A wafer defect detection device for semiconductor production

Abstract

The present invention discloses a wafer defect detection device for semiconductor production, which relates to the field of wafer detection and solves the problem that the existing detection device has too large a clamping force on the wafer when turning the wafer over. It includes: a detection platform and a support plate. An installation disk is arranged on the outside of the support plate. An L-shaped bracket is arranged on the outside of the installation disk. An infrared detector is installed at one end of the L-shaped bracket. An installation frame is installed on the top of the detection platform. A detection box is installed on the top of the installation frame. A transparent placement plate is arranged inside the detection box; it further includes: a detection mechanism for double-sided detection of the wafer on the transparent placement plate, and the detection mechanism is installed inside the detection box; through the detection mechanism of the present invention, it is possible to detect the top and bottom of the wafer without flipping the wafer, reduce the contact with the wafer during detection, solve the problem that the traditional detection device has too large a clamping force on the wafer, prevent the wafer from being damaged, and thus achieve the effect of safe and multi-sided detection.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection, and specifically to a wafer defect detection device for semiconductor production. Background Art

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually made of high-purity single-crystalline silicon, in the shape of circular thin slices, mainly used for manufacturing integrated circuits and other microelectronic devices. They are extremely thin slices cut from high-purity single-crystalline silicon ingots. The manufacturing process includes heating and reducing silica ore in an electric arc furnace to produce crude silicon, then purifying and distilling it to make high-purity polysilicon. Finally, the polysilicon is melted by the Czochralski method and doped with a silicon crystal seed, and slowly pulled out to form a cylindrical single-crystalline silicon rod, which is then sliced, ground, and polished to obtain the final wafer.

[0003] As the cornerstone of semiconductor manufacturing, surface defects on wafers will have a significant impact on chip manufacturing and the performance of final products. Common types of wafer defects include particle defects, scratch defects, bubble defects, cracks and fractures, lattice defects, etc. It is necessary to use detection equipment to detect wafers. When existing detection equipment detects large-sized wafers, single-sided detection is difficult to ensure the comprehensiveness of wafer defect detection. A robotic arm or two symmetrical jigs are required to turn over the wafer. However, the material of the wafer is brittle. If the clamping force is too large, it will cause damage to the outer side of the wafer, resulting in low safety. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer defect detection device for semiconductor production to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A wafer defect detection device for semiconductor production, comprising: a detection platform and a support plate fixedly installed on the top of the detection platform. An installation disk is arranged on the outer side of the support plate. An L-shaped bracket is arranged on the outer side of the installation disk. An infrared detector is fixedly installed at one end of the L-shaped bracket away from the installation disk. An installation frame is fixedly installed on the top of the detection platform. A detection box is fixed on the top of the installation frame. A transparent placement plate is arranged inside the detection box. It further includes: a detection mechanism for double-sided detection of the wafer on the transparent placement plate, and the detection mechanism is installed inside the detection box; an alignment mechanism for automatically aligning the infrared detector with the transparent placement plate, and the alignment mechanism is installed on the outer side of the installation disk; a discharging mechanism for feeding and discharging the wafer in the detection box, and the discharging mechanism is installed inside the detection box.

[0007] Preferably, the detection mechanism includes two rotating rods symmetrically and rotatably installed inside the detection box. There are two symmetrically distributed toothed belts arranged inside the detection box. Two first gears are fixedly installed on the outer sides of the rotating rods and are symmetrically and respectively matched with the two toothed belts. A belt is fixedly installed between the two toothed belts. Detection holes are formed on the outer side of the belt. The top and bottom of the detection box are both open structures. The transparent placement plate is located inside the belt. A toothed ring is fixedly installed on one side of the mounting disk close to the detection box. One end of the rotating rod extends to the outside of the detection box. A second gear matched with the toothed ring is fixedly installed at one end of the rotating rod close to the mounting disk. A rotating cylinder is fixedly installed on one side of the mounting disk close to the support plate. The rotating cylinder is rotatably installed on the outside of the support plate. A driving motor is fixedly installed on one side of the support plate away from the mounting disk. A transmission gear is fixedly installed on the output end of the driving motor and on the outside of the rotating cylinder, and they are matched with each other.

[0008] Preferably, the distance adjusting mechanism includes a slider fixedly installed on one side of the L-shaped bracket close to the mounting disk. A sliding cavity for the slider to slide with limited position is formed on the outside of the mounting disk. A spring is fixedly installed between the inside of the sliding cavity and the outside of the slider. A pulley is fixedly installed on one side of the L-shaped bracket away from the slider. A support ring is fixedly installed on one side of the support plate close to the mounting disk. The outside of the pulley is in contact with the outside of the support ring. Two symmetrically distributed arc-shaped convex blocks are fixedly installed on the outside of the support ring. The maximum distance between the two arc-shaped convex blocks is greater than the width of the detection box.

[0009] Preferably, the discharging mechanism includes two L-shaped plates symmetrically and fixedly installed on one side of the detection box away from the mounting disk. A feeding port is formed on one side of the detection box close to the L-shaped plate. A screw rod is rotatably installed between one end of the L-shaped plate away from the detection box and the inside of the detection box. A fixed ring is fixedly installed on the outside of the transparent placement plate. Two moving blocks respectively matched with the two screw rods are fixedly installed on the top of the fixed ring. A third gear is fixedly installed at one end of the screw rod close to the left side of the detection box. A first arc-shaped rack and a second arc-shaped rack matched with the third gear are fixedly installed on the outside of the mounting disk. The first arc-shaped rack is an inner arc rack, and the second arc-shaped rack is an outer arc rack. A synchronous belt is installed between the two screw rods through a sprocket. The synchronous belt is located on one side of the detection box close to the mounting disk.

[0010] Preferably, a support rod is fixedly installed on one side of the detection box close to the mounting disk. One end of the support rod penetrates through the mounting disk, and the end of the support rod away from the detection box is fixedly connected to the outside of the support plate.

[0011] Preferably, four pressing strips distributed in a rectangular array are fixedly installed inside the detection box, and the outer sides of the pressing strips are in contact with the outer side of the toothed belt.

[0012] Preferably, a guide rod is fixedly installed inside the sliding cavity of the mounting disc, and the guide rod slidably penetrates through the slider.

[0013] Preferably, two symmetrically distributed mounting rods are fixedly installed on one side of the L-shaped bracket close to the mounting disc, a sliding ball is rotatably installed on the outer side of the mounting rod, and a long strip groove for the sliding ball to be limited and slide is formed on the outer side of the mounting disc.

[0014] Preferably, two symmetrically distributed baffle plates are fixedly installed inside the detection box, and a socket for the screw rod to be rotatably installed is fixedly installed on the outer side of the baffle plate.

[0015] Preferably, an elastic abutting block is slidably installed inside the socket, one end of the elastic abutting block close to the screw rod is of a hemispherical structure, and a plurality of spherically distributed spherical grooves are formed on the outer side of the screw rod.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] Through the detection mechanism, the present invention can place the wafer on the transparent placement plate, enable the infrared detector to detect the wafer, and when the top of the wafer is detected, the infrared detector can be moved to the lower part of the wafer to enable the infrared detector to detect the bottom of the wafer, without flipping the wafer, reducing the contact with the wafer during detection, solving the problem that the traditional detection device has too large clamping force on the wafer, preventing the wafer from being damaged, and thus achieving the effect of safe and multi-faceted detection.

[0018] Through the distance adjustment mechanism, when the mounting disc drives the infrared detector to move, the pulley can move from the support ring to the arc-shaped convex block, enabling the infrared detector to avoid the detection box, and when the detection end of the infrared detector is aligned with the wafer, the pulley returns to the support ring, and the detection end of the infrared detector can approach the wafer again, thereby improving the detection accuracy of the wafer.

[0019] Through the discharging mechanism, after the infrared detector has detected both the top and bottom of the wafer, the first arc-shaped rack can be made to contact the third gear on the screw rod, and the transparent placement plate can be moved out of the detection box through the two screw rods, facilitating the staff to take out the wafer, and when the second arc-shaped rack contacts the third gear, the transparent placement plate can be retracted into the detection box again, thereby facilitating the continuous detection of multiple wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 Schematic diagram of the detection box and belt structure in the present invention;

[0022] Figure 3 Schematic diagram of the mounting disc and gear ring structure in the present invention;

[0023] Figure 4 Schematic diagram of the support plate and rotating cylinder structure in the present invention;

[0024] Figure 5 Schematic diagram of the L-shaped bracket and slider structure in the present invention;

[0025] Figure 6 Schematic diagram of the pulley and support ring structure in the present invention;

[0026] Figure 7 Schematic diagram of the fixing ring and baffle structure in the present invention;

[0027] Figure 8 Schematic diagram of the third gear and first arc-shaped rack structure in the present invention.

[0028] In the figure: 1, detection platform; 2, support plate; 3, mounting disc; 4, L-shaped bracket; 5, infrared detector; 6, mounting rack; 7, detection box; 8, transparent placement plate; 9, rotating rod; 10, toothed belt; 11, first gear; 12, belt; 13, gear ring; 14, second gear; 15, rotating cylinder; 16, drive motor; 17, transmission gear; 18, slider; 19, spring; 20, pulley; 21, support ring; 22, arc-shaped convex block; 23, L-shaped plate; 24, screw; 25, fixing ring; 26, moving block; 27, third gear; 28, first arc-shaped rack; 29, second arc-shaped rack; 30, synchronous belt; 31, support rod; 32, pressing strip; 33, guide rod; 34, mounting rod; 35, sliding ball; 36, baffle; 37, socket; 38, elastic abutting block. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Embodiment 1: Please refer to Figures 1-8, A wafer defect detection device for semiconductor production in the illustration, including a detection platform 1 and a support plate 2 fixedly installed on the top of the detection platform 1. An installation disk 3 is arranged on the outside of the support plate 2, and an L-shaped bracket 4 is arranged on the outside of the installation disk 3. One end of the L-shaped bracket 4 far from the installation disk 3 is fixedly installed with an infrared detector 5 for defect detection of the wafer. When the installation disk 3 rotates, it can drive the infrared detector 5 to rotate through the L-shaped bracket 4. An installation frame 6 is fixedly installed on the top of the detection platform 1, and a detection box 7 is fixed on the top of the installation frame 6. A support rod 31 is fixedly installed on one side of the detection box 7 close to the installation disk 3. One end of the support rod 31 penetrates through the installation disk 3, and the end of the support rod 31 far from the detection box 7 is fixedly connected to the outside of the support plate 2. A transparent placement plate 8 is arranged inside the detection box 7 for placing the wafer, and the transparent placement plate 8 is made of high-transparency glass material, which is convenient for the infrared detector 5 to detect the wafer defects through the transparent placement plate 8; It further includes: a detection mechanism for double-sided detection of the wafer on the transparent placement plate 8, and the detection mechanism is installed inside the detection box 7;

[0031] The detection mechanism includes two rotating rods 9 symmetrically and rotatably installed inside the detection box 7. There are two symmetrically distributed toothed belts 10 arranged inside the detection box 7. Four pressing strips 32 arranged in a rectangular array are fixedly installed inside the detection box 7. The outer side of the pressing strip 32 is in contact with the outer side of the toothed belt 10, providing positioning for the installation of the toothed belt 10. Two first gears 11 symmetrically and respectively matched with the two toothed belts 10 are fixedly installed on the outer side of the rotating rod 9. When the two rotating rods 9 rotate, the two toothed belts 10 can be driven to rotate and move synchronously through the first gears 11. A belt 12 is fixedly installed between the two toothed belts 10, and the toothed belt 10 can drive the belt 12 to rotate and move synchronously. Detection holes are formed on the outer side of the belt 12. The top and bottom of the detection box 7 are both open structures. The transparent placement plate 8 is located inside the belt 12. When the detection end of the infrared detector 5 is aligned with the detection holes of the belt 12, the wafers on the transparent placement plate 8 can be detected. A toothed ring 13 is fixedly installed on one side of the mounting plate 3 close to the detection box 7. One end of the rotating rod 9 extends to the outside of the detection box 7. A second gear 14 matched with the toothed ring 13 is fixedly installed at one end of the rotating rod 9 close to the mounting plate 3. When the mounting plate 3 rotates, the toothed ring 13 can drive the second gear 14 to rotate, so that the second gear 14 drives the rotating rod 9 to rotate, and the detection holes on the belt 12 can move from the top of the detection box 7 to the bottom of the detection box 7. The infrared detector 5 can detect the defects of the wafers from below without flipping the wafers. A rotating cylinder 15 is fixedly installed on one side of the mounting plate 3 close to the support plate 2. The rotating cylinder 15 is rotatably installed on the outside of the support plate 2. A driving motor 16 is fixedly installed on one side of the support plate 2 away from the mounting plate 3. Driven gears 17 are fixedly installed on the output end of the driving motor 16 and on the outer side of the rotating cylinder 15 respectively, so that the driving motor 16 can drive the rotating cylinder 15 to rotate through the two driven gears 17, and the rotating cylinder 15 drives the mounting plate 3 to rotate intermittently.

[0032] Embodiment 2: Please refer to Figures 4-6, this embodiment further elaborates on Embodiment 1. The distance adjustment mechanism shown in the figure includes a slider 18 fixedly installed on the side of the L-shaped bracket 4 close to the mounting plate 3. A sliding cavity for the slider 18 to be limited and slide is provided on the outer side of the mounting plate 3. A spring 19 is fixedly installed between the inner side of the sliding cavity and the outer side of the slider 18. A guide rod 33 is fixedly installed on the inner side of the sliding cavity of the mounting plate 3. The guide rod 33 slidably penetrates the slider 18. When the L-shaped bracket 4 moves, it can drive the slider 18 to move along the outer side of the guide rod 33 and the inner side of the sliding cavity, and compress the spring 19. The guide rod 33 is located inside the spring 19 and can provide auxiliary support for the spring 19 to prevent the spring 19 from skewing. A pulley 20 is fixedly installed on the side of the L-shaped bracket 4 away from the slider 18. A support ring 21 is fixedly installed on the side of the support plate 2 close to the mounting plate 3. The outer side of the pulley 20 is in contact with the outer side of the support ring 21. When the mounting plate 3 rotates, it can drive the pulley 20 on the L-shaped bracket 4 to move along the outer side of the support ring 21. Two symmetrically distributed arc-shaped protrusions 22 are fixedly installed on the outer side of the support ring 21. The maximum distance between the two arc-shaped protrusions 22 is greater than the width of the detection box 7. When the pulley 20 moves from the outer side of the support ring 21 to the outer side of the arc-shaped protrusion 22, the pulley 20 can push the L-shaped bracket 4 to move, so that the L-shaped bracket 4 drives the infrared detector 5 away from the detection box 7, facilitating the movement of the infrared detector 5. When the pulley 20 comes into contact with the support ring 21 again, the infrared detector 5 can be aligned directly below the detection platform 1. Two symmetrically distributed mounting rods 34 are fixedly installed on the side of the L-shaped bracket 4 close to the mounting plate 3. A sliding ball 35 is rotatably installed on the outer side of the mounting rod 34. A long slot for the sliding ball 35 to be limited and slide is provided on the outer side of the mounting plate 3. When the L-shaped bracket 4 moves, it can drive the sliding ball 35 to move along the long slot on the mounting plate 3 through the mounting rod 34, so that the sliding ball 35 can provide auxiliary pulling force for the L-shaped bracket 4 and improve the supporting force of the L-shaped bracket 4 on the infrared detector 5.

[0033] Embodiment 3: Please refer to Figures 2-8, this embodiment further illustrates other embodiments. The discharging mechanism in the figure includes two L-shaped plates 23 symmetrically and fixedly installed on the side of the detection box 7 away from the mounting plate 3. An inlet is provided on one side of the detection box 7 close to the L-shaped plate 23 for taking out and putting in the transparent placement plate 8. A screw 24 is rotatably installed between the end of the L-shaped plate 23 away from the detection box 7 and the inner side of the detection box 7. A fixing ring 25 is fixedly installed on the outer side of the transparent placement plate 8. Two moving blocks 26 respectively cooperating with the two screws 24 are fixedly installed on the top of the fixing ring 25. When the two screws 24 rotate, the fixing ring 25 can be driven by the moving blocks 26 to enter or move out of the detection box 7. One end of the screw 24 close to the left side of the detection box 7 is fixedly installed with a third gear 27. A first arc-shaped rack 28 and a second arc-shaped rack 29 cooperating with the third gear 27 are fixedly installed on the outer side of the mounting plate 3. The first arc-shaped rack 28 is an inner arc rack, and the second arc-shaped rack 29 is an outer arc rack. When the mounting plate 3 rotates, the first arc-shaped rack 28 and the second arc-shaped rack 29 can be driven to make circular motions synchronously. When the first arc-shaped rack 28 contacts the third gear 27, the first gear 11 can be driven to rotate clockwise, so that the screw 24 moves the fixing ring 25 out of the detection box 7 through the moving block 26. When the second arc-shaped rack 29 contacts the third gear 27, the screw 24 can send the fixing ring 25 into the detection box 7 through the moving block 26. A synchronous belt 30 is installed between the two screws 24 through sprocket transmission. The synchronous belt 30 is a transmission chain in the prior art. When the screw 24 equipped with the third gear 27 rotates, the other screw 24 can be driven to rotate synchronously through the synchronous belt 30. The synchronous belt 30 is located on the side of the detection box 7 close to the mounting plate 3. Two symmetrically distributed baffles 36 are fixedly installed on the inner side of the detection box 7. A socket 37 for the screw 24 to rotate and install is fixedly installed on the outer side of the baffle 36 to provide support for the screw 24. An elastic abutting block 38 is slidably installed inside the socket 37. One end of the elastic abutting block 38 close to the screw 24 is of a hemispherical structure. A plurality of centrally symmetrically distributed spherical grooves are provided on the outer side of the screw 24. The elasticity of the elastic abutting block 38 can be used to position the stopped screw 24 to prevent the third gear 27 from rotating back.

[0034] Working principle: First, the staff places the wafer to be detected on the transparent placement plate 8, starts the drive motor 16, and the drive motor 16 drives the rotating cylinder 15 to rotate through two transmission gears 17. The rotating cylinder 15 drives the mounting plate 3 to rotate, and the mounting plate 3 drives the infrared detector 5 on the L-shaped bracket 4 to perform a circular motion. At the same time, the pulley 20 of the L-shaped bracket 4 moves along the outside of the arc-shaped convex block 22. When the infrared detector 5 moves from the left side of the detection box 7 to directly above the detection box 7, the pulley 20 can move from the arc-shaped convex block 22 to the support ring 21. Utilizing the elasticity of the spring 19, the slider 18 is pushed to move along the outside of the sliding cavity on the mounting plate 3 and the outside of the guide rod 33. The slider 18 drives the L-shaped bracket 4 to move synchronously, so that the pulley 20 contacts the support ring 21, and the detection end of the infrared detector 5 can approach the top of the detection box 7. At the same time, the mounting plate 3 drives the second gear 14 to rotate through the toothed ring 13, and the second gear 14 drives the rotating rod 9 to rotate. The rotating rod 9 drives two toothed belts 10 to rotate and move synchronously through two first gears 11. The two toothed belts 10 drive the belt 12 to move synchronously, so that the detection holes on the belt 12 move to the top of the detection box 7 and are aligned with the detection end of the infrared detector 5. At the same time, the mounting plate 3 drives the second arc-shaped rack 29 and the first arc-shaped rack 28 to rotate synchronously, and the second arc-shaped rack 29 contacts the third gear 27. The third gear 27 drives the corresponding screw rod 24 to rotate, and the screw rod 24 drives another screw rod 24 to rotate synchronously through the synchronous belt 30. The two screw rods 24 can drive the fixed ring 25 to move through the moving block 26, so that the transparent placement plate 8 on the fixed ring 25 moves and enters the detection box 7. Thus, the infrared detector 5 can detect the wafer on the transparent placement plate 8 through the detection holes on the belt 12. Then, after the infrared detector 5 finishes detecting the top of the wafer, the drive motor 16 is started again, so that the detection holes on the belt 12 move to directly below the wafer, and the infrared detector 5 can detect the bottom of the wafer through the transparent placement plate 8. At the same time, the pulley 20 moves from the outside of the support ring 21 to the outside of another arc-shaped convex block 22. The pulley 20 can push the L-shaped bracket 4 to move. The L-shaped bracket 4 drives the slider 18 to move along the outside of the guide rod 33 and the inside of the sliding cavity, and compresses the spring 19, so that the L-shaped bracket 4 drives the infrared detector 5 to move away from the detection box 7. Utilizing the resilience of the spring 19, when the pulley 20 moves away from the arc-shaped convex block 22, the pulley 20 can contact the outside of the support ring 21 again, and the infrared detector 5 can be aligned directly below the detection platform 1. Finally, the drive motor 16 is started again, and the mounting plate 3 drives the first arc-shaped rack 28 to contact the third gear 27, so that the third gear 27 rotates counterclockwise. The screw rod 24 can move the wafer on the transparent placement plate 8 out of the detection box 7 through the moving block 26 and the fixed ring 25, and the staff can take out the detected wafer. In this process, there is no need to turn over the wafer, thus achieving the effect of safe and multi-sided detection, which is convenient for continuous detection of multiple wafers.

[0035] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer defect detection device for semiconductor production, characterized in that: include: The detection platform and the support plate, the outer side of the support plate is provided with a mounting plate, the outer side of the mounting plate is provided with an L-shaped bracket, one end of the L-shaped bracket is provided with an infrared detector for performing defect detection on the wafer, the top of the detection platform is provided with a mounting frame, the top of the mounting frame is provided with a detection box, the inner side of the detection box is provided with a transparent placement plate for placing the wafer; Also includes: The detection mechanism is used for double-sided detection of wafers on a transparent placement plate. The detection mechanism is installed on the inner side of the detection box. The detection mechanism includes two rotating rods rotatably installed on the inner side of the detection box. Two toothed belts are arranged on the inner side of the detection box. Two first gears respectively matched with the two toothed belts are installed on the outer side of the rotating rod. When the two rotating rods rotate, the two toothed belts can be driven to rotate synchronously by the first gear. A belt is installed between the two toothed belts. The toothed belt drives the belt to rotate synchronously. A detection hole is opened on the outer side of the belt. The detection end of the infrared detector is aligned with the detection hole of the belt. The wafer on the transparent placement plate can be detected. A gear ring is installed on one side of the mounting plate. A second gear matched with a gear ring is installed at one end of the rotating rod. The mounting plate can drive the second gear to rotate through the gear ring, so that the second gear drives the rotating rod to rotate, so that the detection hole on the belt can be moved from the top of the detection box to the bottom of the detection box. The infrared detector can detect defects on the wafer from below. A rotating drum is installed on one side of the mounting plate. The rotating drum is rotatably installed on the outer side of the support plate. A driving motor is installed on one side of the support plate. The output end of the driving motor and the outer side of the rotating drum are both installed with matching transmission gears. The driving motor drives the rotating drum to rotate through two transmission gears, and the rotating drum drives the mounting plate to rotate, and the mounting plate drives the infrared detector on the L-shaped bracket to move. A distance-adjusting mechanism is used for automatically aligning the infrared detector with the transparent placement plate. The distance-adjusting mechanism is installed on the outer side of the mounting plate. The distance-adjusting mechanism includes a slider installed on one side of the L-shaped bracket. A sliding cavity for limiting the sliding of the slider is provided on the outer side of the mounting plate. A spring is installed between the inner side of the sliding cavity and the outer side of the slider. A pulley is installed on one side of the L-shaped bracket. A support ring is installed on one side of the support plate. The outer side of the pulley contacts the outer side of the support ring. Two arc-shaped protrusions are installed on the outer side of the support ring. The mounting plate can drive the pulley on the L-shaped bracket to move along the outer side of the support ring. When the pulley moves from the outer side of the support ring to the outer side of the arc-shaped protrusion, the pulley can push the L-shaped bracket to move, so that the L-shaped bracket drives the infrared detector away from the detection box, and when the pulley contacts the support ring again, the infrared detector can be aligned to the bottom of the detection platform. The discharging mechanism is used to feed and discharge the wafers in the detection box. The discharging mechanism is installed on the inner side of the detection box. The discharging mechanism includes two L-shaped plates installed on one side of the detection box. A screw is rotatably installed between one end of the L-shaped plate and the inner side of the detection box. A fixing ring is installed on the outer side of the transparent placement plate. Two moving blocks respectively matched with the two screws are installed on the top of the fixing ring. A third gear is installed at one end of the screw close to the left side of the detection box. A first arc-shaped rack and a second arc-shaped rack matched with the third gear are installed on the outer side of the mounting plate. When the two screws rotate, the fixing ring can be driven by the moving block to enter or move out of the detection box. The first arc-shaped rack is an inner arc rack, and the second arc-shaped rack is an outer arc rack. The mounting plate can drive the first arc-shaped rack and the second arc-shaped rack to perform circular motion synchronously, and a synchronous belt is rotatably installed between the two screws.

2. The semiconductor wafer defect detection device according to claim 1, characterized in that: A support rod is installed on one side of the detection box, and one end of the support rod away from the detection box is connected to the outer side of the support plate.

3. The semiconductor wafer defect detection device according to claim 1, characterized in that: Four pressure strips are installed on the inner side of the detection box, and the outer sides of the pressure strips are in contact with the outer side of the toothed belt.

4. The semiconductor wafer defect detection device according to claim 1, characterized in that: A guide rod is installed inside the sliding cavity of the installation plate, and the guide rod slides through the sliding block.

5. The semiconductor wafer defect detection device according to claim 1, characterized in that: Two mounting rods are installed on one side of the L-shaped bracket, a sliding ball is rotatably installed on the outer side of the mounting rod, and a long groove for limiting the sliding of the sliding ball is opened on the outer side of the mounting plate.

6. The semiconductor wafer defect detection device according to claim 1, characterized in that: Two baffles are installed on the inner side of the detection box, and a sleeve seat for rotatably installing the screw rod is installed on the outer side of the baffle.

7. The semiconductor wafer defect detection device according to claim 6, characterized in that: An elastic stop block is slidably mounted on the inner side of the sleeve, one end of the elastic stop block is a hemispherical structure, and a plurality of spherical grooves are arranged on the outer side of the screw rod.

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