A semiconductor device packaging equipment

Abstract

The present invention belongs to the technical field of semiconductor device packaging, and specifically relates to a semiconductor device packaging equipment, including a packaging body; a lower mold is fixedly connected to the packaging body; an upper mold is fixedly connected above the lower mold on the packaging body through a hydraulic cylinder; by arranging a plurality of first vacuum suction cups and second vacuum suction cups to vacuum-adsorb semiconductor devices and plastic encapsulation material particles respectively, as the first electric slider drives the materials to the lower mold for plastic encapsulation, it plays a role in synchronously feeding the two materials, improving the efficiency of semiconductor device packaging. At the same time, relying on the upper mold to drive a plurality of ejector rods to eject the finished semiconductor devices, facilitating the picking of semiconductor devices. Using the second electric slider to drive a plurality of third vacuum suction cups to vacuum-adsorb and pick up the packaged semiconductor devices, and sending the semiconductor devices to the blanking place, playing a role in blanking the packaged semiconductor devices, and realizing automatic loading and unloading of semiconductor device packaging.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor device packaging, and specifically relates to a semiconductor device packaging equipment. Background Art

[0002] A semiconductor device is an electronic device with conductivity between that of a good conductor and an insulator, relying on the special electrical properties of semiconductor materials to perform specific functions. When manufacturing semiconductor devices, multiple processes are required, and the packaging process is of utmost importance among these processes.

[0003] A patent application with the publication number CN118156183A discloses a semiconductor component packaging equipment, including a base frame. A feeding mechanism is installed on the base frame, a top frame is installed on the top of the base frame, a lifting mechanism is installed inside the top end of the top frame, clamping mechanisms that can move relative to each other are rotatably connected to both sides of the bottom end of the lifting mechanism, and a lateral displacement mechanism is installed at the bottom of the lifting mechanism. This application can not only position and clamp both sides of the semiconductor device board, but also clean the floating dust adhering to the surface of the semiconductor device board.

[0004] For the above-mentioned packaging equipment, although it can transport semiconductor devices and clean the floating dust on their surfaces, during the plastic packaging process of semiconductor devices, it is difficult to synchronously feed the semiconductor devices and the plastic packaging material particles required for packaging. Therefore, separate feeding is required before packaging, which is likely to affect the efficiency of semiconductor device packaging.

[0005] Therefore, the present invention provides a semiconductor device packaging equipment. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows: A semiconductor device packaging equipment described in the present invention includes a packaging body; a lower mold is fixedly connected to the packaging body; an upper mold is fixedly connected to the packaging body above the lower mold through a hydraulic cylinder; a first electric cylinder is arranged between the lower mold and the upper mold; the output end of the first electric cylinder is fixedly connected to a first fixing frame; a plurality of first vacuum suction cups are fixedly connected to both sides of the first fixing frame; two first vacuum pumps are fixedly connected to the tops of both ends of the first fixing frame; a first connecting pipe is fixedly connected between the two first vacuum pumps and the plurality of first vacuum suction cups; a sliding component is arranged on the packaging body, and the sliding component is used to drive the first electric cylinder to displace; a matching component is arranged on the first vacuum suction cup, and the matching component is used to adsorb and feed plastic packaging material particles; a square plate is slidably connected to the inner wall of the lower mold; a plurality of ejector rods are fixedly connected to the square plate, and the ejector rod consists of a round rod and a top plate, the round rod is slidably connected to the inner wall of the lower mold, the top plate is fixedly connected to the top of the round rod, and the top plate is located in the mold groove of the lower mold; four matching frames are fixedly connected to the outer wall of the square plate, and the protruding parts of the matching frames are located above the upper mold.

[0008] Preferably, the matching component includes a support frame, a second vacuum suction cup and a branch pipe; the support frame is fixedly connected to the two first vacuum suction cups, and the support frame is located between the two first vacuum suction cups; the second vacuum suction cup is fixedly connected to the middle bottom surface of the support frame; the branch pipe is fixedly connected between the first connecting pipe and the support frame, and the first connecting pipe can be connected to the second vacuum suction cup through the branch pipe and the support frame.

[0009] Preferably, the sliding component includes a first slide rail frame, a first electric slide block and a first connecting frame; the first slide rail frame is fixedly connected to the outer wall of the packaging body; the first electric slide block is slidably connected to the bottom end of the first slide rail frame; the first connecting frame is fixedly connected to the bottom end of the first electric slide block, and the end of the first connecting frame far from the first electric slide block is fixedly connected to the top end of the first electric cylinder.

[0010] Preferably, a second slide rail frame is fixedly connected to the outer wall of the packaging body on the side far from the first slide rail frame; a second electric slide block is slidably connected to the bottom end of the second slide rail frame; a second connecting frame is fixedly connected to the bottom end of the second electric slide block; a second electric cylinder is fixedly connected to the end of the second connecting frame far from the second electric slide block; a blanking component is arranged at the bottom end of the second electric cylinder, and the blanking component is used to adsorb and transfer the packaged semiconductor device.

[0011] Preferably, the blanking component includes a second fixing frame, a third vacuum suction cup, a second vacuum pump and a second connecting pipe; the second fixing frame is fixedly connected to the output end of the second electric cylinder; a plurality of the third vacuum suction cups are respectively fixedly connected to both sides of the second fixing frame; two second vacuum pumps are fixedly connected to the tops of both ends of the second fixing frame; the second connecting pipe is fixedly connected between the third vacuum suction cup and the second vacuum pump.

[0012] Preferably, a first air box is fixedly connected to the outer wall of the first vacuum suction cup close to the lower mold; a first air duct is fixedly connected between the first vacuum pump and the first air box; a second air box is fixedly connected to the outer wall of the third vacuum suction cup close to the lower mold; a flow guide plate is fixedly connected to the outer wall of the second air box away from the third vacuum suction cup, and the cross-sectional shape of the flow guide plate is arc-shaped; a second air duct is fixedly connected between the second vacuum pump and the second air box, and the second air duct is connected to the flow guide plate through the second air box.

[0013] Preferably, a plurality of third electric sliders and fourth electric sliders are respectively slidably connected to the outer wall of the first air box; a plurality of air hole plates are slidably connected to the outer wall of the first air box between the third electric slider and the fourth electric slider, and air hole plates are fixedly connected to the opposite sides of the third electric slider and the fourth electric slider; a telescopic rod is fixedly connected between the two air hole plates.

[0014] Preferably, a storage box is fixedly connected to the position below the first slide rail frame on the encapsulation body; a plurality of first material boxes are fixedly connected to the storage box; a second material box is fixedly connected to the storage box close to the two first material boxes; an inflation component is arranged on the storage box, and the inflation component is used for intermittently ejecting the semiconductor devices stored inside the storage box.

[0015] Preferably, the inflation component includes a first air cylinder, a first sliding plate, a first ejecting rod, a second ejecting rod, a second air cylinder, an air guide pipe and a one-way valve; the first air cylinder is fixedly connected to the center inside of the storage box; the first sliding plate is fixedly connected to the output end of the first air cylinder; a plurality of first ejecting rods are fixedly connected to the first sliding plate, and the first ejecting rods are slidably connected to the inner wall of the first material box; a plurality of second ejecting rods are fixedly connected to the first sliding plate, the second ejecting rods are slidably connected to the inner wall of the second material box, and the second ejecting rods are located between the two first ejecting rods; the second air cylinder is fixedly connected to one end of the first slide rail frame away from the encapsulation body; the air guide pipe is fixedly connected between the first air cylinder and the second air cylinder; the one-way valve is fixedly connected to the air guide pipe.

[0016] Preferably, a receiving box is fixedly connected to the position below the second slide rail frame on the encapsulation body; a plurality of third material boxes are fixedly connected to the receiving box; a fixing rod is fixedly connected to the center inside of the receiving box; a second sliding plate is slidably connected to the inner wall of the receiving box, and the fixing rod passes through the middle of the second sliding plate; an elastic member is sleeved on the outer wall of the fixing rod, and the elastic member is located between the outer wall of the second sliding plate and the inner wall of the receiving box; a plurality of third ejecting rods are fixedly connected to the second sliding plate, and the third ejecting rods are slidably connected to the inner wall of the third material box.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. A semiconductor device packaging equipment according to the present invention uses multiple first vacuum suction cups and second vacuum suction cups to vacuum-adsorb semiconductor devices and plastic encapsulation material particles respectively. As the first electric slider moves the materials to the lower mold for plastic encapsulation, it synchronously feeds the two materials, improving the efficiency of semiconductor device packaging. At the same time, the upper mold drives multiple ejector rods to eject the finished semiconductor devices, facilitating the picking of semiconductor devices. The second electric slider drives multiple third vacuum suction cups to vacuum-adsorb and pick up the packaged semiconductor devices, and sends the semiconductor devices to the discharging location, playing the role of discharging the packaged semiconductor devices, thus realizing automatic loading and unloading of semiconductor device packaging.

[0019] 2. A semiconductor device packaging equipment according to the present invention has a first air box and a second air box. While loading and unloading semiconductor devices, multiple vacuum pumps blow air onto the lower mold, playing the role of blowing and cleaning impurities on the lower mold. Multiple air hole plates slide with the third electric slider and the fourth electric slider, capable of controlling the range and intensity of the air blowing on the lower mold. The storage box stores the two materials. As the gas in the second cylinder is squeezed into the first cylinder, the two materials are pushed upward for convenient vacuum adsorption and picking. Multiple third ejector rods receive the packaged semiconductor devices, and stack the finished semiconductor devices in the receiving box for storage, playing the role of collecting the finished products. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the drawings.

[0021] Figure 1 is a three-dimensional view of the present invention;

[0022] Figure 2 is a schematic structural view of the lower mold of the present invention;

[0023] Figure 3 is a schematic structural view of the second vacuum suction cup of the present invention;

[0024] Figure 4 is a schematic structural view of the air hole plate of the present invention;

[0025] Figure 5 is a schematic structural view of the diversion plate of the present invention;

[0026] Figure 6 is a partial structural sectional view of the storage box of the present invention;

[0027] Figure 7 is a partial structural sectional view of the first cylinder of the present invention;

[0028] Figure 8 is a partial structural sectional view of the first cylinder of the present invention.

[0029] In the figure: 1. Encapsulation body; 11. First electric cylinder; 12. First fixing bracket; 13. First vacuum suction cup; 14. First vacuum pump; 15. First connecting pipe; 16. Lower mold; 17. Upper mold; 18. Square plate; 181. Ejector rod; 182. Fitting bracket; 2. Support frame; 21. Second vacuum suction cup; 22. Branch pipe; 3. First slide rail bracket; 31. First connecting bracket; 4. Second slide rail bracket; 41. Second connecting bracket; 42. Second electric cylinder; 5. Second fixing bracket; 51. Third vacuum suction cup; 52. Second vacuum pump; 53. Second connecting pipe; 6. First air box; 61. First air duct; 62. Second air box; 63. Deflector; 64. Second air duct; 7. Third electric slider; 71. Fourth electric slider; 72. Air hole plate; 73. Telescopic rod; 8. Stock bin; 81. First material box; 82. Second material box; 9. First air cylinder; 91. First sliding plate; 92. First ejector rod; 93. Second ejector rod; 94. Second air cylinder; 95. Air guide pipe; 96. Check valve; 97. Receiving bin; 971. Third material box; 972. Fixed rod; 973. Second sliding plate; 974. Elastic member; 975. Third ejector rod. Specific implementation manner

[0030] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0031] Such as Figures 1 to 3 , Figure 8As shown in the figure, a semiconductor device packaging equipment according to an embodiment of the present invention includes a packaging body 1; a lower mold 16 is fixedly connected to the packaging body 1; an upper mold 17 is fixedly connected to the packaging body 1 above the lower mold 16 through a hydraulic cylinder; a first electric cylinder 11 is arranged between the lower mold 16 and the upper mold 17; the output end of the first electric cylinder 11 is fixedly connected to a first fixing frame 12; a plurality of first vacuum suction cups 13 are fixedly connected to both sides of the first fixing frame 12; two first vacuum pumps 14 are fixedly connected to the top ends of both ends of the first fixing frame 12; a first connecting pipe 15 is fixedly connected between the two first vacuum pumps 14 and the plurality of first vacuum suction cups 13; a sliding component is arranged on the packaging body 1, and the sliding component is used to drive the first electric cylinder 11 to displace; a matching component is arranged on the first vacuum suction cup 13, and the matching component is used for adsorbing and feeding plastic encapsulation material particles; a square plate 18 is slidably connected to the inner wall of the lower mold 16; a plurality of ejector rods 181 are fixedly connected to the square plate 18. The ejector rod 181 is composed of a round rod and a top plate. The round rod is slidably connected to the inner wall of the lower mold 16, and the top plate is fixedly connected to the top end of the round rod, and the top plate is located in the mold groove of the lower mold 16; four matching frames 182 are fixedly connected to the outer wall of the square plate 18, and the protruding parts of the matching frames 182 are located above the upper mold 17.When packaging semiconductor devices, the packaging body 1 is used as the main framework of the packaging equipment, and the lower mold 16 and the upper mold 17 connected by the hydraulic cylinder are used as the forming molds for plastic encapsulation of semiconductor devices. Multiple semiconductor devices and plastic encapsulation material particles are respectively placed below the sliding component. The plastic encapsulation material particles can be epoxy resin, which is mainly used to fill the gap between the lower mold 16 and the upper mold 17, wrap the gold wires on the wafer and lead frame, protect the components from damage, prevent gas from oxidizing the internal chip, and ensure the safe and stable use of the product. The sliding component drives the first electric cylinder 11 to slide to the upper position of multiple semiconductor devices and plastic encapsulation material particles. The output end of the first electric cylinder 11 drives multiple first vacuum suction cups 13 on both sides of the first fixing frame 12 to extend downward. Two first vacuum pumps 14 work simultaneously, cooperating with multiple first connecting pipes 15 and the first vacuum suction cups 13 to vacuum adsorb multiple semiconductor devices, and synchronously adsorb the plastic encapsulation material particles with the cooperating component. As the sliding component drives the adsorbed materials to slide and send them to the lower mold 16, after the sliding component resets, the hydraulic cylinder drives the upper mold 17 to press down on the lower mold 16, and heats the plastic encapsulation material particles to plastic encapsulate the semiconductor devices, playing the role of synchronously feeding and packaging the semiconductor devices and the plastic encapsulation material particles, improving the efficiency of semiconductor device packaging. At the same time, after the semiconductor device packaging is completed, an electric heating cutter is built into the upper mold 17 to cut off the excess solidified plastic encapsulation material part on the semiconductor device. The upper mold 17 is driven by the hydraulic cylinder to slide up and reset. After the upper mold 17 reaches the initial position, it is continuously driven by the hydraulic cylinder to slide up. The upper mold 17 fits the protruding parts of the four fitting frames 182 and jacks up the four fitting frames 182. The square plate 18 synchronously drives the round rods on multiple ejector rods 181 to slide. The top plates on multiple ejector rods 181 respectively eject the semiconductor devices with the excess plastic encapsulation material formed and cut out of the mold groove. After the finished semiconductor device products are collected, the hydraulic cylinder drives the upper mold 17 to reset to the initial position, and multiple ejector rods 181 slide down and reset, and the residual plastic encapsulation material on the lower mold 16 can be cleaned, which is convenient for picking up and collecting the finished packaged semiconductor device products, playing the role of ejecting the semiconductor devices.

[0032] The said cooperating component includes a support frame 2, a second vacuum suction cup 21 and a branch pipe 22; the support frame 2 is fixedly connected to two first vacuum suction cups 13, and the support frame 2 is located between the two first vacuum suction cups 13; the second vacuum suction cup 21 is fixedly connected to the middle bottom surface of the support frame 2; the branch pipe 22 is fixedly connected between the first connecting pipe 15 and the support frame 2, and the first connecting pipe 15 can be connected to the second vacuum suction cup 21 through the branch pipe 22 and the support frame 2; when feeding the plastic encapsulation material particles, the support frame 2 is used to support between the two first vacuum suction cups 13. During the process of the first vacuum suction cups 13 vacuum adsorbing the semiconductor devices, the second vacuum suction cup 21 connected by the branch pipe 22 synchronously vacuum adsorbs the plastic encapsulation material particles. As the sliding component drives the two materials adsorbed by vacuum to move, it plays the role of synchronously feeding the two materials.

[0033] The sliding component includes a first slide rail frame 3, a first electric slider, and a first connecting frame 31; the first slide rail frame 3 is fixedly connected to the outer wall of the encapsulation body 1; the first electric slider is slidably connected to the bottom end of the first slide rail frame 3; the first connecting frame 31 is fixedly connected to the bottom end of the first electric slider, and one end of the first connecting frame 31 away from the first electric slider is fixedly connected to the top end of the first electric cylinder 11; when vacuum-adsorbing and moving two kinds of materials, the first electric slider is used to drive the first connecting frame 31 to slide at the bottom end of the first slide rail frame 3, and the first electric cylinder 11 connected to the end of the first connecting frame 31 away from the first electric slider controls the telescopic movement, so as to simultaneously adsorb two kinds of materials and send them to the lower mold 16 for plastic sealing, playing a role in transporting and feeding the two kinds of materials.

[0034] As Figures 1 to 3 , Figure 5 shown, a second slide rail frame 4 is fixedly connected to the outer wall of the encapsulation body 1 on the side away from the first slide rail frame 3; a second electric slider is slidably connected to the bottom end of the second slide rail frame 4; a second connecting frame 41 is fixedly connected to the bottom end of the second electric slider; one end of the second connecting frame 41 away from the second electric slider is fixedly connected to a second electric cylinder 42; a blanking component is arranged at the bottom end of the second electric cylinder 42, and the blanking component is used for adsorbing and transporting the encapsulated semiconductor device; when blanking the encapsulated semiconductor device, the second slide rail frame 4 is fixed above the blanking position of the encapsulation body 1. After the upper mold 17 is reset by the hydraulic cylinder, the second electric slider drives the second electric cylinder 42 at the bottom end of the second connecting frame 41 to slide close to the lower mold 16, and relies on the blanking component to vacuum-adsorb the plastic-sealed semiconductor device. As the second electric slider drives the vacuum-adsorbed semiconductor device to reach the blanking position for blanking, it plays a role in blanking the plastic-sealed semiconductor device.

[0035] The blanking component includes a second fixing frame 5, a third vacuum chuck 51, a second vacuum pump 52, and a second connecting pipe 53; the second fixing frame 5 is fixedly connected to the output end of the second electric cylinder 42; a plurality of the third vacuum chucks 51 are respectively fixedly connected to both sides of the second fixing frame 5; two of the second vacuum pumps 52 are fixedly connected to the top ends of both ends of the second fixing frame 5; the second connecting pipe 53 is fixedly connected between the third vacuum chuck 51 and the second vacuum pump 52; when vacuum-adsorbing the plastic-sealed semiconductor device, the second fixing frame 5 is fixedly connected to the bottom end of the second electric cylinder 42 to support a plurality of the third vacuum chucks 51, and the output end of the second electric cylinder 42 telescopically moves. After the bottom ends of the plurality of the third vacuum chucks 51 are fitted to the ends of the plastic-sealed semiconductor device, the second vacuum pump 52 starts to work and cooperates with the third vacuum chuck 51 through the second connecting pipe 53 to vacuum-adsorb the semiconductor device. As the second electric slider resets and drives the adsorbed semiconductor device to displace, the semiconductor device can be blanked after reaching the blanking area, playing a role in vacuum-adsorbing and blanking the semiconductor device.

[0036] AsFigures 1 to 5 As shown, the outer wall of the No. 1 vacuum suction cup 13 close to the lower mold 16 is fixedly connected to the No. 1 air box 6; the No. 1 air duct 61 is fixedly connected between the No. 1 vacuum pump 14 and the No. 1 air box 6; the No. 3 vacuum suction cup 51 is fixedly connected to the outer wall of the lower mold 16 with the No. 2 air box 62; the No. 2 air box 62 is fixedly connected to the outer wall away from the No. 3 vacuum suction cup 51, and the cross-sectional shape of the guide plate 63 is curved; the No. 2 air duct 64 is fixedly connected between the No. 2 vacuum pump 52 and the No. 2 air box 62, and the No. 2 air duct 64 is connected to the guide plate 63 through the No. 2 air box 62; after the lower mold 16 and the upper mold 17 encapsulate the semiconductor device, some impurities are likely to remain on the lower mold 16 of the semiconductor package, thereby affecting the packaging of the next batch of semiconductor devices. When loading the semiconductor device, the No. 1 air box 6 is fixed at the front end position of multiple No. 1 vacuum suction cups 13, As the two No. 1 vacuum pumps 14 cooperate with multiple No. 1 vacuum suction cups 13 to vacuum absorb semiconductor devices and plastic packaging material particles, the two No. 1 vacuum pumps 14 pump air and discharge air at the same time. By continuously pumping air and compressing the gas, the extracted gas can be discharged to the outside, thereby forming a vacuum or maintaining a low-pressure gas state. One end of the air outlet continuously sends the gas to the front end of the No. 1 air box 6 through the No. 1 air duct 61 to blow it out. During the material loading process, the lower mold 16 is blown to remove impurities. At the same time, after the semiconductor device is packaged, the two No. 2 vacuum pumps 52 cooperate with the No. 2 air duct 64 to continue blowing air into the No. 2 air box 62. The gas is then sent to the guide plate 63 by the No. 2 air box 62. Due to the curved setting of the guide plate 63, the lower mold 16 can be cleaned again when the packaged semiconductor device is unloaded, thereby cleaning the impurities on the lower mold 16.

[0037] The outer wall of the No. 1 wind box 6 is slidably connected to a plurality of No. 3 electric sliders 7 and No. 4 electric sliders 71; the outer wall of the No. 1 wind box 6 is located between the No. 3 electric slider 7 and the No. 4 electric slider 71 and is slidably connected to a plurality of wind hole plates 72, and the opposite sides of the No. 3 electric slider 7 and the No. 4 electric slider 71 are fixedly connected to wind hole plates 72; a telescopic rod 73 is fixedly connected between the two wind hole plates 72; when blowing and cleaning impurities on the lower mold 16, the No. 3 electric slider 7 is used to cooperate with the No. 4 electric slider 71 to be installed on the outer wall of the No. 1 wind box 6, and the plurality of wind hole plates 72 are respectively connected to the interior of the No. 1 wind box 6 for controlling To control the blowing range, when there are few impurities on the lower mold 16, multiple air hole plates 72 are evenly distributed on the outer wall of the No. 1 air box 6 to blow air to clean the impurities on the lower mold 16. When there are too many impurities remaining in one place on the lower mold 16, the No. 3 electric slide 7 and the No. 4 electric slide 71 cooperate to slide closer to each other, driving the multiple air hole plates 72 to squeeze the telescopic rod 73 to contract, and the multiple air hole plates 72 are gathered in the area with too many impurities. As the multiple air hole plates 72 blow air to the area with too many impurities at the same time, the blowing intensity in the same area is increased, thereby achieving the effect of controlling the blowing range according to the different degrees of impurity residues.

[0038] As Figure 1 , Figure 2 and Figure 6 shown, a storage box 8 is fixedly connected to the lower position of the first slide rail frame 3 on the encapsulation body 1; a plurality of first material boxes 81 are fixedly connected to the storage box 8; a second material box 82 is fixedly connected to the storage box 8 near the middle of two first material boxes 81; an inflation component is arranged on the storage box 8, and the inflation component is used for intermittently ejecting the semiconductor devices stored inside the storage box 8; when loading the semiconductor devices and plastic encapsulation material particles, the storage box 8 is fixed at the loading position of the encapsulation body 1 to store a large number of semiconductor devices and plastic encapsulation material particles. The semiconductor devices are stacked in sequence inside the first material box 81, and the plastic encapsulation material particles are stacked in sequence inside the second material box 82. After a batch of materials is vacuum-adsorbed each time, the inflation component drives the stored materials to rise in height, facilitating the picking and loading of the materials, and playing a role in storing and assisting the loading of the materials.

[0039] The inflation component includes a first cylinder 9, a first sliding plate 91, a first ejector rod 92, a second ejector rod 93, a second cylinder 94, an air duct 95 and a check valve 96; the first cylinder 9 is fixedly connected to the center inside of the storage box 8; the first sliding plate 91 is fixedly connected to the output end of the first cylinder 9; a plurality of first ejector rods 92 are fixedly connected to the first sliding plate 91, and the first ejector rods 92 are slidably connected to the inner wall of the first material box 81; a plurality of second ejector rods 93 are fixedly connected to the first sliding plate 91, the second ejector rods 93 are slidably connected to the inner wall of the second material box 82, and the second ejector rods 93 are located between two first ejector rods 92; the second cylinder 94 is fixedly connected to one end of the first slide rail frame 3 away from the encapsulation body 1; the air duct 95 is fixedly connected between the first cylinder 9 and the second cylinder 94; the check valve 96 is fixedly connected to the air duct 95; when ejecting and loading the materials, the first electric slider drives the first connecting frame 31 to slide and squeeze the output end of the second cylinder 94, and the gas inside the second cylinder 94 is sent to the inside of the first cylinder 9 through the air duct 95. The gas passing through the check valve 96 only enters and does not exit. The gas entering the inside of the first cylinder 9 causes the output end of the first cylinder 9 to push up the first sliding plate 91, and the first sliding plate 91 synchronously drives a plurality of first ejector rods 92 and second ejector rods 93 to eject the materials, and the ejection height is the height of one material, facilitating the picking and loading of the semiconductor devices and plastic encapsulation material particles.

[0040] As Figure 1 , Figure 2 and Figure 7As shown, a material receiving box 97 is fixedly connected to the encapsulation body 1 at a position below the second slide rail frame 4; a plurality of third material boxes 971 are fixedly connected to the material receiving box 97; a fixing rod 972 is fixedly connected to the center inside of the material receiving box 97; a second sliding plate 973 is slidably connected to the inner wall of the material receiving box 97, and the fixing rod 972 passes through the middle of the second sliding plate 973; an elastic member 974 is sleeved on the outer wall of the fixing rod 972, and the elastic member 974 is located between the outer wall of the second sliding plate 973 and the inner wall of the material receiving box 97; a plurality of third ejector rods 975 are fixedly connected to the second sliding plate 973, and the third ejector rods 975 are slidably connected to the inner wall of the third material box 971; when picking up and discharging the plastic encapsulated semiconductor device, the semiconductor device is vacuum adsorbed by a plurality of third vacuum suction cups 51, and as the second electric slider moves the material to the upper part of the material receiving box 97, the output end of the second electric cylinder 42 extends downward, placing the semiconductor device inside the third material box 971, and the semiconductor device is placed on the third ejector rods 975. Each time a batch of semiconductor devices is placed in the material receiving box 97, due to the influence of gravity, the second sliding plate 973 slides down by the height of one material on the fixing rod 972, and the elastic member 974 is squeezed and contracted to be stressed, playing a role in collecting and storing a plurality of semiconductor devices.

[0041] Working process: When packaging semiconductor devices, the packaging body 1 serves as the main framework of the packaging equipment. The lower mold 16 and the upper mold 17 connected by the hydraulic cylinder are used as the forming molds for plastic encapsulation of semiconductor devices. Multiple semiconductor devices and plastic encapsulation material particles are respectively placed below the sliding component. The storage box 8 is fixed at the feeding position of the packaging body 1 to store a large number of semiconductor devices and plastic encapsulation material particles. The semiconductor devices are stacked in sequence inside the first material box 81, and the plastic encapsulation material particles are stacked in sequence inside the second material box 82. After each batch of materials is vacuum adsorbed, the inflation component drives the stored materials to rise, facilitating the picking and feeding of the materials, and playing a role in storing and assisting the feeding of the materials. When ejecting and feeding the materials, the first electric slider drives the first connecting frame 31 to slide and squeeze the output end of the second cylinder 94. The gas inside the second cylinder 94 is sent to the inside of the first cylinder 9 through the air duct 95. The gas passing through the one-way valve 96 only goes in but not out. The gas entering the inside of the first cylinder 9 causes the output end of the first cylinder 9 to push up the first sliding plate 91. The first sliding plate 91 synchronously drives multiple first ejector rods 92 and second ejector rods 93 to eject the materials. The ejected height is the height of one material, facilitating the picking and feeding of semiconductor devices and plastic encapsulation material particles. The sliding component drives the first electric cylinder 11 to slide to the position above multiple semiconductor devices and plastic encapsulation material particles. The output end of the first electric cylinder 11 drives multiple first vacuum suction cups 13 on both sides of the first fixing frame 12 to extend downward. Two first vacuum pumps 14 work simultaneously, cooperating with multiple first connecting pipes 15 and the first vacuum suction cups 13 to vacuum adsorb multiple semiconductor devices, and simultaneously adsorbing the plastic encapsulation material particles through the cooperating component. As the sliding component drives the adsorbed materials to slide and send them to the lower mold 16, after the sliding component resets, the hydraulic cylinder drives the upper mold 17 to press down on the lower mold 16 and heats the plastic encapsulation material particles to plastic encapsulate the semiconductor devices, playing a role in synchronously feeding and packaging the semiconductor devices and plastic encapsulation material particles, improving the efficiency of semiconductor device packaging. At the same time, after the semiconductor device packaging is completed, an electric heating cutter built inside the upper mold 17 cuts off the excess solidified plastic encapsulation material part on the semiconductor device. The upper mold 17 is driven by the hydraulic cylinder to slide up and reset. After the upper mold 17 reaches the initial position, it continues to be driven by the hydraulic cylinder to slide up. The upper mold 17 fits the protruding parts of the four cooperating frames 182 and pushes up the four cooperating frames 182. The square plate 18 synchronously drives the round rods on multiple ejector rods 181 to slide. The top plates on multiple ejector rods 181 respectively eject the semiconductor devices with the excess plastic encapsulation material formed and cut out of the mold groove. After the finished semiconductor devices are collected, the hydraulic cylinder drives the upper mold 17 to reset to the initial position, and multiple ejector rods 181 slide down and reset to clean the residual plastic encapsulation material on the lower mold 16, facilitating the picking and collection of the packaged semiconductor device finished products and playing a role in ejecting the semiconductor devices.When feeding plastic encapsulated material particles, use the support frame 2 to support between two first vacuum suction cups 13. During the process of the first vacuum suction cups 13 vacuum-sucking the semiconductor devices, the second vacuum suction cups 21 connected by the branch pipe 22 synchronously vacuum-suck the plastic encapsulated material particles. As the sliding component drives the two materials vacuum-sucked to move, it plays a role in synchronously feeding the two materials;

[0042] When vacuum adsorbing and moving two kinds of materials, the first electric slider is used to drive the first connecting frame 31 to slide at the bottom of the first slide rail frame 3. The first electric cylinder 11 connected to the end of the first connecting frame 31 away from the first electric slider controls the telescoping, which can simultaneously adsorb two kinds of materials and send them to the lower mold 16 for plastic sealing, playing the role of transporting and feeding the two kinds of materials; when discharging the packaged semiconductor device, the second slide rail frame 4 is fixed above the discharging position of the packaging machine body 1. After the hydraulic cylinder drives the upper mold 17 to reset, the second electric slider drives the second electric cylinder 42 at the bottom of the second connecting frame 41 to slide close to the lower mold 16. Relying on the discharging component to vacuum adsorb the packaged semiconductor device, as the second electric slider drives the vacuum-adsorbed semiconductor device to reach the discharging position for discharging, it plays the role of discharging the packaged semiconductor device; when vacuum adsorbing the packaged semiconductor device, the second fixing frame 5 is fixedly connected to the bottom of the second electric cylinder 42 to support multiple third vacuum suction cups 51. The output end of the second electric cylinder 42 telescopes. After the bottom ends of the multiple third vacuum suction cups 51 are fitted to the end of the packaged semiconductor device, the second vacuum pump 52 starts to work and cooperates with the third vacuum suction cups 51 through the second connecting pipe 53 to vacuum adsorb the semiconductor device. As the second electric slider resets and drives the adsorbed semiconductor device to displace, the semiconductor device can be discharged after reaching the discharging area, playing the role of vacuum adsorbing and discharging the semiconductor device; after the lower mold 16 and the upper mold 17 package the semiconductor device, it is easy to leave some impurities on the lower mold 16 for semiconductor packaging, which will affect the packaging of the next batch of semiconductor devices. When feeding the semiconductor device, the first air box 6 is fixed at the front position of the multiple first vacuum suction cups 13. As the two first vacuum pumps 14 respectively cooperate with the multiple first vacuum suction cups 13 to vacuum adsorb the semiconductor device and plastic sealing material particles, the two first vacuum pumps 14 pump air and discharge air at the same time. By continuously pumping air and compressing the gas, the extracted gas can be discharged, thereby forming a vacuum or maintaining a low-pressure gas state. The discharging end continuously sends the gas to the front end of the first air box 6 through the first air pipe 61 to blow out. During the feeding process of the materials, the lower mold 16 is blown to remove impurities. At the same time, after the semiconductor device is packaged, the two second vacuum pumps 52 cooperate with the second air pipe 64 to continue blowing air into the second air box 62 continuously, and the gas is then sent from the second air box 62 to the flow guide plate 63. Due to the arc-shaped setting of the flow guide plate 63, it can remove impurities on the lower mold 16 again when transporting the packaged semiconductor device for discharging, playing the role of cleaning impurities on the lower mold 16;When blowing air to clean impurities on the lower mold 16, the third electric slider 7 and the fourth electric slider 71 are used to be installed on the outer wall of the first air box 6. Multiple air hole plates 72 are respectively connected to the inside of the first air box 6 to control the blowing range. When there are few impurities on the lower mold 16, the multiple air hole plates 72 are evenly distributed on the outer wall of the first air box 6 to blow air to clean the impurities on the lower mold 16. When there is too much residue of impurities at one place on the lower mold 16, the third electric slider 7 and the fourth electric slider 71 cooperate to slide relatively close to each other, driving the multiple air hole plates 72 to squeeze the telescopic rod 73 to contract, converging the multiple air hole plates 72 to the area with excessive impurities. As the multiple air hole plates 72 blow air to the area with excessive impurities at the same time, the blowing intensity in the same area is increased, realizing the function of controlling the blowing range according to different degrees of impurity residue;

[0043] When picking up and discharging the encapsulated semiconductor device, the semiconductor device is vacuum adsorbed by multiple third vacuum suction cups 51. As the second electric slider moves the material to the upper part of the receiving box 97, the output end of the second electric cylinder 42 extends downward, placing the semiconductor device inside the third material box 971, and the semiconductor device is placed on the third ejector rod 975. Each time a batch of semiconductor devices is placed in the receiving box 97, due to the influence of gravity, the second sliding plate 973 slides down by the height of one material on the fixed rod 972, and the elastic member 974 is squeezed and contracted to be stressed, playing a role in collecting and storing multiple semiconductor devices.

[0044] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device packaging device, characterized in that: The invention comprises a packaging machine body (1); a lower mold (16) is fixedly connected to the packaging machine body (1); an upper mold (17) is fixedly connected to the packaging machine body (1) and located directly above the lower mold (16) through a hydraulic cylinder; a No. 1 electric cylinder (11) is provided between the lower mold (16) and the upper mold (17); the output end of the No. 1 electric cylinder (11) is fixedly connected to a No. 1 fixed frame (12); a plurality of No. 1 vacuum suction cups (13) are fixedly connected to both sides of the No. 1 fixed frame (12); two No. 1 vacuum pumps (14) are fixedly connected to the tops of both ends of the No. 1 fixed frame (12); a No. 1 connecting pipe (15) is fixedly connected between the two No. 1 vacuum pumps (14) and the plurality of No. 1 vacuum suction cups (13); the packaging machine A sliding assembly is provided on the body (1), and the sliding assembly is used to drive the displacement of the No. 1 electric cylinder (11); a matching assembly is provided on the No. 1 vacuum suction cup (13), and the matching assembly is used to adsorb and load the plastic packaging material particles; the inner wall of the lower mold (16) is slidably connected to a square plate (18); a plurality of ejector rods (181) are fixedly connected to the square plate (18), and the ejector rods (181) are composed of round rods and a top plate, the round rods are slidably connected to the inner wall of the lower mold (16), the top plate is fixedly connected to the top of the round rods, and the top plate is located in the mold groove of the lower mold (16); four matching frames (182) are fixedly connected to the outer wall of the square plate (18), and the protruding parts of the matching frames (182) are located above the upper mold (17); The matching assembly includes a support frame (2), a No. 2 vacuum suction cup (21) and a branch pipe (22); the support frame (2) is fixedly connected to the two No. 1 vacuum suction cups (13), and the support frame (2) is located between the two No. 1 vacuum suction cups (13); the No. 2 vacuum suction cup (21) is fixedly connected to the middle bottom surface of the support frame (2); the branch pipe (22) is fixedly connected between the No. 1 connecting pipe (15) and the support frame (2), and the No. 1 connecting pipe (15) can be connected to the No. 2 vacuum suction cup (21) through the branch pipe (22) and the support frame (2).

2. The semiconductor device packaging equipment according to claim 1, wherein: The sliding assembly comprises a No. 1 slide rail frame (3), a No. 1 electric slider and a No. 1 connecting frame (31); the No. 1 slide rail frame (3) is fixedly connected to the outer wall of the packaging body (1); the No. 1 electric slider is slidably connected to the bottom end of the No. 1 slide rail frame (3); the No. 1 connecting frame (31) is fixedly connected to the bottom end of the No. 1 electric slider, and the end of the No. 1 connecting frame (31) away from the No. 1 electric slider is fixedly connected to the top end of the No. 1 electric cylinder (11).

3. The semiconductor device packaging equipment according to claim 2, wherein: A second slide rail frame (4) is fixedly connected to the outer wall of the packaging body (1) on the side away from the first slide rail frame (3); the bottom end of the second slide rail frame (4) is slidably connected to a second electric slider; the bottom end of the second electric slider is fixedly connected to a second connecting frame (41); the end of the second connecting frame (41) away from the second electric slider is fixedly connected to a second electric cylinder (42); the bottom end of the second electric cylinder (42) is provided with a blanking assembly, which is used for adsorbing and transporting the packaged semiconductor devices.

4. The semiconductor device packaging equipment according to claim 3, wherein: The blanking assembly comprises a No. 2 fixing frame (5), a No. 3 vacuum suction cup (51), a No. 2 vacuum pump (52) and a No. 2 connecting pipe (53); the No. 2 fixing frame (5) is fixedly connected to the output end of the No. 2 electric cylinder (42); a plurality of the No. 3 vacuum suction cups (51) are respectively fixedly connected to both sides of the No. 2 fixing frame (5); two No. 2 vacuum pumps (52) are fixedly connected to the tops of both ends of the No. 2 fixing frame (5); and the No. 2 connecting pipe (53) is fixedly connected between the No. 3 vacuum suction cups (51) and the No. 2 vacuum pump (52).

5. The semiconductor device packaging equipment according to claim 4, wherein: The No. 1 vacuum suction cup (13) is fixedly connected to the outer wall of the lower mold (16) with the No. 1 air box (6); the No. 1 air duct (61) is fixedly connected between the No. 1 vacuum pump (14) and the No. 1 air box (6); the No. 2 vacuum suction cup (51) is fixedly connected to the outer wall of the lower mold (16) with the No. 2 air box (62); the No. 2 air box (62) is fixedly connected to the outer wall away from the No. 3 vacuum suction cup (51), and the cross-sectional shape of the guide plate (63) is curved; the No. 2 vacuum pump (52) is fixedly connected to the No. 2 air box (62), and the No. 2 air duct (64) is connected to the guide plate (63) through the No. 2 air box (62).

6. The semiconductor device packaging equipment according to claim 5, wherein: The outer wall of the No. 1 wind box (6) is slidably connected to a plurality of No. 3 electric sliders (7) and a No. 4 electric slider (71); the outer wall of the No. 1 wind box (6) is slidably connected to a plurality of wind hole plates (72) located between the No. 3 electric slider (7) and the No. 4 electric slider (71), and the wind hole plates (72) are fixedly connected on opposite sides of the No. 3 electric slider (7) and the No. 4 electric slider (71); a telescopic rod (73) is fixedly connected between the two wind hole plates (72).

7. The semiconductor device packaging equipment according to claim 2, wherein: A material storage box (8) is fixedly connected to the packaging body (1) below the No. 1 slide rail frame (3); a plurality of No. 1 material boxes (81) are fixedly connected to the material storage box (8); a No. 2 material box (82) is fixedly connected to the material storage box (8) between two No. 1 material boxes (81); an inflation component is provided on the material storage box (8), and the inflation component is used to intermittently eject semiconductor devices stored in the material storage box (8).

8. The semiconductor device packaging equipment according to claim 7, wherein: The inflation assembly comprises a No. 1 cylinder (9), a No. 1 sliding plate (91), a No. 1 push rod (92), a No. 2 push rod (93), a No. 2 cylinder (94), an air guide tube (95) and a one-way valve (96); the No. 1 cylinder (9) is fixedly connected to the center of the material storage box (8); the No. 1 sliding plate (91) is fixedly connected to the output end of the No. 1 cylinder (9); a plurality of No. 1 push rods (92) are fixedly connected to the No. 1 sliding plate (91), and the No. 1 push rods (92) are slidably connected to the No. 1 material box (81). ) inner wall; multiple No. 2 push rods (93) are fixed on the No. 1 sliding plate (91), the No. 2 push rods (93) are slidably connected to the inner wall of the No. 2 material box (82), and the No. 2 push rods (93) are located between the two No. 1 push rods (92); the No. 2 cylinder (94) is fixed to one end of the No. 1 slide rail frame (3) away from the packaging body (1); the air guide pipe (95) is fixed between the No. 1 cylinder (9) and the No. 2 cylinder (94); the one-way valve (96) is fixed on the air guide pipe (95).

9. The semiconductor device packaging equipment according to claim 3, wherein: A material receiving box (97) is fixedly connected to the packaging body (1) at a position below the No. 2 slide rail frame (4); a plurality of No. 3 material boxes (971) are fixedly connected to the material receiving box (97); a fixing rod (972) is fixedly connected to the center of the material receiving box (97); the inner wall of the material receiving box (97) is slidably connected to the No. 2 sliding plate (973), and the fixing rod (972) passes through the middle of the No. 2 sliding plate (973); an elastic member (974) is sleeved on the outer wall of the fixing rod (972), and the elastic member (974) is located between the outer wall of the No. 2 sliding plate (973) and the inner wall of the material receiving box (97); a plurality of No. 3 push rods (975) are fixedly connected to the No. 2 sliding plate (973), and the No. 3 push rods (975) are slidably connected to the inner wall of the No. 3 material box (971).

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