Inner groove processing method of circuit board, circuit board and packaging structure

Abstract

The present invention discloses a method for processing an inner groove of a circuit board, a circuit board and a packaging structure. The method for processing an inner groove of a circuit board comprises: obtaining a region to be processed of the circuit board; controlling a tool to process the region to be processed to form a first groove; the first groove has an arc-shaped corner; controlling a laser beam to cut at least the portion between the arc-shaped corner of the first groove and the corresponding corner of the region to be processed to form an inner groove. The inner groove formed in the present invention is used to install and limit functional devices. The side wall of the inner groove consists of two parts, the first part is a vertical side wall formed by tool processing, which is conducive to contact and limit the edge of the functional device; the second part is a corner formed by laser cutting, which is conducive to avoiding the corner of the functional device. The laser beam is small, and the corner formed by laser cutting is closer to the corner of the functional device. The board space of the circuit board can be fully utilized, and reducing the amount of cutting is conducive to improving the structural strength of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board inner groove processing method, a circuit board and a packaging structure. Background Art

[0002] As 2.5D packaging is increasingly used, some FCCSP (Flip-Chip Chip Scale Package) products are becoming thicker and require an inner groove in the middle of the FCCSP product to embed chips and other components.

[0003] In the related art, when processing the inner groove of such products, especially when processing the inner groove with corners, due to the limitation of the size of the machining tool, it is usually necessary to process the inner groove larger than the chip size, resulting in waste of inner groove space; and it is easy to affect the structural strength of the FCCSP product. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a method for processing inner grooves of a circuit board, which can make the actual inner groove size processed closer to the theoretical size by combining tool processing and laser processing, thereby reasonably utilizing the space of the circuit board and ensuring the structural strength of the FCCSP product.

[0005] The present invention also provides a circuit board having an inner groove processed by the inner groove processing method of the circuit board.

[0006] The present invention further provides a packaging structure, which includes a first circuit board having an inner groove processed by the inner groove processing method of the circuit board.

[0007] According to a first aspect of the present invention, a method for processing an inner groove of a circuit board includes:

[0008] Get the area to be processed of the circuit board;

[0009] Controlling the tool to process the area to be processed to form a first groove; the first groove has an arc-shaped corner;

[0010] The laser beam is controlled to cut at least a portion between the arc-shaped corner of the first groove and a corresponding corner of the area to be processed to form an inner groove.

[0011] According to the inner groove processing method of the circuit board of the embodiment of the present invention, there are at least the following beneficial effects: the inner groove is processed in two steps by combining tool processing and laser cutting, and the first groove formed by tool processing has a side wall with high verticality; the arc corner structure of the first groove is expanded again by laser cutting, and at least the part between the arc corner of the first groove and the corner of the area to be processed is completely removed. The side wall of the inner groove thus formed consists of two parts, the first part is the vertical side wall formed by tool processing, which is conducive to the edge contact limit of the functional device; the second part is the corner formed by laser cutting, which is conducive to avoiding the corner of the functional device. Because the laser beam is small, it can cut a finer contour, and the corner formed by expanding the arc corner can be closer to the corner of the functional device, thereby making full use of the board space of the circuit board, and reducing the cutting amount is conducive to improving the structural strength of the FCCSP product.

[0012] According to some embodiments of the present invention, the laser beam cuts the circuit board to form a second groove, and the second groove is connected to the first groove to form the inner groove; a portion of the second groove is located between the arc-shaped corner of the first groove and the corresponding corner of the area to be processed, and the remaining portion of the second groove is located outside the area to be processed.

[0013] According to some embodiments of the present invention, the side wall of the second groove points in the direction of the groove opening along the bottom wall of the inner groove and is inclined away from the area to be processed.

[0014] According to some embodiments of the present invention, the corner of the area to be processed includes a first edge, the laser beam has a first cutting path corresponding to the first edge, and the first cutting path is offset outward by a first preset distance A relative to the first edge.

[0015] According to some embodiments of the present invention, the first preset distance A satisfies: 50um≤A≤70um.

[0016] According to some embodiments of the present invention, the step of controlling the tool to process the area to be processed to form a base groove includes:

[0017] Planning a first tool path and a second tool path of the to-be-processed area of ​​the circuit board according to the type of the tool;

[0018] Controlling the tool to perform processing along the first tool path to form the base groove;

[0019] Controlling the tool to perform processing along the second tool path to perform finish processing on the side wall of the base groove to form the first groove;

[0020] The second tool path is offset inwardly by a second preset distance B relative to the edge of the area to be processed, and the second preset distance B is equal to the radius of the tool.

[0021] According to some embodiments of the present invention, the light spot formed by the laser beam on the circuit board is less than or equal to 10 um.

[0022] According to some embodiments of the present invention, the step of obtaining the area to be processed of the circuit board includes:

[0023] Acquire image information of the circuit board, and identify positioning marks in the image information;

[0024] The area to be processed is determined based on the positioning mark and the input parameter information of the ideal inner groove.

[0025] According to the circuit board of the embodiment of the second aspect of the present invention, the circuit board is provided with an inner groove, the inner groove is used to install and limit functional components, and the inner groove is formed by the inner groove processing method of the circuit board described in the first aspect.

[0026] The circuit board according to the embodiment of the present invention has at least the following beneficial effects: the side wall of the inner groove is composed of two parts, the first part is a vertical side wall formed by tool processing, which is conducive to the contact and limit of the edge of the functional device; the second part is a corner formed by laser cutting, which is conducive to avoiding the corner of the functional device. Since the laser beam is small, it can cut a finer contour, and the corner formed by expanding the arc corner can be closer to the corner of the functional device, thereby making full use of the board space of the circuit board, and reducing the cutting amount is conducive to improving the structural strength of the FCCSP product.

[0027] According to the packaging structure of the embodiment of the third aspect of the present invention, the packaging structure includes: a first circuit board, which is provided with an inner groove, and the inner groove is formed by the inner groove processing method of the circuit board described in the first aspect; a functional device, the functional device is arranged in the inner groove, and the top surface of the functional device is in contact with the bottom wall of the inner groove, and at least part of the side wall of the inner groove limits the functional device; a second circuit board, which is pressed together with the first circuit board to close the inner groove, and the port of the functional device is electrically connected to the pad of the second circuit board.

[0028] The packaging structure according to the embodiment of the present invention has at least the following beneficial effects: in the first circuit board, the side wall of the inner groove is composed of two parts, the first part is a vertical side wall formed by tool processing, which is conducive to the edge contact limit of the functional device; the second part is a corner formed by laser cutting, which is conducive to avoiding the corner of the functional device. Since the laser beam is small, it can cut a finer contour, and the corner formed by expanding the arc corner can be closer to the corner of the functional device, thereby making full use of the board space of the circuit board, and reducing the cutting amount is conducive to improving the structural strength of the FCCSP product.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0031] Figure 1 It is a schematic flow chart of a method for processing an inner groove of a circuit board according to one embodiment of the present invention;

[0032] Figure 2 A schematic flow chart of a method for processing an inner groove of a circuit board in another embodiment of the present invention;

[0033] Figure 3 A schematic diagram of a process flow of a method for processing an inner groove of a circuit board in another embodiment of the present invention;

[0034] Figure 4 It is a structural schematic diagram of processing a first groove on a circuit board in one embodiment of the present invention;

[0035] Figure 5 It is a structural schematic diagram of processing a second groove on a circuit board in one embodiment of the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of a circuit board in one embodiment of the present invention;

[0037] Figure 7 FIG. 1 is a schematic diagram of a packaging structure in an embodiment of the present invention.

[0038] Reference numerals:

[0039] 1000. Packaging structure;

[0040] 100. Circuit board;

[0041] 10. inner groove; 11. first groove; 111. arc-shaped corner; 12. second groove;

[0042] 20. Area to be processed;

[0043] 30. Positioning mark;

[0044] 200. a first circuit board;

[0045] 300. Functional devices;

[0046] 400. A second circuit board. DETAILED DESCRIPTION

[0047] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0048] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0049] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0050] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0051] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0052] In a first aspect, the present application provides a method for processing an inner groove of a circuit board. Figure 1As shown, in some embodiments, the method includes the following steps:

[0053] Step S10, obtaining the area to be processed of the circuit board;

[0054] like Figure 4 As shown, the area to be processed 20 is the portion of the circuit board that needs to be cut corresponding to the ideal inner groove. Obtaining the area to be processed 20 of the circuit board 100 includes obtaining the edge profile, size, depth and position of the area to be processed 20 on the circuit board 100.

[0055] The ideal inner groove is a groove whose sidewalls are completely in contact with the edge of the functional device 300. Due to the processing method, there is a certain error between the inner groove 10 actually processed and the ideal inner groove. The area to be processed 20 in this embodiment is set corresponding to the ideal inner groove.

[0056] The edge contour of the area to be processed 20 is determined according to the edge of the functional device 300, and the edge contour of the area to be processed 20 is usually rectangular, that is, the area to be processed 20 has four straight edges arranged at right angles, and a corner is formed between two adjacent straight edges. It should be noted that the edge contour in this embodiment is not limited to a rectangle, and can also be other shapes forming a corner, and the two edges forming the corner can also be arcs.

[0057] Step S20, controlling the tool to process the area to be processed to form a first groove;

[0058] like Figure 4 As shown, the edge contour of the processing area 20 is a rectangle as an example, and the tool path is controlled within the edge contour of the processing area 20. At the corner position of the processing area 20, due to the size limitation of the tool itself, a right angle cannot be directly cut, but an arc corner 111 is formed.

[0059] The overall profile of the first groove 11 is surrounded by a straight edge and an arc-shaped corner 111. The straight edge coincides with the edge profile of the area to be processed 20 or is within the allowable error range. Since tool processing is conducive to ensuring the verticality between the groove wall and the top surface, the side wall corresponding to the straight edge is a vertical side wall.

[0060] Step S30, controlling the laser beam to cut at least the portion between the arc-shaped corner of the first groove and the corresponding corner of the area to be processed to form an inner groove.

[0061] See also Figures 4 to 6Based on the first groove 11 formed by tool processing, the arc-shaped corner 111 of the first groove 11 is expanded by laser cutting, and at least the part between the arc-shaped corner 111 of the first groove 11 and the corner of the area to be processed 20 is completely removed to form an inner groove 10 that is closer to the ideal inner groove shape.

[0062] The side wall of the inner groove 10 formed by machining is composed of two parts. The first part is a vertical side wall formed by tool machining, which is conducive to contact and limit the edge of the functional device 300; the second part is a corner formed by laser cutting, which is conducive to avoiding the corner of the functional device 300. Since the laser beam is small, a finer contour can be cut, and the corner formed by expanding the arc corner 111 can be closer to the corner of the functional device 300, thereby making full use of the board space of the circuit board 100, and reducing the amount of cutting is conducive to improving the structural strength of the circuit board 100.

[0063] Furthermore, in some embodiments, Figure 2 As shown, step S10 includes:

[0064] Step S11, acquiring image information of the circuit board, and identifying positioning marks in the image information;

[0065] The image information of the circuit board 100 is captured by a high-precision camera or scanning device. In the captured image information, a specific positioning mark 30 is identified by an image processing algorithm or software. The positioning mark 30 is usually pre-designed on the surface of the circuit board 100 to ensure accurate alignment during processing. The positioning mark 30 can be a plurality of positioning holes, a cross groove, etc.

[0066] The precise position and orientation of the circuit board 100 in the processing equipment can be determined by the positioning mark 30, thereby ensuring the accuracy of the processing. For example, the positioning mark 30 can be four positioning holes set on the circuit board 100, and a rectangular coordinate system is established by identifying the positions of the four positioning holes. Steps S20 and S30 are both processed based on the established rectangular coordinate system, which is conducive to reducing the error caused by different benchmarks in the two processes.

[0067] Step S12: determining the area to be processed based on the positioning mark and the input parameter information of the ideal inner groove.

[0068] The parameter information of the ideal inner groove includes size, shape and position; the parameter information of the base groove can be manually input into the processing equipment. Specifically, the input parameter information of the ideal inner groove can be a graphic or data.

[0069] The parameter information of the ideal inner groove is substituted into the rectangular coordinate system, so as to determine the edge profile, size, depth of the area to be processed 20 and the position of the area to be processed 20 on the circuit board 100 .

[0070] Through accurate identification of the positioning mark 30, it is possible to ensure that the tool and the laser generator are correctly aligned with the circuit board 100 during the processing, thereby greatly improving the processing accuracy and consistency. In other words, the position accuracy of the inner groove 10 formed by processing is improved, so that the side wall of the inner groove 10 can better contact and limit the functional device 300, so that the functional device 300 installed in the inner groove 10 can be effectively aligned and connected with the pads on other circuit boards, reducing welding problems caused by position deviation.

[0071] Further, in some embodiments, step S20 includes:

[0072] Step S21, planning a first tool path and a second tool path of the to-be-processed area of ​​the circuit board according to the type of the tool;

[0073] When planning the tool path, select the appropriate tool type, such as a milling cutter, based on the hardness and thickness of the material to be processed; determine the diameter, shape and material of the tool to ensure cutting efficiency and accuracy.

[0074] According to the type of tool, such as diameter, shape, material, etc., and the characteristics of the area to be processed 20, such as edge profile, size, depth, etc., a first tool path is planned for preliminary cutting of the circuit board to form the first groove 11. Ensure that the tool path can efficiently remove most of the excess material while avoiding unnecessary damage to the circuit board.

[0075] In order to finish the side wall of the first groove 11, a second tool path is planned. The second tool path is offset inwardly by a second preset distance B relative to the edge of the area to be processed 20. The second preset distance B is usually equal to the radius of the tool to ensure that the tool does not exceed the preset range during the processing, and the side wall of the base groove can be accurately trimmed. The second tool path can evenly remove excess material on the side wall of the base groove to obtain a smooth, vertical side wall and a curved corner 111.

[0076] Use CAD / CAM software to simulate the first and second tool paths to check the rationality and efficiency of the paths. Optimize the tool paths based on the simulation results to improve machining accuracy and efficiency.

[0077] Step S22, controlling the tool to perform processing along the first tool path to form a base groove;

[0078] Control the tool to process along the first cutting path to cut the circuit board. Through preliminary processing, most of the excess material on the circuit board is removed, providing a basis for subsequent fine processing.

[0079] The first tool path may be progressive from the center to the edge of the area to be processed 20, or may be continuously turned back between two opposite edges of the area to be processed 20. The specific trajectory of the first tool path is not limited in this embodiment. The base groove formed by processing may have a flat edge or a regular serrated edge. It should be noted that at least part of the edge of the base groove is at a certain distance from the edge contour of the area to be processed 20.

[0080] Step S23, controlling the tool to perform processing along the second tool path to perform fine processing on the side wall of the base groove to form the first groove;

[0081] On the basis of the base groove formed by the preliminary machining, the tool is controlled to perform machining along the second tool path to perform finish machining on the side wall of the first groove.

[0082] After fine machining, the side wall becomes smoother and more vertical, and an arc-shaped corner 111 is naturally formed at the corner due to the rotation and movement of the tool, thereby forming the first groove 11 with the arc-shaped corner 111.

[0083] In this embodiment, by planning different tool paths, the material removal efficiency during the processing is ensured, and over-cutting and tool damage are avoided. The preliminary processing and the finishing processing are processed separately, so that the side wall of the first groove 11 is smoother and more vertical.

[0084] The first tooling and the second tooling can be different tools in the tool set. This depends on the specific requirements of the processing, such as using a roughing tool to remove a large amount of material in the first time and using a finishing tool for detail processing in the second time. During the processing, it is also necessary to consider the settings of processing parameters such as cutting speed, feed rate, spindle speed, etc. The settings of these parameters should be adjusted according to the tool type, material characteristics and processing requirements.

[0085] Further, in some embodiments, for step S30, the laser beam cuts the circuit board to form a second groove 12, and the second groove 12 is connected to the first groove 11 to form an inner groove 10; specifically, when the edge contour of the processing area is a rectangle, the second groove 12 is formed corresponding to the four corners of the rectangle. Part of the second groove 12 is located between the arc-shaped corner 111 of the first groove 11 and the corresponding corner of the area to be processed 20, and the rest of the second groove 12 is located outside the area to be processed 20. In this way, the union of the second groove 12 and the first groove 11 can completely remove the area to be processed 20, and there is a certain cutting margin corresponding to the corner.

[0086] The edge of the second groove 12 corresponding to the bottom wall of the inner groove 10 can be flush with the edge of the area to be processed 20, or located outside the area to be processed 20; the edge of the second groove 12 formed on the surface of the circuit board 1200 is located outside the area to be processed 20. That is, the side wall of the second groove 12 points to the direction of the groove opening along the bottom wall of the inner groove 10, and is inclined away from the area to be processed 20. Limited by laser processing technology, the cutting amount of the groove top is usually greater than the cutting amount of the groove bottom. The present application avoids incomplete cutting of the arc corner 111 by designing a certain cutting margin. It can be understood that due to the existence of the vertical side wall, even if there is a certain gap between the side wall of the second groove 12 and the functional device 300, the functional device 300 can be limited by the vertical side wall.

[0087] Specifically, the corner of the area to be processed 20 includes a first edge, and the angle between the two first edges is the corner. The laser beam has a first cutting path corresponding to the first edge, and the first cutting path is offset outward by a first preset distance A relative to the first edge. The first preset distance A is the cutting margin. The first preset distance A is determined according to the depth of the inner groove 10. The deeper the inner groove 10, the larger the first preset distance A.

[0088] In practical applications, the thickness of FCCSP products is 0.5mm to 1.0mm, and the thickness of 2.5D packaged FCCSP products is usually 0.8mm to 1.5mm, and can even reach 1.5mm to 2.5mm. Based on this, the value range of the first preset distance A is 50um to 70um.

[0089] As the thickness of the FCCSP product increases, the first preset distance A can be adaptively increased, and this application does not limit this.

[0090] In some embodiments, there may be some overlap between the laser cutting area and the tool processing area, that is, the laser cutting can act on a portion of the vertical side wall, usually the portion where the vertical side wall connects to the arc corner 111, thereby absorbing errors in the processing process and avoiding the formation of a physical structure obstruction between the first groove 11 and the second groove 12.

[0091] The spot formed by the laser beam on the circuit board 100 is less than or equal to 10um, that is, the R angle of the corner formed by laser cutting is less than 10um. The laser light source can be a CO2 laser or a UV laser. The frequency of the laser beam is 40KHz to 45KHz, and the cutting speed is 230mm to 240mm, providing higher cutting efficiency and better cutting quality.

[0092] The depth of tool processing in step S20 is the same as the depth of laser cutting in step S30, which is conducive to improving the flatness of the bottom wall of the inner groove 10. In addition, an adhesive layer can be provided on the bottom wall of the inner groove 10 for bonding the functional device 300, and the adhesive layer can play a leveling and buffering role.

[0093] In a second aspect, the present application provides a circuit board. Figure 6 As shown, in some embodiments, the circuit board 100 is provided with an inner groove 10, and the inner groove 10 is used to install and limit the functional device 300. The inner groove 10 is formed by the inner groove processing method of the circuit board of the first aspect. The side wall of the inner groove 10 consists of two parts. The first part is a vertical side wall formed by tool processing, which is conducive to contact and limit the edge of the functional device 300; the second part is a corner formed by laser cutting, which is conducive to avoiding the corner of the functional device 300. Because the laser beam is small, it can cut a finer contour, and the corner formed by expanding the arc corner 111 can be closer to the corner of the functional device 300, so as to make full use of the board space of the circuit board 100, and reduce the amount of cutting to improve the structural strength of the circuit board 100.

[0094] In a third aspect, the present application provides a packaging structure 1000. Figure 7 As shown, in some embodiments, the package structure 1000 includes a first circuit board 200, a functional device 300 and a second circuit board 400, the first circuit board 200 is provided with an inner groove 10, and the inner groove 10 is formed by the inner groove processing method of the circuit board of the first aspect, that is, the second circuit board 400 can be the circuit board 100 provided by the second aspect; the functional device 300 is arranged in the inner groove 10, and the top surface of the functional device 300 is in contact with the bottom wall of the inner groove 10, and at least part of the side wall of the inner groove 10 limits the functional device 300; the second circuit board 400 is pressed with the first circuit board 200 to close the inner groove 10, the side of the functional device 300 away from the adhesive layer has a plurality of ports, the second circuit board 400 is formed with a plurality of pads, and the ports of the functional device 300 are electrically connected to the pads of the second circuit board 400 in a one-to-one correspondence. The package structure 1000 has the same technical effect as the inner groove processing method of the circuit board in each embodiment of the first aspect, and will not be repeated here.

[0095] The bottom wall of the inner groove 10 may be provided with an adhesive layer, and when the functional device 300 is placed in the inner groove 10, the edge of the functional device 300 is limited by the side wall of the inner groove 10, and the top surface of the functional device 300 is bonded and fixed by the adhesive layer. Thus, when the first circuit board 200 and the second circuit board 400 are pressed together, the functional device 300 can be kept in a predetermined position.

[0096] The functional device 300 may be a single chip or multiple components integrated through an interposer. When the functional device 300 includes multiple components, the multiple components may include a chip, a memory, a radio frequency unit, etc.; this application does not limit this.

[0097] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A method for processing an inner groove of a circuit board, wherein the inner groove is used to install and limit functional components, characterized in that: The method comprises: Get the area to be processed of the circuit board; Controlling the tool to process the area to be processed to form a first groove; the first groove has an arc-shaped corner; The laser beam is controlled to cut at least a portion between the arc-shaped corner of the first groove and a corresponding corner of the area to be processed to form an inner groove.

2. The inner groove processing method of the circuit board according to claim 1, characterized in that: The laser beam cuts the circuit board to form a second groove, and the second groove is connected with the first groove to form the inner groove; Part of the second groove is located between the arc-shaped corner of the first groove and the corresponding corner of the area to be processed, and the remaining part of the second groove is located outside the area to be processed.

3. The inner groove processing method of the circuit board according to claim 2, characterized in that: The side wall of the second groove points to the groove opening along the bottom wall of the inner groove and is inclined away from the area to be processed.

4. The inner groove processing method of a circuit board according to claim 2, characterized in that: The corner of the area to be processed includes a first edge, the laser beam has a first cutting path corresponding to the first edge, and the first cutting path is offset outwardly by a first preset distance A relative to the first edge.

5. The inner groove processing method of a circuit board according to claim 2, characterized in that: The first preset distance A satisfies: 50um≤A≤70um.

6. The inner groove processing method of a circuit board according to claim 1, characterized in that: The step of controlling the tool to process the area to be processed to form a base groove comprises: Planning a first tool path and a second tool path of the to-be-processed area of ​​the circuit board according to the type of the tool; Controlling the tool to perform processing along the first tool path to form the base groove; Controlling the tool to perform processing along the second tool path to perform finish processing on the side wall of the base groove to form the first groove; The second tool path is offset inwardly by a second preset distance B relative to the edge of the area to be processed, and the second preset distance B is equal to the radius of the tool.

7. The inner groove processing method of a circuit board according to any one of claims 1 to 6, characterized in that: The light spot formed by the laser beam on the circuit board is less than or equal to 10um.

8. The inner groove processing method of a circuit board according to any one of claims 1 to 6, characterized in that: The step of obtaining the area to be processed of the circuit board comprises: Acquire image information of the circuit board, and identify positioning marks in the image information; The area to be processed is determined based on the positioning mark and the input parameter information of the ideal inner groove.

9. A circuit board, characterized in that: The circuit board is provided with an inner groove, and the inner groove is used for installing and limiting functional components. The inner groove is formed by the inner groove processing method of the circuit board according to any one of claims 1 to 8.

10. A packaging structure, characterized in that: include: A first circuit board having an inner groove formed by processing the inner groove processing method of a circuit board according to any one of claims 1 to 8; A functional device, wherein the functional device is disposed in the inner groove, and a top surface of the functional device is in contact with a bottom wall of the inner groove, and at least a portion of a side wall of the inner groove limits the functional device; The second circuit board is pressed together with the first circuit board to close the inner groove, and the port of the functional device is electrically connected to the pad of the second circuit board.

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