Thermal chamber for thermal control component

Abstract

The present disclosure relates to a thermal chamber for a thermal control component. The thermal chamber includes a plurality of faces, such as a back face, a front face, a first end, a second end, a top face, and a bottom face. The plurality of faces form a cavity. The top surface includes one or more ports. Each of the one or more ports includes a top surface open region that exposes a cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy into and out of an electrical device exposed via the cavity. A top surface open area of the one or more ports has a corresponding bottom surface open area of the bottom surface below the top surface open area. The bottom surface open area is configured to allow the temperature control component to contact the electrical device exposed through the bottom surface open area.

Description

[0001] Information about divisional applications

[0002] This case is a divisional application of the invention patent application with the application date of December 11, 2019, application number 201980089116.8, and invention name “Thermal chamber for thermal control components”. Technical Field

[0003] The present disclosure relates generally to a thermal chamber, and more particularly to a thermal chamber for temperature controlling components. Background Art

[0004] The memory subsystem may be a storage system, such as a solid state drive (SSD) or a hard disk drive (HDD). The memory subsystem may be a memory module, such as a dual in-line memory module (DIMM), a small outline DIMM (SO-DIMM), or a non-volatile dual in-line memory module (NVDIMM). The memory subsystem may include one or more memory components that store data. The memory components may be, for example, non-volatile memory components and volatile memory components. Typically, a host system may utilize a memory subsystem to store data in the memory components and retrieve data from the memory components. Summary of the invention

[0005] In one aspect, the present disclosure provides a thermal chamber comprising: a cavity enclosed by multiple faces; one or more ports exposing the cavity within the thermal chamber, wherein each of the one or more ports is configured to receive a temperature control component having a solid physical structure and is configured to transfer thermal energy into and out of an electrical device exposed through the cavity; and a bottom open area of ​​the thermal chamber, which is located below the one or more ports, wherein the bottom open area is configured to allow the temperature control component to contact the electrical device exposed through the bottom open area.

[0006] On the other hand, the present disclosure provides a system for testing an electrical device under various thermal conditions, comprising: a circuit board; the electrical device coupled to the circuit board; a temperature control component having a solid physical structure and configured to contact the electrical device to transfer thermal energy into and out of the electrical device; and a thermal chamber configured to be located above the circuit board, the thermal chamber comprising: a cavity enclosed by multiple faces; and one or more ports exposing the cavity within the thermal chamber, wherein each of the one or more ports is configured to receive the temperature control component to transfer thermal energy into and out of the electrical device exposed through the cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The present disclosure will be more fully understood from the detailed description given below and the accompanying drawings of various embodiments of the present disclosure.

[0008] Figure 1 An example environment for allocating test resources to perform tests on a memory component according to some embodiments of the present disclosure is shown.

[0009] Figures 2A to 2B A temperature control component according to some embodiments of the present disclosure is shown.

[0010] Figure 3 A thermal chamber according to an embodiment of the present disclosure is shown.

[0011] Figures 4A to 4B A system for testing an electrical device under various thermal conditions according to an embodiment of the present disclosure is shown.

[0012] Figure 5A and 5B A system for testing an electrical device under various thermal conditions according to an embodiment of the present disclosure is shown.

[0013] Figure 6 An example computing environment including a memory subsystem is shown according to some embodiments of the present disclosure.

[0014] Figure 7 is a block diagram of an example computer system in which embodiments of the present disclosure may operate. DETAILED DESCRIPTION

[0015] Aspects of the present disclosure relate to a thermal chamber for a heat transfer component. A memory subsystem is also referred to as a "memory device" hereinafter. An example of a memory subsystem is a storage device coupled to a central processing unit (CPU) via a peripheral interconnect (e.g., an input / output bus, a storage area network). Examples of storage devices include a solid-state drive (SSD), a flash drive, a universal serial bus (USB) flash drive, and a hard disk drive (HDD). Another example of a memory subsystem is a memory module coupled to a CPU via a memory bus. Examples of memory modules include dual in-line memory modules (DIMMs), small outline DIMMs (SO-DIMMs), non-volatile dual in-line memory modules (NVDIMMs), etc. The memory subsystem can be a hybrid memory / storage subsystem. Typically, a host system can utilize a memory subsystem that includes one or more memory devices. The host system can provide data to be stored in the memory subsystem and can request to retrieve data from the memory subsystem.

[0016] Electronic devices (such as memory components used in memory subsystems) can be tested before being used in the system. In conventional testing processes, electrical devices can be placed in chambers (i.e., ovens) that test electrical devices under various temperature conditions. For example, a single chamber can be used to test multiple memory components at a time at a specific temperature. Hot or cold gas can be pumped into the chamber to control the temperature of the chamber and the temperature of the electrical device in the chamber. The test process can indicate that various operations are performed at the electrical device at a specific temperature. Such operations may include but are not limited to read operations, write operations, or erase operations. When performing the test process, the performance and behavior of the electrical device can be observed or measured. For example, the performance characteristics (e.g., read delay or write delay) and reliability of data stored at the memory component can be measured and recorded during the test process. However, since the chamber can only apply a single temperature to the electrical device at any particular time, it may take a lot of time to test the electrical device at many different temperatures because the test process needs to be performed for each desired temperature. In addition, the chamber can only perform a single test process at a time. Thus, if the testing process of the electrical device requires many different conditions, performing different tests on the electrical device under different operating conditions (e.g., different temperatures) may use a significant amount of time. Further, as the temperature in the chamber cycles through different temperatures within the temperature testing range, condensation (such as water and ice) may form at the electrical device and other associated electronic components and cause damage, inaccurate test measurements, or catastrophic failure.

[0017] Aspects of the present disclosure address the above and other deficiencies by using a thermal chamber having multiple faces, such as a back face, a front face, a first end, a second end, a top face, and a bottom face. The multiple faces are coupled to form a cavity. The top face includes one or more ports. Each of the ports exposes the cavity within the thermal chamber. Each of the ports is configured to receive a temperature control component that transfers heat energy into and out of an electrical device exposed through the cavity. Each of the temperature control components can simultaneously apply different (or the same) temperatures to a corresponding electrical device through the cavity of the thermal chamber. The bottom face of the thermal chamber includes a bottom open area that allows the temperature control component to contact the electrical device exposed through the bottom open area.

[0018] In an embodiment, the thermal chamber may have a gas port that allows a gas source to be coupled to the thermal chamber and provide gas to the cavity of the thermal chamber. The gas may have a dew point that is lower than the lowest test temperature in the test temperature range. In some embodiments, the gas source may create a positive pressure environment in the cavity of the thermal chamber so that the only gas entering or leaving the chamber comes from the gas source. By providing a gas with a low dew point and creating a positive pressure environment in the cavity of the thermal chamber, condensation is not allowed to form at the electrical device under test or at associated electrical components. It may be noted that in some embodiments, a temperature control component coupled to the thermal chamber changes the temperature at the electrical device and the gas provided to the thermal chamber maintains a low humidity environment without substantially affecting the temperature in the cavity of the chamber, rather than changing the temperature of the cavity via the injection of hot or cold gas.

[0019] Advantages of the present disclosure include, but are not limited to, providing a thermal chamber that allows testing of an electrical device in a given chamber under different temperature conditions in a given instance. The thermal chamber disclosed herein can be configured to simultaneously apply a wide range of thermal conditions to the tested electrical device and to simultaneously apply different thermal conditions to electrical devices coupled to the same circuit board. In addition, aspects of the present disclosure provide a thermal chamber that prevents condensation from forming at the tested electrical device throughout a wide test temperature range. Thus, many different tests can be performed on the electrical device more quickly, and the reliability of the electrical device can also be improved because any potential defects or flaws can be identified and subsequently addressed in the design or manufacture of the electrical device.

[0020] Figure 1An example environment for allocating test resources to perform tests on memory components according to some embodiments of the present disclosure is shown. Test platform 100 may include one or more racks 110A, 110B, and 110N. Each of racks 110A, 110B, and 110N may include multiple test boards 120, wherein each test board 120 includes one or more test sockets (i.e., test resources). Test platform 100 may include any number of racks or test sockets. In some embodiments, a socket may refer to an electromechanical device that physically or electrically couples an electrical device such as an active electrical device or a passive electrical device to a test board 120. A circuit board may be an example of a test board 120. In some embodiments, an electrical device may be a discrete component encapsulated in a package (e.g., a ceramic packaging material). The packaging material may have pins, solder bumps, or terminals outside the package that connect an on-chip element or an on-die element to an off-chip or off-die element (e.g., a power supply, other components at a circuit board, etc.). As shown, the test board 120 may include one or more test sockets. For example, the test board 120 may include a first test socket 121, a second test socket 122, and a third test socket 123. Although three test sockets are shown, the test board 120 may include any number of test sockets. In an embodiment, each test socket may include an electronic device, such as a memory component, that has been embedded in the corresponding test socket. In addition, each test socket may be equipped with a temperature control component that is used to apply temperature conditions to the embedded electrical device. For example, the temperature control component may be in physical contact with the package of the memory component to adjust the package temperature or the temperature on the die to a desired temperature value within a temperature range. In some embodiments, the temperature range may be -40 degrees Celsius to 140 degrees Celsius.

[0021] In some embodiments, the temperature control component may be used to apply a temperature to a portion of a corresponding electrical device that is different from a temperature applied by another temperature control component to another corresponding electrical device at the same or different test board 120. For example, a first temperature control component may apply a temperature of -20 degrees Celsius to a specific memory component, and another temperature control component adjacent to the first temperature control component may apply a temperature of 100 degrees Celsius to another memory component located at the same test board 120.

[0022] In some embodiments, the temperature control component can be a dual thermoelectric component (TEC) (also referred to herein as a "thermoelectric cooler") (e.g., two TEC devices) that utilizes the Peltier effect to apply a heating or cooling effect at the surface of the dual TEC device coupled to the embedded memory component. For example, a bottom portion of the temperature control component can contact the package of the electrical device to transfer thermal energy into and out of the electrical device. In some embodiments, the thermoelectric component can be a Peltier device. In some embodiments, the thermoelectric component can include an array of alternating n-type and p-type semiconductors disposed between two plates (such as two ceramic plates). A voltage applied to the thermoelectric component causes one plate to cool and the other plate to heat. In the same or alternative embodiments, the temperature control component can be placed on top of the memory component in the corresponding test socket.

[0023] As shown, each test rack 110A, 110B and 110N can include multiple test boards 120. Each of the test boards 120 of a specific test rack can be coupled to a local test component. For example, each test rack 110A, 110B and 110N can include local test components 111A, 111B and 111N, respectively. Each of the local test components 111A, 111B and 111N can receive instructions to perform a test or a part of a test to be performed at a test socket of the corresponding test rack. For example, the resource distributor component 130 can receive (e.g., from a user) the conditions of the test to be performed, and the resource distributor component 130 can determine the specific test sockets that can be used by the test on different test boards 120 at one or more of the test racks 110A, 110B and 110N. In some embodiments, the resource distributor component 130 can be provided by a server 131. In some embodiments, server 131 is a computing device or system coupled to local testing components 111A, 111B, and 111N via a network.

[0024] The temperature control component of each test socket 121, 122, and 123 of each test board 120 can be used to apply different temperature conditions to the corresponding embedded memory component. In addition, each test socket 121, 122, and 123 can be used to perform different operations at the embedded memory component.

[0025] The resource distributor component 130 may receive a test input from a user. The test input may specify the conditions of a test to be performed using one or more memory components. For example, the test may specify a specific temperature condition to be applied to the memory component and a sequence of operations to be performed at the memory component under the specific temperature conditions. The resource distributor 130 may retrieve a data structure identifying the available test sockets on the test platform 100 and the characteristics of the available test sockets. Subsequently, the resource distributor component 130 may allocate the test sockets at the test platform 100 containing the embedded memory components that match or meet the test conditions. Then, the resource distributor component 130 may transmit instructions to the local test components of the test rack containing the test sockets to be used in the test.

[0026] In some embodiments, one or more of the test boards 120 of the test platform 100 can be used with one or more thermal chambers (also referred to herein as "micro thermal chambers" or "housings"). For example, the test board 120 can include a plurality of test sockets 121, 122, and 123. The thermal chamber can be assembled above the plurality of test sockets 121, 122, and 123. In another example, a different thermal chamber can be assembled above each of the plurality of test sockets 121, 122, and 123. The thermal chamber can include one or more ports. One or more ports can expose the cavity in the thermal chamber (also referred to herein as a "chamber"). An electrical device coupled to the test socket of the test board 120 can be accessed from one or more ports. In some embodiments, one or more ports are configured to receive a temperature control component. In some embodiments, the bottom portion of the temperature control component extends within the cavity of the thermal chamber and contacts the corresponding electrical device. The top portion of the temperature control component (e.g., a heat sink) can extend above the thermal chamber. In some embodiments, the temperature control component can be coupled to the thermal chamber. In some embodiments, the thermal chamber can be used to hold the temperature control component in place. In some embodiments, the thermal chamber can align the temperature control component with the corresponding test socket and the corresponding electrical device so that the bottom portion of the temperature control component can be in physical contact with the corresponding electrical device. In embodiments where the thermal chamber includes multiple ports for holding multiple temperature control components, the thermal chamber can be used to help apply temperature control components with similar or equal or consistent pressures to each of the corresponding electrical devices. Multiple temperature control components can simultaneously apply different temperatures to the corresponding electrical devices within the thermal chamber. Figure 3 and Figures 4A to 4B The thermal chamber is further described.

[0027] Figures 2A to 2B A temperature control component according to some embodiments of the present disclosure is shown. Figure 2A A temperature control component according to some embodiments of the present disclosure is shown in a collapsed view. Figure 2BThe temperature control components according to some embodiments of the present disclosure are shown in an enlarged view. For the purpose of illustration and not limitation, the temperature control component 200 is shown as having a plurality of elements. In other embodiments, the temperature control component 200 may include the same, different, fewer or additional elements. For the purpose of illustration and not limitation, the temperature control component 200 is shown as having a relative positional relationship (top and bottom). It can be noted that it is within the scope of the present disclosure to assign other positional relationships to the elements of the temperature control component 200 and the temperature control component 200.

[0028] A thermoelectric element (TEC) (also known as a "thermoelectric cooler") can convert electrical energy into thermal energy and vice versa. A TEC can include two surfaces. When a voltage is applied to the TEC, one surface heats up while the other opposing surface cools down simultaneously. However, in some instances, applying a single TEC to an electrical device may not transfer enough thermal energy to meet the temperature test range of some electrical devices (e.g., -40 degrees Celsius to 130 degrees Celsius).

[0029] A TEC can generate more thermal energy at one surface than the TEC dissipates at the opposing surface. For example, for every 1 degree Celsius change at the first surface of the TEC, the opposing surface of the TEC generates approximately 3 degrees Celsius. Because a TEC generates a disproportionate amount of heat for each degree of cooling, it can be challenging to remove excess heat from one surface while cooling an electrical device with opposing surfaces. The challenge is especially acute when testing electrical devices at very low temperatures, as the heat generated is many times greater than the heat removed. Using a single TEC is often insufficient to transfer enough thermal energy to meet the temperature test range of the electrical device.

[0030] In order to remove the excess heat, two TECs of different sizes can be stacked directly on top of each other. For example, a larger TEC can be stacked directly on top of a smaller TEC. When the bottom surface of the smaller TEC cools the object, the top surface of the smaller TEC generates heat. The bottom surface of the larger TEC contacts the top surface of the smaller TEC and removes the heat generated by the top surface of the smaller TEC by cooling the bottom surface of the larger TEC. As the bottom surface of the larger TEC is cooled, the top surface of the larger TEC will generate more heat. In theory, the larger TEC can dissipate more heat energy and help dissipate the excess heat from the smaller TEC. However, stacking two TECs on top of each other may be very inefficient, and is generally not enough to transfer enough heat energy to meet the temperature test range of the electrical device. When the two TECs are stacked on each other, the heat generated by the smaller TEC is concentrated at the footprint of the smaller TEC, rather than being evenly distributed over the entire bottom surface of the larger TEC. Thus, the larger TEC cannot effectively remove heat from the top surface of the smaller TEC, which limits the lower temperature that can be applied to the electrical device.

[0031] In an embodiment, a temperature control component 200 as described herein can address the above and additional challenges. In an embodiment, the temperature control component 200 can include a heat transfer component 206 that is tapered so that the surface area of ​​the bottom surface 208B coupled to the smaller TEC 202 is less than the surface area of ​​the top surface 208A coupled to the larger TEC 210.

[0032] In an embodiment, the temperature control component 200 includes a thermoelectric component (TEC) 202. In an embodiment, a TEC (such as TEC 202) can be used as a heat pump to transfer heat to a surface or remove heat from a surface. TEC 202 includes two surfaces 204: a top surface 204A and a bottom surface 204B. The TEC (such as TEC 202) is configured to simultaneously increase the temperature of the top surface (e.g., top surface 204A) and decrease the temperature of the bottom surface (e.g., bottom surface 204B) based on a voltage potential applied to the TEC, or to simultaneously decrease the temperature of the top surface (e.g., top surface 204A) and increase the temperature of the bottom surface (e.g., bottom surface 204B). In an embodiment, a TEC (such as TEC 202 and TEC 210) includes a set of wires to couple the voltage potential to the TEC and to deliver the necessary current to the TEC.

[0033] In an embodiment, the temperature control component 200 includes a TEC 210. The TEC 210 may include two surfaces 212, such as a top surface 212A and a bottom surface 212B. In an embodiment, the bottom surface 212B is coupled to the top surface 208A of the heat transfer component 206. In an embodiment, the TEC 210 is larger than the TEC 202. In some embodiments, the surface area of ​​the bottom surface 212B of the TEC 210 is approximately twice the surface area of ​​the top surface 204A of the TEC 202. In some embodiments, the size of the TEC 210 is designed to effectively transfer heat away from the TEC 202. In some embodiments, the heat transfer capability of the TEC 210 is at least twice that of the TEC 202. As described herein, the surface area of ​​the TEC 210 may be twice the surface area of ​​the TEC 202, so that the heat transfer capability of the TEC 210 is at least twice that of the TEC 202. It may be noted that in some embodiments, TEC 210 may have a similar surface area as TEC 202 (or at least less than twice the surface area of ​​TEC 202) but with twice the power and heat transfer capabilities.

[0034] For purposes of illustration and not limitation, a square TEC is shown. In other embodiments, TECs of different shapes may be implemented, such as a rectangular TEC or a circular TEC. In some embodiments, the two TECs may have different shapes. The selected TEC may be based on the surface shape of the electrical device 250. For example, if the package of the electrical device 250 is square, then using a square TEC (at least for TEC 202) may help to optimally transfer thermal energy into and out of the electrical device 250. It may be noted that using TECs having different shapes is within the scope of the present disclosure.

[0035] In an embodiment, the temperature control component 200 includes a heat transfer component 206. In an embodiment, the heat transfer component 206 effectively conducts thermal energy from a surface of one TEC to an opposing surface of another TEC. For example, to cool the electrical device under test 250, the bottom surface 204B of the TEC 202 removes thermal energy (e.g., heat) from the top surface of the electrical device 250. The top surface 204A of the TEC 202 simultaneously generates thermal energy, which is transferred to the bottom surface 212B of the TEC 210 via the heat transfer component 206.

[0036] In an embodiment, the heat transfer component 206 is composed or made of a thermally conductive material. The thermally conductive material includes but is not limited to copper, aluminum, copper brass, or alloys of the above materials. It can be noted that other thermally conductive materials can be used. It can also be noted that materials with higher thermal conductivity (k) can more effectively transfer thermal energy between TEC 202 and TEC 210.

[0037] In an embodiment, heat transfer component 206 includes at least two surfaces 208, including a top surface 208A and a bottom surface 208B. Bottom surface 208B of heat transfer component 206 is coupled to top surface 204A of TEC 202. Top surface 208A of heat transfer component 206 is coupled to bottom surface 212B of TEC 210.

[0038] In some embodiments, heat transfer component 206 can be coupled to the surface of an adjacent component using a thermal interface material such as a thermally conductive adhesive, thermal grease, phase change material, thermal tape, gap-filling thermal pad, thermal epoxy, etc. For example, the thermal interface material can be disposed between top surface 204A of TEC 202 and bottom surface 208B of heat transfer component 206, and between top surface 208A of heat transfer component 206 and bottom surface 212B of TEC 210. In some embodiments, the thermal interface material can have at least a minimum electrical conductivity of 150 Watts / meter Kelvin (W / mk) or greater.

[0039] In an embodiment, the heat transfer member 206 is tapered such that the bottom surface 208B is smaller than the top surface 208A. In some embodiments, the surface area of ​​the top surface 208A of the heat transfer member 206 is approximately twice the surface area of ​​the bottom surface 208B of the heat transfer member 206. In some embodiments, the top surface 208A and the bottom surface 208B of the heat transfer member 206 are sized to match or be close in size to the surface of the corresponding TEC. In some embodiments, the surface area of ​​one or more of the top surface 208A and the bottom surface 208B of the heat transfer member 206 may be 95% to 120% of the surface area of ​​the corresponding surface of the corresponding TEC.

[0040] As described above, in an embodiment, the surface of the TEC generates more heat energy than the opposing surface of the TEC dissipates. In order to maximize the potential energy transfer capability of the larger TEC, the heat energy can be spread across the entire surface of the larger TEC. The tapered heat transfer component 206 allows for efficient transfer of heat energy between the smaller TEC 202 and the larger TEC 210. For example, heat from the top surface 204A of the TEC 202 is conducted through the heat transfer component 206 and spread across the bottom surface 212B of the TEC 210 using the tapered heat transfer component 206. The larger TEC 210 can move the heat energy from the bottom surface 212B to the opposing surface (e.g., the top surface 212A).

[0041] In an embodiment, the heat transfer component 206 may be in the shape of a stepped pyramid as shown. In other embodiments, the heat transfer component 206 may have a different shape, such as a flat-sided pyramid that tapers from a top surface to a bottom surface. In some embodiments, the shape of the heat transfer component 206 may be based in part on the shape of the TEC that contacts the surface of the heat transfer component 206. For example, in an embodiment using a circular TEC, the shape of the heat transfer component 206 may be conical, where the bottom and top surfaces of the heat transfer component 206 are circular. In some embodiments, the thickness of the heat transfer component 206 (between the surface 208A and the surface 208B) is greater than or equal to the thickness of one of the TEC 202 or the TEC 210. In some embodiments, the heat transfer component 206 may include a heat conductive layer 214. The heat conductive layer 214 may include a top surface 216A and a bottom surface 216B. In an embodiment, the top surface 216A of the heat conductive layer 214 is coupled to the bottom surface 204B of the TEC 202. In some embodiments, heat conductive layer 214 may transfer thermal energy from bottom surface 204B of TEC 202 to bottom surface 216B of heat conductive layer 214 .

[0042] In some embodiments, bottom surface 216B of heat conductive layer 214 may be positioned to contact a top surface of electrical device 250. For example, bottom surface 216B of heat conductive layer 214 may be positioned to contact a top surface of a package of electrical device 250 so that a package temperature of electrical device 250 or an on-chip temperature of electrical device 250 may be controlled to a desired temperature. In some embodiments, heat conductive layer 214 may be configured to fit within a socket that couples electrical device 250 to a circuit board so that bottom surface 216B of heat conductive layer 214 may physically contact the package of electrical device 250 and transfer thermal energy.

[0043] In an embodiment, as described above, thermal interface material may be used to couple heat transfer layer 214 to TEC 202. In an embodiment, as described above, heat transfer layer 214 is composed or made of a thermally conductive material.

[0044] In an embodiment, the top surface 216A of the heat conductive layer 214 can have approximately the same size and the same shape as the bottom surface 204B of the TEC 202. In some embodiments, the size and shape of the surface 216 of the heat conductive layer 214 can be based on the size and shape of the top surface (e.g., the contact surface) of the electrical device 250. For example, the heat conductive layer 214 can be shaped so that the bottom surface 216B contacts the top surface of the electrical device 250, if not all of it, but contacts most (in some cases, more than just the top surface). In some embodiments, the top surface 216A of the heat conductive layer 214 is approximately the same size or larger than the bottom surface 204B of the TEC 202. In some embodiments, the bottom surface 216B of the heat conductive layer 214 can have the same size and shape as the top surface 216A of the heat conductive layer 214. For example, the heat conductive layer 214 can be a square cube or a rectangular cube. In some embodiments, the heat conductive layer 214 can taper in one direction or the other, such as tapering from the top surface 216A to the bottom surface 216B, or vice versa. It may be noted that the shape of the thermally conductive layer 214 may be based at least in part on the shape of the TEC 202 or the electrical device 250 .

[0045] In some embodiments, heat conductive layer 214 may be an optional element and TEC 202 may be in direct physical contact with electrical device 250 to transfer thermal energy into and out of electrical device 250 .

[0046] In some embodiments, the temperature control component 200 may include a thermal sensing device 218. In some embodiments, the thermal sensing device 218 may be disposed or embedded within the thermal conductive layer 214. The thermal sensing device 218 may be located within the thermal conductive layer 214 such that a temperature sensing surface of the thermal sensing device 218 is proximate to a bottom surface 216B of the thermal conductive layer 214. The thermal sensing device 218 may be used to measure a temperature applied to a package of the electrical device 250, which may effectively represent a temperature at the package of the electrical device 250 due to the low thermal resistance (k) of the thermal conductive layer 214. In an embodiment, the thermal sensing device 218 may be any temperature sensing device, such as a thermocouple, a capacitive temperature sensing device, a resistive temperature sensing device, etc. In an embodiment, the thermal sensing device 218 may include a set of wires to couple the thermal sensing device 218 to a measurement unit to measure the output of the thermal sensing device 218.

[0047] In some embodiments, the electrical device 250 may include one or more temperature sensing devices, such as an on-chip temperature sensing device. Due to the thermal resistance of the package, the on-chip temperature may be different from the package temperature of the electrical device 250. Temperature measurements from the on-chip temperature sensing device, the thermal sensing device 218 of the heat conductive layer 214, or both may be used to perform thermal testing on the electrical device 250.

[0048] In some embodiments, the temperature control component 200 may include a heat sink 220. The heat sink 220 may include a top surface 222A and a bottom surface 222B. In an embodiment, the top surface 222A may include a larger surface area than the bottom surface 222B to help facilitate the transfer of thermal energy from the heat sink 220 to the adjacent media. In an embodiment, the bottom surface 222B of the heat sink 220 is coupled to the top surface 212A of the TEC 210 to transfer thermal energy from the TEC 210 to the heat sink 220. In an embodiment, the heat sink 220 and the TEC 210 are coupled using a thermal interface material as described above. In an embodiment, the heat sink 220 is composed of a thermally conductive material as described above.

[0049] In some embodiments, the heat sink 220 is a passive mechanical device. In an embodiment, the top surface 222A of the heat sink 220 includes a plurality of channels and a plurality of fins disposed between the channels. In other embodiments, the heat sink 220 can be another type of heat sink, such as a liquid cooled heat sink.

[0050] In some embodiments, heat sink 220 includes one or more attachment members 224. In embodiments, the attachment members can be used to secure temperature control component 200 to a thermal chamber. In some embodiments, attachment member 224 is configured to receive adjustable coupling member 226, which can adjustably couple temperature control component 200 to the thermal chamber. In some embodiments, adjustable coupling member can include a spring element that allows adjustment of the vertical position of temperature control component 200 mounted to the thermal chamber.

[0051] In some embodiments, the temperature control component 200 may include a fan, such as an electric fan 228. In an embodiment, the electric fan 228 is disposed above the top surface 222A of the heat sink 220 and is used to transfer thermal energy from the heat sink 220 to an adjacent medium, such as a gas medium local to the temperature control component 200. The electric fan 228 may include a set of wires coupled to a voltage potential.

[0052] A single heat transfer component 206 is shown for purposes of illustration and not limitation. In other embodiments, multiple heat transfer components 206 may be used. For example, additional heat transfer components may be stacked on the top surface 212A of the TEC 210. The additional heat transfer components may be larger than the heat transfer component 206. For example, the bottom surface of the additional heat transfer component may be approximately the same size as the top surface 212A of the TEC 210. The additional heat transfer component may be tapered such that the top surface of the additional heat transfer component is larger than the bottom surface. In an embodiment, the top surface of the additional heat transfer component may be coupled to a TEC that is larger than the TEC 210 (e.g., has a larger surface area). Any number of additional heat transfer components or TECs may be implemented in other embodiments.

[0053] Figure 3 A thermal chamber according to an embodiment of the present disclosure is shown. For purposes of illustration and not limitation, thermal chamber 300 is depicted as having a relative positional relationship, as shown by three-dimensional (3D) axis 302. It may be noted that assigning other relative positional relationships to thermal chamber 300 is within the scope of the present disclosure.

[0054] The 3D axis 302 includes an X-axis, a Y-axis, and a Z-axis. As shown in the figure, the X-axis points to the front and rear direction relative to the thermal chamber 300. The Y-axis points to the directions of both ends relative to the thermal chamber 300. The Y-axis of the 3D axis 302 corresponds to the horizontal axis 304. The Z-axis points to the top and bottom directions relative to the thermal chamber 300.

[0055] In an embodiment, thermal chamber 300 includes multiple faces, such multiple rigid faces. The multiple rigid faces include a back face 308 oriented parallel to horizontal axis 304, a front face 306 oriented parallel to horizontal axis 304, a horizontal axis 310A oriented perpendicular to horizontal axis 304 (e.g., along the X-axis), and an end 310B oriented perpendicular to horizontal axis 304 and positioned opposite end 310A.

[0056] The plurality of rigid surfaces of thermal chamber 300 further include a top surface 312 oriented perpendicular to and coupled with back surface 308, front surface 306, end 310A, and end 310B. The plurality of rigid surfaces of thermal chamber 300 further include a bottom surface 314 oriented parallel to and opposite to top surface 312. In an embodiment, the plurality of rigid surfaces form a cavity (also referred to herein as a "chamber") 316 enclosed by the plurality of rigid surfaces.

[0057] In an embodiment, the top surface 312 includes one or more ports 318 oriented in a first direction along the horizontal axis 304. It may be noted that the ports 318A, 318B, 318C, and 318D are generally referred to as ports 318. It may also be noted that, for purposes of illustration and not limitation, the thermal chamber 300 shows a plurality of ports 318 aligned along the horizontal axis 304. In other embodiments, the thermal chamber 300 may include any number of ports 318 located at any position relative to the thermal chamber 300. In an embodiment, each of the ports includes an open area (also referred to herein as a "top surface open area") that exposes the cavity 316 within the thermal chamber 300. In an embodiment, each of the ports 318 is configured to receive a temperature control component, such as a temperature sensor, a temperature sensor, or a temperature sensor. Figures 2A to 2B The temperature control component 200 is depicted. The temperature control component 200 can be located in a position within the thermal chamber 300 such that the temperature control component 200 transfers thermal energy to and from the electrical device exposed via the cavity 316 .

[0058] In an embodiment, each top surface open area corresponding to a corresponding one of the ports 318 has a corresponding open area at the bottom surface 314 (also referred to herein as a "bottom surface open area 320"). The bottom surface open area 320 is located below (e.g., directly below) the corresponding top surface open area. As shown, the bottom surface open area 320 is a single large open area. It can be noted that in other embodiments, multiple bottom surface open areas can be used, each of which corresponds to a specific one of the ports 318 at the top surface 312. In an embodiment, the bottom surface open area 320 is an area of ​​the bottom surface 314 that is configured to receive one or more electrical devices from the direction of the bottom surface 314 and allow the temperature control component 200 (located at a corresponding one of the ports 318) to contact the corresponding electrical device exposed via the bottom surface open area 320. In some embodiments, the one or more electrical devices are located below the bottom surface of the bottom surface 314.

[0059] In some embodiments, one or more of the plurality of rigid surfaces are constructed of one or more of a thermal insulator, a non-conductive material, or an antistatic material. In some embodiments, the plurality of rigid surfaces may be constructed of a phenolic material. In some embodiments, the plurality of rigid surfaces are constructed of a conductive material. The thermal chamber 300 constructed of a conductive material may be grounded to ground potential to help prevent electrostatic discharge damage at the electrical device under test.

[0060] In some embodiments, each of the one or more ports 318 includes at least one pair of opposing sides, such as opposing side 322A and opposing side 322B of port 318B (generally referred to herein as "opposing sides 322"). In an embodiment, each of the one or more ports 318 may be associated with one or more fixing features. The fixing features allow the temperature control component 200 to be fixed at the top surface 312 of the thermal chamber 300 and align the temperature control component 200 to contact the electrical device exposed through the bottom open area 320 of the thermal chamber 300. For example, fixing feature 324A is located near the opposing side 322A of port 318B. Fixing feature 324B is located near the opposing side 322B of port 318B. Fixing features 324A and 324B (generally referred to herein as "fixing features 324") are associated with port 318B and allow the corresponding temperature control component 200 to be fixed at port 318B. As shown, other ports 318A, 318C, and 318D have similar fixing features located at similar positions relative to the corresponding ports 318. In some embodiments, the fixing features 324 include holes that pass through the top surface 312 of the thermal chamber 300. In an embodiment, the fixing features 324 are each configured to receive an adjustable coupling member to adjustably couple the temperature control component 200 to the thermal chamber 300 at the corresponding port 318. The number, shape, and location of the fixing features are provided for purposes of illustration and not limitation. In other embodiments, the number, shape, or location of the fixing features may be different.

[0061] In an embodiment, the thermal chamber 300 includes a gas port 326. The gas port 326 can be configured to allow gas to enter the cavity 316 of the thermal chamber 300 from an external gas source. The gas port 326 connects the outer surface of the thermal chamber 300 to the cavity of the thermal chamber 300. In some embodiments, the gas port 326 includes a hole, such as a circular hole, located at one of the plurality of rigid surfaces. For example, the gas port 326 can be located at the front surface 306, the back surface 308, the end 310A, the end 310B, the top surface 312, or the bottom surface 314 of the thermal chamber 300. In an embodiment, the gas port 326 is equipped with a gas fitting 328 coupled to the gas port 326. In an embodiment, a portion of the gas fitting 328 can be assembled within the gas port 326, while another portion of the gas fitting 328 can extend outside the thermal chamber 300. In an embodiment, the portion of the gas fitting 328 that extends outside of the thermal chamber 300 may be coupled to a gas hose that moves gas from a gas source into the cavity of the thermal chamber 300 .

[0062] In some embodiments, the thermal chamber 300 includes a plurality of mounting features that allow the thermal chamber 300 to be mounted or secured to a circuit board located below the thermal chamber 300. In some embodiments, the mounting features are located on at least one of the back 308, front 306, end 310A, end 310B, bottom 314, or top 312 of the thermal chamber 300. For example, the thermal chamber 300 shows a mounting feature 330A at the back 308 of the thermal chamber 300 and a mounting feature 330B at the front 306 of the thermal chamber 300. Other mounting features are located at the back 308 and front 306 of the thermal chamber 300, but are not labeled. In some embodiments, the plurality of mounting features include holes that pass through at least one of the back 308, front 306, end 310A, end 310B, or top 312 in a direction from the top 312 to the bottom 314. The holes are configured to receive mounting mechanisms to mount the thermal chamber 300 to a circuit board located below the thermal chamber 300. For example, the mounting mechanism may be a screw and nut set.

[0063] In some embodiments, the thermal chamber 300 may include a hinge (not shown). The hinge may allow the thermal chamber 300 to be raised (e.g., opened) from the circuit board about the axis of rotation to expose the electrical device under test below the thermal chamber 300. In some embodiments, the hinge may allow the thermal chamber 300 to be lowered to (e.g., close to) the circuit board to cover the electrical device below and align the temperature control component 200 with the corresponding electrical device. In some embodiments, the hinge includes a first blade, a second blade, and a pin. The pin defines the axis of rotation between the first blade and the second blade. The first blade is coupled to the thermal chamber 300, and the second blade is coupled to the circuit board.

[0064] Figures 4A to 4B A system for testing an electrical device under various thermal conditions according to an embodiment of the present disclosure is shown. Figure 4A System 400 is shown in an enlarged view according to an embodiment of the present disclosure. Figure 4B The system 400 according to an embodiment of the present disclosure is shown in a collapsed view. It can be noted that the temperature control components (such as Figures 2A to 2B The temperature control component 200 of the embodiment of the present invention can be used with the system 400 or be a part of the system. It can also be noted that the thermal chamber (such as Figure 3 The thermal chamber 300 ) may be used with the system 400 or be a part of the system. Figures 2A to 2B The temperature control component 200 and Figure 3 The elements of thermal chamber 300 are used to help illustrate Figures 4A to 4B The system 400 can be used to test one or more electrical devices, such as the electrical device 404, under various thermal conditions as described herein. It can be noted that Figures 4A to 4BFour electrical devices are shown. A plurality of electrical devices is referred to as electrical device 404. A single electrical device is referred to as electrical device 404. Temperature control component 200 and socket 406 are referred to in a similar manner.

[0065] In an embodiment, the system 400 may include a circuit board 402. The circuit board 402 may be coupled to one or more electrical devices under test 404. In an embodiment, the circuit board 402 may facilitate the transfer of electrical signals into and out of the one or more electrical devices 404 and into and out of any additional components coupled to the circuit board 402. In an embodiment, the circuit board 402 may facilitate the transfer of power into and out of the one or more electrical devices 404 and into and out of any additional components coupled to the circuit board 402. For example, the temperature control component 200 may be coupled to the circuit board 402 and the circuit board 402 may provide power to various components of the temperature control component 200. In some embodiments, the circuit board 402 may be used to transmit instructions to perform a read operation, a write operation, or an erase operation at the electrical device 404 during the execution of the thermal test. In addition, the circuit board 402 may be used to retrieve information or test data from the electrical device 404 during the execution of the thermal test.

[0066] In some embodiments, system 400 can include one or more sockets 406. A socket can be an electromechanical device that couples an electrical device to circuit board 402. In an embodiment, a face of socket 406 can extend vertically beyond a top surface of electrical device 404. A bottom portion of temperature control component 200 (e.g., at least a portion of heat conductive layer 214) can fit within socket 406.

[0067] In some embodiments, the thermal chamber 300 can include one or more ports 318. The one or more ports 318 can expose a cavity within the thermal chamber 300. The electrical device 404 is coupled to a test socket of a circuit board and is accessible from the one or more ports 318.

[0068] In an embodiment, the thermal chamber 300 can be placed above the electrical device 404 and above the circuit board 402. One or more temperature control components 200 are mounted at the top surface of the thermal chamber 300. In some embodiments, each of the one or more ports 318 of the thermal chamber 300 is configured to receive a temperature control component 200. In some embodiments, a bottom portion of the temperature control component 200 extends within the cavity of the thermal chamber 300 and contacts the corresponding electrical device to transfer thermal energy into and out of the corresponding electrical device. The top portion of the temperature control component 200 extends above the top surface of the thermal chamber 300.

[0069] For example, a top portion of the temperature control component 200, such as a heat sink, may extend above the thermal chamber 300. A bottom portion of the temperature control component 200, such as the bottom surface 216B of the heat conductive layer 214, is in physical contact with a top surface of the electrical device 404. The temperature control component 200 may transfer thermal energy into and out of the electrical device 404. For example, the temperature control component 200 may change the temperature (e.g., package temperature or on-die temperature) of the electronic device 404 within a temperature range from -40 degrees Celsius to 140 degrees Celsius.

[0070] In some embodiments, the temperature control component 200 can be coupled to the thermal chamber 300. In some embodiments, the thermal chamber 300 can be used to hold the temperature control component 200 in place. In some embodiments, the thermal chamber 300 can align the temperature control component 200 with the corresponding test socket 406 and the corresponding electrical device 404 so that the bottom portion of the temperature control component 200 can be in physical contact with the corresponding electrical device 404. In embodiments where the thermal chamber 300 includes multiple ports to hold multiple temperature control components 200, the thermal chamber 300 using adjustable coupling members can allow each of the temperature control components 200 to apply similar or equal or consistent pressures to each of the corresponding electrical devices 404. Multiple temperature control components 200 can simultaneously apply different temperatures to the corresponding electrical devices 404 within the thermal chamber 300.

[0071] In some embodiments, seals 408 and 410 can be used with thermal chamber 300 to help seal thermal chamber 300 and create a positive pressure environment within the cavity of thermal chamber 300. In some embodiments, seals 408 and 410 do not hermetically seal thermal chamber 300. Instead, seals 408 and 410 can reduce the amount of gas escaping thermal chamber 300 to help create a positive pressure environment. In an embodiment, seals 408 and 410 can be made of non-conductive, insulating or antistatic materials (such as rubber or weather stripping). In an embodiment, seal 410 is disposed between circuit board 402 and the bottom surface of thermal chamber 300. In an embodiment, seal 408 is disposed on the top surface of thermal chamber 300. In an embodiment, seals with different configurations can be implemented. In some embodiments, seals 408 or 410 are not included in system 400.

[0072] In an embodiment, the temperature control component 200 may include an attachment member such as Figures 2A to 2B Attachment member 224. In an embodiment, thermal chamber 300 may include fixing features such as Figure 3In some embodiments, the adjustable coupling member can be coupled to the attachment member of the temperature control component 200 and the fixing feature 324 of the thermal chamber 300 to adjustably couple the temperature control component 200 to the thermal chamber 300. In some embodiments, the attachment member and the fixing feature are configured to receive the adjustable coupling member, which can adjustably couple the temperature control component 200 to the thermal chamber 300. In some embodiments, the adjustable coupling member can include a spring element that allows the vertical position of the temperature control component 200 mounted to the thermal chamber 300 to be adjusted.

[0073] In some embodiments, the thermal chamber 300 may include a gas port for receiving a gas such as oil-free air (OFA) or nitrogen or clean dry air or gas (CDA). In some embodiments, the dew point of the gas may be below the expected low temperature range in the test. In some embodiments, the gas may have less than one part per million (ppm) of carbon dioxide and less than 0.003 ppm of hydrocarbon vapor.

[0074] The thermal chamber 300 can be used to control the environment near the electrical device under test. In an embodiment, the dew point of such gas provided to the thermal chamber 300 is lower than the lowest temperature at which the electrical device is to be tested. This gas is provided to the thermal chamber 300 so that condensation, such as moisture or ice, is not formed at the electrical device during testing. For example, the package of the electrical device under test can be controlled within a temperature range of -25 degrees Celsius to 140 degrees Celsius. The dew point of the gas can be at or below -25 degrees Celsius (e.g., -90 degrees Celsius). When the temperature control component 200 applies a temperature of -25°C to the electrical device under test, condensation will not form at the electrical device based on the low dew point of the gas provided within the cavity of the thermal chamber 300.

[0075] In some embodiments, the thermal chamber 300 (e.g., a cavity within the thermal chamber 300) can be maintained as a positive pressure environment such that the only gas entering the thermal chamber 300 is from a gas port and the only gas escaping the thermal chamber 300 is the gas from the gas port, rather than hermetically sealing the thermal chamber 300.

[0076] In an embodiment, the temperature control component 200 can maintain a temperature environment local to each electrical device under test 404, rather than using hot or cold gas to change the temperature of the thermal chamber 300. In an embodiment where the thermal chamber 300 includes multiple temperature control components 200 coupled to multiple electrical devices 404, each of the temperature control components 200 can maintain a different (or the same) temperature at the corresponding electrical device under test 404 without using hot or cold gas. For example, a first electrical device under test can contact a first temperature control component. A second electrical device under test can contact a second temperature control component. The first temperature control component and the second temperature control component can be coupled to a single thermal chamber. The first temperature control component can maintain the temperature of the first electrical device at 100 degrees Celsius, while the second temperature control component can maintain the temperature of the second electrical device at 0 degrees Celsius.

[0077] Figures 5A to 5B A system for testing an electrical device under various thermal conditions according to an embodiment of the present disclosure is shown. It can be noted that temperature control components (such as Figures 2A to 2B The temperature control component 200 of the embodiment of the present invention can be used with the system 500 or be a part of the system. It can also be noted that the thermal chamber (such as Figure 3 The thermal chamber 300 ) may be used with the system 500 or be a part of the system. Figures 2A to 2B The temperature control component 200 and Figure 3 Elements of thermal chamber 300 are used to help illustrate aspects of FIG. 5. System 500 may be similar to that described with respect to Figures 4A to 4B System 400 described herein. System 500 may be used to test one or more electrical devices, such as electrical device 504, under various thermal conditions as described herein. Figure 5A , the system 500 is shown in an open position. Figure 5B , the system 500 is shown in a closed position.

[0078] The system 500 includes a temperature control component 200 mounted to a thermal chamber 508. For purposes of illustration and not limitation, the thermal chamber 508 shows a port for a single temperature control component 200. In other embodiments, the thermal chamber 508 may include any number of ports and any number of temperature control components 200. In some embodiments, the system 500 includes a circuit board 502. An electrical device 504 is coupled to the circuit board 502 via a socket 506.

[0079] In some embodiments, system 500 includes hinge 510. Hinge 510 allows thermal chamber 508 to be easily moved from an open position to a closed position and vice versa. In the closed position, a bottom portion of thermal chamber 508 is aligned to contact the package of electrical device 504. Hinge 510 can include blade 512A and blade 512B. Blade 512A connects the chamber to pin 514. Blade 512B connects circuit board 502 to pin 514. The axis of rotation of hinge 510 is defined by pin 514. It can be noted that hinges with different configurations can be used.

[0080] In an embodiment, the system 500 includes a base element 516. The thermal chamber 508 can be coupled to the base element in a closed position. In some embodiments, the base element 516 can be a part of the thermal chamber 508. A latch 520 can be used to secure the thermal chamber 508 in a closed position. In an embodiment, the base element 516 includes a gas fitting 518 coupled to a gas port. As described above, a gas source can be coupled to the gas fitting to maintain a positive pressure environment within the thermal chamber 508.

[0081] Figure 6 An example computing environment 600 is shown that includes a memory subsystem 610 according to some embodiments of the present disclosure. The memory subsystem 610 may include media such as memory components 612A to 612N. The memory components 612A to 612N may be volatile memory components, non-volatile memory components, or a combination thereof. In some embodiments, the memory subsystem is a storage system. An example of a storage system is an SSD. In some embodiments, the memory subsystem 610 is a hybrid memory / storage subsystem. Typically, the computing environment 600 may include a host system 620 that uses the memory subsystem 610. For example, the host system 620 may write data to the memory subsystem 610 and read data from the memory subsystem 610.

[0082] The host system 620 may be a computing device such as a desktop computer, a laptop computer, a network server, a mobile device, or such a computing device including a memory and a processing device. The host system 620 may include or be coupled to the memory subsystem 610 so that the host system 620 can read data from the memory subsystem 610 or write data to the memory subsystem. The host system 620 may be coupled to the memory subsystem 610 via a physical host interface. As used herein, "coupled to" generally refers to a connection between components, which may be an indirect communication connection or a direct communication connection (e.g., without an intermediate component), whether wired or wireless, including connections such as electrical, optical, magnetic, etc. Examples of physical host interfaces include, but are not limited to, a Serial Advanced Technology Attachment (SATA) interface, a Peripheral Component Interconnect Express (PCIe) interface, a Universal Serial Bus (USB) interface, a Fiber Channel, a Serial Attached SCSI (SAS), etc. The physical host interface may be used to transmit data between the host system 620 and the memory subsystem 610. When the memory subsystem 610 is coupled to the host system 620 through the PCIe interface, the host system 620 can further utilize the NVM Express (NVMe) interface to access the memory components 612A to 612N. The physical host interface can provide an interface for transferring control, address, data, and other signals between the memory subsystem 610 and the host system 620.

[0083] Memory components 612A to 612N may include any combination of different types of non-volatile memory components and / or volatile memory components. Examples of non-volatile memory components include NAND type flash memory. Each of memory components 612A to 612N may include one or more memory cell arrays, such as single-layer cells (SLC) or multi-layer cells (MLC) (e.g., triple-layer cells (TLC), quad-layer cells (QLC)). In some embodiments, a specific memory component may include both an SLC portion and an MLC portion of a memory cell. Each of the memory cells may store one or more data bits (e.g., data blocks) used by the host system 620. Although non-volatile memory components such as NAND type flash memory are described, memory components 612A to 612N may be based on any other type of memory such as volatile memory. In some embodiments, the memory components 612A to 612N may be, but are not limited to, random access memory (RAM), read-only memory (ROM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), phase change memory (PCM), magnetic random access memory (MRAM), or non-(NOR) flash memory, electrically erasable programmable read-only memory (EEPROM), and a cross-point array of non-volatile memory cells. The cross-point array of non-volatile memory may perform bit storage based on body resistance changes in combination with a stackable cross-grid data access array. In addition, compared to many flash memory-based memories, cross-point non-volatile memories may perform write-in-place operations, where non-volatile memory cells may be programmed without having to erase the non-volatile memory cells in advance. Further, the memory cells of the memory components 612A to 612N may be grouped into a group of memory cells, word lines, word line groups (e.g., multiple word lines in a group), or data blocks, which may refer to a unit of a memory component for storing data.

[0084] The memory system controller 615 (hereinafter referred to as the "controller") can communicate with the memory components 612A to 612N to perform operations such as reading data, writing data, or erasing data at the memory components 612A to 612N, as well as other such operations. The controller 615 may include hardware such as one or more integrated circuits and / or discrete components, buffer memory, or a combination thereof. The controller 615 may be a microcontroller, a dedicated logic circuit system (e.g., a field programmable gate array (FPGA), an application-specific integrated circuit (ASIC), etc.), or other suitable processor. The controller 615 may include a processor (e.g., a processing device) 617 configured to execute instructions stored in a local memory 619. In the example shown, the local memory 619 of the controller 615 includes an embedded memory configured to store instructions for executing various processes, operations, logic flows, and routines for controlling the operation of the memory subsystem 610 (including handling communications between the memory subsystem 610 and the host system 620). In some embodiments, the local memory 619 may include memory registers that store memory pointers, pre-fetched data, etc. Local memory 619 may also include read-only memory (ROM) for storing microcode. Figure 6 The example memory subsystem 610 in has been shown as including a controller 615, but in another embodiment of the present disclosure, the memory subsystem 610 may not include the controller 615, but may rely on external control (e.g., provided by an external host or by a processor or controller separate from the memory subsystem).

[0085] Typically, the controller 615 may receive commands or operations from the host system 620, and may convert the commands or operations into instructions or appropriate commands to achieve desired access to the memory components 612A to 612N. The controller 615 may be responsible for other operations, such as wear leveling operations, garbage collection operations, error detection and error correction code (ECC) operations, encryption operations, cache operations, and address conversion between logical block addresses and physical block addresses associated with the memory components 612A to 612N. The controller 615 may also include a host interface circuit system to communicate with the host system 620 via a physical host interface. The host interface circuit system may convert commands received from the host system into command instructions to access the memory components 612A to 612N, and convert responses associated with the memory components 612A to 612N into information for the host system 620.

[0086] The memory subsystem 610 may also include additional circuitry or components not shown. In some embodiments, the memory subsystem 610 may include a cache or buffer (e.g., DRAM) and address circuitry (e.g., row decoders and column decoders) that may receive addresses from the controller 615 and decode the addresses to access the memory components 612A to 612N.

[0087] The memory subsystem 610 includes a temperature estimation component 613 that performs operations as described herein. In some embodiments, the temperature estimation component 613 can be part of the host system 620, the controller 615, the memory component 612N, an operating system, or an application. The temperature estimation component 613 can generate an estimated temperature for the memory subsystem 610. For example, the controller 615 can include a processor 617 (processing device) configured to execute instructions stored in the local memory 619 to perform the operations described herein.

[0088] Figure 7 An example machine of computer system 700 is shown in which a set of instructions for causing the machine to perform any one or more of the methodologies discussed herein may be executed. In some embodiments, computer system 700 may correspond to a host or server system that includes, is coupled to, or utilizes a test platform (e.g., to perform operations related to Figure 1 In some embodiments, the machine may be connected (e.g., using a network) to other machines in a LAN, an intranet, an extranet, or the Internet. The machine may operate in the capacity of a server or a client user machine in a client-server network environment, as a peer computer in a peer-to-peer (or distributed) network environment, or as a server or a client user machine in a cloud computing infrastructure or environment.

[0089] The machine may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a cellular phone, a web appliance, a server, a network router, a switch or a bridge, or any machine capable of executing (sequentially or otherwise) a set of instructions that specify operations to be performed by the machine. Further, while a single machine is shown, the term "machine" should also be construed to include any collection of machines that individually or collectively execute one (or more) sets of instructions to perform any one or more of the methodologies discussed herein.

[0090] The example computer system 700 includes a processing device 702, a main memory 704 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM), such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 706 (e.g., flash memory, static random access memory (SRAM), etc.), and a data storage system 718 that communicate with each other via a bus 730.

[0091] The processing device 702 represents one or more general-purpose processing devices, such as a microprocessor, a central processing unit, etc. More specifically, the processing device can be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets or a processor that implements a combination of instruction sets. The processing device 702 can also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The processing device 702 is configured to execute instructions 726 for performing the operations and steps discussed herein. The computer system 700 can further include a network interface device 708 to communicate through a network 720.

[0092] The data storage system 718 may include a machine-readable storage medium 724 (also referred to as a computer-readable medium) on which is stored one or more sets of instructions 726 or software embodying any one or more of the methodologies or functions described herein. The instructions 726 may also reside, completely or at least partially, within the main memory 704 and / or within the processing device 702 during execution of the instructions by the computer system 700, the main memory 704 and the processing device 702 also constituting machine-readable storage media. The machine-readable storage medium 724, the data storage system 718, and / or the main memory 704 may correspond to a memory subsystem.

[0093] In one embodiment, instructions 726 include instructions for implementing a resource allocator component (e.g., Figure 1 The machine-readable storage medium 724 is shown as a single medium in the example embodiment, but the term "machine-readable storage medium" should be considered to include a single medium or multiple media storing one or more sets of instructions. The term "machine-readable storage medium" should also be considered to include any medium capable of storing or encoding a set of instructions for execution by a machine and causing the machine to perform any one or more of the methods of the present disclosure. Therefore, the term "machine-readable storage medium" should be considered to include, but not limited to, solid-state memory, optical media, and magnetic media.

[0094] Some portions of the foregoing detailed description have been presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the means by which those skilled in the art of data processing most effectively communicate the substance of their work to others skilled in the art. An algorithm is here and generally considered to be a self-consistent sequence of operations that leads to a desired result. The operations are those that require physical manipulation of physical quantities. Typically, although not necessarily, these quantities take the form of electrical or magnetic signals that can be stored, combined, compared, and otherwise manipulated. It has been demonstrated that it is sometimes convenient, in principle, for general reasons, to refer to such signals as bits, data, values, elements, symbols, characters, terms, quantities, etc.

[0095] It should be borne in mind, however, that all of these or similar terms will be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. The present disclosure may refer to the actions and processes of a computer system or similar electronic computing device that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system's memories or registers or other such information storage systems.

[0096] The present disclosure also relates to an apparatus for performing the operations herein. Such an apparatus may be specifically constructed for the intended purpose, or it may comprise a general purpose computer selectively activated or reconfigured by a computer program stored in the computer. Such a computer program may be stored in a computer-readable storage medium, such as, but not limited to, any type of disk including floppy disks, optical disks, CD-ROMs and magneto-optical disks, read-only memories (ROMs), random access memories (RAMs), EPROMs, EEPROMs, magnetic or optical cards, or any type of media suitable for storing electronic instructions, all of which are each coupled to a computer system bus.

[0097] The algorithms and displays presented herein are not inherently associated with any particular computer or other device. Various general purpose systems can be used together with programs according to the teachings herein, or it may be convenient to construct more specialized equipment to perform the method. As described below, structures for various of these systems will occur. In addition, the present disclosure is not described with reference to any particular programming language. It should be understood that various programming languages ​​may be used to implement the teachings of the present disclosure as described herein.

[0098] The present disclosure may be provided as a computer program product or software, which may include a machine-readable medium having instructions stored thereon, which may be used to program a computer system (or other electronic device) to perform a process according to the present disclosure. The machine-readable medium includes any mechanism for storing information in a form readable by a machine (e.g., a computer). In some embodiments, the machine-readable (e.g., computer-readable) medium includes a machine (e.g., computer) readable storage medium, such as a read-only memory ("ROM"), a random access memory ("RAM"), a magnetic disk storage medium, an optical storage medium, a flash memory component, etc.

[0099] The words "example" or "exemplary" are used herein to mean used as an example, instance or illustration. Any aspect or design described herein as "example" or "exemplary" is not necessarily interpreted as being more preferred or advantageous than other embodiments or designs. More specifically, the use of the word "example" or "exemplary" is intended to present concepts in a specific way. As used in this application, the term "or" is intended to represent an inclusive "or" rather than an exclusive "or". That is, unless otherwise specified or obvious in the context, "X includes A or B" is intended to represent any natural inclusive arrangement. That is, if X includes A; X includes B; or X includes both A and B, "X includes A or B" is satisfied in any of the above examples. In addition, unless otherwise specified or the context clearly points to a singular form, the article "one" used in this application and the appended claims should generally be interpreted as meaning "one or more". In addition, unless so described, the term "embodiment" or "one embodiment" or "embodiment" or "one embodiment" etc. is always used and is not intended to represent the same embodiment or embodiment. One or more embodiments or embodiments described herein may be combined in a specific embodiment or embodiment. The terms “first,” “second,” “third,” “fourth,” etc. as used herein refer to labels for distinguishing different elements, but do not necessarily have ordinal meanings according to their numerical names.

[0100] In the foregoing description, embodiments of the present disclosure have been described with reference to specific example embodiments of the present disclosure. It will be apparent that various modifications may be made thereto without departing from the broader scope and spirit of the embodiments of the present disclosure as set forth in the appended claims. Therefore, this specification and the accompanying drawings should be understood in an illustrative rather than a restrictive sense.

Claims

1. A thermal chamber comprising: A cavity enclosed by multiple faces; exposing one or more ports of the cavity within the thermal chamber, wherein each of the one or more ports is configured to receive a temperature control component having a solid physical structure and is configured to transfer thermal energy to and from an electrical device exposed through the cavity; as well as An open bottom area of ​​the thermal chamber is located below the one or more ports, wherein the open bottom area is configured to allow the temperature control component to contact the electrical device exposed through the open bottom area.

2. The thermal chamber of claim 1, wherein the plurality of faces comprise a material that is a thermal insulator and is not electrically conductive.

3. The thermal chamber of claim 1, wherein each of the one or more ports comprises opposing sides, the thermal chamber further comprising: a first securing feature located proximate a first one of the opposing sides of a first port of the one or more ports; as well as a second securing feature located proximate a second one of the opposing sides of the first port, wherein the first and second securing features allow the temperature control component to be secured to a top one of the plurality of sides of the thermal chamber and align the temperature control component to contact the electrical device exposed through the bottom open area.

4. The thermal chamber of claim 3, wherein the first fixing feature and the second fixing feature comprise holes through the top surface of the thermal chamber, the first fixing feature and the second fixing feature each being configured to receive an adjustable coupling member to adjustably couple the temperature control component to the thermal chamber.

5. The thermal chamber of claim 1, further comprising: A gas port is located at one of the plurality of faces, the gas port connecting an outer surface of the thermal chamber to the cavity.

6. The thermal chamber of claim 5, wherein the gas port comprises an aperture located at one of the plurality of faces.

7. The thermal chamber of claim 6, further comprising: A gas fitting includes a first end and a second end, wherein the first end of the gas fitting fits within the gas port.

8. The thermal chamber of claim 1, wherein the one or more ports include a plurality of ports aligned along a horizontal axis, wherein a bottom surface of the plurality of surfaces includes a single bottom surface open area.

9. The thermal chamber of claim 1, further comprising: A plurality of mounting features are located on at least one of the back side, the front side, the first end, or the second end of the plurality of faces, the plurality of mounting features being configured to receive mounting mechanisms to mount the thermal chamber to a circuit board located below the thermal chamber.

10. The thermal chamber of claim 1, further comprising: A hinge includes a first blade, a second blade, and a pin, wherein the pin defines an axis of rotation between the first blade and the second blade, wherein the first blade is coupled to the thermal chamber and the second blade is coupled to a circuit board.

11. A system for testing an electrical device under various thermal conditions, comprising: Circuit boards; the electrical device coupled to the circuit board; a temperature control component having a solid physical structure and configured to contact the electrical device to transfer thermal energy into and out of the electrical device; as well as a thermal chamber configured to be located above the circuit board, the thermal chamber comprising: A cavity enclosed by multiple faces; as well as One or more ports of the cavity within the thermal chamber are exposed, wherein each of the one or more ports is configured to receive the temperature control component to transfer thermal energy to and from the electrical device exposed through the cavity.

12. The system of claim 11, wherein the thermal chamber further comprises: An open bottom area of ​​the thermal chamber is located below the one or more ports, wherein the open bottom area is configured to allow the temperature control component to contact the electrical device exposed through the open bottom area.

13. The system of claim 11, wherein the thermal chamber further comprises: a back surface of the plurality of surfaces, the back surface being oriented parallel to a horizontal axis; a front face of the plurality of faces, the front face being oriented parallel to the horizontal axis; a first end of the plurality of faces, the first end being oriented perpendicular to the horizontal axis; a second end of the plurality of faces, the second end oriented perpendicular to the horizontal axis; a top surface of the plurality of surfaces, the top surface oriented perpendicular to and coupled with the back surface, the front surface, the first end, and the second end, and wherein the top surface comprises the one or more ports oriented along a first direction of the horizontal axis, wherein each of the one or more ports comprises a top surface open area exposing the cavity within the thermal chamber, wherein each of the one or more ports is configured to receive the temperature control component; and A bottom surface among the plurality of surfaces is oriented parallel to the top surface, wherein the top surface open area of ​​the one or more ports corresponds to a bottom surface open area portion of the bottom surface directly below the top surface open area.

14. The system of claim 13, wherein each of the one or more ports of the thermal chamber comprises opposing sides, the thermal chamber further comprising: a first securing feature located proximate a first one of the opposing sides of a first port of the one or more ports; as well as A second securing feature is located near a second of the opposing sides of the first port, wherein the first securing feature and the second securing feature allow the temperature control component to be secured to the top surface of the thermal chamber and aligned to contact the electrical device exposed through the bottom surface open area.

15. The system of claim 14, further comprising: A plurality of adjustable coupling members for adjustably coupling the temperature control component to the thermal chamber via use of the first securing feature and the second securing feature.

16. The system of claim 15, wherein each of the plurality of adjustable coupling members comprises a spring element to adjustably couple the temperature control component to the thermal chamber.

17. The system of claim 15, wherein the top portion of the temperature control component comprises a heat sink, wherein the heat sink is coupled to the top surface of the thermal chamber using the plurality of adjustable coupling members.

18. The system of claim 13, wherein the thermal chamber further comprises: A gas port is located at one of the plurality of faces, the gas port connecting an outer surface of the thermal chamber to the cavity.

19. The system of claim 18, further comprising: A gas source is coupled to the thermal chamber via the gas port, the gas source comprising one of oil-free air or nitrogen, wherein the gas source is applied to the thermal chamber to create a positive pressure environment within the cavity of the thermal chamber.

20. The system of claim 11, further comprising: an additional electrical device coupled to the circuit board; as well as an additional temperature control component for contacting the additional electrical device to transfer thermal energy into and out of the additional electrical device, wherein a bottom portion of the additional temperature control component extends within the cavity of the thermal chamber and contacts a package of the additional electrical device, wherein the bottom portion of the temperature control component and the temperature of the bottom portion of the additional temperature control component are independently controlled within a temperature range.

Images