Liquid cooling unit, heat dissipation device and electronic equipment

Abstract

The invention discloses a liquid cooling unit, a heat dissipation device and electronic equipment. The liquid cooling unit, the heat dissipation device and the electronic equipment have the advantages of good heat dissipation effect and lighter weight. The liquid cooling unit is suitable for being matched with an air cooling unit and used for conducting heat dissipation on a heating component in the electronic equipment, the liquid cooling unit is provided with a heat absorption surface and internally provided with a flowing path, and the heat absorption surface is used for making contact with / being connected with the heating component so as to absorb heat of the heating component. A liquid medium flowing along a flowing path is arranged in the liquid cooling unit, the liquid medium flows along the flowing path to release heat, the liquid cooling unit forms a plurality of fins which are parallel to one another and arranged at intervals in a back-and-forth curling and stacking mode, and therefore the fin heat dissipation module is formed, and the liquid cooling unit is of a thin film sheet structure.

Description

Technical Field

[0001] The present invention relates to the field of electronic equipment, and in particular to a liquid cooling unit, a heat dissipation device and electronic equipment. Background Art

[0002] With the development of electronic technology, especially the demand for terminal electronic consumer products to be thin and portable has become more and more obvious. Taking laptops as an example, existing laptop heat dissipation generally adopts air cooling or liquid cooling. However, whether air cooling or liquid cooling is adopted, the heat dissipation effect is still not up to expectations. In addition, these two solutions will use fins made of metal for heat dissipation. Due to the relatively high density of metal, the resulting fin heat dissipation module does not have an advantage in weight.

[0003] Therefore, there is an urgent need for a liquid cooling unit, a heat dissipation device and an electronic device with good heat dissipation effect and lighter weight to overcome the above defects. Summary of the invention

[0004] A first object of the present invention is to provide a liquid cooling unit with good heat dissipation effect and light weight.

[0005] The second object of the present invention is to provide a heat dissipation device with good heat dissipation effect and lighter weight.

[0006] A third object of the present invention is to provide an electronic device comprising a heat dissipation device with good heat dissipation effect and light weight.

[0007] To achieve the above-mentioned purpose, the liquid cooling unit provided by the present invention is suitable for cooperating with an air cooling unit and is used to dissipate heat from heat-generating components in electronic equipment. The liquid cooling unit has a heat absorbing surface and a flow path inside. The heat absorbing surface is used to contact / connect with the heat-generating components to absorb the heat of the heat-generating components. The liquid cooling unit is provided with a liquid medium flowing along the flow path. The liquid medium releases heat along the flow of the flow path. The liquid cooling unit forms a plurality of fins that are parallel to each other and spaced apart by curling and stacking back and forth, thereby forming a fin heat dissipation module. The liquid cooling unit is a thin film sheet structure.

[0008] Preferably, the heat absorbing surface is provided with a metal sheet for direct contact / connection with a heat generating component.

[0009] Preferably, the liquid cooling unit is a single, integral and flexible thin film sheet structure, and the flow path extends along the deployment direction of the liquid cooling unit.

[0010] Preferably, the liquid cooling unit further comprises a liquid cooling pump for circulating the liquid medium in the flow path.

[0011] Preferably, a flow path is provided in the fin where the heat absorbing surface is located.

[0012] Preferably, the heat absorbing surface is a planar structure or a discontinuous surface structure composed of a plurality of curved surfaces.

[0013] Preferably, the liquid cooling unit includes an upper diaphragm and a lower diaphragm, a surface of at least one of the upper diaphragm and the lower diaphragm is formed with strip grooves, the upper diaphragm and the lower diaphragm are stacked and connected to form a flow path in the portion surrounding the strip grooves; the material of the upper diaphragm and the lower diaphragm is graphite, graphene, copper or aluminum.

[0014] To achieve the second purpose mentioned above, the present invention provides a heat dissipation device, including an air cooling unit and the above-mentioned liquid cooling unit, the air cooling unit has a blade structure, the air cooling unit is connected to the liquid cooling unit, and the air cooling unit is used to discharge the heat released by the liquid cooling unit into the atmosphere.

[0015] Preferably, the liquid cooling unit further has a mounting surface different from the heat absorbing surface, and the air cooling unit is mounted on the mounting surface.

[0016] To achieve the third objective mentioned above, the electronic device provided by the present invention includes the above-mentioned heat dissipation device.

[0017] Compared with the prior art, the heat dissipation device of the present invention includes a liquid cooling unit and an air cooling unit, wherein the liquid cooling unit forms a plurality of fins that are parallel to each other and spaced apart by curling and stacking back and forth, thereby forming a fin heat dissipation module, which increases the exposed area within a limited space to facilitate heat dissipation. Moreover, the liquid cooling unit is a thin film sheet structure, which is lighter and requires less space, thereby reducing the weight of the heat dissipation device and facilitating structural layout. In addition, a metal sheet is arranged on the heat absorbing surface, and the metal sheet is directly used to contact or connect with the heat generating component, thereby improving the heat conduction efficiency and thermal conductivity, and improving the heat dissipation performance of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of the heat dissipation device when the liquid cooling unit of the present invention adopts the first embodiment and the heat generating component is connected to the heat absorbing surface.

[0019] Figure 2 is hidden Figure 1 A three-dimensional view of the heat dissipation device behind the heat-generating component at another angle.

[0020] Figure 3 yes Figure 2 The heat dissipation device is shown in a three-dimensional view at another angle.

[0021] Figure 4 This is a perspective view of a liquid cooling unit according to the present invention when using the first embodiment.

[0022] Figure 5 yes Figure 4 A perspective view of the liquid cooling unit is shown at another angle.

[0023] Figure 6 It is a three-dimensional diagram of the heat dissipation device when the liquid cooling unit of the present invention adopts the second implementation scheme and the heat-generating component is connected to the heat-absorbing surface.

[0024] Figure 7 is hidden Figure 6 A three-dimensional view of the heat dissipation device behind the heat-generating component at another angle.

[0025] Figure 8 yes Figure 7 The heat dissipation device is shown in a three-dimensional view at another angle.

[0026] Fig. 9 It is a perspective view of the liquid cooling unit of the present invention when using the second implementation scheme.

[0027] Fig.10 yes Fig. 9 A perspective view of the liquid cooling unit is shown at another angle.

[0028] Fig.11 It is a schematic diagram of the partial structure of the liquid cooling unit of the present invention. DETAILED DESCRIPTION

[0029] In order to explain the technical content and structural features of the present invention in detail, further description will be given below in combination with the implementation modes and the accompanying drawings.

[0030] like Figure 1 and Figure 6 As shown, the present invention discloses a heat dissipation device 100, which is used to dissipate heat from a heat generating component in an electronic device. The electronic device may be a laptop computer, a tablet computer, etc. The heat generating component 200 may be a heat pipe, a GPU, a chip, etc. In the embodiment provided by the present invention, the heat generating component 200 is described as a heat pipe, but this does not constitute a limitation to the present invention.

[0031] like Figures 1 to 5As shown, the heat dissipation device 100 of the present invention includes a liquid cooling unit 10 and an air cooling unit 20. The liquid cooling unit 10 has a heat absorbing surface 11 and a flow path 12 therein. The heat absorbing surface 11 absorbs the heat of the heat generating component 200 by contact / connection. A liquid medium flowing along the flow path 12 is provided in the liquid cooling unit 10. Preferably, the liquid medium can be water or a coolant. The flow of the liquid medium along the flow path 12 releases heat. The air cooling unit 20 has a blade structure, and the air cooling unit 20 is used to discharge the heat released by the liquid cooling unit 10 into the atmosphere, and the heat dissipation device 100 dissipates heat from the heat generating component 200. The liquid cooling unit 10 forms a plurality of fins that are parallel to each other and spaced apart by curling and stacking back and forth, and finally obtains a fin heat dissipation module, which increases the exposed area in a limited space and enhances the heat dissipation effect. The liquid cooling unit 10 is a thin film sheet structure, which is lighter than the traditional fin heat dissipation module structure, and helps to reduce the weight of the heat dissipation device 100. The heat absorbing surface 11 is provided with a metal sheet 13 for directly contacting / connecting with the heat generating component 200. Since the metal sheet 13 has good thermal conductivity, the heat of the heat generating component 200 is better transferred to the liquid cooling unit 10 by utilizing the good thermal conductivity of the metal sheet 13, thereby improving the thermal conductivity and thermal efficiency of the liquid cooling unit 10 and the heat generating component 200.

[0032] The heat dissipation device 100 of the present invention includes a liquid cooling unit 10 and an air cooling unit 20, wherein the liquid cooling unit 10 forms a plurality of fins that are parallel to each other and spaced apart by curling and stacking back and forth, and finally obtains a fin heat dissipation module, thereby increasing the area exposed to the outside in a limited space to facilitate heat dissipation. Moreover, the liquid cooling unit 10 is a thin film sheet structure, which is lighter and requires less space, thereby reducing the weight of the heat dissipation device 100 and facilitating structural layout. In addition, a metal sheet 13 is provided on the heat absorbing surface 11, and the metal sheet 13 is directly used to contact or connect with the heat generating component 200, thereby improving the heat conduction efficiency and thermal conductivity, and improving the heat dissipation performance of the heat dissipation device 100.

[0033] Preferably, the liquid cooling unit 10 can be rolled back and forth from top to bottom to form a Figure 2 , Figure 4 , Figure 5 The multiple fins shown can also be rolled back and forth from left to right to form a stacked Figure 7 , Fig. 9 and Fig.10 Multiple fins shown.

[0034] Furthermore, the liquid cooling unit 10 is a single integral and flexible thin film sheet structure, that is, the formed fins are connected end to end. The liquid cooling unit 10 is a single integral structure, the structural integrity is better, and it is flexible, which is convenient for curling and folding. The flow path 12 extends along the unfolding direction of the liquid cooling unit 10, and the flow path 12 is throughout the liquid cooling unit 10. The flow path 12 is continuous and uninterrupted, so that the liquid medium can flow stably in the flow path 12, and the heat transfer is more uniform, so that the heat dissipation device 100 has better thermal uniformity. Since the liquid cooling unit 10 is a single integral structure in the form of a thin film, the flow path 12 extends along the unfolding direction of the liquid cooling unit 10, and the film is curled and folded, which effectively increases the flow path of the liquid and achieves a better heat dissipation effect.

[0035] like Figure 2 , Figure 4 , Figure 8 , Fig. 9 As shown, the liquid cooling unit 10 also includes a liquid cooling pump 30 for circulating the liquid medium in the flow path 12. Preferably, the liquid cooling pump 30 uses a piezoelectric ceramic pump, but is not limited thereto. After the heat is transferred to the liquid medium, the inverse piezoelectric effect of the piezoelectric material of the piezoelectric ceramic pump is utilized. Under the action of the electric field, the piezoelectric ceramic material undergoes tensile / compressive deformation, driving the metal sheet under the ceramic sheet to produce an upward convex or downward concave deformation, generating a driving force to promote the flow of the liquid, so that the heated liquid medium flows in the flow path 12, and the heat is diffused to all parts of the liquid cooling unit 10. The high-speed airflow generated by the air cooling unit 20 (such as a fan, but not limited thereto) performs convective heat exchange with the surface of the liquid cooling unit 10, bringing the heat to the air, and at the same time, the liquid medium is cooled and enters the next cycle of heat absorption and heat release, thereby achieving the purpose of efficient heat dissipation and heat uniformity, improving the heat dissipation capacity of the product, and bringing better performance to the product.

[0036] like Figures 2 to 10 As shown, a flow path 12 is provided in the fin where the heat absorbing surface 11 is located, and the heat transferred to the metal sheet 13 is directly conducted to the flow path 12. The liquid medium in the flow path 12 carries the heat and transfers it to the liquid cooling unit 10 under the drive of the piezoelectric ceramic pump. The liquid cooling unit 10 has a high heat conduction characteristic in the XY direction to achieve the purpose of temperature uniformity. The metal sheet 13 is connected to the heat absorbing surface 11 by one of gluing, welding and hot melting to ensure the stability of the metal sheet 13 installed on the heat absorbing surface 11.

[0037] like Figures 1 to 10As shown, the liquid cooling unit 10 also has a mounting surface 14 different from the heat absorbing surface 11, and the air cooling unit 20 is mounted on the mounting surface 14. The mounting surface 14 and the heat absorbing surface 11 are arranged on different sides of the liquid cooling unit 10, and the two are independent of each other and do not affect each other, and there is no structural interference between the heat generating component 200 and the air cooling unit 20.

[0038] Specifically, if we use Figures 1 to 5 In the scheme in which the liquid cooling unit 10 is rolled back and forth from top to bottom to form a plurality of fins (hereinafter referred to as the first embodiment), the heat absorbing surface 11 is arranged on the bottom side of the fin heat dissipation module, and the mounting surface 14 is arranged on the rear side of the fin heat dissipation module. Figures 6 to 10 The liquid cooling unit 10 is curled and stacked from left to right to form a solution of multiple fins (hereinafter referred to as Implementation Option 2). At this time, the heat absorption surface 11 is arranged on the bottom side of the fin heat dissipation module, and the installation surface 14 is arranged on the rear side of the fin heat dissipation module.

[0039] However, it is worth noting that the structures of the fin heat dissipation modules of the two embodiments are completely different. In the first embodiment, the heat absorbing surface 11 is a planar structure. In this embodiment, the metal sheet 13 installed on the heat absorbing surface 11 is represented by a grid filling method to clearly distinguish the metal sheet 13 from other structures, but this is only for the convenience of explanation and is not a limitation on the structure of the metal sheet 13.

[0040] In the second embodiment, the heat absorbing surface 11 is a discontinuous surface structure composed of multiple curved surfaces. Although the exposed area of ​​a single curved surface is small, the area of ​​the heat absorbing surface 11 composed of multiple curved surfaces is still large, and the heat conduction effect is ideal. In this embodiment, the metal sheet 13 installed on the curved surface is represented by a grid filling method to clearly distinguish the metal sheet 13 from other structures, but this is only for the convenience of explanation and is not a structural limitation of the metal sheet 13. In the first embodiment, the liquid cooling pump 30 is arranged on the upper side of the fin heat dissipation module. In the second embodiment, the liquid cooling pump 30 is arranged on the right side of the fin heat dissipation module.

[0041] like Fig.11As shown, a partial exploded schematic diagram of a liquid cooling unit 10 as a flexible thin film sheet structure is shown, and the liquid cooling unit 10 includes an upper diaphragm 15 and a lower diaphragm 16. A strip groove is formed on the surface of at least one of the upper diaphragm 15 and the lower diaphragm 16, and the upper diaphragm 15 and the lower diaphragm 16 are stacked and connected, and a flow path 12 is formed in the portion surrounding the strip groove. The liquid cooling unit 10 formed by the upper diaphragm 15 and the lower diaphragm 16 has a very light and thin structure. In the embodiment provided by the present invention, the material of the upper diaphragm 15 and the lower diaphragm 16 is graphite, graphene, copper or aluminum. At this time, the upper diaphragm 15 and the lower diaphragm 16 have high thermal conductivity, flexibility and ductility, which are conducive to heat conduction and processing, and also make the temperature uniformity of the liquid cooling unit 10 better. The material of the metal sheet 13 is copper, aluminum or copper-aluminum alloy, etc. On the one hand, the metal sheet 13 has high thermal conductivity, and on the other hand, the structural performance is also excellent.

[0042] Figures 1 to 10 In the figure, the direction indicated by arrow X is from left to right, the direction indicated by arrow Y is from front to back, and the direction indicated by arrow Z is from top to bottom.

[0043] The above disclosure is only a preferred embodiment of the present invention, which cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are all within the scope of the present invention.

Claims

1. A liquid cooling unit, suitable for cooperating with an air cooling unit, for dissipating heat from heat generating components in electronic equipment, characterized in that: The liquid cooling unit has a heat absorbing surface and a flow path therein, the heat absorbing surface is used to contact / connect with the heat-generating component to absorb the heat of the heat-generating component, the liquid cooling unit is provided with a liquid medium flowing along the flow path, the liquid medium releases heat along the flow of the flow path, the liquid cooling unit forms a plurality of fins that are parallel to each other and spaced apart by curling and stacking back and forth, thereby forming a fin heat dissipation module, and the liquid cooling unit is a thin film sheet structure.

2. The liquid cooling unit according to claim 1, characterized in that The heat absorbing surface is provided with a metal sheet for direct contact / connection with a heat generating component.

3. The liquid cooling unit according to claim 1, characterized in that The liquid cooling unit is a single integral and flexible thin film sheet structure, and the flow path extends along the unfolding direction of the liquid cooling unit.

4. The liquid cooling unit according to claim 1, characterized in that The liquid cooling unit further includes a liquid cooling pump for circulating the liquid medium within the flow path.

5. The liquid cooling unit according to claim 1, characterized in that The flow path is provided in the fin where the heat absorbing surface is located.

6. The liquid cooling unit according to claim 1, characterized in that The heat absorbing surface is a plane structure or a discontinuous surface structure composed of a plurality of curved surfaces.

7. The liquid cooling unit according to claim 1, characterized in that The liquid cooling unit includes an upper diaphragm and a lower diaphragm, and a strip groove is formed on the surface of at least one of the upper diaphragm and the lower diaphragm. The upper diaphragm is stacked and connected to the lower diaphragm and the flow path is formed in the part surrounding the strip groove; the material of the upper diaphragm and the lower diaphragm is graphite, graphene, copper or aluminum.

8. A heat dissipation device, characterized in that: The invention comprises an air cooling unit and a liquid cooling unit as claimed in any one of claims 1 to 7, wherein the air cooling unit has a blade structure, the air cooling unit is connected to the liquid cooling unit, and the air cooling unit is used to discharge the heat released by the liquid cooling unit into the atmosphere.

9. The heat dissipation device according to claim 8, characterized in that: The liquid cooling unit also has a mounting surface different from the heat absorbing surface, and the air cooling unit is mounted on the mounting surface.

10. An electronic device, characterized in that: Comprising the heat dissipation device as claimed in claim 8 or 9.

Images