Semiconductor device packaging equipment

Abstract

The invention belongs to the technical field of semiconductor component packaging, and particularly relates to semiconductor device packaging equipment which comprises a packaging machine body. The packaging machine body is fixedly connected with a lower mold; an upper mold is fixedly connected to the portion, located over the lower mold, of the packaging machine body through a hydraulic cylinder. A plurality of first vacuum suction cups and second vacuum suction cups are arranged to conduct vacuum adsorption on semiconductor devices and plastic package material particles respectively, the first electric sliding block drives the materials to be conveyed to the lower die to be subjected to plastic package, the effect of synchronously feeding the two materials is achieved, the semiconductor device packaging efficiency is improved, and the production cost is reduced. Meanwhile, a plurality of ejector rods are driven by the upper die to eject a finished semiconductor device, so that the semiconductor device is conveniently picked up, a plurality of third vacuum chucks are driven by a second electric sliding block to perform vacuum adsorption and pickup on the packaged semiconductor device, the semiconductor device is conveyed to a discharging position, and the effect of discharging the packaged semiconductor device is achieved; automatic feeding and discharging of semiconductor device packaging are achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor component packaging, in particular to a semiconductor device packaging device. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators, which rely on the special electrical properties of semiconductor materials to complete specific functions. The production of semiconductor devices requires multiple processes, among which the packaging process is the most important.

[0003] A patent application with publication number CN118156183A discloses a semiconductor component packaging device, including a base frame, a feeding mechanism installed on the base frame, a top frame installed on the top of the base frame, a lifting mechanism installed inside the top of the top frame, both sides of the bottom end of the lifting mechanism are rotatably connected with a clamping mechanism that can move relatively, and a lateral displacement mechanism is installed at the bottom of the lifting mechanism. This application can not only position and clamp both sides of the semiconductor device board, but also clean the floating dust adhering to the surface of the semiconductor device board.

[0004] Although the above-mentioned packaging equipment can transport semiconductor devices and clean the dust on their surfaces, it is difficult to simultaneously load the semiconductor devices and the plastic packaging material particles required for packaging during the process of plastic packaging of the semiconductor devices. Therefore, they need to be loaded separately before packaging can be carried out, which easily affects the efficiency of semiconductor device packaging.

[0005] To this end, the present invention provides a semiconductor device packaging equipment. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a semiconductor device packaging equipment described in the present invention includes a packaging body; a lower mold is fixedly connected to the packaging body; an upper mold is fixedly connected to the packaging body and located directly above the lower mold through a hydraulic cylinder; a No. 1 electric cylinder is arranged between the lower mold and the upper mold; a No. 1 fixing frame is fixedly connected to the output end of the No. 1 electric cylinder; a plurality of No. 1 vacuum suction cups are fixedly connected to both sides of the No. 1 fixing frame; two No. 1 vacuum pumps are fixedly connected to the tops of both ends of the No. 1 fixing frame; and a plurality of No. 1 vacuum suction cups are fixedly connected to the two No. 1 vacuum pumps and a plurality of No. 1 vacuum suction cups are fixedly connected to the tops of the two ends of the No. 1 fixing frame. A No. 1 connecting pipe is fixedly connected; a sliding component is arranged on the packaging body, and the sliding component is used to drive the No. 1 electric cylinder to move; a matching component is arranged on the No. 1 vacuum suction cup, and the matching component is used to adsorb and load plastic packaging material particles; a square plate is slidably connected to the inner wall of the lower mold; a plurality of ejector rods are fixedly connected to the square plate, and the ejector rods are composed of round rods and top plates, the round rods are slidably connected to the inner wall of the lower mold, the top plate is fixedly connected to the top end of the round rods, and the top plate is located in the mold groove of the lower mold; four matching frames are fixedly connected to the outer wall of the square plate, and the protruding parts of the matching frames are located above the upper mold.

[0008] Preferably, the matching component includes a support frame, a No. 2 vacuum suction cup and a branch pipe; the support frame is fixedly connected to two No. 1 vacuum suction cups, and the support frame is located between the two No. 1 vacuum suction cups; the No. 2 vacuum suction cup is fixedly connected to the middle bottom surface of the support frame; the branch pipe is fixedly connected between the No. 1 connecting pipe and the support frame, and the No. 1 connecting pipe can be connected to the No. 2 vacuum suction cup through the branch pipe and the support frame.

[0009] Preferably, the sliding assembly includes a slide rail frame No. 1, an electric slider No. 1 and a connecting frame No. 1; the slide rail frame No. 1 is fixedly connected to the outer wall of the packaging body; the electric slider No. 1 is slidably connected to the bottom end of the slide rail frame No. 1; the connecting frame No. 1 is fixedly connected to the bottom end of the electric slider No. 1, and the end of the connecting frame No. 1 away from the electric slider No. 1 is fixedly connected to the top of the electric cylinder No. 1.

[0010] Preferably, a No. 2 slide rail frame is fixedly connected to the outer wall of the packaging body on one side away from the No. 1 slide rail frame; a No. 2 electric slider is slidably connected to the bottom end of the No. 2 slide rail frame; a No. 2 connecting frame is fixedly connected to the bottom end of the No. 2 electric slider; a No. 2 electric cylinder is fixedly connected to the end of the No. 2 connecting frame away from the No. 2 electric slider; a unloading assembly is provided at the bottom end of the No. 2 electric cylinder, and the unloading assembly is used for adsorbing and transporting the packaged semiconductor devices.

[0011] Preferably, the unloading assembly includes a No. 2 fixed frame, a No. 3 vacuum suction cup, a No. 2 vacuum pump and a No. 2 connecting pipe; the No. 2 fixed frame is fixedly connected to the output end of the No. 2 electric cylinder; a plurality of the No. 3 vacuum suction cups are respectively fixedly connected to both sides of the No. 2 fixed frame; two of the No. 2 vacuum pumps are fixedly connected to the tops of both ends of the No. 2 fixed frame; and the No. 2 connecting pipe is fixedly connected between the No. 3 vacuum suction cup and the No. 2 vacuum pump.

[0012] Preferably, the No. 1 vacuum suction cup is fixedly connected to the outer wall near the lower mold with a No. 1 wind box; the No. 1 air duct is fixedly connected between the No. 1 vacuum pump and the No. 1 wind box; the No. 3 vacuum suction cup is fixedly connected to the outer wall near the lower mold with a No. 2 wind box; the No. 2 wind box is fixedly connected to the outer wall away from the No. 3 vacuum suction cup, and the cross-sectional shape of the guide plate is an arc; the No. 2 air duct is fixedly connected between the No. 2 vacuum pump and the No. 2 wind box, and the No. 2 air duct is connected to the guide plate through the No. 2 wind box.

[0013] Preferably, the outer wall of the No. 1 wind box is slidably connected to multiple No. 3 electric sliders and No. 4 electric sliders; the outer wall of the No. 1 wind box is located between the No. 3 electric slider and the No. 4 electric slider and is slidably connected to multiple wind hole plates, and the opposite sides of the No. 3 electric slider and the No. 4 electric slider are fixedly connected with wind hole plates; a telescopic rod is fixedly connected between the two wind hole plates.

[0014] Preferably, a material storage box is fixedly connected to the packaging body at a position below the No. 1 slide rail frame; a plurality of No. 1 material boxes are fixedly connected to the material storage box; a No. 2 material box is fixedly connected to the material storage box near two No. 1 material boxes; and an inflation component is provided on the material storage box, which is used to intermittently eject semiconductor devices stored in the material storage box.

[0015] Preferably, the inflation assembly includes a No. 1 cylinder, a No. 1 sliding plate, a No. 1 push rod, a No. 2 push rod, a No. 2 cylinder, an air duct and a one-way valve; the No. 1 cylinder is fixedly connected to the center of the storage box; the No. 1 sliding plate is fixedly connected to the output end of the No. 1 cylinder; a plurality of the No. 1 push rods are fixedly connected to the No. 1 sliding plate, and the No. 1 push rod is slidably connected to the inner wall of the No. 1 material box; a plurality of the No. 2 push rods are fixedly connected to the No. 1 sliding plate, and the No. 2 push rod is slidably connected to the inner wall of the No. 2 material box, and the No. 2 push rod is located between the two No. 1 push rods; the No. 2 cylinder is fixedly connected to one end of the No. 1 slide rail frame away from the packaging body; the air duct is fixedly connected between the No. 1 cylinder and the No. 2 cylinder; the one-way valve is fixedly connected to the air duct.

[0016] Preferably, a material receiving box is fixedly connected to the packaging body at a position below the No. 2 slide rail frame; a plurality of No. 3 material boxes are fixedly connected to the material receiving box; a fixing rod is fixedly connected to the center inner part of the material receiving box; a No. 2 sliding plate is slidably connected to the inner wall of the material receiving box, and the fixing rod passes through the middle part of the No. 2 sliding plate; an elastic part is sleeved on the outer wall of the fixing rod, and the elastic part is located between the outer wall of the No. 2 sliding plate and the inner wall of the material receiving box; a plurality of No. 3 push rods are fixedly connected to the No. 2 sliding plate, and the No. 3 push rods are slidably connected to the inner wall of the No. 3 material box.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The semiconductor device packaging equipment described in the present invention vacuum absorbs semiconductor devices and plastic packaging material particles respectively through the multiple No. 1 vacuum suction cups and No. 2 vacuum suction cups. As the No. 1 electric slider drives the materials to be plastic-sealed on the lower mold, the two materials are simultaneously loaded, thereby improving the efficiency of semiconductor device packaging. At the same time, the upper mold drives multiple ejector rods to eject the finished semiconductor devices, which is convenient for picking up semiconductor devices. The No. 2 electric slider drives multiple No. 3 vacuum suction cups to vacuum absorb and pick up the packaged semiconductor devices, and the semiconductor devices are sent to the unloading place, which plays a role in unloading the packaged semiconductor devices, thereby realizing automatic loading and unloading of semiconductor device packaging.

[0019] 2. The semiconductor device packaging equipment described in the present invention can, through the provision of No. 1 and No. 2 air boxes, blow air onto the lower mold by multiple vacuum pumps while loading and unloading semiconductor devices, so as to clean impurities on the lower mold by blowing. Multiple air hole plates slide with the No. 3 electric slide block and the No. 4 electric slide block to control the range and intensity of the blowing on the lower mold. The two materials are stored in the material storage box. As the gas in the No. 2 cylinder is squeezed into the No. 1 cylinder, the two materials are pushed up for vacuum adsorption and picking. Multiple No. 3 push rods are used to receive the packaged semiconductor devices, and the finished semiconductor devices are stacked in sequence and stored in the material receiving box, so as to collect the finished products. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] Figure 1 is a stereogram of the present invention;

[0022] Figure 2 It is a structural schematic diagram of the lower mold in the present invention;

[0023] Figure 3 It is a structural schematic diagram of the No. 2 vacuum suction cup in the present invention;

[0024] Figure 4 It is a schematic diagram of the structure of the wind hole plate in the present invention;

[0025] Figure 5 It is a structural schematic diagram of the guide plate in the present invention;

[0026] Figure 6 It is a partial structural sectional view of the material storage box in the present invention;

[0027] Figure 7 It is a partial structural sectional view of cylinder No. 1 in the present invention;

[0028] Figure 8 It is a partial structural sectional view of cylinder No. 1 in the present invention.

[0029] In the figure: 1. Encapsulation body; 11. No. 1 electric cylinder; 12. No. 1 fixed frame; 13. No. 1 vacuum suction cup; 14. No. 1 vacuum pump; 15. No. 1 connecting pipe; 16. Lower mold; 17. Upper mold; 18. Square plate; 181. Ejector rod; 182. Matching frame; 2. Support frame; 21. No. 2 vacuum suction cup; 22. Branch pipe; 3. No. 1 slide rail frame; 31. No. 1 connecting frame; 4. No. 2 slide rail frame; 41. No. 2 connecting frame; 42. No. 2 electric cylinder; 5. No. 2 fixed frame; 51. No. 3 vacuum suction cup; 52. No. 2 vacuum pump; 53. No. 2 connecting pipe; 6. No. 1 wind box; 61. No. 1 air duct; 62. No. 2 wind box; 63. guide plate; 64. No. 2 air duct; 7. No. 3 electric slide block; 71. No. 4 electric slide block; 72. wind hole plate; 73. telescopic rod; 8. material storage box; 81. No. 1 material box; 82. No. 2 material box; 9. No. 1 cylinder; 91. No. 1 sliding plate; 92. No. 1 push rod; 93. No. 2 push rod; 94. No. 2 cylinder; 95. air guide tube; 96. one-way valve; 97. material collection box; 971. No. 3 material box; 972. fixing rod; 973. No. 2 sliding plate; 974. elastic part; 975. No. 3 push rod. DETAILED DESCRIPTION

[0030] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0031] like Figures 1 to 3 , Figure 8As shown, a semiconductor device packaging device according to an embodiment of the present invention comprises a packaging body 1; a lower mold 16 is fixedly connected to the packaging body 1; an upper mold 17 is fixedly connected to the packaging body 1 and located directly above the lower mold 16 through a hydraulic cylinder; a No. 1 electric cylinder 11 is arranged between the lower mold 16 and the upper mold 17; a No. 1 fixing frame 12 is fixedly connected to the output end of the No. 1 electric cylinder 11; a plurality of No. 1 vacuum suction cups 13 are fixedly connected to both sides of the No. 1 fixing frame 12; two No. 1 vacuum pumps 14 are fixedly connected to the tops of both ends of the No. 1 fixing frame 12; a No. 1 connecting pipe is fixedly connected between the two No. 1 vacuum pumps 14 and the plurality of No. 1 vacuum suction cups 13 15; the packaging body 1 is provided with a sliding component, which is used to drive the No. 1 electric cylinder 11 to move; the No. 1 vacuum suction cup 13 is provided with a matching component, which is used to absorb and load plastic packaging material particles; the inner wall of the lower mold 16 is slidably connected with a square plate 18; the square plate 18 is fixedly connected with a plurality of ejector rods 181, which are composed of round rods and a top plate, the round rods are slidably connected to the inner wall of the lower mold 16, the top plate is fixedly connected to the top of the round rods, and the top plate is located in the mold groove of the lower mold 16; the outer wall of the square plate 18 is fixedly connected with four matching frames 182, and the protruding part of the matching frame 182 is located above the upper mold 17;When encapsulating semiconductor devices, the encapsulation body 1 is used as the main structure of the encapsulation equipment, the lower mold 16 cooperates with the upper mold 17 connected to the hydraulic cylinder as the molding mold for the plastic encapsulation of the semiconductor devices, and multiple semiconductor devices and plastic encapsulation material particles are placed at the lower position of the sliding component respectively. The plastic encapsulation material particles can be epoxy resin, which is mainly used to fill the gap between the lower mold 16 and the upper mold 17, wrap the gold wires on the wafer and the lead frame, protect the components from damage, prevent the gas from oxidizing the internal chip, and ensure the safety and stability of the product. The sliding component drives the No. 1 electric cylinder 11 to slide to the upper position of the multiple semiconductor devices and plastic encapsulation material particles, and the output end of the No. 1 electric cylinder 11 drives the No. 1 vacuum suction cups 13 on both sides of the No. 1 fixed frame 12 to extend downward, and the two No. 1 vacuum pumps 14 work simultaneously to cooperate with the multiple No. 1 connecting pipes 15 and the No. 1 vacuum suction cups 13 to vacuum adsorb the multiple semiconductor devices, and cooperate with the components to synchronously adsorb the plastic encapsulation material particles. As the sliding component drives the adsorbed material to slide to the lower mold 16, after the sliding component is reset, the hydraulic cylinder drives The upper mold 17 is moved downwardly to be pressed onto the lower mold 16, and the plastic encapsulation material particles are heated to plastic encapsulate the semiconductor device, which plays a role in synchronously loading and encapsulating the semiconductor device and the plastic encapsulation material particles, thereby improving the efficiency of semiconductor device packaging. At the same time, after the semiconductor device packaging is completed, the upper mold 17 is internally built with an electric heating cutter to cut off the excess solidified plastic encapsulation material on the semiconductor device. The upper mold 17 is driven by the hydraulic cylinder to slide up and reset. After the upper mold 17 reaches the initial position, it continues to be driven by the hydraulic cylinder to slide up. The upper mold 17 fits the protruding parts of the four matching frames 182 and lifts the four matching frames 182. The square plate 18 synchronously drives the round rods on the multiple ejection rods 181 to slide, and the top plates on the multiple ejection rods 181 respectively eject the semiconductor devices with the excess plastic encapsulation material formed and cut out of the mold groove. After the finished semiconductor devices are collected, the hydraulic cylinder drives the upper mold 17 to reset to the initial position, and the multiple ejection rods 181 slide down and reset, and the residual plastic encapsulation material on the lower mold 16 can be cleaned, which is convenient for picking up and collecting the packaged semiconductor device products, thereby playing a role in ejecting the semiconductor devices. ;

[0032] The matching components include a support frame 2, a No. 2 vacuum suction cup 21 and a branch pipe 22; the support frame 2 is fixedly connected to two No. 1 vacuum suction cups 13, and the support frame 2 is located between the two No. 1 vacuum suction cups 13; the No. 2 vacuum suction cup 21 is fixedly connected to the middle bottom surface of the support frame 2; the branch pipe 22 is fixedly connected between the No. 1 connecting pipe 15 and the support frame 2, and the No. 1 connecting pipe 15 can be connected to the No. 2 vacuum suction cup 21 through the branch pipe 22 and the support frame 2; when the plastic encapsulation material particles are loaded, the support frame 2 is supported between the two No. 1 vacuum suction cups 13, and during the process of the No. 1 vacuum suction cup 13 vacuuming the semiconductor device, the No. 2 vacuum suction cup 21 connected to the branch pipe 22 synchronously vacuum adsorbs the plastic encapsulation material particles, and as the sliding component drives the two materials to be vacuum adsorbed to move, the two materials are loaded synchronously.

[0033] The sliding assembly includes a No. 1 slide rail frame 3, a No. 1 electric slider and a No. 1 connecting frame 31; the No. 1 slide rail frame 3 is fixedly connected to the outer wall of the packaging body 1; the No. 1 electric slider is slidably connected to the bottom end of the No. 1 slide rail frame 3; the No. 1 connecting frame 31 is fixedly connected to the bottom end of the No. 1 electric slider, and the end of the No. 1 connecting frame 31 away from the No. 1 electric slider is fixedly connected to the top of the No. 1 electric cylinder 11; when the two materials are moved by vacuum adsorption, the No. 1 electric slider is used to drive the No. 1 connecting frame 31 to slide at the bottom end of the No. 1 slide rail frame 3, and the No. 1 electric cylinder 11 connected to the end of the No. 1 connecting frame 31 away from the No. 1 electric slider controls the extension and contraction, and can simultaneously adsorb the two materials and send them to the lower mold 16 for plastic sealing, thereby playing a role in transferring and loading the two materials.

[0034] like Figures 1 to 3 , Figure 5 As shown, a No. 2 slide rail frame 4 is fixedly connected to the outer wall of the packaging body 1 on one side away from the No. 1 slide rail frame 3; a No. 2 electric slider is slidably connected to the bottom end of the No. 2 slide rail frame 4; a No. 2 connecting frame 41 is fixedly connected to the bottom end of the No. 2 electric slider; a No. 2 electric cylinder 42 is fixedly connected to the end of the No. 2 connecting frame 41 away from the No. 2 electric slider; a No. 2 electric cylinder 42 is provided with a blanking component at the bottom end of the No. 2 electric cylinder 42, and the blanking component is used for adsorbing the packaged semiconductor devices for transportation; when the packaged semiconductor devices are blanked, the No. 2 slide rail frame 4 is fixed above the blanking place of the packaging body 1, and after the hydraulic cylinder drives the upper mold 17 to reset, the No. 2 electric slider drives the No. 2 electric cylinder 42 at the bottom end of the No. 2 connecting frame 41 to slide close to the lower mold 16, and the plastic-sealed semiconductor devices are vacuum-adsorbed by the blanking component, and as the No. 2 electric slider drives the vacuum-adsorbed semiconductor devices to reach the blanking place for blanking, the plastic-sealed semiconductor devices are blanked.

[0035] The unloading assembly includes a No. 2 fixing frame 5, a No. 3 vacuum suction cup 51, a No. 2 vacuum pump 52 and a No. 2 connecting pipe 53; the No. 2 fixing frame 5 is fixedly connected to the output end of the No. 2 electric cylinder 42; a plurality of the No. 3 vacuum suction cups 51 are respectively fixedly connected to both sides of the No. 2 fixing frame 5; two No. 2 vacuum pumps 52 are fixedly connected to the tops of both ends of the No. 2 fixing frame 5; the No. 2 connecting pipe 53 is fixedly connected between the No. 3 vacuum suction cup 51 and the No. 2 vacuum pump 52; when the semiconductor device after plastic sealing is vacuum adsorbed, the No. 2 fixing frame The bottom end of the No. 2 electric cylinder 42 is fixedly connected to support a plurality of No. 3 vacuum suction cups 51. The output end of the No. 2 electric cylinder 42 is extended and retracted. After the bottom ends of the plurality of No. 3 vacuum suction cups 51 are attached to the end of the semiconductor device after plastic sealing, the No. 2 vacuum pump 52 starts to work to vacuum absorb the semiconductor device through the No. 2 connecting pipe 53 in cooperation with the No. 3 vacuum suction cups 51. As the No. 2 electric slider is reset, the absorbed semiconductor device is driven to move. After reaching the unloading area, the semiconductor device can be unloaded, thereby achieving the effect of vacuum absorption and unloading of the semiconductor device.

[0036] like Figures 1 to 5 As shown, the outer wall of the No. 1 vacuum suction cup 13 close to the lower mold 16 is fixedly connected to the No. 1 wind box 6; the No. 1 air duct 61 is fixedly connected between the No. 1 vacuum pump 14 and the No. 1 wind box 6; the No. 2 wind box 62 is fixedly connected to the outer wall of the No. 3 vacuum suction cup 51 close to the lower mold 16; the No. 2 wind box 62 is fixedly connected to the outer wall away from the No. 3 vacuum suction cup 51, and the cross-sectional shape of the guide plate 63 is an arc; the No. 2 air duct 64 is fixedly connected between the No. 2 vacuum pump 52 and the No. 2 wind box 62, and the No. 2 air duct 64 is connected to the guide plate 63 through the No. 2 wind box 62; after the lower mold 16 and the upper mold 17 encapsulate the semiconductor device, some impurities are likely to remain on the lower mold 16 of the semiconductor package, thereby affecting the packaging of the next batch of semiconductor devices. When the semiconductor device is loaded, the No. 1 wind box 6 is fixed at the front end position of multiple No. 1 vacuum suction cups 13, As the two No. 1 vacuum pumps 14 cooperate with multiple No. 1 vacuum suction cups 13 to vacuum absorb semiconductor devices and plastic packaging material particles, the two No. 1 vacuum pumps 14 extract air and discharge air at the same time. By continuously extracting air and compressing the gas, the extracted gas can be discharged to the outside, thereby forming a vacuum or maintaining a low-pressure gas state. One end of the gas outlet continuously sends the gas to the front end of the No. 1 air box 6 through the No. 1 air duct 61 to blow it out. During the material loading process, the lower mold 16 is blown to remove impurities. At the same time, after the semiconductor device is packaged, the two No. 2 vacuum pumps 52 cooperate with the No. 2 air duct 64 to continue to blow air into the No. 2 air box 62. The gas is then sent to the guide plate 63 by the No. 2 air box 62. Due to the curved setting of the guide plate 63, the lower mold 16 can be cleaned again when the packaged semiconductor device is unloaded, thereby cleaning the impurities on the lower mold 16.

[0037] The outer wall of the No. 1 wind box 6 is slidably connected to a plurality of No. 3 electric sliders 7 and No. 4 electric sliders 71; the outer wall of the No. 1 wind box 6 is located between the No. 3 electric slider 7 and the No. 4 electric slider 71 and is slidably connected to a plurality of wind hole plates 72, and the opposite sides of the No. 3 electric slider 7 and the No. 4 electric slider 71 are fixedly connected to the wind hole plates 72; a telescopic rod 73 is fixedly connected between the two wind hole plates 72; when blowing and cleaning impurities on the lower mold 16, the No. 3 electric slider 7 is used to cooperate with the No. 4 electric slider 71 to be installed on the outer wall of the No. 1 wind box 6, and the plurality of wind hole plates 72 are respectively connected to the interior of the No. 1 wind box 6 for controlling To control the blowing range, when there are few impurities on the lower mold 16, multiple air hole plates 72 are evenly distributed on the outer wall of the No. 1 wind box 6 to blow air to clean the impurities on the lower mold 16. When there are too many impurities remaining in one place on the lower mold 16, the No. 3 electric slide block 7 and the No. 4 electric slide block 71 cooperate to slide relatively close to each other, drive the multiple air hole plates 72 to squeeze the telescopic rod 73 to contract, and gather the multiple air hole plates 72 in the area with too many impurities. As the multiple air hole plates 72 blow air to an area with too many impurities at the same time, the intensity of blowing in the same area is improved, so as to achieve the effect of controlling the blowing range according to different degrees of impurity residues.

[0038] like Figure 1 , Figure 2 and Figure 6 As shown, a material storage box 8 is fixedly connected to the packaging body 1 at a position below the No. 1 slide rail frame 3; a plurality of No. 1 material boxes 81 are fixedly connected to the material storage box 8; a No. 2 material box 82 is fixedly connected to the material storage box 8 between two No. 1 material boxes 81; an inflation component is provided on the material storage box 8, and the inflation component is used to intermittently eject the semiconductor devices stored in the material storage box 8; when semiconductor devices and plastic encapsulation material particles are loaded, the material storage box 8 is fixed at the loading position of the packaging body 1 to store a large number of semiconductor devices and plastic encapsulation material particles, semiconductor devices are stacked in sequence in the No. 1 material box 81, and plastic encapsulation material particles are stacked in sequence in the No. 2 material box 82. After each batch of materials is vacuum-absorbed by the inflation component, the stored materials are driven to rise in height, which is convenient for picking up and loading the materials, thereby playing a role in material storage and auxiliary loading.

[0039] The inflation assembly includes a No. 1 cylinder 9, a No. 1 sliding plate 91, a No. 1 push rod 92, a No. 2 push rod 93, a No. 2 cylinder 94, an air guide tube 95 and a one-way valve 96; the No. 1 cylinder 9 is fixedly connected to the center of the storage box 8; the No. 1 sliding plate 91 is fixedly connected to the output end of the No. 1 cylinder 9; a plurality of the No. 1 push rods 92 are fixedly connected to the No. 1 sliding plate 91, and the No. 1 push rods 92 are slidably connected to the inner wall of the No. 1 material box 81; a plurality of the No. 2 push rods 93 are fixedly connected to the No. 1 sliding plate 91, and the No. 2 push rods 93 are slidably connected to the inner wall of the No. 2 material box 82, and the No. 2 push rods 93 are located between the two No. 1 push rods 92; the No. 2 cylinder 94 is fixedly connected to the No. 1 slide rail frame 3 away from the packaging body 1; the air guide pipe 95 is fixedly connected between the No. 1 cylinder 9 and the No. 2 cylinder 94; the one-way valve 96 is fixedly connected to the air guide pipe 95; when the material is ejected and fed, the No. 1 electric slider drives the No. 1 connecting frame 31 to slide and squeeze the output end of the No. 2 cylinder 94, and the gas inside the No. 2 cylinder 94 is sent to the inside of the No. 1 cylinder 9 through the air guide pipe 95, and the gas passing through the one-way valve 96 can only enter but not exit. The gas entering the No. 1 cylinder 9 makes the output end of the No. 1 cylinder 9 push the No. 1 sliding plate 91, and the No. 1 sliding plate 91 synchronously drives multiple No. 1 ejector rods 92 and No. 2 ejector rods 93 to eject the material. The ejection height is the height of one material, which is convenient for picking up and feeding semiconductor devices and plastic packaging material particles.

[0040] like Figure 1 , Figure 2 and Figure 7As shown, a material receiving box 97 is fixedly connected to the packaging body 1 at a position below the No. 2 slide rail frame 4; a plurality of No. 3 material boxes 971 are fixedly connected to the material receiving box 97; a fixing rod 972 is fixedly connected to the center of the material receiving box 97; a No. 2 sliding plate 973 is slidably connected to the inner wall of the material receiving box 97, and the fixing rod 972 passes through the middle of the No. 2 sliding plate 973; an elastic member 974 is sleeved on the outer wall of the fixing rod 972, and the elastic member 974 is located between the outer wall of the No. 2 sliding plate 973 and the inner wall of the material receiving box 97; a plurality of No. 3 ejector rods 975 are fixedly connected to the No. 2 sliding plate 973, and the No. 3 ejector rods 975 are slidably connected to the inner wall of the No. 2 sliding plate 973. It is connected to the inner wall of the No. 3 material box 971; when picking up and unloading the plastic-sealed semiconductor devices, the semiconductor devices are vacuum-adsorbed by multiple No. 3 vacuum suction cups 51, and as the No. 2 electric slider drives the materials to the top of the material receiving box 97, the output end of the No. 2 electric cylinder 42 extends downward to place the semiconductor devices inside the No. 3 material box 971, and the semiconductor devices are placed on the No. 3 push rod 975. Each time a batch of semiconductor devices is placed in the material receiving box 97, the No. 2 sliding plate 973 slides down to the height of one material on the fixed rod 972 due to the influence of gravity, and the elastic member 974 is squeezed and contracted to collect and store multiple semiconductor devices.

[0041] Working process: When packaging semiconductor devices, the packaging body 1 is used as the main frame of the packaging equipment, the lower mold 16 cooperates with the upper mold 17 connected to the hydraulic cylinder as the molding mold for the semiconductor device plastic packaging, and multiple semiconductor devices and plastic packaging material particles are placed at the lower position of the sliding component respectively. The storage box 8 is fixed at the loading position of the packaging body 1 to store a large number of semiconductor devices and plastic packaging material particles. Semiconductor devices are stacked in sequence inside the No. 1 material box 81, and plastic packaging material particles are stacked in sequence inside the No. 2 material box 82. After a batch of materials is vacuumed away by the inflatable component each time, the stored materials are driven to rise in height, which is convenient for picking up and loading materials, playing a role in material storage and auxiliary loading; when the materials are When the material is ejected, the No. 1 electric slide block drives the No. 1 connecting frame 31 to slide and squeeze the output end of the No. 2 cylinder 94. The gas inside the No. 2 cylinder 94 is sent to the inside of the No. 1 cylinder 9 through the air guide pipe 95. The gas passing through the one-way valve 96 can only enter but not exit. The gas entering the No. 1 cylinder 9 causes the output end of the No. 1 cylinder 9 to push the No. 1 sliding plate 91. The No. 1 sliding plate 91 synchronously drives multiple No. 1 ejector rods 92 and No. 2 ejector rods 93 to eject the material. The ejection height is the height of one material, which is convenient for picking up and loading semiconductor devices and plastic packaging material particles; the sliding assembly drives the No. 1 electric cylinder 11 to slide to the upper position of multiple semiconductor devices and plastic packaging material particles, and the output end of the No. 1 electric cylinder 11 drives both sides of the No. 1 fixed frame 12 The multiple No. 1 vacuum suction cups 13 extend downward, and the two No. 1 vacuum pumps 14 work simultaneously to cooperate with the multiple No. 1 connecting pipes 15 and the No. 1 vacuum suction cups 13 to vacuum adsorb multiple semiconductor devices, and cooperate with the components to synchronously adsorb the plastic encapsulation material particles. As the sliding component drives the adsorbed material to slide and send it to the lower mold 16, after the sliding component is reset, the hydraulic cylinder drives the upper mold 17 to press down on the lower mold 16, and heats the plastic encapsulation material particles to plastic encapsulate the semiconductor device, which plays a role in synchronously feeding and encapsulating the semiconductor device and the plastic encapsulation material particles, thereby improving the efficiency of semiconductor device packaging. At the same time, after the semiconductor device is packaged, the upper mold 17 has a built-in electric heating cutter to cut off the excess solidified plastic encapsulation material on the semiconductor device. The upper mold 17 is driven by the hydraulic cylinder to slide up and reset. After the upper mold 17 reaches the initial position, it continues to be driven by the hydraulic cylinder to slide up. The upper mold 17 fits the protrusions of the four matching frames 182 and lifts the four matching frames 182. The square plate 18 synchronously drives the round rods on the multiple ejector rods 181 to slide. The top plates on the multiple ejector rods 181 respectively eject the semiconductor devices with excess plastic sealing material formed and cut out of the mold groove. After the finished semiconductor devices are collected, the hydraulic cylinder drives the upper mold 17 to reset to the initial position, and the multiple ejector rods 181 slide down and reset, and the residual plastic sealing material on the lower mold 16 can be cleaned, which is convenient for picking up and collecting the finished semiconductor devices after packaging, and plays a role in ejecting the semiconductor devices;When the plastic encapsulation material particles are loaded, the support frame 2 is supported between the two No. 1 vacuum suction cups 13. During the process of the No. 1 vacuum suction cup 13 vacuuming the semiconductor device, the No. 2 vacuum suction cup 21 connected to the branch pipe 22 vacuums the plastic encapsulation material particles synchronously. As the sliding component drives the two materials to be vacuumed to move, the two materials are loaded synchronously.

[0042] When the two materials are moved by vacuum adsorption, the No. 1 electric slider is used to drive the No. 1 connecting frame 31 to slide on the bottom end of the No. 1 slide rail frame 3. The No. 1 connecting frame 31 is away from the No. 1 electric cylinder 11 connected to one end of the No. 1 electric slider to control the extension and contraction, and can simultaneously adsorb the two materials and send them to the lower mold 16 for plastic sealing, which plays a role in transferring and loading the two materials; when the packaged semiconductor device is unloaded, the No. 2 slide rail frame 4 is fixed above the unloading place of the packaging body 1. After the hydraulic cylinder drives the upper mold 17 to reset, the No. 2 electric slider drives the No. 2 electric cylinder 42 at the bottom of the No. 2 connecting frame 41 to slide close to the lower mold 16, and the unloading assembly is used to unload the packaged semiconductor device. The semiconductor device is vacuum adsorbed. As the No. 2 electric slider drives the vacuum adsorbed semiconductor device to the unloading place for unloading, it plays the role of unloading the semiconductor device after plastic sealing. When the semiconductor device after plastic sealing is vacuum adsorbed, the No. 2 fixing frame 5 is fixedly connected to the bottom end of the No. 2 electric cylinder 42 to support multiple No. 3 vacuum suction cups 51. The output end of the No. 2 electric cylinder 42 is extended and retracted. After the bottom ends of multiple No. 3 vacuum suction cups 51 are attached to the end of the semiconductor device after plastic sealing, the No. 2 vacuum pump 52 starts to work through the No. 2 connecting pipe 53 to cooperate with the No. 3 vacuum suction cup 51 to vacuum adsorb the semiconductor device. As the No. 2 electric slider is reset, it drives the adsorbed semiconductor device to move. , after arriving at the unloading area, the semiconductor device can be unloaded, which plays the role of vacuum adsorption unloading of the semiconductor device; after the lower mold 16 and the upper mold 17 encapsulate the semiconductor device, some impurities are likely to remain on the lower mold 16 of the semiconductor package, thereby affecting the packaging of the next batch of semiconductor devices. When loading the semiconductor device, the No. 1 air box 6 is fixed at the front end position of the multiple No. 1 vacuum suction cups 13, and the two No. 1 vacuum pumps 14 cooperate with the multiple No. 1 vacuum suction cups 13 to vacuum adsorb the semiconductor device and the plastic packaging material particles. The two No. 1 vacuum pumps 14 exhaust air while exhausting air, and continuously exhaust and compress the gas. The gas extracted can be discharged to form a vacuum or maintain a low-pressure gas state. One end of the gas outlet continuously delivers the gas to the front end of the No. 1 air box 6 through the No. 1 air duct 61 to blow out. During the material loading process, the lower mold 16 is blown to remove impurities. At the same time, after the semiconductor device is packaged, the two No. 2 vacuum pumps 52 cooperate with the No. 2 air duct 64 to continue to blow air into the No. 2 air box 62. The gas is then sent to the guide plate 63 by the No. 2 air box 62. Due to the curved setting of the guide plate 63, the lower mold 16 can be cleaned again when the semiconductor device after packaging is unloaded, so as to clean the impurities on the lower mold 16.When blowing and cleaning impurities on the lower mold 16, the No. 3 electric slider 7 is used to cooperate with the No. 4 electric slider 71 to be installed on the outer wall of the No. 1 wind box 6, and multiple air hole plates 72 are respectively connected to the interior of the No. 1 wind box 6 to control the blowing range. When there are few impurities on the lower mold 16, multiple air hole plates 72 are evenly distributed on the outer wall of the No. 1 wind box 6 to blow and clean the impurities on the lower mold 16. When there are too many impurities remaining in one place on the lower mold 16, the No. 3 electric slider 7 and the No. 4 electric slider 71 cooperate to slide relatively close, driving the multiple air hole plates 72 to squeeze the telescopic rod 73 to contract, and the multiple air hole plates 72 are gathered in the area with too many impurities. As the multiple air hole plates 72 blow air to an area with too many impurities at the same time, the intensity of blowing in the same area is improved, so as to achieve the effect of controlling the blowing range according to different impurity residual degrees;

[0043] When picking up and unloading the plastic-sealed semiconductor devices, the semiconductor devices are vacuum-adsorbed by multiple No. 3 vacuum suction cups 51, and as the No. 2 electric slider drives the materials to the top of the material receiving box 97, the output end of the No. 2 electric cylinder 42 extends downward to place the semiconductor devices inside the No. 3 material box 971, and the semiconductor devices are placed on the No. 3 push rod 975. Each time a batch of semiconductor devices is placed in the material receiving box 97, the No. 2 sliding plate 973 slides down to the height of one material on the fixed rod 972 due to the influence of gravity, and the elastic member 974 is squeezed and contracted to collect and store multiple semiconductor devices.

[0044] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor device packaging device, characterized in that: The invention comprises a packaging machine body (1); a lower mold (16) is fixedly connected to the packaging machine body (1); an upper mold (17) is fixedly connected to the packaging machine body (1) and located directly above the lower mold (16) through a hydraulic cylinder; a No. 1 electric cylinder (11) is arranged between the lower mold (16) and the upper mold (17); an output end of the No. 1 electric cylinder (11) is fixedly connected to a No. 1 fixed frame (12); a plurality of No. 1 vacuum suction cups (13) are fixedly connected to both sides of the No. 1 fixed frame (12); two No. 1 vacuum pumps (14) are fixedly connected to the tops of both ends of the No. 1 fixed frame (12); a No. 1 connecting pipe (15) is fixedly connected between the two No. 1 vacuum pumps (14) and the plurality of No. 1 vacuum suction cups (13); the packaging machine A sliding assembly is provided on the body (1), and the sliding assembly is used to drive the No. 1 electric cylinder (11) to move; a matching assembly is provided on the No. 1 vacuum suction cup (13), and the matching assembly is used to absorb and load plastic packaging material particles; the inner wall of the lower mold (16) is slidably connected to a square plate (18); a plurality of ejector rods (181) are fixedly connected to the square plate (18), and the ejector rods (181) are composed of round rods and a top plate, the round rods are slidably connected to the inner wall of the lower mold (16), the top plate is fixedly connected to the top of the round rods, and the top plate is located in the mold groove of the lower mold (16); four matching frames (182) are fixedly connected to the outer wall of the square plate (18), and the protruding part of the matching frame (182) is located above the upper mold (17).

2. A semiconductor device packaging equipment according to claim 1, characterized in that: The matching component comprises a support frame (2), a No. 2 vacuum suction cup (21) and a branch pipe (22); the support frame (2) is fixedly connected to two No. 1 vacuum suction cups (13), and the support frame (2) is located between the two No. 1 vacuum suction cups (13); the No. 2 vacuum suction cup (21) is fixedly connected to the middle bottom surface of the support frame (2); the branch pipe (22) is fixedly connected between the No. 1 connecting pipe (15) and the support frame (2), and the No. 1 connecting pipe (15) can be connected to the No. 2 vacuum suction cup (21) through the branch pipe (22) and the support frame (2).

3. The semiconductor device packaging equipment according to claim 1, characterized in that: The sliding assembly comprises a No. 1 slide rail frame (3), a No. 1 electric slider and a No. 1 connecting frame (31); the No. 1 slide rail frame (3) is fixedly connected to the outer wall of the packaging body (1); the No. 1 electric slider is slidably connected to the bottom end of the No. 1 slide rail frame (3); the No. 1 connecting frame (31) is fixedly connected to the bottom end of the No. 1 electric slider, and the end of the No. 1 connecting frame (31) away from the No. 1 electric slider is fixedly connected to the top end of the No. 1 electric cylinder (11).

4. A semiconductor device packaging equipment according to claim 3, characterized in that: A second slide rail frame (4) is fixedly connected to the outer wall of the packaging body (1) at one side away from the first slide rail frame (3); a second electric slider is slidably connected to the bottom end of the second slide rail frame (4); a second connecting frame (41) is fixedly connected to the bottom end of the second electric slider; a second electric cylinder (42) is fixedly connected to the end of the second connecting frame (41) away from the second electric slider; a blanking assembly is arranged at the bottom end of the second electric cylinder (42), and the blanking assembly is used for adsorbing and transporting the packaged semiconductor devices.

5. A semiconductor device packaging equipment according to claim 4, characterized in that: The material unloading assembly comprises a No. 2 fixed frame (5), a No. 3 vacuum suction cup (51), a No. 2 vacuum pump (52) and a No. 2 connecting pipe (53); the No. 2 fixed frame (5) is fixedly connected to the output end of the No. 2 electric cylinder (42); a plurality of the No. 3 vacuum suction cups (51) are respectively fixedly connected to both sides of the No. 2 fixed frame (5); two No. 2 vacuum pumps (52) are fixedly connected to the tops of both ends of the No. 2 fixed frame (5); and the No. 2 connecting pipe (53) is fixedly connected between the No. 3 vacuum suction cup (51) and the No. 2 vacuum pump (52).

6. The semiconductor device packaging equipment according to claim 5, characterized in that: The outer wall of the No. 1 vacuum suction cup (13) close to the lower mold (16) is fixedly connected to the No. 1 wind box (6); the No. 1 air duct (61) is fixedly connected between the No. 1 vacuum pump (14) and the No. 1 wind box (6); the No. 2 wind box (62) is fixedly connected to the outer wall of the No. 3 vacuum suction cup (51) close to the lower mold (16); the No. 2 wind box (62) is fixedly connected to the outer wall away from the No. 3 vacuum suction cup (51) with a guide plate (63), and the cross-sectional shape of the guide plate (63) is an arc; the No. 2 air duct (64) is fixedly connected between the No. 2 vacuum pump (52) and the No. 2 wind box (62), and the No. 2 air duct (64) is connected to the guide plate (63) through the No. 2 wind box (62).

7. The semiconductor device packaging equipment according to claim 6, characterized in that: The outer wall of the No. 1 wind box (6) is slidably connected to a plurality of No. 3 electric sliders (7) and a No. 4 electric slider (71); the outer wall of the No. 1 wind box (6) is slidably connected to a plurality of wind hole plates (72) located between the No. 3 electric slider (7) and the No. 4 electric slider (71), and the wind hole plates (72) are fixedly connected to the opposite sides of the No. 3 electric slider (7) and the No. 4 electric slider (71); and a telescopic rod (73) is fixedly connected between the two wind hole plates (72).

8. The semiconductor device packaging equipment according to claim 3, characterized in that: A material storage box (8) is fixedly connected to the packaging body (1) at a position below the No. 1 slide rail frame (3); a plurality of No. 1 material boxes (81) are fixedly connected to the material storage box (8); a No. 2 material box (82) is fixedly connected to the material storage box (8) between two No. 1 material boxes (81); and an inflation component is provided on the material storage box (8), and the inflation component is used to intermittently eject semiconductor devices stored in the material storage box (8).

9. The semiconductor device packaging equipment according to claim 8, characterized in that: The inflation assembly comprises a No. 1 cylinder (9), a No. 1 sliding plate (91), a No. 1 push rod (92), a No. 2 push rod (93), a No. 2 cylinder (94), an air guide tube (95) and a one-way valve (96); the No. 1 cylinder (9) is fixedly connected to the center of the material storage box (8); the No. 1 sliding plate (91) is fixedly connected to the output end of the No. 1 cylinder (9); a plurality of No. 1 push rods (92) are fixedly connected to the No. 1 sliding plate (91), and the No. 1 push rods (92) are slidably connected to the No. 1 material box (81). ) inner wall; multiple No. 2 push rods (93) are fixedly connected to the No. 1 sliding plate (91), the No. 2 push rods (93) are slidably connected to the inner wall of the No. 2 material box (82), and the No. 2 push rods (93) are located between the two No. 1 push rods (92); the No. 2 cylinder (94) is fixedly connected to one end of the No. 1 slide rail frame (3) away from the packaging body (1); the air guide pipe (95) is fixedly connected between the No. 1 cylinder (9) and the No. 2 cylinder (94); the one-way valve (96) is fixedly connected to the air guide pipe (95).

10. The semiconductor device packaging equipment according to claim 4, characterized in that: A material receiving box (97) is fixedly connected to the packaging body (1) at a position below the No. 2 slide rail frame (4); a plurality of No. 3 material boxes (971) are fixedly connected to the material receiving box (97); a fixing rod (972) is fixedly connected to the center of the material receiving box (97); a No. 2 sliding plate (973) is slidably connected to the inner wall of the material receiving box (97), and the fixing rod (972) passes through the middle of the No. 2 sliding plate (973); an elastic member (974) is sleeved on the outer wall of the fixing rod (972), and the elastic member (974) is located between the outer wall of the No. 2 sliding plate (973) and the inner wall of the material receiving box (97); a plurality of No. 3 push rods (975) are fixedly connected to the No. 2 sliding plate (973), and the No. 3 push rods (975) are slidably connected to the inner wall of the No. 3 material box (971).

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