Efficient heat dissipation vapor chamber with micro protrusions, manufacturing method and heat dissipation system

By designing a highly efficient heat dissipation and heat dissipation plate with micro-protrusions in thin and light notebooks and other communication equipment, using a composite structure liquid absorbing core and gas-liquid circulation system, the problem of limited performance improvement space for traditional heat dissipation solutions is solved, and efficient chip heat dissipation effect is achieved.

CN119803136AActive Publication Date: 2025-04-11SOUTH CHINA UNIV OF TECH +1
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Patent Information

Application Number
CN202510078811.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-17
Publication Date
2025-04-11
Estimated Expiration
2045-01-17

AI Technical Summary

Technical Problem

It is difficult to design efficient heat dissipation and heat dissipation plates in thin and light notebooks and other communication equipment in the prior art, especially when the chip power increases, the performance room for traditional heat dissipation solutions is limited.

Method used

The shell consisting of a micro-protruding cover plate and bottom plate is adopted, combined with the heat-generating heat source CPU, heat-dissipating fins, heat-dissipating fan and internal liquid-absorbing core, and the composite structure liquid-absorbing core of the planar wire mesh and spiral braided mesh is designed to efficiently dissipate heat using the gas-liquid circulation system of deionized water.

Benefits of technology

The thermal conductivity and thermal resistance reduction ability of the heat-smoothing plate are improved, so that the chip can effectively dissipate heat in a short time and meet the working needs of high-power chips.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides an efficient heat dissipation vapor chamber with micro-bulges and a manufacturing method, and the vapor chamber comprises a shell composed of a micro-bulge cover plate and a bottom plate, and a first plane silk screen and a first spiral woven net which are sintered together with the cover plate, the second plane silk screen and the second spiral woven net which are sintered together with the bottom plate, the powder ring and the supporting column which are connected with the first plane silk screen and the second plane silk screen, the vapor chamber cover plate and the bottom plate are all made of JCC materials, and it is guaranteed that the plate does not sink after diffusion welding; a spiral woven mesh and a planar silk screen composite liquid absorption core are integrally sintered, and a laser cutting method is adopted, so that the position of the spiral woven mesh on the planar silk screen can be well ensured, and interference between the spiral woven mesh and a copper column is avoided; welding fins are arranged on the bottom plate. In addition, the whole heat dissipation system is further provided with a centrifugal fan. The vapor chamber has the advantages of being high in heat conductivity coefficient, small in heat resistance and resistant to adverse gravity, and heat of a CPU can be transmitted to the cooling fins in a short time for heat dissipation.
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Description

Technical Field

[0001] The present invention relates to the field of chip heat dissipation, and in particular to a heat spreader with micro-protrusions and high-efficiency heat dissipation, and a manufacturing method thereof. Background Art

[0002] With the rapid development of the Internet industry, laptops and other communication equipment are moving towards being lighter, thinner and smaller. However, the increase in chip power causes the chips to generate a larger heat flux density when laptops and other communication equipment are running, resulting in excessive chip temperature, loss of frequency and overclocking. Therefore, heat dissipation becomes particularly important.

[0003] Traditional laptops and other communication equipment use multiple flattened heat pipes to dissipate heat from chips through a segmented composite liquid-wick structure, but the performance improvement space for this cooling solution has gradually reached its peak. Currently, some gaming laptops use vapor chambers for heat dissipation, but the width of the condensation end of thin and light laptops and other communication equipment is limited, making it difficult to design an efficient heat dissipation vapor chamber. However, with the development of the Internet and the increase in chip power, it has become a focus to develop efficient heat dissipation vapor chambers suitable for thin and light laptops and electronic equipment. Summary of the invention

[0004] In order to improve multiple technical problems, the present invention provides a heat spreader with micro-protrusions and an efficient heat dissipation method. From the perspective of heat dissipation, the heat spreader with micro-protrusions and an efficient heat dissipation method has high thermal conductivity and low thermal resistance. The heat of the chip can be introduced into the heat dissipation fins and dissipated in a short time, so that the high-power chip can meet the working range.

[0005] A heat spreader with micro-protrusions and high efficiency heat dissipation, comprising a shell composed of a cover plate with micro-protrusions and a bottom plate, a support column as a support, a heat source CPU, heat dissipation fins, a heat dissipation fan and an internal liquid absorption core;

[0006] The internal liquid-absorbing core comprises: a first plane screen and a first spiral woven screen sintered with the cover plate, a second plane screen and a second spiral woven screen sintered with the bottom plate, and a powder ring connected with the first plane screen and the second plane screen;

[0007] The working fluid inside the heat spreader is deionized water. When the heat source CPU is working, the heat generated is transferred to the second plane screen and the second spiral woven screen at the evaporation end through heat conduction. The deionized water around the second plane screen and the second spiral woven screen evaporates and absorbs heat to become gas. The gas flows to the condensation end under the action of pressure. Under the action of the cooling fan, the cooling fins and the micro-protrusions perform forced convection heat exchange with the air to reduce the temperature of the cover plate and the bottom plate. At this time, the gas releases heat and liquefies into liquid. Part of the liquid flows to the cover plate liquid absorption core under the action of gravity, and the other part flows to the cover plate liquid absorption core. The liquid flows to the evaporation end under the capillary force of the spiral woven screen and the plane screen. The working fluid at the bottom plate flows into the cover plate through the powder ring at the evaporation end for further heat exchange, thereby forming a gas-liquid circulation.

[0008] The width of the flat screen at the condensation end is 8mm.

[0009] The first flat wire mesh adopts a 100 mesh wire mesh structure, the first spiral woven mesh is woven with a mixed wire diameter of 0.04mm and 0.05mm, and the width and height are 1.1mm and 0.19mm respectively; the second flat wire mesh adopts a two-layer wire mesh structure of 300 mesh + 100 mesh, and the second spiral woven mesh is woven with a wire diameter of 0.04mm, and the width and height are 2mm and 0.24mm respectively; the wire diameter of the 300 mesh wire mesh is 0.03mm, and the wire diameter of the 100 mesh is 0.05mm.

[0010] The first and second planar wire meshes at the evaporation end are provided with sintered copper powder.

[0011] The diameter of the support column is 2 mm, and the distance between the center of the support column and the two ends of the flat screen at the condensation end is 3 mm.

[0012] The bottom plate has a thickness of 0.25 mm, the base plate of the cover plate has a thickness of 0.25 mm, the convex thickness of the cover plate has a thickness of 0.35 mm, and the materials used are JCC materials.

[0013] A method for manufacturing a heat spreader with micro-protrusions and high-efficiency heat dissipation, the steps are as follows:

[0014] a) Processing cover plate, base plate and heat dissipation fins;

[0015] b) placing the spiral woven mesh into the groove of the annealing graphite mold for annealing and cooling to room temperature;

[0016] c) sintering the flat screen and the copper powder in one piece;

[0017] d) placing the spiral woven mesh into the groove of the first welded mesh graphite mold and sintering it with the copper powder composite flat wire mesh to form an integrated liquid wick;

[0018] e) Cutting the sintered product into the required shape using laser;

[0019] f) The one-piece sintered wire mesh is fixed on the bottom plate and the cover plate;

[0020] g) placing the support column in the circular groove of the second welded mesh graphite mold, pressing it on the cover plate with the integral sintered wick, and placing it for resistance welding for sintering;

[0021] h) The bottom plate and the integrated sintered liquid wick are sintered by resistance welding of two rectangular graphite blocks;

[0022] i) Place the powder ring on some copper columns and rivet the upper and lower cover plates together;

[0023] j) placing the riveted soaking plate under the first diffusion welding graphite mold and the second diffusion welding graphite mold to be welded into one;

[0024] k) Welding the liquid filling port of the heat spreader into one piece, annealing, and the first vacuuming process to make the vacuum degree inside the heat spreader reach 30Pa~40Pa;

[0025] l) The second degassing process uses a 120°C baking pan to heat the vapor chamber, so that the non-condensable gas inside the vapor chamber gathers in the liquid injection tube. The liquid injection tube is precisely cut to further reduce the non-condensable gas inside the vapor chamber, so that the vacuum degree inside the vapor chamber reaches 0.01Pa~0.001Pa;

[0026] m) Perform sealing welding on the cut position of the injection tube connected to the soaking plate;

[0027] n) Solder the heat spreader and the heat sink fins.

[0028] The specific operation steps of steps d) and e) are as follows:

[0029] Step 1: Cut the flat screen into a square shape and place it on the square graphite. Use the first welded screen graphite mold with grooves to clamp and fix the annealed spiral woven screen and press it on the square flat screen. Put it into the vacuum sintering furnace with the flat screen under the woven screen. Before heating, evacuate the inner cavity of the sintering furnace and then fill it with protective gas, 95% N2 and 5% H2, and then heat it to 900℃ and keep it constant for 1 hour.

[0030] Step 2: After sintering, the contact position of the woven mesh and the flat wire mesh is slightly melted at high temperature and connected together. After cooling, the square graphite, flat wire mesh, the first spiral woven mesh and the first welded mesh graphite mold are placed integrally in the aluminum profile fixture fixed under the laser, and a laser route is set in the laser system to perform laser cutting to finally form an integral sintered liquid-absorbing core.

[0031] The depth of the second groove of the first welded mesh graphite mold and the first groove of the second welded mesh graphite mold are both H. The method to determine the value of H is:

[0032] The resistance welding pressure is set to P, the surface area of ​​the bottom plate is A, then the pressure on the bottom plate is: F = P·A

[0033] The thickness of the bottom plate or cover plate is L0. Under the pressure of resistance welding, the bottom plate is compressed by △L.

[0034] According to the knowledge of material mechanics, in order to reflect the degree of axial deformation of the tension and compression rods, the linear strain ε is defined as:

[0035]

[0036] According to Hooke's law, the linear strain ε of the axial section is proportional to the normal stress σ on the section, that is,

[0037]

[0038] From, here the pressure P = σ, then

[0039]

[0040] According to the above formulas (1), (2) and (3), we can get:

[0041]

[0042] Assume the thickness of the spiral mesh is H 1, In order to avoid the capillary capacity of the spiral woven mesh, the strip groove depth H should be:

[0043] H=△L+H1

[0044] The second diffusion welding graphite mold is provided with a groove, and the depth of the groove is 1 mm.

[0045] Avoid interference with micro-protrusions with the cover plate.

[0046] Compared with the prior art, the present invention has the following beneficial effects:

[0047] The present invention provides a heat spreader with micro-protrusions and high-efficiency heat dissipation and a manufacturing method. Compared with the existing technology, the heat spreader and the heat dissipation system have the following advantages:

[0048] (1) A heat spreader with micro-protrusions and efficient heat dissipation is proposed. A cover plate and a bottom plate are both made of a flat wire mesh, a spiral woven mesh and copper powder. The three-in-one composite structure liquid absorption core design can effectively solve the problem of gas-liquid reflux in the narrow space inside the evaporation end of the heat spreader, and greatly improve the thermal conductivity of the heat spreader.

[0049] (2) The heat spreader has micro-bumps for efficient heat dissipation. Fins are welded on one side of the heat spreader and small micro-bumps are provided on the other side. The fins and micro-bumps effectively help cool the heat spreader, allowing the gas at the evaporation end of the heat spreader to quickly liquefy into liquid, thereby speeding up the gas-liquid phase change and reflux speed of the heat spreader, further improving the thermal conductivity of the heat spreader.

[0050] (3) The manufacturing method of the heat spreader with micro-protrusions and high-efficiency heat dissipation proposes a method for manufacturing an integrated sintered liquid wick and a calculation method for grooving a graphite mold, which can effectively ensure the good capillary performance of the internal liquid wick. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is an overall exploded view of the heat spreader and the heat dissipation system according to the embodiment of the present invention.

[0052] Figure 2 The figure is an exploded view of a heat spreader according to an embodiment of the present invention.

[0053] Figure 3 It is a three-dimensional diagram of an embodiment provided by the present invention having a microstructured cover.

[0054] Figure 4 The embodiment provided by the present invention Figure 3 A partial enlarged view.

[0055] Figure 5 This is a schematic diagram of the material of the present invention causing slight deformation when subjected to bending moment;

[0056] Figure 6 This is an embodiment of the present invention providing a planar screen and a spiral woven screen placed in a graphite mold for blasting.

[0057] Figure 7 It is a three-dimensional view of the laser-cut one-piece sintered liquid-absorbing core provided in an embodiment of the present invention.

[0058] Figure 8 This is a view of the first welded mesh graphite mold according to an embodiment of the present invention.

[0059] Fig. 9 This is a view of fixing an aluminum profile according to an embodiment of the present invention.

[0060] Fig.10 It is an exploded view of the sintering of the bottom plate, the integrated sintered liquid wick and the support column according to the embodiment of the present invention.

[0061] Fig.11 This is a view of a second graphite mold according to an embodiment of the present invention.

[0062] Fig.12 It is a three-dimensional view of the second plane screen, the second spiral woven screen support column, and the powder ring sintered together with the base plate in the embodiment provided by the present invention.

[0063] Fig.13 The embodiment provided by the present invention Fig.12 A partial enlarged view of point B.

[0064] Fig.14 This is a three-dimensional view of the first plane screen, the first spiral woven screen and the cover plate sintered into one piece in the embodiment provided by the present invention.

[0065] Fig.15 The invention provides an embodiment in which a flat wire mesh and a spiral woven mesh are sintered into an integrated sintered liquid absorbent core.

[0066] Fig.16 It is an explosion view of the diffusion welding of the heat spreader provided in the embodiment of the present invention.

[0067] Fig.17 This is a view of an annealed graphite mold according to an embodiment of the present invention.

[0068] Fig.18 This is a view of a second diffusion welding graphite mold provided by the present invention.

[0069] Fig.19 This is a view of the specific positions of the evaporation end and the condensation end of the heat spreader provided by the present invention.

[0070] Fig. 20 1 is a microscope view of a spiral woven mesh and a flat wire mesh according to an embodiment of the present invention.

[0071] Fig.21 This is a microscope view of a flat screen and a flat screen composite copper powder according to an embodiment of the present invention.

[0072] The specific markings in the figure are as follows:

[0073] 101, cover plate, 102, first plane screen, 103, first spiral woven screen, 104, powder ring, 105, support column, 106, second spiral woven screen, 107, second plane screen, 108, bottom plate, 109, CPU, 1010, heat sink fin, 1011, heat sink fan, 201, square graphite, 202, square plane screen, 203, first welded mesh graphite mold, 204, aluminum profile fixing device, 2 05, laser head, 206, second welding mesh graphite mold, 207, first diffusion welding graphite mold, 208, second diffusion welding graphite mold, 209, annealing graphite mold, 301, aluminum profile fixing device mounting hole, 302, integrated sintered liquid absorption core, 303, evaporation end, 304, condensation end, 401, circular groove, 402, micro protrusion, 403 substrate, 501, first strip groove, 502 second strip groove, 601, groove DETAILED DESCRIPTION

[0074] The present invention is described in detail below in conjunction with the embodiments and drawings, but it should be understood that the embodiments and drawings are only used to exemplify the present invention and do not constitute any limitation on the protection scope of the present invention. All reasonable changes and combinations within the scope of the inventive concept of the present invention fall within the protection scope of the present invention.

[0075] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "set", "install", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0076] The present invention will be further described below in conjunction with the accompanying drawings.

[0077] Embodiment 1

[0078] like Figure 1 and Figure 2 As shown, a micro-protrusion high-efficiency heat dissipation vapor chamber comprises a shell composed of a cover plate 101 with micro-protrusions 402 and a bottom plate 108, a support column 105 as a support, a heat source CPU 109, a heat dissipation fin 1010 and a heat dissipation fan 1011, and an internal liquid wick; the internal liquid wick structure comprises a sintered cover plate as shown in FIG. Fig. 20 A first planar screen 102 and a first spiral woven screen 103, a second planar screen 107 and a second spiral woven screen 106 sintered together with the bottom plate, and a powder ring 104 connected to the first planar screen 102 and the second planar screen 107;

[0079] The working fluid inside the heat plate is deionized water. When the heat source CPU109 is working, the heat generated is transferred to the heat source through heat conduction. Fig.19As shown, the second plane screen 107 and the second spiral woven screen 106 are at the evaporation end 303. The deionized water around the second plane screen 107 and the second spiral woven screen 106 evaporates and absorbs heat to become gas. The gas flows to the condensation end 304 under the action of pressure. Under the action of the cooling fan 1011, the cooling fins 1011 and the micro-protrusions 402 perform forced convection heat exchange with the air to reduce the temperature of the cover plate and the bottom plate. At this time, the gas releases heat and liquefies into liquid. Part of the liquid flows to the liquid absorption core of the cover plate 101 under the action of gravity, and the other part flows to the liquid absorption core of the cover plate 108. The liquid flows to the evaporation end 303 under the capillary force of the spiral woven screen and the plane screen. The working fluid at the bottom plate flows into the cover plate 101 through the powder ring at the evaporation end 303 for further heat exchange, thereby forming a gas-liquid cycle.

[0080] The spiral woven mesh has a large axial capillary force, which can effectively bring the working fluid from one side to the other side, and the flat screen can diffuse the working fluid to the surroundings. Therefore, the flat screen and the spiral woven mesh composite liquid wick can well solve the problem of quickly bringing the liquid to the evaporation end 303 in the narrow flow channel of the condensation end 304; the 300-mesh flat screen has a smaller aperture, and the 100-mesh flat screen has a larger aperture. The knot of the 300-mesh and 100-mesh double-layer screens forms a V-shaped aperture shape, which is conducive to bubble separation, and the bottom plate 108 is in contact with the heat source. The second flat screen 107 adopts a 300-mesh + 100-mesh two-layer screen structure. The permeability of the 100-mesh flat screen is higher than that of the 300-mesh flat screen, and the gas channel is larger, the gas resistance is smaller, and the gas flow rate is faster, which is conducive to reducing thermal resistance. Therefore, the first flat screen 102 only uses a 100-mesh flat screen, the wire diameter of the 300-mesh screen is 0.03mm, and the wire diameter of the 100-mesh screen is 0.05mm. The first spiral braided mesh 103 is made of mixed wire diameters of 0.04mm and 0.05mm, and the width and height are 1.1mm and 0.19mm respectively. The second spiral braided mesh 106 is made of wire diameters of 0.04mm, and the width and height are 2mm and 0.24mm respectively. Due to the limited position, there is no powder ring distribution at the condensation end 304, and there is sintered copper powder on the flat wire mesh at the evaporation end 303, such as Fig.21 .

[0081] like Figure 3 and Figure 4 As shown, the bottom plate 108 has a thickness of 0.25 mm, the base plate of the cover plate 101 has a thickness of 0.25 mm, the micro protrusion 402 of the cover plate 101 has a thickness of 0.35 mm, and the materials are all JCC materials.

[0082] When the vapor chamber is placed in a diffusion welding furnace and the upper and lower covers are welded, the gas inside the vapor chamber will flow out from the inside of the vapor chamber after being heated, causing the internal air pressure to decrease. Due to the difference in air pressure inside the vapor chamber and outside, a uniform load is generated on the upper and lower covers of the vapor chamber, so the plate will generate a bending moment Me ,like Figure 5 As shown, the material will produce a small deformation when subjected to bending moment, and the deformation curvature formula is:

[0083]

[0084] Where: ρ is the radius of the material after bending, and E is the elastic modulus.

[0085] Assume that the cross-section of the heat spreader cover and bottom plate is rectangular, with a thickness of h and a width of b. z The formula is:

[0086]

[0087] Compared with oxygen-free copper C1020, JCC material has alloy elements added to increase the complexity of the alloy lattice structure. Therefore, the hardness and elastic modulus of JCC material are higher than those of oxygen-free copper C1020 material. Assuming that the shape and size of the plate are the same, the above formula M e and I z Similarly, the larger the elastic modulus E, the larger the radius ρ of the material after deformation, and the less obvious the deformation. Therefore, in the case of thinner plates, JCC material is less likely to be dented after diffusion welding than oxygen-free copper C1020 material.

[0088] Embodiment 2 The present invention also provides a method for manufacturing a heat spreader with micro-protrusions and high-efficiency heat dissipation, the steps of which are as follows:

[0089] a) Processing the cover plate 101, the bottom plate 108, and the heat dissipation fins 1010;

[0090] b) Place the spiral woven mesh into Fig.17 Annealing is performed in the groove of the annealing graphite mold 209 and cooled to room temperature;

[0091] c) sintering the flat screen and the copper powder in one piece;

[0092] d) placing the spiral woven mesh into the groove of the first welded mesh graphite mold 203 and sintering it with the copper powder composite flat wire mesh to form an integrated liquid wick;

[0093] e) Cutting the sintered product into the required shape using laser;

[0094] f) An integrally sintered wire mesh is fixed on the bottom plate 108 and the cover plate 101;

[0095] g) placing the support column 105 in the circular groove 401 of the second graphite mold 206, pressing it on the cover plate with the integral sintered wick, and placing it for resistance welding to sinter, such as Fig.10 ;

[0096] h) The bottom plate 101 and the integrated sintered liquid wick are sintered by resistance welding using two rectangular graphite blocks;

[0097] i) Place the powder ring on some copper columns and rivet the upper and lower cover plates together;

[0098] j) The riveted heat sink is placed under the first diffusion welding graphite mold 207 and the second diffusion welding graphite mold 208 to be welded into one body, such as Fig.16 ;

[0099] k) Welding the liquid filling port of the heat spreader into one piece, annealing, and the first vacuuming process to make the vacuum degree inside the heat spreader reach 30Pa~40Pa;

[0100] l) The second degassing process uses a 120°C baking pan to heat the vapor chamber, so that the non-condensable gas inside the vapor chamber gathers in the liquid injection tube. The liquid injection tube is precisely cut to further reduce the non-condensable gas inside the vapor chamber, so that the vacuum degree inside the vapor chamber reaches 0.01Pa~0.001Pa;

[0101] m) Perform sealing welding on the cut position of the injection tube connected to the soaking plate;

[0102] n) Soldering the heat spreader and the heat sink fins 204.

[0103] like Figure 6 , Figure 7 As shown, the specific operation steps of steps d) and e) are as follows:

[0104] Step 1: Cut the flat screen 202 into a square shape and place it on the square graphite 201, and use Figure 8 The first welded mesh graphite mold 203 with grooves shown clamps and fixes the annealed spiral woven mesh 103, and presses it on the square flat wire mesh 202, and puts it into a vacuum sintering furnace, with the flat wire mesh under the woven mesh. Before heating, the inner cavity of the sintering furnace is evacuated and then filled with protective gas, 95% N2 and 5% H2, and then heated to 900℃ and kept at a constant temperature for 1 hour;

[0105] Step 2: The sintered woven mesh and the flat screen are slightly melted at the contact position at high temperature and connected together. After cooling, the square graphite 201, the square flat screen 202, the spiral woven mesh 103 and the first welded mesh graphite mold 203 are integrally placed under the laser and fixed as follows: Fig. 9 In the aluminum profile fixing device 204 shown in the figure, a laser route is set in the laser system to perform laser cutting, and finally form an integrated sintered liquid absorbent core 302, as shown in FIG. Fig.15 shown.

[0106] according to Figure 8 and Fig.11As shown, the depth of the second groove 502 of the first welding mesh graphite mold 203 and the first groove 501 of the second welding mesh graphite mold 206 are both H. The method for determining the value of H is as follows:

[0107] The resistance welding pressure is set to P, the surface area of ​​the bottom plate is A, then the pressure on the bottom plate is: F = P·A

[0108] The thickness of the bottom plate 101 or the cover plate 108 is L0. Under the resistance welding pressure, the bottom plate is compressed by △L.

[0109] According to the knowledge of material mechanics, in order to reflect the degree of axial deformation of the tension and compression rods, the linear strain ε is defined as:

[0110]

[0111] According to Hooke's law, the linear strain ε of the axial section is proportional to the normal stress σ on the section, that is:

[0112]

[0113] From, here the pressure P = σ, then:

[0114]

[0115] According to the above formulas (1), (2) and (3), we can get:

[0116]

[0117] Assume the thickness of the spiral mesh is H 1, In order to avoid the capillary capacity of the spiral woven mesh, the strip groove depth H should be:

[0118] H=△L+H1

[0119] like Fig.18 As shown, the second diffusion welding graphite mold 208 is provided with a groove 601 , and the depth of the groove 601 is 1 mm to avoid interference with the micro protrusion 402 of the cover plate 101 .

[0120] The above embodiments are only preferred implementations of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A heat spreader with micro-protrusions and high efficiency heat dissipation, characterized in that: The housing comprises a cover plate (101) and a bottom plate (108), a support column (105) as a support, a heat source CPU (109), heat dissipation fins (1010), a heat dissipation fan (1011) and an internal liquid absorption core; the cover plate (101) is provided with a micro-protrusion (402); The internal liquid-absorbing core comprises: a first plane screen (102) and a first spiral woven screen (103) sintered together with the cover plate (101), a second plane screen (107) and a second spiral woven screen (106) sintered together with the bottom plate (108), and a powder ring (104) connected to the first plane screen (102) and the second plane screen (107); The working medium inside the heat spreader is deionized water. When the heat source CPU (109) is working, the heat generated is transferred to the second plane screen (107) and the second spiral woven screen (106) at the evaporation end (303) by heat conduction. The deionized water around the second plane screen (107) and the second spiral woven screen (106) evaporates and absorbs heat to become gas. The gas flows to the condensation end (304) under the action of the heat dissipation fan (1011). The heat dissipation fins (1011) and the micro-protrusions (40 2) Forced convection heat exchange is performed with the air to reduce the temperature of the cover plate and the bottom plate. At this time, the gas releases heat and liquefies into liquid. A part of the liquid flows to the liquid wick of the cover plate (101) under the action of gravity, and the other part flows to the liquid wick of the cover plate (108). The liquid flows to the evaporation end (303) under the capillary force of the spiral woven mesh and the flat wire mesh. The working fluid at the bottom plate (108) flows into the cover plate (101) through the powder ring at the evaporation end (303) for further heat exchange, thereby forming a gas-liquid cycle.

2. According to claim 1, a heat spreader with micro-protrusions and high efficiency heat dissipation, characterized in that: The width of the flat screen at the condensation end (304) is 8 mm.

3. The heat spreader with micro-protrusions and high efficiency heat dissipation according to claim 1, characterized in that: The first planar screen (102) adopts a 100-mesh screen structure, the first spiral woven screen (103) adopts a mixed wire diameter of 0.04 mm and 0.05 mm, and the width and height are 1.1 mm and 0.19 mm respectively, the second planar screen (107) adopts a 300-mesh + 100-mesh two-layer screen structure, the second spiral woven screen (106) adopts a 0.04 mm wire diameter structure, and the width and height are 2 mm and 0.24 mm respectively, the 300-mesh screen wire diameter is 0.03 mm, and the 100-mesh wire diameter is 0.05 mm.

4. A heat spreader with micro-protrusions and high efficiency heat dissipation according to claim 1 or 3, characterized in that: The first plane screen (102) and the second plane screen (107) at the evaporation end (303) are provided with sintered copper powder.

5. The heat spreader with micro-protrusions and high efficiency heat dissipation according to claim 1, characterized in that: The support column (105) has a diameter of 2 mm, and at the condensation end (304), the distance between the center of the support column (105) and the two ends of the plane screen is 3 mm.

6. The heat sink with micro-protrusions and high efficiency heat dissipation according to claim 1, characterized in that: The bottom plate (101) has a thickness of 0.25 mm, the base plate (403) of the cover plate (101) has a thickness of 0.25 mm, and the micro protrusion (402) of the cover plate (101) has a thickness of 0.35 mm, and the materials used are JCC materials.

7. A method for manufacturing a heat spreader with micro-protrusions and high efficiency heat dissipation according to any one of claims 1 to 6, characterized in that: Here are the steps: a) processing the cover plate (101), the bottom plate (108), and the heat dissipation fins (1010); b) placing the spiral braided mesh into the groove of the annealing graphite mold (209) for annealing and cooling to room temperature; c) sintering the flat screen and the copper powder in one piece; d) placing the spiral woven mesh into the groove of the first welded mesh graphite mold (203) and sintering it with the copper powder composite flat wire mesh to form an integrated liquid wick; e) Cutting the sintered product into the required shape using laser; f) an integrally sintered wire mesh is fixed on the bottom plate (108) and the cover plate (101); g) placing the support column (105) in the circular groove (401) of the second welded mesh graphite mold (206), pressing it onto the cover plate with the integrated sintered wick, and placing it for resistance welding to perform sintering; h) The bottom plate (101) and the integrated sintered liquid wick are sintered by resistance welding using two rectangular graphite blocks; i) Place the powder ring on some copper columns and rivet the upper and lower cover plates together; j) placing the riveted heat sink under the first diffusion welding graphite mold (207) and the second diffusion welding graphite mold (208) to be welded into one body; k) Welding the liquid filling port of the heat spreader into one piece, annealing, and the first vacuuming process to make the vacuum degree inside the heat spreader reach 30Pa~40Pa; l) The second degassing process uses a 120°C baking pan to heat the vapor chamber, so that the non-condensable gas inside the vapor chamber gathers in the liquid injection tube. The liquid injection tube is precisely cut to further reduce the non-condensable gas inside the vapor chamber, so that the vacuum degree inside the vapor chamber reaches 0.01Pa~0.001Pa; m) Perform sealing welding on the cut position of the injection tube connected to the soaking plate; n) Soldering the heat spreader and the heat sink fins (1010).

8. A method for manufacturing a heat spreader with micro-protrusions and high efficiency heat dissipation according to claim 7, characterized in that: The specific operation steps of steps d) and e) are as follows: Step 1: The flat screen (202) is cut into a square shape and placed on the square graphite (201), and the spiral woven screen (103) after annealing is clamped and fixed by a first welded screen graphite mold (203) with grooves, and pressed on the square flat screen (202), and placed in a vacuum sintering furnace, with the flat screen under the woven screen; before heating, the inner cavity of the sintering furnace is evacuated and then filled with protective gas, 95% N2 and 5% H2, and then heated to 900°C and kept at a constant temperature for 1 hour; Step 2: After sintering, the woven mesh and the flat screen are slightly melted at the contact position at high temperature and connected together. After cooling, the square graphite (201), the flat screen (202), the first spiral woven mesh (103) and the first welded mesh graphite mold (203) are placed integrally in an aluminum profile fixing device (204) fixed below the laser, and a laser route is set in the laser system to perform laser cutting to finally form an integral sintered liquid wick (302).

9. A method for manufacturing a heat spreader with micro-protrusions and high efficiency heat dissipation according to claim 8, characterized in that: The depth of the second groove (502) of the first welding mesh graphite mold (203) and the first groove (501) of the second welding mesh graphite mold (206) are both H. The method for determining the value of H is as follows: The resistance welding pressure is set to P, the surface area of ​​the bottom plate is A, then the pressure on the bottom plate is: F = P·A The thickness of the bottom plate (101) or the cover plate (108) is L0. Under the action of resistance welding pressure, the bottom plate is compressed by an amount △L. According to the knowledge of material mechanics, in order to reflect the degree of axial deformation of the tension and compression rod, the linear strain ε is defined as: According to Hooke's law, the linear strain ε of the axial section is proportional to the normal stress σ on the section, that is, From, here the pressure P = σ, then: According to the above formulas (1), (2) and (3), we can get: Assume the thickness of the spiral mesh is H 1, In order to avoid the capillary capacity of the spiral woven mesh, the strip groove depth H should be: H=△L+H 1。 10. A method for manufacturing a heat sink with micro-protrusions and high efficiency heat dissipation according to claim 9, characterized in that: The second diffusion welding graphite mold (208) is provided with a groove (601) with a depth of 1 mm.

Citation Information

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