Flexible circuit board, display device and manufacturing method thereof

Abstract

The present application relates to a flexible circuit board, a display device and a manufacturing method thereof. The flexible circuit board includes a bonding area and a main body area connected to the bonding area. A plurality of first bonding pins arranged at intervals are arranged in the bonding area. The flexible circuit board also includes at least one exhaust channel. The exhaust channel includes a first channel opening located in the bonding area and a second channel opening located in the main body area. The exhaust channel passes through the interior of the flexible circuit board from the first channel opening to the second channel opening, wherein the first channel opening and the first bonding pin are located on the same side of the flexible circuit board. In this way, when the flexible circuit board and other components to be bonded are bonded to each other using conductive adhesive, the gas in the bonding area can be timely discharged from the first channel opening of the bonding area through the interior of the flexible circuit board and finally from the second channel opening of the main body area, thereby avoiding the gas from gathering in the conductive adhesive to form bubbles in the conductive adhesive, thereby improving the bonding reliability.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a flexible circuit board, a display device and a manufacturing method thereof. Background Art

[0002] With the development of semiconductor technology, people's dependence on and requirements for computer, communication and consumer electronic products are increasing. Often, a machine needs to have multiple functions. In order to integrate many functions into the same product while ensuring the thinness, small size and narrow frame of the product, the size of each component is bound to be reduced. For the bonding area of ​​display panels and circuit boards waiting for bonding components, when the size of the bonding area is reduced, the design space of the bonding pins in the bonding area is insufficient, resulting in the accumulation of conductive glue used for bonding around the bonding area. The gas in the bonding area is not easy to discharge and bubbles are formed in the conductive glue, which reduces the bonding reliability and increases the risk of peeling in the bonding area. Summary of the invention

[0003] Based on this, it is necessary to provide a flexible circuit board, a display device and a manufacturing method thereof that can avoid bubble formation, thereby improving bonding reliability and reducing the risk of peeling in the bonding area.

[0004] In a first aspect, an embodiment of the present application provides a flexible circuit board, the flexible circuit board comprising a bonding area and a main body area connected to the bonding area, wherein a plurality of first bonding pins arranged at intervals are provided in the bonding area; wherein:

[0005] The flexible circuit board also includes at least one exhaust channel, the exhaust channel includes a first channel opening located in the bonding area and a second channel opening located in the main area, the exhaust channel runs from the first channel opening through the interior of the flexible circuit board to the second channel opening, wherein the first channel opening and the first bonding pin are located on the same side of the flexible circuit board.

[0006] In one of the embodiments, the exhaust channel includes a first sub-channel, a second sub-channel and a third sub-channel;

[0007] The first subchannel runs through the first channel opening to the interior of the flexible circuit board, the third subchannel runs through the second channel opening to the interior of the flexible circuit board, and the second subchannel connects the first subchannel with the third subchannel inside the flexible circuit board.

[0008] In one embodiment, the extension direction of the first sub-channel and the third sub-channel are both perpendicular to the plane where the flexible circuit board is located, and the extension direction of the second sub-channel is parallel to the plane where the flexible circuit board is located.

[0009] In one embodiment, the flexible circuit board includes a metal layer, a support layer and a shielding layer which are stacked;

[0010] The second sub-channel is located in the metal layer, the supporting layer or the shielding layer.

[0011] In one embodiment, an alignment mark is further provided in the bonding area, the alignment mark and the first bonding pin are located on the same side of the flexible circuit board, and a plurality of the first bonding pins are distributed on a first side and a second side of the alignment mark that are opposite to each other along a first direction;

[0012] The first channel opening is located between two adjacent first bonding pins, between the first bonding pin and the first side of the alignment mark, between the first bonding pin and the second side of the alignment mark, on a third side of the alignment mark along the second direction, or on a fourth side of the alignment mark along the second direction, wherein the third side is opposite to the fourth side, and the second direction is perpendicular to the first direction;

[0013] Optionally, the second channel port and the first bonding pin are located on the same side or opposite sides of the flexible circuit board.

[0014] In one embodiment, a protrusion structure is further provided in the bonding area, and the protrusion structure and the first bonding pin are located on the same side of the flexible circuit board; and,

[0015] The protruding structure is located between the first bonding pin and the first side of the alignment mark, between the first bonding pin and the second side of the alignment mark, on a third side of the alignment mark along the second direction, or on a fourth side of the alignment mark along the second direction.

[0016] In a second aspect, an embodiment of the present application provides a display device, the display device comprising a display panel and a flexible circuit board as described in the first aspect above; wherein:

[0017] The display panel comprises a bonding area, in which a plurality of second bonding pins arranged at intervals are arranged, and the second bonding pins of the display panel are connected to the first bonding pins of the flexible circuit board in a one-to-one correspondence through conductive glue.

[0018] In one of the embodiments, the display device further includes a packaging adhesive layer; the packaging adhesive layer is used to package the flexible circuit board bonded to the display panel, and the packaging adhesive layer covers the second channel opening.

[0019] In a third aspect, an embodiment of the present application provides a method for manufacturing a display device, the method comprising:

[0020] A display panel and the flexible circuit board as described in the first aspect are provided, wherein the display panel comprises a bonding area, and a plurality of second bonding pins arranged at intervals are provided in the bonding area of ​​the display panel;

[0021] Applying conductive glue at least on the bonding area of ​​the display panel;

[0022] The flexible circuit board is pressed onto the display panel, so that the second bonding pins of the display panel are connected to the first bonding pins of the flexible circuit board in a one-to-one correspondence through the conductive adhesive.

[0023] In one of the embodiments, after laminating the flexible circuit board to the display panel, the method further comprises:

[0024] Performing pressurized degassing on the bonding area of ​​the display panel and the bonding area of ​​the flexible circuit board;

[0025] A packaging adhesive layer is formed on the surface of the flexible circuit board.

[0026] The above-mentioned flexible circuit board, display device and manufacturing method thereof, wherein the flexible circuit board includes a bonding area and a main body area connected to the bonding area, a plurality of first bonding pins arranged at intervals are provided in the bonding area, and since the flexible circuit board also includes at least one exhaust channel, the exhaust channel includes a first channel opening located in the bonding area and a second channel opening located in the main body area, the exhaust channel passes through the interior of the flexible circuit board from the first channel opening to the second channel opening, and the first channel opening and the first bonding pin are located on the same side of the flexible circuit board. In this way, when the flexible circuit board and other components to be bonded are bonded to each other using conductive adhesive, the gas in the bonding area can be timely discharged from the first channel opening of the bonding area through the interior of the flexible circuit board and finally from the second channel opening of the main body area, thereby avoiding the gas from gathering in the conductive adhesive to form bubbles in the conductive adhesive, thereby improving the bonding reliability and reducing the risk of peeling in the bonding area. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 A schematic diagram of bonding a display panel and a flexible circuit board in the related art;

[0029] Figure 2 for Figure 1 Schematic diagram of the cross section along line CC';

[0030] Figure 3 One of the schematic top views of a flexible circuit board in an embodiment along the direction from the inside of the flexible circuit board to the bonding pins of the flexible circuit board;

[0031] Figure 4 This is one of the cross-sectional schematic diagrams of the flexible circuit board along the DD' line in one embodiment;

[0032] Figure 5 The second cross-sectional schematic diagram of the flexible circuit board along the DD' line in one embodiment;

[0033] Figure 6 The third cross-sectional schematic diagram of the flexible circuit board along the DD' line in one embodiment;

[0034] Figure 7 The fourth cross-sectional schematic diagram of the flexible circuit board along the DD' line in one embodiment;

[0035] Figure 8 A second schematic top view of a flexible circuit board in an embodiment, along the direction from the inside of the flexible circuit board to the bonding pins of the flexible circuit board;

[0036] Fig. 9 A third schematic top view of a flexible circuit board in an embodiment, along the direction from the inside of the flexible circuit board to the bonding pins of the flexible circuit board;

[0037] Fig.10 is one of the schematic diagrams of a display device in an embodiment;

[0038] Fig.11 This is a second schematic diagram of a display device in an embodiment;

[0039] Fig.12 FIG. 4 is a flow chart of a method for manufacturing a display device in an embodiment.

[0040] Explanation of the accompanying drawings: 300-flexible circuit board, 310-bonding area, 320-main area, 330-exhaust channel, 3301-first channel opening, 3302-second channel opening, 331-first sub-channel, 332-second sub-channel, 333-third sub-channel, 301-first supporting layer, 302-first metal layer, 303-second supporting layer, 304-second metal layer, 305-third supporting layer, 306-first shielding layer, 340-alignment mark, 350-raised structure, 400-display panel, 500-conductive adhesive, 600-encapsulation adhesive layer. DETAILED DESCRIPTION

[0041] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0043] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0044] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0045] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least part of an element” means part or all of an element.

[0046] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0047] As mentioned in the background art, when the components to be bonded are bonded with conductive adhesive, the gas in the bonding area is not easy to be discharged and bubbles are formed in the conductive adhesive, which reduces the bonding reliability and increases the risk of peeling in the bonding area. The inventors have found that the reasons are:

[0048] Combination Figure 1 and Figure 2, taking the case where the display panel 110 and the flexible circuit board 120 are bonded to each other using the conductive adhesive 130 as an example, both the display panel 110 and the flexible circuit board 120 include a bonding area, and both bonding pins are provided in the bonding area. For the convenience of distinction, the bonding pins in the bonding area of ​​the display panel 110 are the second bonding pins, and the bonding pins in the bonding area of ​​the flexible circuit board 120 are the first bonding pins. The second bonding pins of the display panel 110 and the first bonding pins of the flexible circuit board 120 can correspond one to one. During bonding, the conductive adhesive 130 can be applied to the bonding area, that is, the adhesive can be dispensed in the bonding area. After the adhesive is dispensed, the flexible circuit board 120 can be pressed onto the display panel 110 by the pressure of the bonding pressure head, so that the first bonding pins of the flexible circuit board 120 and the second bonding pins of the display panel 110 are connected correspondingly through the conductive adhesive 130, thereby completing the bonding. Among them, due to the obvious height difference of the bonding pins between the bonding pin area 121 and the blank area 122 in the bonding area, the bonding pressure head pressures on the bonding pin area 121 and the blank area 122 are inconsistent, and the blank area 122 is relatively less stressed. The larger the area of ​​the blank area 122, the easier it is to generate gas during bonding. Moreover, since the size of the entire bonding area is originally small, the conductive adhesive 130 will accumulate around the bonding area during bonding, resulting in the gas generated during bonding being unable to be discharged from the bonding area in time, so that the gas forms bubbles 140 in the conductive adhesive 130 in the bonding area. The presence of bubbles 140 will make it easy for water vapor to penetrate into the bonding area, thereby reducing the bonding reliability and increasing the risk of peeling in the bonding area.

[0049] In view of this, the embodiments of the present application provide a flexible circuit board, a display device and a manufacturing method thereof, so as to timely discharge the gas generated in the bonding area during bonding, avoid the formation of bubbles in the conductive adhesive in the bonding area, thereby improving the bonding reliability and reducing the risk of peeling in the bonding area. Among them, the flexible circuit board provided in the embodiments of the present application includes but is not limited to FPC (Flexible Printed Circuit) or COF (Chip On Film), and the display device includes but is not limited to LCD (Liquid Crystal Display) display device or OLED (Organic Light Emitting Diode) display device.

[0050] In an exemplary embodiment, in combination Figure 3 and Figure 4, a flexible circuit board 300 is provided, the flexible circuit board 300 includes a bonding area 310 and a main body area 320 connected to the bonding area 310. Generally, the bonding area 310 can be located at the end of the flexible circuit board 300, and the area of ​​the flexible circuit board 300 other than the bonding area 310 can be used as the main body area 320, and the circuit in the flexible circuit board 300 can extend from the bonding area 310 to the main body area 320. A plurality of first bonding pins Pins arranged at intervals are provided in the bonding area 310, and the first bonding pins Pins are pins capable of conducting electricity and transmitting signals, and the plurality of first bonding pins Pins can be arranged in sequence along the same direction.

[0051] Among them, the flexible circuit board 300 also includes at least one exhaust channel 330, the exhaust channel 330 includes a first channel opening 3301 located in the bonding area 310 and a second channel opening 3302 located in the main area 320, the first channel opening 3301 and the first bonding pin Pin are located on the same side of the flexible circuit board 300, the exhaust channel 330 passes through the interior of the flexible circuit board 300 from the first channel opening 3301 to the second channel opening 3302, and the exhaust channel 330 is formed, for example, by punching or etching the flexible circuit board 300. In this way, the exhaust channel 330 runs through the bonding area 310 to the main body area 320. When the flexible circuit board 300 and other components to be bonded are bonded to each other using conductive adhesive, even if the conductive adhesive accumulates around the bonding area 310 so that the gas in the bonding area 310 cannot be discharged from the bonding area 310, the gas can be timely discharged from the first channel opening 3301 of the bonding area 310 through the interior of the flexible circuit board 300 and finally from the second channel opening 3302 of the main body area 320. That is, the gas passes through the interior of the flexible circuit board 300 from the bonding area 310 and finally from the main body area 320. This avoids the gas gathering in the conductive adhesive to form bubbles in the conductive adhesive, thereby improving the bonding reliability and reducing the peeling risk of the bonding area 310.

[0052] In the embodiment of the present application, the first channel opening 3301 in the bonding area 310 and the first bonding pin Pin in the bonding area 310 are located on the same side of the flexible circuit board 300, and the exhaust channel 330 runs through the bonding area 310 to the main area 320, so that the gas in the bonding area 310 that cannot be discharged from the surrounding side of the bonding area 310 can be timely discharged from the first channel opening 3301 of the bonding area 310 through the interior of the flexible circuit board 300 and finally completely discharged from the second channel opening 3302 of the main area 320, so as to completely discharge the gas in the bonding area 310, avoid gas accumulation and retention in the bonding area 310, thereby avoiding gas accumulation in the conductive adhesive to form bubbles in the conductive adhesive, thereby improving the bonding reliability and reducing the peeling risk of the bonding area 310.

[0053] In the embodiment of the present application, the exhaust channel 330 may be composed of a plurality of sub-channels interconnected with each other. There are various ways of connecting the sub-channels, ways of setting relative positions, shapes, etc., which are not specifically limited in the embodiment of the present application. Several of them are exemplified below but are not intended to be limitations of the present invention.

[0054] In an exemplary embodiment, reference Figure 5 The exhaust channel 330 includes a first sub-channel 331, a second sub-channel 332 and a third sub-channel 333. The first sub-channel 331 runs from the first channel opening 3301 to the interior of the flexible circuit board 300, the third sub-channel 333 runs from the second channel opening 3302 to the interior of the flexible circuit board 300, and the second sub-channel 332 connects the first sub-channel 331 with the third sub-channel 333 inside the flexible circuit board 300.

[0055] In this embodiment, the exhaust channel 330 includes a first sub-channel 331, a second sub-channel 332 and a third sub-channel 333, so that the exhaust channel 330 is easy to manufacture, thereby reducing the manufacturing cost of the flexible circuit board 300; in addition, the position of the first channel port 3301 for air intake in the bonding area 310 and the position of the second channel port 3302 for exhaust in the main area 320 can be adjusted by adjusting the positions of the first sub-channel 331, the second sub-channel 332 and the third sub-channel 333, that is, the position of the first channel port 3301 and the position of the second channel port 3302 are easy to adjust, so that they are easy to match with actual exhaust requirements.

[0056] Among them, the angle between the extension direction of the first sub-channel 331 and the third sub-channel 333 and the plane where the flexible circuit board 300 is located can be less than 90°, equal to 90° or greater than 90°, that is, the first sub-channel 331 and the third sub-channel 333 can be inclined or vertically set inside the flexible circuit board 300, and the second sub-channel 332 can be inclined or horizontally set inside the flexible circuit board 300, which is easy to match with actual exhaust requirements, and this embodiment does not make specific limitations on this.

[0057] In an exemplary embodiment, reference Figure 6 The extension direction of the first sub-channel 331 and the third sub-channel 333 are both perpendicular to the plane where the flexible circuit board 300 is located, that is, the first sub-channel 331 and the third sub-channel 333 are vertically arranged inside the flexible circuit board 300; the extension direction of the second sub-channel 332 is parallel to the plane where the flexible circuit board 300 is located, that is, the second sub-channel 332 is horizontally arranged inside the flexible circuit board 300.

[0058] In this embodiment, the first sub-channel 331 and the third sub-channel 333 are vertically arranged inside the flexible circuit board 300 and the second sub-channel 332 is horizontally arranged inside the flexible circuit board 300, which not only makes the exhaust channel 330 easy to manufacture, but also helps the gas in the bonding area 310 to be completely discharged from the main area 320 through a shorter path, thereby improving the exhaust efficiency.

[0059] In an exemplary embodiment, the flexible circuit board 300 includes a metal layer, a support layer, and a shielding layer which are stacked, and the second sub-channel 332 is located in the metal layer, the support layer, or the shielding layer.

[0060] In this embodiment, the flexible circuit board 300 may be composed of a plurality of film layers stacked together, and the second sub-channel 332 may be located in one of the film layers. For example, the flexible circuit board 300 may be composed of at least one metal layer, at least one support layer and at least one shielding layer stacked together, and the second sub-channel 332 may be located in one of the metal layers, the support layer or the shielding layer. The metal layer may be used to form the circuit and line inside the flexible circuit board 300, and may also be used to form the first bonding pin Pin. The material of the metal layer is, for example, copper (Cu). As the base material layer of the flexible circuit board 300, the support layer may not only support the metal layer and the shielding layer, but also isolate and insulate the adjacent metal layers. The support layer may also be used as the outer surface layer of the flexible circuit board 300 to protect the circuit and line inside the flexible circuit board 300. The material of the support layer may be, for example, polyimide (PI). The shielding layer may be used as the outer surface layer of the flexible circuit board 300 to shield and protect the circuit and line inside the flexible circuit board 300. The shielding layer may be, for example, an electromagnetic (EMI) shielding layer.

[0061] In an exemplary embodiment, the first channel opening 3301 is located in the metal layer, the supporting layer or the shielding layer, and the second channel opening 3302 is located in the metal layer, the supporting layer or the shielding layer, that is, the exhaust channel 330 can pass through the metal layer, the supporting layer or the shielding layer to the inside of the flexible circuit board 300, and then can pass through from the inside of the flexible circuit board 300 to the metal layer, the supporting layer or the shielding layer.

[0062] In an exemplary embodiment, reference Figure 7 , along the first bonding pin Pin pointing to the internal direction of the flexible circuit board 300, the flexible circuit board 300 includes a first supporting layer 301, a first metal layer 302, a second supporting layer 303, a second metal layer 304, a third supporting layer 305 and a first shielding layer 306 which are stacked in sequence, wherein the first metal layer 302 and the second metal layer 304 can both be used to form circuits and lines inside the flexible circuit board 300, and can also be used to form the first bonding pin Pin; the first supporting layer 301 and the third supporting layer 305 can be used as covering layers for the exposed surface of the first metal layer 302 and the exposed surface of the second metal layer 304, respectively, and the second supporting layer 303 can be used as a substrate layer of the flexible circuit board 300.

[0063] The second sub-channel 332 is located in the second metal layer 304, and the gas in the bonding area 310 can be discharged from the first channel opening 3301 in the bonding area 310 through the second metal layer 304 and finally from the second channel opening 3302 in the main area 320; the first channel opening 3301 is located in the first metal layer 302, which means that the first metal layer 302 in the blank area in the bonding area 310 is not covered by the first supporting layer 301 but exposed. In order to discharge the gas in the blank area, the first channel opening 3301 can be set in the first metal layer 302; the first metal layer 302 in the area convenient for exhaust in the main area 320 is not exposed but covered by the first supporting layer 301. At this time, the second channel opening 3302 can be set in the first supporting layer 301 (at this time, Figure 7 As shown, the first channel opening 3301, the second channel opening 3302 and the first bonding pin Pin are located on the same side of the flexible circuit board 300). Of course, the second channel opening 3302 can also be set on the first shielding layer 306 (at this time, only the first channel opening 3301 and the first bonding pin Pin are located on the same side of the flexible circuit board 300, and the second channel opening 3302 and the first bonding pin Pin are located on different sides of the flexible circuit board 300 (not shown in the figure). It can be seen that the first channel opening 3301 is set in the film layer closest to the component to be bonded in the bonding area 310 of the flexible circuit board 300 to ensure that the gas in the bonding area 310 enters from the first channel opening 3301; the second channel opening 3302 can be set in the film layer closest to the component to be bonded in the main area 320 of the flexible circuit board 300, and can also be set in the film layer farthest from the component to be bonded in the main area 320 of the flexible circuit board 300 to ensure that the gas is discharged from the second channel opening 3302.

[0064] In an exemplary embodiment, reference Figure 8 , the bonding area 310 of the flexible circuit board 300 is also provided with an alignment mark 340, and the alignment mark 340 and the first bonding pin Pin are located on the same side of the flexible circuit board 300. During bonding, the alignment mark 340 can be used to align with the component to be bonded, and the component to be bonded can also be provided with an alignment mark that complements the alignment mark 340. For example, the first bonding pin Pin of the flexible circuit board 300 is aligned with the bonding pin Pin of the component to be bonded by using the alignment mark 340 on the flexible circuit board 300 and the alignment mark on the component to be bonded, so as to ensure bonding accuracy.

[0065] The multiple first bonding pins Pins on the flexible circuit board 300 are usually distributed on the first and second sides opposite to each other along the first direction x of the alignment mark 340, and the first channel opening 3301 is located between two adjacent first bonding pins Pins, between the first bonding pin Pin and the first side of the alignment mark 340, between the first bonding pin Pin and the second side of the alignment mark 340, on the third side of the alignment mark 340 along the second direction y, or on the fourth side of the alignment mark 340 along the second direction y, wherein the third side is opposite to the fourth side, and the second direction y is perpendicular to the first direction x.

[0066] In this embodiment, since there is usually a large blank area where the alignment mark 340 is located, it is easy to accumulate more gas compared with other areas. Therefore, the first channel opening 3301 is set on the side of the alignment mark 340, which is conducive to timely exhausting more gas and effectively improving the bonding reliability.

[0067] In an exemplary embodiment, reference Fig. 9 A protruding structure 350 is also provided in the bonding area 310 of the flexible circuit board 300, and the protruding structure 350 and the first bonding pin Pin are located on the same side of the flexible circuit board 300; and the protruding structure 350 is located between the first bonding pin Pin and the first side of the alignment mark 340, between the first bonding pin Pin and the second side of the alignment mark 340, the third side of the alignment mark 340 along the second direction y, or the fourth side of the alignment mark 340 along the second direction y.

[0068] In this embodiment, a protruding structure 350 can be provided in the blank area of ​​the flexible circuit board 300. When bonding is performed using a bonding pressure head, it is helpful to increase the bonding pressure in the blank area so that it is close to the bonding pressure in the first bonding pin Pin area, thereby facilitating the discharge of gas from the bonding area 310. The protruding structure 350 is protruded along the inside of the flexible circuit board 300 toward the first bonding pin Pin. Fig. 9 The protruding structure 350 is only exemplarily shown to be in the shape of a long strip, and the specific shape of the protruding structure 350 can be arbitrary, and this embodiment does not specifically limit the shape of the protruding structure 350.

[0069] In an exemplary embodiment, reference Fig.10, a display device is provided, the display device includes a display panel 400 and a flexible circuit board 300 provided in any of the above embodiments. The display panel 400 may be an LCD display panel or an OLED display panel, the display panel 400 includes a bonding area, a plurality of second bonding pins Pins arranged at intervals are provided in the bonding area of ​​the display panel 400, the second bonding pins Pins of the display panel 400 are also pins capable of conducting electricity and transmitting signals, and the second bonding pins Pins of the display panel 400 are connected to the first bonding pins Pins of the flexible circuit board 300 one by one through a conductive adhesive 500.

[0070] In this embodiment, due to the narrow frame requirement of the display device, the size of the bonding area of ​​the display panel 400 and / or the size of the bonding area 310 of the flexible circuit board 300 is relatively small. During bonding, the conductive adhesive 500 will accumulate around the bonding area 310, so that the gas in the bonding area 310 cannot be discharged from the bonding area 310 in time during bonding. Since the flexible circuit board 300 includes an exhaust channel 330, the gas can be discharged from the first channel opening 3301 of the bonding area 310 through the interior of the flexible circuit board 300 and finally completely discharged from the second channel opening 3302 of the main area 320 in time, that is, the gas passes through the interior of the flexible circuit board 300 from the bonding area 310 and finally completely discharged from the main area 320, thereby avoiding the gas from gathering in the conductive adhesive to form bubbles in the conductive adhesive, thereby improving the bonding reliability and reducing the peeling risk of the bonding area 310.

[0071] In an exemplary embodiment, reference Fig.11 The display device further includes an encapsulation layer 600, which is used to encapsulate the flexible circuit board 300 after being bonded to the display panel, and the encapsulation layer 600 covers the second channel opening 3302. The display panel may include a substrate and a light-emitting layer provided on the substrate. The above-mentioned second binding pin may be provided on the substrate, but the present disclosure is not limited thereto. After the flexible circuit board 300 is bonded to the display panel 400, part of the structure of the flexible circuit board 300 extends out of the lower edge 700 of the display panel 400; part of the encapsulation layer 600 is provided at the part of the flexible circuit board 300 extending out of the display panel 400, and another part of the encapsulation layer 600 seals the gap between the flexible circuit board 300 and the lower edge 700 of the display panel 400 (in the thickness direction of the display panel 400, there is a gap between the display panel 400 or the substrate of the display panel 400 and the flexible circuit board 300). When the encapsulation layer 600 can be in a strip shape and extend along the direction of the pixel row.

[0072] In this embodiment, after the flexible circuit board 300 is bonded to the display panel 400 , the flexible circuit board 300 needs to be packaged to support, fix, package and protect the bonding with the display panel 400 . Among them, the packaging of the flexible circuit board 300 can be performed by sealing the surface of the flexible circuit board 300 with a line of glue. The line of glue sealing can be dispensed along the edge of the display panel 400, the edge and the side of the flexible circuit board 300, so as to form a packaging glue layer 600 on the surface of the flexible circuit board 300, which can further prevent water vapor from entering the bonding area after the flexible circuit board 300 and the display panel 400 are bonded, and can also play a packaging and protection role for the Pin routing of the first bonding pin Pin on the flexible circuit board 300 that exceeds the outside of the display panel 400. In the process of sealing the surface of the flexible circuit board 300 with a line of glue, the line of glue seals the second channel opening 3302, that is, the packaging glue layer 600 covers the second channel opening 3302, thereby preventing external water vapor from entering the second channel opening 3302, ensuring reliable bonding of the display panel 400 and the flexible circuit board 300. It should be understood that the sealing of the second channel opening 3302 is completed simultaneously during the process of performing one-line glue sealing on the flexible circuit board 300, thereby saving the process step of sealing the second channel opening 3302 separately, so that the manufacturing cost of the display device is low.

[0073] In an exemplary embodiment, reference Fig.12 , a method for manufacturing a display device is provided, and the manufacturing method can be used to manufacture the display device provided by any of the above embodiments, and the manufacturing method comprises:

[0074] S1102, providing a display panel and a flexible circuit board, wherein the display panel includes a bonding area, and a plurality of bonding pins arranged at intervals are provided in the bonding area of ​​the display panel.

[0075] The flexible circuit board is the flexible circuit board 300 provided in any of the above embodiments.

[0076] S1104, coating conductive adhesive at least on the bonding area of ​​the display panel.

[0077] Glue dispensing may be performed in the bonding area of ​​the display panel and / or the bonding area 310 of the flexible circuit board 300 .

[0078] S1106, pressing the flexible circuit board onto the display panel, so as to connect the first bonding pins of the display panel and the second bonding pins of the flexible circuit board one by one through the conductive adhesive.

[0079] The flexible circuit board 300 can be pressed onto the display panel 400 by means of the pressure of the bonding head, so that the first bonding pin Pin of the flexible circuit board 300 and the second bonding pin Pin of the display panel 400 are correspondingly connected through the conductive adhesive 500, thereby completing the bonding.

[0080] In an exemplary embodiment, after S1106, the method further includes:

[0081] S1108: Degassing the bonding area of ​​the display panel and the bonding area of ​​the flexible circuit board under pressure.

[0082] Among them, pressure may be applied to the bonding area of ​​the display panel 400 and the bonding area 310 of the flexible circuit board 300 to perform pressurized degassing, so that gas is discharged from the bonding area 310, thereby improving bonding reliability.

[0083] S1110: forming a packaging adhesive layer on the surface of the flexible circuit board.

[0084] Among them, after pressurized degassing, glue is dispensed on the surface of the flexible circuit board 300 to form a packaging glue layer. The packaging glue layer encapsulates the flexible circuit board 300 to support, fix and protect the bonding of the flexible circuit board 300 and the display panel 400. At the same time, the packaging glue layer also seals the second channel opening 3302 of the main area 320 of the flexible circuit board 300, thereby preventing external water vapor from entering the second channel opening 3302, ensuring reliable bonding of the display panel 400 and the flexible circuit board 300.

[0085] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0086] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A flexible circuit board, characterized in that: The flexible circuit board includes a bonding area and a main body area connected to the bonding area, and a plurality of first bonding pins are arranged at intervals in the bonding area; wherein the flexible circuit board also includes at least one exhaust channel, and the exhaust channel includes a first channel opening located in the bonding area and a second channel opening located in the main body area, and the exhaust channel runs from the first channel opening through the interior of the flexible circuit board to the second channel opening, wherein the first channel opening and the first bonding pin are located on the same side of the flexible circuit board.

2. The flexible circuit board according to claim 1, characterized in that: The exhaust channel includes a first sub-channel, a second sub-channel and a third sub-channel; The first subchannel runs through the first channel opening to the interior of the flexible circuit board, the third subchannel runs through the second channel opening to the interior of the flexible circuit board, and the second subchannel connects the first subchannel with the third subchannel inside the flexible circuit board.

3. The flexible circuit board according to claim 2, characterized in that: The extension directions of the first sub-channel and the third sub-channel are both perpendicular to the plane where the flexible circuit board is located, and the extension direction of the second sub-channel is parallel to the plane where the flexible circuit board is located.

4. The flexible circuit board according to claim 3, characterized in that: The flexible circuit board comprises a metal layer, a support layer and a shielding layer which are stacked; The second sub-channel is located in the metal layer, the supporting layer or the shielding layer.

5. The flexible circuit board according to claim 1, characterized in that: An alignment mark is also provided in the bonding area, the alignment mark and the first bonding pin are located on the same side of the flexible circuit board, and a plurality of the first bonding pins are distributed on a first side and a second side of the alignment mark that are opposite to each other along a first direction; The first channel opening is located between two adjacent first bonding pins, between the first bonding pin and the first side of the alignment mark, between the first bonding pin and the second side of the alignment mark, on a third side of the alignment mark along the second direction, or on a fourth side of the alignment mark along the second direction, wherein the third side is opposite to the fourth side, and the second direction is perpendicular to the first direction; Optionally, the second channel port and the first bonding pin are located on the same side or opposite sides of the flexible circuit board.

6. The flexible circuit board according to claim 5, characterized in that: A protruding structure is also provided in the bonding area, and the protruding structure and the first bonding pin are located on the same side of the flexible circuit board; and, The protruding structure is located between the first bonding pin and the first side of the alignment mark, between the first bonding pin and the second side of the alignment mark, on a third side of the alignment mark along the second direction, or on a fourth side of the alignment mark along the second direction.

7. A display device, characterized in that: The display device comprises a display panel and a flexible circuit board as claimed in any one of claims 1 to 6; wherein, The display panel comprises a bonding area, in which a plurality of second bonding pins arranged at intervals are arranged, and the second bonding pins of the display panel are connected to the first bonding pins of the flexible circuit board in a one-to-one correspondence through conductive glue.

8. The display device according to claim 7, characterized in that: The display device further comprises a packaging adhesive layer; the packaging adhesive layer is used to package the flexible circuit board bonded to the display panel, and the packaging adhesive layer covers the second channel opening.

9. A method for manufacturing a display device, characterized in that: The method comprises: A display panel and a flexible circuit board as claimed in any one of claims 1 to 6 are provided, wherein the display panel comprises a bonding area, and a plurality of second bonding pins arranged at intervals are provided in the bonding area of ​​the display panel; Applying conductive glue at least on the bonding area of ​​the display panel; The flexible circuit board is pressed onto the display panel, so that the second bonding pins of the display panel are connected to the first bonding pins of the flexible circuit board in a one-to-one correspondence through the conductive adhesive.

10. The method according to claim 9, characterized in that After the flexible circuit board is pressed onto the display panel, the method further comprises: Performing pressurized degassing on the bonding area of ​​the display panel and the bonding area of ​​the flexible circuit board; A packaging adhesive layer is formed on the surface of the flexible circuit board.

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