Heat dissipation packaging structure of semiconductor power device

Abstract

The invention relates to the field of semiconductor power device heat dissipation packaging, in particular to a semiconductor power device heat dissipation packaging structure which comprises two symmetrically-arranged heat dissipation plates, a semiconductor power device is clamped between the two heat dissipation plates, the interiors of the two heat dissipation plates are hollow, the two ends of each heat dissipation plate are symmetrically provided with insertion holes, and the insertion holes are communicated with the heat dissipation plates. An insertion pipe opposite to the insertion hole is arranged on the side wall of the end plate; according to the designed heat dissipation mode, heat is absorbed and dissipated through the heat dissipation plate, the surface, not making contact with the semiconductor power device, of the heat dissipation plate can be designed to be uneven, the contact area of the heat dissipation plate and the external environment is increased, and the heat dissipation effect of the heat dissipation plate is improved; in the embodiment, cooling liquid heat dissipation is main heat dissipation, heat absorbed by the heat dissipation plate can be fully taken away, and the heat dissipation plate continuously and effectively absorbs heat generated by operation of the semiconductor power device.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation packaging of semiconductor power devices, in particular to a heat dissipation packaging structure of semiconductor power devices. Background Art

[0002] Semiconductor power devices are the core devices for power electronic devices to achieve power conversion and power management, also known as power electronic devices. Their main functions include frequency conversion, voltage conversion, rectification, power conversion and management, and they also have energy-saving effects. They are widely used in power electronic fields such as mobile communications, consumer electronics, electric vehicles, rail transportation, industrial control, power generation and distribution.

[0003] Semiconductor power devices generate heat during operation, and the heat mainly comes from two aspects: one is the switching loss during the opening and closing process, and the other is the conduction loss when the current is turned on. The energy of these losses will be converted into heat energy, causing the temperature of each point of the device to rise. At the same time, the use environment and performance requirements of semiconductor power devices are becoming higher and higher, and the requirements for the heat dissipation capacity of the devices are also increasing. In addition, the current design of the semiconductor power device packaging structure has failed to meet the heat dissipation of semiconductor power devices. The failures caused by device heat dissipation problems account for more than half of the total failures, seriously affecting the stable operation of power electronic equipment.

[0004] Therefore, in order to solve the above problems, a semiconductor power device heat dissipation packaging structure is proposed. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: a semiconductor power device heat dissipation packaging structure described in the present invention comprises two symmetrically arranged heat dissipation plates, the two heat dissipation plates are used to clamp the semiconductor power device, and the two heat dissipation plates are hollow inside, each heat dissipation plate is symmetrically provided with plug holes at both ends, and hollow end plates are also provided at both ends of the heat dissipation plate, and a plug pipe opposite to the plug hole is provided on the side wall of the end plate;

[0007] The axes of two upper and lower adjacent jacks are arranged to intersect.

[0008] Preferably, a T-shaped slide groove is provided at the two end corners of each heat sink, and the slide groove is provided along the width direction of the heat sink; plug blocks are provided on both sides of the side walls of each end plate, the plug blocks are slidably connected to the end side walls, and T-shaped sliding pins are provided on the upper and lower surfaces of the plug blocks, the plug blocks slide along both sides of the heat sink into between the two heat sinks, and the sliding pins are embedded in the slide groove.

[0009] Preferably, the upper slide groove is arranged to be inclined upward, and the lower slide groove is arranged to be inclined downward.

[0010] Preferably, the cannula comprises a first hose and a second hose, the first hose is connected to the inside of the end plate, the end of the first hose is connected to the second hose, and the outer ring of the second hose is provided with a plurality of annular rings.

[0011] Preferably, a plurality of notches are provided on both sides of each heat dissipation plate, and a multi-layer card slot is provided on the inner side wall of each notch;

[0012] A heat absorbing block is arranged in each of the notches, and a card strip adapted to the card slot is arranged on the outer wall of the heat absorbing block, the heat absorbing block is embedded in the notch, and the card strip is embedded in the card slot;

[0013] A clamping plate is provided on the end surface of each heat absorbing block, and two clamping plates are relatively capable of clamping the pins of the semiconductor power device;

[0014] Preferably, a recess is formed on each of the clamping strips; a convex point adapted to the recess is provided in each of the clamping slots, the clamping strip is embedded in the clamping slot, and the convex point is embedded in the recess.

[0015] Preferably, a lead assembly for clamping a pin is provided on the outer end surface of each of the heat absorbing blocks, and the lead assembly includes a frame fixedly connected to the heat absorbing block, a pressure rod is slidably connected inside the frame, one end of the pressure rod passes through the frame in the direction of the pin, one end of the pressure rod is fixedly connected to a pressure plate, the pressure plate is pressed on the pin, the other end of the pressure rod is fixedly connected to a wire, the end of the wire passes through the outside of the frame and is fixedly connected to a connecting block.

[0016] Preferably, each of the clamping plates has a concave surface, and the pins can be embedded in the concave position.

[0017] Preferably, each of the pressing plates is arranged in an arc shape.

[0018] Preferably, a strip-shaped material slot is provided at the concave position of the clamping plate.

[0019] The present invention is beneficial in that:

[0020] 1. In the present invention, the heat dissipation method is designed to dissipate heat by absorbing heat from the heat sink. The surface of the heat sink that is not in contact with the semiconductor power device can be designed with some unevenness to increase the contact area between the heat sink and the external environment and improve the heat dissipation effect of the heat sink itself. The second method is to dissipate heat by the coolant flowing through the heat sink. In this embodiment, the coolant is used as the main heat dissipation method, which can fully remove the heat absorbed by the heat sink, so that the heat sink can continuously and effectively absorb the heat generated by the operation of the semiconductor power device.

[0021] 2. In the present invention, the packaging structure is designed. First, it can protect the semiconductor power device. The two heat sinks and the semiconductor power device clamped therebetween form a sandwich structure, which can protect the semiconductor power device from external damage. At the same time, the two end plates are cooperated to maximize the wrapping of the semiconductor power device. The axis of the plug and the plug hole are tilted. When the plug is inserted into the plug hole, the plug plays a role in squeezing the heat sink inward, that is, the two heat sinks are squeezed in the direction of the semiconductor power device, thereby improving the stability of the heat dissipation packaging structure and eliminating the trouble of fixing components such as screws. Second, the two flat heat sinks, after being matched with the semiconductor power device, even if the thickness increases, the space occupied still meets most installation environments, and has little impact on the installation environment of the semiconductor power device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional diagram of the heat dissipation packaging structure of the present invention;

[0023] Figure 2 It is a side view of the heat dissipation packaging structure in the present invention;

[0024] Figure 3 It is a schematic diagram of the cooperation between the semiconductor power device and the heat absorption block in the present invention;

[0025] Figure 4 is a three-dimensional diagram of the heat dissipation plate of the present invention;

[0026] Figure 5 is a three-dimensional diagram of the end plate of the present invention;

[0027] Figure 6 It is a side view of the end plate of the present invention;

[0028] Figure 7 It is a schematic diagram of the cooperation between the insert tube and the insert hole in the present invention;

[0029] Figure 8 is a cross-sectional view of the heat dissipation plate of the present invention;

[0030] Fig. 9 It is a structural schematic diagram of the chute in the present invention;

[0031] Fig.10 It is a three-dimensional diagram of the cooperation between the heat absorbing block and the heat dissipating plate in the present invention;

[0032] Fig.11 It is a schematic diagram of the structure of the semiconductor power device in the present invention;

[0033] Fig.12 A first-view stereoscopic view of the heat absorbing block in the present invention;

[0034] Fig.13 This is a first-view stereoscopic image of the heat absorption block in the present invention.

[0035] In the figure: 101, semiconductor power device; 102, pin; 1, heat sink; 2, socket; 3, end plate; 4, plug; 5, pipeline; 6, slide groove; 7, plug block; 8, slide pin; 9, pull rod; 10, spring; 11, telescopic groove; 12, first hose; 13, second hose; 14, annular ring; 15, notch; 16, slot; 17, heat absorbing block; 18, clip strip; 19, clamping plate; 20, recess; 21, frame; 22, pressure rod; 23, pressure plate; 24, wire; 25, connection block; 26, tension spring; 27, material slot DETAILED DESCRIPTION

[0036] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0037] Reference Figure 1 - Figure 8 A semiconductor power device heat dissipation packaging structure includes two symmetrically arranged heat dissipation plates 1, the two heat dissipation plates 1 are used to clamp the semiconductor power device 101, and the two heat dissipation plates 1 are hollow inside, each heat dissipation plate 1 has symmetrically opened plug holes 2 at both ends, and hollow end plates 3 are also arranged at both ends of the heat dissipation plate 1, and a plug pipe 4 opposite to the plug hole 2 is arranged on the side wall of the end plate 3;

[0038] The axes of the two adjacent jacks 2 are arranged to intersect each other;

[0039] In this embodiment, the designed heat dissipation packaging structure can perform double-sided heat dissipation packaging for the semiconductor power device 101, that is, two heat dissipation plates 1 are attached to the two sides of the semiconductor power device 101, and the heat dissipation plates 1 absorb the heat generated by the operation of the semiconductor power device 101, and then the heat is removed by the coolant flowing through the heat dissipation plates 1;

[0040] Heat dissipation paste is applied to the two surfaces of the semiconductor power device 101 to fill the gap between the heat sink 1 and the semiconductor power device 101, so that the heat on the semiconductor power device 101 can be fully transferred to the heat sink 1, and then the end plates 3 are installed on both ends of the heat sink 1, and the plugs 4 on the end plates 3 are inserted into the sockets 2. The end plates 3 are also provided with pipes 5 for transmitting coolant. Two pipes 5 are provided on each end plate 3, and each pipe 5 is connected to the two plugs 4 on the same layer of each end plate 3; the two tubes on one end plate 3 are liquid inlet pipes, and the two tubes on the other end plate 3 are liquid outlet pipes.

[0041] The cooling liquid is injected into the liquid inlet pipe through an external liquid pump, and the cooling liquid flows into the hollow end plate 3, and flows through the insert pipe 4 to the heat sink 1. During the cooling liquid flowing in the heat sink 1, the heat absorbed by the heat sink 1 is taken away, and finally the cooling liquid flows out from the liquid outlet pipe on the other end plate 3 to achieve heat dissipation of the semiconductor power device 101;

[0042] In this embodiment, the heat dissipation method is designed to, first, rely on the heat dissipation of the heat plate 1 to absorb heat. The surface of the heat plate 1 that is not in contact with the semiconductor power device 101 can be designed with some unevenness to increase the area of ​​the heat plate 1 in contact with the external environment and improve the heat dissipation effect of the heat plate 1 itself. Second, rely on the coolant flowing through the heat plate 1 to dissipate heat. In this embodiment, the coolant heat dissipation is the main heat dissipation, which can fully remove the heat absorbed by the heat plate 1, so that the heat plate 1 continuously and effectively absorbs the heat generated by the operation of the semiconductor power device 101.

[0043] In this embodiment, the packaging structure is designed to, firstly, protect the semiconductor power device 101. The two heat sinks 1 and the semiconductor power device 101 sandwiched therebetween form a sandwich structure, which can protect the semiconductor power device 101 from external damage. At the same time, the two end plates 3 are used to maximize the wrapping of the semiconductor power device 101. The axis of the insert 4 and the socket 2 are tilted. When the insert 4 is inserted into the socket 2, the insert 4 squeezes the heat sink 1 toward the center, that is, the two heat sinks 1 squeeze toward the semiconductor power device 101, thereby improving the stability of the heat dissipation packaging structure and eliminating the trouble of fixing components such as screws. Secondly, the two flat heat sinks 1, after being matched with the semiconductor power device 101, even if the thickness increases, the occupied space still meets most installation environments, and has little impact on the installation environment of the semiconductor power device 101.

[0044] Reference Figure 1 - Fig.10 , a T-shaped slide groove 6 is provided at the corner positions of both ends of each heat dissipation plate 1, and the slide groove 6 is provided along the width direction of the heat dissipation plate 1; plug blocks 7 are provided on both sides of the side wall of each end plate 3, and the plug blocks 7 are slidably connected to the end side wall, and T-shaped sliding pins 8 are provided on the upper and lower surfaces of the plug blocks 7, and the plug blocks 7 slide along the two sides of the heat dissipation plate 1 into between the two heat dissipation plates 1, and the sliding pins 8 are embedded in the slide groove 6;

[0045] A pull rod 9 is provided at one end of the plug block 7, and the pull rod 9 is slidably connected to a telescopic slot 11 opened inside the end plate 3 through a spring 10, as shown in the figure, so that the plug block 7 can be pulled toward the end of the end plate 3;

[0046] When installing the end plate 3, first pull the plug block 7 outward from the end plate 3, then align the plug tube 4 with the plug hole 2 and insert it, then release the plug block 7, and the plug block 7 is reset under the elastic force of the spring 10, and slides into the two heat sinks 1 at the same time, and the sliding pin 8 on the plug block 7 is also embedded in the sliding groove 6. Due to the meshing fit of the sliding pin 8 and the sliding groove 6, the two heat sinks 1 can be further fixed, that is, the two heat sinks 1 can be stabilized;

[0047] Furthermore, the socket 2 slides into the two heat sinks 1 and presses against the corners of the semiconductor power device 101, thereby constraining the position of the semiconductor power device 101, constraining the semiconductor power device 101 between the two heat sinks 1, and preventing the semiconductor power device 101 from moving between the two heat sinks 1.

[0048] Reference Figure 1 - Fig.10 , the upper chute 6 is arranged to be inclined upward, and the lower chute 6 is arranged to be inclined downward;

[0049] The inclined angle design of the slide groove 6, combined with the working principle of the sliding pin 8, is the same as the working principle of the insert tube 4 in conjunction with the socket 2, and plays a role in squeezing the heat sink 1 toward the center; specifically, the spring 10 tightens the slider, the slider moves with the sliding pin 8, the sliding pin 8 slides into the slide groove 6, and during the sliding process, the sliding pin 8 pulls the heat sink 1 toward the center, so that the two heat sinks 1 are squeezed toward the center on the surface of the semiconductor power device 101, further improving the heat dissipation and the packaging firmness between the semiconductor power device 101, and at the same time, the elastic force of the spring 10 also plays a self-locking role, that is, the sliding pin 8 is stably locked in the slide groove 6.

[0050] Reference Figure 1 - Fig.10 The cannula 4 includes a first hose 12 and a second hose 13. The first hose 12 is connected to the inside of the end plate 3. The end of the first hose 12 is connected to the second hose 13. The outer ring of the second hose 13 is provided with a plurality of annular rings 14.

[0051] Considering the sealing between the plug tube 4 and the socket 2, the axis of the plug tube 4 is tilted, which may affect the sealing between the plug tube 4 and the socket 2. For this reason, the plug tube 4 is made of elastic rubber material, and the hardness of the first hose 12 is greater than the hardness of the second hose 13. The second hose 13 is fully inserted into the socket 2 and can be fully attached to the socket 2. Together with the annular ring 14 on its surface, the sealing between the socket 2 and the plug tube 4 is ensured. The first hose 12 plays a squeezing role, that is, squeezing the two heat sinks 1 to ensure that after the plug tube 4 is inserted into the socket 2, it still exerts a squeezing force on the two heat sinks 1 toward the center.

[0052] Reference Figure 1 - Fig.13, a plurality of notches 15 are provided on both sides of each heat dissipation plate 1, and a multi-layer card slot 16 is provided on the inner side wall of each notch 15;

[0053] A heat absorbing block 17 is disposed in each of the notches 15, and a card strip 18 adapted to the card slot 16 is disposed on the outer wall of the heat absorbing block 17. The heat absorbing block 17 is embedded in the notch 15, and the card strip 18 is embedded in the card slot 16.

[0054] A clamping plate 19 is provided on the end surface of each heat absorbing block 17, and two clamping plates 19 are relatively capable of clamping the pins 102 of the semiconductor power device 101;

[0055] When the semiconductor power device 101 is in operation, not only the semiconductor power device 101 itself generates heat, but also the multiple pins 102 thereon generate heat when current passes through them, which also has an adverse effect on the stable operation of the semiconductor power device 101. It is necessary to remove the heat on the pins 102 in time. For this purpose, a heat absorbing block 17 is designed in this embodiment, and the heat absorbing block 17 can absorb the heat on each pin 102.

[0056] Two heat sinks 1 are installed on the semiconductor power device 101, and then two end plates 3 are installed. Then, the heat absorbing blocks 17 are installed in the notches 15 one by one. When installing the heat absorbing blocks 17, the clamping strips 18 are embedded in the clamping grooves 16 to stabilize the heat absorbing blocks 17 on the heat sink 1. At the same time, the clamping plates 19 on the two heat absorbing blocks 17 are attached and pressed on the pins 102. The heat absorbing blocks 17 absorb the heat generated by the pins 102. At the same time, the heat sink 1 absorbs the heat on the heat absorbing blocks 17 and discharges the heat in time. The clamping plates 19 are pressed on the pins 102 relative to the clamping plates 19, which can also protect the pins 102 to prevent the pins 102 from breaking and being damaged at their roots.

[0057] Reference Fig.10 - Fig.13 , each of the clamping strips 18 is provided with a recess 20; each of the clamping slots 16 is provided with a convex point adapted to the recess 20, the clamping strip 18 is embedded in the clamping slot 16, and the convex point is embedded in the recess 20;

[0058] The heat absorbing block 17 is embedded in the notch 15 to constrain the heat absorbing block 17 from moving to both sides thereof. The clamping strip 18 is embedded in the clamping slot 16 to constrain the heat absorbing block 17 in the vertical direction. The convex point is embedded in the concave portion 20 to fix the heat absorbing block 17 in the notch 15 to prevent the heat absorbing block 17 from escaping from the notch 15 in the horizontal direction, that is, the heat absorbing block 17 is constrained in three dimensions, and at the same time, the heat absorbing block 17 and the pin 102 are constrained so that the heat absorbing block 17 can always be aligned with the pin 102.

[0059] Reference Fig.12 - Fig.13A lead assembly for clamping the pin 102 is provided on the outer end surface of each of the heat absorbing blocks 17, and the lead assembly includes a frame 21 fixedly connected to the heat absorbing block 17, a pressure rod 22 is slidably connected in the frame 21, one end of the pressure rod 22 passes through the frame 21 in the direction of the pin 102, a pressure plate 23 is fixedly connected to one end of the pressure rod 22, the pressure plate 23 presses on the pin 102, and a wire 24 is fixedly connected to the other end of the pressure rod 22, and the end of the wire 24 passes through the outside of the frame 21 and is fixedly connected to a connecting block 25;

[0060] Considering that each pin 102 of the semiconductor power device 101 is relatively fragile and easy to be damaged, a lead assembly is provided for the electrical transmission of the pin 102 and the protection of the pin 102; the designed frame 21 is made of insulating material, the clamping plate 19 is pressed on the pin 102, the end of the pin 102 is exposed, and the pressure rod 22 is connected to the frame 21 through a tension spring 26. The tension of the tension spring 26 acts on the pressure rod 22 and is then transmitted to the pressure plate 23. The pressure plate 23 is stably pressed on the pin 102. The pressure plate 23 is pressed on the pin 102 and is electrically connected to the pin 102. A wire 24 is fixedly connected to the pressure rod 22, and a connection block 25 is provided at the end of the wire 24, which can fix the external wire on the connection block 25, and this can prevent the pin 102 from being directly welded to the external circuit board or wire, thereby protecting the pin 102.

[0061] Reference Fig.13 Each of the clamping plates 19 has a concave surface, and the pins 102 can be embedded in the concave position;

[0062] The surfaces opposite to the clamping plates 19 and the pins 102 are concavely arranged, so that the pins 102 can be wrapped in the two opposite clamping plates 19, and the offset of the pins 102 and the clamping plates 19 can be constrained, so that the pins 102 can be stably placed between the two opposite clamping plates 19, avoiding contact between adjacent pins 102, and also ensuring that the pins 102 can be accurately opposite to the pressure plate 23.

[0063] Reference Fig.12 - Fig.13 , each of the pressing plates 23 is arranged in an arc shape; during the process of the heat absorption block 17 sliding into the notch 15, the two ends of the pressing plate 23 are tilted and tilted, reducing the problem of the end of the pressing plate 23 pressing on the end of the pin 102, so as to avoid pressing on the pin 102 and squeezing and bending the diameter pin 102.

[0064] Reference Fig.13A strip-shaped material groove 27 is provided at the concave position of each clamping plate 19; the pins 102 are flat or thin strip-shaped, and the material groove 27 is provided to clamp the thin strip-shaped pins 102, clamping the thin strip-shaped pins 102 in the middle position of the clamping plate 19, and the ends of the pins 102 are naturally aligned with the pressing plate 23, and the pressing plate 23 can effectively squeeze the thin strip-shaped pins 102.

[0065] Working principle: apply heat dissipation paste on the two surfaces of the semiconductor power device 101, fill the gap between the heat sink 1 and the semiconductor power device 101, so that the heat on the semiconductor power device 101 can be fully transferred to the heat sink 1, and then install the end plates 3 at both ends of the heat sink 1, insert the plug 4 on the end plate 3 into the socket 2, and the end plate 3 is also provided with a pipe 5 for transmitting the coolant. Two pipes 5 are provided on each end plate 3, and each pipe 5 is connected to the two plugs 4 on the same layer of each end plate 3; the two tubes on one end plate 3 are liquid inlet pipes, and the two tubes on the other end plate 3 are liquid outlet pipes.

[0066] The cooling liquid is injected into the liquid inlet pipe through an external liquid pump, and the cooling liquid flows into the hollow end plate 3, and flows through the insert pipe 4 to the heat sink 1. During the cooling liquid flowing in the heat sink 1, the heat absorbed by the heat sink 1 is taken away, and finally the cooling liquid flows out from the liquid outlet pipe on the other end plate 3 to achieve heat dissipation of the semiconductor power device 101;

[0067] At the same time, it is also taken into consideration that each pin 102 of the semiconductor power device 101 is relatively fragile and easy to be damaged. For this purpose, a lead assembly is provided for electrical transmission of the pin 102 and protection of the pin 102. The designed frame 21 is made of insulating material, the clamping plate 19 is pressed on the pin 102, the end of the pin 102 is exposed, and the pressure rod 22 is connected to the frame 21 through a tension spring 26. The tension of the tension spring 26 acts on the pressure rod 22 and is then transmitted to the pressure plate 23. The pressure plate 23 is stably pressed on the pin 102. The pressure plate 23 is pressed on the pin 102 and is electrically connected to the pin 102. A wire 24 is fixedly connected to the pressure rod 22, and a connection block 25 is provided at the end of the wire 24, which can fix the external wire on the connection block 25, and this can prevent the pin 102 from being directly welded to the external circuit board or wire, thereby protecting the pin 102.

[0068] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor power device heat dissipation packaging structure, characterized in that: The invention comprises two symmetrically arranged heat dissipation plates (1), the two heat dissipation plates (1) being used to clamp a semiconductor power device (101) therebetween, the two heat dissipation plates (1) being arranged in a hollow shape inside, plug holes (2) being symmetrically provided at both ends of each heat dissipation plate (1), hollow end plates (3) being also provided at both ends of the heat dissipation plates (1), and insert pipes (4) being provided on the side walls of the end plates (3) and being opposite to the plug holes (2); The axes of the two upper and lower adjacent insertion holes (2) are arranged to intersect.

2. A semiconductor power device heat dissipation packaging structure according to claim 1, characterized in that: Each of the heat sinks (1) is provided with a T-shaped slide groove (6) at the corner positions of both ends, and the slide groove (6) is provided along the width direction of the heat sink (1); each of the side walls of the end plates (3) is provided with an insert block (7), the insert block (7) is slidably connected to the end side wall, and the upper and lower surfaces of the insert block (7) are provided with a T-shaped slide pin (8), the insert block (7) slides along the two sides of the heat sink (1) into between the two heat sinks (1), and the slide pin (8) is embedded in the slide groove (6).

3. A semiconductor power device heat dissipation packaging structure according to claim 2, characterized in that: The upper slide groove (6) is arranged to be inclined upward, and the lower slide groove (6) is arranged to be inclined downward.

4. The semiconductor power device heat dissipation packaging structure according to claim 1, characterized in that: The cannula (4) comprises a first hose (12) and a second hose (13); the first hose (12) is connected to the interior of the end plate (3); the end of the first hose (12) is connected to the second hose (13); and the outer ring of the second hose (13) is provided with a plurality of annular rings (14).

5. The semiconductor power device heat dissipation packaging structure according to claim 2, characterized in that: A plurality of notches (15) are provided on both sides of each heat dissipation plate (1), and a multi-layered slot (16) is provided on the inner side wall of each notch (15); A heat absorbing block (17) is provided in each of the notches (15); a card strip (18) adapted to the card slot (16) is provided on the outer wall of the heat absorbing block (17); the heat absorbing block (17) is embedded in the notch (15), and the card strip (18) is embedded in the card slot (16); A clamping plate (19) is provided on the end surface of each heat absorbing block (17), and two clamping plates (19) are relatively capable of clamping the pins (102) of the semiconductor power device (101).

6. A semiconductor power device heat dissipation packaging structure according to claim 5, characterized in that: A recess (20) is provided on each of the clamping strips (18); a convex point adapted to the recess (20) is provided in each of the clamping slots (16); the clamping strip (18) is embedded in the clamping slot (16), and the convex point is embedded in the recess (20).

7. The semiconductor power device heat dissipation packaging structure according to claim 5, characterized in that: A lead assembly for clamping the pin (102) is provided on the outer end surface of each heat absorbing block (17), and the lead assembly comprises a frame (21) fixedly connected to the heat absorbing block (17), a pressure rod (22) is slidably connected inside the frame (21), one end of the pressure rod (22) passes through the frame (21) in the direction of the pin (102), one end of the pressure rod (22) is fixedly connected to a pressure plate (23), the pressure plate (23) is pressed on the pin (102), the other end of the pressure rod (22) is fixedly connected to a wire (24), the end of the wire (24) passes through the outside of the frame (21) and is fixedly connected to a connecting block (25).

8. The semiconductor power device heat dissipation packaging structure according to claim 5, characterized in that: Each of the clamping plates (19) has a concave portion formed on its surface, and the pins (102) can be embedded in the concave portion.

9. The semiconductor power device heat dissipation packaging structure according to claim 7, characterized in that: Each of the pressing plates (23) is arranged in an arc shape.

10. The semiconductor power device heat dissipation packaging structure according to claim 8, characterized in that: A strip-shaped material slot (27) is provided at the concave position of the clamping plate (19).

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