An electron beam evaporation coating equipment and its application method

Abstract

The present invention relates to an electron beam evaporation coating device and an application method thereof, including an evaporation chamber, an electron gun system, a first vacuum pumping system, a heating stage mechanism, a sample stage mechanism, and an ion source system; the sample stage mechanism is rotationally connected to the heating stage mechanism, and the sample stage mechanism includes a substrate clamping portion for clamping a substrate; the ion source system is connected to the top of the evaporation chamber for cleaning the substrate; the first driving system is used to drive the first rotating shaft to rotate; the second driving system is used to drive the second rotating shaft to rotate, and the second rotating shaft drives the heating stage mechanism and the sample stage mechanism to flip integrally synchronously; when the sample stage mechanism flips so that the substrate clamping portion faces the ion source system, the substrate can be placed, cleaned, and flipped. The present invention can be flipped to a specific angle, and special inclination coating can increase the interaction between the film and the substrate and improve the bonding force. The sample stage mechanism of the present invention can be flipped so that the substrate faces the ion source system.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film preparation, and particularly relates to an electron beam evaporation coating device and an application method thereof. Background Art

[0002] The working principle of electron beam evaporation coating is that in a high vacuum environment, a high-energy electron beam generated by an electron gun bombards the evaporation material, causing it to heat up and evaporate and deposit on the surface of the substrate to form a thin film. The electron emission cathode inside the electron gun emits electrons under the action of heating or other means. These electrons are accelerated to a very high speed under the strong electric field formed by the acceleration anode, obtaining high energy and forming an electron beam. At the same time, the magnetic field generated by the focusing coil focuses the electron beam, making it a high-energy electron beam with a certain energy density and spot size. The focused high-energy electron beam is guided into a crucible containing the evaporation material, and the electron beam interacts with the atoms or molecules of the evaporation material. The high energy of the electron beam is transferred to the evaporation material, causing its atoms or molecules to obtain sufficient energy to start vibrating violently, thereby rapidly increasing the temperature of the material. After reaching the melting point, it melts, and continued heating will cause it to evaporate into gaseous atoms or molecules. Since the entire process is carried out in a high vacuum environment, the gaseous evaporation material atoms or molecules can move in a straight line with a relatively high mean free path and will not collide and scatter with a large number of air molecules. The evaporated gaseous atoms or molecules move towards the surface of the substrate at a certain speed. When they reach the surface of the substrate, processes such as adsorption, migration, and condensation will occur on the surface of the substrate. On the surface of the substrate, the gaseous atoms or molecules gradually lose energy and begin to adsorb and stay at specific positions on the surface of the substrate. As more and more atoms or molecules reach the surface of the substrate, they will combine with each other and gradually form a continuous thin film. By controlling parameters such as the coating time and evaporation rate, the thickness and quality of the thin film can be controlled.

[0003] Publication No.: CN117127152A, Application Date: August 25, 2023, Invention Title: An Electron Beam Evaporation Coating Device and an Evaporation Coating Method. This invention is an electron beam evaporation mechanism, an electron beam evaporation coating device and method with the above evaporation mechanism. The electron beam evaporation mechanism includes assembly bases symmetrically arranged at the bottom. A fixed structure of the entire electron beam evaporation mechanism is installed on the assembly bases, and there are two cooling water pipe interfaces behind the mechanism. In the central part of the mechanism, there is a crucible containing evaporation coating material. The electron gun motor is connected to the electron gun target gun head to evaporate the evaporation coating material. This invention improves the efficiency of the evaporation coating process and extends the service life of the device.

[0004] Although the above-mentioned existing technology can clean workpieces in the process chamber, since the workpiece table cannot be flipped, the workpieces cannot be directly facing the ion source, and the cleaning effect cannot be guaranteed, resulting in a reduction in the purity of the thin film and affecting the optical, electrical and other properties of the thin film. Due to the small space in the process chamber, it is impossible to flip the workpiece table, so a special inclination coating is carried out on the workpiece.

[0005] In addition, when replenishing materials, the manipulator needs to take samples from the sample introduction chamber and then transfer them to the electron beam coating process chamber. Therefore, an additional sample introduction chamber needs to be designed and manufactured. The existence of the two chambers makes the structure of the equipment more complex, and the maintenance workload and difficulty increase accordingly. It is necessary to regularly maintain, service and repair the sample introduction chamber and connecting components, and replace the parts that may malfunction, which will all lead to an increase in maintenance costs. Summary of the Invention

[0006] Aiming at the defects of the above-mentioned existing technology that the workpieces cannot be flipped, the workpieces cannot be cleaned thoroughly; the special inclination coating process cannot be carried out; a separate sample introduction chamber needs to be set up, increasing the complexity of the equipment, etc., the purpose of the present invention is to provide an electron beam evaporation coating equipment and its application method that can flip the sample stage mechanism to fully clean the substrate, and at the same time, the sample stage mechanism can be flipped to carry out the special inclination coating process, and the evaporation material can be transported without setting up a sample introduction chamber.

[0007] The technical solution provided by the present invention is as follows:

[0008] An electron beam evaporation coating equipment, comprising,

[0009] An evaporation chamber, which provides a space for depositing a thin film on the substrate;

[0010] An electron gun system, which is connected to the bottom of the evaporation chamber. The electron gun system is used to emit an electron beam, and the electron beam is used to strike the material in the crucible and evaporate the material. The crucible is located in the evaporation chamber and below the substrate;

[0011] A first vacuum pumping system, which is connected to the flange on one side of the evaporation chamber and is used to make the evaporation chamber obtain an ultra-high vacuum environment;

[0012] It further includes a heating stage mechanism, which is located in the evaporation chamber, and the heating stage mechanism is used to heat the substrate;

[0013] A sample stage mechanism, which is rotationally connected to the heating stage mechanism and is located outside the heating stage mechanism. The sample stage mechanism includes a substrate clamping part for clamping the substrate;

[0014] An ion source system, which is connected to the flange on the top of the evaporation chamber, and the ion source system is used to clean the substrate;

[0015] The first drive system, which is located outside the evaporation chamber, is used to drive the first rotating shaft to rotate, and the first rotating shaft drives the sample stage mechanism to rotate around the central axis of the substrate clamping part;

[0016] The second drive system, which is located outside the evaporation chamber, is used to drive the second rotating shaft to rotate, and the second rotating shaft drives the heating stage mechanism and the sample stage mechanism to flip synchronously as a whole;

[0017] Wherein, when the sample stage mechanism flips so that the substrate clamping part faces the ion source system, the substrate can be placed, cleaned, and flipped.

[0018] Further, the first rotating shaft is rotationally connected to the second rotating shaft, and the first rotating shaft penetrates through the inside of the second rotating shaft;

[0019] The ends of both the first rotating shaft and the second rotating shaft are located inside the evaporation chamber, and the end of the first rotating shaft extends out of the second rotating shaft.

[0020] Further, the positioning component is rotationally connected to the first rotating shaft;

[0021] One end of the positioning component is fixedly connected to the end of the second rotating shaft, the other end is fixedly connected to the heating stage mechanism, and is simultaneously rotationally connected to the sample stage mechanism;

[0022] When the second rotating shaft rotates, the sample stage mechanism and the heating stage mechanism flip synchronously as a whole through the positioning component.

[0023] Further, one end of the second drive system is fixedly connected to the first flange on one side of the evaporation chamber, and the other end is connected to the rotating ring;

[0024] One end of the rotating ring is fixedly connected to the second rotating shaft, the second rotating shaft passes through the first flange and enters the inside of the evaporation chamber, and the second rotating shaft is rotationally connected to the first flange;

[0025] The other end of the rotating ring is connected to the adapter flange, and the adapter flange is fixedly connected to the first drive system;

[0026] The second drive system drives the rotating ring together with the second rotating shaft to rotate, driving the adapter flange and the first drive system to rotate synchronously.

[0027] Further, the first rotating shaft is connected to the sample stage mechanism through a transfer shaft;

[0028] A driving wheel is fixedly connected to one end of the first rotating shaft away from the first drive system; a driven wheel is fixedly connected to one end of the transfer shaft away from the sample stage mechanism;

[0029] One end of the transfer shaft close to the sample stage mechanism is fixedly connected with a driving bevel gear, and the sample stage mechanism is provided with a driven bevel gear;

[0030] The driving wheel meshes with the driven wheel, and the driving bevel gear meshes with the driven bevel gear. When the first rotating shaft rotates, it drives the transfer shaft and the sample stage mechanism to rotate.

[0031] Further, the sample stage mechanism further includes a sample rotating shaft, and the driven bevel gear is sleeved on the outer wall of the sample rotating shaft and fixedly connected with the sample rotating shaft;

[0032] The support platform is fixedly connected with the end of the sample rotating shaft;

[0033] The substrate clamping part is connected with the support platform through a support rod;

[0034] Wherein, the support platform is located between the substrate clamping part and the driven bevel gear.

[0035] Further, the substrate clamping part includes a pair of fixed pressing plates and a pair of movable pressing plates; wherein, the movable pressing plates are located between the fixed pressing plates and the support platform;

[0036] Two ends of the support rod are respectively fixedly connected with the support platform and the fixed pressing plate;

[0037] The movable pressing plate is provided with a plurality of through holes for the support rod to pass through;

[0038] The elastic component is sleeved on the support rod, and one end of the elastic component is fixed on the support platform and the other end is fixed on the movable pressing plate; the elastic component is used to enable the movable pressing plate to slide vertically along the support rod.

[0039] Further, when the fixed pressing plate is attached to the movable pressing plate, the elastic component is in a natural state or a compressed state;

[0040] When the fixed pressing plate is separated from the movable pressing plate, the elastic component is in a compressed state;

[0041] When the substrate clamping part faces the ion source system, the pressing mechanism is used to press down the movable pressing plate.

[0042] Further, the pressing mechanism is connected with the top of the evaporation chamber through a top flange assembly, and the pressing mechanism includes a third driving system and a linear module fixedly connected with the third driving system; the linear module is fixed on the top flange assembly;

[0043] The pressing mechanism further includes a slider moving vertically along the linear module; the third driving system is used to drive the slider to move vertically along the linear module.

[0044] Further, the pressing mechanism further includes a platform fixedly connected to the slider. A pair of movable rod assemblies are symmetrically arranged on both sides of the platform, and the movable rod assemblies penetrate through the top flange assembly and extend into the evaporation chamber.

[0045] Further, the movable rod assembly includes a moving rod and a transfer platform;

[0046] Wherein, the transfer platform is fixedly connected to the end of the moving rod away from the platform;

[0047] A pair of pressing hands are arranged on the transfer platform, and the pressing hands are used to press down the movable pressing plate.

[0048] Further, the equipment further includes a material conveying system flange-connected to one side of the evaporation chamber. The material conveying system includes a fourth driving system and a lead screw connected to the fourth driving system; the lead screw is threadedly connected to the translation assembly, and the translation assembly is magnetically coupled to the sample transfer rod assembly;

[0049] The fourth driving system drives the lead screw to rotate, and the lead screw drives the translation assembly together with the sample transfer rod assembly to move horizontally along the guide shaft;

[0050] Wherein, the guide shaft is hollow and parallel to the lead screw; the translation assembly is sleeved on the guide shaft, and the sample transfer rod assembly is inserted into the inside of the guide shaft;

[0051] When the sample transfer rod assembly extends into the evaporation chamber, it is used to replenish materials into the crucible.

[0052] Further, one end of the guide shaft away from the fourth driving system is fixedly connected to one side of the displacement table, the other side of the displacement table is fixedly connected to the addition chamber, a flap valve is connected to one end of the addition chamber away from the displacement table, and the addition chamber is flange-connected to one side of the evaporation chamber through the flap valve;

[0053] The second vacuum pumping system is arranged on the side of the addition chamber, and a quick-opening door is arranged on the top of the addition chamber. The quick-opening door is used to open and close the inner cavity of the addition chamber;

[0054] Wherein, the displacement table includes an inner cavity for the sample transfer rod assembly to pass through, and the inner cavity of the displacement table communicates with the addition chamber.

[0055] Further, the sample transfer rod assembly includes a first shaft rod and a second shaft rod rotatably connected to the first shaft rod. The second shaft rod is inserted into the first shaft rod and extends out of the end of the first shaft rod;

[0056] A storage hopper is connected to the end of the first shaft rod. A second bevel gear is arranged on the storage hopper, and the second bevel gear is fixedly connected to the material baffle; the material baffle is used to open or cover the storage hopper;

[0057] One end of the two - axis rod extending out of the first axis rod is provided with a first bevel gear; the first bevel gear meshes with the second bevel gear;

[0058] A transmission mechanism rotatably connected to the translation assembly is provided on the translation assembly. The transmission mechanism is used to drive the second axis rod together with the first bevel gear to rotate around a horizontal axis. The first bevel gear drives the second bevel gear to rotate around a vertical axis, and the second bevel gear drives the material baffle to swing in a fan - shape in the horizontal plane.

[0059] An application method of an electron beam evaporation coating device includes the following steps:

[0060] The first vacuum pumping system pumps the evaporation chamber to an ultra - vacuum environment;

[0061] The second drive system drives the second rotating shaft to rotate, driving the sample stage mechanism and the heating stage mechanism to synchronously and integrally flip, so that the sample clamping part faces the ion source system;

[0062] The pressing mechanism at the top of the evaporation chamber moves downwards, separating the movable pressing plate of the sample clamping part from the fixed pressing plate. After placing the substrate, the pressing mechanism retracts;

[0063] The ion source system cleans the substrate;

[0064] The second drive system drives the second rotating shaft to rotate in the opposite direction again, driving the sample stage and the heating stage mechanism to synchronously and integrally flip, so that the sample clamping part faces the electron gun system;

[0065] The first drive system drives the first rotating shaft to rotate, driving the sample stage mechanism to rotate around the central axis of the sample clamping part, and the substrate rotates synchronously; the electron gun system is synchronously turned on to perform evaporation coating on the substrate;

[0066] When it is necessary to adjust the coating surface of the substrate, the first drive system is turned off, and the second drive system is turned on to integrally flip the sample stage mechanism and the heating stage mechanism; the pressing mechanism moves downwards to separate the movable pressing plate from the fixed pressing plate, and the substrate is flipped to complete the swapping of the coating surfaces.

[0067] Adopting the technical solution provided by the present invention, compared with the prior art, it has the following beneficial effects:

[0068] (1) The sample stage mechanism of the present invention can rotate relative to the heating stage mechanism. The rotation of the sample stage mechanism can make the positions of each point on the surface of the substrate relative to the evaporation material change continuously during the coating process, so that each position can receive the coating material more evenly, improving the uniformity of the film thickness.

[0069] (2) The sample stage mechanism of the present invention can be flipped to a specific angle. When preparing a thin film with special optical properties, coating at a special inclination angle can enable better diffusion and embedding of metal atoms on the substrate surface, increase the interaction between the film and the substrate, improve the bonding force, and reduce the risk of film peeling off during use.

[0070] (3) The sample stage mechanism of the present invention can be flipped so that the substrate faces the ion source system. The ion source system is hermetically connected to the evaporation chamber, and the cleaning work of the substrate is carried out in the evaporation chamber, enabling the evaporation system to add the function of cleaning the substrate.

[0071] (4) The material delivery system of the present invention is hermetically connected to one side of the evaporation chamber. When performing large-scale or long-term continuous coating operations, as the coating progresses, the coating material in the evaporation source will gradually decrease. Or when preparing some complex film systems, multiple different coating materials need to be used for sequential evaporation deposition. If a certain key coating material is exhausted during evaporation and subsequent film layers depend on the deposition of this material, then the evaporation source must be replenished in a timely manner to ensure the integrity and performance of the entire film system. The material delivery system provided by the present invention can complete its own vacuum pumping process and replenish the coating material in a timely manner in a vacuum environment according to the coating requirements.

[0072] (5) The evaporation chamber integrates multiple functions. It can fully clean the substrate, perform coating at multiple angles, eliminate the sample introduction chamber, simplify the equipment, and enable rapid and convenient transmission of evaporation materials. Description of the Drawings

[0073] Figure 1 Schematic diagram of the overall structure of the evaporation chamber in an embodiment of the present application;

[0074] Figure 2 Schematic diagram of the positional relationship between the first vacuum pumping system and the material delivery system in an embodiment of the present application;

[0075] Figure 3 Schematic diagram of the overall structure of the sample platform mechanism and the heating table mechanism in an embodiment of the present application;

[0076] Figure 4 Schematic diagram of the structure of the first rotating shaft driving the sample stage mechanism to rotate self in an embodiment of the present application;

[0077] Figure 5 Schematic diagram of the detailed structure of the adapter shaft and the sample stage in an embodiment of the present application;

[0078] Figure 6 Schematic diagram of the structure of the substrate clamping part in an embodiment of the present application;

[0079] Figure 7Schematic diagram of the rotational connection relationship between the driven bevel gear and the sample rotating shaft in an embodiment of the present application;

[0080] Figure 8 Schematic diagram of the rotational connection relationship between the first rotating shaft and the second rotating shaft in an embodiment of the present application;

[0081] Figure 9 Schematic diagram of the overall flipping structure of the sample stage mechanism in an embodiment of the present application;

[0082] Figure 10 Schematic diagram of the relative overall view of the substrate clamping part and the top of the evaporation chamber in an embodiment of the present application;

[0083] Figure 11 Schematic diagram of the pressing mechanism pressing down the movable pressing plate in an embodiment of the present application;

[0084] Figure 12 Schematic diagram of the press hand pressing down the movable pressing plate in an embodiment of the present application;

[0085] Figure 13 Schematic diagram of the structure of the movable pressing plate and the fixed pressing plate in an embodiment of the present application;

[0086] Figure 14 Schematic diagram of the overall structure of the pressing mechanism in an embodiment of the present application;

[0087] Figure 15 Schematic diagram of the slider driving the movable rod assembly to move vertically in an embodiment of the present application;

[0088] Figure 16 Schematic diagram of coating with a special inclination angle in an embodiment of the present application;

[0089] Figure 17 Schematic diagram of the overall structure of the material conveying system in an embodiment of the present application;

[0090] Figure 18 Schematic diagram of the sample transfer rod assembly moving into the evaporation chamber in an embodiment of the present application;

[0091] Figure 19 Schematic diagram of the positional relationship between the first shaft rod and the second shaft rod in an embodiment of the present application;

[0092] Figure 20 Schematic diagram of the swinging principle of the material baffle in an embodiment of the present application;

[0093] Figure 21 Schematic diagram of the sample transfer rod assembly retracting in an embodiment of the present application;

[0094] Figure 22 Schematic diagram of the stock hopper retracting into the addition chamber in an embodiment of the present application.

[0095] Description of the reference numerals in the schematic diagram:

[0096] The first drive system 1, the first rotating shaft 11, the adapter shaft 12, the driving wheel 111, the driven wheel 121, the driving bevel gear 122;

[0097] The second drive system 2, the second rotating shaft 21, the rotating ring 22, the first flange 23, the adapter flange 24, the vacuum electrical feedthrough 25;

[0098] The substrate clamping part 31, the driven bevel gear 32, the sample rotating shaft 33, the support platform 34, the support rod 35, the elastic member 36, the substrate 37, the fixed pressing plate 311, the movable pressing plate 312, the convex part 3111, the groove 3121;

[0099] The shaft rod 41, the heating table body 42;

[0100] The positioning assembly 5, the vertical plate 51, the first horizontal plate 52, the bottom support plate 53, the second horizontal plate 54, the top support plate 55, the first limiting part 56, the second limiting part 57;

[0101] The third drive system 6, the top flange assembly 61, the slider 62, the platform 63, the movable rod assembly 64, the top flange assembly 65, the moving rod 641, the adapter platform 642, the pressing hand 643, the bellows 644;

[0102] The fourth drive system 7, the transmission mechanism 70, the lead screw 71, the translation assembly 72, the guide shaft 74, the displacement table 75, the addition chamber 76, the gate valve 77, the second vacuum pumping system 78, the quick-opening door 79, the first shaft rod 731, the second shaft rod 732, the storage hopper 733, the second bevel gear 734, the material baffle 735, the first bevel gear 736, the moving part 751, the flexible pipe 752;

[0103] The detection crystal 8;

[0104] The ion source system 9, the guide cylinder 91, the first shutter drive mechanism 92, the first shutter 93, the gas guiding part 94. Detailed implementation manners

[0105] To further understand the content of the present invention, the present invention will be described in detail with reference to the accompanying drawings and embodiments.

[0106] The structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention. At the same time, terms such as "upper", "lower", "left", "right", "middle", etc. cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope in which the present invention can be implemented.

[0107] The electron beam evaporation coating equipment mainly consists of parts such as an electron gun, a crucible, a vacuum system, and a substrate. The electron gun is the key component for generating an electron beam. In the electron gun, electrons are usually emitted by a hot cathode. The hot cathode is heated to a high enough temperature (usually using materials such as tungsten filaments as the cathode, and after heating, electrons obtain enough energy to overcome the work function of the material and are emitted). A high voltage (usually several thousand volts to several hundred thousand volts) is applied between the cathode and the anode to form a strong electric field. Under the action of this electric field, the emitted electrons are accelerated to form a high-speed electron beam.

[0108] After the high-speed electron beam is focused, it directly bombards the coating material placed in the crucible. When the energy of the electron beam is transferred to the coating material, the atoms on the material surface obtain enough energy and begin to evaporate by overcoming the intermolecular interaction forces. Since the electron beam can provide a high energy density, it can cause the material to rapidly heat up to the evaporation temperature in a local area. For example, for some high-melting-point materials such as titanium dioxide (TiO2) with a melting point as high as 1800 - 1850 °C, the high energy of the electron beam can cause it to rapidly evaporate in a vacuum environment.

[0109] The evaporated atoms exist in the form of gas in the vacuum chamber. In a vacuum environment, these atoms can be transported from the evaporation source above the crucible to the substrate placed at a certain distance away with almost no collision interference. During the transportation process, the movement direction of the atoms is mainly from the evaporation source to the substrate direction because other directions are restricted by the vacuum chamber wall, etc. When the atoms reach the substrate surface, due to the kinetic energy of the atoms themselves and the interaction between the substrate and the atoms (such as van der Waals forces, chemical bonding, etc.), the atoms will deposit on the substrate and gradually form a thin film.

[0110] Initially, atoms are randomly deposited on the substrate surface. As the deposition process continues, interactions occur between atoms, such as adsorption, diffusion, and condensation. Adsorption refers to the attachment of atoms to the substrate surface, diffusion refers to the movement of atoms on the substrate surface, and condensation refers to the combination of atoms to form aggregates. During this process, atoms continuously adjust their positions, making the film gradually become denser and flatter. If the substrate can be heated, it can further promote the processes of atomic diffusion and condensation, which is beneficial to the formation of high-quality films. For example, when preparing optical films, appropriately heating the substrate can make the deposited atoms arrange better and improve the optical properties of the film.

[0111] Compared with resistance evaporation coating, electron beam evaporation coating has great advantages: Resistance evaporation coating is generally used to evaporate low-melting-point materials such as aluminum, gold, silver, zinc sulfide, etc.; while electron beam evaporation coating can evaporate high-melting-point metals or dielectric materials such as tungsten, molybdenum, germanium, SiO2, Al2O3, etc., greatly expanding the types of materials that can be coated.

[0112] In resistance evaporation coating, the material is prone to react with the crucible, affecting the purity of the film; while in electron beam evaporation coating, the material to be evaporated is placed in a water-cooled crucible, which can avoid the evaporation of the container material and the reaction between the container material and the evaporated material, and can significantly improve the purity of the coating. Electron beam evaporation coating has a high energy density, the heating temperature can reach above 3000°C, and the evaporation speed is fast; in contrast, the evaporation rate of resistance evaporation coating is relatively low.

[0113] Compared with induction heating evaporation coating, electron beam evaporation coating also has great advantages: Electron beam evaporation coating directly adds heat to the surface of the evaporated material, with less loss of heat conduction and thermal radiation and high thermal efficiency; while induction heating evaporation coating, although it has a large evaporation rate, has a relatively low energy utilization efficiency compared with electron beam evaporation coating.

[0114] The equipment of induction heating evaporation coating requires a high-frequency electromagnetic field generating device, etc., and the equipment is complex and costly; the electron beam evaporation coating equipment is relatively simple and the cost is relatively low.

[0115] Compared with magnetron sputtering coating, electron beam evaporation coating also has great advantages: Magnetron sputtering coating has a large deposition rate, and a large ion current can be obtained, which can effectively improve the deposition rate and sputtering rate during the coating process; while the deposition rate of electron beam evaporation coating is relatively slow, but for some application scenarios with not particularly high requirements for the deposition rate and high requirements for the film quality, electron beam evaporation coating has more advantages. The film formed by electron beam evaporation coating has strong adhesion, high density, and relatively large particle kinetic energy. When deposited on the substrate surface, it can better combine with the substrate, forming a high-quality film; although magnetron sputtering coating can also prepare films with good performance, in some aspects, such as the density and adhesion of the film, electron beam evaporation coating is superior.

[0116] In addition, electron beam evaporation coating can evaporate a wide variety of materials, including various metals, alloys, oxides, sulfides, etc.; magnetron sputtering coating is mainly applicable to the coating of metal and alloy materials. For some high-melting-point dielectric materials, electron beam evaporation coating has more advantages.

[0117] In an electron beam evaporation coating system, the primary function of the interconnection and transfer module is to connect various different chambers, such as the evaporation chamber, the pretreatment chamber, the analysis and detection chamber, etc., so that the entire coating process can be continuously carried out in an integrated system, avoiding the possible contamination caused by the exposure of the sample to the atmospheric environment during the transfer between different devices, and ensuring the purity and quality of the thin film.

[0118] The transfer module is responsible for accurately and stably transferring the sample to be coated between various chambers, ensuring that the sample can enter different processing links in sequence according to the preset process flow, and realizing automated and high-efficiency production. For example, in the manufacture of large-scale integrated circuits, a large number of silicon wafers need to be coated. The interconnection and transfer module can quickly and accurately transfer the silicon wafers from one chamber to another, improving production efficiency.

[0119] An electron beam evaporation coating device of the present application focuses on the optimized design of the evaporation chamber. The thin film deposition process is completed in the evaporation chamber. The first vacuum pumping system is connected to the flange on one side of the evaporation chamber to obtain an ultra-high vacuum environment for the evaporation chamber. The first vacuum pumping system includes a mechanical pump and a molecular pump. Among them, when starting the mechanical pump, the vacuum degree in the evaporation chamber is pumped to about 10 -1 Pa, and then start the molecular pump to pump the vacuum degree to about 10 -8 Pa.

[0120] The electron gun system is located at the bottom of the evaporation chamber and is used to emit electron beams. The electron beams hit the materials in the crucible to make them evaporate, and the evaporated materials are gradually deposited on the surface of the substrate 37. It should be noted that the crucible is arranged in the evaporation chamber and is located below the substrate 37.

[0121] As Figure 1 、 Figure 2 shown, the ion source system 9 is used to clean the substrate 37. The ion source system 9 is connected to the top of the evaporation chamber through the top flange assembly 65. More specifically, the guide cylinder 91 is hollow and is sleeved in the middle and lower part of the ion source system 9 and extends downward until it extends out of the bottom of the ion source system 9. The guide cylinder 91 is fixedly connected to the ion source system 9. The guide cylinder 91 passes through the top flange assembly 65 and enters the interior of the evaporation chamber, and the guide cylinder 91 is fixedly connected to the top flange assembly 65.

[0122] As Figure 14 、 Figure 15As shown in the figure, a first baffle driving mechanism 92 located outside the evaporation chamber and a first baffle 93 located inside the evaporation chamber are also provided on the top flange assembly 65. The first baffle 93 is fixedly connected to the first baffle driving mechanism 92. Driven by the first baffle driving mechanism 91, the first baffle 93 swings in a fan shape in the horizontal plane to shield or open the guide cylinder 91. When it is necessary to start the ion source system 9 to clean the substrate 37, the first baffle 93 swings horizontally to make the guide cylinder 91 face the substrate 37 directly. After the substrate 37 is cleaned, the first baffle 93 swings in the opposite direction to shield the guide cylinder 91.

[0123] As Figure 1 , Figure 2 shown in the figure, a gas supply system is also provided at the top of the evaporation chamber. An opening is provided in the middle and lower part of the guide cylinder 91. One end of the gas guiding part 94 is connected to the gas supply system pipeline, and the other end is inserted into the opening of the guide cylinder 91. When starting the ion source system 9 to clean the substrate 37, the gas supply system is synchronously started, so that the plasma generated by the ion source system 9 reacts chemically with the gas injected by the gas guiding part 94, changing the chemical properties of the material surface, thereby achieving a better cleaning effect or providing favorable conditions for subsequent surface modification and other treatments.

[0124] As Figures 3 to 7 shown in the figure, the heating stage mechanism is arranged inside the evaporation chamber and is used to heat the substrate 37. The sample stage mechanism is rotationally connected to the heating stage mechanism and is located outside the heating stage mechanism. The two are preferably connected by bearings. The sample stage mechanism includes a substrate clamping part 31 for clamping the substrate 37.

[0125] As Figure 8 shown in the figure, the first driving system 1 is located outside the evaporation chamber and is used to drive the first rotating shaft 11 to rotate. The first rotating shaft 11 drives the sample stage mechanism to rotate around the central axis of the substrate clamping part 31. It should be noted that during the rotation of the sample stage mechanism, the heating stage does not rotate.

[0126] As Figure 8 shown in the figure, the second driving system 2 is located outside the evaporation chamber and is used to drive the second rotating shaft 21 to rotate. The second rotating shaft 21 drives the sample stage mechanism and the heating stage mechanism to flip synchronously as a whole. After flipping, when the sample clamping part 31 faces the ion source system 9, the substrate 37 can be placed on the substrate clamping part 31 to carry out the cleaning work of the substrate 37, or flip the substrate 37 to adjust the thin film deposition surface of the substrate 37.

[0127] It should be noted that the placement and flipping of the substrate 37 require the assistance of a manipulator. A long strip-shaped opening with an opening and closing function is provided on the side wall of one side of the evaporation chamber. When the manipulator needs to transfer the substrate 37 into the evaporation chamber or transfer the substrate 37 from the evaporation chamber to other chambers, the opening is in an open state. When the manipulator retracts to other chambers, the opening closes. Since the interconnection transfer module connects various different cavities and each different cavity maintains an ultra-high vacuum environment, the movement of the manipulator will not damage the ultra-high vacuum environment of the evaporation chamber.

[0128] As Figure 8 shown, more specifically, the first rotating shaft 11 is rotatably connected to the second rotating shaft 21, and the two are preferably connected by bearings, and the first rotating shaft 11 penetrates through the inside of the second rotating shaft 21. The second driving system 2 is connected to one side of the evaporation chamber through the first flange 23. One end of the second driving system 2 is fixedly connected to the first flange 23, and the other end is connected to the rotating ring 22.

[0129] As Figure 8 shown, one end of the rotating ring 22 is fixedly connected to the second rotating shaft 21, and the other end is fixedly connected to the adapter flange 24. The adapter flange 24 is fixedly connected to the first driving system. Among them, the second rotating shaft 21 passes through the first flange 23 and enters the inside of the evaporation chamber, and the second rotating shaft 21 is rotatably connected to the first flange 23. The rotation connection method is preferably a bearing connection. It is worth noting that the end of the first rotating shaft 11 extends out of the second rotating shaft 21, that is, the ends of the first rotating shaft 11 and the second rotating shaft 21 are both located inside the evaporation chamber. The end here refers to the end far from the first driving system 1 and the second driving system 2.

[0130] The second driving system 2 is preferably a differential rotating motor. The differential rotating motor drives the rotating ring 22 together with the second rotating shaft 21 to rotate, and synchronously drives the adapter flange 24 to rotate synchronously with the first driving system 1. During the rotation of the rotating ring 22, the differential rotating motor itself does not rotate.

[0131] As Figure 3 、 Figure 4 、 Figure 8 shown, the adapter flange 24 is preferably a four-way flange. Its two ends are respectively fixedly connected to the rotating ring 22 and the first driving system 1. Its two opposite side parts are respectively connected to a vacuum electrical feedthrough 25. The vacuum electrical feedthrough 25 is connected to the heating table mechanism through a wire. The temperature sensor provided on the heating table mechanism transmits an electrical signal to the vacuum electrical feedthrough 25, and is transmitted to the temperature control system by the vacuum electrical feedthrough 25. The vacuum electrical feedthrough 25 simultaneously transmits an external electrical signal to the heating table mechanism in the vacuum chamber, so as to realize the temperature control of the heating table mechanism.

[0132] The driving shaft of the first driving system 1 itself is arranged inside the four-way flange, and the driving shaft of the first driving system 1 itself is connected to the first rotating shaft 11 through a coupling. When the first driving system 1 drives the first rotating shaft 11 to rotate, the second rotating shaft can remain relatively still.

[0133] In order to ensure the smooth rotation of the sample stage mechanism, the first rotating shaft 11 is connected to the sample stage mechanism through the adapter shaft 12, and the rotation direction is changed through the adapter shaft 12. A driving wheel 111 is fixedly connected to the end of the first rotating shaft 11, and a driven wheel 121 is provided at the end of the adapter shaft 12 away from the sample stage mechanism; a driving bevel gear 122 is provided at the end of the adapter shaft 12 close to the sample stage mechanism, and a driven bevel gear 32 is fixedly connected to the sample stage mechanism.

[0134] like Figures 4 to 7 As shown, the driving wheel 111 meshes with the driven wheel 121, and the driving bevel gear 122 meshes with the driven bevel gear 32, thereby completing the rotation transfer. When the first rotating shaft 11 rotates, it drives the adapter shaft 12 and the sample stage mechanism to rotate, and due to the characteristics of the bevel gear, the rotation of the first rotating shaft 11 around the horizontal axis is converted into the rotation of the sample stage mechanism around the vertical axis.

[0135] The adapter shaft 12 requires a support portion, and the positioning assembly 5 not only provides a fulcrum for the adapter shaft 12, but also can bear the weight of the sample stage mechanism and the heating stage mechanism. One end of the positioning assembly 5 is fixedly connected to the end of the second rotating shaft 21, and the other end is fixedly connected to the heating stage mechanism, and is also rotationally connected to the sample stage mechanism. When the second rotating shaft 21 rotates, the sample stage mechanism and the heating stage mechanism are synchronously turned over as a whole through the positioning assembly 5.

[0136] like Figure 5 , Figure 7 , Figure 12 , Figure 13 As shown, more specifically, the positioning assembly 5 includes a vertical plate 51 fixedly connected to the end of the second rotating shaft 21 and a first horizontal plate 52 perpendicular to the vertical plate 51, and the vertical plate 51 is fixedly connected to the first horizontal plate 52 through a pair of bottom support plates 53. The second horizontal plate 54 is fixedly connected to the first horizontal plate 52 through a pair of top support plates 55. Among them, the second horizontal plate 54 is located above the first horizontal plate 52, and the second horizontal plate 54 is fixedly connected to the heating stage mechanism, and the second horizontal plate 54 is also rotationally connected to the sample stage mechanism, and the rotational connection is preferably a bearing connection.

[0137] An opening for accommodating the transfer shaft 12 is provided in the middle of the first horizontal plate 52, and one end of the transfer shaft 12 meshed with the driving wheel 111 is rotatably connected to the first horizontal plate 52 to prevent the first horizontal plate 52 from interfering with the rotation of the transfer shaft 12 by the rotating shaft. A first limiting portion 56 is fixedly connected to the middle of the first horizontal plate 52. The first limiting portion 56 is sleeved on the middle of the transfer shaft 12, and the two are also rotatably connected. The side of the first horizontal plate 52 away from the vertical plate 51 is sleeved on the outer wall of the sample stage mechanism, and the first horizontal plate 52 is rotatably connected to the sample stage mechanism.

[0138] The second limiting portion 57 is fixedly connected to the lower surface of the first horizontal plate 52, and the lower surface is the surface close to the substrate clamping portion. It should be noted that the first rotating shaft 11 includes the driving wheel 111 passing through the vertical plate 51 and being rotatably connected to the second limiting portion 57. The advantage of such a setting is to increase the support points of the first rotating shaft 11 and make the rotation of the first rotating shaft 11 more stable.

[0139] The sample stage mechanism includes a sample rotating shaft 33. The driven bevel gear 32 is sleeved on the outer wall of the sample rotating shaft 33 and is fixedly connected to the sample rotating shaft 33. The end of the sample rotating shaft 33 is fixedly connected to the support platform 34. The substrate clamping portion 31 is connected to the support platform 34 through a support rod 35. The support platform 34 is located between the substrate clamping portion 31 and the driven bevel gear 32.

[0140] As Figure 12 、 Figure 13 shown, the substrate clamping portion 31 includes a pair of fixed pressing plates 311 and a pair of movable pressing plates 312. The movable pressing plates 312 are located between the fixed pressing plates 311 and the support platform 34. Each side of the support rod 35 is preferably four, and its two ends are respectively fixedly connected to the support platform 34 and the fixed pressing plate 311.

[0141] The movable pressing plate 312 is provided with a plurality of through holes for the support plate 35 to pass through. The elastic member 36 is sleeved on the support rod 35. One end of the elastic member 36 is fixed on the support platform 34, and the other end is fixed on the movable pressing plate 312. Two elastic members 36 are preferably arranged on each side to enable the movable pressing plate 312 to slide vertically along the support rod 35.

[0142] The part of the movable pressing plate 312 in contact with the substrate 37 is provided with a groove 3121. The groove 3121 is adapted to the substrate 37 and is used for limiting the substrate 37. The part of the fixed pressing plate 311 in contact with the substrate 37 is provided with a protrusion 3111. The protrusion 3111 is adapted to the groove 3121.

[0143] It should be noted that when the fixed pressing plate 311 is in contact with the movable pressing plate 312, the elastic member 36 is in a natural state or a compressed state, and when the fixed pressing plate 311 is separated from the movable pressing plate 312, the elastic member 36 is compressed by the pressing mechanism.

[0144] The pressing mechanism is connected to the top of the evaporation chamber through the top flange assembly 65. The pressing mechanism includes a third driving system 6, a linear module 61 fixedly connected to the third driving system 6, and a slider 62 sliding along the linear module 61. Among them, the linear module 61 is fixed on the top flange assembly 61, and the third driving system is used to drive the slider 62 to move vertically along the linear module 61.

[0145] As Figure 14 、 15 shown, the pressing mechanism further includes a platform 63 fixedly connected to the slider 62. A pair of movable rod assemblies 64 are symmetrically arranged on both sides of the platform 63. The movable rod assemblies 64 pass through the top flange assembly 65 and extend into the evaporation chamber. The slider 62 drives the platform 63 together with the movable rod assemblies 64 to move vertically.

[0146] The movable rod assembly 64 includes a movable rod 641 and a transfer platform 642. The transfer platform 642 is fixedly connected to the end of the movable rod 641 away from the platform 63. A pair of pressing hands 643 are provided on the transfer platform. The pressing hands 643 are used to press down the movable pressing plate 312, and the end of the pressing hand 643 is preferably set as a smooth curved surface. By providing two pressing hands 643, the movable pressing plate 312 can always be kept parallel to the fixed pressing plate 311 during the vertical movement. When placing or flipping the substrate 37 later, the substrate 37 will not fall due to inclination.

[0147] Taking the transfer of the substrate 37 by the manipulator as an example (the sample platform is flipped so that the substrate clamping part 31 faces the ion source system 9), the pressing hand 643 presses down the movable pressing plate 312 to separate the fixed pressing plate 311 from the movable pressing plate 312. The manipulator transfers the substrate 37 between a pair of substrate clamping parts 31. At this time, the substrate 37 is located between the fixed pressing plate 311 and the movable pressing plate 312. The pressing hand 643 rises at a constant speed. During the process of the movable pressing plate 312 rising at a constant speed, it contacts the substrate and then rises synchronously with the substrate 37 until the pressing hand 643 no longer provides a downward pressure, and the movable pressing plate 312 is in contact with the fixed pressing plate 311, completing the pressing of the substrate 37.

[0148] It should be noted that a corrugated pipe 644 is sleeved on the outer wall of the moving rod 641. The corrugated pipe 644 is arranged outside the evaporation chamber, and one end of the corrugated pipe 644 is fixedly connected to the upper part of the moving rod 641, and the other end is fixedly connected to the top flange assembly 65. When the moving rod 641 undergoes a vertical displacement, the corrugated pipe 644 is correspondingly compressed or rebounds. The function of the corrugated pipe 644 is to ensure that the moving rod 641 is always hermetically connected to the evaporation chamber during the vertical movement.

[0149] An electron beam evaporation coating device of the present application further includes a material conveying system flange-connected to one side of the evaporation chamber, such as Figure 17 , Figure 18 As shown, the material conveying system includes a fourth driving system 7 and a lead screw 71 connected to the fourth driving system 7. The lead screw 71 is threadedly connected to a translation assembly 72, and the translation assembly 72 is magnetically coupled to a sample transfer rod assembly. By driving the lead screw 71 to rotate through the fourth driving system 7, the lead screw 71 drives the translation assembly 72 together with the sample transfer rod assembly to move horizontally along the guide shaft 74. When the sample transfer rod assembly extends into the evaporation chamber, it is used to supplement the materials used by the electron gun system into the crucible.

[0150] More specifically, the guide shaft 74 is hollow and arranged in parallel with the lead screw 71. The translation assembly 72 is sleeved on the guide shaft 74, and the sample transfer rod assembly passes through the inside of the guide shaft 74. One end of the guide shaft 74 away from the fourth driving system 7 is fixedly connected to one side of a displacement table 75, and the other side of the displacement table 75 is fixedly connected to an addition chamber 76. One end of the addition chamber 76 away from the displacement table 75 is connected with a flap valve 77, and the addition chamber 76 is flange-connected to one side of the evaporation chamber through the flap valve 77.

[0151] A second vacuum pumping system 78 is arranged on the side of the addition chamber 76, and a quick-opening door 79 is arranged on the top of the addition chamber 76. The quick-opening door 79 is used to open and close the inner cavity of the addition chamber 76. The displacement table 75 is internally provided with an inner cavity, which is used for the sample transfer rod assembly to pass through, and at the same time, the inner cavity communicates with the addition chamber 76.

[0152] In order to ensure that the gas extracted by the second vacuum pumping system 78 is from a sealed space, the guide shaft 74 and the displacement table 75 are preferably sealed and connected by a flange, and at the same time, one end of the guide shaft 74 away from the displacement table 75 is closed.

[0153] Such as Figure 19 , Figure 20 As shown, the sample transfer rod assembly includes a first shaft rod 731 and a second shaft rod 732. The second shaft rod 732 is located inside the first shaft rod 731 and extends out of the first shaft rod 731, and the two are rotatably connected. A material storage hopper 733 is fixedly connected to the end of the first shaft rod 731. A second bevel gear 734 is arranged on the material storage hopper 733, and the second bevel gear 734 is fixedly connected to a material baffle 735, and the material baffle 735 is used to open or shield the material storage hopper 733.

[0154] One end of the second shaft rod 732 extending out of the first shaft rod 731 is fixedly connected with a first bevel gear 736, and the first bevel gear 736 meshes with the second bevel gear 734. It should be noted that when the second shaft rod 732 rotates around its own axis together with a bevel gear 736, the first shaft rod 731 is relatively stationary. The second bevel gear 734 is rotatably connected to the storage hopper 733, that is, when the second bevel gear 734 rotates driven by the first bevel gear 736, the storage hopper 733 is relatively stationary.

[0155] Such as Figure 17 、 Figure 21 、 Figure 22 As shown in, a transmission mechanism 70 rotatably connected thereto is provided on the translation assembly 72. The transmission mechanism 70 is preferably a belt drive. Its driven pulley is sleeved on the guide shaft 74 but does not contact the guide shaft 74. The driving pulley is driven to rotate by a fifth driving system. The driving pulley and the driven pulley realize belt drive through a transmission belt.

[0156] Specifically, the translation assembly 72 is magnetically coupled with the first shaft rod 731, and the transmission mechanism 70 is magnetically coupled with the second shaft rod 732. Through the action of magnetic coupling, the translation assembly 72 can drive the first shaft rod 731 to move horizontally, and the transmission mechanism 70 can drive the second shaft rod 732 to rotate around its own axis.

[0157] The displacement table 75 includes a moving part 751 and a flexible tube 752. The flexible tube 752 provides the inner cavity described above for the displacement table 75. Along the central axis extension direction of the guide shaft 74, the specific connection method is as follows: the end of the guide shaft 74 is hermetically connected to the moving part 751 through a flange, the moving part 751 is hermetically connected to the flexible tube 752, and the flexible tube 752 is flange-connected to the addition chamber 76.

[0158] The moving part 751 can move vertically under the drive of a sixth driving system. Since the flexible tube 752 can undergo a certain deformation, it will not affect the connection between the flexible tube 752 and the moving part 751 and the addition chamber 76. Under the vertical movement of the moving part 751, the guide shaft 74 together with the sample transfer rod assembly (including the translation assembly 72, the fourth driving system 7, and the lead screw 71) inside it will all move vertically synchronously as a whole. Therefore, when the sample transfer rod assembly extends into the evaporation chamber and moves above the crucible, if the vertical distance between the crucible and the storage hopper 735 is large, the moving part 751 can be moved downward to move the storage hopper 735 closer to the crucible, and then the material baffle 735 is opened to make the material fall into the crucible.

[0159] The specific way to add materials to the material conveying system is as follows: The fourth drive system 7 drives the lead screw 71 to rotate, driving the translation assembly 72 and the sample transfer rod assembly to retract, so that the storage hopper 733 at the end of the sample transfer rod assembly faces the quick-opening door 79. At this time, the flap valve 77 is closed, and the material baffle 735 shields the storage hopper 733.

[0160] Open the quick-opening door 79, add materials to the storage hopper 733, close the quick-opening door 79, and activate the second vacuum pumping system 78 to pump the addition chamber 76 to an ultra-high vacuum environment. Open the flap valve 77, and the fourth drive system 7 drives the lead screw 71 to rotate in the reverse direction, driving the sample transfer rod assembly to translate towards the evaporation chamber until the storage hopper 733 is translated directly above the crucible.

[0161] The sixth drive system drives the moving part 751 to move vertically towards the bottom of the evaporation chamber, so that the sample transfer rod assembly moves vertically synchronously, bringing the storage hopper 735 closer to the crucible. Open the material baffle 735 to let the material fall into the crucible. The sample transfer rod assembly retracts, and the flap valve 77 is closed.

[0162] The heating stage mechanism includes a shaft rod 41 rotatably connected to the sample rotating shaft 33 and a heating stage body 42. The shaft rod 41 passes through the inside of 33 and extends out of the support platform 34. One end of the shaft rod 41 is fixedly connected to the positioning assembly 5, and the other end is fixedly connected to the heating stage body 42. The heating stage body 42 is located between the support platform 34 and the sample clamping part 31.

[0163] The device also includes a film thickness detection system. The film thickness detection system includes a detection crystal 8 with one end extending into the evaporation chamber. The end of the detection crystal 8 outside the evaporation chamber is hermetically connected to the side wall of the evaporation chamber through a flange. The detection crystal 8 can monitor the thickness of the film being deposited in real time and accurately calculate the thickness of the film. This is like installing a "ruler" for the coating process, which can know the growth situation of the film at any time.

[0164] The film thickness detection system is connected to an external control system. When it detects that the film thickness reaches the preset value, it can send a signal to the control system to stop the operation of the electron gun system or adjust parameters such as the evaporation rate.

[0165] The application method of the device is as follows:

[0166] The first vacuum pumping system pumps the evaporation chamber to an ultra-high vacuum environment;

[0167] The second drive system drives the second rotating shaft to rotate, driving the sample stage mechanism and the heating stage mechanism to flip as a whole synchronously, so that the sample clamping part faces the ion source system;

[0168] The pressing mechanism at the top of the evaporation chamber moves downwards, separating the movable pressing plate and the fixed pressing plate of the sample clamping part. After placing the substrate, the pressing mechanism retracts;

[0169] The ion source system cleans the substrate;

[0170] The second drive system drives the second rotating shaft to rotate in the reverse direction again, driving the sample stage and the heating stage mechanism to flip synchronously as a whole, so that the sample clamping part faces the electron gun system;

[0171] The first drive system drives the first rotating shaft to rotate, driving the sample stage mechanism to rotate around the central axis of the sample clamping part, and the substrate rotates synchronously; the electron gun system is turned on synchronously to evaporate and coat the substrate;

[0172] When it is necessary to adjust the coating surface of the substrate, the first drive system is turned off and the second drive system is turned on to flip the sample stage mechanism and the heating stage mechanism as a whole; the pressing mechanism moves downward to separate the movable pressing plate from the fixed pressing plate, and the substrate is flipped to complete the swapping of the coating surfaces.

[0173] It should be noted that the present application provides a solution for coating the substrate at an inclined angle. Coating at a special inclination angle is a special process. It means that during the coating process, the substrate is placed at a certain angle relative to the evaporation source, rather than the traditional vertical placement method.

[0174] The distribution of evaporated atoms or molecules will change when they reach the surface of the substrate. In the case of vertical evaporation, the deposition rate in the area of the substrate directly above the evaporation material may be higher than that in the edge area, resulting in uneven film thickness. By tilting the substrate at an angle, the coverage range of the evaporated material on the substrate can be made wider, reducing the deposition rate difference between the central and edge areas.

[0175] The second rotating shaft is driven to rotate by a differential rotating motor, thereby driving the sample stage mechanism to flip as a whole to a specified angle to achieve coating the substrate at a special inclination angle. During the coating process, the inclination angle of the substrate can still be adjusted by the differential rotating motor to improve the electrical and mechanical properties of the film.

[0176] The above schematically describes the present invention and its implementation manners. This description is not restrictive, and what is shown in the drawings is only one of the implementation manners of the present invention. The actual structure is not limited thereto. Therefore, if those of ordinary skill in the art are inspired by it and design similar structural manners and embodiments to this technical solution without creative work without departing from the purpose of the present invention, they shall fall within the protection scope of the present invention.

Claims

1. An electron beam evaporation coating device, comprising: An evaporation chamber, which provides a space for depositing a thin film on a substrate (37); An electron gun system connected to the bottom of the evaporation chamber, the electron gun system is used to emit an electron beam, the electron beam is used to impact the material in the crucible and evaporate the material, the crucible is located in the evaporation chamber and below the substrate (37); A first vacuum pumping system, which is connected to a flange on one side of the evaporation chamber and is used to provide the evaporation chamber with an ultra-vacuum environment; Features: Also includes, A heating platform mechanism, the heating platform mechanism is located in the evaporation chamber, and the heating platform mechanism is used to heat the substrate (37); A sample stage mechanism, the sample stage mechanism is rotatably connected to the heating stage mechanism and is located outside the heating stage mechanism, the sample stage mechanism comprising a substrate clamping portion (31) for clamping a substrate (37); An ion source system (9), the ion source system (9) being connected to the top flange of the evaporation chamber, and the ion source system (9) being used for cleaning the substrate (37); A first driving system (1), the first driving system (1) being located outside the evaporation chamber and used for driving a first rotating shaft (11) to rotate, wherein the first rotating shaft (11) drives the sample stage mechanism to rotate around a central axis of the substrate clamping portion (31); A second driving system (2), the second driving system (2) being located outside the evaporation chamber and used for driving the second rotating shaft (21) to rotate, and the second rotating shaft (21) drives the heating stage mechanism and the sample stage mechanism to turn over synchronously as a whole; When the sample stage mechanism is flipped so that the substrate clamping portion (31) is opposite to the ion source system (9), the substrate (37) can be placed, cleaned and flipped; The device also includes a material conveying system connected to a flange on one side of the evaporation chamber, the material conveying system including a fourth drive system (7) and a screw (71) connected to the fourth drive system (7); the screw (71) is threadedly connected to the translation assembly (72), and the translation assembly (72) is magnetically coupled to the sample transfer rod assembly; The fourth driving system (7) drives the screw (71) to rotate, and the screw (71) drives the translation assembly (72) together with the sample transfer rod assembly to move horizontally along the guide shaft (74); One end of the guide shaft (74) away from the fourth drive system (7) is fixedly connected to one side of the displacement platform (75), and the other side of the displacement platform (75) is fixedly connected to the adding chamber (76). One end of the adding chamber (76) away from the displacement platform (75) is connected to a gate valve (77), and the adding chamber (76) is flange-connected to one side of the evaporation chamber via the gate valve (77); The second vacuum pumping system (78) is arranged on the side of the adding chamber (76), and the quick-opening door (79) is arranged on the top of the adding chamber (76), and the quick-opening door (79) is used to open and close the inner cavity of the adding chamber (76); The displacement platform (75) comprises an inner cavity for the sample transfer rod assembly to pass through, and the inner cavity of the displacement platform (75) is connected with the addition chamber (76).

2. The electron beam evaporation coating device according to claim 1, characterized in that: The first rotating shaft (11) is rotatably connected to the second rotating shaft (21), and the first rotating shaft (11) is disposed inside the second rotating shaft (21); The ends of the first rotating shaft (11) and the second rotating shaft (21) are both located in the evaporation chamber, and the end of the first rotating shaft (11) extends out of the second rotating shaft (21).

3. The electron beam evaporation coating device according to claim 2, characterized in that: The positioning assembly (5) is rotationally connected to the first rotating shaft (11); One end of the positioning component (5) is fixedly connected to the end of the second rotating shaft (21), and the other end is fixedly connected to the heating stage mechanism and is also rotationally connected to the sample stage mechanism; When the second rotating shaft (21) rotates, the sample stage mechanism and the heating stage mechanism are synchronously turned over as a whole through the positioning assembly (5).

4. The electron beam evaporation coating device according to claim 3, characterized in that: One end of the second driving system (2) is fixedly connected to a first flange (23) on one side of the evaporation chamber, and the other end is connected to the rotating ring (22); One end of the rotating ring (22) is fixedly connected to the second rotating shaft (21); the second rotating shaft (21) passes through the first flange (23) and enters the interior of the evaporation chamber; the second rotating shaft (21) is rotatably connected to the first flange (23); The other end of the rotating ring (22) is connected to the adapter flange (24), and the adapter flange (24) is fixedly connected to the first driving system (1); The second driving system (2) drives the rotating ring (22) to rotate together with the second rotating shaft (21), thereby driving the adapter flange (24) to rotate synchronously with the first driving system (1).

5. The electron beam evaporation coating device according to claim 1, characterized in that: The first rotating shaft (11) is connected to the sample stage mechanism via a transfer shaft (12); The end of the first rotating shaft (11) away from the first driving system (1) is fixedly connected to a driving wheel (111); the end of the adapter shaft (12) away from the sample stage mechanism is fixedly connected to a driven wheel (121); An end of the adapter shaft (12) close to the sample stage mechanism is fixedly connected with a driving bevel gear (122), and the sample stage mechanism is provided with a driven bevel gear (32); The driving wheel (111) meshes with the driven wheel (121), and the driving bevel gear (122) meshes with the driven bevel gear (32). When the first rotating shaft (11) rotates, the transfer shaft (12) and the sample table mechanism are driven to rotate.

6. The electron beam evaporation coating device according to claim 5, characterized in that: The sample stage mechanism also includes a sample rotating shaft (33), and the driven bevel gear (32) is sleeved on the outer wall of the sample rotating shaft (33) and is fixedly connected to the sample rotating shaft (33); The supporting platform (34) is fixedly connected to the end of the sample rotating shaft (33); The substrate clamping portion (31) is connected to the support platform (34) via a support rod (35); The supporting platform (34) is located between the substrate clamping portion (31) and the driven bevel gear (32).

7. The electron beam evaporation coating device according to claim 6, characterized in that: The substrate clamping portion (31) comprises a pair of fixed pressing plates (311) and a pair of movable pressing plates (312); wherein the movable pressing plates (312) are located between the fixed pressing plates (311) and the supporting platform (34); The two ends of the support rod (35) are respectively fixedly connected to the support platform (34) and the fixed pressing plate (311); The movable pressing plate (312) is provided with a plurality of through holes for the support rods (35) to pass through; The elastic component (36) is sleeved on the support rod (35), and one end of the elastic component (36) is fixed on the support platform (34), and the other end is fixed on the movable pressing plate (312); the elastic component (36) is used to make the movable pressing plate (312) slide vertically along the support rod (35).

8. The electron beam evaporation coating device according to claim 7, characterized in that: When the fixed pressing plate (311) and the movable pressing plate (312) are in contact with each other, the elastic component (36) is in a natural state or a compressed state; When the fixed pressing plate (311) is separated from the movable pressing plate (312), the elastic component (36) is in a compressed state; When the substrate clamping portion (31) is opposite to the ion source system (9), the pressing mechanism is used to press down the movable pressing plate (312).

9. The electron beam evaporation coating device according to claim 8, characterized in that: The pressing mechanism is connected to the top of the evaporation chamber via a top flange assembly (65), and the pressing mechanism comprises a third drive system (6) and a linear module (61) fixedly connected to the third drive system (6); the linear module (61) is fixed on the top flange assembly (65); The pressing mechanism further comprises a slider (62) which moves vertically along the linear module (61); and the third driving system (6) is used to drive the slider (62) to move vertically along the linear module (61).

10. The electron beam evaporation coating device according to claim 9, characterized in that: The pressing mechanism also includes a platform (63) fixedly connected to the slider (62), and a pair of movable rod assemblies (64) are symmetrically arranged on both sides of the platform (63). The movable rod assemblies (64) pass through the top flange assembly (65) and extend into the interior of the evaporation chamber.

11. The electron beam evaporation coating device according to claim 10, characterized in that: The movable rod assembly (64) comprises a movable rod (641) and a transfer platform (642); Wherein, the transfer platform (642) is fixedly connected to an end of the moving rod (641) away from the platform (63); A pair of pressing hands (643) are provided on the transfer platform (642), and the pressing hands (643) are used to press down the movable pressing plate (312).

12. The electron beam evaporation coating device according to claim 1, characterized in that: The guide shaft (74) is hollow and parallel to the screw rod (71); the translation assembly (72) is sleeved on the guide shaft (74), and the sample transfer rod assembly is inserted into the guide shaft (74); When the sample transfer rod assembly extends into the evaporation chamber, it is used to replenish materials into the crucible.

13. The electron beam evaporation coating device according to claim 1, characterized in that: The sample transfer rod assembly comprises a first shaft (731) and a second shaft (732) rotatably connected to the first shaft (731), wherein the second shaft (732) is inserted into the first shaft (731) and extends out of the end of the first shaft (731); The end of the first shaft (731) is connected to a material storage hopper (733), and the material storage hopper (733) is provided with a second bevel gear (734), and the second bevel gear (734) is fixedly connected to a material baffle (735); the material baffle (735) is used to open or cover the material storage hopper (733); One end of the second shaft (732) extending from the first shaft (731) is provided with a first bevel gear (736); the first bevel gear (736) is meshed with the second bevel gear (734); The translation assembly (72) is provided with a transmission mechanism (78) rotatably connected thereto, and the transmission mechanism (78) is used to drive the second shaft (732) and the first bevel gear (736) to rotate around a horizontal axis, the first bevel gear (736) drives the second bevel gear (734) to rotate around a vertical axis, and the second bevel gear (734) drives the material baffle (735) to swing in a fan shape on a horizontal plane.

14. The application method of the electron beam evaporation coating device according to any one of claims 1 to 13, characterized in that: The following steps are involved: The first vacuum pumping system pumps the evaporation chamber to an ultra-vacuum environment; The second driving system drives the second rotating shaft to rotate, driving the sample stage mechanism and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the ion source system; The pressing mechanism on the top of the evaporation chamber moves downward to separate the movable pressing plate of the sample clamping part from the fixed pressing plate. After the substrate is placed, the pressing mechanism retracts. The ion source system cleans the substrate; The second driving system drives the second rotating shaft to rotate in the opposite direction again, driving the sample stage and the heating stage mechanism to turn over synchronously as a whole, so that the sample clamping part is opposite to the electron gun system; The first driving system drives the first rotating shaft to rotate, driving the sample stage mechanism to rotate around the central axis of the sample clamping part, and the substrate rotates synchronously; the electron gun system is turned on synchronously to evaporate and coat the substrate; When the coating surface of the substrate needs to be adjusted, the first drive system is turned off and the second drive system is turned on to flip the sample stage mechanism and the heating stage mechanism as a whole; the pressing mechanism moves down to separate the movable pressing plate from the fixed pressing plate, flip the substrate, and complete the swap of the coating surface.

Images