Monocrystalline silicon wafer detection device

Abstract

The invention belongs to the technical field of monocrystalline silicon wafer detection, and relates to a monocrystalline silicon wafer detection device. The device comprises a workbench, a detection unit and a carrying unit. The workbench is provided with a closed first sliding groove, the first sliding groove is slidably connected with a first adsorption assembly in a limiting mode, the first adsorption assembly is used for fixing a silicon wafer, the detection unit comprises cameras and a backlight lamp strip, and the two cameras on the first mounting plate are symmetrically arranged on the inner side and the outer side of the first sliding groove respectively. A camera located on the outer side of the first sliding groove is arranged on the second mounting plate. In the process that the silicon wafer moves along the first sliding groove, the three cameras are matched with the first sliding groove, so that the silicon wafer can be comprehensively detected without turning over the silicon wafer. The silicon wafers can be classified in the process of moving along the first sliding groove, the qualified silicon wafers are transferred to the second conveying belt, the unqualified silicon wafers are transferred to the third conveying belt, and the detection efficiency is high.

Description

Technical Field

[0001] The invention belongs to the technical field of single crystal silicon wafer detection and relates to a single crystal silicon wafer detection device. Background Art

[0002] The surface defects of monocrystalline silicon wafers not only affect the appearance quality of monocrystalline silicon wafers, but also have an important impact on their performance and reliability. Therefore, in the production process of monocrystalline silicon wafers, it is necessary to detect their surface defects. The surface defects of monocrystalline silicon wafers include corner chipping, edge collapse, warping, etc. at the edge of the monocrystalline silicon wafer. The traditional manual visual inspection is to place the monocrystalline silicon wafer under the backlight and observe the surface of the monocrystalline silicon wafer carefully bit by bit, which is inefficient. And under the influence of the backlight, the eyes of the inspectors are prone to visual fatigue, which in turn affects the inspection quality.

[0003] In order to solve the above problems, the present invention proposes a single crystal silicon wafer detection device. Summary of the invention

[0004] In order to solve the problems existing in the background technology, the present invention proposes a single crystal silicon wafer detection device.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A single crystal silicon wafer detection device comprises a workbench, a detection unit and a transport unit; a closed first slide groove is provided on the workbench, a first adsorption component is limitedly slidably connected to the first slide groove, the first adsorption component is used to fix the silicon wafer, the detection unit is arranged on the workbench, the detection unit comprises a camera and a backlight strip, the backlight strip is arranged on the upper end surface of the workbench, three cameras are arranged above the workbench corresponding to the backlight strip, the three cameras are respectively a first camera, a second camera and a third camera, the first camera and the third camera are arranged in cooperation with a group of opposite sides of the silicon wafer, the first camera and the second camera are arranged in cooperation with another group of opposite sides of the silicon wafer, the silicon wafer moves along the first slide groove close to the detection unit, the first camera and the third camera detect a group of opposite sides on the silicon wafer, when the silicon wafer moves to the corner corresponding to the first slide groove and the detection unit, the first camera and the second camera start to detect another group of opposite sides on the silicon wafer; the transport unit is arranged on the workbench and is used to take and place the silicon wafer.

[0007] Furthermore, the three conveying units are respectively arranged at the four corners of the first slide slot, and the three conveying units are respectively a first inspection unit for placing the silicon wafer to be inspected on the first adsorption component, a second conveying unit for moving the qualified silicon wafers on the first adsorption component away, and a third conveying unit for moving the unqualified silicon wafers on the first adsorption component away, wherein the first conveying unit and the inspection unit are arranged adjacent to each other.

[0008] Furthermore, the first adsorption component includes a first adsorption plate, which is used to adsorb silicon wafers. A first air suction pump is fixedly installed in the slider, and the suction end of the first air suction pump is connected to the first adsorption plate. The slider is provided with a first air suction pump connected to the air outlet end of the first air suction pump.

[0009] Furthermore, the transport unit includes a telescopic rod, a fixed rod and a second adsorption assembly, the telescopic rod is vertically rotatably installed on the workbench; a second motor is embedded and fixedly installed in the workbench, a second gear is coaxially fixedly connected to the output shaft of the second motor, the second gear is meshingly linked to a third gear, the third gear is fixedly sleeved with a rotating sleeve, and one end of the telescopic rod is fixedly sleeved in the rotating sleeve; the second adsorption assembly is arranged on the fixed rod.

[0010] Furthermore, the second adsorption assembly includes a second adsorption plate and a second air suction pump. The fixed rod is fixedly connected to a fixed column. The second adsorption plate is fixed at the lower end of the fixed column. The second air suction pump is embedded in the fixed column. The suction end of the second air suction pump is connected to the second adsorption plate, and the air outlet end of the second air suction pump is connected to the outside world.

[0011] Furthermore, the first adsorption plate is fixedly connected to a slider, the slider is limited and slidably arranged in the first slide groove, and a driving component for driving the slider to move along the first slide groove is arranged in the workbench; the driving component includes a connecting rod, a rotating ring and a first motor; a second slide groove connected to the first slide groove is opened in the workbench, the rotating ring is rotatably installed in the second slide groove, the connecting rod is fixedly connected to the rotating ring, a guide groove is opened on the connecting rod, the lower end of the slider is connected to a sliding column, the sliding column is slidably arranged in the connecting rod, the rotating ring is coaxially fixedly connected to a gear ring, the gear ring is meshed with a first gear, the first motor is embedded in the workbench, and the gear ring is coaxially fixed on the output shaft of the first motor.

[0012] Furthermore, an image processing and analysis module is provided on the workbench, and the camera transmits the captured image to the image processing and analysis module, and the image processing and analysis module processes and analyzes the received image.

[0013] Furthermore, a first control button and a second control button are in the first slide slot; a first control switch is provided on the second transport unit, and the first control switch and the first control button are both connected to the control circuit of the second transport unit; a second control switch is provided on the third transport unit, and the second control switch and the second control button are both connected to the control circuit of the second transport unit.

[0014] Compared with the prior art, the present invention has the following beneficial effects: when the silicon wafer moves along the first slide chute, the three cameras are arranged in cooperation with the first slide chute, and the silicon wafer can be fully inspected without turning over the silicon wafer. And the silicon wafer can be sorted when it moves along the first slide chute, and the qualified silicon wafer is transferred to the second conveyor belt, and the unqualified silicon wafer is transferred to the third conveyor belt, and the inspection efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 It is a structural schematic diagram of the workbench in the present invention;

[0017] Figure 3 It is a schematic diagram of the cooperation between the slider and the first slide groove in the present invention;

[0018] Figure 4 is a vertical cross-sectional view of the workbench in the present invention;

[0019] Figure 5 is a horizontal cross-sectional view of the workbench in the present invention;

[0020] Figure 6 It is a structural schematic diagram of the connecting rod in the present invention;

[0021] Figure 7 It is a structural schematic diagram of the first adsorption component in the present invention;

[0022] Figure 8 is a schematic diagram of the positions of the first control button and the second control button in the present invention;

[0023] Fig. 9 is a schematic diagram of the position of the second motor in the third transport unit of the present invention;

[0024] Fig.10 It is a structural schematic diagram of the second adsorption component in the first transport unit of the present invention;

[0025] Fig.11 is a schematic diagram of the position of the camera in the present invention;

[0026] Fig.12 It is a simplified diagram of the detection process of the detection unit in the present invention.

[0027] In the figure: 1, workbench; 2, first conveyor belt; 3, third conveyor belt; 4, second conveyor belt; 5, backlight belt; 6, fixed plate; 7, image processing and analysis module; 8, first control switch; 9, second telescopic rod; 10, second fixed rod; 11, first slide; 12, second control switch; 13, third telescopic rod; 14, third fixed rod; 15, first fixed rod; 16, first telescopic rod; 17, silicon wafer; 18, first mounting plate; 19, second mounting plate; 20, first adsorption plate; 21, second adsorption plate; 22, Fixed column; 23, second slide groove; 24, connecting rod; 25, slider; 26, rotating ring; 27, first motor; 28, first gear; 29, gear ring; 30, second gear; 31, third gear; 32, give way groove; 33, sliding column; 34, first air pump; 35, exhaust duct; 36, second motor; 37, first control button; 38, second control button; 39, rotating sleeve; 40, second air pump; 41, camera; 401, first camera; 402, second camera; 403, third camera. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] like Figure 1-Figure 12 As shown, the technical solution adopted by the present invention is as follows: a single crystal silicon wafer detection device includes a workbench 1, a detection unit and a transport unit.

[0030] The upper end surface of the workbench 1 is provided with a first slide groove 11, and the first slide groove 11 is rectangular. A slider 25 is provided in the first slide groove 11 for limited sliding, and a first adsorption assembly is fixedly installed on the slider 25. The first adsorption assembly includes a first adsorption disk 20, and the first adsorption disk 20 is used to adsorb the silicon wafer 17. A first suction pump 34 is fixedly installed in the slider 25, and the suction end of the first suction pump 34 is connected to the first adsorption disk 20, and an exhaust channel 35 connected to the exhaust end of the first suction pump 34 is provided on the slider 25.

[0031] A driving assembly for driving the slider 25 to move along the first slide groove 11 is provided in the workbench 1. The driving assembly includes a connecting rod 24, a rotating ring 26 and a first motor 27. A second slide groove 23 is provided in the workbench 1, and the first slide groove 11 is connected to the second slide groove 23. The rotating ring 26 is rotatably installed in the second slide groove 23, and the connecting rod 24 is fixedly connected to the rotating ring 26. A guide groove is provided on the connecting rod 24, and a sliding column 33 is connected to the lower end of the slider 25, and the sliding column 33 is slidably arranged in the connecting rod 24. The rotating ring 26 is coaxially fixedly connected with a gear ring 29, and the gear ring 29 is meshed with a first gear 28. The first motor 27 is embedded and installed in the workbench 1, and the gear ring 29 is coaxially fixed on the output shaft of the first motor 27.

[0032] There are three conveying units, namely the first conveying unit, the second conveying unit, and the third conveying unit. The first conveying unit, the second conveying unit, the third conveying unit, and the detection unit are respectively arranged at the four corners of the first chute 11. The detection unit is arranged near the first conveying unit. The first conveying unit is used to convey the silicon wafer 17 to be detected to the first adsorption plate 20, and then the first adsorption plate 20 drives the silicon wafer 17 to move along the first chute 11 toward the direction close to the detection unit, and the detection unit detects the silicon wafer 17. After the detection is completed, the silicon wafer 17 continues to move along the first chute 11. When passing through the second conveying unit, the second conveying unit removes the qualified silicon wafer 17 from the first adsorption plate 20, and when passing through the third conveying unit, the third conveying unit removes the unqualified silicon wafer 17 from the first adsorption plate 20. Afterwards, when the first adsorption plate 20 passes through the first conveying unit, the first conveying unit places the next silicon wafer 17 to be detected on the first adsorption plate 20. Therefore, the detection and sorting can be completed in the process of the silicon wafer 17 moving along the first chute 11.

[0033] The first transport unit is provided with a first conveyor belt 2, which is used to transport the silicon wafers 17 to be tested. The first transport unit transports the silicon wafers 17 to be tested on the first conveyor belt 2 to the first adsorption tray 20. The second transport unit is provided with a second conveyor belt 4, which is used to transport the silicon wafers 17 that have passed the test. The second transport unit transfers the silicon wafers 17 that have passed the test on the first adsorption tray 20 to the second conveyor belt 4. The third transport unit is provided with a third conveyor belt 3, which is used to transport the silicon wafers 17 that have failed the test. The third transport unit transfers the silicon wafers 17 that have failed the test on the first adsorption tray 20 to the third conveyor belt 3.

[0034] The transport unit includes a telescopic rod, a fixed rod and a second adsorption assembly. The telescopic rod is vertically rotatably mounted on the workbench 1. Specifically, a second motor 36 is embedded and fixedly mounted in the workbench 1, and a second gear 30 is coaxially fixedly connected to the output shaft of the second motor 36, and the second gear 30 is meshingly connected to the third gear 31. The third gear 31 is fixedly sleeved with a rotating sleeve 39, and one end of the telescopic rod is fixedly sleeved in the rotating sleeve 39. A clearance groove 32 for accommodating the second gear 30 and the third gear 31 is provided on the workbench 1.

[0035] One end of the fixed rod is fixedly mounted on the telescopic end of the telescopic rod. The fixed rod is arranged perpendicular to the telescopic rod. The second adsorption assembly is mounted on one end of the fixed rod away from the telescopic rod. In this embodiment, the telescopic rod is an electric telescopic rod.

[0036] The second adsorption assembly includes a second adsorption plate 21 and a second suction pump 40. The fixing rod is fixedly connected to the fixing column 22, the second adsorption plate 21 is fixed to the lower end of the fixing column 22, and the second suction pump 40 is embedded in the fixing column 22. The suction end of the second suction pump 40 is connected to the second adsorption plate 21, and the air outlet end of the second suction pump 40 is connected to the outside. The second suction pump 40 is started, so that the second adsorption plate 21 generates an adsorption force to adsorb the silicon wafer 17.

[0037] For the convenience of description, the telescopic rod in the first transport unit is named the first telescopic rod 16, and the fixed rod is named the first fixed rod 15. The telescopic rod in the second transport unit is named the second telescopic rod 9, and the fixed rod is named the second fixed rod 10. The telescopic rod in the third transport unit is named the third telescopic rod 13, and the fixed rod is named the third fixed rod 14.

[0038] The detection unit includes a camera 41 and a backlight strip 5. The backlight strip 5 is fixedly mounted on the workbench 1. There are two backlight strips 5, one of which is arranged at a corresponding position inside the first slide slot 11, and the other backlight strip 5 is arranged at a corresponding position outside the first slide slot 11.

[0039] The workbench 1 is fixedly mounted with a fixing plate 6, which is fixedly connected with a first mounting plate 18 and a second mounting plate 19, wherein two cameras 41 are mounted on the first mounting plate 18, and the two cameras 41 on the first mounting plate 18 are symmetrically arranged on the inner and outer sides of the first slide groove 11. The second mounting plate 19 is provided with a camera 41 located outside the first slide groove 11, and the camera 41 on the second mounting plate 19 corresponds to the camera 41 on the first mounting plate 18 located inside the first slide groove 11. The positions of the three cameras 41 should also match the size of the silicon wafer 17.

[0040] like Fig.12As shown, the three cameras 41 are named as the first camera 401, the second camera 402 and the third camera 403. The first camera 401 and the second camera 402 are both on the first mounting plate 18, and the third camera 403 is on the second mounting plate 19. The four corners of the silicon wafer 17 are a, b, c, and d. When the silicon wafer 17 moves along the first slide 11 toward the direction close to the detection unit, the first camera 401 corresponds to the cd edge of the silicon wafer 17, and the third camera 403 corresponds to the ba edge of the silicon wafer 17. The first camera 401 detects the cd edge of the silicon wafer 17, and the third camera 403 detects the ba edge of the silicon wafer 17. When the silicon wafer 17 moves to the corner of the first slide 11 close to the detection unit, the first camera 401 corresponds to the d point of the silicon wafer 17, and the second camera 402 corresponds to the c point of the silicon wafer 17. Then, as the silicon wafer 17 continues to move forward, the first camera 401 detects the da side of the silicon wafer 17, and the second camera 402 detects the cb side of the silicon wafer 17. As the silicon wafer 17 moves along the first slide chute 11, the detection of the silicon wafer 17 can be completed.

[0041] The fixing plate 6 is provided with an image processing and analysis module 7, which is arranged in conjunction with the camera 41. The camera 41 transmits the captured image to the image processing and analysis module 7, which processes and analyzes the received image and determines whether the silicon wafer 17 is qualified. If the silicon wafer 17 has defects such as missing corners, broken edges, and warping, it is judged as unqualified, otherwise it is judged as qualified.

[0042] The image processing and analysis module 7 includes a central processing unit, a signal receiver, a signal transmitter, etc. The image processing module belongs to the prior art and will not be described in detail here.

[0043] The second telescopic rod 9 is provided with a first control switch 8, which is connected to the control circuit of the second telescopic rod 9, the second motor 36 and the second suction pump 40 in the second transport unit. The third telescopic rod 13 is provided with a second control switch 12, which is connected to the control circuit of the third telescopic rod 13, the second motor 36 and the second suction pump 40 in the third transport unit. The first control switch 8, the second control switch 12 and the image processing and analysis module 7 are all electrically connected to the controller. The image processing and analysis module 7 transmits the judgment result to the controller. If the silicon wafer 17 is judged to be qualified, the controller connects the first control switch 8. If the silicon wafer 17 is judged to be unqualified, the controller connects the second control switch 12.

[0044] A first control button 37 is provided on the inner wall of the first chute 11 at a position corresponding to the second transport unit, and the first control button 37 is used to control the opening and closing of the second telescopic rod 9, the second motor 36 and the second air pump 40 in the second transport unit. A second control button 38 is provided at a position corresponding to the third transport unit. The second control button 38 is used to control the opening and closing of the third telescopic rod 13, the second motor 36 and the second air pump 40 in the third transport unit. The first control button 37, the second control button 38 and the first air pump 34 are all electrically connected to the controller.

[0045] When the silicon wafer 17 is qualified, the first control switch 8 is connected, and when the slider 25 presses the first control button 37, the second telescopic rod 9, the second motor 36 and the second suction pump 40 in the second transport unit are turned on, and the first suction pump 34 is turned off at the same time, and the first suction plate 20 releases the suction of the silicon wafer 17. The second telescopic rod 9 drives the second fixed rod 10 to move downward for a certain distance, and the second suction plate 21 adsorbs the silicon wafer 17, and then the second telescopic rod 9 drives the second fixed rod 10 to move upward, and then the second motor 36 is started, so that the second telescopic rod 9 rotates 90 degrees, and the second telescopic rod 9 drives the second fixed rod 10 to move downward again, the second suction pump 40 is turned off, and the silicon wafer 17 falls onto the second conveyor belt 4. After that, the second telescopic rod 9 drives the second fixed rod 10 to move upward, and the second telescopic rod 9 reverses 90 degrees.

[0046] When the silicon wafer 17 is unqualified, the first control switch 8 is disconnected and the second control switch 12 is connected. When the slider 25 presses the first control button 37, the second telescopic rod 9, the second motor 36 and the second suction pump 40 in the second transport unit will not be turned on. When the slider 25 presses the second control button 38, the third telescopic rod 13, the second motor 36 and the second suction pump 40 in the third transport unit are turned on. At the same time, the first suction pump 34 is turned off. The third transport unit transfers the silicon wafer 17 on the first suction plate 20 to the third conveyor belt 3.

[0047] Working principle: Initially, the transport units are all above the corresponding positions of the first chute 11. The first suction plate 20 is opposite to the second suction plate 21 in the first transport unit. The first control switch 8, the second control switch 12, the first control button 37 and the second control button 38 are all in the off state.

[0048] The silicon wafer 17 to be tested is placed on the first conveyor belt 2. The second motor 36 in the first transport unit drives the first telescopic rod 16 to rotate 90 degrees. The first telescopic rod 16 drives the first fixed rod 15 to move downward. The second suction pump 40 in the first transport unit is started, and the second suction plate 21 adsorbs the silicon wafer 17 to be tested on the first conveyor belt 2. After that, the first telescopic rod 16 drives the first fixed rod 15 to move upward. The first telescopic rod 16 rotates 90 degrees in the opposite direction. At this time, the second suction plate 21 in the first transport unit is opposite to the first suction plate 20. The first telescopic rod 16 drives the first fixed rod 15 to move downward, so that the silicon wafer 17 is close to the first suction plate 20. The second suction pump 40 is turned off, and the silicon wafer 17 falls on the first suction plate 20. After that, the first suction pump 34 is started, and the first suction plate 20 adsorbs and fixes the silicon wafer 17. The first telescopic rod 16 drives the first fixed rod 15 to move upward and reset.

[0049] Then the first motor 27 is started, the rotating ring 26 rotates, the connecting rod 24 rotates around the axis of the rotating ring 26, the connecting rod 24 drives the sliding column 33 to rotate around the axis of the rotating ring 26, and at the same time the sliding column 33 slides along the connecting rod 24, and the slider 25 moves along the first slide groove 11, so that the silicon wafer 17 moves in the direction close to the detection unit.

[0050] When the silicon wafer 17 moves to the bottom of the detection unit, the detection unit detects the silicon wafer 17 and transmits the detection data to the image processing and analysis module 7. The image processing and analysis module 7 processes the detection data, analyzes and judges, and divides the silicon wafer 17 into qualified or unqualified, and then transmits the detection result to the controller. If the silicon wafer 17 is qualified, the controller connects the first control switch 8 and the second control switch 12 is in the disconnected state. As the silicon wafer 17 moves forward along the first chute 11, when the slider 25 presses the first control button 37, the first suction pump 34 is turned off, and the second transport unit transports the silicon wafer 17 on the first adsorption disk 20 to the second conveyor belt 4, and then the second transport unit is reset. If the silicon wafer 17 is unqualified, the second control switch 12 is connected, the first control switch 8 is in the disconnected state, as the silicon wafer 17 moves along the first chute 11, when the slider 25 presses the second control button 38, the first suction pump 34 is turned off, and the third transport unit transports the silicon wafer 17 on the first adsorption disk 20 to the third conveyor belt 3, and then the third transport unit is reset.

[0051] Afterwards, when the first suction plate 20 moves to the position corresponding to the first transport unit again, the first transport unit transports the next silicon wafer 17 to be inspected to the first suction plate 20. As the first suction plate 20 moves along the first chute 11, the inspection and classification of the silicon wafers 17 can be completed, with a high degree of automation, which is conducive to improving the inspection efficiency.

[0052] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A single crystal silicon wafer detection device, characterized in that: The invention comprises a workbench (1), a detection unit and a transport unit; the workbench (1) is provided with a closed first slide groove (11), the first slide groove (11) is limitedly slidably connected with a first adsorption component, the first adsorption component is used to fix a silicon wafer (17), the detection unit is arranged on the workbench (1), the detection unit comprises a camera (41) and a backlight strip (5), the backlight strip (5) is arranged on the upper end surface of the workbench (1), three cameras (41) are arranged above the workbench (1) corresponding to the backlight strip (5), the three cameras (41) are respectively a first camera (401), a second camera (402), and a third camera (403), the first camera (401 ) and a third camera (403) are arranged in cooperation with a group of opposite edges of the silicon wafer (17), the first camera (401) and the second camera (402) are arranged in cooperation with another group of opposite edges of the silicon wafer (17), the silicon wafer (17) moves along the first slide groove (11) close to the detection unit, the first camera (401) and the third camera (403) detect a group of opposite edges on the silicon wafer (17), when the silicon wafer (17) moves to the corner corresponding to the first slide groove (11) and the detection unit, the first camera (401) and the second camera (402) start to detect another group of opposite edges on the silicon wafer (17); the handling unit is arranged on the workbench (1) and is used to take and place the silicon wafer (17).

2. A single crystal silicon wafer detection device according to claim 1, characterized in that: The three transport units are respectively arranged at the four corners of the first slide slot (11), and the three transport units are respectively a first detection unit for placing the silicon wafer (17) to be detected on the first adsorption component, a second transport unit for removing the qualified silicon wafer (17) on the first adsorption component, and a third transport unit for removing the unqualified silicon wafer (17) on the first adsorption component, wherein the first transport unit and the detection unit are arranged adjacent to each other.

3. The single crystal silicon wafer detection device according to claim 1, characterized in that: The first adsorption component comprises a first adsorption plate (20), the first adsorption plate (20) is used to adsorb the silicon wafer (17), a first air suction pump (34) is fixedly installed in the slider (25), the air suction end of the first air suction pump (34) is connected to the first adsorption plate (20), and the slider (25) is provided with a first air suction pump (34) connected to the air outlet end of the first air suction pump (34).

4. The single crystal silicon wafer detection device according to claim 1, characterized in that: The transport unit comprises a telescopic rod, a fixed rod and a second adsorption assembly, wherein the telescopic rod is vertically rotatably mounted on a workbench (1); a second motor (36) is embedded and fixedly mounted in the workbench (1); a second gear (30) is coaxially fixedly connected to the output shaft of the second motor (36); the second gear (30) is meshingly linked to a third gear (31); the third gear (31) is fixedly sleeved with a rotating sleeve (39); one end of the telescopic rod is fixedly sleeved in the rotating sleeve (39); and the second adsorption assembly is arranged on the fixed rod.

5. The single crystal silicon wafer detection device according to claim 1, characterized in that: The second adsorption assembly comprises a second adsorption plate (21) and a second air suction pump (40); the fixing rod is fixedly connected to a fixing column (22); the second adsorption plate (21) is fixed to the lower end of the fixing column (22); the second air suction pump (40) is embedded in the fixing column (22); the suction end of the second air suction pump (40) is connected to the second adsorption plate (21); and the air outlet end of the second air suction pump (40) is connected to the outside.

6. The single crystal silicon wafer detection device according to claim 3, characterized in that: The first suction plate (20) is fixedly connected with a slider (25), the slider (25) is limitedly slidably arranged in the first slide groove (11), and a driving component for driving the slider (25) to move along the first slide groove (11) is arranged in the workbench (1); the driving component comprises a connecting rod (24), a rotating ring (26) and a first motor (27); a second slide groove (23) connected to the first slide groove (11) is opened in the workbench (1), and the rotating ring (26) is rotatably installed in the second slide groove (23) 3), the connecting rod (24) is fixedly connected to the rotating ring (26), a guide groove is provided on the connecting rod (24), the lower end of the slider (25) is connected to the sliding column (33), the sliding column (33) is slidably arranged in the connecting rod (24), the rotating ring (26) is coaxially fixedly connected to the gear ring (29), the gear ring (29 is meshed with the first gear (28), the first motor (27) is embedded and installed in the workbench (1), and the gear ring (29) is coaxially fixed on the output shaft of the first motor (27).

7. The single crystal silicon wafer detection device according to claim 1, characterized in that: An image processing and analysis module (7) is provided on the workbench (1); the camera (41) transmits the captured image to the image processing and analysis module (7); and the image processing and analysis module (7) processes and analyzes the received image.

8. The single crystal silicon wafer detection device according to claim 2, characterized in that: A first control button (37) and a second control button (38) are provided in the first chute (11); a first control switch (8) is provided on the second transport unit, and the first control switch (8) and the first control button (37) are both connected to the control circuit of the second transport unit; a second control switch (12) is provided on the third transport unit, and the second control switch (12) and the second control button (38) are both connected to the control circuit of the second transport unit.

Images