LED packaging structure and LED packaging method

Abstract

The present invention belongs to the technical field of optoelectronic devices, and specifically is an LED packaging structure and an LED packaging method, comprising a substrate, a bracket fixedly connected to the side wall of the substrate; an LED chip fixedly connected to the top of the substrate; a deoxidation component is arranged on the top of the substrate; a light-transmitting bead is arranged on the inner side wall of the bracket; a light-reflecting component is arranged on the inner side wall of the bracket; the deoxidation component comprises a fixing frame, a piercing knife and a deoxidizer capsule; a pair of placement grooves are opened on the top of the substrate near the LED chip; the deoxidizer capsule is fixedly connected in the placement groove on the top of the substrate; the fixing frame is fixedly connected to the top of the substrate near the deoxidizer capsule; the LED packaging structure is formed by arranging the bracket, the substrate, the LED chip and the light-transmitting bead, the function of packaging the LED chip is realized, the problem that the silver-plated layer is oxidized and blackened due to the contact of the LED chip with the outside air is solved, and the service life of the LED is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of optoelectronic devices, and in particular to an LED packaging structure and an LED packaging method. Background Art

[0002] LED is a semiconductor device that can convert electrical energy into light energy. The core part is a PN junction composed of P-type semiconductor and N-type semiconductor. Different semiconductor materials can emit light of different colors.

[0003] LED packaging technology refers to the process of integrating LED chips and other components into a package. The main functions of packaging include providing mechanical protection, enhancing heat dissipation, optical control, and power supply management. Common LED packaging structures include pin-type packaging, surface mount packaging, and power packaging. During packaging, sealant is applied to the bottom of the lamp bead and the lamp bead is bonded to the bracket. After bonding, a small space remains between the lamp bead and the bracket, and oxygen is stored in the space. When the LED works for a long time, the temperature between the lamp bead and the bracket is too high, and the oxygen in the space reacts with the silver-plated layer in the LED to cause the LED light source to turn black. Summary of the invention

[0004] In order to make up for the deficiencies of the prior art and solve at least one technical problem raised in the background technology, the present invention provides an LED packaging structure and an LED packaging method.

[0005] The technical solution adopted by the present invention to solve the technical problem is: an LED packaging structure, comprising a substrate, a bracket fixedly connected to the side wall of the substrate; an LED chip fixedly connected to the top of the substrate; a deoxidation component is arranged on the top of the substrate; a light-transmitting bead is arranged on the inner side wall of the bracket; and a light-reflecting component is arranged on the inner side wall of the bracket. In this step, the LED packaging structure is formed by arranging the bracket, the substrate, the LED chip and the light-transmitting bead, so as to realize the function of packaging the LED chip, solve the problem that the silver-plated layer is oxidized and blackened due to the contact of the LED chip with the outside air, and improve the service life of the LED.

[0006] Preferably, the deoxidation component includes a fixing frame, a puncturing knife and a deoxidizer capsule; a pair of placement grooves are opened at the top of the substrate near the LED chip; the deoxidizer capsule is fixedly connected in the placement groove at the top of the substrate; the fixing frame is fixedly connected to the top of the substrate near the deoxidizer capsule; a puncturing knife is slidably connected to the middle of the fixing frame; this step forms a deoxidation structure through the arrangement of the fixing frame, the puncturing knife and the deoxidizer capsule, realizes the function of deoxidizing the space between the light-transmitting beads and the substrate, solves the problem of oxidation of the LED chip caused by oxygen retained in the space between the light-transmitting beads and the substrate, improves the service life of the LED chip, and reduces the oxidation and blackening of the silver-plated layer of the LED chip.

[0007] Preferably, the substrate is fixedly connected with a ventilation net near the inner side wall of the deoxidizer capsule; a pair of the ventilation nets are arranged on the top of the substrate and are symmetrically arranged; in this step, a breathable filtering structure is formed by the arrangement of the ventilation net, so that the function of air passing through the ventilation net and reacting with the deoxidizer in the deoxidizer capsule is realized, and the problem of the deoxidizer entering the interior of the bracket after the deoxidizer capsule is punctured, causing dirt or damage to electronic components, is solved, thereby improving the service life of the LED.

[0008] Preferably, a pad is fixedly connected to the top of the puncturing knife; the pad is made of a transparent material; this step increases the contact area of ​​the light-transmitting beads when pressing the puncturing knife through the provision of the pad, and the pad is made of a transparent material, which reduces the obstruction of light during reflection and improves the convenience of the light-transmitting beads pressing the puncturing knife.

[0009] Preferably, the reflective component includes a reflective coating; the reflective coating is arranged in a circle on the inner wall of the bracket; this step forms a reflective structure through the arrangement of the reflective coating, realizes the function of reflecting the light emitted by the LED chip, solves the problem of partial light loss after the LED chip emits the light source, and improves the light output efficiency of the LED packaging structure.

[0010] Preferably, a sealing groove is formed between the light-transmitting beads and the bracket; a sealant is provided in the sealing groove between the light-transmitting beads and the bracket; the sealant is an inorganic sealant; in this step, a sealing structure is formed by the setting of the sealant, thereby realizing the function of sealing between the light-transmitting beads and the bracket, solving the problem of air entering the internal space and causing oxidation of the LED chip, and improving the service life of the LED.

[0011] Preferably, the height of the top of the fixing frame is consistent with the height of the LED chip; a placement groove is provided on the top of the fixing frame; the thickness of the pad is consistent with the depth of the placement groove of the fixing frame; this step reduces the space between the light-transmitting beads and the substrate by setting the depth of the placement groove on the top of the fixing frame consistent with the thickness of the pad, thereby increasing the depth of the piercing knife piercing the deoxidizer capsule.

[0012] A LED packaging method is applicable to any of the above-mentioned LED packaging structures. The specific implementation steps of the packaging method are as follows: S1, coating a reflective layer on the inner wall of a bracket with a thickness between 0.2 mm and 0.4 mm; S2, mounting an LED chip on a substrate, inserting pins into the substrate and connecting with a metal circuit; S3, mounting a lamp bead on the bracket, applying sealant between the lamp bead and the bracket to seal the bracket and the lamp bead, placing the lamp bead on the bracket to pierce a deoxidizer, and the deoxidizer removes oxygen near the LED chip.

[0013] The beneficial effects of the present invention are as follows: The LED packaging structure and the LED packaging method described in the present invention form an LED packaging structure by arranging a bracket, a substrate, an LED chip and light-transmitting beads, thereby realizing the function of packaging the LED chip, solving the problem that the silver plating layer is oxidized and blackened due to contact between the LED chip and the outside air, and improving the service life of the LED. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below in conjunction with the accompanying drawings.

[0015] Figure 1 is a stereogram of the present invention; Figure 2 It is a schematic diagram of the structure of the cooperation between the fixing frame and the base plate in the present invention; Figure 3 It is a schematic diagram of the structure of the puncture knife and the deoxidizer capsule in the present invention; Figure 4 It is a flow chart of the packaging steps in the present invention.

[0016] In the figure: 1. bracket; 11. LED chip; 12. fixing frame; 13. puncture knife; 14. deoxidizer capsule; 15. light-transmitting beads; 16. substrate; 2. ventilation net; 3. pad; 4. reflective coating; 5. sealant. DETAILED DESCRIPTION

[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0018] like Figures 1 to 3 As shown, an LED packaging structure of an embodiment of the present invention includes a substrate 16, a bracket 1 is fixedly connected to the side wall of the substrate 16; an LED chip 11 is fixedly connected to the top of the substrate 16; a deoxidation component is provided on the top of the substrate 16; a light-transmitting bead 15 is provided on the inner wall of the bracket 1; a reflective component is provided on the inner wall of the bracket 1; during operation, the LED chip 11 is installed on the top of the substrate 16, the LED chip 11 and the metal wire in the substrate 16 are connected, the light-transmitting bead 15 is installed on the inner wall of the LED chip 11, so that the space between the light-transmitting bead 15 and the substrate 16 is closed, the deoxidation component removes the oxygen between the light-transmitting bead 15 and the substrate 16, and the light-transmitting bead 15 and the bracket 1 are sealed with glue; in this step, the LED packaging structure is formed by the arrangement of the bracket 1, the substrate 16, the LED chip 11 and the light-transmitting bead 15, the function of packaging the LED chip 11 is realized, the problem of oxidation and blackening of the silver plating layer caused by the contact of the LED chip 11 with the external air is solved, and the service life of the LED is improved.

[0019] like Figure 2 and Figure 3As shown, the deoxidation assembly includes a fixing frame 12, a piercing knife 13 and a deoxidizer capsule 14; a pair of placement grooves are opened at the top of the substrate 16 near the LED chip 11; the deoxidizer capsule 14 is fixedly connected in the placement groove at the top of the substrate 16; the fixing frame 12 is fixedly connected to the top of the substrate 16 near the deoxidizer capsule 14; the piercing knife 13 is slidably connected to the middle of the fixing frame 12; during operation, when the light-transmitting beads 15 are installed inside the bracket 1, the light-transmitting beads 15 press the piercing knife 13 to approach the substrate 16, the piercing knife 13 slides in the middle of the fixing frame 12, and the piercing knife 13 pierces the deoxidizer capsule 14 The deoxidizer capsule 14 is wrapped with a deoxidizer, which is exposed in the space between the light-transmitting beads 15 and the substrate 16 to remove the oxygen in the space by reaction. In this step, the fixing frame 12, the piercing knife 13 and the deoxidizer capsule 14 are arranged to form a deoxidation structure, which realizes the function of deoxidizing the space between the light-transmitting beads 15 and the substrate 16, solves the problem that the LED chip 11 is oxidized due to the oxygen retained in the space between the light-transmitting beads 15 and the substrate 16, improves the service life of the LED chip 11, and reduces the oxidation and blackening of the silver-plated layer of the LED chip 11.

[0020] like Figure 3 As shown, the substrate 16 is fixedly connected with a ventilation net 2 near the inner wall of the deoxidizer capsule 14; a pair of ventilation nets 2 are arranged on the top of the substrate 16, and are symmetrically arranged; during operation, the puncturing knife 13 slides in the middle of the ventilation net 2, and the ventilation net 2 plays a guiding role. The ventilation net 2 is breathable, and air can pass through the ventilation net 2 to react with the deoxidizer in the deoxidizer capsule 14, and the ventilation net 2 blocks the deoxidizer from entering the space between the light-transmitting beads 15 and the substrate 16; in this step, the ventilation net 2 is arranged to form a breathable filtering structure, which realizes the function of air passing through the ventilation net 2 to react with the deoxidizer in the deoxidizer capsule 14, solves the problem that the deoxidizer enters the inside of the bracket 1 after the deoxidizer capsule 14 is punctured, causing dirt or damage to electronic components, and improves the service life of the LED.

[0021] like Figure 3 As shown, a pad 3 is fixedly connected to the top of the puncturing knife 13; the pad 3 is made of a transparent material; during operation, when the light-transmitting beads 15 are pressed toward the top of the puncturing knife 13, the pad 3 contacts the bottom of the light-transmitting beads 15, thereby increasing the contact area between the puncturing knife 13 and the light-transmitting beads 15, and the pad 3 is made of a transparent material; this step increases the contact area when the light-transmitting beads 15 press the puncturing knife 13 through the provision of the pad 3, and the pad 3 is made of a transparent material, thereby reducing the obstruction of light during reflection and increasing the convenience when the light-transmitting beads 15 press the puncturing knife 13.

[0022] like Figure 2As shown, the reflective component includes a reflective coating 4; the reflective coating 4 is arranged in a circle on the inner wall of the bracket 1; during operation, the inner wall of the bracket 1 is coated with the reflective coating 4, and the light emitted by the LED chip 11 is reflected by the reflective coating 4 and emitted from the light-transmitting beads 15; in this step, a reflective structure is formed by the arrangement of the reflective coating 4, which realizes the function of reflecting the light emitted by the LED chip 11, solves the problem of partial light loss after the LED chip 11 emits the light source, and improves the light output efficiency of the LED packaging structure.

[0023] like Figure 2 As shown, a sealing groove is formed between the light-transmitting beads 15 and the bracket 1; a sealant 5 is arranged in the sealing groove between the light-transmitting beads 15 and the bracket 1; the sealant 5 is an inorganic sealant; during operation, the sealant 5 seals the light-transmitting beads 15 and the bracket 1 to reduce the air from entering the space between the light-transmitting beads 15 and the bracket 1; in this step, a sealing structure is formed by the setting of the sealant 5, thereby realizing the function of sealing between the light-transmitting beads 15 and the bracket 1, solving the problem that the air enters the internal space and causes the LED chip 11 to oxidize, thereby improving the service life of the LED.

[0024] like Figure 2 and Figure 3 As shown, the height of the top of the fixing frame 12 is consistent with the height of the LED chip 11; a placement groove is provided on the top of the fixing frame 12; the thickness of the pad 3 is consistent with the depth of the placement groove of the fixing frame 12; during operation, when the light-transmitting beads 15 press the piercing knife 13, the pad 3 is driven to approach the fixing frame 12, and the pad 3 enters the placement groove at the top of the fixing frame 12 and is flush with the top of the fixing frame 12; in this step, by setting the depth of the placement groove at the top of the fixing frame 12 consistent with the thickness of the pad 3, the space between the light-transmitting beads 15 and the substrate 16 is reduced, and the depth of the piercing knife 13 piercing the deoxidizer capsule 14 is increased.

[0025] like Figure 4 As shown, an LED packaging method is applicable to any of the above-mentioned LED packaging structures, and the specific implementation steps of the packaging method are as follows: S1, coating the reflective layer on the inner wall of the bracket with a thickness between 0.2mm-0.4mm; S2, installing the LED chip on the substrate, inserting the pins into the substrate and connecting with the metal circuit; S3, installing the lamp bead on the bracket, applying sealant between the lamp bead and the bracket, sealing the bracket and the lamp bead, placing the lamp bead on the bracket to pierce the deoxidizer, and the deoxidizer removes oxygen near the LED chip.

[0026] During operation, the LED chip 11 is installed on the top of the substrate 16, the LED chip 11 is connected to the metal wire in the substrate 16, the light-transmitting beads 15 are installed on the inner wall of the LED chip 11, so that the space between the light-transmitting beads 15 and the substrate 16 is closed, the deoxidation component removes the oxygen between the light-transmitting beads 15 and the substrate 16, and glue is used to seal the light-transmitting beads 15 and the bracket 1; when the light-transmitting beads 15 are installed inside the bracket 1, the light-transmitting beads 15 press the puncturing knife 13 to approach the substrate 16, the puncturing knife 13 slides in the middle of the fixing frame 12, and the puncturing knife 13 pierces the deoxidizer capsule 14, the deoxidizer capsule 14 is wrapped with a deoxidizer, and the deoxidizer is exposed in the space between the light-transmitting beads 15 and the substrate 16, and the oxygen in the space is removed by reaction; the puncturing knife 13 slides in the middle of the ventilation net 2, and the ventilation net 2 plays a guiding role, The ventilation net 2 is a breathable device, and air can pass through the ventilation net 2 to react with the deoxidizer in the deoxidizer capsule 14. The ventilation net 2 blocks the deoxidizer from entering the space between the light-transmitting beads 15 and the substrate 16; when the light-transmitting beads 15 are pressed against the top of the puncturing knife 13, the pad 3 contacts the bottom of the light-transmitting beads 15, thereby increasing the contact area between the puncturing knife 13 and the light-transmitting beads 15, and the pad 3 is made of a transparent material; the inner wall of the bracket 1 is coated with a reflective coating 4, and the light emitted by the LED chip 11 is reflected by the reflective coating 4 and emitted from the light-transmitting beads 15; the sealant 5 seals the space between the light-transmitting beads 15 and the bracket 1 to reduce the air from entering the space between the light-transmitting beads 15 and the bracket 1; when the light-transmitting beads 15 press the puncturing knife 13, the pad 3 is driven to approach the fixing frame 12, and the pad 3 enters the placement groove at the top of the fixing frame 12 and is flush with the top of the fixing frame 12.

[0027] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An LED packaging structure, comprising a substrate (16), characterized in that: A bracket (1) is fixedly connected to the side wall of the substrate (16); an LED chip (11) is fixedly connected to the top of the substrate (16); a deoxidation component is provided on the top of the substrate (16); light-transmitting beads (15) are provided on the inner side wall of the bracket (1); and a reflective component is provided on the inner side wall of the bracket (1).

2. The LED packaging structure according to claim 1, characterized in that: The deoxidation component comprises a fixing frame (12), a puncturing knife (13) and a deoxidizer capsule (14); a pair of placement grooves are provided at the top of the substrate (16) near the LED chip (11); the deoxidizer capsule (14) is fixedly connected in the placement groove at the top of the substrate (16); the fixing frame (12) is fixedly connected to the top of the substrate (16) near the deoxidizer capsule (14); and the puncturing knife (13) is slidably connected to the middle of the fixing frame (12).

3. The LED packaging structure according to claim 2, characterized in that: The inner side wall of the base plate (16) close to the deoxidizer capsule (14) is fixedly connected with a ventilation net (2); a pair of the ventilation nets (2) are arranged on the top of the base plate (16) and are symmetrically arranged.

4. The LED packaging structure according to claim 2, characterized in that: A backing plate (3) is fixedly connected to the top of the puncturing knife (13); the backing plate (3) is made of a transparent material.

5. The LED packaging structure according to claim 1, characterized in that: The reflective component comprises a reflective coating (4); the reflective coating (4) is arranged in a circle on the inner side wall of the bracket (1).

6. The LED packaging structure according to claim 1, characterized in that: A sealing groove is formed between the light-transmitting bead (15) and the bracket (1); a sealing glue (5) is provided in the sealing groove between the light-transmitting bead (15) and the bracket (1); and the sealing glue (5) is an inorganic glue.

7. The LED packaging structure according to claim 4, characterized in that: The height of the top of the fixing frame (12) is consistent with the height of the LED chip (11); a placement groove is provided on the top of the fixing frame (12); and the thickness of the pad (3) is consistent with the depth of the placement groove of the fixing frame (12).

8. An LED packaging method, the LED packaging method is applicable to any LED packaging structure of claims 1-7, characterized in that: The specific implementation steps of the packaging method are as follows: S1. Coat the reflective layer on the inner wall of the bracket with a thickness between 0.2mm and 0.4mm; S2, mounting the LED chip on the substrate, inserting the pins into the substrate and connecting them with the metal circuit; S3. Install the lamp bead on the bracket, apply sealant between the lamp bead and the bracket to seal the bracket and the lamp bead, put the lamp bead on the bracket to puncture the deoxidizer, and the deoxidizer removes oxygen near the LED chip.

Images