Ornament processing technology and ornament

Abstract

The invention relates to the technical field of ornament processing, and provides an ornament processing technology and an ornament, a solid base body is obtained by means of lost wax pouring, CNC machining, oil pressure and the like, so that the base body has better structural strength and toughness, and the base body is embedded in a second wax mold and is subjected to electroforming operation to obtain a thin electroplated layer; therefore, on the basis that the inlaying requirement is met, the metal material of the electroplated layer is lower, so that the overall metal material can be effectively reduced, and the purpose of reducing the cost is achieved; meanwhile, when the inlaying operation is carried out on the inlaying structure of the base body, the second wax mold can also provide supporting force, so that the inlaying structure can further bear larger pressure, and the influence on the inlaying operation is lower.

Description

Technical Field

[0001] The present application relates to the technical field of jewelry processing, and in particular provides a jewelry processing technology and jewelry. Background Art

[0002] At present, the market demand for jewelry inlaid with gemstones is gradually increasing. In the related technology, metal blanks are mainly formed by casting, machining, electroforming and other processes, and then the metal blanks are inlaid in batches.

[0003] Among them, the metal blanks formed by the two processes of casting and machining have excellent hardness and toughness, which can perfectly match the hand-set gemstones; this kind of metal blank can be manually processed into nails, claws, and teeth of various shapes and with very fine surfaces to fix the gemstones. The hand-set gemstone process can be processed by drilling, knives, shovels, sandpaper, brushes, cloth wheels and other tools to carve, carve, turn, shovel, and polish the metal around the gemstone inlay groove, gemstone pit, nails, claws, teeth, etc., and finally form a bright and sparkling metal blank and gemstones to reflect each other, so that the whole piece of jewelry has a high-quality and dazzling decorative effect. However, the whole metal blank formed by the two processes of casting and machining is solid, so a large amount of metal raw materials are required, so the cost is relatively high.

[0004] The electroforming process is widely welcomed by consumers because it can produce jewelry with thinner metal walls, larger volume and lighter weight, and uses less metal for the same volume. However, in the process of inlaying gemstones in metal jewelry formed by the electroforming process, the inlay structures such as nails, claws, and teeth formed by electroforming need to be based on solid wax or low-temperature alloy as the base core, which is then thickened layer by layer by electroforming metal, and then emptied through heating and chemical precipitation processes. Therefore, the inlay structure is also a hollow structure. Therefore, the inlay structure needs to be set to a larger volume to meet the structural strength required for inlaying, which will seriously affect the refractive area of ​​the inlaid gemstones and the display of the overall product. In addition, the toughness of the metal formed by the electroforming process is very poor, and it is not suitable for manual inlay operations using tools directly, and it is very easy to produce cracks and cracks.

[0005] Therefore, designing a processing technology with low metal material consumption and low impact on the inlay operation is an urgent problem to be solved. Summary of the invention

[0006] The purpose of the embodiments of the present application is to provide a jewelry processing technology and jewelry, aiming to provide a processing technology with low metal material consumption and low impact on the inlay operation.

[0007] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is:

[0008] In a first aspect, an embodiment of the present application provides a jewelry processing process, comprising the following steps:

[0009] obtaining a substrate on which a mosaic structure is disposed;

[0010] Obtain a second wax model, and embed the substrate on the second wax model;

[0011] Performing electroforming operation on the second wax mold to form an electroplating layer; the electroplating layer is connected with the substrate to form a whole;

[0012] Performing an inlay operation on the inlay structure to inlay the inlay material in the inlay structure;

[0013] Drilling the electroplating layer to form a lead-out hole, the lead-out hole penetrates to the second wax mold;

[0014] The second wax mold is heated and melted and then discharged from the outlet hole to obtain the ornament with the inlaid material.

[0015] Beneficial effects of the embodiments of the present application: The jewelry processing technology provided in the embodiments of the present application can obtain a solid base by lost wax casting, so that the base has better structural strength, and the base is embedded in the second wax mold and electroplated to obtain a thinner electroplating layer; in this way, on the basis of meeting the inlay requirements, the metal material used in the electroplating layer is lower, thereby effectively reducing the overall metal material used to achieve the purpose of reducing costs; at the same time, when the inlay structure of the base is inlaid, the second wax mold can also provide supporting force, so that the inlay structure can further withstand greater pressure, and the inlay operation is less affected.

[0016] In some embodiments, the base has a first end face and a second end face relative to each other, the inlaid structure is arranged on the first end face, and the first connecting portion is arranged on the second end face; a receiving groove is opened on the surface of the second wax mold, and a second connecting portion is arranged on the bottom wall of the groove; the base is accommodated in the receiving groove, and the first connecting portion is plugged into and matched with the second connecting portion.

[0017] In some embodiments, a connection groove is provided on the substrate in a direction perpendicular to the thickness of the second wax pattern; and a size of the connection groove is greater than or equal to the thickness of the electroplating layer in the thickness direction of the second wax pattern.

[0018] In some embodiments, the base body is annular in structure, and connecting grooves are provided on the inner and outer peripheral wall surfaces of the base body in a direction perpendicular to the thickness of the second wax mold.

[0019] In some embodiments, the specific steps of embedding the substrate on the second wax model include:

[0020] applying a conductive coating to the outer surface of the second wax mold;

[0021] The substrate is embedded in the second wax mold coated with a conductive coating, and pressure is continuously applied to make the substrate and the second wax mold fit each other.

[0022] In some embodiments, after the second wax mold is heated and melted and discharged from the outlet, the method further includes:

[0023] Perform chemical precipitation on the jewelry to completely decompose the remaining conductive coating;

[0024] Clean the jewelry in an ultrasonic cleaner and let it air dry.

[0025] In some embodiments, before the step of electroforming the second wax pattern and forming the electroplating layer, the method further includes:

[0026] applying an insulating layer to the mosaic structure;

[0027] The second wax mold embedded with the matrix is ​​placed in an ultrasonic cleaning machine for cleaning and air drying.

[0028] In some embodiments, after the step of electroforming the second wax pattern and forming the electroplating layer, the method further includes:

[0029] Clean the insulation layer and remove the insulation layer;

[0030] The electroplating layer and the base mold connected to form an integral body are placed in an ultrasonic cleaning machine for cleaning and air drying.

[0031] In some embodiments, before performing the inlay operation step on the inlay structure, the step further includes: performing grinding and polishing operations on the inlay structure.

[0032] In a second aspect, an embodiment of the present application further provides a kind of ornament, including a substrate, an electroplating layer and an inlay material, wherein the substrate and the electroplating layer are connected to form an integral structure, an inlay structure is provided on the substrate, and the inlay material is fixed in the inlay structure.

[0033] Beneficial effects of the embodiments of the present application: The jewelry provided in the embodiments of the present application utilizes a substrate to carry the inlaid material, and the thickness of the inlaid electroplating layer is relatively thin, which can save metal materials for the jewelry and effectively reduce the cost of the jewelry. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1A flowchart of a jewelry processing process provided in an embodiment of the present application;

[0036] Figure 2 A front view of an ornament with inlaid material provided in an embodiment of the present application;

[0037] Figure 3 A front view of a second wax model provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of a second end surface of a substrate provided in an embodiment of the present application;

[0039] Figure 5 A flowchart of the specific steps of embedding the substrate on the second wax model;

[0040] Figure 6 A flow chart of the steps after the second wax mold is heated and melted and then discharged from the outlet hole;

[0041] Figure 7 A flow chart of steps before the step of performing electroforming operation on the second wax pattern and forming an electroplating layer;

[0042] Figure 8 is a flow chart of steps after the step of performing electroforming operation on the second wax pattern and forming an electroplating layer;

[0043] Fig. 9 A flow chart of steps before performing a mosaic operation on a mosaic structure;

[0044] Fig.10 A flow chart of another jewelry processing process provided in an embodiment of the present application.

[0045] Among them, the reference numerals in the figure are:

[0046] 10. base body; 101. first end surface; 102. second end surface; 11. inlay structure; 12. first connecting portion; 13. connecting groove;

[0047] 20. second wax mold; 21. receiving groove; 22. second connecting portion;

[0048] 30. Electroplating layer; 40. Inlaid materials. DETAILED DESCRIPTION

[0049] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0050] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0052] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] At present, the market demand for jewelry inlaid with gemstones is gradually increasing. In the related technology, metal blanks are mainly formed by casting, machining, electroforming and other processes, and then the metal blanks are inlaid in batches.

[0054] Among them, the metal blanks formed by the two processes of casting and machining have excellent hardness and toughness, which can perfectly match the hand-set gemstones; this kind of metal blank can be manually processed into nails, claws, and teeth of various shapes and with very fine surfaces to fix the gemstones. The hand-set gemstone process can be processed by drilling, knives, shovels, sandpaper, brushes, cloth wheels and other tools to carve, carve, turn, shovel, and polish the metal around the gemstone inlay groove, gemstone pit, nails, claws, teeth, etc., and finally form a bright and sparkling metal blank and gemstones to reflect each other, so that the whole piece of jewelry has a high-quality and dazzling decorative effect. However, the whole metal blank formed by the two processes of casting and machining is solid, so a large amount of metal raw materials are required, so the cost is relatively high.

[0055] The electroforming process is widely welcomed by consumers because it can produce jewelry with thinner metal walls, larger volume and lighter weight, and uses less metal for the same volume. However, in the process of setting gemstones in metal jewelry formed by electroforming, the setting structures such as nails, claws, and teeth formed by electroforming need to be based on solid wax or low-temperature alloy as the core, which is then thickened layer by layer by electroforming metal, and then emptied through heating and chemical precipitation processes. Therefore, the setting structure is also a hollow structure. Therefore, the setting structure needs to be set to a larger volume to meet the structural strength required for setting, which will seriously affect the refractive area of ​​the gemstones and the display of the overall product.

[0056] Therefore, designing a processing technology with low metal material consumption and low impact on the inlay operation is an urgent problem to be solved.

[0057] Based on the above considerations, in order to provide a processing technology with lower metal content and less impact on the inlay operation, a jewelry processing technology is designed. A solid base is obtained by lost wax casting or CNC machining, oil pressure, etc., so that the base has better structural strength and toughness, and the base is embedded in the second wax mold and electroplated to obtain a thinner electroplating layer; in this way, on the basis of meeting the inlay requirements, the metal content of the electroplating layer is lower, thereby effectively reducing the overall metal content to achieve the purpose of reducing costs; at the same time, when the inlay structure of the base is inlaid, the second wax mold can also provide supporting force, so that the inlay structure can further withstand greater pressure, and thus the inlay operation is less affected.

[0058] Below, the jewelry processing technology provided in the embodiment of the present application will be described in detail.

[0059] Please refer to Figures 1 to 4 In a first aspect, an embodiment of the present application provides a jewelry processing process, comprising the following steps:

[0060] S100, obtaining a substrate 10, on which a mosaic structure 11 is disposed;

[0061] S200, obtaining a second wax mold 20, and embedding the substrate 10 on the second wax mold 20;

[0062] S300, performing electroforming operation on the second wax mold 20 to form an electroplating layer 30; the electroplating layer 30 is connected to the substrate 10 to form a whole;

[0063] S400, performing an inlay operation on the inlay structure 11, inlaying the inlay material 40 in the inlay structure 11;

[0064] S500, drilling the electroplating layer 30 to form a lead-out hole (not shown in the figure), the lead-out hole penetrates to the second wax mold 20;

[0065] S600, heating the second wax mold 20, and the second wax mold 20 is melted by the heat and discharged from the outlet hole to obtain a jewelry with the inlaid material 40.

[0066] The substrate 10 may be obtained by directly obtaining the substrate 10 through CNC machining or hydraulic machining; or, the substrate 10 may be obtained by obtaining a first wax mold and performing lost wax casting on the first wax mold to obtain the substrate 10 having the mosaic structure 11.

[0067] The first wax model can be in any shape, such as a block, annular, cylindrical or various special-shaped structures or customized structures, and the substrate 10 is obtained by performing lost wax casting on the first wax model. For example, in some embodiments, the first wax model can be formed by 3D printing; the digital file of the first wax model is completed by digital 3D modeling technology, and then the required first wax model is printed using a 3D printer.

[0068] Among them, the lost wax casting process is also called precision casting, which is often used to make metal parts with complex shapes. The basic principle of the lost wax casting process is to first use wax to make a model of the part to be cast, then wrap a layer of refractory material on the outside of the wax model, then melt the wax model by heating, and finally inject metal material into the cavity to form a solid metal part.

[0069] It can be understood that the base 10 with the inlay structure 11 can be obtained through the lost wax casting process; the above-mentioned inlay structure 11 includes but is not limited to inlay claws, inlay grooves, gemstone grooves and other structures.

[0070] The second wax mold 20 can be in any shape, such as a block, ring, column, or various special-shaped structures or customized structures. For example, in some embodiments, the second wax mold 20 can be formed by 3D printing; the digital file of the second wax mold 20 is completed by digital 3D modeling technology, and then the required second wax mold 20 is printed using a 3D printer.

[0071] The substrate 10 is embedded in the second wax mold 20; optionally, the substrate 10 can be embedded in any surface of the second wax mold 20; the specific embedding position of the substrate 10 can be selected according to actual conditions.

[0072] The second wax mold 20 is used to support the substrate 10 and to serve as a bearing structure for electroforming; thus, the electroplating layer 30 formed by the electroforming operation can be connected to the substrate 10 to form an integral structure, and the electroplating layer 30 can show the external structure of the second wax mold 20. Optionally, the external structure of the second wax mold 20 can be customized, for example, to form various patterns, meshes or multiple configurations, so that the electroplating layer 30 can show the corresponding external shape. Due to the material effects of the second wax mold 20 itself, a variety of complex patterns can be more conveniently designed on the second wax mold 20, thereby increasing the variety of external shapes of the electroplating layer 30, and thus being able to process more ornaments with different external shapes.

[0073] When the inlay structure 11 is inlaid, since the base 10 is still embedded in the second wax mold 20, the second wax mold 20 can provide support for the inlay operation; thus, the influence on the inlay operation can be effectively reduced.

[0074] During the inlay process, various electric and pneumatic tools can be used to grind and polish the inlay structure 11 to improve the reflective visual effect of the inlay structure 11 and improve the display of the inlay structure 11. The inlay material 40 can be, but is not limited to, a material with decorative properties such as gemstones, diamonds, and agates.

[0075] After the inlay is completed, a hole can be drilled on the electroplating layer 30 to form an outlet hole, so that the second wax mold 20 can be heated and melted and then led out from the outlet hole, thereby obtaining a finished jewelry product with the inlay material 40.

[0076] The jewelry processing technology provided in the embodiment of the present application can obtain a solid base 10 by means of lost wax casting, so that the base 10 has better structural strength, and the base 10 is embedded in the second wax mold 20 and electroplated to obtain a thinner electroplating layer 30; in this way, on the basis of meeting the inlay requirements, the metal material used in the electroplating layer 30 is lower, thereby being able to effectively reduce the overall metal material used to achieve the purpose of reducing costs; at the same time, when the inlay structure 11 of the base 10 is inlaid, the second wax mold 20 can also provide supporting force, so that the inlay structure 11 can further withstand greater pressure, and thus the inlay operation is less affected.

[0077] Please refer to Figures 2 to 4 In some embodiments, the base 10 has a first end face 101 and a second end face 102 relative to each other, the inlaid structure 11 is arranged on the first end face 101, and the second end face 102 is provided with a first connecting portion 12; a receiving groove 21 is opened on the surface of the second wax mold 20, and a second connecting portion 22 is provided on the bottom wall of the receiving groove 21; the base 10 is accommodated in the receiving groove 21, and the first connecting portion 12 is plugged into and matched with the second connecting portion 22.

[0078] The base 10 is used to be arranged in the receiving groove 21 of the second wax mold 20. Optionally, when the base 10 is an annular structure, the receiving groove 21 opened on the second wax mold 20 is also an annular groove.

[0079] The second end face 102 of the base 10 is used to face the second wax mold 20, and the second end face 102 is used to fit with the bottom wall of the groove of the receiving groove 21 to achieve a stable connection. The first connecting portion 12 is arranged on the second end face 102, and optionally, the first connecting portion 12 includes but is not limited to a convex rod, a convex point, or a groove, a pit and other structures; correspondingly, the second connecting portion 22 is arranged on the bottom wall of the groove of the receiving groove 21, and the second connecting portion 22 includes but is not limited to a convex rod, a convex point, or a groove, a pit and other structures. Exemplarily, in some embodiments, the first connecting portion 12 includes one or more connecting convex rods, and the second connecting portion 22 includes one or more pits, so that when the base 10 is accommodated in the receiving groove 21, the connecting convex rod can be correspondingly inserted into the pit to achieve plug-in fit and positioning connection.

[0080] The inlay structure 11 is disposed on the first end surface 101 of the base body 10 , so that the inlay material 40 disposed in the inlay structure 11 can be displayed externally to achieve a better display effect.

[0081] Please refer to Figures 2 to 4 In some embodiments, a connecting groove 13 is provided on the substrate 10 in a direction perpendicular to the thickness of the second wax mold 20 ; and a size of the connecting groove 13 is greater than or equal to the thickness of the electroplating layer 30 along the thickness of the second wax mold 20 .

[0082] The connection groove 13 may be, but is not limited to, a strip groove, an annular groove, a circular groove, a rectangular groove, or other groove types; the number of the connection grooves 13 may be, but is not limited to, one, two, or any number of more than two. For example, in some embodiments, when the base 10 is in a disc shape, an annular connection groove 13 may be provided on the outer peripheral wall surface of the base 10; or, in other embodiments, when the base 10 is in a ring shape, an annular connection groove 13 may be provided on both the outer peripheral wall surface and the inner peripheral wall surface of the base 10.

[0083] It should be understood that when the second wax mold 20 is electroformed and the electroplating layer 30 is formed, a layer of electroplating layer 30 with a preset thickness will be formed on the outer surface of the second wax mold 20, and the electroplating layer 30 will be formed on the substrate 10 and filled in the connecting groove 13 to achieve the connection between the electroplating layer 30 and the substrate 10 to form a whole.

[0084] At the same time, the size of the connection groove 13 is set to be greater than or equal to the thickness of the electroplating layer 30; in this way, when the electroforming operation is performed and the electroplating layer 30 is formed, the electroplating layer 30 can fill the connection groove 13; in this way, the electroplating layer 30 can form a more stable connection with the substrate 10. Exemplarily, in some embodiments, the size of the connection groove 13 can be, but is not limited to, 1 to 3 times the thickness of the electroplating layer 30, for example, 1 time, 1.5 times, 1.8 times, 2 times, 2.5 times, 3 times, etc.

[0085] Please refer to Figures 2 to 4 In some embodiments, the base 10 is annular in structure, and connecting grooves 13 are provided on the inner and outer wall surfaces of the base 10 in a direction perpendicular to the thickness of the second wax mold 20 .

[0086] In this embodiment, the substrate 10 can be set as an annular structure, such as a perfect circular ring, an elliptical ring, etc. In this way, the receiving groove 21 opened on the second wax mold 20 can also be an annular groove body; when the substrate 10 is embedded in the receiving groove 21 of the second wax mold 20 and the electroforming operation is performed, the electroplating layer 30 can be formed inside and outside the annular structure of the substrate 10 and connected to the substrate 10 to form a whole.

[0087] At the same time, in the thickness direction perpendicular to the second wax mold 20, connecting grooves 13 are opened on the inner wall and the outer wall of the substrate 10; in this way, after the electroforming operation, the electroplating layer 30 can be simultaneously filled in the connecting grooves 13 on the inner wall and the outer wall of the substrate 10, that is, the electroplating layer 30 can be simultaneously connected to the inner wall and the outer wall of the substrate 10 to form a whole; therefore, the connection between the electroplating layer 30 and the substrate 10 is more stable.

[0088] Please refer to Figures 2 to 5 In some embodiments, the specific steps of embedding the substrate 10 on the second wax mold 20 include:

[0089] S201, coating the outer surface of the second wax mold 20 with a conductive coating;

[0090] S202 , embedding the substrate 10 on the second wax mold 20 coated with a conductive coating, and continuously applying pressure to make the substrate 10 and the second wax mold 20 fit each other.

[0091] By applying the conductive coating, in the subsequent electroforming operation, the electroplating layer 30 can be smoothly formed on the outer surface of the second wax mold 20. The conductive coating includes but is not limited to conductive silver oil, etc. It should be understood that the main components of the conductive silver oil include powdered metallic silver, resin and solvent, etc.

[0092] After the conductive coating is applied, the substrate 10 is embedded and pressure is continuously applied to make the substrate 10 and the second wax mold 20 fit each other, so that the connection between the substrate 10 and the second wax mold 20 is more stable, avoiding the problem of the substrate 10 falling off during the electroplating process.

[0093] Please refer to Figures 2 to 4 as well as Figure 6 In some embodiments, after the second wax mold 20 is heated and melted and discharged from the outlet, the method further includes:

[0094] S700, performing chemical precipitation operation on the jewelry to completely decompose the remaining conductive coating;

[0095] S800, clean the jewelry in an ultrasonic cleaner and air dry.

[0096] It should be understood that after the melted second wax mold 20 is discharged, the conductive coating can be decomposed by chemical precipitation operation on the obtained jewelry with the inlay material 40 to improve the cleanliness of the jewelry. In addition, after the chemical precipitation operation, the jewelry is placed in an ultrasonic cleaning machine for cleaning and air drying, thereby further improving the cleanliness of the jewelry.

[0097] Optionally, after ultrasonic cleaning and air drying, the metal surface of the jewelry (for example, the electroplating layer 30, the exposed part of the inlaid structure 11, etc.) can also be polished, for example, using diamond needles, sandpaper, sandblasting machines, polishing machines and other equipment to improve the decorative effect of the metal surface of the jewelry.

[0098] Please refer to Figures 2 to 4 as well as Figure 7 In some embodiments, before the step of electroforming the second wax mold 20 and forming the electroplating layer 30, the method further includes:

[0099] S210, coating an insulating layer on the mosaic structure 11;

[0100] S220, placing the second wax mold 20 embedded with the substrate 10 into an ultrasonic cleaning machine for cleaning and air drying.

[0101] Before the electroforming operation, an insulating layer is firstly coated on the inlay structure 11 to prevent the electroplating layer 30 from being formed on the surface of the inlay structure 11 during the electroforming process and affecting the subsequent inlay operation. Optionally, the insulating layer can be, but is not limited to, insulating paint.

[0102] After coating the insulating layer, the second wax mold 20 embedded with the substrate 10 is cleaned in an ultrasonic cleaning machine using a degreasing agent and pure water, so as to facilitate the subsequent electroforming operation.

[0103] Please refer to Figures 2 to 4 as well as Figure 8 In some embodiments, after the step of electroforming the second wax mold 20 and forming the electroplating layer 30, the method further includes:

[0104] S310, cleaning the insulation layer to remove the insulation layer;

[0105] S320, placing the electroplating layer 30 and the substrate 10 connected to form an integral body into an ultrasonic cleaning machine for cleaning and air drying.

[0106] After the electroforming operation is completed, the insulating layer is removed to facilitate the subsequent embedding operation. The insulating layer can be cleaned with a paint solvent to dissolve the insulating layer.

[0107] Then, the electroplating layer 30 and the substrate 10 connected to form an integral body are placed in an ultrasonic cleaning machine filled with pure water for cleaning and air drying to improve the cleanliness of the electroplating layer 30 and the substrate 10 .

[0108] Please refer to Figures 2 to 4 as well as Fig. 9 In some embodiments, before performing the mosaic operation step on the mosaic structure 11, the method further includes:

[0109] S330 , grinding and polishing the mosaic structure 11 .

[0110] It can be understood that by grinding and polishing the inlay structure 11 , the surface glossiness of the inlay structure 11 can be effectively improved; when the inlay material 40 is embedded in the inlay structure 11 , the display effect of the inlay material 40 can be further improved.

[0111] Next, the jewelry processing technology of the present application will be further described according to specific implementation methods.

[0112] Please refer to Fig.10 In this embodiment, the jewelry processing process includes the following steps:

[0113] S01, obtaining a substrate 10, on which an inlay structure 11 is disposed; wherein the substrate 10 can be directly obtained by CNC machining or hydraulic machining, or a first wax mold can be first obtained, and then the first wax mold can be lost wax cast to obtain the substrate 10 with the inlay structure 11; the substrate 10 is annular, and an annular connecting groove 13 is provided on the inner and outer peripheral wall surfaces of the substrate 10;

[0114] S02, obtaining a second wax mold 20, and coating an outer surface of the second wax mold 20 with a conductive coating;

[0115] S03, embedding the substrate 10 on the second wax mold 20 coated with a conductive coating, and continuously applying pressure to make the substrate 10 and the second wax mold 20 fit each other;

[0116] S04, coating an insulating layer on the mosaic structure 11;

[0117] S05, placing the second wax mold 20 embedded with the substrate 10 into an ultrasonic cleaning machine for cleaning and air drying;

[0118] S06, performing electroforming operation on the second wax mold 20 and forming an electroplating layer 30; the electroplating layer 30 is connected to the substrate 10 to form a whole; wherein, along the thickness direction of the second wax mold 20, the size of the connecting groove 13 is greater than or equal to the thickness of the electroplating layer 30;

[0119] S07, cleaning the insulation layer to remove the insulation layer;

[0120] S08, placing the electroplating layer 30 and the substrate 10 mold connected to form an integral body into an ultrasonic cleaning machine for cleaning and air drying;

[0121] S09, grinding and polishing the mosaic structure 11;

[0122] S10, performing an inlay operation on the inlay structure 11, inlaying the inlay material 40 in the inlay structure 11;

[0123] S11, drilling the electroplating layer 30 to form a lead-out hole, the lead-out hole penetrates to the second wax mold 20;

[0124] S12, heating the second wax mold 20, and the second wax mold 20 is melted by the heat and discharged from the outlet hole to obtain a jewelry with the inlaid material 40;

[0125] S13, performing chemical precipitation operation on the jewelry to completely decompose the remaining conductive coating;

[0126] S14. Place the jewelry in an ultrasonic cleaner for cleaning and air drying.

[0127] Please refer to Figures 2 to 4 In the second aspect, the embodiment of the present application further provides a kind of ornament, including a substrate 10, a plating layer 30 and an inlay material 40, the substrate 10 and the plating layer 30 are connected to form an integral structure, an inlay structure 11 is provided on the substrate 10, and the inlay material 40 is fixed in the inlay structure 11.

[0128] The jewelry provided in the embodiment of the present application utilizes the base 10 to carry the inlay material 40 , and the thickness of the electroplating layer 30 that does not need to be inlaid is relatively thin, which can save the metal material of the jewelry and effectively reduce the cost of the jewelry.

[0129] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A jewelry processing technology, characterized in that: The processing technology comprises the following steps: obtaining a substrate on which a mosaic structure is disposed; Obtaining a second wax model, and embedding the substrate on the second wax model; Performing electroforming operation on the second wax mold to form an electroplating layer; the electroplating layer is connected with the substrate to form a whole; Performing an inlay operation on the inlay structure to inlay the inlay material into the inlay structure; Drilling the electroplated layer to form a lead-out hole, wherein the lead-out hole penetrates to the second wax mold; The second wax mold is heated, and the second wax mold is melted by the heat and then discharged from the outlet hole to obtain a jewelry with inlaid material.

2. The jewelry processing technology according to claim 1, characterized in that: The base has a first end surface and a second end surface opposite to each other, the inlay structure is arranged on the first end surface, and the first connecting portion is arranged on the second end surface; A receiving groove is provided on the surface of the second wax mold, and a second connecting portion is provided on the bottom wall of the receiving groove; the base body is received in the receiving groove, and the first connecting portion is plugged and matched with the second connecting portion.

3. The jewelry processing technology according to claim 1 or 2, characterized in that: A connecting groove is provided on the substrate in a direction perpendicular to the thickness of the second wax pattern; and a size of the connecting groove is greater than or equal to the thickness of the electroplating layer in the thickness direction of the second wax pattern.

4. The jewelry processing technology according to claim 3, characterized in that: The base body is an annular structure, and the connecting grooves are provided on the inner peripheral wall surface and the outer peripheral wall surface of the base body in a direction perpendicular to the thickness of the second wax mold.

5. The jewelry processing technology according to claim 3, characterized in that: The specific steps of embedding the substrate on the second wax model include: applying a conductive coating to the outer surface of the second wax mold; The substrate is embedded in the second wax mold coated with a conductive coating, and pressure is continuously applied to make the substrate and the second wax mold fit each other.

6. The jewelry processing technology according to claim 5, characterized in that: After the heating operation of the second wax pattern and the step of discharging the second wax pattern from the outlet hole after the second wax pattern is melted by the heat, the method further comprises: Performing a chemical precipitation operation on the ornament to completely decompose the remaining conductive coating; The jewelry was cleaned in an ultrasonic cleaner and air-dried.

7. The jewelry processing technology according to claim 1 or 5, characterized in that: Before the step of electroforming the second wax mold and forming an electroplating layer, the method further comprises: coating the mosaic structure with an insulating layer; The second wax mold embedded with the substrate is placed in an ultrasonic cleaning machine for cleaning and air drying.

8. The jewelry processing technology according to claim 7, characterized in that: After the step of electroforming the second wax pattern and forming an electroplating layer, the method further comprises: Cleaning the insulating layer to remove the insulating layer; The electroplating layer and the substrate connected as one are placed in an ultrasonic cleaning machine for cleaning and air drying.

9. The jewelry processing technology according to claim 1, characterized in that: Before the step of performing an inlay operation on the inlay structure, the method further includes: performing a grinding and polishing operation on the inlay structure.

10. A kind of ornament, characterized by: The invention comprises a substrate, an electroplating layer and an inlay material. The substrate and the electroplating layer are connected to form an integral structure. An inlay structure is arranged on the substrate, and the inlay material is fixed in the inlay structure.

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