Chip aging jig

Abstract

The invention relates to the technical field of chip detection, in particular to a chip aging jig which comprises a chip placement module, a fixed module, a conductive module, a movable module, a heat dissipation module, a floating module and a pressing module. The chip placement module is arranged on the fixed module, the conductive module is arranged on the fixed module, the heat dissipation module is arranged on the movable module, and the movable module is buckled with the fixed module to form a fixed area; the pressing module is arranged on the floating module, the pressing module is buckled with the movable module to form a floating area, and the floating module presses the chip body, so that the chip body is conductively connected with the conductive module; a fixed area is formed by the movable module and the fixed module, so that the structural stability is enhanced; and the pressing module and the movable module form a floating area, so that the position of the floating module can be freely adjusted in the floating area to adapt to chips of different sizes, and through tight buckling of the pressing module and the movable module, uniform pressing of a chip body is realized, the test precision is enhanced, the practicability is high, and the application prospect is good.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, in particular to a chip aging fixture. Background Art

[0002] Chips, also known as microcircuits, microchips, and integrated circuits, refer to silicon wafers containing integrated circuits. They are very small and are often part of computers or other electronic devices. After the chips are manufactured, they need to be aged on an aging board. Before the test, the chips need to be placed in a test seat. The test seat usually uses a single press-to-open fixture. When placing the chip, the fixture needs to be pressed manually. After the test seat is opened, the chip is placed manually.

[0003] The existing chip fixture needs to be pressed manually when testing the clamped chip, and the chip test fixture has no floating space, which is easy to damage the chip and is inconvenient to develop vigorously. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a chip aging fixture, which solves the problems that the existing chip fixture needs to be manually pressed when testing the clamped chip, and the chip testing fixture has no floating space, which is easy to damage the chip and is inconvenient to develop vigorously.

[0005] The technical solution adopted by the present invention is: a chip aging fixture, including a chip placement module, a fixed module, a conductive module, a movable module, a heat dissipation module, a floating module and a pressing module; the chip placement module is arranged on the fixed module for placing the chip body; the conductive module is arranged on the fixed module, and one end of the conductive module is electrically connected to the chip; the heat dissipation module is arranged on the movable module, and one end of the movable module is buckled with the fixed module to form a fixed area; the pressing module is arranged on the floating module, and one end of the pressing module is buckled with the movable module to form a floating area, the floating module is arranged in the floating area, and the floating module is used to press the chip body on the chip placement module so that the chip body is conductively connected to the conductive module.

[0006] A further improvement to the above scheme is that the chip placement module includes a chip mounting plate, a chip placement plate, a chip limiting plate and a probe in sequence; the chip mounting plate is provided with a chip contact hole, the chip placement plate is provided with a chip placement groove, the chip limiting plate is provided with a chip limiting hole, the chip contact hole, the chip placement groove and the chip limiting hole are connected, the chip body is provided on the chip limiting plate, one end of the probe passes through the chip contact hole, the chip placement groove and the chip limiting hole, so that the probe can be used to abut the chip body on the chip limiting plate.

[0007] A further improvement to the above scheme is that the fixed module includes a fixed base, a fixed plate and a fixed sleeve, the fixed base is provided with a fixed groove, the fixed plate is arranged in the fixed groove, a fixed placement groove is provided on the fixed plate, the chip mounting plate is arranged in the fixed groove, the chip limiting plate is arranged in the fixed placement groove, the chip placement plate is arranged between the fixed groove and the fixed placement groove, the fixed sleeve is arranged at one end of the fixed base, and one end of the movable module is arranged at the fixed sleeve; a conductive placement groove is provided on the side of the fixed base close to the fixed plate, and the conductive module is arranged in the conductive placement groove.

[0008] A further improvement to the above scheme is that the conductive module includes a conductive seat, a conductive terminal and a conductive sheet, conductive limit blocks are arranged on both sides of the conductive seat, one end of the conductive terminal passes through the conductive seat, one end of the conductive terminal is electrically connected to the chip body, and the other end is electrically connected to the conductive sheet.

[0009] A further improvement to the above scheme is that the movable module includes a movable cover, a movable buckle and a movable connecting end; the movable buckle is arranged at one end of the movable cover, and the movable connecting end is arranged at the other end of the movable cover relative to the movable buckle; the movable buckle buckles the movable module and the fixed module, and one end of the movable connecting end is connected to the fixed shaft sleeve, so that the movable module is movably arranged on the fixed module; a plurality of movable through grooves are arranged on the movable cover.

[0010] A further improvement to the above solution is that pressing grooves are provided on both sides of the movable cover, and guide grooves are provided on the movable cover close to the pressing grooves, and the guide grooves are inclined surfaces.

[0011] A further improvement to the above scheme is that the heat dissipation module includes a heat dissipation substrate, a heat dissipation fin and a heat dissipation core, the heat dissipation fins are arranged on both sides of the heat dissipation substrate to form an embedded cavity, the embedded cavity is used for the heat dissipation substrate to be installed on the movable module, and a plurality of heat dissipation cores are provided, and the plurality of heat dissipation cores are evenly distributed on the heat dissipation fins.

[0012] A further improvement to the above solution is that the floating module includes a floating block, and a plurality of floating through grooves are arranged on the floating block, and the plurality of floating through grooves are communicated with the movable through groove.

[0013] A further improvement to the above scheme is that the pressing module includes a pressing plate, a pressing buckle and a connecting component; the pressing buckle is arranged on both sides of the pressing plate, one end of the pressing buckle is clamped in the pressing groove along the guide groove, and the connecting component is arranged on the pressing plate to install and fix the movable module.

[0014] A further improvement to the above scheme is that a plurality of pressing grooves are arranged on the pressing plate, the connecting assembly includes a movable connecting element, a limiting connecting element and a connecting connecting element, one end sleeve of the limiting connecting element is provided with an elastic element, the pressing groove is the same as the floating groove and the movable groove, and the movable connecting element, the limiting connecting element and the connecting connecting element respectively pass through the pressing groove, the floating groove and the movable groove.

[0015] The beneficial effects of the present invention are:

[0016] Compared with the existing chip aging test, the present invention ensures that the chip body can be stably placed on the fixed module through the chip placement module, providing a solid foundation for subsequent operations; and the electrical connection between the conductive module and the chip body realizes the stable transmission of the signal for aging test; a fixed area is formed by the movable module and the fixed module to enhance the structural stability, and a floating area is formed by the ingenious combination of the pressing module and the movable module to facilitate the movement of the floating module, so that the floating module can freely adjust its position in the floating area to adapt to chips of different sizes, and a uniform pressing of the chip body is achieved through the tight fit of the pressing module and the movable module, and an efficient, stable and reliable aging test of the chip body is achieved through the coordinated work of each module, which has strong practicality and good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional diagram of the chip aging fixture of the present invention;

[0018] Figure 2 This is a front view of the chip aging fixture of the present invention;

[0019] Figure 3 A top view of the chip aging fixture of the present invention;

[0020] Figure 4 for Figure 3 Sectional view at AA in the middle;

[0021] Figure 5 This is a schematic diagram of the structure of the chip aging fixture of the present invention;

[0022] Figure 6 It is an exploded schematic diagram of the chip aging fixture of the present invention;

[0023] Figure 7 FIG. 4 is an exploded schematic diagram of the chip aging fixture of the present invention from another angle.

[0024] Description of reference numerals: chip placement module 10, chip mounting plate 11, chip contact hole 112, chip placement plate 12, chip placement groove 121, chip limiting plate 13, chip limiting hole 131, probe 14;

[0025] Fixed module 20, fixed base 21, fixed plate 22, fixed sleeve 23, fixed groove 24, fixed placement groove 25;

[0026] Conductive module 30, conductive seat 31, conductive terminal 32, conductive sheet 33, conductive limit block 34;

[0027] The movable module 40, the movable cover 41, the movable buckle 42, the movable connecting end 43, the movable through slot 44, the press-fitting slot 45, and the guide slot 46;

[0028] Heat dissipation module 50, heat dissipation substrate 51, heat dissipation sheet 52, heat dissipation core 53, embedded cavity 54;

[0029] Floating module 60, floating block 61, floating slot 62;

[0030] Pressing module 70 , pressing plate 71 , pressing slot 711 , pressing buckle 72 , connecting assembly 73 , movable connecting element 74 , limiting connecting element 75 , elastic element 751 . DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0034] like Figure 1 to Figure 7As shown, in an embodiment of the present invention, a chip aging fixture is involved, including: a chip placement module 10, a fixed module 20, a conductive module 30, a movable module 40, a heat dissipation module 50, a floating module 60 and a pressing module 70; the chip placement module 10 is arranged on the fixed module 20 for chip body placement; the conductive module 30 is arranged on the fixed module 20, and one end of the conductive module 30 is electrically connected to the chip; the heat dissipation module 50 is arranged on the movable module 40, and one end of the movable module 40 is buckled with the fixed module 20 to form a fixed area; the pressing module 70 is arranged on the floating module 60, and one end of the pressing module 70 is buckled with the movable module 40 to form a floating area, and the floating module 60 is arranged in the floating area, and the floating module 60 is used to press the chip body on the chip placement module 10 so that the chip body is conductively connected to the conductive module. In this embodiment, the chip placement module 10 ensures that the chip body can be stably placed on the fixed module 20, providing a solid foundation for subsequent operations; and the electrical connection between the conductive module 30 and the chip body realizes the stable transmission of signals for aging testing; the floating area for the floating module 60 to move is formed by the ingenious combination of the movable module 40 and the fixed module 20, so that the floating module 60 can freely adjust its position in the floating area to adapt to chips of different sizes, and the pressing module 70 is tightly fastened with the movable module 40.

[0035] like Figure 6 to Figure 7 As shown, the chip placement module 10 includes a chip mounting plate 11, a chip placement plate 12, a chip limiting plate 13 and a probe 14 in sequence; the chip mounting plate 11 is provided with a chip contact hole 112, the chip placement plate 12 is provided with a chip placement groove 121, the chip limiting plate 13 is provided with a chip limiting hole 131, the chip contact hole 112, the chip placement groove 121 and the chip limiting hole 131 are connected, the chip body is provided on the chip limiting plate 13, one end of the probe 14 passes through the chip contact hole 112, the chip placement groove 121 and the chip limiting hole 131, so that the probe 14 can abut the chip body on the chip limiting plate 13. In this embodiment, the chip mounting plate 11, the chip placement plate 12, the chip limiting plate 13 and the probe 14 are sequentially arranged to achieve precise positioning and stable connection of the chip in the aging test, and the chip contact hole 112, the placement hole and the limiting hole are interconnected to facilitate the accurate placement of the chip body on the limiting plate, thereby preventing displacement during the test; one end of the probe 14 passes through each hole to abut the chip body, thereby optimizing the signal transmission efficiency; the overall structure is compact and practical.

[0036] The fixed module 20 includes a fixed base 21, a fixed plate 22 and a fixed sleeve 23. The fixed base 21 is provided with a fixed groove 24, the fixed plate 22 is arranged in the fixed groove 24, the fixed plate 22 is provided with a fixed placement groove 25, the chip mounting plate 11 is arranged in the fixed groove 24, the chip limiting plate 13 is arranged in the fixed placement groove 25, the chip placement plate 12 is arranged between the fixed groove 24 and the fixed placement groove 25, the fixed sleeve 23 is arranged at one end of the fixed base 21, and one end of the movable module 40 is arranged on the fixed sleeve 23; a conductive placement groove is arranged on the side of the fixed base 21 close to the fixed plate 22, and the conductive module 30 is arranged in the conductive placement groove. In this embodiment, the fixing groove 24 on the fixed base 21 is closely matched with the fixing plate 22 to ensure that the chip mounting plate 11 and the chip limiting plate 13 are firmly positioned to prevent displacement or falling off during the chip testing process. The setting of the fixed shaft sleeve 23 provides reliable support for the precise positioning and smooth operation of the movable module 40, and the conductive placement groove is used for the placement of the conductive module 30 to ensure the stability and safety of power transmission, meet the high-precision requirements of the chip aging test, and effectively improve the test accuracy.

[0037] The conductive module 30 includes a conductive seat 31, a conductive terminal 32 and a conductive sheet 33. Conductive stoppers 34 are provided on both sides of the conductive seat 31. One end of the conductive terminal 32 passes through the conductive seat 31. One end of the conductive terminal 32 is electrically connected to the chip body, and the other end is electrically connected to the conductive sheet 33. In this embodiment, the conductive seat 31 ensures the accurate positioning and stable installation of the conductive terminal 32 through the conductive stoppers 34 on both sides thereof, effectively preventing poor contact caused by vibration or misoperation, and one end of the conductive terminal 32 is reliably electrically connected to the chip body, and the other end is tightly connected to the conductive sheet 33, constructing an efficient current transmission path, ensuring the signal stability and transmission efficiency of the chip during the aging test, and improving the accuracy of the test, with strong practicality.

[0038] The movable module 40 includes a movable cover 41, an movable buckle 42 and an movable connection end 43; the movable buckle 42 is arranged at one end of the movable cover 41, and the movable connection end 43 is arranged at the other end of the movable cover 41 relative to the movable buckle 42; the movable buckle 42 is buckled with the movable module 40 and the fixed module 20, and one end of the movable connection end 43 is connected to the fixed shaft sleeve 23, so that the movable module 40 is movably arranged on the fixed module 20; a plurality of movable through grooves 44 are arranged on the movable cover 41. In this embodiment, the movable cover 41 is used for opening and closing, which provides great convenience for the placement and removal of the chip body. The movable buckle 42 is used to tightly buckle the movable module 40 and the fixed module 20, which ensures the stability of the first fixed area, effectively prevents the displacement of the chip during the aging test, and improves the accuracy of the test; and the movable connection end 43 realizes the flexible rotation of the movable module 40 on the fixed module 20 through the fixed shaft sleeve 23, which is convenient for adjusting the angle, meets the diverse test requirements, and has strong practicality.

[0039] The movable cover 41 is provided with pressing and snapping grooves 45 on both sides, and the movable cover 41 is provided with guide grooves 46 near the pressing and snapping grooves 45, and the guide grooves 46 are inclined surfaces. In this embodiment, the pressing and snapping grooves 45 are used to allow the pressing module 70 to press the movable module 40, so that the pressing module 70 can press the floating module 60 in the movable module 40 to the chip body on the fixed module 20, and the pressing and snapping grooves 45 are provided with guide grooves 46 to improve the pressing accuracy of the pressing module 70, which is highly practical.

[0040] The heat dissipation module 50 includes a heat dissipation substrate 51, a heat sink 52 and a heat dissipation core 53. The heat sink 52 is arranged on both sides of the heat dissipation substrate 51 to form an embedded cavity 54. The embedded cavity 54 is used for the heat dissipation substrate 51 to be installed on the movable module 40. There are multiple heat dissipation cores 53, and the multiple heat dissipation cores 53 are evenly distributed on the heat sink 52. In this embodiment, the heat dissipation substrate 51 is used as the cornerstone of heat conduction, and the heat sink 52 arranged on both sides thereof form an embedded cavity 54, which is convenient for stable installation on the movable module 40, ensuring the stability and efficiency of the heat transfer path; and the uniform distribution design of multiple heat dissipation cores 53 on the heat sink 52 greatly increases the heat dissipation area, accelerates the heat dissipation speed, optimizes the heat conduction and convection inside the fixture, and effectively reduces the temperature of the chip during the aging test, improves the accuracy of the test, and prolongs the service life of the chip body.

[0041] The floating module 60 includes a floating block 61, and a plurality of floating slots 62 are provided on the floating block 61, and the plurality of floating slots 62 are communicated with the movable slot 44. In this embodiment, the floating slots 62 are communicated with the movable slot 44 so that the pressing module 70 can press and fix them, thereby enhancing the fastening between the movable module 40 and the pressing module 70, thereby enhancing the accuracy of the pressing module 70 pressing the floating module 60 toward the chip body, and having strong practicality.

[0042] The pressing module 70 includes a pressing plate 71, a pressing buckle 72 and a connecting assembly 73; the pressing buckle 72 is arranged on both sides of the pressing plate 71, one end of the pressing buckle 72 is clamped in the pressing clamping groove 45 along the guide groove 46, and the connecting assembly 73 is arranged on the pressing plate 71 to install and fix the movable module 40. In this embodiment, the synergistic effect of the pressing plate 71 and the pressing buckle 72 provides accurate positioning and support for the floating module 60; the design of the pressing buckle 72 being clamped in the pressing clamping groove 45 along the guide groove 46 not only simplifies the installation process, but also enhances the stability of the structure, and the setting of the connecting assembly 73 enables the movable module 40 to be firmly installed on the pressing plate 71, effectively preventing the module from loosening or displacement during the aging test, thereby ensuring the accuracy and reliability of the test results.

[0043] A floating pressing plate 71 is provided inside the pressing plate 71. A plurality of pressing grooves 711 are provided on the pressing plate 71. The connecting assembly 73 includes a movable connecting element 74 and a limiting connecting element 75. An elastic element 751 is sleeved on one end of the limiting connecting element 75. The pressing groove 711 is the same as the floating groove 62 and the movable groove 44. The movable connecting element 74, the limiting connecting element 75 and the pressing groove 711 respectively pass through the floating groove 62 and the movable groove 44. In this embodiment, the elastic element 751 on the limiting connection element 75 is used to provide elastic reset force for the pressing plate 71, thereby enhancing the usability of the pressing plate 71 and extending the service life of the pressing plate 71; the multiple pressing grooves 711 designed on the pressing plate 71 and the precise coordination with the movable connection element 74, the limiting connection element 75 and the like ensure the stable installation and convenient adjustment of the connecting component 73; the connecting component 73 passing through the pressing grooves 711, the floating grooves 62 and the movable grooves 44 realizes the precise pressing and positioning of the chip component, effectively preventing displacement and loosening during the test process, enhancing the applicability and stability of the connecting component 73, simplifying the operation process, and having strong practicality.

[0044] In an embodiment of the present invention, a chip aging fixture is provided, comprising: a chip placement module 10, a fixed module 20, a conductive module 30, a movable module 40, a heat dissipation module 50, a floating module 60 and a pressing module 70; the chip placement module 10 is arranged on the fixed module 20 for placing the chip body; the conductive module 30 is arranged on the fixed module 20, and one end of the conductive module 30 is electrically connected to the chip; the heat dissipation module 50 is arranged on the movable module 40, and one end of the movable module 40 is buckled with the fixed module 20 to form a fixed area; the pressing module 70 is arranged on the floating module 60, and one end of the pressing module 70 is buckled with the movable module 40 to form a floating area, and the floating module 60 is arranged in the floating area, and the floating module 60 is used to press the chip body on the chip placement module 10 to form a fixed area. The chip body is conductively connected to the conductive module; the chip placement module 10 ensures that the chip body can be stably placed on the fixed module 20, providing a solid foundation for subsequent operations; and the electrical connection between the conductive module 30 and the chip body realizes stable signal transmission for aging testing; a fixed area is formed by the movable module 40 and the fixed module 20 to enhance structural stability, and a floating area is formed by the ingenious combination of the pressing module 70 and the movable module 40 to facilitate the movement of the floating module 60, so that the floating module 60 can freely adjust its position in the floating area to adapt to chips of different sizes, and the chip body is uniformly pressed by the tight fit of the pressing module 70 and the movable module 40, and the efficient, stable and reliable aging test of the chip body is realized by the coordinated work of each module, which has strong practicality and good application prospects.

[0045] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A chip aging fixture, characterized in that: include: Chip placement module, fixed module, conductive module, movable module, heat dissipation module, floating module and pressing module; The chip placement module is arranged on the fixed module for placing the chip body; The conductive module is arranged on the fixed module, and one end of the conductive module is electrically connected to the chip; the heat dissipation module is arranged on the movable module, and one end of the movable module is buckled with the fixed module to form a fixed area; the pressing module is arranged on the floating module, and one end of the pressing module is buckled with the movable module to form a floating area, and the floating module is arranged in the floating area, and the floating module is used to press the chip body on the chip placement module so that the chip body is conductively connected to the conductive module.

2. The chip aging fixture according to claim 1, characterized in that: The chip placement module includes a chip mounting plate, a chip placement plate, a chip limiting plate and a probe in sequence; the chip mounting plate is provided with a chip contact hole, the chip placement plate is provided with a chip placement groove, the chip limiting plate is provided with a chip limiting hole, the chip contact hole, the chip placement groove and the chip limiting hole are connected, the chip body is provided on the chip limiting plate, one end of the probe passes through the chip contact hole, the chip placement groove and the chip limiting hole, so that the probe can abut the chip body on the chip limiting plate.

3. The chip aging fixture according to claim 1, characterized in that: The fixed module includes a fixed base, a fixed plate and a fixed sleeve, the fixed base is provided with a fixed groove, the fixed plate is arranged in the fixed groove, the fixed plate is provided with a fixed placement groove, the chip mounting plate is arranged in the fixed groove, the chip limiting plate is arranged in the fixed placement groove, the chip placement plate is arranged between the fixed groove and the fixed placement groove, the fixed sleeve is arranged at one end of the fixed base, and one end of the movable module is arranged at the fixed sleeve; a conductive placement groove is arranged on a side of the fixed base close to the fixed plate, and the conductive module is arranged in the conductive placement groove.

4. The chip aging fixture according to claim 3, characterized in that: The conductive module includes a conductive seat, a conductive terminal and a conductive sheet. Conductive limit blocks are arranged on both sides of the conductive seat. One end of the conductive terminal passes through the conductive seat. One end of the conductive terminal is electrically connected to the chip body, and the other end is electrically connected to the conductive sheet.

5. The chip aging fixture according to claim 1, characterized in that: The movable module includes a movable cover, a movable buckle and a movable connecting end; the movable buckle is arranged at one end of the movable cover, and the movable connecting end is arranged at the other end of the movable cover relative to the movable buckle; the movable buckle buckles the movable module and the fixed module, and one end of the movable connecting end is connected to the fixed shaft sleeve, so that the movable module is movably arranged on the fixed module; a plurality of movable through grooves are arranged on the movable cover.

6. The chip aging fixture according to claim 5, characterized in that: Pressing grooves are arranged on both sides of the movable cover, and guide grooves are arranged on the movable cover close to the pressing grooves, and the guide grooves are inclined surfaces.

7. The chip aging fixture according to claim 5, characterized in that: The heat dissipation module includes a heat dissipation substrate, a heat dissipation fin and a heat dissipation core. The heat dissipation fins are arranged on both sides of the heat dissipation substrate to form an embedded cavity. The embedded cavity is used for the heat dissipation substrate to be installed on the movable module. There are multiple heat dissipation cores, and the multiple heat dissipation cores are evenly distributed on the heat dissipation fins.

8. The chip aging fixture according to claim 7, characterized in that: The floating module comprises a floating block, on which a plurality of floating through slots are arranged, and the plurality of floating through slots are communicated with the movable through slot.

9. The chip aging fixture according to claim 1, characterized in that: The pressing module includes a pressing plate, a pressing buckle and a connecting component; the pressing buckle is arranged on both sides of the pressing plate, one end of the pressing buckle is clamped in the pressing groove along the guide groove, and the connecting component is arranged on the pressing plate to install and fix the movable module.

10. The chip aging fixture according to claim 8, characterized in that: A plurality of pressing grooves are arranged on the pressing plate, and the connecting assembly includes a movable connecting element, a limiting connecting element and a connecting connecting element. An end sleeve of the limiting connecting element is provided with an elastic element. The pressing groove is the same as the floating groove and the movable groove. The movable connecting element, the limiting connecting element and the connecting connecting element respectively penetrate the pressing groove, the floating groove and the movable groove.

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