Integrated chip test positioning structure

Abstract

The invention belongs to the technical field of semiconductor chip processing, and discloses an integrated chip test positioning structure which comprises a test board, a feeding mechanism arranged on the test board and used for feeding chips, and a test mechanism arranged on the test board and used for testing the chips. A finished product conveying mechanism used for collecting successfully-tested chips is further arranged on the testing mechanism, and the feeding mechanism comprises a stock bin arranged on the testing table and an automatic feeding mechanism arranged at the bottom of the stock bin and used for conveying the chips in the stock bin into the testing mechanism to be tested. The test mechanism comprises a mounting seat detachably connected with the test board, a turntable rotationally arranged on the mounting seat and a test module arranged in the center of the turntable. Different test modules are replaced by replacing the mounting seat, detection is performed according to test requirements, qualified chips are collected in a unified manner, unqualified chips are collected in a waste frame, manual screening is not needed, and waste of labor cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip processing, and in particular to an integrated chip testing and positioning structure. Background Art

[0002] Integrated circuit chips, as a highly sophisticated microelectronic device or component, are the cornerstone of modern electronic technology. They integrate various basic components required for circuits, such as transistors, resistors, capacitors and inductors, on a small semiconductor chip through advanced process technology. This integration method not only greatly reduces the size of electronic equipment, but also significantly improves its performance and reliability.

[0003] In terms of functions, integrated circuit chips are able to perform a variety of complex electronic tasks, ranging from simple logical operations to complex data processing. They are widely used in various fields such as computers, communication equipment, consumer electronics, automotive electronics, etc., and are indispensable core components in modern technology products.

[0004] In terms of integration methods, the production process of integrated circuit chips involves the precise arrangement and connection of hundreds of millions of tiny components on a semiconductor chip. This is usually achieved through a series of complex process steps such as photolithography, etching, and ion implantation. Each step requires extremely high precision and cleanliness. These components form a complex circuit network on the chip and work together to achieve specific functions.

[0005] During the production process, integrated circuit chips need to go through multiple stages of processing and testing, from the preparation of raw materials to the growth of wafers, to the manufacture and packaging of circuits. Each link is crucial, especially the packaging step, which not only protects fragile circuit components from damage from the external environment, but also provides a connection interface with external circuits.

[0006] Testing plays a vital role in the production process of integrated circuit chips. Through strict testing, it can be ensured that the performance of each chip meets the design requirements, thereby avoiding defective products from entering the market. The testing content usually includes functional testing, performance testing, reliability testing and other aspects to ensure that the chip can work stably under various conditions.

[0007] To this end, for example, a Chinese patent, application announcement number CN221746126U, discloses a positioning device for integrated circuit chip testing, including a test bench, a support frame is provided on the test bench, a first electric push rod is provided at the lower end of the support frame, a test module is provided at the driving end of the first electric push rod, one side of the test module is slidably connected to the support frame through a track structure, the test bench is rotatably connected to a turntable through a bearing, the upper end of the test bench is recessed inward to form a groove matching the turntable, a rotating column is provided on the turntable, the lower end of the rotating column is connected to a toothed belt through the turntable and the test bench, a first motor is provided at the lower end of the test bench, a first driving gear is provided at the driving end of the first motor, the first driving gear is meshed with the toothed belt, and a top plate is provided at the upper end of the rotating column, which can perform alternating rotational positioning of multiple chips, thereby improving the efficiency of integrated circuit chip testing and automatically loading and locking chips of different sizes.

[0008] But it has the following problems:

[0009] (1) Although it can automatically load materials, solving the problem of manual loading at the loading end, it is still necessary to rely on manual screening to separate defective products and finished products for packaging after inspection, which does not completely solve the problem of wasted labor costs.

[0010] (2) The detection of integrated chips includes functional testing, performance testing, reliability testing and other aspects. Although the above structure can alternately locate multiple chips, it cannot perform multiple positioning tests simultaneously. Summary of the invention

[0011] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide an integrated chip testing and positioning structure. When the working surface of the die head is not parallel to the core carrier board, when the die head touches the core carrier board, the die head can adaptively adjust its own angle, so that the thickness of the solder after pressing can be more uniform and the shape can be more complete. The die head is replaceable and can be replaced with a matching die head according to processing requirements for processing.

[0012] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides an integrated chip test positioning structure, comprising:

[0013] Test bench;

[0014] A loading mechanism, arranged on the test bench for loading chips;

[0015] A testing mechanism, arranged on a test bench for testing the chip;

[0016] A finished product conveying mechanism is also arranged on the testing mechanism for collecting the chips that have passed the test, and a positioning mechanism for positioning the chip during testing is also arranged between the testing mechanism and the testing table.

[0017] Preferably, the feeding mechanism comprises:

[0018] Silo, arranged on the test bench;

[0019] An automatic loading mechanism is arranged at the bottom of the silo and is used to transport the chips in the silo to the testing mechanism for testing;

[0020] Wherein, the inner wall of the silo is arranged with an adjustment mechanism for adjusting the inner wall space.

[0021] Preferably, the automatic loading mechanism comprises a loading bin, a loading plate is arranged in the loading bin directly below the loading bin, and an electric push rod which can drive the loading plate to move back and forth in the loading bin is arranged on one side of the loading plate.

[0022] Preferably, the adjustment mechanism comprises:

[0023] Clamping plates, the clamping plates are symmetrically arranged in the silo;

[0024] Adjusting bolts, two of which are arranged symmetrically, and the two adjusting bolts are rotatably arranged on the side wall of the silo;

[0025] Wherein, the clamping plate is arranged parallel to the side wall of the silo, and the threaded end of the adjusting bolt is rotatably connected to the clamping plate.

[0026] Preferably, the testing mechanism comprises:

[0027] A mounting base, detachably connected to the test bench;

[0028] A turntable is rotatably arranged on a mounting seat;

[0029] The test module is arranged at the center of the turntable;

[0030] There are several chip seats in a circular array on the outer edge of the turntable, and a servo motor capable of driving the turntable to rotate is arranged at the bottom of the turntable.

[0031] Preferably, the test module comprises:

[0032] A fixed column, wherein the fixed column is a straight prism structure;

[0033] The test unit is arranged in plurality and arranged one by one on each side of the fixed column; wherein the number of the test units and the sides of the fixed column is consistent with the number of the chip seats, and a bearing is arranged between the fixed column and the turntable.

[0034] Preferably, the testing unit comprises:

[0035] The testing department is a device for testing chips;

[0036] The second electric push rod is fixedly arranged on the side of the fixed column, and the telescopic end of the second electric push rod is fixedly connected to the testing part;

[0037] The testing unit includes but is not limited to a functional testing device, a performance testing device, and a reliability testing device.

[0038] Preferably, the finished product conveying mechanism comprises a conveyor belt, and the conveyor belt is arranged directly below the last testing section.

[0039] Preferably, the positioning mechanism comprises:

[0040] Positioning holes, a plurality of the positioning holes are arranged, and the plurality of the positioning holes are evenly spaced and distributed on the turntable;

[0041] A positioning rod, which is plugged into the positioning hole and can limit the rotation of the turntable when the positioning rod enters the positioning hole;

[0042] The locking mechanism is used to control the positioning rod to enter and exit the positioning hole to control the rotation of the turntable;

[0043] Wherein, a reset mechanism for resetting the positioning rod is arranged in the positioning hole, and the reset mechanism includes a spring arranged in the positioning hole and a reset plate arranged on the spring for pushing the positioning rod to move.

[0044] Preferably, the locking mechanism comprises:

[0045] Gear ring;

[0046] Push blocks, which are evenly distributed on the inner ring of the gear ring and push the positioning rod to insert into the positioning hole under the rotation of the gear ring;

[0047] Wherein, a servo motor 2 for driving the gear ring to rotate forward and reverse is arranged on one side of the gear ring.

[0048] The beneficial effects of the present invention are:

[0049] The present invention arranges an adjustment mechanism for adjusting the inner wall space on the inner wall of the silo, thereby meeting the feeding requirements of chips of different sizes.

[0050] The present invention arranges a conveyor belt just below the last test section to collect qualified chips uniformly and collect unqualified chips in a waste frame, without the need for manual screening, thereby reducing the waste of labor costs.

[0051] The present invention arranges the test mechanism to be detachably connected to the test bench, and selects a corresponding number of test modules to be installed on the test bench according to the chip test quantity requirement, thereby achieving testing of various types of chips and improving the versatility of equipment use. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0053] Figure 1 A schematic diagram of the structure of an integrated chip test positioning structure provided by an embodiment of the present invention.

[0054] Figure 2 A schematic diagram of a positioning structure of an integrated chip test positioning structure provided in an embodiment of the present invention.

[0055] Figure 3 for Figure 2 Enlarged view of point A in .

[0056] Figure 4 A schematic diagram of a test mechanism structure of an integrated chip test positioning structure provided in an embodiment of the present invention.

[0057] Description of reference numerals:

[0058] 1-test bench, 2-bin, 201-connecting plate, 3-loading bin, 4-loading plate, 5-electric push rod 1, 6-clamp, 7-adjusting bolt, 8-turntable, 9-chip holder, 10-servo motor 1, 11-fixing column, 12-bearing, 13-electric push rod 2, 14-conveyor belt, 15-positioning hole, 16-positioning rod, 17-spring, 18-reset plate, 19-gear ring, 20-push block, 21-servo motor 2. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] Embodiment 1:

[0061] like Figures 1 to 4As shown, the present invention provides an integrated chip test positioning structure, including a test bench 1, a loading mechanism arranged on the test bench 1 for loading chips, and a testing mechanism arranged on the test bench 1 for testing chips;

[0062] The test mechanism is also provided with a finished product conveying mechanism for collecting the successfully tested chips and conveying the chips that have passed the test;

[0063] The loading mechanism includes a silo 2 arranged on the test bench 1 and an automatic loading mechanism arranged at the bottom of the silo 2 for conveying the chips in the silo 2 to the test mechanism for testing. Specifically, the automatic loading mechanism includes a loading silo 3, and a loading plate 4 is arranged in the loading silo 3 directly below the silo 2. An electric push rod 5 is arranged on one side of the loading plate 4, which can drive the loading plate 4 to move back and forth in the loading silo 3. The chips to be tested are stacked in the silo 2 and fall into the loading silo 3 in turn under the action of gravity. The electric push rod 5 pushes the loading plate 4 to push the chip at the bottom of the loading silo 3 for loading.

[0064] The inner wall of the silo 2 is provided with an adjustment mechanism for adjusting the inner wall space, so as to match the detection of chips of different sizes.

[0065] Specifically, the adjustment mechanism includes a clamping plate 6 symmetrically arranged in the silo 2, two adjusting bolts 7 symmetrically arranged on the side wall of the silo 2, the adjusting bolts 7 are rotatably connected to the silo 2, the clamping plate 6 is arranged parallel to the side wall of the silo 2, the threaded end of the adjusting bolt 7 is rotatably connected to the clamping plate 6, and the contact surface between the clamping plate 6 and the chip is arranged as a layer of flexible material for protecting the chip;

[0066] The distance between the two clamping plates 6 can be adjusted by rotating the adjusting bolt 7, so that chips of different sizes can be stored, and small chips can be prevented from tipping over in the silo 2 due to too much space when testing.

[0067] Specifically, the finished product conveying mechanism includes a conveyor belt 14, which is arranged just below the last testing section. Finally, the chips that pass all the testing links without any problems fall on the conveyor belt 14 for output.

[0068] Embodiment 2:

[0069] On the basis of the first embodiment, since the performance, function and application of chips of different batches are different, the items to be tested are also different. In order to be able to test chips of different batches, specifically, the testing mechanism includes a mounting seat 101 detachably connected to the test bench 1, a turntable 8 rotatably arranged on the mounting seat 101 and a test module arranged at the center of the turntable 8. By replacing the mounting seat 101, different test modules are replaced, and detection is performed according to the test requirements;

[0070] Among them, there are several chip seats 9 in a circular array on the outer edge of the turntable 8, and a servo motor 10 that can drive the turntable 8 to rotate is arranged at the bottom of the turntable 8. The chip seat 9 is used to place the chip. It is a prior art. Currently, all chip testing equipments are arranged with this structure to clamp the chip when testing the chip. The specific structure will not be introduced in detail here, except that there is a conveyor belt 14 directly below the chip seat 9 at the last detection position. The bottom of the chip seat 9 at the front detection position is arranged with a waste frame for collecting chips that fail the detection.

[0071] Among them, the test module includes a fixed column 11 of a straight prism structure and a plurality of test units, the test units are arranged one by one on each side of the fixed column 11, the number of the test units and the side of the fixed column 11 is consistent with the number of the chip seat 9, a bearing 12 is arranged between the fixed column 11 and the turntable 8, the test unit includes a test part for testing the chip and an electric push rod 13 fixedly arranged on the side of the fixed column 11, the telescopic end of the electric push rod 13 is fixedly connected to the test part, the test part includes but is not limited to a functional test device, a performance test device, and a reliability test device. The test part is a test component that can perform various tests on the chip, which is also an existing mature technology, and is not within the technical scope of this application document, and will not be described in detail here;

[0072] In order to improve the stability of the test mechanism, a connecting plate 201 is arranged between the electric push rod 13 and the silo 2 to form the test mechanism, the silo 2, the upper silo 3 and the test bench 1 into a whole.

[0073] During the test, when the electric push rod 1 5 pushes the loading plate 4 to push the chip in the loading bin 3 onto the chip seat 9, the chip is fixed by the chip seat 9, and then the electric push rod 2 13 pushes the test part to slide downward along the fixed column 11, so that the test part contacts the chip on the chip seat 9 and detects the chip. If there is a problem with the test, the chip will be directly discarded by the chip seat 9 and fall into the waste frame below the chip seat 9. If there is no problem with the test, the turntable 8 rotates under the control of the servo motor 10, so as to rotate the chip to the second inspection station. At this time, the inspection part located at the second station also performs a second inspection on the chip under the push of the electric push rod 2 13. If the test is qualified, the above operation is repeated to enter the third inspection, and the subsequent tests are repeated until the chips that pass all the tests without problems fall on the conveyor belt 14, and the chips with test problems are collected in the waste frame.

[0074] Embodiment three:

[0075] On the basis of the second embodiment, in order to keep the turntable 8 still during detection and prevent the turntable 8 from rotating, thereby preventing the test unit from accidentally damaging the chip when moving downward under the control of the electric push rod 2 13, a positioning mechanism for chip test positioning is also arranged between the test mechanism and the test table 1.

[0076] Specifically, the positioning mechanism includes a plurality of positioning holes 15, a positioning rod 16 plugged into the positioning holes 15, and a locking mechanism for controlling the positioning rod 16 to enter and exit the positioning holes 15 to complete the control of the rotation of the turntable 8. The positioning holes 15 are evenly spaced on the turntable 8, and when the positioning rod 16 enters the positioning hole 15, the rotation of the turntable 8 can be restricted;

[0077] Among them, a reset mechanism for resetting the positioning rod 16 is arranged in the positioning hole 15, and the reset mechanism includes a spring 17 arranged in the positioning hole 15 and a reset plate 18 arranged on the spring 17 for pushing the positioning rod 16 to move. The reset plate 18 can withdraw the positioning rod 16 in the positioning hole 15 from the positioning hole 15 under the rebound action of the spring 17.

[0078] Specifically, the locking mechanism includes a gear ring 19 and a push block 20. The push blocks 20 are evenly distributed on the inner ring of the gear ring 19. When the gear ring 19 rotates, the positioning rod 16 is pushed to be inserted into the positioning hole 15. Specifically, the contact end of the push block 20 and the positioning rod 16 is a wedge-shaped structure, so that when the push block 20 moves, the positioning rod 16 is pushed to be inserted into the positioning hole 15. A servo motor 21 for driving the gear ring 19 to rotate forward and reverse is arranged on one side of the gear ring 19. A gear meshingly connected with the driving gear ring 19 is arranged at the output end of the servo motor 21.

[0079] When the turntable 8 stops rotating, the chip moves from the previous inspection station to the next inspection station. At this time, the servo motor 21 controls the gear ring 19 to rotate. The rotation of the gear ring 19 drives the push block 20 to move, thereby pushing the positioning rod 16 to insert into the positioning hole 15, pushing the reset plate 18 into the positioning hole 15, compressing the spring 17, and thus positioning the position of the turntable 8. When the inspection is completed and the turntable 8 needs to rotate again, the positioning of the turntable 8 needs to be released first, and the servo motor 21 controls the gear ring 19 to rotate in the opposite direction, so that the push block 20 is separated from the positioning rod 16, and the spring 17 rebounds to reset the reset plate 18, thereby pushing the positioning rod 16 out of the positioning hole 15.

[0080] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An integrated chip test positioning structure, characterized in that: include: Test bench (1); A loading mechanism, arranged on the test bench (1) and used for loading chips; A testing mechanism, arranged on the test bench (1) and used for testing the chip; A finished product conveying mechanism is also arranged on the testing mechanism for collecting the chips that have passed the test, and a positioning mechanism for positioning the chip during testing is also arranged between the testing mechanism and the testing table (1).

2. An integrated chip test positioning structure as claimed in claim 1, characterized in that: The feeding mechanism comprises: A silo (2) is arranged on the test bench (1); An automatic loading mechanism, arranged at the bottom of the material bin (2) and used for conveying the chips in the material bin (2) to the testing mechanism for testing; Wherein, the inner wall of the silo (2) is arranged with an adjustment mechanism for adjusting the inner wall space.

3. An integrated chip test positioning structure as claimed in claim 2, characterized in that: The automatic loading mechanism comprises a loading bin (3), a loading plate (4) is arranged in the loading bin (3) directly below the bin (2), and an electric push rod (5) is arranged on one side of the loading plate (4) and can drive the loading plate (4) to move back and forth in the loading bin (3).

4. An integrated chip test positioning structure as claimed in claim 2, characterized in that: The regulating mechanism comprises: A clamping plate (6), wherein the clamping plate (6) is symmetrically arranged in the silo (2); An adjusting bolt (7), wherein two adjusting bolts (7) are arranged, and the two adjusting bolts (7) are symmetrically arranged, and the two adjusting bolts (7) are rotatably arranged on the side wall of the silo (2); The clamping plate (6) is arranged parallel to the side wall of the silo (2), and the threaded end of the adjusting bolt (7) is rotatably connected to the clamping plate (6).

5. The integrated chip test positioning structure according to claim 1, characterized in that: The testing organization includes: A mounting seat (101) detachably connected to the test bench (1); A turntable (8) rotatably arranged on a mounting seat (101); A test module is arranged at the center of the turntable (8); There are a number of chip seats (9) in a circular array on the outer edge of the turntable (8), and a servo motor (10) capable of driving the turntable (8) to rotate is arranged at the bottom of the turntable (8).

6. An integrated chip test positioning structure as claimed in claim 5, characterized in that: The test module comprises: A fixed column (11), wherein the fixed column (11) is a straight prism structure; A test unit, wherein a plurality of the test units are arranged, one by one, on each side of the fixed column (11); The number of the test units and the side surfaces of the fixing column (11) are consistent with the number of the chip holder (9), and a bearing (12) is arranged between the fixing column (11) and the turntable (8).

7. An integrated chip test positioning structure as claimed in claim 6, characterized in that: The test unit comprises: The testing department is a device for testing chips; The second electric push rod (13) is fixedly arranged on the side of the fixed column (11), and the telescopic end of the second electric push rod (13) is fixedly connected to the testing part; The testing unit includes but is not limited to a functional testing device, a performance testing device, and a reliability testing device.

8. An integrated chip test positioning structure as claimed in claim 7, characterized in that: The finished product conveying mechanism comprises a conveyor belt (14), and the conveyor belt (14) is arranged directly below the last testing section.

9. The integrated chip test positioning structure according to claim 1, characterized in that: The positioning mechanism comprises: Positioning holes (15), a plurality of the positioning holes (15) are arranged, and the plurality of the positioning holes (15) are evenly spaced and distributed on the rotating disk (8); A positioning rod (16), wherein the positioning rod (16) is plugged into the positioning hole (15), and when the positioning rod (16) enters the positioning hole (15), the rotation of the turntable (8) can be restricted; A locking mechanism, used to control the positioning rod (16) to enter and exit the positioning hole (15) to complete the control of the rotation of the turntable (8); A reset mechanism for resetting the positioning rod (16) is arranged in the positioning hole (15), and the reset mechanism comprises a spring (17) arranged in the positioning hole (15) and a reset plate (18) arranged on the spring (17) for pushing the positioning rod (16) to move.

10. The integrated chip test positioning structure according to claim 8, characterized in that: The locking mechanism comprises: Gear ring (19); Push blocks (20), the push blocks (20) are evenly distributed on the inner ring of the gear ring (19), and push the positioning rod (16) to insert into the positioning hole (15) under the rotation of the gear ring (19); Wherein, a servo motor 2 (21) for driving the gear ring (19) to rotate forward and reverse is arranged on one side of the gear ring (19).

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