Cutting device for semiconductor wafer

Abstract

The invention relates to a cutting device for a semiconductor wafer, which comprises a rack, a sucker, a cutting assembly and a cooling assembly, and is characterized in that the sucker is mounted on the rack; the cutting assembly comprises a support, a transverse plate, a lifting plate and a cutter, the support is slidably arranged on the rack, the transverse plate is slidably arranged on the support, the lifting plate is slidably arranged on the transverse plate, and the cutter is rotationally connected to the lifting plate; the cooling assembly comprises a cutter cover and a protective cover, the cutter cover is installed on one side of the lifting plate, the cutter cover is provided with a first cutter groove, a first air groove and a plurality of first through holes, the first cutter groove is used for containing the cutting edge part of the cutter, the first air groove is formed in the cutter cover, one end of the first through hole communicates with the first air groove, and the other end of the first through hole communicates with the first cutter groove; the protective cover is detachably connected with the cutter cover and provided with a second cutter groove, a second air groove and a plurality of second through holes, the second cutter groove is used for containing the blade portion of the cutter, the second air groove is formed in the protective cover, one end of each second through hole is communicated with the second air groove, and the other end of each second through hole is communicated with the second cutter groove. The cutting device is convenient to use, and heat dissipation of the cutter is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafer processing and manufacturing, and in particular to a cutting device for semiconductor wafers. Background Art

[0002] The semiconductor wafers produced by semiconductor (such as gallium arsenide) wafer manufacturing plants in the industry are generally 8 inches or 12 inches in size, while the back-end processing equipment of the packaging plant that performs semiconductor back-end processing can only process semiconductor crystal blocks of 4 inches or smaller; therefore, after completing the manufacturing of the entire wafer, the semiconductor wafer manufacturing plant needs to cut the entire wafer into several small crystal blocks, and then cut the small crystal blocks into several chip particles. At present, cutting is generally performed by the blade of the cutting device, but during the cutting process, the blade and the semiconductor wafer repeatedly rub and generate heat, causing the blade temperature to rise, which affects the life of the blade.

[0003] For example, the invention patent with the announcement number CN118559896B discloses a shock-absorbing dual-refrigerant circulation cooling wafer cutting device, which includes a main body, an air pump and a water pump. A protective cover is provided on one side of the main body, a blade is provided inside the protective cover, a driving motor is provided between the protective cover and the blade, the main body controls the protective cover to move horizontally, the lower end surface of the protective cover is higher than the lower end surface of the blade, a carrier is provided below the inside of the main body, the carrier is used to fix the wafer, and the gap between the protective cover and the blade is filled with coolant, the coolant is mainly located on both sides of the blade, and the coolant is provided to limit the deflection of the blade during rotation. By filling the coolant on the outside of the blade, when the blade vibrates, that is, deflects, the coolant flow will generate additional torque on the blade, thereby increasing resistance and reducing the deflection angle of the blade; however, by cooling with coolant, the coolant is prone to leaking, thereby contaminating the wafer. Summary of the invention

[0004] Based on this, it is necessary to provide a cutting device for semiconductor wafers that is easy to dissipate heat in order to solve the above problems.

[0005] A cutting device for semiconductor wafers, comprising a frame, a suction cup, a cutting assembly and a cooling assembly, wherein the suction cup is mounted on the frame; the cutting assembly comprises a bracket, a transverse plate, a lifting plate and a cutter, wherein the bracket is slidably mounted on the frame, the transverse plate is slidably mounted on the bracket, the lifting plate is slidably mounted on the transverse plate, and the cutter is rotatably connected to the lifting plate; the cooling assembly comprises a knife cover and a guard, wherein the knife cover is mounted on one side of the lifting plate, the knife cover is provided with a first knife groove, a first air groove and a plurality of first through holes, the first knife groove is used to accommodate a blade portion of the cutter, the first air groove is arranged in the knife cover, one end of the first through hole is connected to the first air groove, and the other end is connected to the first knife groove; the guard is detachably connected to the knife cover, the guard is provided with a second knife groove, a second air groove and a plurality of second through holes, the second knife groove is used to accommodate a blade portion of the cutter, the second air groove is arranged in the guard, one end of the second through hole is connected to the second air groove, and the other end is connected to the second knife groove.

[0006] In one embodiment, the cooling assembly further includes an air inlet pipe and an air exhaust pipe, wherein one end of the air inlet pipe is connected to the first air groove, and the other end is connected to the inflation mechanism; one end of the air exhaust pipe is connected to the first air groove, and the other end is connected to the air exhaust mechanism.

[0007] In one embodiment, the second gas groove is connected to the first gas groove.

[0008] In one embodiment, a clamping portion is provided at one end of the knife cover, and the clamping portion is provided corresponding to one end of the first air groove; a clamping groove is provided at one end of the protective cover to accommodate the clamping portion, and the clamping groove is connected to the second air groove.

[0009] In one of the embodiments, the cooling assembly further comprises a support block, one end of which is mounted on one side of the shield, and the other end of which is detachably connected to one side of the knife cover.

[0010] In one embodiment, the cooling assembly also includes a baffle and a protrusion, the baffle is accommodated in the first air groove, the baffle is used to close or open the first through hole; one end of the protrusion is installed on the baffle, and the other end is passed through the knife cover, and the protrusion is used to drive the baffle to slide.

[0011] In one embodiment, the cutting assembly also includes a lifting power element, which is installed on the horizontal plate and is used to drive the lifting plate to slide; the cutting assembly also includes a cutting power element, a driving wheel, a driven wheel and a synchronous belt, the cutting power element is installed on the lifting plate, the driving wheel is installed on the output end of the cutting power element, the driven wheel is installed on the blade shaft of the cutter, one end of the synchronous belt is connected to the driving wheel, and the other end is connected to the driven wheel.

[0012] In one of the embodiments, it also includes a sharpening assembly, which includes a base plate, a slider, a sharpening wheel and a sliding power element. The base plate, the slider, the sharpening wheel and the sliding power element are two in number and correspond one to one. The two base plates are respectively installed on both sides of the lifting plate, the slider is slidably arranged on the base plate, the sharpening wheel is installed on the slider, the sliding power element is used to drive the slider to slide, and the two sharpening wheels correspond to both sides of the cutter.

[0013] In one embodiment, the grinding wheel includes a ceramic bond, a resin bond and an abrasive, and the abrasive is silicon carbide or corundum.

[0014] In one embodiment, the suction cup is a microporous ceramic suction cup.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The cutting device for semiconductor wafers of the present invention accommodates the blade of the cutter through the first blade groove and the second blade groove, and blows air toward the blade of the cutter through the first through hole and the second through hole respectively, thereby accelerating the cooling of the cutter; the cutting device for semiconductor wafers is easy to use and facilitates the heat dissipation of the cutter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a cutting device for semiconductor wafers shown in an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram of the structure of a cutting device for semiconductor wafers, wherein the frame and control components are not shown;

[0019] Figure 3 for Figure 2 A schematic diagram of the structure of a cutting assembly and a sharpening assembly in a cutting device for semiconductor wafers is shown;

[0020] Figure 4 for Figure 3 A schematic diagram of the structure of a cutting blade and a cooling assembly in a cutting device for semiconductor wafers is shown;

[0021] Figure 5 for Figure 4 A schematic diagram of the structure of a cooling assembly in a cutting device for semiconductor wafers, wherein a shield and a support block are not shown;

[0022] Figure 6 for Figure 5 Enlarged view of the middle circle A;

[0023] Figure 7 for Figure 4 A schematic diagram of the structure of the shield and the support block in the cooling assembly shown;

[0024] Figure 8 for Figure 7 Enlarged view of the middle circle B;

[0025] Fig. 9 for Figure 1 A physical schematic diagram of a cutting device for semiconductor wafers is shown.

[0026] The meanings of the numbers in the accompanying drawings are:

[0027] 100. A cutting device for semiconductor wafers;

[0028] 10. Frame; 11. Base; 12. Cover; 13. Top seat; 20. Suction cup; 30. Cutting assembly; 31. Bracket; 32. Horizontal plate; 33. Lifting plate; 34. Cutter; 35. Lifting power element; 36. Cutting power element; 37. Driving wheel; 38. Driven wheel; 39. Synchronous belt;

[0029] 40. Cooling assembly; 41. Knife cover; 411. First knife groove; 412. First air groove; 413. First through hole; 414. Clamping portion; 42. Protective cover; 421. Second knife groove; 422. Second air groove; 423. Second through hole; 424. Clamping slot; 43. Support block; 44. Air inlet pipe; 45. Air exhaust pipe; 46. Baffle; 47. Bump; 50. Knife sharpening assembly; 51. Base plate; 52. Sliding block; 53. Knife sharpening wheel; 54. Sliding power element; 60. Control assembly; 61. Display screen. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0036] Please refer to Figures 1 to 9 , a semiconductor wafer cutting device 100 according to an embodiment of the invention comprises a frame 10, a suction cup 20, a cutting assembly 30 and a cooling assembly 40, wherein the suction cup 20 is mounted on the frame 10; the cutting assembly 30 comprises a bracket 31, a horizontal plate 32, a lifting plate 33 and a cutter 34, wherein the bracket 31 is slidably mounted on the frame 10, the horizontal plate 32 is slidably mounted on the bracket 31, the lifting plate 33 is slidably mounted on the horizontal plate 32, and the cutter 34 is rotatably connected to the lifting plate 33; the cooling assembly 40 comprises a knife cover 41 and a guard cover 42, wherein the knife cover 41 is mounted on one side of the lifting plate 33, and the knife cover 41 is provided with a first knife groove 411, a first air groove 412 and a second air groove 413. 12 and a plurality of first through holes 413, the first knife groove 411 is used to accommodate the blade of the cutter 34, the first air groove 412 is provided in the knife cover 41, one end of the first through hole 413 is connected to the first air groove 412, and the other end is connected to the first knife groove 411; the shield 42 is detachably connected to the knife cover 41, the shield 42 is provided with a second knife groove 421, a second air groove 422 and a plurality of second through holes 423, the second knife groove 421 is used to accommodate the blade of the cutter 34, the second air groove 422 is provided in the shield 42, one end of the second through hole 423 is connected to the second air groove 422, and the other end is connected to the second knife groove 421. The cutting device 100 for semiconductor wafers accommodates the blade of the cutter 34 through the first knife groove 411 and the second knife groove 421, and blows air toward the blade of the cutter 34 through the first through hole 413 and the second through hole 423, respectively, so as to accelerate the cooling of the cutter 34.

[0037] like Figure 1 As shown, in this embodiment, the frame 10 includes a base 11, a cover plate 12 and a top seat 13, the cover plate 12 is covered on the base 11, and the top seat 13 is installed on the base 11; the suction cup 20 is installed on the frame 10, and optionally, the suction cup 20 is installed on the base 11; further, the suction cup 20 is a microporous ceramic suction cup, which uses the vacuum adsorption principle to fix the semiconductor wafer to be processed, and the microporous ceramic suction cup has the characteristics of high flatness, high parallelism, high strength, good air permeability, uniform adsorption force, etc.

[0038] like Figure 2 and Figure 3 As shown, the cutting assembly 30 includes a bracket 31, a horizontal plate 32, a lifting plate 33 and a cutter 34. The bracket 31 is slidably mounted on the frame 10, the horizontal plate 32 is slidably mounted on the bracket 31, the lifting plate 33 is slidably mounted on the horizontal plate 32, and the cutter 34 is rotatably connected to the lifting plate 33. Optionally, the cutting assembly 30 also includes a Y-axis power element (not shown) and an X-axis power element (not shown). The Y-axis power element is used to drive the bracket 31 to slide on the base 11, and the X-axis power element is used to drive the horizontal plate 32 to slide on the bracket 31. This is a prior art. Further, the cutting assembly 30 also includes a lifting power element 35, which is installed on the horizontal plate 32 and is used to drive the lifting plate 33 to slide.

[0039] In one embodiment, the cutting assembly 30 also includes a cutting power element 36, a driving wheel 37, a driven wheel 38 and a synchronous belt 39. The cutting power element 36 is installed on the lifting plate 33, the driving wheel 37 is installed on the output end of the cutting power element 36, the driven wheel 38 is installed on the blade shaft of the cutter 34, one end of the synchronous belt 39 is connected to the driving wheel 37, and the other end is connected to the driven wheel 38; the driving wheel 37 is driven to rotate by the cutting power element 36, and the driven wheel 38 is driven to rotate by the synchronous belt 39, thereby driving the cutter 34 to rotate to achieve cutting.

[0040] like Figures 3 to 8 As shown, the cooling assembly 40 includes a knife cover 41 and a protective cover 42. The knife cover 41 is installed on one side of the lifting plate 33. The knife cover 41 is provided with a first knife groove 411, a first air groove 412 and a plurality of first through holes 413. The first knife groove 411 is used to accommodate the blade of the cutter 34. The first air groove 412 is provided in the knife cover 41. One end of the first through hole 413 is connected to the first air groove 412, and the other end is connected to the first knife groove 411. Optionally, the knife cover 41 is arc-shaped, and the first knife groove 411 and the first air groove 412 are both arc-shaped corresponding to the knife cover 41, and each first through hole 413 is evenly distributed along the circumference of the inner side of the knife cover 41. In one embodiment, a clamping portion 414 is provided at one end of the knife cover 41, and the clamping portion 414 is provided corresponding to one end of the first air groove 412.

[0041] like Figure 4 , Figure 7 and Figure 8As shown, the shield 42 is detachably connected to the knife cover 41, and the shield 42 is provided with a second knife groove 421, a second air groove 422 and a plurality of second through holes 423, wherein the second knife groove 421 is used to accommodate the blade of the cutter 34, the second air groove 422 is provided in the shield 42, one end of the second through hole 423 is connected to the second air groove 422, and the other end is connected to the second knife groove 421. Optionally, the shield 42 is arc-shaped, the second knife groove 421 and the second air groove 422 are both arc-shaped corresponding to the shield 42, and each second through hole 423 is evenly distributed along the circumference of the inner side of the shield 42; further, the second air groove 422 is connected to the first air groove 412; one end of the shield 42 is magnetically attracted to one end of the knife cover 41; in other embodiments, one end of the shield 42 is snap-fitted to one end of the knife cover 41. In one embodiment, a slot 424 is provided at one end of the shield 42 to accommodate the snap-fit ​​portion 414 . The slot 424 is connected to the second air slot 422 . The snap-fit ​​portion 414 is inserted into the slot 424 for positioning and improving air tightness.

[0042] like Figure 4 As shown, the cooling assembly 40 further includes a support block 43, one end of which is mounted on one side of the shield 42, and the other end of which is detachably connected to one side of the knife cover 41, thereby improving the connection reliability between the shield 42 and the knife cover 41; optionally, one side of the support block 43 is magnetically attracted to one side of the knife cover 41. In other embodiments, one side of the support block 43 is snap-fitted to one side of the knife cover 41.

[0043] like Figure 5 As shown, the cooling component 40 also includes an air inlet pipe 44 and an air exhaust pipe 45. One end of the air inlet pipe 44 is connected to the first air groove 412, and the other end is connected to the charging mechanism. Air is supplied to the first air groove 412 through the air inlet pipe 44, and the gas is blown toward the cutter 34 through the first through hole 413. At the same time, the gas flows into the second air groove 422 through the first air groove 412, and then blows toward the cutter 34 through the second through hole 423 to accelerate the heat dissipation of the cutter 34; one end of the air exhaust pipe 45 is connected to the first air groove 412, and the other end is connected to the exhaust mechanism. Air is exhausted through the air exhaust pipe 45, and waste chips generated by cutting enter the first air groove 412 through the first through hole 413, and then discharged through the air exhaust pipe 45.

[0044] Please check again Figure 4 The cooling assembly 40 also includes a baffle 46 and a protrusion 47. The baffle 46 is accommodated in the first air groove 412, and the baffle 46 is used to close or open the first through hole 413; one end of the protrusion 47 is installed on the baffle 46, and the other end is penetrated by the knife cover 41, and the protrusion 47 is used to drive the baffle 46 to slide; optionally, the protrusion 47 is two pieces; when cutting, if waste chips do not want to enter the first air groove 412, the first through hole 413 is closed by the baffle 46 to prevent waste chips from entering the first air groove 412.

[0045] like Figure 3 As shown, the cutting device 100 for semiconductor wafers also includes a sharpening assembly 50, which includes a substrate 51, a slider 52, a sharpening wheel 53 and a sliding power element 54. The substrate 51, the slider 52, the sharpening wheel 53 and the sliding power element 54 are two in number and correspond to each other. The two substrates 51 are respectively mounted on both sides of the lifting plate 33, the slider 52 is slidably mounted on the substrate 51, the sharpening wheel 53 is mounted on the slider 52, and the sliding power element 54 is used to drive the slider 52 to slide. The two sharpening wheels 53 correspond to both sides of the cutter 34 respectively. The sliding power element 54 drives the sharpening wheel 53 to approach one side of the cutter 34, and the two sharpening wheels 53 cooperate to achieve sharpening. Optionally, the sharpening wheel 53 includes a ceramic binder, a resin binder and an abrasive, and the abrasive is silicon carbide or corundum, which has high sharpness and good finishing effect.

[0046] like Figure 1 As shown, the cutting device 100 for semiconductor wafers also includes a control component 60, which includes a display screen 61 and a controller (not shown). The display screen 61 is installed on the top seat 13, and the display screen 61 and each power element are electrically connected to the controller to achieve automatic control. This is the prior art; optionally, the display screen 61 is a touch screen.

[0047] During cutting, the semiconductor wafer to be processed is placed on the suction cup 20, and the shield 42 is separated from the knife cover 41; the bracket 31 is slidably mounted on the base 11, and the horizontal plate 32 is slidably mounted on the bracket 31 to adjust the position, and the lifting power element 35 drives the lifting plate 33 to descend and approach the semiconductor wafer, and the cutting power element 36 then drives the cutter 34 to rotate to achieve cutting. When it is not necessary for waste chips to enter the first air groove 412, the baffle 46 closes the first air hole. When it is necessary to collect waste chips, the baffle 46 opens the first air hole, closes the air inlet pipe 44, and exhausts air through the exhaust pipe 45, so that the waste chips enter the first air groove 412 through the first air hole and are then discharged through the exhaust pipe 45. In addition, when it is necessary to cool the cutter 34 while cutting, the exhaust pipe 45 is closed, the first through hole 413 is opened, the air inlet pipe 44 supplies air to the first air groove 412, and the air is blown toward the cutter 34 through the first through hole 413. After the cutting is completed, the protective cover 42 covers the blade of the cutter 34, one end of the protective cover 42 is magnetically attracted to the bottom end of the knife cover 41, and one side of the support block 43 is magnetically attracted to one side of the knife cover 41. At this time, the clamping portion 414 is inserted into the clamping groove 424, and then the exhaust pipe 45 is closed, the first through hole 413 is opened, and the air inlet pipe 44 supplies air to the first air groove 412, and the air is blown toward the cutter 34 through the first through hole 413. At the same time, the air enters the second air groove 422 through the first air groove 412, and then blows toward the cutter 34 through the second through hole 423 to accelerate the cooling of the cutter 34. Moreover, the cutter 34 is covered by the knife cover 41 and the protective cover 42 to prevent accidental injury to the user and improve safety.

[0048] The cutting device 100 for semiconductor wafers of the present invention accommodates the blade of the cutter 34 through the first blade groove 411 and the second blade groove 421, and blows air toward the blade of the cutter 34 through the first through hole 413 and the second through hole 423, thereby accelerating the cooling of the cutter 34; the cutting device 100 for semiconductor wafers is easy to use and facilitates the heat dissipation of the cutter 34.

[0049] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A cutting device for semiconductor wafers, characterized in that: The invention comprises a frame, a suction cup, a cutting assembly and a cooling assembly, wherein the suction cup is installed on the frame; the cutting assembly comprises a bracket, a transverse plate, a lifting plate and a cutting knife, the bracket is slidably mounted on the frame, the transverse plate is slidably mounted on the bracket, the lifting plate is slidably mounted on the transverse plate, and the cutting knife is rotatably connected to the lifting plate; the cooling assembly comprises a knife cover and a guard, wherein the knife cover is mounted on one side of the lifting plate, the knife cover is provided with a first knife groove, a first air groove and a plurality of first through holes, the first knife groove is used to accommodate a blade portion of the cutting knife, the first air groove is arranged in the knife cover, one end of the first through hole is connected to the first air groove, and the other end is connected to the first knife groove; the guard is detachably connected to the knife cover, the guard is provided with a second knife groove, a second air groove and a plurality of second through holes, the second knife groove is used to accommodate a blade portion of the cutting knife, the second air groove is arranged in the guard, one end of the second through hole is connected to the second air groove, and the other end is connected to the second knife groove.

2. The semiconductor wafer cutting device according to claim 1, characterized in that: The cooling assembly also includes an air intake pipe and an air extraction pipe, wherein one end of the air intake pipe is connected to the first air groove, and the other end is connected to the charging mechanism; one end of the air extraction pipe is connected to the first air groove, and the other end is connected to the air extraction mechanism.

3. The semiconductor wafer cutting device according to claim 1, characterized in that: The second gas groove is connected to the first gas groove.

4. The semiconductor wafer cutting device according to claim 1, characterized in that: A clamping portion is arranged at one end of the knife cover, and the clamping portion is arranged corresponding to one end of the first air groove; a clamping groove is arranged at one end of the shield to accommodate the clamping portion, and the clamping groove is connected to the second air groove.

5. The semiconductor wafer cutting device according to claim 1, characterized in that: The cooling assembly also includes a support block, one end of which is mounted on one side of the shield, and the other end of which is detachably connected to one side of the knife cover.

6. The semiconductor wafer cutting device according to claim 1, characterized in that: The cooling assembly also includes a baffle and a protrusion. The baffle is accommodated in the first air groove and is used to close or open the first through hole. One end of the protrusion is installed on the baffle, and the other end is penetrated by the knife cover. The protrusion is used to drive the baffle to slide.

7. The semiconductor wafer cutting device according to claim 1, characterized in that: The cutting assembly also includes a lifting power element, which is installed on the cross plate and is used to drive the lifting plate to slide; the cutting assembly also includes a cutting power element, a driving wheel, a driven wheel and a synchronous belt, the cutting power element is installed on the lifting plate, the driving wheel is installed on the output end of the cutting power element, the driven wheel is installed on the blade shaft of the cutter, one end of the synchronous belt is connected to the driving wheel, and the other end is connected to the driven wheel.

8. The semiconductor wafer cutting device according to claim 1, characterized in that: It also includes a sharpening assembly, which includes a base plate, a slider, a sharpening wheel and a sliding power element. The base plate, the slider, the sharpening wheel and the sliding power element are two in number and correspond one to one. The two base plates are respectively installed on both sides of the lifting plate, the slider is slidably arranged on the base plate, the sharpening wheel is installed on the slider, the sliding power element is used to drive the slider to slide, and the two sharpening wheels correspond to both sides of the cutter.

9. The semiconductor wafer cutting device according to claim 8, characterized in that: The grinding wheel comprises a ceramic binder, a resin binder and an abrasive, and the abrasive is silicon carbide or corundum.

10. The semiconductor wafer cutting device according to claim 1, characterized in that: The suction cup is a microporous ceramic suction cup.

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