Cutting device for semiconductor chip processing

Abstract

The invention discloses a cutting device for semiconductor chip processing, belongs to the technical field of semiconductor chip processing, and aims to solve the problems that when a worker does not fasten a fixing nut in place, a blade deviates in the high-speed rotation process, and the cutting precision is affected. A limiting block is fixedly arranged on the circumferential outer wall of an output shaft of the motor in a sleeving mode, the tail end of the output shaft of the motor is in threaded connection with a fixing nut, an L-shaped support is further fixedly arranged on the supporting frame, an electric telescopic column is fixedly arranged on the L-shaped support, and a position adjusting assembly is rotationally installed at the output tail end of the electric telescopic column; and an anti-falling assembly is movably arranged in the position adjusting assembly, and a pair of jacking assemblies are fixedly arranged on the side wall of the position adjusting assembly in a communicating manner, so that a loosened blade can be fixed under the condition of no shutdown, and a wafer which is cut to half is continuously cut and then is overhauled, so that the wafer taking frequency is reduced, the wafer taking efficiency is improved, and the wafer taking efficiency is improved. The damage probability of the semiconductor chip can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip processing, in particular to a cutting device for semiconductor chip processing. Background Art

[0002] A semiconductor chip is a miniature electronic component made on semiconductor materials. The steps for making semiconductor chips are as follows: wafer processing, oxidation, photolithography, etching, thin film deposition, interconnection, testing and packaging. In the packaging step, the wafer needs to be cut into multiple separate semiconductor chips and then packaged. The step of cutting the wafer is very important. If there is a problem with the cutting accuracy, the performance of the semiconductor chip will be damaged or even unusable.

[0003] Chinese patent CN215771065U announces an IC semiconductor chip processing and cutting device, including a base, a housing, an operating disk, a sleeve, a gear ring, a telescopic cylinder, a support ring, a U-shaped frame, a first motor, a gear and a fixed rod, the housing is fixedly connected to the base, the base is provided with a groove, one end of the fixed rod is fixedly connected to the bottom of the groove, the operating disk is fixedly connected to the upper end of the fixed rod, the sleeve is rotatably sleeved on the fixed rod, the gear ring is fixedly sleeved on the sleeve, the first motor is fixedly connected to the bottom of the groove, the gear is fixedly sleeved on the output shaft of the first motor and meshes with the gear ring, the telescopic cylinder is symmetrically arranged on the gear ring, the support ring is fixedly connected to the upper end of the telescopic cylinder, the U-shaped frame is symmetrically fixedly connected to the support ring, and a rotating mechanism is fixedly connected inside the housing. The utility model can realize cutting out multiple chips at one time, greatly improving the production efficiency of chips.

[0004] The IC semiconductor chip processing and slitting device disclosed in the above-mentioned prior art can slit multiple chips at a time, greatly improving the chip production efficiency, but still has the following defects: when the blade of the machine reaches the point where it needs to be replaced, the machine is generally shut down, the old blade is manually removed, and then the new blade is installed on the machine. If the fixing nut is not tightened in place during manual installation, the blade may fall off, deviate or burst due to uneven stress during high-speed rotation, affecting the cutting accuracy and causing a decrease in the chip yield.

[0005] In view of the above problems, a cutting device for semiconductor chip processing is proposed. Summary of the invention

[0006] The object of the present invention is to provide a cutting device for semiconductor chip processing. By using this device to work, it is solved that when the blade of the machine in the above background reaches the point where it needs to be replaced, the machine is stopped and the blade is replaced manually. The worker may fail to tighten the fixing nut in place, resulting in the blade falling off, shifting or bursting due to uneven stress during high-speed rotation, thereby affecting the cutting accuracy and reducing the yield rate of the chip.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a cutting device for semiconductor chip processing, comprising a device housing and a controller embedded and fixedly arranged on the device housing, an alarm is fixedly arranged on the top of the device housing, the controller and the alarm are electrically connected, a motor is fixedly arranged on the side wall inside the device housing, a moving component is also slidably arranged inside the device housing, the controller is electrically connected to the motor and the moving component respectively, a support frame is fixedly installed on the side wall of the motor housing, the output shaft of the motor passes through the support frame, and a limit block is fixedly sleeved on the circumferential outer wall of the motor output shaft, A blade is movably sleeved on the circumferential outer wall of the motor output shaft, and a fixing nut is threadedly connected to the end of the motor output shaft. The fixing nut and the limit block are matched to limit the blade. A position sensor is fixedly installed on the support frame, and the position sensor is electrically connected to the controller. An L-shaped bracket is also fixedly arranged on the support frame, and an electric telescopic column is fixedly arranged on the L-shaped bracket, and the electric telescopic column is electrically connected to the controller. A positioning component is rotatably installed on the output end of the electric telescopic column, and an anti-falling component is movably arranged inside the positioning component, and a pair of tightening components are connected and fixedly arranged on the side wall of the positioning component.

[0008] Furthermore, the moving component includes a driving member slidably mounted inside the device housing, a lifting component is fixedly mounted on the top surface of the driving member, and a placement plate is fixedly mounted on the top surface of the lifting component.

[0009] Furthermore, the L-shaped bracket includes a bracket body fixedly installed on the support frame, an L-shaped limit rod fixedly installed on the bottom surface of the horizontal section of the bracket body, a first slide groove is opened on the L-shaped limit rod, a mounting column is slidably installed in the inner cavity of the first slide groove, the side wall of the mounting column and the side wall of the inner cavity of the first slide groove are elastically connected by a first spring, a roller is rotatably installed on the mounting column, and there is damping performance between the mounting column and the roller.

[0010] Furthermore, the positioning assembly includes a swivel mounted on the anti-falling assembly for sliding movement, a plurality of second slide grooves are provided on the side wall of the swivel facing the blade, the plurality of second slide grooves are arranged in a circular array, a positioning column is slidably installed in the inner cavity of each of the second slide grooves, an annular groove is also provided on the side wall of the swivel facing the blade, a turntable is rotatably installed in the inner cavity of the annular groove, the side wall of the turntable is in contact with the circumferential outer wall of the roller, a plurality of arc grooves are provided on the turntable, the plurality of arc grooves are arranged in a circular array, and the positioning columns are correspondingly penetrated and slidably arranged in the inner cavity of the arc grooves, a plurality of third slide grooves are provided on the side wall of the inner ring of the swivel, and a plurality of mounting grooves and a plurality of L-shaped slide grooves are respectively provided inside the swivel.

[0011] Furthermore, the positioning column includes a base embedded and slidably installed in the inner cavity of the second slide groove, a push rod is slidably installed in the inner cavity of the base, the side wall of the push rod is elastically connected to the side wall of the inner cavity of the base through a second spring, an electromagnet and a permanent magnet 1 are respectively fixedly installed on the side walls of the inner cavity of the base, permanent magnet 2 is fixedly installed on the side wall of the push rod, permanent magnet 1 and permanent magnet 2 are aligned, a ball is embedded and rotatably installed on the end of the push rod away from permanent magnet 2, and there is damping performance between the ball and the push rod.

[0012] Furthermore, the cutting edge of the blade is arranged as a bevel.

[0013] The cam is provided with a plurality of locking plates, each of which is provided with a plurality of locking plates, each of which is provided with a plurality of locking plates respectively disposed on the cam face and a plurality of locking plates are provided on the cam face.

[0014] Furthermore, a protruding portion is provided on the special-shaped plate.

[0015] Furthermore, the tightening assembly includes a mounting rod fixedly mounted on the side wall of the swivel, an end of the mounting rod away from the swivel is connected to and fixedly mounted with a top head, the mounting rod is connected to the L-shaped slide groove, a piston is slidably mounted inside the mounting rod, an L-shaped slide is fixedly mounted on the side wall of the piston, an end of the L-shaped slide away from the piston is slidably mounted in the inner cavity of the L-shaped slide groove, a plurality of tooth blocks 2 are fixedly mounted on the side wall of the L-shaped slide, a gear is rotatably mounted in the inner cavity of the L-shaped slide groove, the tooth block 2 is meshingly connected with the gear, and the gear is meshingly connected with the tooth block 1.

[0016] Furthermore, a side of the top head facing the blade is made of wear-resistant rubber material.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In the case that the fixing nut is not installed in place and the blade becomes loose, the loose blade can be fixed without stopping the machine, and the half-cut wafer can be cut and repaired, which reduces the number of times the wafer is taken and can reduce the probability of damage to the semiconductor chip.

[0019] 2. By setting the positioning component, the blade is first adjusted from the offset state to the state perpendicular to the motor output shaft, and then the blade is adjusted to the state concentric with the motor output shaft, and finally the blade is fixed, instead of directly fixing the blade when the blade is rotating at high speed, to prevent uneven stress distribution on the blade during the process of fixing the blade, thereby reducing the probability of blade cracking causing additional damage to the semiconductor chip.

[0020] 3. When the fixing nut becomes loose, the loose fixing nut can be clamped during the process of fixing the blade to prevent the fixing nut from continuing to loosen and falling onto the semiconductor chip, thereby damaging the semiconductor chip.

[0021] 4. Through the coordination of the anti-drop assembly and the tightening assembly, after the loose blade is fixed again, the relative displacement between the top head and the high-speed rotating blade can be prevented to prevent continuous wear, thereby ensuring the stable operation of the blade, ensuring good cutting accuracy, and continuing to cut the uncut wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0024] Figure 3 for Figure 2 A magnified image of point A;

[0025] Figure 4 It is a cross-sectional schematic diagram of the position adjustment component, the anti-falling component and the tightening component of the present invention;

[0026] Figure 5 for Figure 4 A magnified view of point B;

[0027] Figure 6 for Figure 4 Enlarged view of point C;

[0028] Figure 7 It is a schematic diagram of the installation position of the blade of the present invention;

[0029] Figure 8 for Figure 7 The enlarged view of point D;

[0030] Fig. 9 It is a schematic diagram of the three-dimensional structure of the position adjustment component of the present invention;

[0031] Fig.10 for Fig. 9 The enlarged view of point E;

[0032] Fig.11 It is a disassembly schematic diagram of the rotating ring and the rotating disk of the present invention;

[0033] Fig.12 It is a schematic diagram of the installation position of the limiting plate of the present invention;

[0034] Fig.13 It is a side view of the positioning assembly, the tightening assembly, the blade, the limiting block and the fixing nut of the present invention;

[0035] Fig.14 It is a schematic diagram of the installation position of the electric telescopic column of the present invention;

[0036] Fig.15 for Fig.14 An enlarged schematic diagram of point F;

[0037] Fig.16 It is a schematic diagram of the connection relationship between the anti-falling component and the tightening component of the present invention;

[0038] Fig.17 for Fig.16 Enlarged schematic diagram of point G.

[0039] In the figure: 1. Equipment housing; 2. Controller; 3. Alarm; 4. Motor; 5. Moving assembly; 51. Driving member; 52. Lifting assembly; 53. Placing plate; 6. Support frame; 7. Position sensor; 8. L-shaped bracket; 81. Bracket body; 82. L-shaped limit rod; 83. First slide groove; 84. Mounting column; 85. First spring; 86. Roller; 9. Electric telescopic column; 10. Adjusting assembly; 101. Rotating ring; 102. Second slide groove; 103. Positioning column; 1031. Base; 1032. Push rod; 1033. Second spring; 1034. Electromagnet; 1035. Permanent magnet 1; 1036. Permanent magnet 2; 1037. Ball; 1 04, annular groove; 105, turntable; 106, arc groove; 107, the third slide groove; 108, mounting groove; 109, L-shaped slide groove; 20, anti-falling assembly; 201, support block; 202, clamping block; 203, mounting plate; 204, tooth block one; 205, slide rod; 206, fourth slide groove; 207, third spring; 208, clamping plate; 209, limit plate; 220, fourth spring; 230, special-shaped plate; 240, top plate; 30, tightening assembly; 301, mounting rod; 302, top head; 303, piston; 304, L-shaped slide plate; 305, tooth block two; 306, gear; 40, blade; 50, limit block; 60, fixing nut. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In order to solve the technical problem that when the worker fails to tighten the fixing nut 60 in place, the blade 40 may fall off, deviate or burst due to uneven stress during high-speed rotation, thereby affecting the cutting accuracy and reducing the yield rate of the chip, such as Figure 1-Figure 15 As shown, the following preferred technical solutions are provided:

[0042] A cutting device for semiconductor chip processing comprises an equipment housing 1 and a controller 2 embedded and fixedly arranged on the equipment housing 1, the controller 2 is used to control and coordinate the orderly operation of various components, an alarm 3 is fixedly arranged on the top of the equipment housing 1, the controller 2 and the alarm 3 are electrically connected, and the alarm 3 can serve as a warning when a device fails, a motor 4 is fixedly arranged on the side wall inside the equipment housing 1, and a moving component 5 is also slidably arranged inside the equipment housing 1, the controller 2 is electrically connected to the motor 4 and the moving component 5 respectively, the motor 4 provides power output for the cutting operation, and before cutting the wafer, the wafer is first placed on the moving component 5, and the moving component 5 drives the wafer to move along a preset trajectory, and the wafer is cut during the movement of the wafer, so that the wafer can be cut into multiple independent semiconductor chips.

[0043] A support frame 6 is fixedly installed on the side wall of the motor 4 housing, and the support frame 6 is also provided with other components, all of which belong to the existing public technology and will not be described in detail here. The output shaft of the motor 4 passes through the support frame 6, and a limit block 50 is fixedly sleeved on the circumferential outer wall of the output shaft of the motor 4, and a blade 40 is also movably sleeved on the circumferential outer wall of the output shaft of the motor 4. The end of the output shaft of the motor 4 is threadedly connected with a fixing nut 60, and the matching setting of the fixing nut 60 and the limit block 50 limits the blade 40. When installing the blade 40, the worker sleeves the blade 40 on the output shaft of the motor 4, and then tightens the fixing nut 60 until the fixing nut 60 and the limit block 50 firmly clamp the blade 40, and then the fixing nut 60 can be stopped from rotating. At this time, the blade 40 is installed in place, and the motor 4 is started to drive the blade 40 to rotate, and the wafer can be cut.

[0044] A position sensor 7 is fixedly installed on the support frame 6, and the position sensor 7 is electrically connected to the controller 2. The position sensor 7 is used to monitor the rotation state of the blade 40 during the cutting process to determine whether the blade 40 is offset, and then determine whether the fixing nut 60 is loose. An L-shaped bracket 8 is also fixedly provided on the support frame 6, and an electric telescopic column 9 is fixedly provided on the L-shaped bracket 8. The electric telescopic column 9 is electrically connected to the controller 2, and a positioning component 10 is rotatably installed at the output end of the electric telescopic column 9. An anti-falling component 20 is movably provided inside the positioning component 10, and a pair of tightening components 30 are connected and fixedly provided on the side walls of the positioning component 10.

[0045] During the cutting process, when the position sensor 7 detects that the blade 40 is offset, the controller 2 determines that the fixing nut 60 is loose, and then determines that the blade 40 and the output shaft of the motor 4 may be out of center, which will cause the cutting accuracy to decrease. At this time, the controller 2 controls the moving component 5 to move the wafer away from the blade 40, and the controller 2 controls the motor 4 to reduce the speed, and then drives the adjustment component 10 to move toward the direction close to the blade 40 through the electric telescopic column 9. When the adjustment component 10 contacts the blade 40, the electric telescopic column 9 continues to extend, and the blade 40 can be adjusted to be aligned with the electric telescopic column 9 through the adjustment component 10. The output shaft of the machine 4 is in a concentric state, and then the electric telescopic column 9 is extended again, so that the tightening component 30 abuts against the side wall of the blade 40, and then the tightening component 30 replaces the function of the fixing nut 60, and the tightening component 30 and the limit block 50 are arranged in cooperation to clamp the blade 40 firmly again. At this time, the electric telescopic column 9 continues to extend, so that the anti-falling component 20 abuts against the end of the output shaft of the motor 4, triggering the clamping effect of the anti-falling component 20, so that the anti-falling component 20 clamps the fixing nut 60 to prevent the fixing nut 60 from continuing to loosen, and can also prevent the fixing nut 60 from falling and damaging the semiconductor chip.

[0046] The moving component 5 includes a driving member 51 slidably mounted inside the device housing 1, a lifting component 52 is fixedly mounted on the top surface of the driving member 51, and a placement plate 53 is fixedly mounted on the top surface of the lifting component 52. When cutting the wafer, the wafer is first placed on the placement plate 53, and then the driving member 51 and the lifting component 52 are coordinated to drive the wafer to move along a preset trajectory, thereby achieving precise cutting of the wafer.

[0047] The L-shaped bracket 8 includes a bracket body 81 fixedly mounted on the support frame 6, an L-shaped limit rod 82 fixedly mounted on the bottom surface of the horizontal section of the bracket body 81, a first slide groove 83 is provided on the L-shaped limit rod 82, a mounting column 84 is slidably mounted in the inner cavity of the first slide groove 83, the side wall of the mounting column 84 is elastically connected to the side wall of the inner cavity of the first slide groove 83 by a first spring 85, a roller 86 is rotatably mounted on the mounting column 84, and there is damping performance between the mounting column 84 and the roller 86.

[0048] The positioning assembly 10 includes a swivel 101 slidably mounted on the anti-falling assembly 20, and a plurality of second slide grooves 102 are provided on the side wall of the swivel 101 facing the blade 40, and the plurality of second slide grooves 102 are arranged in a circular array, and a positioning column 103 is slidably mounted in the inner cavity of each second slide groove 102, and an annular groove 104 is also provided on the side wall of the swivel 101 facing the blade 40, and a turntable 105 is rotatably mounted in the inner cavity of the annular groove 104, and the side wall of the turntable 105 is in contact with the circumferential outer wall of the roller 86, and the turntable 105 is provided with a plurality of arc grooves 106, and the plurality of arc grooves 106 are arranged in a circular array, and the positioning column 103 is correspondingly penetrated and slidably arranged in the inner cavity of the arc groove 106, and a plurality of third slide grooves 107 are provided on the side wall of the inner ring of the swivel 101, and a plurality of mounting grooves 108 and a plurality of L-shaped slide grooves 109 are respectively provided inside the swivel 101.

[0049] The positioning column 103 includes a base 1031 embedded and slidably installed in the inner cavity of the second slide groove 102, a push rod 1032 is slidably installed in the inner cavity of the base 1031, the side wall of the push rod 1032 is elastically connected to the side wall of the inner cavity of the base 1031 through a second spring 1033, an electromagnet 1034 and a permanent magnet 1035 are fixedly installed on the side walls of the inner cavity of the base 1031, a permanent magnet 2 1036 is fixedly installed on the side wall of the push rod 1032, the permanent magnet 1035 and the permanent magnet 2 1036 are aligned, a ball 1037 is embedded and rotatably installed at one end of the push rod 1032 away from the permanent magnet 2 1036, and there is damping performance between the ball 1037 and the push rod 1032.

[0050] The cutting edge of the blade 40 is arranged to be a bevel.

[0051] Specifically, when the blade 40 is worn, the cutting device is generally stopped, and then the blade 40 is replaced manually. If the fixing nut 60 is not installed properly manually, the blade 40 may become loose or even offset during the process of cutting the wafer into multiple independent semiconductor chips, which may affect the cutting accuracy.

[0052] When the position sensor 7 detects that the blade 40 is offset, the controller 2 determines that the fixing nut 60 is loose, and then determines that the blade 40 and the output shaft of the motor 4 may be out of center. At this time, the controller 2 controls the moving component 5 to move the wafer away from the blade 40. At the same time, the controller 2 controls the motor 4 to reduce the speed. The controller 2 then controls the electric telescopic column 9 to drive the anti-falling component 20 and the positioning component 10 to move toward the direction close to the blade 40. During the movement, the balls 1037 on the multiple ejector rods 1032 will all contact the inclined surface of the blade 40. As the electric telescopic column 9 continues to extend, the multiple positioning columns 103 will apply pressure to the blade 40. The multiple positioning columns 103 cooperate with the limit block 50 to make the blade 40 change from an inclined state to a state perpendicular to the output shaft of the motor 4.

[0053] In order to prevent the blade 40 from being out of center with the output shaft of the motor 4 and affecting the cutting accuracy, when the positioning column 103 pushes the blade 40 to a state perpendicular to the output shaft of the motor 4, since the blade 40 is rotating and since there is damping performance between the ball 1037 and the push rod 1032, the blade 40 will apply force to the multiple positioning columns 103 in the rotation direction, thereby driving the anti-drop assembly 20, the rotating ring 101 and the multiple positioning columns 103 to rotate synchronously on the output end of the electric telescopic column 9;

[0054] Under the elastic force of the first spring 85, the mounting column 84 and the roller 86 are in contact with the side wall of the rotating disk 105. Since there is a damping performance between the mounting column 84 and the roller 86, the rotating disk 105 will encounter resistance when rotating on the annular groove 104. Then, when the anti-drop assembly 20, the rotating ring 101 and the plurality of positioning columns 103 rotate synchronously on the output end of the electric telescopic column 9, since the rotating disk 105 will encounter resistance when rotating in the annular groove 104, the rotating ring 101 and the rotating disk 105 will have different The phenomenon of step rotation, and the rotation speed of the rotating ring 101 is faster than the rotation speed of the rotating disk 105, and then under the cooperation of the second slide groove 102 and the arc groove 106, the plurality of positioning posts 103 are respectively gathered toward the center on the corresponding second slide groove 102, because the balls 1037 on the plurality of push rods 1032 are all in contact with the inclined surface of the blade 40, then when the plurality of positioning posts 103 gather toward the middle, they will apply pressure to the inclined surface of the blade 40, and adjust the blade 40 to a position concentric with the rotating ring 101;

[0055] Since the rotating ring 101 is concentrically arranged with the output shaft of the motor 4, the blade 40 after adjusting the position is also concentric with the output shaft of the motor 4. When the blade 40 is concentric with the output shaft of the motor 4, the controller 2 controls the electric telescopic column 9 to continue to extend. At this time, the push rod 1032 is pressed into the inner cavity of the base 1031 and compresses the second spring 1033 until the clamping assembly 30 contacts the blade 40. At this time, the clamping assembly 30 and the limit block 50 are matched to fix the blade 40 adjusted to the concentric state again, and the electromagnet 1034 is started, so that the electromagnet 1034 attracts the permanent magnet 2 1036, so that the permanent magnet 2 1036, the push rod 1032 and the ball 1037 are synchronously retracted toward the inside of the base 1031, so that the ball 1037 and the inclined surface at the edge of the blade 40 are separated from each other. When retracted to an appropriate distance, the permanent magnet 1 1035 and the permanent magnet The suction force generated between the two permanent magnets 1036 and the compressive elastic force of the second spring 1033 is balanced with each other, so that the permanent magnet two 1036, the push rod 1032 and the ball 1037 stop and position. At this time, closing the electromagnet 1034 will not have any effect. The advantage of such a setting is that the electromagnet 1034 does not need to operate for a long time to prevent the electromagnet 1034 from being damaged by heat. On the contrary, by reversely energizing the electromagnet 1034, the permanent magnet two 1036, the push rod 1032 and the ball 1037 can be pushed outward from the base 1031. As the distance between the permanent magnet one 1035 and the permanent magnet two 1036 continues to increase, when the appropriate position is reached, the electromagnet 1034 is closed, so that the attraction between the permanent magnet one 1035 and the permanent magnet two 1036 is gradually smaller than the compressive elastic force of the second spring 1033, and then the permanent magnet two 1036, the push rod 1032 and the ball 1037 are reset outward to adjust the position of the blade 40.

[0056] After the above actions are completed, it means that the loose blade 40 has been fixed without stopping the machine, and the controller 2 controls the motor 4 to drive the blade 40 to return to the speed during cutting. At this time, the positioning component 10, the anti-falling component 20, the tightening component 30, the blade 40 and the limit block 50 rotate synchronously, and then the moving component 5 brings the wafer to reset, and continues to cut the uncut wafer.

[0057] Through the above arrangement, when the fixing nut 60 is not installed in place and the blade 40 is loose, the loose blade 40 can be fixed without stopping the machine, and the wafer that has been cut halfway can be cut and then repaired, which reduces the number of times the wafer is taken and can reduce the probability of damage to the semiconductor chip.

[0058] Moreover, it can be known from the above description that the blade 40 is first adjusted from the offset state to the state perpendicular to the output shaft of the motor 4 through the positioning component 10, and then the blade 40 is adjusted to a state concentric with the output shaft of the motor 4, and finally the adjusted blade 40 is fixed through the coordinated setting of the electric telescopic column 9, the tightening component 30 and the limit block 50, instead of directly fixing the blade 40 when the blade 40 is rotating at a high speed. The advantage of such a setting is as follows: the blade 40 is first adjusted to a relatively stable state and fixed, so as to prevent the blade 40 from having uneven stress distribution during the process of fixing the blade 40, thereby reducing the probability of the blade 40 breaking and causing additional damage to the semiconductor chip.

[0059] In order to solve the technical problem that the fixing nut 60 continues to loosen and falls onto the semiconductor chip, causing damage to the semiconductor chip, such as Figure 4-Figure 5 , Fig. 9 and Figure 12-Figure 17 As shown, the following preferred technical solutions are provided:

[0060] The anti-falling component 20 includes a support block 201 rotatably mounted on the output end of the electric telescopic column 9, a plurality of clamping blocks 202 are fixedly mounted on the circumferential outer wall of the support block 201, the clamping blocks 202 are embedded and slidably mounted in the inner cavity of the third slide groove 107, a pair of mounting plates 203 are fixedly mounted on the edge of the circumferential outer wall of the support block 201, special-shaped plates 230 are fixedly mounted on the side walls of the two mounting plates 203, a plurality of tooth blocks 204 are fixedly mounted on the outer wall on the same side of the mounting plate 203 and the special-shaped plate 230, a sliding rod 205 is slidably mounted in the inner cavity of the mounting groove 108, and the side wall of the sliding rod 205 is fixedly mounted on the inner cavity of the mounting groove 108. The side walls of the inner cavity of the mounting groove 108 are elastically connected by a third spring 207, a clamping plate 208 is fixedly installed on one end of the slide rod 205 away from the third spring 207, a fourth slide groove 206 is opened on the slide rod 205, a special-shaped plate 230 is slidably arranged in the inner cavity of the fourth slide groove 206, a plurality of limit plates 209 are fixedly installed on the outer wall of the rotating ring 101 facing the electric telescopic column 9, the side wall of the limit plate 209 is elastically connected to the side wall of the support block 201 by a fourth spring 220, and a top plate 240 is rotatably installed on the outer wall of the support block 201 facing the blade 40.

[0061] A raised portion is provided on the special-shaped plate 230. When the special-shaped plate 230 slides inside the fourth slide groove 206, the raised portion on the special-shaped plate 230 cooperates with the fourth slide groove 206, so that the slide rod 205 brings the clamping plate 208 together toward the center direction of the support block 201, thereby achieving a clamping effect on the fixing nut 60.

[0062] Specifically, when the clamping assembly 30 is arranged in cooperation with the limiting block 50, after the blade 40 adjusted to the concentric state is fixed, the controller 2 controls the electric telescopic column 9 to continue to extend. The electric telescopic column 9 continues to extend, which will cause the output shaft of the motor 4 to come into contact with the top plate 240. Since the top plate 240 can rotate, the wear between the components is reduced; since the positioning assembly 10 and the clamping assembly 30 are supported by the blade 40 and will not continue to move, the support block 201 and the clamping block 202 slide in the inner cavity of the third slide groove 107 in the direction close to the blade 40, further causing the support block 201 to contact the rotating The rings 101 generate a displacement difference. When the support block 201 slides inside the rotating ring 101, the support block 201 will synchronously slide with the mounting plate 203 and the special-shaped plate 230. During the sliding process of the special-shaped plate 230, the raised portion of the special-shaped plate 230 will exert pressure on the inner wall of the fourth slide groove 206, which makes the slide bar 205 slide outward in the inner cavity of the mounting groove 108 and gather the clamping plate 208 toward the center direction of the support block 201, so as to achieve a clamping effect on the fixing nut 60. After use, the anti-drop assembly 20 can be reset by the fourth spring 220 to facilitate the next use.

[0063] Through the above-mentioned arrangement, when the fixing nut 60 becomes loose, the loose fixing nut 60 can also be clamped during the process of fixing the blade 40, so that the fixing nut 60 rotates synchronously with the positioning assembly 10, the anti-falling assembly 20, the tightening assembly 30, the blade 40, the limit block 50 and the control motor 4, thereby preventing the fixing nut 60 from continuing to loosen and falling onto the semiconductor chip, thereby reducing the probability of the semiconductor chip being damaged.

[0064] In order to solve the technical problem that the relative displacement between the plug 302 and the high-speed rotating blade 40 causes continuous wear, as shown in FIG. Figure 5 and Fig.17 As shown, the following preferred technical solutions are provided:

[0065] The tightening assembly 30 includes a mounting rod 301 fixedly mounted on the side wall of the swivel 101, the end of the mounting rod 301 away from the swivel 101 is connected to and fixedly mounted with a top head 302, the mounting rod 301 is connected to the L-shaped slide 109, a piston 303 is slidably mounted inside the mounting rod 301, an L-shaped slide plate 304 is fixedly mounted on the side wall of the piston 303, the end of the L-shaped slide plate 304 away from the piston 303 is slidably mounted in the inner cavity of the L-shaped slide 109, a plurality of tooth blocks 2 305 are fixedly mounted on the side wall of the L-shaped slide plate 304, a gear 306 is rotatably mounted in the inner cavity of the L-shaped slide 109, the tooth block 2 305 is meshingly connected with the gear 306, and the gear 306 is meshingly connected with the tooth block 1 204.

[0066] The side of the top head 302 facing the blade 40 is made of wear-resistant rubber material, which has the following advantages. First, when the top head 302 just contacts the rotating blade 40, a relative displacement will occur between the top head 302 and the blade 40. The use of wear-resistant rubber material can prevent the top head 302 from scratching the blade 40, will not cause uneven weight distribution of the blade 40, and will not affect the rotation stability of the blade 40; second, it can ensure good air tightness.

[0067] Specifically, during the operation of the anti-falling assembly 20, the support block 201 will slide inside the rotating ring 101. During the sliding of the support block 201, the mounting plate 203, the special-shaped plate 230 and the tooth block 1 204 will be driven to move synchronously. During the movement of the tooth block 104, the L-shaped slide plate 304 and the piston 303 will be driven to move in the opposite direction through the gear 306 and the tooth block 2 305. During the movement of the piston 303, the interior of the top head 302 will be changed into a negative pressure state, so that the top head 302 is firmly adsorbed on the side wall of the blade 40, so that the positioning assembly 10, the anti-falling assembly 20, the tightening assembly 30, the blade 40, the limit block 50 and the control motor 4 can rotate synchronously. With this arrangement, after the loose blade 40 is fixed again, it is possible to prevent the top head 302 from being relatively displaced from the high-speed rotating blade 40 and continuously causing wear, thereby ensuring the stable operation of the blade 40, ensuring good cutting accuracy, and continuing to cut the uncut wafers.

[0068] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0069] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cutting device for semiconductor chip processing, comprising a device housing (1) and a controller (2) embedded and fixedly arranged on the device housing (1), an alarm (3) fixedly arranged on the top of the device housing (1), the controller (2) and the alarm (3) are electrically connected, a motor (4) is fixedly arranged on the side wall inside the device housing (1), a moving component (5) is also slidably arranged inside the device housing (1), and the controller (2) is electrically connected to the motor (4) and the moving component (5), respectively, characterized in that: A support frame (6) is fixedly mounted on the side wall of the motor (4) housing, the output shaft of the motor (4) passes through the support frame (6), and a limit block (50) is fixedly sleeved on the circumferential outer wall of the output shaft of the motor (4), and a blade (40) is movably sleeved on the circumferential outer wall of the output shaft of the motor (4), and a fixing nut (60) is threadedly connected to the end of the output shaft of the motor (4), and the fixing nut (60) and the limit block (50) are matched to limit the blade (40), and a position sensor (7) is fixedly mounted on the support frame (6). ), the position sensor (7) is electrically connected to the controller (2), an L-shaped bracket (8) is fixedly arranged on the support frame (6), an electric telescopic column (9) is fixedly arranged on the L-shaped bracket (8), the electric telescopic column (9) is electrically connected to the controller (2), an output end of the electric telescopic column (9) is rotatably mounted with a position adjustment component (10), an anti-drop component (20) is movably arranged inside the position adjustment component (10), and a pair of tightening components (30) are connected and fixedly arranged on the side wall of the position adjustment component (10).

2. A semiconductor chip processing cutting device according to claim 1, characterized in that: The moving assembly (5) comprises a driving member (51) slidably mounted inside the device housing (1); a lifting assembly (52) is fixedly mounted on the top surface of the driving member (51); and a placement plate (53) is fixedly mounted on the top surface of the lifting assembly (52).

3. A semiconductor chip processing cutting device according to claim 1, characterized in that: The L-shaped bracket (8) comprises a bracket body (81) fixedly mounted on the support frame (6); an L-shaped limiting rod (82) is fixedly mounted on the bottom surface of the horizontal section of the bracket body (81); a first sliding groove (83) is provided on the L-shaped limiting rod (82); a mounting column (84) is slidably mounted in the inner cavity of the first sliding groove (83); a side wall of the mounting column (84) and a side wall of the inner cavity of the first sliding groove (83) are elastically connected via a first spring (85); a roller (86) is rotatably mounted on the mounting column (84); and a damping performance is provided between the mounting column (84) and the roller (86).

4. A semiconductor chip processing cutting device according to claim 3, characterized in that: The positioning assembly (10) comprises a rotating ring (101) slidably mounted on the anti-falling assembly (20); a plurality of second sliding grooves (102) are provided on the side wall of the rotating ring (101) facing the blade (40); the plurality of second sliding grooves (102) are arranged in a circular array; a positioning column (103) is slidably mounted in the inner cavity of each of the second sliding grooves (102); an annular groove (104) is also provided on the side wall of the rotating ring (101) facing the blade (40); a rotating disk (103) is rotatably mounted in the inner cavity of the annular groove (104) 105), the side wall of the turntable (105) is in contact with the circumferential outer wall of the roller (86), a plurality of arc grooves (106) are provided on the turntable (105), the plurality of arc grooves (106) are arranged in a circumferential array, and the positioning posts (103) are correspondingly penetrated and slidably arranged in the inner cavity of the arc grooves (106), a plurality of third sliding grooves (107) are provided on the side wall of the inner ring of the rotating ring (101), and a plurality of mounting grooves (108) and a plurality of L-shaped sliding grooves (109) are respectively provided inside the rotating ring (101).

5. A semiconductor chip processing cutting device according to claim 4, characterized in that: The positioning column (103) comprises a base (1031) embedded and slidably installed in the inner cavity of the second slide groove (102), a push rod (1032) is slidably installed in the inner cavity of the base (1031), the side wall of the push rod (1032) and the side wall of the inner cavity of the base (1031) are elastically connected through a second spring (1033), an electromagnet (1034) and a permanent magnet 1 (1035) are fixedly installed on the side wall of the inner cavity of the base (1031), a permanent magnet 2 (1036) is fixedly installed on the side wall of the push rod (1032), the permanent magnet 1 (1035) and the permanent magnet 2 (1036) are arranged in alignment, and a ball (1037) is embedded and rotatably installed at one end of the push rod (1032) away from the permanent magnet 2 (1036), and there is a damping performance between the ball (1037) and the push rod (1032).

6. A semiconductor chip processing cutting device according to claim 1, characterized in that: The blade edge of the blade (40) is arranged as a bevel.

7. A semiconductor chip processing cutting device according to claim 4, characterized in that: The anti-falling component (20) comprises a support block (201) rotatably mounted on the output end of the electric telescopic column (9); a plurality of clamping blocks (202) are fixedly mounted on the circumferential outer wall of the support block (201); the clamping blocks (202) are embedded and slidably mounted in the inner cavity of the third slide groove (107); a pair of mounting plates (203) are fixedly mounted at the edge of the circumferential outer wall of the support block (201); a special-shaped plate (230) is fixedly mounted on the side walls of the two mounting plates (203); a plurality of tooth blocks (204) are fixedly mounted on the outer wall on the same side of the mounting plate (203) and the special-shaped plate (230); a sliding rod (205) is slidably mounted in the inner cavity of the mounting groove (108); the side wall of the sliding rod (205) is rotatably mounted on the inner cavity of the mounting groove (108); The side walls of the inner cavity of the groove (108) are elastically connected by a third spring (207); a clamping plate (208) is fixedly installed on one end of the slide rod (205) away from the third spring (207); a fourth slide groove (206) is opened on the slide rod (205); a special-shaped plate (230) is slidably arranged in the inner cavity of the fourth slide groove (206); a plurality of limit plates (209) are fixedly installed on the outer wall of the rotating ring (101) facing the electric telescopic column (9); the side wall of the limit plate (209) is elastically connected to the side wall of the support block (201) by a fourth spring (220); a top plate (240) is rotatably installed on the outer wall of the support block (201) facing the blade (40).

8. A semiconductor chip processing cutting device according to claim 7, characterized in that: The special-shaped plate (230) is provided with a protruding portion.

9. A semiconductor chip processing cutting device according to claim 7, characterized in that: The tightening assembly (30) comprises a mounting rod (301) fixedly mounted on the side wall of the rotating ring (101); the end of the mounting rod (301) away from the rotating ring (101) is connected to and fixedly mounted with a top head (302); the mounting rod (301) is connected to the L-shaped slide groove (109); a piston (303) is slidably mounted inside the mounting rod (301); an L-shaped slide plate (304) is fixedly mounted on the side wall of the piston (303); the end of the L-shaped slide plate (304) away from the piston (303) is slidably mounted in the inner cavity of the L-shaped slide groove (109); a plurality of tooth blocks (305) are fixedly mounted on the side wall of the L-shaped slide plate (304); a gear (306) is rotatably mounted in the inner cavity of the L-shaped slide groove (109); the tooth block (305) is meshedly connected with the gear (306); and the gear (306) is meshedly connected with the tooth block (204).

10. A semiconductor chip processing cutting device according to claim 9, characterized in that: The side of the top head (302) facing the blade (40) is made of wear-resistant rubber material.

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