacity.

[0056] In this embodiment, a combination of a temperature averaging plate 70 and a flat heat pipe is used. Figure 4A and Figure 4B As shown; Figure 4A is a side view of a combination of a temperature homogenizing plate 70 and a flat heat pipe; Figure 4B for Figure 4AThe top view of the figure. The flat heat pipe includes a transverse heat conductor 81 and a longitudinal heat conductor 80; the transverse heat conductor 81 extends transversely along the horizontal direction of the temperature equalizer 70. The longitudinal heat conductor 80 extends from the transverse heat conductor 81 to the main heat sink 10 in the vertical direction; the transverse heat conductor 81 and the longitudinal heat conductor 80 can be an integrally formed structure, that is, the longitudinal heat conductor 80 is formed by bending the two ends of the flat heat pipe; or they can be riveted, bonded or welded together. Since the positions of the XPU chip and the power supply module 32 are set on the smart card mainboard 41, which are usually used to transmit power or signals, the longitudinal heat conductor 80 can only extend from both sides of the power supply module 32 to the main heat sink 10; further, the longitudinal heat conductor 80 is in thermal contact with the main heat sink 10, thereby further reducing the thermal resistance between the temperature equalizer 70 and the main heat sink 10. Here, the thickness of the flat heat pipe is less than 5mm or even 3mm, and its width is at least 10mm, or even 20mm to 30mm. To ensure good heat transfer capability of the heat spreader, the flat heat pipe can be a hollow filled with thermal phase change material, or a flat ribbon composed of graphene and nano-carbon tubes, and its thermal conductivity should be as high as 1000w / m·k or more. Similarly, if mechanical fastening capability is required, it can be combined with Figure 2C The structures shown in the figure are used in combination, specifically Figure 2C The temperature plate 70 is replaced by Figure 4A The combination of the temperature averaging plate 70 and the flat heat pipe can take into account both thermal conductivity and mechanical fastening capabilities.

[0057] In a preferred embodiment, the combination of the temperature averaging plate 70 and the flat heat pipe can also be as follows: Figure 5A and Figure 5B As shown; Figure 5A is a side view of a combination of a temperature homogenizing plate 70 and a flat heat pipe; Figure 5B for Figure 5A A top view of Figure 5A The longitudinal heat conducting member 80 on the left side is a sleeve-shaped heat pipe with an annular cross section, which is responsible for heat transfer. The high-strength bolts penetrate the sleeve-shaped heat pipe and are matched with nuts to fix it. For comparison, Figure 5A The longitudinal heat conducting member 80 on the middle right side is a screw 12 set above the heat pipe; in the actual embodiment Figure 5A The longitudinal heat conducting member 80 on the left or right side can be made of the same structure. Since the heat pipe is usually made of metal with low structural strength, such as copper, the heat pipe is easily deformed if it is subjected to a large force. Figure 5B In the figure, the flat heat pipe is flatly attached to the temperature averaging plate 70, so that the combination of the temperature averaging plate 70 and the flat heat pipe takes into account both mechanical strength and good thermal conductivity, thereby avoiding the heat pipe from being deformed by force; specifically, the temperature averaging plate 70 serves as a reinforcing rib for reinforcement, and the flat heat pipe serves as a lateral heat conduction.

[0058] Embodiment 2

[0059] like Figure 6 As shown, a through window is left on the temperature plate 70, and the power supply module 32 and the system mainboard 42 can be electrically connected through the through window. The connection method is preferably a connector method; the connector method is similar to the high-speed signal connector 60, such as Figure 6 The enlarged schematic diagram of the power supply module 32 in FIG. A power supply module pin or a power supply module socket is set below the power supply module 32; a corresponding power supply socket or a power supply plug is set on the upper surface of the system mainboard 42; a system mainboard power supply jack can also be set on the system mainboard 42 for the pin below the power supply module 32 to be inserted to obtain electricity; the system mainboard power supply jack runs through the thickness of the system mainboard. In this way, the high-voltage input electrode of the power supply module 32 can also be realized through the connector to achieve vertical power transmission nearby, not only breaking through the high current limit of low input voltage, but also breaking through the high-voltage avoidance distance limit of high input voltage. The input voltage of the power supply module 32 can be lower than 5V, or as high as 12V, 48V, 400V, 800V or even 1200V. Furthermore, the temperature plate can be used as the GND grounding electrode of the power supply module 32, electrically connected to the system mainboard, and further increase the high current channel. At this time, the high-speed signal connector 60 of the smart card can be provided with no power pin, so as to facilitate the processing of high-speed signals and increase the communication capacity.

[0060] In this embodiment, the height of the high-speed signal connector 60 is reduced, so that the distance between the temperature equalizing plate 70 and the system mainboard 42 is reduced, and a thermal conductive interface material 90 is added between the temperature equalizing plate 70 and the system mainboard 42. Although the thermal conductivity of the thermal conductive interface material 90 is lower than that of the temperature equalizing plate 70, a heat dissipation path is added to the power supply module 32, that is, part of the loss of the power supply module 32 can be dissipated through the system mainboard 42, thereby achieving a better thermal conductivity effect for the power supply module 32.

[0061] Embodiment 3

[0062] like Figure 7 As shown, in some application scenarios, the height between the smart card mainboard 41 and the system mainboard 42 is further reduced (for example, reduced to 5 mm), so that the temperature equalizer 70 needs to be set inside or on the lower surface of the system mainboard 42. This embodiment is illustrated by the temperature equalizer 70 being located on the lower surface of the system mainboard 42. The power supply module 32 is directly bonded to the system mainboard 42 through the thermal interface material 90, and a plurality of thermal vias 43 are provided in the system mainboard 42 to achieve heat conduction between the power supply module 32 and the temperature equalizer 70. The heat will be further transferred to the main radiator 10 through the heat and force complex, and the heat and force complex simultaneously penetrates the temperature equalizer 70, the system mainboard 42, and the smart card mainboard 41. Alternatively, the flat heat pipe on the temperature equalizer 70 can be bent and extended to the main radiator 10 to transfer heat.

[0063] Embodiment 4

[0064] like Fig. 8A As shown, in this embodiment, a secondary radiator 11 is provided on the back of the system mainboard 42, and the temperature equalizer 70 can preferentially transfer the heat generated by the power supply module 32 to the secondary radiator 11. The specific structure is as follows: a small-area raised heat column 72 can be provided locally on the large-area temperature equalizer 70; the heat column 72 penetrates the through hole on the system mainboard 42, and the shape of the through hole matches the shape of the heat column 72. The power supply module 32 transfers heat to the secondary radiator 11 through the heat column 72. At the same time, the main radiator 10 is fixed to the chassis shell 100 by screws; if necessary, an elastic buffer layer 101 can be provided between the secondary radiator 11 and the chassis shell 100 to absorb the longitudinal structural tolerances between the main radiator 10 and the chassis shell 100 and maintain sufficient pressure between the structures.

[0065] like Figure 8B As shown, in a preferred embodiment, three different heat dissipation paths are set up at the same time: the temperature equalizer 70 conducts heat to the auxiliary heat sink 11 through the heat column 72; the temperature equalizer 70 conducts heat to the main heat sink 10 through the heat and force complex that penetrates the smart card mainboard 41; the temperature equalizer 70 locks the bendable flat heat pipe on the temperature equalizer 70 on the heat sink 10, so that more heat is conducted to the main heat sink 10.

[0066] Embodiment 5

[0067] As the power consumed by XPU chips increases, the output power of the power supply module also increases, and the challenge of heat dissipation becomes greater and greater; traditional air cooling has become a bottleneck, and the heat dissipation method has gradually changed from air cooling to water cooling. Fig.9A A system water-cooling heat dissipation structure is provided, which includes a top liquid cooling plate 111 and a bottom liquid cooling plate 112. The top liquid cooling plate 111 is located above the XPU chip 21 and is used to dissipate heat for the XPU chip; the bottom liquid cooling plate 112 is located below the power supply module 32 and is used to dissipate heat for the power supply module; the two liquid cooling plates are vertically connected by a liquid guide hose 113.

[0068] Preferably, the top liquid cooling plate 111 is used to dissipate heat for multiple XPU chips; the bottom liquid cooling plate 114 is used to dissipate heat for multiple power supply modules 32; and on the same side of the two liquid cooling plates, the liquid paths of the two liquid cooling plates are connected in series through the liquid guide hose 113. In an application scenario, the entire system may include multiple similar Fig.9AThe structure shown, in which the liquid path of the coolant can be connected in parallel or in series. Generally speaking, the volume of the air-cooled radiator is relatively large, so the heat exchange area between the radiator and the air can be increased to meet the heat dissipation requirements. The liquid cooling plate can adopt a thinner structure, such as less than 50mm, and the heat exchange capacity can be improved by increasing the flow rate and pressure through power devices such as coolant pumps. These power devices are arranged outside the system board and will not occupy the height dimension of the system board; on the other hand, since multiple smart cards share the same liquid cooling plate, there is no need to set screw holes for fixing the liquid cooling plate on the smart card mainboard 41, which saves the plane size of the smart card mainboard 41; it is only necessary to set some support columns between the smart card mainboard 41 to fix the top liquid cooling plate and the bottom liquid cooling plate; or support columns can also be set on the periphery of the system board, which is not limited here.

[0069] Since multiple smart cards share the top liquid cooling plate, how can we ensure that the thermal interface material between multiple XPUs and the top liquid cooling plate 111 is thin enough to achieve excellent heat dissipation effect? ​​In one installation method, the liquid cooling plate can be used as a carrier, and multiple smart cards are respectively attached to the top liquid cooling plate 111, and each smart card is fixed to the top liquid cooling plate 111 by screws; then the support column 114 and the bottom liquid cooling plate 112 are installed; finally, the top liquid cooling plate 111 and the bottom liquid cooling plate 112 are fixed by screws.

[0070] In some other embodiments, the liquid circuits of the two liquid circuit plates may be connected in series through the liquid guiding hose 113 on opposite sides of the two liquid cooling plates; or the liquid circuits of the two liquid circuit plates may be connected in parallel through the liquid guiding hose 113.

[0071] In some other embodiments, the top liquid cooling plate 111 and the bottom liquid cooling plate 112 may also connect the inlet of one of them with the outlet of the other to form a self-circulating closed cavity, and the liquid inside is a phase change material.

[0072] In some other embodiments, the system only includes the system mainboard 42, but does not include the smart card mainboard 41; in this case, multiple XPU substrates 22 are directly mounted on multiple system mainboards 42, and the structure formed is as follows: Fig. 9B In this embodiment, multiple XPU chips continue to share the top liquid cooling plate; multiple system motherboards 42 continue to share the bottom liquid cooling plate. In an extended embodiment, the multiple system motherboards 42 can be combined into one system motherboard.

[0073] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0074] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure of a high-power chip power supply module, characterized in that: The invention comprises a first mainboard, a second mainboard, a high-power chip module, a power supply module and a top heat dissipation device, wherein the first mainboard comprises a first surface and a second surface opposite to each other, the second mainboard comprises a third surface and a fourth surface opposite to each other, the high-power chip module is arranged on the first surface, the power supply module is arranged on the second surface, an assembly formed by the first mainboard, the high-power chip module and the power supply module is horizontally assembled on the third surface of the second mainboard, the power supply module is located between the first mainboard and the second mainboard, the top heat dissipation device is thermally connected to the high-power chip module, the positions of the power supply module and the high-power chip module correspond vertically, and the power supply module comprises at least one heat-generating power element, The power supply module has a heat dissipation surface, and the heat-generating power element is arranged adjacent to the heat dissipation surface; The heat dissipation structure further comprises at least one temperature averaging plate, which is thermally connected to the heat dissipation surface, and is thermally connected to the top heat dissipation device via a longitudinal heat conducting member.

2. The heat dissipation structure according to claim 1, characterized in that: It also includes multiple fasteners; there are multiple longitudinal heat conductors; the complex of the longitudinal heat conductor and the fastener is used to fasten the temperature spreader and the first mainboard to the top radiator; the longitudinal heat conductor includes a limit end, a cylindrical heat pipe and a fastening and fitting structure; the limit end and the fastening and fitting structure are respectively arranged at both ends of the cylindrical heat pipe; the limit end and the temperature spreader are in large-area thermal contact; the fastening and fitting structure and the fastener are fixedly connected; the cylindrical heat pipe runs through the first mainboard and the temperature spreader.

3. The heat dissipation structure according to claim 1, characterized in that: The longitudinal heat conductive member has a closed cavity and a phase-change heat conductive material is arranged in the closed cavity, or the material of the longitudinal heat conductive member includes at least one of graphene or carbon nanotubes.

4. The heat dissipation structure according to claim 1, characterized in that: The temperature balancing plate may be made of copper, copper-graphite alloy, or an ultra-thin VC plate containing a phase change material.

5. The heat dissipation structure according to claim 2, characterized in that: The limiting end is a cap; the fastener is a screw, and the fastening matching structure has threads; the top heat sink is provided with a plurality of stepped holes; the fastener and the fastening matching structure are fixedly connected in the stepped holes; a thermal conductive filler is provided in the gap between the inner wall of the stepped hole and the fastening matching structure.

6. The heat dissipation structure according to claim 1, characterized in that: It also includes multiple fasteners; there are multiple longitudinal heat conductive members; the longitudinal heat conductive members include cylindrical heat pipes; the fasteners are used to fix the longitudinal heat conductive members on the top heat dissipation device; the longitudinal heat conductive members pass through the first mainboard, and the longitudinal heat conductive members and the temperature equalizing plate are fixedly connected by welding.

7. The heat dissipation structure according to claim 6, characterized in that: The temperature averaging plate is arranged between the second mainboard and the power supply module, and the temperature averaging plate is thermally connected to the second mainboard.

8. The heat dissipation structure according to claim 6, characterized in that: A through window is provided on the temperature homogenizing plate, and the input electrode of the power supply module is electrically connected to the second main board through the through window. The temperature homogenizing plate and the second main board are thermally connected via a thermally conductive interface material.

9. The heat dissipation structure according to claim 6, characterized in that: A mainboard through hole is provided on the second mainboard, a back heat dissipation device is arranged on the fourth surface, the temperature homogenizing plate has a heat column matching the shape of the mainboard through hole, and the temperature homogenizing plate is thermally connected to the back heat dissipation device through the bottom surface of the heat column.

10. The heat dissipation structure according to claim 6, characterized in that: The power supply module is thermally connected to the third surface, the temperature equalizing plate is arranged on the fourth surface, the positions of the temperature equalizing plate and the power supply module correspond vertically, thermal vias are arranged in the second mainboard, the power supply module and the temperature equalizing plate are thermally connected through the thermal vias, and the longitudinal heat conductive component also runs through the second mainboard.

11. The heat dissipation structure according to claim 6, characterized in that: The cross section of the columnar heat pipe is circular, the fastener is a screw, and one end of the columnar heat pipe is also provided with a fastening and matching structure with a thread.

12. The heat dissipation structure according to claim 6, characterized in that: The cross section of the cylindrical heat pipe is annular, the fastener is a screw penetrating the cylindrical heat pipe, and the inner wall of the cylindrical heat pipe is provided with threads.

13. The heat dissipation structure according to claim 6, characterized in that: It also includes a transverse heat conducting member, which is arranged on a temperature balancing plate; the temperature balancing plate functions as a reinforcing rib.

14. The heat dissipation structure according to claim 13, characterized in that: The transverse heat-conducting member has a closed cavity and a phase-change heat-conducting material is arranged in the closed cavity, or the material of the transverse heat-conducting member includes at least one of graphene or carbon nanotubes.

15. The heat dissipation structure according to claim 1, characterized in that: It also includes a shell and a plurality of fasteners; the temperature averaging plate is arranged between the second mainboard and the power supply module, the second mainboard is provided with a mainboard through hole, a back heat dissipation device is arranged on the fourth surface, the temperature averaging plate has a heat column matching the shape of the mainboard through hole, and the temperature averaging plate is thermally connected to the back heat dissipation device through the bottom surface of the heat column; The fasteners are used to fix the top heat sink, the first main board, and the second main board to the housing; The fastener passes through the top radiator, the first main board and the second main board; an elastic buffer layer is arranged between the back radiator and the shell.

16. The heat dissipation structure according to claim 1, characterized in that: It also includes a transverse heat conductive member, which is arranged on the temperature equalizing plate, and the longitudinal heat conductive member includes a flat longitudinal heat conductive member; the transverse heat conductive member and the flat longitudinal heat conductive member are formed into a bendable heat conductive member by integral molding or fixed connection, the longitudinal heat conductive member is arranged on at least one side of the first main board, and a mounting hole is arranged at the end of the longitudinal heat conductive member, and the longitudinal heat conductive member is mounted on the top heat conductive component through a fastener.

17. The heat dissipation structure according to claim 16, characterized in that: The bendable thermal conductive member has a closed cavity and a phase change thermal conductive material is arranged in the closed cavity, or the material of the bendable thermal conductive member includes at least one of graphene or carbon nanotubes; the bendable thermal conductive member has a width of not less than 10 mm, a thickness of less than 5 mm, and a thermal conductivity of not less than 1000 W / (m·K).

18. The heat dissipation structure according to claim 1, characterized in that: The temperature averaging plate is provided with fins, the power supply module includes a plurality of sub-modules, and the sub-modules are thermally connected to the temperature averaging plate; The side surface of the submodule is thermally connected to the fin; the fin is used for heat dissipation on the side surface of the submodule; The fins and the temperature averaging plate are integrally formed, or the fins and the temperature averaging plate are thermally connected.

19. The heat dissipation structure according to claim 1, characterized in that: The top heat dissipation device includes a top liquid cooling plate, the temperature equalizing plate is a bottom liquid cooling plate, the longitudinal heat conducting member is a liquid guiding hose, the top liquid cooling plate, the bottom liquid cooling plate and the liquid guiding hose have an internally connected cooling liquid chamber, and the cooling liquid chamber is provided with cooling liquid.

20. The heat dissipation structure according to claim 19, characterized in that: The cooling liquid chamber is a closed self-circulating chamber and the cooling liquid is a phase-change cooling liquid, or the cooling liquid chamber is connected to a cooling liquid pump fluid circuit.

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