Gold-to-silver thermal printing head and preparation method thereof

Abstract

The invention provides a gold-in-silver thermal printing head and a preparation method thereof, and relates to the technical field of engineering machinery. The preparation method of the gold-in-silver thermal printing head comprises the steps that two-layer etching silver printing sintering is carried out on the part except a heating body, and the length of the gold-in-silver lap joint part is 50-400 microns; and PR2, carrying out substrate pretreatment, photoresist coating, photoresist curing, exposure, developing, etching, demolding and cleaning to obtain a silver loop. Based on the technical scheme, the preparation method of the gold-in-silver thermal printing head can be used for preparing the gold-in-silver thermal printing head, and silver is used for replacing gold to prepare a loop of the thermal printing head, so that the production cost of the thermal printing head is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of thermal print heads, and in particular to a gold-on-silver thermal print head and a preparation method thereof. Background Art

[0002] Thermal printers are widely used in the fields of tickets, POS machines, cards, etc. due to their advantages of fast printing, lightness and no pollution. The main component is the thermal print head. In existing thermal print heads, the conductive layer is mainly made of precious metal materials, which is costly. Therefore, the present application provides a gold-on-silver thermal print head and a preparation method thereof, which can reduce the production cost of the thermal print head. Summary of the invention

[0003] In view of the above problems in the prior art, the present application proposes a gold-on-silver thermal print head and a preparation method thereof, which can reduce the production cost of the thermal print head.

[0004] One aspect of the present invention provides a method for preparing a gold-on-silver thermal print head, the method comprising the steps of:

[0005] S10: printing a base glaze on the surface of a ceramic substrate, and sintering at 1200° C. for 7.5 hours to obtain a glass base glaze substrate, wherein the thickness of the base glaze is 100±10 μm;

[0006] S20: printing two layers of gold paste at the positions of the heating elements on the sintered glass enamel substrate and sintering them;

[0007] S30:PR1: Substrate pretreatment → photoresist coating → photoresist curing → exposure → development → etching → film stripping and cleaning to obtain the gold circuit at the heating element position;

[0008] S40: Two layers of etched silver printing and sintering are performed on the part other than the heating element, and the length of the gold-silver overlap part is 50-400 μm;

[0009] S50:PR2: substrate pretreatment → photoresist coating → photoresist curing → exposure → development → etching → film stripping and cleaning to obtain a silver circuit;

[0010] S60: Perform the first printing and sintering of busbar silver on the substrate with etched gold and silver circuits, and the thickness after sintering is 10±4μm;

[0011] S70: Printing and sintering the heating line on the substrate after the busbar silver sintering is completed, the heating line width is 110-220 μm, and the thickness is 6 μm;

[0012] S80: Perform a second printing and sintering of busbar silver on the substrate after sintering, and the thickness after sintering is 14±4μm;

[0013] S90: Printing and sintering the surface encapsulation glass on the obtained substrate, with a thickness of 8±2 μm after sintering;

[0014] S100: The sintered substrate is subjected to pulse resistance correction, and then subjected to processes such as slicing, die bonding, wire bonding, resin packaging, and resin curing to obtain a thermal print head with a gold-silver overlap structure.

[0015] The method for preparing the gold-on-silver thermal print head further comprises step S20: printing two layers of gold paste at the position of the heating element on the sintered glass enamel substrate and sintering the two layers of gold paste respectively, comprising:

[0016] S21: First layer of gold printing and sintering, printing the first layer of gold paste at the position of the heating element on the sintered glass enamel substrate and then sintering, the thickness of the first gold layer is 0.3 μm;

[0017] S22: The second layer of gold is printed and sintered. The second layer of gold paste is printed on the sintered first gold layer. The lower edge of the second layer of gold paste is 50-300μm shorter than that of the first layer of gold. After completion, the total thickness of the two gold layers is 0.6μm.

[0018] Another aspect of the present invention provides a gold-on-silver thermal print head, which is prepared by the above-mentioned method for preparing a gold-on-silver thermal print head.

[0019] The above technical features can be combined in various suitable ways or replaced by equivalent technical features as long as the purpose of the present invention can be achieved.

[0020] The invention provides a gold-on-silver thermal print head and a preparation method thereof, which have at least the following beneficial effects compared with the prior art: when a thermal print head needs to be prepared, a base glaze is printed on the surface of a ceramic substrate, and sintered at 1200°C for 7.5 hours to obtain a glass base glaze substrate, the thickness of which is 100±10 μm; two layers of gold paste are respectively printed at the position of a heating element on the sintered glass base glaze substrate and sintered; PR1: substrate pretreatment→photoresist coating→photoresist curing→exposure→development→etching→film stripping and cleaning to obtain a gold circuit at the position of the heating element; two layers of etched silver printing and sintering are performed on the part other than the heating element, and the length of the gold-silver overlapping part is 50-400 μm; PR2: substrate pretreatment→photoresist coating→ The photoresist is solidified, exposed, developed, etched, stripped and cleaned to obtain a silver circuit; the first printing and sintering of the busbar silver is carried out on the substrate with the gold and silver circuits etched, and the thickness after sintering is 10±4μm; the heating line is printed and sintered on the substrate with the busbar silver sintered, and the width of the heating line is 110-220μm and the thickness is 6μm; the second printing and sintering of the busbar silver is carried out on the substrate after sintering, and the thickness after sintering is 14±4μm; the surface encapsulation glass is printed and sintered on the obtained substrate, and the thickness after sintering is 8±2μm; the sintered substrate is subjected to pulse resistance correction, and then the slicing, crystal solidification, wire bonding resin encapsulation, resin curing and other processes are carried out to obtain a thermal print head with a gold-silver overlap structure. The gold-silver thermal print head preparation method can prepare a gold-silver thermal print head, and silver is used instead of gold to prepare the circuit of the thermal print head, thereby reducing the production cost of the thermal print head.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0023] The present invention will be described in more detail below based on embodiments and with reference to the accompanying drawings, wherein:

[0024] Figure 1 A schematic flow chart showing a method for preparing a gold-on-silver thermal print head provided by an embodiment of the present invention;

[0025] Figure 2 The flowchart of step S20 of the method for preparing a gold-on-silver thermal print head provided by an embodiment of the present invention is shown.

[0026] In the drawings, like reference numerals are used for like parts. The drawings are not necessarily to scale. DETAILED DESCRIPTION

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] The present invention will be further described below in conjunction with the accompanying drawings.

[0033] The embodiment of the present invention provides a gold-on-silver thermal print head and a preparation method thereof, which can reduce the production cost of the thermal print head.

[0034] See also Figure 1 The method for preparing a gold-on-silver thermal print head provided in an embodiment of the present invention comprises the following steps:

[0035] S10: printing a base glaze on the surface of a ceramic substrate, and sintering at 1200° C. for 7.5 hours to obtain a glass base glaze substrate, wherein the thickness of the base glaze is 100±10 μm;

[0036] S20: printing two layers of gold paste at the positions of the heating elements on the sintered glass enamel substrate and sintering them;

[0037] S30:PR1: Substrate pretreatment → photoresist coating → photoresist curing → exposure → development → etching → film stripping and cleaning to obtain the gold circuit at the heating element position;

[0038] S40: Two layers of etched silver printing and sintering are performed on the part other than the heating element, and the length of the gold-silver overlap part is 50-400 μm;

[0039] S50:PR2: substrate pretreatment → photoresist coating → photoresist curing → exposure → development → etching → film stripping and cleaning to obtain a silver circuit;

[0040] The focus of this etching is the precise alignment of the two etchings of gold and silver and the etching of the gold and silver overlap without residue. The etching solution used for the second etching will form the same etching effect on the circuit after the first etching, so the second photomask design should cover the etched part to avoid re-exposure and protect the gold circuit part from contacting the etching solution when entering the etching tank. The second photomask is aligned with high precision by identifying the MARK point after the first etching, and the alignment accuracy can be guaranteed to be within 5μm.

[0041] S60: Perform the first printing and sintering of busbar silver on the substrate with etched gold and silver circuits, and the thickness after sintering is 10±4μm;

[0042] S70: Printing and sintering the heating line on the substrate after the busbar silver sintering is completed, the heating line width is 110-220 μm, and the thickness is 6 μm;

[0043] S80: Perform a second printing and sintering of busbar silver on the substrate after sintering, and the thickness after sintering is 14±4μm;

[0044] S90: Printing and sintering the surface encapsulation glass on the obtained substrate, with a thickness of 8±2 μm after sintering;

[0045] S100: The sintered substrate is subjected to pulse resistance correction, and then subjected to processes such as slicing, die bonding, wire bonding, resin packaging, and resin curing to obtain a thermal print head with a gold-silver overlap structure.

[0046] The gold-on-silver thermal print head preparation method can prepare a gold-on-silver thermal print head, and silver is used instead of gold to prepare a circuit of the thermal print head, thereby reducing the production cost of the thermal print head.

[0047] The preparation method of the gold-silver thermal print head provided by the present invention is specifically referred to Figure 2 Step S20: printing two layers of gold paste at the position of the heating element on the sintered glass enamel substrate and sintering, including:

[0048] S21: First layer of gold printing and sintering, printing the first layer of gold paste at the position of the heating element on the sintered glass enamel substrate and then sintering, the thickness of the first gold layer is 0.3 μm;

[0049] S22: The second layer of gold is printed and sintered. The second layer of gold paste is printed on the sintered first gold layer. The lower edge of the second layer of gold paste is 50-300μm shorter than that of the first layer of gold. After completion, the total thickness of the two gold layers is 0.6μm.

[0050] The embodiment of the present invention further provides a gold-on-silver thermal print head, which is prepared by the preparation method of the gold-on-silver thermal print head as described above. The specific steps of the gold-on-silver thermal print head refer to the above embodiment. Since the gold-on-silver thermal print head adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0052] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A method for preparing a gold-on-silver thermal print head, characterized in that: The preparation method of the gold-on-silver thermal print head comprises the following steps: S10: printing a base glaze on the surface of a ceramic substrate, and sintering at 1200° C. for 7.5 hours to obtain a glass base glaze substrate, wherein the thickness of the base glaze is 100±10 μm; S20: printing two layers of gold paste at the positions of the heating elements on the sintered glass enamel substrate and sintering them; S30:PR1: Substrate pretreatment → photoresist coating → photoresist curing → exposure → development → etching → film stripping and cleaning to obtain the gold circuit at the heating element position; S40: Two layers of etched silver printing and sintering are performed on the part other than the heating element, and the length of the gold-silver overlap part is 50-400 μm; S50:PR2: substrate pretreatment → photoresist coating → photoresist curing → exposure → development → etching → film stripping and cleaning to obtain a silver circuit; S60: Perform the first printing and sintering of busbar silver on the substrate with etched gold and silver circuits, and the thickness after sintering is 10±4μm; S70: Printing and sintering the heating line on the substrate after the busbar silver sintering is completed, the heating line width is 110-220 μm, and the thickness is 6 μm; S80: Perform a second printing and sintering of busbar silver on the substrate after sintering, and the thickness after sintering is 14±4μm; S90: Printing and sintering the surface encapsulation glass on the obtained substrate, with a thickness of 8±2 μm after sintering; S100: The sintered substrate is subjected to pulse resistance correction, and then subjected to processes such as slicing, die bonding, wire bonding, resin packaging, and resin curing to obtain a thermal print head with a gold-silver overlap structure.

2. The method for preparing a gold-on-silver thermal print head according to claim 1, characterized in that: Step S20: printing two layers of gold paste at the positions of the heating elements on the sintered glass enamel substrate and sintering them, including: S21: First layer of gold printing and sintering, printing the first layer of gold paste at the position of the heating element on the sintered glass enamel substrate and then sintering, the thickness of the first gold layer is 0.3 μm; S22: The second layer of gold is printed and sintered. The second layer of gold paste is printed on the sintered first gold layer. The lower edge of the second layer of gold paste is 50-300μm shorter than that of the first layer of gold. After completion, the total thickness of the two gold layers is 0.6μm.

3. A gold-on-silver thermal print head, characterized in that: The gold-on-silver thermal print head is prepared by the method for preparing a gold-on-silver thermal print head as described in any one of claims 1-2.

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