Wafer mounting device and wafer mounting method

Abstract

The present application provides a wafer mounting device and a wafer mounting method, wherein the wafer mounting device includes a bearing platform, a glue dispensing device and a pressing device. The bearing platform includes a jig base and a horizontal adjustment platform, the jig base is fixedly arranged above the horizontal adjustment platform, and the jig base includes a bearing portion with a flat upper surface and a limiting portion arranged around the bearing portion. The glue dispensing device is used to perform glue dispensing operations on the surface of the wafer. The pressing device includes a pressing drive device and a pressing adsorption head arranged below the pressing drive device, and a pressing adsorption plane is arranged below the pressing adsorption head. The technical solution of the present application can complete a variety of work requirements including wafer glue dispensing, shipping and mounting of parts to be bonded, and improves the stability of the mounting process by providing a replaceable jig base. In addition, the technical solution of the present application also provides a protrusion in the center of the pressing adsorption plane to improve the glue diffusion process and avoid bubbles in the glue.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing, and more specifically, to a wafer mounting device and a wafer mounting method. Background Art

[0002] CMOS X-ray detectors are advanced imaging devices that can detect X-rays and convert them into electrical signals to generate images. Due to the strong penetrating power of X-rays, CMOS X-ray detectors are widely used in many fields, including but not limited to: medical imaging, including X-ray photography, CT scanning, radiotherapy, etc., to help doctors diagnose diseases and plan surgeries; industrial inspection, non-destructive testing of materials, such as detecting casting and welding defects and measuring material thickness; security inspection, including security inspections in public places such as airports, railway stations, docks, and border control; scientific research, such as studying the properties of materials and high-energy phenomena in the universe; art and archaeology, including cultural relics archaeology and artwork identification.

[0003] During operation, the CMOS X-ray detector first needs to convert the received X-rays into visible light, and then realize the conversion of visible light into electrical signals through the CMOS (complementary metal oxide semiconductor) chip. To realize the conversion of X-rays into visible light, cesium iodide is usually required as a conversion layer. Therefore, in the production process of CMOS X-ray detectors, it is necessary to bond cesium iodide modules to the surface of the CMOS chip. However, in the prior art, due to the lack of specialized mounting equipment and corresponding standardized mounting processes, the mounting efficiency and effect of cesium iodide modules are difficult to guarantee, and during the mounting process, bubbles are easily generated inside the glue, which has a negative impact on the imaging effect of the CMOS X-ray detector. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a wafer mounting device and a wafer mounting method, which can complete various work requirements including wafer dispensing, shipping and mounting of components to be bonded, etc. The wafer mounting device effectively improves the stability of wafer bonding of flat components by providing a replaceable fixture base, ensuring efficient and reliable completion of the wafer mounting process. In addition, the wafer mounting device also provides a raised portion at the center of the bonding adsorption plane to ensure that the center of the component to be bonded can first contact the glue during the bonding process, thereby improving the diffusion process of the glue and avoiding the appearance of bubbles in the glue.

[0005] In the first aspect, the present application provides a wafer mounting device, including a carrying platform, a glue dispensing device and a pressing device. Among them, the carrying platform includes a jig base and a horizontal adjustment platform, the jig base is fixedly arranged above the horizontal adjustment platform, and the jig base includes a carrying portion with a flat upper surface and a limiting portion arranged around the carrying portion. The glue dispensing device is used to perform glue dispensing operations on the surface of the wafer. The pressing device includes a pressing drive device and a pressing adsorption head arranged below the pressing drive device, and a pressing adsorption plane is arranged below the pressing adsorption head. When in use, the pressing device moves to the top of the carrying platform to press the flat plate-shaped component to be bonded with the wafer together.

[0006] In an implementable solution, the fixture base is installed on the horizontal adjustment platform in a detachable manner.

[0007] In an implementable solution, the bearing platform includes a plurality of fixture bases, each of which has a bearing portion and a limiting portion of different sizes.

[0008] In an practicable solution, the horizontal adjustment platform includes an adjustment base and a plurality of retractable adjustment rods. When in use, the fixture base is fixedly arranged above the adjustment base, and the horizontality of the adjustment base is changed by adjusting the length of the adjustment rods so that the upper surface of the bearing part is located in the horizontal plane.

[0009] In an practicable solution, a convex portion is provided at the center of the pressing and adsorption plane. When the pressing and adsorption plane adsorbs the component to be bonded, under the action of the convex portion, the center of the component to be bonded is lower than other parts.

[0010] In one feasible solution, the maximum height of the protrusion is 0.2 mm-0.4 mm.

[0011] In an practicable solution, the wafer mounting equipment further includes a flat plate buffer device for storing flat plate-shaped components to be mounted. The flat plate buffer device includes a flat plate bearing portion and a flat plate driving device, wherein a flat plate adsorption surface is provided on the upper portion of the flat plate bearing portion, and the flat plate driving device is used to drive the flat plate bearing portion to flip up and down.

[0012] In an practicable solution, the wafer mounting equipment further includes a wafer handling device. The wafer handling device includes a displacement module and a wafer adsorption module. The displacement module includes a horizontal displacement mechanism and a lifting mechanism installed on the horizontal displacement mechanism. The wafer adsorption module is installed at the bottom of the lifting mechanism and is used to adsorb one wafer or multiple wafers.

[0013] In an practicable solution, the wafer mounting device further includes a material unloading device. The material unloading device includes a wafer grabbing portion and a material unloading driving device, wherein a wafer adsorption portion is provided on the surface of the wafer grabbing portion, and the material unloading driving device is used to drive the wafer grabbing portion to translate and flip up and down.

[0014] In a second aspect, the present application also provides a wafer mounting method, using the aforementioned wafer mounting equipment to mount a flat-panel component on a wafer surface. The wafer mounting method includes:

[0015] S1. Place the wafer on the fixture base with the front side facing up, and adjust the wafer so that its surface remains level;

[0016] S2, the glue dispensing device dispenses glue on the surface of the wafer;

[0017] S3, the pressing device absorbs the component to be bonded, and then the pressing device drives the component to be bonded to move just above the surface of the wafer;

[0018] S4, moving the pressing device downward at a first speed;

[0019] S5. After the components to be bonded come into contact with the glue, when the bonding pressure reaches a first pressure, the pressing device stops moving and remains stationary for a first preset time to complete wafer bonding.

[0020] S6, stopping the pressing device from adsorbing the component to be bonded, and then controlling the pressing device to move upward and away from the wafer that has been bonded.

[0021] In an practicable solution, the interval from the end of step S2 to the contact between the parts to be bonded and the glue is no more than 5 seconds.

[0022] In an implementable solution, when the wafer is a CMOS chip and the component to be bonded is a cesium iodide module, the first speed is 0.05 mm / s-0.15 mm / s, the first pressure is 0.15 MPa-0.45 MPa, and the first preset time is 15 s-45 s.

[0023] Compared with the prior art, the beneficial effects of this application include at least:

[0024] The wafer mounting equipment of the present application can meet various work requirements including wafer dispensing, shipping and mounting of parts to be mounted, etc., reducing the need for manual participation and reducing the difficulty of operation, which helps to reduce the probability of wafer damage, improve production efficiency and improve the effect of wafer mounting. The wafer mounting equipment of the present application is provided with a special replaceable fixture base, which can effectively prevent the target wafer from being displaced during the mounting process, thereby excellently meeting the needs of reliability, stability and other aspects, and can adapt to the mounting needs of wafers of different sizes, and has a wide range of applications.

[0025] Furthermore, the wafer mounting equipment of the present application is also provided with a raised portion at the center of the pressing and adsorption plane. When the pressing and adsorption plane adsorbs the component to be bonded, the raised portion can ensure that the center of the component to be bonded is lower than other parts, so that the center of the component to be bonded can contact the glue first, thereby ensuring that the glue spreads orderly from the center to the surroundings during the pressing process, avoiding bubbles in the glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a schematic diagram of a carrying platform of a wafer mounting device according to an embodiment of the present application;

[0028] Figure 2 is a schematic diagram of a dispensing device;

[0029] Figure 3 is a schematic diagram of a pressing device;

[0030] Figure 4 is a schematic diagram of the pressed adsorption plane;

[0031] Figure 5 is a schematic diagram of a flat-panel cache device;

[0032] Figure 6 It is a schematic diagram of a wafer handling device and a detection device;

[0033] Figure 7 is a schematic diagram of a feeding device;

[0034] Figure 8 The present invention is a flowchart of a wafer mounting method according to an embodiment of the present application.

[0035] In the figure: 1. Carrying platform; 2. Glue dispensing device; 3. Pressing device; 4. Flat plate buffer device; 5. Wafer transport device; 6. Unloading device; 101. Fixture base; 102. Horizontal adjustment platform; 111. Carrying part; 112. Limiting part; 121. Adjusting base; 122. Adjusting rod; 201. Glue dispensing module; 202. Movement module; 221. Horizontal movement mechanism; 222. Vertical movement mechanism; 301. Pressing adsorption head; 302. Pressing drive device; 303. Pressing adsorption plane; 304. Raised part; 401. Flat plate carrying part; 402. Flat plate drive device; 411. Flat plate adsorption surface; 501. Displacement module; 502. Wafer adsorption module; 511. Horizontal displacement mechanism; 512. Lifting mechanism; 601. Wafer grabbing part; 602. Unloading drive device; 611. Wafer adsorption part. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0038] like Figure 1-Figure 3 As shown, the present application provides a wafer mounting device, including a carrying platform 1, a glue dispensing device 2 and a pressing device 3. Among them, the carrying platform 1 includes a fixture base 101 and a horizontal adjustment platform 102, the fixture base 101 is fixedly arranged above the horizontal adjustment platform 102, and the fixture base 101 includes a carrying portion 111 with a flat upper surface and a limiting portion 112 arranged around the carrying portion 111. The glue dispensing device 2 is used to perform glue dispensing operations on the surface of the wafer. The pressing device 3 includes a pressing drive device 302 and a pressing adsorption head 301 arranged below the pressing drive device 302.

[0039] When in use, the limiting portion 112 is higher than the bearing portion 111, so that the limiting portion 112 can be matched with the shape and size of the target wafer to be processed, so as to limit the target wafer and prevent it from being misplaced. The dispensing device 2 may include a dispensing module 201 and a motion module 202, and the motion module 202 includes a horizontal motion mechanism 221 and a vertical motion mechanism 222 installed on the horizontal motion mechanism 221. When in use, the motion module 202 can drive the dispensing module 201 to move to a designated position for dispensing. An air flow channel can be set inside the pressing adsorption head 301, and an air vent can be set on the surface and an external exhaust device can be connected. The air vent, the air flow channel and the air vents on the surface of the pressing adsorption head 301 form a complete air flow passage.

[0040] When in use, first adjust the horizontal adjustment platform 102 to make the base adsorption plane 111 in a horizontal state, and then place the wafer on the bearing part 111 to prevent the wafer from being displaced due to external interference. Then, the glue dispensing device 2 moves to the top of the bearing platform 1 and dispenses glue on the surface of the wafer. The specific glue dispensing amount and glue dispensing position can be determined according to actual work requirements. After that, the pressing device 3 absorbs the flat-plate-shaped component to be bonded and drives the component to be bonded to move to the top of the bearing platform 1, and then moves downward to press the component to be bonded with the wafer on which the glue is dispensed.

[0041] The present application provides a device specifically used for wafer mounting work, which can meet various work requirements including wafer dispensing, shipping and mounting of parts to be mounted, etc., reduces the need for manual participation and reduces the difficulty of operation, helps to reduce the probability of wafer damage, improve production efficiency and improve the effect of wafer mounting. Furthermore, due to the provision of a special replaceable fixture base 101, the wafer mounting equipment of the present application can effectively prevent the target wafer from being displaced during the mounting process, thereby excellently meeting the needs of reliability, stability and other aspects, and can adapt to the mounting requirements of wafers of different sizes, and has a wide range of applications.

[0042] In one embodiment, the fixture base 101 is installed on the horizontal adjustment platform 102 in a detachable manner. Specifically, the fixture base 101 can be detachably connected to the horizontal adjustment platform 102 by means of screw connection, snap connection, or magnetic connection, and the specific method is not limited here. In addition, a base connection portion can be fixedly provided below the fixture base 101, and the fixture base 101 can be detachably connected to the upper surface of the horizontal adjustment platform through the base connection portion.

[0043] In one embodiment, the carrier platform 1 includes a plurality of fixture bases 101, each fixture base 101 having a carrier portion 111 and a stop portion 112 of different sizes. In actual work, different types of fixture bases 101 can be appropriately replaced according to the size of the wafers to be spliced, so that the wafer mounting equipment of the present application has a better scope of application and flexibility, and can adapt to more complex production task requirements.

[0044] In one embodiment, if Figure 1 As shown, the horizontal adjustment platform 102 includes an adjustment base 121 and a plurality of retractable adjustment rods 122. When in use, the adsorption base 101 is fixedly disposed above the adjustment base 121, and the horizontality of the adjustment base 121 is changed by adjusting the length of the adjustment rod 122, so that the horizontality of the upper surface of the adjustment base 121 meets the requirements, and ensures that the base adsorption plane 111 is located in the horizontal plane. A laser displacement sensor can be installed on the upper surface of the adjustment base 121, and a servo motor can be arranged at the lower part of the adjustment rod 122, and the laser displacement sensor is connected to the servo motor signal. When in use, the laser displacement sensor will test the horizontality of the upper surface of the adjustment base 121 and transmit the signal to the servo motor, and then the servo motor will adjust the height accordingly until the horizontality of the upper surface of the adjustment base 121 meets the requirements.

[0045] In one embodiment, if Figure 4 As shown, a raised portion 304 is provided at the center of the pressing adsorption plane 303. During operation, when the pressing adsorption plane 303 adsorbs the component to be bonded, the raised portion 304 will support the central part of the component to be bonded, so that the central part of the component to be bonded is slightly lower than other parts. After adopting this design, if the component to be bonded and the wafer are pressed, the central part of the component to be bonded will first contact the surface of the wafer. The top surface of the raised portion 304 can be set to a plane or a relatively flat arc surface to avoid the presence of sharp structures such as spikes or edges on the raised portion 304, thereby minimizing the possibility of damage to the component to be bonded. The maximum height of the raised portion 304 can be set to 0.2mm-0.4mm, for example, the maximum height of the raised portion 304 can be 0.2mm, 0.25mm, 0.3mm, 0.35mm or 0.4mm, which can be determined according to actual needs.

[0046] In one embodiment, if Figure 5As shown, the wafer mounting equipment also includes a flat plate buffer device 4 for storing flat plate-shaped components to be bonded. The flat plate buffer device 4 includes a flat plate bearing portion 401 and a flat plate driving device 402, wherein a flat plate adsorption surface 411 is provided on the upper portion of the flat plate bearing portion 401. An air flow channel can be provided inside the flat plate bearing portion 401, and a vent can be provided on the surface of the flat plate bearing portion 401 and an external exhaust device can be connected. The vent, the air flow channel and the vent holes on the flat plate adsorption surface 411 form a complete air flow passage. When in use, the flat plate driving device 402 can drive the flat plate bearing portion 401 to drive the components to be bonded to flip up and down, so as to facilitate the implementation of some process flows, for example, it is convenient to clean the surfaces on both sides of the components to be bonded.

[0047] In one embodiment, if Figure 6 As shown, the wafer mounting equipment also includes a wafer handling device 5. The wafer handling device 5 includes a displacement module 501 and a wafer adsorption module 502. Among them, the displacement module 501 includes a horizontal displacement mechanism 511 and a lifting mechanism 512 installed on the horizontal displacement mechanism 511. The wafer adsorption module 502 is installed at the bottom of the lifting mechanism 512, and is used to adsorb one wafer or multiple wafers. In addition, the wafer adsorption module 502 can be detachably installed at the bottom of the lifting mechanism 512. In actual work, wafer adsorption modules 502 of different sizes or functions can be replaced to meet different work task requirements, or the wafer adsorption module 502 can be easily replaced when it is damaged.

[0048] In one embodiment, if Figure 7 As shown, the wafer mounting equipment also includes a material unloading device 6. The material unloading device 6 includes a wafer gripping part 601 and a material unloading driving device 602. Among them, a wafer adsorption part 611 is provided on the surface of the wafer gripping part 601, and the material unloading driving device 602 is used to drive the wafer gripping part 601 to translate and flip up and down. An air flow channel can be provided inside the wafer adsorption part 611, and an air vent can be provided on the surface and an external exhaust device can be connected. The air vent, the air flow channel and the wafer adsorption part 611 form a complete air flow passage. After the wafer mounting is completed, the material unloading driving device 602 can drive the wafer gripping part 601 to move above the carrier platform 1, and the wafer adsorption part 611 adsorbs the surface of the mounted wafer, and then drives the wafer gripping part 601 to leave the carrier platform 1 and reach the designated position, thereby completing the material unloading.

[0049] In one embodiment, the wafer mounting device further includes a wafer cleaning device, which includes a tornado cleaning device and / or a plasma cleaning device. During operation, the wafer cleaning device can be used to clean the surface of the wafer first, and then the wafer is placed on the carrying platform 1. In addition, before the pressing device 3 absorbs the component to be bonded, the wafer cleaning device can be used to clean the surface of the component to be bonded.

[0050] like Figure 8 As shown, the present application also provides a wafer mounting method, using the above-mentioned wafer mounting equipment to mount a flat component on the surface of a wafer. The wafer mounting method includes:

[0051] S1. Place the wafer on the fixture base with the front side facing up, and adjust the wafer so that its surface remains level;

[0052] S2, the glue dispensing device dispenses glue on the surface of the wafer;

[0053] S3, the pressing device absorbs the component to be bonded, and then the pressing device drives the component to be bonded to move just above the surface of the wafer;

[0054] S4, moving the pressing device downward at a first speed;

[0055] S5, after the component to be bonded contacts the glue, when the bonding pressure reaches a first pressure, the pressing device stops moving and remains stationary for a first preset time, thereby completing wafer bonding;

[0056] S6, stopping the pressing device from adsorbing the component to be bonded, and then controlling the pressing device to move upward and away from the wafer that has been bonded.

[0057] For a specific embodiment, such as mounting a cesium iodide module on the surface of a CMOS chip to make an X-ray detector, since this process is mounted on the front of the CMOS chip, it is necessary to ensure that the front of the CMOS chip is not damaged and to avoid bubbles in the glue. This places high demands on mounting accuracy, requiring precise control of mounting pressure, speed and time, which is difficult to meet if manual mounting or other traditional mounting methods are used.

[0058] In step S2, when mounting the cesium iodide module on the surface of the CMOS chip, epoxy resin glue with a viscosity of 200-500cps can be used for dispensing. During the dispensing process, the dispensing time can be controlled to be 15-25s (preferably 20s), the amount of glue can be 10-20g (preferably 15g), and the distance between the dispensing needle and the surface of the CMOS chip can be 1mm-2mm.

[0059] In step S3, when the cesium iodide module is mounted on the surface of the CMOS chip, since a protrusion 304 is provided at the center of the pressing and adsorption plane 303, when the pressing and adsorption plane 303 adsorbs the cesium iodide module, the protrusion 304 will support the center of the cesium iodide module, so that the center of the cesium iodide module is slightly lower than other parts. Therefore, in step S5, the center of the cesium iodide module will contact the glue before other parts, so that the glue can be orderly diffused from the center to the surroundings during the pressing process, thereby avoiding bubbles in the glue.

[0060] In steps S4-S5, when mounting the cesium iodide module on the surface of the CMOS chip, the first speed can be set to 0.05 mm / s-0.15 mm / s, the first pressure can be set to 0.15 MPa-0.45 MPa, and the first preset time can be set to 15 s-45 s. Preferably, the first speed can be set to 0.1 mm / s, the first pressure can be set to 0.3 MPa, and the first preset time can be set to 30 s.

[0061] In one embodiment, the interval from the end of step S2 to the contact between the component to be bonded and the glue is no more than 5 seconds. If the interval is too long, the performance of the glue may be reduced or even the glue may be cured prematurely, and the adhesive ability of the glue may not be guaranteed, thereby affecting the subsequent bonding effect. In severe cases, it may even cause the product to be scrapped, resulting in significant economic losses.

[0062] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer mounting device, characterized in that: include: A bearing platform (1) comprises a fixture base (101) and a level adjustment platform (102), wherein the fixture base (101) is fixedly arranged above the level adjustment platform (102), and the fixture base (101) comprises a bearing portion (111) having a flat upper surface and a limiting portion (112) arranged around the bearing portion (111); A glue dispensing device (2), used for performing glue dispensing operation on the surface of the wafer; The pressing device (3) comprises a pressing drive device (302) and a pressing adsorption head (301) arranged below the pressing drive device (302), and a pressing adsorption plane (303) is arranged below the pressing adsorption head (301); when in use, the pressing device (3) moves to the top of the supporting platform (1) to press the flat plate-shaped component to be bonded and the wafer together.

2. The wafer mounting equipment according to claim 1, characterized in that: The fixture base (101) is detachably mounted on the horizontal adjustment platform (102).

3. The wafer mounting equipment according to claim 1, characterized in that: The bearing platform (1) comprises a plurality of fixture bases (101), each of the fixture bases (101) having a bearing portion (111) and a limiting portion (112) of different sizes.

4. The wafer mounting equipment according to claim 1, characterized in that: The horizontal adjustment platform (102) comprises an adjustment base (121) and a plurality of retractable adjustment rods (122); When in use, the jig base (101) is fixedly arranged above the adjustment base (121), and the horizontality of the adjustment base (121) is changed by adjusting the length of the adjustment rod (122), so that the upper surface of the bearing part (111) is located in a horizontal plane.

5. The wafer mounting equipment according to claim 1, characterized in that: A protrusion (304) is provided at the center of the pressing and adsorption plane (303); When the pressing and adsorption plane (303) adsorbs the component to be bonded, under the action of the protrusion (304), the central part of the component to be bonded is lower than other parts.

6. The wafer mounting equipment according to claim 5, characterized in that: The maximum height of the protrusion (304) is 0.2 mm to 0.4 mm.

7. The wafer mounting equipment according to claim 1, characterized in that: It also includes a flat plate buffer device (4) for storing flat plate-shaped components to be bonded, and the flat plate buffer device (4) includes: A flat plate bearing portion (401), the upper portion of which is provided with a flat plate adsorption surface (411); The flat plate driving device (402) is used to drive the flat plate bearing part (401) to flip up and down.

8. The wafer mounting equipment according to claim 1, characterized in that: It also includes a wafer handling device (5), wherein the wafer handling device (5) includes: A displacement module (501) comprises a horizontal displacement mechanism (511) and a lifting mechanism (512) installed on the horizontal displacement mechanism (511); The wafer adsorption module (502) is installed at the bottom end of the lifting mechanism (512) and is used to adsorb one wafer or multiple wafers.

9. The wafer mounting equipment according to claim 1, characterized in that: The invention also comprises a material discharging device (6), wherein the material discharging device (6) comprises: A wafer grabbing portion (601) having a wafer adsorption portion (611) disposed on its surface; The material unloading driving device (602) is used to drive the wafer grabbing part (601) to move horizontally and flip up and down.

10. A wafer mounting method, characterized in that: Using the wafer mounting device as described in any one of claims 1 to 9 to mount a flat-panel component on a wafer surface, the wafer mounting method comprising: S1. Place the wafer on the fixture base with the front side facing up, and adjust the wafer so that its surface remains level; S2, the glue dispensing device dispenses glue on the surface of the wafer; S3, the pressing device absorbs the component to be bonded, and then the pressing device drives the component to be bonded to move just above the surface of the wafer; S4, moving the pressing device downward at a first speed; S5, after the component to be bonded contacts the glue, when the bonding pressure reaches a first pressure, the pressing device stops moving and remains stationary for a first preset time, thereby completing wafer bonding; S6, stopping the pressing device from adsorbing the component to be bonded, and then controlling the pressing device to move upward and away from the wafer that has been bonded.

11. The wafer mounting method according to claim 10, characterized in that: The interval time from the end of step S2 to the contact between the parts to be bonded and the glue is no more than 5 seconds.

12. The wafer mounting method according to claim 10, characterized in that: When the wafer is a CMOS chip and the component to be bonded is a cesium iodide module, the first speed is 0.05 mm / s-0.15 mm / s, the first pressure is 0.15 MPa-0.45 MPa, and the first preset time is 15 s-45 s.

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