Workpiece internal hole surface treatment device and method

Abstract

The invention discloses a workpiece internal hole surface treatment device and method.The device comprises a power source, a first fixing assembly, a second fixing assembly and an electroplating liquid bath, and the first fixing assembly and the second fixing assembly make contact with the two ends of a workpiece correspondingly and are used for fixing the workpiece and sealing openings in the two sides of a workpiece internal hole; the first fixing assembly is provided with an anode, the second fixing assembly is provided with a cathode, the anode of the power supply is connected with the anode, the cathode of the power supply is connected with the cathode, electroplating liquid is stored in the electroplating liquid tank, the first fixing assembly is provided with a liquid flow channel, one end of the liquid flow channel is communicated with the electroplating liquid tank, and the other end of the liquid flow channel is communicated with the electroplating liquid tank. When the power source is powered on, the electroplating liquid enters the inner hole of the workpiece, and therefore surface treatment is conducted on the inner hole of the workpiece. The workpiece internal hole surface treatment device can complete independent surface treatment on the workpiece internal hole.

Description

Technical Field

[0001] The invention belongs to the technical field of surface treatment, and in particular relates to a device and method for treating the surface of internal holes of a workpiece. Background Art

[0002] Electroplating and oxidation are common metal workpiece surface treatment technologies, which are used to generate a plating layer or an oxide layer on the surface of metal workpieces. In certain cases, only the surface of the internal holes of the workpiece needs to be treated, and there is no need to treat the outer surface of the workpiece.

[0003] In the prior art, surface treatment processes such as electroplating or oxidation of workpieces usually rely on handling equipment such as cranes and robots to transfer workpieces between multiple electroplating tanks and water washing tanks to complete different stages of treatment. These methods usually perform surface treatment on the outer surface and the inner hole surface of the workpiece at the same time, and it is impossible to perform surface treatment on only the inner hole surface of the workpiece.

[0004] At present, the process for surface treatment of the internal hole surface of the workpiece is generally to place the workpiece as a whole into an electroplating tank, then apply power to electroplate or oxidize the inner and outer surfaces of the workpiece at the same time, and then remove the electroplating layer or oxide layer on the outer surface of the workpiece by cutting or grinding, etc., leaving only the electroplating layer or oxide layer on the internal hole surface of the workpiece. This method is relatively complicated, resulting in great waste and damage to the workpiece. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a device and method for surface treatment of internal holes of a workpiece in view of the above-mentioned deficiencies in the prior art. The device for surface treatment of internal holes of a workpiece can complete independent surface treatment of internal holes of a workpiece.

[0006] In order to solve the above problems, the present invention adopts the following technical solutions:

[0007] A device for treating the surface of a hole inside a workpiece comprises a power supply, a first fixing component, a second fixing component and a plating liquid tank, wherein the first fixing component and the second fixing component are respectively in contact with two ends of the workpiece and are used to fix the workpiece and close the openings on both sides of the hole inside the workpiece, the first fixing component is provided with an anode, the second fixing component is provided with a cathode, the positive electrode of the power supply is connected to the anode, and the negative electrode is connected to the cathode, the plating liquid tank stores plating liquid, the first fixing component is provided with a liquid flow channel, one end of the liquid flow channel is connected to the plating liquid tank, and the other end is connected to the hole inside the workpiece, when the power supply is powered on, the plating liquid enters the hole inside the workpiece, thereby performing surface treatment on the hole inside the workpiece.

[0008] Preferably, the first fixing component includes a base and a first insulating plate, the base constitutes the anode, the first insulating plate is installed on the top of the base, the workpiece is placed on the first insulating plate, the anode has a protrusion, the protrusion extends upward into the internal hole of the workpiece, and the top of the protrusion is lower than the upper opening of the internal hole of the workpiece.

[0009] Preferably, the second fixing assembly includes an electric cylinder, a cover plate and a second insulating plate, the cover plate constitutes the cathode, the second insulating plate is fixedly mounted on the output end of the electric cylinder, the cover plate is fixedly mounted on the side of the second insulating plate away from the electric cylinder, the electric cylinder is started to drive the cover plate to move downward, the cover plate contacts the top of the workpiece and closes the upper opening of the internal hole of the workpiece.

[0010] Preferably, the liquid flow channels are provided with two, namely a first flow channel and a second flow channel, the first flow channel and the second flow channel are both arranged in the base, one end of the first flow channel is opened at the top of the base and is connected with the bottom of the internal hole of the workpiece, the other end of the first flow channel is connected with the electroplating liquid tank through a first pipe, and one end of the second flow channel is opened at the top of the raised portion, and the other end is connected with the electroplating liquid tank through a second pipe.

[0011] Preferably, the workpiece internal hole surface treatment device further comprises a water tank, in which cleaning water is stored, and the water tank is connected to the first flow channel through a third pipe, and is connected to the second flow channel through a fourth pipe.

[0012] Preferably, the first pipeline is provided with a first valve and a first delivery pump, the second pipeline is provided with a second valve, the third pipeline is provided with a third valve and a second delivery pump, and the fourth pipeline is provided with a fourth valve.

[0013] Preferably, the device for treating the surface of the internal holes of the workpiece also includes an air exhaust component, which includes a first air pipe and a second air pipe. A cavity is provided inside the cover plate, and the cavity is connected to the internal hole of the workpiece. One end of the first air pipe is connected to the cavity, and the other end is connected to the electroplating liquid tank. One end of the second air pipe is connected to the cavity, and the other end is connected to the water tank. A fifth valve is provided on the first air pipe, and a sixth valve is provided on the second air pipe.

[0014] Preferably, the device for treating the surface of the internal holes of the workpiece further comprises a purge assembly, which comprises a purge pipe and an air storage device, wherein one end of the purge pipe is connected to the air storage device, and the other end is respectively connected to the first air pipe and the second air pipe, and a seventh valve is provided on the purge pipe.

[0015] Preferably, a first sealing ring is provided between the workpiece and the first insulating plate, and a second sealing ring is provided between the first insulating plate and the base.

[0016] The present invention also provides a method for treating the surface of a hole inside a workpiece, using the above-mentioned device for treating the surface of a hole inside a workpiece, and the method is as follows:

[0017] The first valve, the first delivery pump, the second valve, and the fifth valve are opened, and the electroplating solution is passed into the internal holes of the workpiece through the first pipe and the first flow channel, and the air in the internal holes of the workpiece is discharged into the electroplating solution tank along the first air pipe, and the overflowed electroplating solution flows back to the electroplating solution tank along the second flow channel and the second pipe;

[0018] Turn on the power supply to electroplate and oxidize the surface of the internal holes of the workpiece;

[0019] After the electroplating and oxidation treatments are completed, the first delivery pump is turned off, the seventh valve is opened, and the first purge is performed to dry the electrolyte remaining in the holes and pipes inside the workpiece;

[0020] Close the first valve, the second valve, the fifth valve, and the seventh valve, and open the third valve, the fourth valve, the sixth valve, and the second delivery pump. The cleaning water enters the internal holes of the workpiece through the third pipe and the first flow channel. The air in the internal holes of the workpiece is discharged into the water tank along the second air pipe. The overflowed cleaning water flows back to the water tank along the second flow channel and the fourth pipe.

[0021] After cleaning, turn off the second delivery pump, open the seventh valve, and perform a second purge to dry the remaining water in the holes and pipes inside the workpiece.

[0022] The device for treating the internal holes of a workpiece in the present invention seals the upper and lower openings of the internal holes of the workpiece through a cover plate and a base, and a liquid flow channel is provided on the base, through which the plating liquid in the plating liquid tank can flow into the internal holes of the workpiece, thereby completing the separate electroplating or oxidation treatment of the internal holes of the workpiece, simplifying the surface treatment process, achieving precise surface treatment of the internal holes of the workpiece, saving the plating liquid and power consumption required for electroplating or oxidation, and being able to perform process treatments such as electroplating or oxidation only on the surface of the internal holes of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic structural diagram of a workpiece internal hole surface treatment device in Embodiment 1 of the present invention;

[0024] Figure 2 It is a schematic diagram of the connection between the workpiece and the first fixing component in Example 1 of the present invention.

[0025] In the figure: 100-power supply, 200-second fixing assembly, 210-electric cylinder, 220-second insulating plate, 230-cover plate, 231-cavity, 300-workpiece, 400-first insulating plate, 410-first bottom plate, 411-protrusion, 420-second bottom plate, 430-second flow channel, 440-first flow channel, 500-electroplating liquid tank, 510-first pipeline, 520-second pipeline, 530-first valve, 540-second valve, 550-first delivery pump, 600-water tank, 6 10-third pipeline, 620-fourth pipeline, 630-third valve, 640-fourth valve, 650-second delivery pump, 700-first air pipe, 710-second air pipe, 720-fifth valve, 730-sixth valve, 800-purge pipeline, 810-seventh valve, 900-first sealing ring, 910-second sealing ring, 920-third sealing ring, 930-first node, 940-second node, 950-third node, 960-fourth node, 970-fifth node. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of the present invention.

[0027] In the description of the present invention, it should be noted that the term "upper" and the like to indicate orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] In the description of the present invention, the terms “first” and “second” are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connect", "set", "install", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0030] The present invention provides a device for treating the surface of internal holes of a workpiece, comprising a power supply, a first fixing component, a second fixing component, and a plating liquid tank. The first fixing component and the second fixing component are respectively in contact with two ends of the workpiece and are used to fix the workpiece and close the openings on both sides of the internal hole of the workpiece. The first fixing component is provided with an anode, and the second fixing component is provided with a cathode. The positive electrode of the power supply is connected to the anode, and the negative electrode is connected to the cathode. The plating liquid tank stores plating liquid. The first fixing component is provided with a liquid flow channel, one end of the liquid flow channel is connected to the plating liquid tank, and the other end is connected to the internal hole of the workpiece. When the power supply is powered on, the plating liquid enters the internal hole of the workpiece, thereby performing surface treatment on the internal hole of the workpiece.

[0031] The present invention also provides a method for treating the surface of a hole inside a workpiece, using the above-mentioned device for treating the surface of a hole inside a workpiece, and the method is as follows:

[0032] The first valve, the first delivery pump, the second valve, and the fifth valve are opened, and the electroplating solution is passed into the internal holes of the workpiece through the first pipe and the first flow channel, and the air in the internal holes of the workpiece is discharged into the electroplating solution tank along the first air pipe, and the overflowed electroplating solution flows back to the electroplating solution tank along the second flow channel and the second pipe;

[0033] Turn on the power supply to electroplate and oxidize the surface of the internal holes of the workpiece;

[0034] After the electroplating and oxidation treatments are completed, the first delivery pump is turned off, the seventh valve is opened, and the first purge is performed to dry the electrolyte remaining in the holes and pipes inside the workpiece;

[0035] Close the first valve, the second valve, the fifth valve, and the seventh valve, and open the third valve, the fourth valve, the sixth valve, and the second delivery pump. The cleaning water enters the internal holes of the workpiece through the third pipe and the first flow channel. The air in the internal holes of the workpiece is discharged into the water tank along the second air pipe. The overflowed cleaning water flows back to the water tank along the second flow channel and the fourth pipe.

[0036] After cleaning, turn off the second delivery pump, open the seventh valve, and perform a second purge to dry the remaining water in the holes and pipes inside the workpiece.

[0037] Example 1

[0038] like Figure 1As shown, this embodiment discloses a surface treatment device for internal holes of a workpiece, comprising a power supply 100, a first fixing component, a second fixing component 200, and a plating liquid tank 500. The first fixing component and the second fixing component 200 are respectively in contact with the two ends of the workpiece 300, and are used to fix the workpiece 300 and close the openings on both sides of the internal hole of the workpiece. An anode is provided on the first fixing component, and a cathode is provided on the second fixing component 200. The positive pole of the power supply 100 is connected to the anode, and the negative pole is connected to the cathode. The power supply 100 adopts a DC power supply 100, which is used to supply power to the anode and the cathode. Plating liquid is stored in the plating liquid tank 500, and a liquid flow channel is provided on the first fixing component. One end of the liquid flow channel is connected to the plating liquid tank 500, and the other end is connected to the internal hole of the workpiece. When the power supply 100 is powered on, the plating liquid enters the internal hole of the workpiece, thereby performing surface treatment such as electroplating or oxidation on the internal hole of the workpiece.

[0039] like Figure 2 As shown, in this embodiment, the first fixing component includes a base and a first insulating plate 400, the base constitutes an anode, the first insulating plate 400 is installed on the top of the base, the workpiece is placed on the first insulating plate 400, and the anode has a protrusion 411, the protrusion 411 extends upward into the internal hole of the workpiece, and the top of the protrusion 411 is lower than the upper opening of the internal hole of the workpiece.

[0040] Specifically, the first insulating plate 400 is a cylindrical structure, and a stepped hole is opened along its axial direction, the stepped hole includes a large diameter section and a small diameter section that are connected to each other, and the large diameter section is located above the small diameter section. The workpiece 300 is also a cylindrical structure, and its internal hole is opened along its axial direction. The bottom of the workpiece 300 overlaps the stepped surface of the stepped hole of the first insulating plate 400, and the small diameter section of the stepped hole is connected to the internal hole of the workpiece.

[0041] Furthermore, the base includes a first bottom plate 410 and a second bottom plate 420 , the first bottom plate 410 is stacked on the second bottom plate 420 , and the protrusion 411 is located at the top center of the first bottom plate 410 and extends upward into the internal hole of the workpiece.

[0042] In this embodiment, two liquid flow channels are provided, namely a first flow channel 440 and a second flow channel 430 . The first flow channel 440 is disposed on the first bottom plate 410 , and the second flow channel 430 is disposed on the second bottom plate 420 .

[0043] like Figure 2As shown, the first flow channel 440 includes a horizontal section and a vertical section, one end of the horizontal section extends outward to the side wall opening of the first bottom plate 410, the bottom end of the vertical section is connected to the horizontal section, and extends upward to the top opening of the first bottom plate 410 (the top opening of the vertical section is arranged at the top of the first bottom plate 410), so as to be connected to the stepped hole in the first insulating plate 400 and the internal hole of the workpiece. The horizontal section of the first flow channel 440 is installed with a quick connector at the side wall opening of the first bottom plate 410, and is connected to the electroplating liquid tank 500 through the first pipe 510, that is, one end of the first pipe 510 is connected to the quick connector at the side wall opening of the first bottom plate 410, and the other end is connected to the electroplating liquid tank 500.

[0044] The second flow channel 430 is located below the first flow channel 440, and also includes a horizontal section and a vertical section. The horizontal section of the second flow channel 430 extends outward to the side wall opening of the second bottom plate 420, and the bottom end of the vertical section is connected to the horizontal section and extends upward through the second bottom plate 420, the first bottom plate 410, and the protrusion 411. The top opening of the vertical section is set at the top of the protrusion 411. The horizontal section of the second flow channel 430 is installed with a quick connector at the side wall opening of the second bottom plate 420, and is connected to the electroplating liquid tank 500 through the second pipe 520, that is, one end of the second pipe 520 is connected to the quick connector at the side wall opening of the second bottom plate 420, and the other end is connected to the electroplating liquid tank 500.

[0045] Furthermore, the first pipe 510 is provided with a first valve 530 and a first delivery pump 550, and the second pipe 520 is provided with a second valve 540. When delivering the plating solution, the first valve 530 and the second valve 540 are opened, and the first delivery pump 550 is turned on. The first delivery pump 550 delivers the plating solution in the plating solution tank 500 along the first pipe 510 and the first flow channel 440 to the internal holes of the workpiece. During the delivery of the plating solution, the liquid level of the plating solution in the internal holes of the workpiece continues to rise until it exceeds the top of the raised portion 411 on the base. The plating solution flows downward along the top opening of the second flow channel 430, and flows out from the opening of the second flow channel 430 on the side wall of the second bottom plate 420, and finally flows back into the plating solution tank 500 through the second pipe 520, thereby completing the circulation of the plating solution. With the continuous operation of the first delivery pump 550, the plating solution circulates continuously between the internal holes of the workpiece and the plating solution tank 500. The power supply 100 is started to supply power to the anode and cathode, thereby completing the electroplating or oxidation treatment only on the surface of the hole inside the workpiece. It is worth noting that the inlet end of the first pipe 510 is located below the liquid level of the electroplating tank 500, and the outlet end of the second pipe 520 is located above the liquid level of the electroplating tank 500.

[0046] In this embodiment, the second fixing assembly 200 includes an electric cylinder 210, a cover plate 230, and a second insulating plate 220. The cover plate 230 constitutes a cathode, and the second insulating plate 220 is fixedly mounted at the output end of the electric cylinder 210 to insulate the cover plate 230 from the electric cylinder 210. The cover plate 230 is fixedly mounted on a side of the second insulating plate 220 away from the electric cylinder 210. The electric cylinder 210 is started to drive the cover plate 230 to move downward, and the cover plate 230 contacts the top of the workpiece and closes the upper opening of the hole inside the workpiece, thereby completing the sealing of the hole inside the workpiece.

[0047] In this embodiment, the workpiece internal hole surface treatment device further includes a water tank 600, in which cleaning water is stored, and the water tank 600 is connected to the first flow channel 440 through a third pipe 610, and is connected to the second flow channel 430 through a fourth pipe 620. The third pipe 610 is provided with a third valve 630 and a second delivery pump 650, and the fourth pipe 620 is provided with a fourth valve 640.

[0048] Specifically, the third pipeline 610 is connected to the first pipeline 510 at a first node 930, and the first node 930 is located between the first valve 530 and the connection between the first pipeline 510 and the first flow channel 440, that is, the first pipeline 510 and the third pipeline 610 have a common section. The fourth pipeline 620 is connected to the second pipeline 520 at a second node 940, and the second node 940 is located between the connection between the second valve 540 and the second pipeline 520 and the second flow channel 430, that is, the second pipeline 520 and the fourth pipeline 620 have a common section.

[0049] In this embodiment, after the surface of the internal hole of the workpiece is subjected to surface treatments such as electroplating and oxidation, the internal hole of the workpiece needs to be cleaned. When cleaning, close the first valve 530, the second valve 540 and the first delivery pump 550, open the third valve 630, the fourth valve 640 and the second delivery pump 650, and the second delivery pump 650 delivers the cleaning water in the water tank 600 along the third pipe 610 and the first flow channel 440 to the internal hole of the workpiece. During the delivery of the cleaning water, the liquid level of the cleaning water in the internal hole of the workpiece continues to rise until it exceeds the top of the raised portion 411 on the base, and the cleaning water flows downward along the top opening of the second flow channel 430, and flows out from the opening of the second flow channel 430 on the side wall of the second bottom plate 420, and finally flows back to the water tank 600 through the fourth pipe 620, thereby completing the circulation of the cleaning water. With the continuous operation of the second delivery pump 650, the cleaning water circulates between the internal hole of the workpiece and the water tank 600 to flush the internal hole of the workpiece. It is worth noting that the inlet end of the third pipe 610 is located below the liquid surface of the water tank 600 , and the outlet end of the fourth pipe 620 is located above the liquid surface of the water tank 600 .

[0050] Furthermore, the surface treatment device for the internal holes of the workpiece also includes an air exhaust component, which includes a first air pipe 700 and a second air pipe 710. A cavity 231 is provided inside the cover plate 230. When the cover plate 230 is pressed against the top of the workpiece, the cavity 231 is connected to the internal holes of the workpiece. One end of the first air pipe 700 passes through the side wall of the cover plate 230 and is connected to the cavity 231 inside it, and the other end is connected to the electroplating liquid tank 500. One end of the second air pipe 710 is connected to the cavity 231, and the other end is connected to the water tank 600. A fifth valve 720 is provided on the first air pipe 700, and a sixth valve 730 is provided on the second air pipe 710.

[0051] Specifically, one end of the second air pipe 710 is connected to the first air pipe 700 at a third node 950 . The third node 950 is located on the first air pipe 700 and between the fifth valve 720 and the cover plate 230 .

[0052] Furthermore, when the plating liquid is transported to the internal holes of the workpiece, the fifth valve 720 needs to be opened at the same time, and the liquid level of the plating liquid in the internal holes of the workpiece gradually rises, thereby squeezing the air inside the internal holes of the workpiece into the cavity 231 on the cover plate 230, and discharged into the plating liquid tank 500 through the first air pipe 700, thereby completing the discharge of air inside the internal holes of the workpiece.

[0053] When cleaning water is delivered to the internal holes of the workpiece, the sixth valve 730 needs to be opened at the same time. The liquid level of the cleaning water in the internal holes of the workpiece gradually rises, thereby squeezing the air inside the internal holes of the workpiece into the cavity 231 on the cover plate 230, and discharged into the water tank 600 through the second air pipe 710, thereby completing the discharge of air inside the internal holes of the workpiece.

[0054] like Figure 1 Specifically, the lower end of the first air pipe 700 is connected to the second pipe 520 at a fourth node 960, and the fourth node 960 is located between the electrolyte tank and the second node 940. The lower end of the second air pipe 710 is connected to the fourth pipe 620 (second pipe 520) at the second node 940.

[0055] Furthermore, the device for treating the surface of the internal holes of the workpiece also includes a purge assembly, which includes a purge pipe 800 and an air storage device. One end of the purge pipe 800 is connected to the air storage device, and the other end is respectively connected to the first air pipe 700 and the second air pipe 710. A seventh valve 810 is provided on the purge pipe 800.

[0056] Specifically, the purge pipe 800 is connected to the first air pipe 700 at the fifth node 970, and the fifth node 970 is located between the third node 950 and the fifth valve 720. After electroplating or oxidation treatment and after washing with cleaning water, the inside of the workpiece hole and the pipe need to be purged and dried.

[0057] After the electroplating and oxidation treatments are completed, the first delivery pump 550 is closed and the seventh valve 810 is opened. At this time, the first valve 530, the second valve 540, and the fifth valve 720 are all in an open state, and the air in the air storage device enters the internal holes of the workpiece along the path of the purge pipeline 800, the fifth node 970, the first air pipe 700, the third node 950, and the internal cavity 231 of the cover plate 230, and the electroplating liquid remaining in the internal holes of the workpiece is transported back to the electroplating liquid tank 500 along the path of the first flow channel 440 and the first pipeline 510. In addition, the air in the air storage device also circulates along the path of the purge pipeline 800, the fifth node 970, the first air pipe 700, the fifth valve 720, the fourth node 960, the second pipeline 520, the second flow channel 430, the internal holes of the workpiece, the cavity 231 of the cover plate 230, and the first air pipe 700 to purge and dry the inside of the workpiece holes and the pipeline.

[0058] After cleaning is completed, the second delivery pump 650 is turned off and the seventh valve 810 is opened. At this time, the third valve 630, the fourth valve 640 and the sixth valve 730 are all in an open state. The air in the air storage device enters the internal holes of the workpiece along the path of the purge pipe 800, the fifth node 970, the first air pipe 700, the third node 950 and the internal cavity 231 of the cover plate 230, and the cleaning water remaining in the internal holes of the workpiece is transported back to the water tank 600 along the path of the first flow channel 440, the first pipe 510, the first node 930 and the third pipe 610. In addition, the air in the air storage device also circulates along the path of the purge pipe 800, the fifth node 970, the first air pipe 700, the third node 950, the second air pipe 710, the sixth valve 730, the second node 940, the second pipe 520, the second flow channel 430, the internal holes of the workpiece, the cavity 231 of the cover plate 230, the first air pipe 700, the third node 950, and the second air pipe 710 to purge and dry the inside of the workpiece holes and the pipes.

[0059] In this embodiment, a first sealing ring 900 is provided between the contact surface between the bottom of the workpiece and the top of the first insulating plate 400, a second sealing ring 910 is provided between the contact surface between the bottom of the first insulating plate 400 and the first bottom plate 410, and a third sealing ring 920 is provided between the contact surfaces between the second bottom plate 420 and the first bottom plate 410, so as to increase the sealing performance of the lower part of the internal hole of the workpiece to ensure that the electrolyte and cleaning water will not leak.

[0060] The first valve 530, the second valve 540, the third valve 630, the fourth valve 640, the fifth valve 720, the sixth valve 730, and the seventh valve 810 of this embodiment are all electric valves, and there are manual valves on the first pipeline 510, the second pipeline 520, the third pipeline 610, the fourth pipeline 620, the first air pipe 700, the second air pipe 710, and the purge pipeline 810 for controlling the corresponding pipelines to close when the electric valves are under maintenance to prevent leakage.

[0061] The device for treating the internal holes of the workpiece in this embodiment seals the upper and lower openings of the internal holes of the workpiece through the cover plate 230 and the base, and a liquid flow channel is provided on the base. The plating liquid in the plating liquid tank 500 can flow into the internal holes of the workpiece through the liquid flow channel, thereby completing the separate electroplating or oxidation treatment of the internal holes of the workpiece, simplifying the surface treatment process, achieving precise surface treatment of the internal holes of the workpiece, saving the plating liquid and power consumption required for electroplating or oxidation, and being able to perform process treatments such as electroplating or oxidation only on the surface of the internal holes of the workpiece.

[0062] In addition, the liquid flow channel is also connected to the water tank 600, so that multiple processes such as electroplating and water washing can be performed on the internal holes of the workpiece at the same workstation, which greatly reduces the equipment and manpower required for the production process.

[0063] Example 2

[0064] This embodiment discloses a method for treating the surface of a hole inside a workpiece using the device for treating the surface of a hole inside a workpiece in Embodiment 1. The method is as follows:

[0065] Open the first valve 530, the first delivery pump 550, the second valve 540, and the fifth valve 720, and the plating solution is passed into the internal holes of the workpiece through the first pipe 510 and the first flow channel 440, and the air in the internal holes of the workpiece is discharged into the plating solution tank 500 along the first air pipe 700, and the overflowed plating solution flows back to the plating solution tank 500 along the second flow channel 430 and the second pipe 520;

[0066] Turn on the power supply 100 to perform electroplating and oxidation treatment on the surface of the inner hole of the workpiece;

[0067] After the electroplating and oxidation treatments are completed, the first delivery pump 550 is turned off, and the seventh valve 810 is opened to perform the first purge to dry the electrolyte remaining in the pores and pipes inside the workpiece;

[0068] The first valve 530, the second valve 540, the fifth valve 720, and the seventh valve 810 are closed, and the third valve 630, the fourth valve 640, the sixth valve 730, and the second delivery pump 650 are opened. The cleaning water enters the internal holes of the workpiece through the third pipe 610 and the first flow channel 440. The air in the internal holes of the workpiece is discharged into the water tank 600 along the second air pipe 710. The overflowed cleaning water flows back to the water tank 600 along the second flow channel 430 and the fourth pipe 620.

[0069] After cleaning is completed, the second delivery pump 650 is turned off, the seventh valve 810 is opened, and a second purge is performed to dry the residual water in the internal holes and pipes of the workpiece.

[0070] Specifically, the workpiece is first placed on the first insulating plate 400, and the base and the first insulating plate 400 together seal the lower opening of the hole inside the workpiece;

[0071] Secondly, the electric cylinder 210 is started, and the electric cylinder 210 drives the second insulating plate 220 and the cover plate 230 to move downward until they are in contact with and squeeze the top of the workpiece, and close the upper opening of the hole inside the workpiece;

[0072] Then open the first valve 530, the second valve 540, and the fifth valve 720, and start the first delivery pump 550, the plating solution passes through the first pipe 510 and the first flow channel 440 into the internal holes of the workpiece, as the liquid level of the plating solution in the internal holes of the workpiece rises, the air in the internal holes of the workpiece is squeezed into the cavity 231 of the cover plate 230, and is discharged into the plating liquid tank 500 along the first air pipe 700, the fifth valve 720, the fourth node 960, and the second pipe; the overflowed plating solution enters the second flow channel 430 from the top opening of the second flow channel 430 (the top opening of the protrusion 411), and flows back to the plating liquid tank 500 along the second flow channel 430 and the second pipe 520, thereby completing the circulation of the plating solution, and as the first delivery pump 550 continues to operate, the plating solution continues to circulate between the internal holes of the workpiece and the plating liquid tank 500;

[0073] The power source 100 is started to supply power to the anode and the cathode, thereby completing the electroplating or oxidation treatment only on the surface of the hole inside the workpiece;

[0074] Then, the first delivery pump 550 is turned off, the seventh valve 810 is opened, and the first purge is performed. At this time, the first valve 530, the second valve 540, and the fifth valve 720 are all in the open state, and the air in the air storage device enters the internal holes of the workpiece along the path of the purge pipeline 800, the fifth node 970, the first air pipe 700, the third node 950, and the internal cavity 231 of the cover plate 230, and the electroplating liquid remaining in the internal holes of the workpiece is transported back to the electroplating liquid tank 500 along the path of the first flow channel 440 and the first pipeline 510. In addition, the air in the air storage device also circulates along the path of the purge pipeline 800, the fifth node 970, the first air pipe 700, the fifth valve 720, the fourth node 960, the second pipeline 520, the second flow channel 430, the internal holes of the workpiece, the cavity 231 of the cover plate 230, and the first air pipe 700 to purge and dry the inside of the workpiece hole and the pipeline;

[0075] After that, water washing is performed again, the first valve 530, the second valve 540, the fifth valve 720 and the first delivery pump 550 are closed, and the third valve 630, the fourth valve 640, the sixth valve 730 and the second delivery pump 650 are opened. The second delivery pump 650 delivers the cleaning water in the water tank 600 along the third pipe 610 and the first flow channel 440 to the internal holes of the workpiece. As the liquid level of the cleaning water in the internal holes of the workpiece rises, the air in the internal holes of the workpiece is squeezed into the cavity 231 of the cover plate 230 and flows along the first air pipe 700, the third valve 630, the second air pipe 710, the sixth valve 730, the second node 94. 0. The fourth pipe 620 is discharged into the water tank 600; during the delivery process of the cleaning water, the liquid level of the cleaning water in the internal holes of the workpiece continues to rise until it exceeds the top of the raised portion 411 on the base, and the cleaning water flows downward along the top opening of the second flow channel 430, and flows out from the opening of the second flow channel 430 on the side wall of the second bottom plate 420, and finally flows back to the water tank 600 through the second pipe 520, the second node 940, and the fourth pipe 620, thereby completing the circulation of the cleaning water. With the continuous operation of the second delivery pump 650, the cleaning water circulates continuously between the internal holes of the workpiece and the water tank 600 to flush the internal holes of the workpiece;

[0076] After cleaning is completed, the second delivery pump 650 is turned off, the seventh valve 810 is opened, and the second purge is performed. At this time, the third valve 630, the fourth valve 640, and the sixth valve 730 are all in an open state. The air in the air storage device enters the internal holes of the workpiece along the path of the purge pipeline 800, the fifth node 970, the first air pipe 700, the third node 950, and the internal cavity 231 of the cover plate 230, and the cleaning water remaining in the internal holes of the workpiece is transported back to the water tank 600 along the path of the first flow channel 440, the first pipeline 510, the first node 930, and the third pipeline 610. In addition, the air in the air storage device also circulates along the path of the purge pipe 800, the fifth node 970, the first air pipe 700, the third node 950, the second air pipe 710, the sixth valve 730, the second node 940, the second pipe 520, the second flow channel 430, the internal holes of the workpiece, the cavity 231 of the cover plate 230, the first air pipe 700, the third node 950, and the second air pipe 710 to purge and dry the inside of the workpiece holes and the pipes.

[0077] In the method for surface treatment of internal holes in a workpiece in this embodiment, the plating liquid flows into the internal holes of the workpiece through the liquid flow channel, thereby completing separate electroplating or oxidation treatment of the internal holes of the workpiece, thereby completing separate electroplating or oxidation treatment of the internal holes of the workpiece, simplifying the surface treatment process, and achieving precise surface treatment of the internal holes of the workpiece.

[0078] In addition, the liquid flow channel is also connected to the water tank 600, so that multiple processes such as electroplating and water washing can be performed on the internal holes of the workpiece at the same workstation, which greatly reduces the equipment and manpower required for the production process.

[0079] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A device for treating the surface of internal holes of a workpiece, characterized in that: It comprises a power source (100), a first fixing component, a second fixing component (200), and an electroplating liquid tank (500). The first fixing assembly and the second fixing assembly (200) are respectively in contact with two ends of the workpiece (300) and are used to fix the workpiece (300) and close the openings on both sides of the hole inside the workpiece. The first fixing component is provided with an anode, the second fixing component (200) is provided with a cathode, the positive electrode of the power source (100) is connected to the anode, and the negative electrode is connected to the cathode. The electroplating liquid tank (500) stores electroplating liquid, and the first fixed component is provided with a liquid flow channel, one end of the liquid flow channel is connected to the electroplating liquid tank (500), and the other end is connected to the internal hole of the workpiece. When the power source (100) is powered on, the electroplating solution enters the internal holes of the workpiece, thereby performing surface treatment on the internal holes of the workpiece.

2. The workpiece internal hole surface treatment device according to claim 1, characterized in that: The first fixing assembly comprises a base and a first insulating plate (400), wherein the base constitutes the anode, the first insulating plate (400) is mounted on the top of the base, and the workpiece is placed on the first insulating plate (400). The anode has a protrusion (411), the protrusion (411) extends upward into the hole inside the workpiece, and the top of the protrusion (411) is lower than the upper opening of the hole inside the workpiece.

3. The workpiece internal hole surface treatment device according to claim 2, characterized in that: The second fixing assembly (200) comprises an electric cylinder (210), a cover plate (230) and a second insulating plate (220). The cover plate (230) constitutes the cathode, The second insulating plate (220) is fixedly mounted on the output end of the electric cylinder (210), and the cover plate (230) is fixedly mounted on a side of the second insulating plate (220) away from the electric cylinder (210). When the electric cylinder (210) is started, the cover plate (230) is driven to move downward, and the cover plate (230) contacts the top of the workpiece (300) and closes the upper opening of the hole inside the workpiece.

4. The workpiece internal hole surface treatment device according to claim 3, characterized in that: The liquid flow channels are provided with two, namely a first flow channel (440) and a second flow channel (430). The first flow channel (440) and the second flow channel (430) are both arranged in the base, one end of the first flow channel (440) is opened at the top of the base and communicates with the bottom of the hole inside the workpiece, and the other end of the first flow channel (440) is communicated with the electroplating liquid tank (500) through a first pipe (510). One end of the second flow channel (430) is opened and arranged at the top of the protruding portion (411), and the other end is connected to the electroplating liquid tank (500) through a second pipe (520).

5. The workpiece internal hole surface treatment device according to claim 4, characterized in that: It also includes a water tank (600), in which washing water is stored. The water tank (600) is connected to the first flow channel (440) through a third pipe (610), and is connected to the second flow channel (430) through a fourth pipe (620).

6. The workpiece internal hole surface treatment device according to claim 5, characterized in that: The first pipeline (510) is provided with a first valve (530) and a first delivery pump (550), the second pipeline (520) is provided with a second valve (540), the third pipeline (610) is provided with a third valve (630) and a second delivery pump (650), and the fourth pipeline (620) is provided with a fourth valve (640).

7. The workpiece internal hole surface treatment device according to claim 6, characterized in that: Also included is an air exhaust assembly, the air exhaust assembly comprising a first air pipe (700) and a second air pipe (710), The cover plate (230) is provided with a cavity (231) inside, and the cavity (231) is communicated with the internal hole of the workpiece. One end of the first air pipe (700) is connected to the cavity (231), and the other end is connected to the electroplating liquid tank (500); one end of the second air pipe (710) is connected to the cavity (231), and the other end is connected to the water tank (600). The first air pipe (700) is provided with a fifth valve (720), and the second air pipe (710) is provided with a sixth valve (730).

8. The workpiece internal hole surface treatment device according to claim 7, characterized in that: Also included is a purge assembly, the purge assembly comprising a purge pipeline (800) and an air storage device, One end of the purge pipeline (800) is connected to the air storage device, and the other end is respectively connected to the first air pipe (700) and the second air pipe (710). A seventh valve (810) is provided on the purge pipeline (800).

9. The workpiece internal hole surface treatment device according to claim 2, characterized in that: A first sealing ring (900) is provided between the workpiece (300) and the first insulating plate (400), and a second sealing ring (910) is provided between the first insulating plate (400) and the base.

10. A method for surface treatment of internal holes of a workpiece, characterized in that: The device for treating the surface of internal holes of a workpiece according to claim 8 is used, and the method is as follows: The first valve (530), the first delivery pump (550), the second valve (540), and the fifth valve (720) are opened, and the electroplating solution is passed into the internal holes of the workpiece through the first pipe (510) and the first flow channel (440), and the air in the internal holes of the workpiece is discharged into the electroplating solution tank (500) along the first air pipe (700), and the overflowed electroplating solution flows back to the electroplating solution tank (500) along the second flow channel (430) and the second pipe (520); Turning on the power supply (100) to conduct electroplating and oxidation treatment on the surface of the inner hole of the workpiece; After the electroplating and oxidation treatments are completed, the first delivery pump (550) is turned off, the seventh valve (810) is opened, and the first purge is performed to dry the electrolyte remaining in the pores and pipes inside the workpiece; The first valve (530), the second valve (540), the fifth valve (720), and the seventh valve (810) are closed, and the third valve (630), the fourth valve (640), the sixth valve (730), and the second delivery pump (650) are opened, and the cleaning water enters the internal holes of the workpiece through the third pipe (610) and the first flow channel (440), and the air in the internal holes of the workpiece is discharged into the water tank (600) along the second air pipe (710), and the overflowed cleaning water flows back to the water tank (600) along the second flow channel (430) and the fourth pipe (620); After cleaning is completed, the second delivery pump (650) is turned off, the seventh valve (810) is opened, and a second purge is performed to dry the water remaining in the internal holes and pipes of the workpiece.

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