Piezoelectric ceramic silver coating surface tinning equipment suitable for transducer tin soldering

Abstract

The invention provides piezoelectric ceramic silver coating surface tinning equipment suitable for transducer tin soldering. The piezoelectric ceramic silver coating surface tinning equipment comprises a movement mechanism, a workbench, an execution mechanism and a control system. Through effective integration of mechanical mechanisms, electrical mechanisms and the like and recombination and improvement of the process, the piezoelectric ceramic silver coating surface tinning equipment, system and process suitable for transducer tin soldering are achieved. Compared with an existing manual tinning process, the automatic tinning device has the advantages of being high in efficiency, good in reliability and good in consistency. The problems that in the automatic tinning process of a piezoelectric ceramic surface silver coating, the tinning amount is difficult to control, and the tin soldering point quality is poor due to tin soldering point diffusion and infiltration can be solved. The whole structure is few in component, compact in structure, simple, reliable and wide in application range.

Description

Technical Field

[0001] The invention belongs to the technical field of soldering technology, and in particular, relates to a tinning device, system and method on the surface of a piezoelectric ceramic silver-plated layer suitable for soldering a transducer. Background Art

[0002] With the development of social economy and the progress of acoustic technology, electroacoustic transducers are widely used in various industries such as medicine, military, and engineering. Among them, high-frequency electroacoustic transducers based on piezoelectric ceramics are an important type of transducer. For example, ultrasonic diagnosis in the medical field requires high-frequency electroacoustic transducers as its probe.

[0003] On the one hand, due to the limitations of natural laws, the piezoelectric ceramic components used in high-frequency transducers are generally characterized by small size, small mass, and high precision requirements. In addition, in order to achieve a relatively single thickness-direction vibration mode while ensuring the transmission power and transmission voltage response, and to suppress coupling interference such as bending modes, a single piezoelectric ceramic component is often divided into dozens or even hundreds of small units, and the electrical connection is achieved by parallel connection of leads. Since the size of the ceramic itself is already very small, the additional mass introduced by the parallel leads and solder still has a significant impact on the resonant frequency of the ceramic. Therefore, it is necessary to use the smallest possible solder joints and the thinnest possible leads to reduce the resonant frequency offset while ensuring the reliability of the connection.

[0004] On the other hand, the existing production process of high-frequency transducers is roughly manual tinning and lead welding. Among them, manual tinning is a process of applying tin beads on the surface of ceramics. Its purpose is to achieve reliable connection of solder and silver plating before lead welding, which provides convenience for subsequent wire welding. The soldering point of tinning is generally much smaller than the size of the ceramic block, and its minimum diameter can reach about 0.7mm; when tinning, first melt a very small amount of solder on the soldering iron, and then apply it to the ceramic surface through precise visual operation. When welding the lead, basically no additional solder is added, but the solder point is used to achieve welding. In order to improve solderability, the lead generally uses silver-plated wire, and flux is applied during welding to ensure welding quality. Due to the small size and large number of solder joints, this production process has high requirements for operators.

[0005] In addition, it is easy to find that the existing soldering process is labor-intensive, and the extremely small solder joints are very likely to cause visual fatigue, affecting the health of operators; solder joints are still often uneven in size, leaking, and ceramics are burned, which greatly affects the frequency consistency and emission performance of the transducer. This greatly affects the high-efficiency and high-quality production of high-frequency transducers and limits the widespread application of ultrasonic technology.

[0006] In terms of automatic soldering technology, existing automatic soldering machines and other equipment can achieve high-efficiency tinning of PCB pads. For example, patent document CN210412936U provides a modular soldering machine with good soldering effect, including a workbench, a frame, an X-axis moving mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism, a product processing base, a soldering mechanism, an automatic tinning mechanism, an air blowing device, a temperature control box, a PLC programming interface, a driving mechanism, a control mechanism and a transmission mechanism.

[0007] In addition, in the soldering of electronic components, automatic soldering such as reflow soldering by coating solder paste on a steel mesh is also common. The problems existing in these prior arts are analyzed below.

[0008] For automatic soldering machines, due to the uncontrollability of the solder melting and adhesion process, the existing soldering machine tinning accuracy is not high, and the tinning process is often used when welding small solder joints. Compared with the solder joints surrounded by the solder mask layer on the PCB surface, the silver-plated layer on the surface of the piezoelectric ceramic is directly and completely exposed, and the solder joints that need to be tinned are much smaller than the pad size. If the tinning process is used, the excess solder will easily diffuse and infiltrate the entire surface silver-plated layer under the action of surface tension, making the solder joints too large and too thin, which not only increases the additional mass and affects the resonant frequency, but is also not conducive to the subsequent lead welding.

[0009] For methods such as reflow soldering using steel mesh, generally speaking, the main steps of the steel mesh reflow soldering method are as follows: 1. Steel mesh alignment; 2. Solder paste coating; 3. Excess solder paste removal; 4. Steel mesh removal; 5. Hot air soldering. Although the existing steel mesh soldering process has been widely used in the field of printed circuit boards, it has even been used in non-fields such as solar panels. However, it still has the following problems: 1. It is suitable for mass production, and the steel mesh is not very versatile; 2. It is suitable for the situation where all pads are tinned. When the solder joints to be tinned are much smaller than the pad size, the aforementioned solder point diffusion and infiltration phenomenon still exists.

[0010] Therefore, in order to solve the problems existing in the above-mentioned prior art and realize more stable, reliable and efficient high-frequency transducer production, it is very necessary to develop a tinning process and equipment on the surface of the piezoelectric ceramic silver-plated layer suitable for transducer soldering.

[0011] In view of the problems existing in the prior art, the present invention provides a device, system and process for tinning the surface of a silver-plated layer of a piezoelectric ceramic suitable for tin soldering of a transducer. Summary of the invention

[0012] In view of the defects in the prior art, the object of the present invention is to provide a device, system and process method for tinning the surface of the silver-plated layer of piezoelectric ceramics suitable for soldering of transducers.

[0013] According to the present invention, a tinning device for tinning the silver-plated surface of a piezoelectric ceramic suitable for tinning a transducer comprises: a motion mechanism 1, a workbench 2, and an actuator 3;

[0014] The motion mechanism 1 is mounted on a frame 10;

[0015] The actuator 3 is directly or indirectly connected to the frame 10;

[0016] The workbench 2 is directly or indirectly connected to the frame 10 .

[0017] Preferably, the motion mechanism 1 includes at least one of a first motion axis system 11 and a second motion axis system 12, and the relative motion or rotation in at least one direction between the workbench 2 and the actuator is realized by at least one of the first motion axis system 11 and the second motion axis system 12;

[0018] One end of the first motion axis system 11 and the second motion axis system 12 are mounted on the frame 10;

[0019] The workbench 2 is directly mounted on the frame 10, or is mounted on the frame 10 via a second motion axis system 11;

[0020] The actuator 3 is mounted on the frame 10 via a first motion axis system 11 , or is directly mounted on the frame 10 .

[0021] Preferably, the actuator 3 comprises: a connecting member 30 , a tin supply assembly 31 , a heating assembly 32 and a solder template 33 , wherein the tin supply assembly 31 , the heating assembly 32 and the solder template 33 are respectively installed on the connecting member 30 ; and the heating assembly 32 is installed next to the solder template 33 .

[0022] Preferably, the tin supply component 31 adopts a method of conveying tin balls through pipelines, etc., and takes out one or several tin balls at a time through a rotating wheel with grooves, and delivers them to the welding point, that is, the center position of the solder template through the pipeline; wherein the rotating wheel is driven by a stepper motor to control its start and stop and the number of tin balls output; a harder rubber scraper is provided at the tail of the silo to scrape off excess tin balls in a single groove; an elastic scraper is provided in the pipeline to remove the tin balls from the grooves of the rotating wheel.

[0023] Preferably, the solder template (33) is a plate with holes; the solder template (33) is made of a material that is hydrophobic to the tin liquid.

[0024] Preferably, the solder template 33) is made of 304 stainless steel, with a sheet thickness of 0.8 mm and a hole diameter of 0.75 mm.

[0025] A tinning system provided according to the present invention is characterized in that it comprises the tinning device on the surface of the silver-plated layer of the piezoelectric ceramic suitable for tin soldering of the transducer, and also comprises a control system;

[0026] The control system includes PLC, industrial computer and motion control card;

[0027] The control system construction plan is: use PLC to control the movement of each axis of the tinning equipment on the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering, and use an industrial computer with a display screen to analyze the soldering program to control the heating and tinning actions.

[0028] Preferably, the communication method between the PLC of the control system and the industrial computer can adopt Ethercat method, and the target position and movement speed of each axis can be set directly by operating the register, and the programming of the tinning point, welding parameters and processing path can be realized by software.

[0029] Preferably, when the tinning system is used in the tinning process of a local area on the surface of exposed metal or metal coating, the area to be tinned is smaller than the exposed area of ​​the surface; the shape of the tinning area is determined by the solder template 33 in the tinning equipment on the surface of the piezoelectric ceramic silver-plated layer suitable for transducer soldering; the exposed surface area and the molten solder are hydrophilic, and the molten solder tends to spontaneously fill the exposed surface; the movable solder template 33 is used to repeat tinning at more than one position on the surface to be tinned, and the area to be tinned is smaller than the exposed surface area.

[0030] According to a tinning process provided by the present invention, the tinning device on the surface of the silver-plated layer of the piezoelectric ceramic suitable for the tin soldering of the transducer is adopted, and is characterized by comprising:

[0031] Step S1: Replace the solder template 33;

[0032] Step S2: Load solder beads, turn on the power, and do pre-soldering preparations;

[0033] Step S3: Setting the welding point position in the control system;

[0034] Step S4: clamping and aligning the ceramic component to be welded on the workbench 2;

[0035] Step S5: the motion mechanism 1 drives the actuator 3 to the position above the pad on the surface of the ceramic component and aligns it;

[0036] Step S6: the motion mechanism 1 drives the solder template 33 to descend to the surface of the ceramic component and fits tightly with the help of the elasticity of the actuator 3;

[0037] Step S7: the tin supply mechanism 31 supplies tin beads of required size to the holes at the soldering point positions of the solder template 33;

[0038] Step S8: The heating component 32 heats the solder template 33 and the solder ball to melt the solder ball and weld it to the ceramic;

[0039] Step S9: the heating component 32 stops heating and waits for the solder and the solder template 33 to cool down;

[0040] Step S10: the motion mechanism 1 moves away the solder template 33;

[0041] Repeat steps S4 to S10 until all soldering pads are tinned.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. Compared with the existing manual tinning process, the present invention has the advantages of high efficiency, good reliability and good consistency;

[0044] 2. Compared with other existing devices, the present invention can solve the problem that the amount of tinning is difficult to control during the automatic tinning process of the silver-plated layer on the surface of piezoelectric ceramics, and the diffusion and infiltration of the solder points lead to poor quality of the solder points;

[0045] 3. The present invention has fewer structural components and a compact and reliable structure;

[0046] 4. The present invention has a wide range of applications and can be used for various transducers, metal-coated surfaces, and tinning processes where the area of ​​a metal surface to be tinned is smaller than the exposed area of ​​the surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0048] Figure 1 This is a schematic diagram of the structure of the tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering provided by the present invention.

[0049] Figure 2 This is a schematic diagram of the actuator mechanism of the tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for tin soldering of transducers provided by the present invention.

[0050] The figure shows:

[0051] DETAILED DESCRIPTION

[0052] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0053] like Figure 1 As shown, the embodiment of the present invention provides a tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for tinning of transducers, comprising: a motion mechanism 1, a workbench 2, and an actuator 3;

[0054] The motion mechanism 1 includes a frame 10, and includes at least one of a first motion axis system 11 and a second motion axis system 12, and is used to realize relative movement or rotation in at least one direction between the workbench 2 and the actuator; one end of the first motion axis system 11 and the second motion axis system 12 are installed on the frame 10; the workbench 2 is directly installed on the frame 10 or installed on the frame 10 through the second motion axis system 11; the actuator 3 is installed on the frame 10 through the first motion axis system 11, or directly installed on the frame 10; further, the first motion axis system 11 and the second motion axis system 12 can be composed of a motion axis stack composed of one or more stepping or servo motors, reducers, screws, guide rails and other components; thereby, the soldering equipment can accurately relatively position and align the solder joints to be soldered on the surface of the workpiece.

[0055] Furthermore, the motion mechanism 1 can be realized by modifying, combining, etc. a multi-axis machine tool or a multi-axis robot whose size and stroke meet the relative motion requirements of the tinning equipment or the workpiece to be tinned on the surface of the piezoelectric ceramic silver-plated layer suitable for transducer soldering of the present invention, for example, Figure 1 The motion mechanism 1 shown in the figure can be converted from a four-axis machine tool.

[0056] The workpiece to be tinned is placed on the workbench 2 to achieve the fixation function of the workpiece. Further, the workbench 2 can be a machine tool workbench with an inverted T-shaped guide rail or a workbench with positioning holes.

[0057] The actuator 3 includes a connecting part 30, a tin supply component 31, a heating component 32 and a solder template 33. The tin supply component 31, the heating component 32 and the solder template 33 are respectively installed on the connecting part 30; the heating component 32 is installed next to the solder template 33, and can realize contact or non-contact heating of the area corresponding to the solder template 33; the tin supply component 31 can realize the supply of solder in the solder joint area, and its implementation method includes using a pipeline to transport solder balls and other methods.

[0058] More specifically, one implementation of the tin supply assembly 31 is as follows: using a pipeline to transport tin balls, etc., taking out one or several tin balls at a time through a rotating wheel with grooves, and sending them to the welding point, that is, the center of the solder template, through the pipeline; wherein the rotating wheel is driven by a stepper motor, and its start and stop and the number of tin balls output can be accurately controlled; a harder rubber scraper is provided at the tail of the silo to scrape off excess tin balls in a single groove; an elastic scraper is provided in the pipeline to remove the tin balls from the grooves of the rotating wheel. In this way, a small amount of solder can be accurately supplied, and the influence of excess solder on the vibration of the transducer can be avoided.

[0059] The heating component 32 includes laser heating, electric heating, ultrasonic heating and the like;

[0060] Furthermore, the heating component 32 can heat the solder template 33 by a laser beam, the laser power used is about 20W, and the focus diameter is about 0.3mm; thereby, the melting and welding of the solder can be achieved;

[0061] The solder template 33 is a thin plate with a certain shape of openings, which realizes the function of limiting the tin liquid at the solder joint during the tinning process; specifically, a solder template 33 with a single circular opening is used to realize the circular solder joint tinning process on the surface of the square pad of the silver-plated layer of the cutting ceramic block; the solder template 33 is made of a material that is hydrophobic to the tin liquid, such as aluminum, stainless steel, etc., to avoid the adhesion of the tin liquid. Furthermore, the solder template 33 is hydrophobic to the tin liquid, which inhibits the affinity, adsorption, and diffusion effects of the solder droplets that are hydrophilic to the solder; thus, the solder cannot invade the gap formed by the solder template 33, so that the size of the solder joint is limited, the solder joint is small, full, and uniform, which has the beneficial effect of avoiding affecting the resonant frequency of the transducer and the subsequent wire bonding process; in addition, the hydrophobic solder template 33 avoids the adhesion and clogging of the solder, greatly extending its service life. Furthermore, the parameters of an optional solder template are: the material is 304 stainless steel, the sheet thickness is 0.8mm, and the aperture is 0.75mm. The solder template 33 is connected to other components of the actuator 3 by an elastic connector, so that it fits tightly with the ceramic during welding and plays a better limiting role; specifically, the solder template 33 can be connected to the connector 30 of the actuator 3 by a cantilever beam.

[0062] The embodiment of the present invention further provides a tinning system, comprising the tinning device on the surface of the silver-plated layer of the piezoelectric ceramic suitable for tinning of the transducer provided by the present invention, and also comprising a control system;

[0063] The control system includes industrial control systems such as PLC, industrial computer, motion control card, etc., to realize the motion control function of the mechanism and the automatic control of heating, tinning and other actions; specifically, the control system can be built in the following way: use PLC to control the movement of each axis, and use an industrial computer with a display screen to parse the soldering program and control heating, tinning and other actions. Furthermore, the communication method between the PLC and the industrial computer of the control system can adopt the Ethercat method, directly set the target position and movement speed of each axis by operating the register, and use software to realize the rapid programming of tinning points, welding parameters and processing paths;

[0064] Furthermore, when the tinning system of the present invention is used in the tinning process of local areas of bare metal, metal-plated surfaces and other conductive surfaces, the tinning area needs to be smaller than the exposed surface area; the shape of the tinning area is determined by the solder template 33 in the tinning system; the exposed surface area and the molten solder are in a hydrophilic state, and the molten solder tends to spontaneously fill the exposed surface; a movable solder template 33 is used to repeat tinning at more than one position on the surface to be tinned, and the tinning area needs to be smaller than the exposed surface area.

[0065] The embodiment of the present invention further provides a tinning process using the tinning device on the surface of the piezoelectric ceramic silver-plated layer suitable for transducer soldering according to the present invention, comprising:

[0066] Step S1: Replace the solder template 33. Generally, a single circular hole template can be used. The shape of the solder template 33 can be consistent with the shape of the desired solder joint to control the shape of the solder joint.

[0067] Step S2: Load solder beads, turn on the power, and do pre-soldering preparations;

[0068] Step S3: Setting the welding point position in the control system;

[0069] Step S4: clamping and aligning the ceramic component to be welded on the workbench 2;

[0070] Step S5: the motion mechanism 1 drives the actuator 3 to a position above the surface of the ceramic element and aligns it;

[0071] Step S6: the motion mechanism 1 drives the solder template 33 to descend to the surface of the ceramic component and fits tightly with the help of the elasticity of the actuator 3;

[0072] Step S7: the tin supply mechanism 31 accurately supplies tin beads of required size to the holes at the soldering point positions of the solder template 33 through the pipeline;

[0073] Step S8: The heating component 32 heats the solder template 33 and the solder ball to melt the solder ball and weld it to the ceramic;

[0074] Step S9: the heating component 32 stops heating and waits for the solder and the solder template 33 to cool down;

[0075] Step S10: the motion mechanism 1 moves away the solder template 33;

[0076] Repeat steps 4-10 until all soldering is completed.

[0077] In a more specific embodiment of the tinning process, the silver plating on the surface of the transducer piezoelectric ceramic block is welded and tinned through experiments. The ceramic size is 80×50mm, the block pad size is 2×2mm, and the solder joint size is required to be less than φ0.75mm. The tinning condition is good during the actual welding process, and no phenomena such as excessive solder joints and tin sticking are found. Therefore, the tinning process and equipment on the surface of the piezoelectric ceramic silver plating layer suitable for transducer soldering implemented according to the method provided by the present invention can achieve better results.

[0078] In summary, the present invention provides a device, system and process for tinning the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering. Through the effective integration of mechanical, electrical and other mechanisms and the reorganization and improvement of the process, a device, system and process for tinning the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering is realized; compared with the existing manual tinning process, it has the advantages of high efficiency, good reliability and good consistency; it can solve the problems of difficult control of tinning amount during automatic tinning of the silver-plated layer on the surface of piezoelectric ceramics and poor quality of solder points due to diffusion and infiltration of solder points; the overall structural components are relatively few, the structure is compact and reliable, and the scope of application is wide.

[0079] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0080] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A tinning device for the surface of a piezoelectric ceramic silver-plated layer suitable for soldering a transducer, characterized in that: include: Motion mechanism (1), workbench (2), actuator (3); The motion mechanism (1) is mounted on a frame (10); The actuator (3) is directly or indirectly connected to the frame (10); The workbench (2) is directly or indirectly connected to the frame (10).

2. The tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering according to claim 1, characterized in that: The motion mechanism (1) comprises at least one of a first motion axis system (11) and a second motion axis system (12), and the at least one of the first motion axis system (11) and the second motion axis system (12) is used to realize relative motion or rotation in at least one direction between the workbench (2) and the actuator; One end of the first motion shaft system (11) and the second motion shaft system (12) are mounted on the frame (10); The workbench (2) is directly mounted on the frame (10), or is mounted on the frame (10) via a second motion axis system (11); The actuator (3) is mounted on the frame (10) via a first motion axis system (11), or is directly mounted on the frame (10).

3. The tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for soldering of transducers according to claim 1, characterized in that: The actuator (3) comprises: a connecting member (30), a tin supply assembly (31), a heating assembly (32) and a solder template (33); the tin supply assembly (31), the heating assembly (32) and the solder template (33) are respectively mounted on the connecting member (30); and the heating assembly (32) is mounted next to the solder template (33).

4. The tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for soldering of transducers according to claim 3, characterized in that: The tin supply component (31) adopts a method of conveying tin balls through a pipeline, etc., and takes out one or several tin balls at a time through a rotating wheel with grooves, and delivers them to the welding point, that is, the center position of the solder template through the pipeline; wherein the rotating wheel is driven by a stepper motor to control its start and stop and the number of tin balls output; a harder rubber scraper is provided at the tail of the silo to scrape off excess tin balls in a single groove; an elastic scraper is provided in the pipeline to take the tin balls out of the grooves of the rotating wheel.

5. The tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for soldering of transducers according to claim 3, characterized in that: The solder template (33) is a plate with holes; the solder template (33) is made of a material that is hydrophobic to the tin liquid.

6. The tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for soldering of transducers according to claim 5, characterized in that: The solder template (33) is made of 304 stainless steel, with a sheet thickness of 0.8 mm and a hole diameter of 0.75 mm.

7. A tinning system, characterized in that: The tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for tin soldering of transducers according to any one of claims 1 to 6 also includes a control system; The control system includes PLC, industrial computer and motion control card; The control system construction plan is: use PLC to control the movement of each axis of the tinning equipment on the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering, and use an industrial computer with a display screen to analyze the soldering program to control the heating and tinning actions.

8. The tinning system according to claim 7, characterized in that: The communication method between the PLC of the control system and the industrial computer can adopt the Ethercat method, and the target position and movement speed of each axis can be set directly by operating the register, and the software can be used to realize the programming of the tinning point, welding parameters and processing path.

9. The tinning system according to claim 7, characterized in that: When the tinning system is used in the tinning process of a local area on the surface of a bare metal or metal coating, the area to be tinned is smaller than the exposed area on the surface; the shape of the tinning area is determined by a solder template (33) in a tinning device on the surface of the piezoelectric ceramic silver coating suitable for transducer soldering; the exposed area on the surface is hydrophilic with the molten solder, and the molten solder has a tendency to spontaneously fill the exposed surface; the movable solder template (33) is used to repeat tinning at more than one position on the surface to be tinned, and the area to be tinned is smaller than the exposed area on the surface.

10. A tinning process, using the tinning device on the surface of the silver-plated layer of piezoelectric ceramics suitable for transducer soldering as claimed in any one of claims 1 to 6, characterized in that: include: Step S1: Replace the solder template (33); Step S2: Load solder beads, turn on the power, and do pre-soldering preparations; Step S3: Setting the welding point position in the control system; Step S4: Clamping and aligning the ceramic component to be welded on the workbench (2); Step S5: the motion mechanism (1) drives the actuator (3) to the position above the pad on the surface of the ceramic component and aligns it; Step S6: The motion mechanism (1) drives the solder template (33) to descend to the surface of the ceramic component and fits tightly with the help of the elasticity of the actuator (3); Step S7: the tin supply mechanism (31) supplies tin beads of a required size to the holes at the soldering point positions of the solder template (33); Step S8: The heating component (32) heats the solder template (33) and the solder ball, so that the solder ball melts and is welded to the ceramic; Step S9: the heating component (32) stops heating and waits for the solder and the solder template (33) to cool down; Step S10: the motion mechanism (1) moves the solder template (33); Repeat steps S4 to S10 until all soldering pads are tinned.

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