Wet film thickness measuring device and method, electronic equipment and storage medium

Abstract

The invention relates to the technical field of thickness measurement, in particular to a wet film thickness measuring device and method, electronic equipment and a storage medium, and the device comprises a first device body; a second device body that is allowed to move within the first device body; the measuring part and the pressing part are arranged on the second device body, one side of the measuring part is connected with one side of the pressing part, and when the other side of the pressing part is pressed, the other side of the measuring part is driven to move; and the processing part is used for acquiring measurement data when the other side of the measurement part is in contact with the wet film and the substrate of the to-be-measured product, and calculating the thickness of the wet film of the to-be-measured product according to the measurement data. Therefore, the problems that errors exist and the accuracy of a measurement result cannot be guaranteed due to the fact that manual measurement reading is needed in the prior art are solved.

Description

Technical Field

[0001] The present application relates to the technical field of thickness measurement, and in particular to a wet film thickness measurement device, method, electronic device and storage medium. Background Art

[0002] On delicate and high-value products such as processing materials, circuit boards, and special metals, a layer of wet film is often printed or sprayed on the surface to achieve moisture-proof, protective, insulating and aesthetic effects. In order to ensure that product quality and technical specifications are met, it is crucial to accurately measure the thickness of the applied wet film during the processing process. The accuracy of wet film thickness is directly related to product performance and cost control; if the measurement is inaccurate, it may lead to insufficient or excessive coating thickness, which in turn affects product quality.

[0003] The commonly used wet film thickness detection device in the related technology is also called a wet film thickness gauge, also called a wet film comb, a thickness gauge, and a wet film card. After the construction of various coatings, the wet film thickness gauge is immediately placed vertically and stably on the flat surface of the workpiece coating to measure the coating thickness. However, most of the existing wet film thickness gauges rely on manual measurement and reading. However, the visual reading has large errors and insufficient accuracy, which leads to serious deviations in the read data. At the same time, its measurement conditions are relatively harsh, and the test tool must be placed horizontally during the measurement process, resulting in low measurement efficiency. Summary of the invention

[0004] The present application provides a wet film thickness measurement device, method, electronic device and storage medium to solve the problems in the prior art that manual measurement readings are required, errors occur, and the accuracy of the measurement results cannot be guaranteed.

[0005] The first aspect of the present application provides a wet film thickness measuring device, including: a first device body; a second device body, the second device body is allowed to move within the first device body; a measuring part and a pressing part on the second device body, one side of the measuring part is connected to one side of the pressing part, and when the other side of the pressing part is pressed, it drives the other side of the measuring part to move; a processing part, used to obtain measurement data when the other side of the measuring part contacts the wet film and substrate of the product to be measured, and calculate the wet film thickness of the product to be measured based on the measurement data.

[0006] Optionally, the measuring part includes a main body and a measuring head, wherein one side of the main body is connected to one side of the pressing part, and the other side of the main body is connected to the measuring head.

[0007] Optionally, the measuring head can pierce the wet film of the product to be measured under the pressure.

[0008] Optionally, the measuring head is made of a thin-walled material.

[0009] Optionally, the processing unit includes a reading head, a grating scale, a processor and a display screen, wherein the grating scale is mounted on the main body, the reading head, the display screen and the processor are mounted on the first device body, or the processor, the reading head and the display screen communicate with each other, and the processor also communicates with the measuring head.

[0010] Optionally, the processor is further used to: receive a first electrical signal generated when the measuring head contacts the wet film, and a second electrical signal generated when the measuring head contacts the substrate, and control the reading head to read the first measurement data of the grating scale when the measuring head contacts the wet film according to the first electrical signal, and control the reading head to read the second measurement data of the grating scale when the measuring head contacts the substrate according to the second electrical signal, calculate the wet film thickness of the product to be measured according to the first measurement data and the second measurement data, and send the wet film thickness to a display screen for display.

[0011] Optionally, the first device body includes: a sleeve and a support portion, wherein the sleeve and the support portion are physically connected or integrally formed, and the support portion abuts against a substrate of the product to be measured to support the wet film thickness measuring device to be placed on the product to be measured.

[0012] A second aspect of the present application provides a wet film thickness measurement method, which is used to perform measurement using the wet film thickness measurement device of the above embodiment, and includes the following steps: obtaining first measurement data of the wet film of the product to be measured when the measuring part contacts the measuring part under the pressure of pressing force, and second measurement data when the measuring part contacts the substrate of the product to be measured; and calculating the wet film thickness of the product to be measured based on the first measurement data and the second measurement data.

[0013] A third aspect of the present application provides an electronic device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement a wet film thickness measurement method as described in the above embodiment.

[0014] A fourth aspect of the present application provides a computer-readable storage medium having a computer program or instruction stored thereon. When the computer program or instruction is executed, it is used to implement the wet film thickness measurement method as described in the above embodiment.

[0015] Therefore, this application has at least the following beneficial effects:

[0016] The embodiment of the present application applies force to the pressing part to drive the measuring part to move slowly within the first device body through the second device body, so that the measuring part contacts the surface of the wet film, reducing errors caused by rapid contact or impact, and continues to apply pressing force until the measuring part penetrates the wet film and contacts the substrate of the product to be measured. The wet film thickness of the product to be measured is obtained based on the measurement data at the time of contact, which not only simplifies the operation process but also ensures the accuracy and stability of the measurement. It is suitable for various application scenarios that require precise measurement of the wet film thickness, avoids human errors caused by manual readings, and improves detection efficiency.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 A block diagram of a wet film thickness measuring device provided according to an embodiment of the present application;

[0020] Figure 2 A structural diagram of a wet film thickness measuring device provided according to an embodiment of the present application;

[0021] Figure 3 It is a schematic diagram of a wet film thickness measuring device provided according to an embodiment of the present application;

[0022] Figure 4 This is a working flow chart of a wet film thickness measuring device provided according to an embodiment of the present application;

[0023] Figure 5 A flow chart of a wet film thickness measurement method provided according to an embodiment of the present application;

[0024] Figure 6 It is a schematic diagram of the structure of an electronic device provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0026] The wet film thickness measuring device, method, electronic device and storage medium of the embodiment of the present application are described below with reference to the accompanying drawings. In view of the problems mentioned in the above background technology, the present application provides a wet film thickness measuring device, in which the embodiment of the present application applies force to the pressing part to drive the measuring part to slowly move through the second device body in the first device body, so that the measuring part contacts the surface of the wet film, and continues to apply pressing force until the measuring part penetrates the wet film and contacts the substrate of the product to be measured. The wet film thickness of the product to be measured is obtained according to the measurement data at the time of contact, which not only simplifies the operation process, but also ensures the accuracy and stability of the measurement. It is suitable for various application scenarios that require accurate measurement of the wet film thickness, avoids human errors caused by manual readings, and improves detection efficiency.

[0027] Specifically, Figure 1 Schematic diagram of a wet film thickness measuring device according to an embodiment of the present application.

[0028] like Figure 1 As shown, the wet film thickness measuring device includes: a first device body 110 , a measuring part 120 , a processing part 130 , a pressing part 140 , the processing part 130 , and a second device body 160 .

[0029] The second device body 160 is allowed to move inside the first device body 110; the measuring part 120 and the pressing part 140 on the second device body 160, one side of the measuring part 120 is connected to one side of the pressing part 140, and when the other side of the pressing part 140 is pressed, the other side of the measuring part 120 is driven to move; the processing part 130 is used to obtain the measurement data when the other side of the measuring part 120 contacts the wet film and substrate of the product to be measured, and calculate the wet film thickness of the product to be measured based on the measurement data. The second device body 160 can be a deceleration device to ensure that the measuring part can move slowly and stably to the surface to be measured, reduce the error caused by rapid contact or impact, and improve the measurement accuracy.

[0030] It can be understood that when measuring the wet film thickness of the product to be measured in the embodiment of the present application, the wet film thickness measuring device needs to be placed on the product to be measured, and the measuring part 120 is driven to move slowly in the first device body through the second device body 160 by applying force to the pressing part 140, so that the measuring part 120 gradually approaches and finally contacts the surface of the wet film, and continues to apply the pressing force until the measuring part 120 penetrates the wet film and contacts the substrate of the product to be measured, and the wet film thickness of the product to be measured is obtained, which not only simplifies the operation process, but also ensures the accuracy and stability of the measurement, and is suitable for various application scenarios that require accurate determination of the wet film thickness. Compared with the non-contact wet film thickness measuring equipment in the prior art, such as installed on a production line or as a special inspection process (workbench), the wet film thickness measuring device of the embodiment of the present application can be manually held to measure any position of a wet film of any shape. On the premise of retaining the accuracy of the sensor reading and the portability of the mechanical measuring instrument, the volume of the device is reduced, the human error caused by manual reading is avoided, and the accuracy and portability of the device are improved.

[0031] In one embodiment of the present application, Figure 2 and Figure 3 As shown, the measuring part 120 includes a main body 121 and a measuring head 122, wherein one side of the main body 120 is connected to one side of the pressing part 140, and the other side of the main body 121 is connected to the measuring head 122. The measuring head 122 can pierce the wet film 220 of the product to be tested 200 and abut against the base 210 of the product to be tested 200 under the driving force of the pressing force.

[0032] The measuring head 122 may be made of a repellent material, that is, the measuring head does not need to be cleaned or dried after the measurement, and can be used continuously to achieve multi-point and multi-frequency continuous measurement.

[0033] In one embodiment of the present application, the processing unit 130 includes a reading head 130, a grating ruler 132, a processor 133 and a display screen 134.

[0034] Among them, the grating ruler 132 is installed on the main body 121, the reading head 131, the display screen 134 and the processor 133 are installed on the first device body 110, or the processor 133, the reading head 131 and the display screen 134 communicate with each other, and the processor 133 also communicates with the measuring head 122.

[0035] Specifically, the processor 133 is further used to receive the first electrical signal generated when the measuring head 122 contacts the wet film 220, and the second electrical signal generated when the measuring head 122 contacts the substrate 210, and control the reading head 131 to read the first measurement data of the grating ruler 132 when the measuring head 122 contacts the wet film 220 according to the first electrical signal, and control the reading head 131 to read the second measurement data of the grating ruler 132 when the measuring head 122 contacts the substrate 210 according to the second electrical signal, calculate the wet film thickness of the product 200 to be measured according to the first measurement data and the second measurement data, and send the wet film thickness to the display screen 134 for display. In this way, it is ensured that each measurement can accurately record the moment when the wet film contacts the substrate, and calculate the accurate thickness value accordingly. In addition, due to the use of automated signal processing and data reading mechanisms, the possibility of human intervention is reduced, thereby improving the consistency and reliability of measurement.

[0036] In one embodiment of the present application, Figure 3 As shown, the first device body 110 includes a sleeve 111 and a support portion 112 .

[0037] The sleeve 111 and the support part 110 are physically connected or integrally formed, and the support part 110 contacts the base 210 of the product 200 to be tested, and is used to support the wet film thickness measuring device to be placed on the product 200 to be tested. In addition, the support part 112 of the embodiment of the present application can be a fine point type, or a spherical type, etc. In addition, the magnetic attraction type, electrostatic adsorption type, and retractable support part have the same function as the support part 112 in the embodiment of the present application.

[0038] In addition, if Figure 2 As shown, the wet film thickness measuring device of the embodiment of the present application further includes a protective cover 150, which can protect key components inside the device, such as a measuring part, a deceleration device, etc., from external physical shocks or collisions, thereby maintaining stable performance.

[0039] It should be noted that some structures and components in the above embodiments of the present application can be replaced with other structural components, and these structures and components do not change the overall working mode of the device. The specific structural components are as follows:

[0040] 1) Installation location of the readhead, processor and display

[0041] The reading head 131, the display screen 134 and the processor 133 of the embodiment of the present application can be installed on the first device body 110, or can be set separately from the first device body 110. When they are set separately from the first device body 110, the reading head 131, the display screen 134 and the processor 133 can exchange data through longer wires, Bluetooth, 5G and other communication methods.

[0042] 2) Type of readhead, processor and display

[0043] In the embodiment of the present application, the reading head 131 can be a grating type, a magnetic grating type or other measuring device, and the processor 133 can be a single chip microcomputer, a programmable logic controller (PLC) or an electronic control unit (ECU), etc. The display screen 134 can also be a TF display screen, a TFT display screen, an AMOLED display screen, an IPS display screen, etc.

[0044] 3) Measurement unit structure

[0045] The measuring unit 120 can be a contact capacitance sensor, which refers to other sensors with contact induction such as finger capacitance, thin film capacitance, humidity sensor, etc. Most of the current mainstream wet film testing instruments and platforms are based on optical solutions. For example, the use of a camera to read the scale is easily affected by factors such as ambient light, and the use of laser reflection to measure the thickness. Since the wet film has a certain refraction, this method is easily affected by the humidity and material of the wet film and is not universal. However, the present application uses a contact sensor to avoid a series of problems based on optical solutions. As long as the product to be tested has a certain humidity, accurate measurement can be achieved, and the application scenarios are more extensive.

[0046] 4) Structure of the Second Device Body

[0047] The second device body 160 can be a spring, a gear set, a coil spring, an elastic element or other mechanical structures with a deceleration effect.

[0048] 5) Connection method between structural parts

[0049] The connection between the pressing part 140 and the contact capacitive sensor 120, the supporting part 112 and the sleeve 112, the housing 110 and the sleeve 111 and other structural parts can be bolted, clamped, pinned, welded, riveted or integrally formed, etc. The integrally formed method can be die-casting, extrusion, cutting and other molding processes.

[0050] This application is mainly used in scenarios where wet film thickness measurement is required for fire retardant coatings, protective paints and glues. In order to more clearly understand the wet film thickness measurement device of this application and its working principle, a specific example will be described in detail below. Figure 4 As shown, the following working steps are included:

[0051] Step 1: firstly, the wet film thickness measuring device is calibrated to zero, so that the output of the contact capacitance sensor 120 is empty when it does not touch the paint surface.

[0052] Step 2, placing the wet film thickness measuring instrument 100 on the product to be measured 200, so that the support portion 112 contacts the substrate 210;

[0053] Step 3, pressing the top pressing portion 140 to drive the contact capacitive sensor 120 to move slowly in the housing 110 through the deceleration device 160;

[0054] Step 4: When one end of the contact capacitance sensor 120 contacts the wet film 220, the contact capacitance sensor 120 sends an electrical signal to the processor 133. At this time, the reading head 131 reads the scale X1 of the grating ruler 132 at this time and sends it to the processor 133;

[0055] Step 5, continue to press the top pressing portion 140 to drive the touch capacitive sensor 120 to slowly move through the deceleration device 160 in the housing 110, so that one end of the touch capacitive sensor 120 pierces the wet film 220 and contacts the substrate 210;

[0056] Step 6, after the collision, an electrical signal is sent to the processor 133. At this time, the reading head 131 reads the scale X2 of the grating ruler 132 at this time and sends it to the processor 133;

[0057] Step 7, after the processor 133 receives two electrical signals, it makes a difference X=X1-X2 between the grating scale data collected twice before and after, and sends the obtained data difference to the display screen 132 for display. This data is the thickness of the wet film.

[0058] According to the wet film thickness measuring device proposed in the embodiment of the present application, force is applied to the pressing part to drive the measuring part to move slowly within the first device body through the second device body, so that the measuring part contacts the surface of the wet film, and the pressing force is continued to be applied until the measuring part penetrates the wet film and contacts the substrate of the product to be measured. The wet film thickness of the product to be measured is obtained based on the measurement data at the time of contact, which not only simplifies the operation process but also ensures the accuracy and stability of the measurement. It is suitable for various application scenarios that require precise measurement of the wet film thickness, avoids human errors caused by manual readings, and improves detection efficiency.

[0059] Next, a wet film thickness measurement method according to an embodiment of the present application is described with reference to the accompanying drawings, and the wet film thickness measurement device of the above embodiment is used for measurement.

[0060] Figure 5 A schematic flow chart of a wet film thickness measurement method provided in an embodiment of the present application.

[0061] like Figure 5 As shown, the wet film thickness measurement method includes the following steps:

[0062] In step S101 , first measurement data of the measuring part contacting the wet film of the product to be measured driven by the pressing force and second measurement data of the measuring part contacting the substrate of the product to be measured are obtained.

[0063] In step S102, the wet film thickness of the product to be measured is calculated according to the first measurement data and the second measurement data.

[0064] It should be noted that part of the above explanations of the wet film thickness measuring device embodiment is also applicable to the wet film thickness measuring method of this embodiment, and will not be described again here to avoid redundancy.

[0065] According to the wet film thickness measurement method proposed in the embodiment of the present application, force is applied to the pressing part to drive the measuring part to move slowly within the first device body through the second device body, so that the measuring part contacts the surface of the wet film, and the pressing force is continued to be applied until the measuring part penetrates the wet film and contacts the substrate of the product to be measured. The wet film thickness of the product to be measured is obtained based on the measurement data at the time of contact. This not only simplifies the operation process, but also ensures the accuracy and stability of the measurement. It is suitable for various application scenarios that require precise measurement of the wet film thickness, avoids human errors caused by manual readings, and improves detection efficiency.

[0066] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device may include:

[0067] A memory 601 , a processor 602 , and a computer program stored in the memory 601 and executable on the processor 602 .

[0068] When the processor 602 executes the program, the wet film thickness measurement method provided in the above embodiment is implemented.

[0069] Furthermore, the electronic device further comprises:

[0070] The communication interface 603 is used for communication between the memory 601 and the processor 602 .

[0071] The memory 601 is used to store computer programs that can be executed on the processor 602 .

[0072] The memory 601 may include a high-speed RAM (Random Access Memory) memory, and may also include a non-volatile memory, such as at least one disk memory.

[0073] If the memory 601, the processor 602 and the communication interface 603 are implemented independently, the communication interface 603, the memory 601 and the processor 602 can be connected to each other through a bus and communicate with each other. The bus can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0074] Optionally, in a specific implementation, if the memory 601, the processor 602 and the communication interface 603 are integrated on a chip, the memory 601, the processor 602 and the communication interface 603 can communicate with each other through an internal interface.

[0075] The processor 602 may be a CPU (Central Processing Unit), or an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present application.

[0076] An embodiment of the present application further provides a computer-readable storage medium having a computer program stored thereon, which implements the above wet film thickness measurement method when executed by a processor.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0078] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0079] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or more executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0080] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiment, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array, a field programmable gate array, etc.

[0081] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0082] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A wet film thickness measuring device, characterized in that: include: a first device body; a second device body, the second device body being allowed to move within the first device body; A measuring part and a pressing part on the second device body, one side of the measuring part is connected to one side of the pressing part, and when the other side of the pressing part is pressed, the other side of the measuring part is driven to move; The processing part is used to obtain measurement data when the other side of the measuring part contacts the wet film and substrate of the product to be measured, and calculate the wet film thickness of the product to be measured according to the measurement data.

2. The wet film thickness measuring device according to claim 1, characterized in that: The measuring part includes a main body and a measuring head, wherein one side of the main body is connected to one side of the pressing part, and the other side of the main body is connected to the measuring head.

3. The wet film thickness measuring device according to claim 2, characterized in that: The measuring head can pierce the wet film of the product to be measured under the driving force of the pressing force.

4. The wet film thickness measuring device according to claim 2 or 3, characterized in that: The measuring head is made of a thin-film material.

5. The wet film thickness measuring device according to claim 2, characterized in that: The processing unit includes a reading head, a grating scale, a processor and a display screen, wherein the grating scale is mounted on the main body, the reading head, the display screen and the processor are mounted on the first device body, or the processor, the reading head and the display screen communicate with each other, and the processor also communicates with the measuring head.

6. The wet film thickness measuring device according to claim 5, characterized in that: The processor is further configured to: Receive a first electrical signal generated when the measuring head contacts the wet film, and a second electrical signal generated when the measuring head contacts the substrate, and control the reading head to read the first measurement data of the grating ruler when the measuring head contacts the wet film according to the first electrical signal, and control the reading head to read the second measurement data of the grating ruler when the measuring head contacts the substrate according to the second electrical signal, calculate the wet film thickness of the product to be measured according to the first measurement data and the second measurement data, and send the wet film thickness to the display screen for display.

7. The wet film thickness measuring device according to claim 1, characterized in that: The first device body includes: a sleeve and a support portion, wherein the sleeve and the support portion are physically connected or integrally formed, and the support portion abuts against the substrate of the product to be measured to support the wet film thickness measuring device to be placed on the product to be measured.

8. A method for measuring wet film thickness, characterized in that: The method uses the wet film thickness measuring device according to any one of claims 1 to 7 to perform measurement, comprising the following steps: Acquire first measurement data of the wet film of the product to be measured when the measuring part contacts the wet film of the product to be measured under the pressure, and second measurement data of the wet film of the product to be measured when the measuring part contacts the substrate of the product to be measured; The wet film thickness of the product to be measured is calculated according to the first measurement data and the second measurement data.

9. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the wet film thickness measurement method according to claim 8.

10. A computer-readable storage medium having a computer program or instruction stored thereon, characterized in that: When the computer program or instruction is executed, the wet film thickness measurement method according to claim 8 is implemented.

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