Leveling device for semiconductor heating plate and heating plate leveling method

Abstract

The invention provides a leveling device for a semiconductor heating disc and a heating disc leveling method. The leveling device comprises a leveling seat, a fixed seat, at least one fixed connecting assembly and at least two leveling assemblies. The at least one fixed connecting assembly is used for fixedly connecting the leveling seat to the fixed seat; each of the at least two leveling assemblies comprises a leveling screw, a locking nut and a scale nut; wherein the leveling screw is in threaded connection with the fixing base, the scale nut is arranged on the leveling screw in a sleeving mode and located below the lower surface of the fixing base, and the locking nut is in threaded connection with the leveling screw, located below the scale nut and tightly presses the scale nut.

Description

Technical Field

[0001] The invention relates to semiconductor process equipment, in particular to a heating plate leveling device. Background Art

[0002] In the prior art, the leveling structure of the heating plate of the thin film deposition equipment uses three leveling nuts evenly distributed at 120° to adjust the level of the heating plate, and the adjustment process requires simultaneous adjustment of three points.

[0003] During the process, when the horizontality of the heating plate needs to be adjusted again according to the process performance, the adjustment method in the prior art requires three leveling nuts to be adjusted at the same time, and can only be adjusted blindly, not quantitatively. Therefore, it is difficult to meet the process development requirements, and multiple attempts to adjust are required, which wastes time and energy and increases process development costs.

[0004] In addition, in the prior art, two leveling nuts are arranged at the rear of the leveling device, which is not conducive to the adjustment operation due to the high requirements on equipment integration, compact structural design, and small adjustment operation space. Summary of the invention

[0005] In order to overcome the defects of the prior art, the present invention provides a leveling device and a heating plate leveling method for a semiconductor heating plate. The leveling device and the heating plate leveling method are applied to adjust the horizontality of a heating plate of a wafer thin film preparation device.

[0006] The leveling device for a semiconductor heating plate of the present invention includes, but is not limited to, a leveling seat, a fixing seat, at least one fixing connection component and at least two leveling components.

[0007] The at least one fixed connection assembly fixedly connects the leveling seat to the fixed seat.

[0008] Each of the at least two leveling assemblies includes a leveling screw, a locking nut, and a scale nut.

[0009] Among them, the leveling screw is threadedly connected to the fixing seat, the scale nut is sleeved on the leveling screw and is located below the lower surface of the fixing seat, and the locking nut is threadedly connected to the leveling screw and is located below the scale nut and presses the scale nut.

[0010] In one embodiment, there is a gap between the leveling seat and the fixed seat; the fixed seat is connected to the lifting slide, and a bellows is connected between the leveling seat and the heating plate; the at least one fixed connection component and the two leveling components are evenly distributed circumferentially.

[0011] In one embodiment, the fixed connection assembly includes a fixing nut, a fixing screw and a preload spring; the fixing screw passes through the preload spring, the fixing screw connects the fixing seat and the leveling seat, one end of the fixing screw is fixed to the fixing seat, and the other end is fixed to the leveling seat by the fixing nut. The contact surface between the fixing nut and the leveling seat is a spherical surface, and the contact surface between the leveling seat and the fixing nut is chamfered.

[0012] In one embodiment, the spring preload force of the preload spring is greater than the gravity of the heating plate.

[0013] In one embodiment, the contact surface between the leveling screw and the leveling seat is a spherical surface, and the contact surface between the leveling seat and the leveling screw is chamfered.

[0014] In one embodiment, the at least one fixed connection component is arranged close to the lifting slide side; and the at least two leveling components are far away from the lifting slide side.

[0015] In one embodiment, the scale nut has a scale, and the lower surface of the fixing seat has a scale alignment line; each value of the scale is set to be associated with the position angle, radius and adjustment range of the adjustment point on the heating plate.

[0016] The present invention also provides a method for leveling a heating plate using the aforementioned leveling device, the method including but not limited to the following steps:

[0017] Using the leveling device to perform initial leveling on the heating plate before the process; and

[0018] During the process, the leveling device is used to quantitatively adjust the horizontal angle of the heating plate.

[0019] In one embodiment, the step of using the leveling device to initially level the heating plate before the process includes:

[0020] Adjusting the at least two leveling components to level the heating plate;

[0021] Without changing the position of the leveling screw, loosen the locking nut, and rotate the scale nut to align the "0" scale with the alignment line on the leveling seat;

[0022] Tighten the locking nut.

[0023] In one embodiment, the step of quantitatively adjusting the horizontal angle of the heating plate by using the leveling device during the process includes:

[0024] Determine the position angle, radius and adjustment range of the adjustment point of the heating plate;

[0025] According to the relationship between the scale value and the position angle, radius and adjustment range of the adjustment point, determine to rotate the scale nut to the corresponding scale value;

[0026] The leveling screw is rotated, and the scale nut rotates along with the leveling screw until the corresponding scale value on the scale nut is aligned with the scale alignment line.

[0027] The present invention also provides a leveling device for a semiconductor heating plate, comprising a leveling seat, a fixing seat, at least one fixing connection component and at least two leveling components.

[0028] The at least one fixed connection assembly fixedly connects the leveling seat to the fixed seat.

[0029] Each of the at least two leveling assemblies includes a leveling nut, a locking nut, and a scale nut.

[0030] The leveling nut is threadedly connected to the leveling seat, the scale nut is sleeved on the leveling screw and is located above the upper surface of the leveling seat, the locking nut is threadedly connected to the leveling nut and is located above the scale nut and presses the scale nut. A scale alignment line is provided on the upper surface of the fixing seat.

[0031] The present invention has the following technical effects:

[0032] First, one of the three-point leveling points is designed as a fixed position, changing it to a two-point adjustment. The fixed point uses a tightening spring to fix the position of the adjustment block, and the fixing nut is designed to have spherical contact, which not only ensures that the position of the adjustment block is relatively fixed, but also achieves a non-locking state at this point when adjusting the level.

[0033] Secondly, the third fixed point is placed at the rear side of the structure, and the two points that need to be adjusted are designed at the near end of the structure to facilitate adjustment operations.

[0034] Third, the adjustment nut is designed as a leveling component with adjustable scale. After leveling, if the process needs to make horizontal adjustments according to the results, quantitative adjustments can be made according to the process requirements. After the horizontal adjustment, loosen the locking nut, adjust the scale nut, align the "0" point with the adjustment block and align the scale line, and lock the locking nut to complete the horizontal adjustment. If quantitative adjustment is required, it is only necessary to rotate the two leveling components according to the position angle, radius and adjustment amplitude relationship between the scale and the adjustment point to achieve quantitative adjustment. Therefore, the leveling device of the present invention can not only level the heating plate before the process, but also quantitatively adjust the heating plate during the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above invention content and the following specific embodiments of the present invention will be better understood when read in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are only examples of the claimed invention. In the accompanying drawings, the same reference numerals represent the same or similar elements.

[0036] Figure 1 An overall schematic diagram of a heating plate and a leveling device according to an embodiment of the present invention is shown;

[0037] Figure 2 A schematic diagram of a fixed connection assembly according to an embodiment of the present invention is shown;

[0038] Figure 3 A schematic diagram showing an application environment of two leveling components according to an embodiment of the present invention;

[0039] Figure 4A An exploded view of a leveling assembly according to an embodiment of the present invention is shown;

[0040] Figure 4B A schematic diagram of an assembled leveling assembly according to an embodiment of the present invention is shown;

[0041] Figure 4C A schematic diagram of a leveling assembly installed on a leveling seat according to an embodiment of the present invention is shown;

[0042] Figure 5 A cross-sectional view showing a leveling assembly according to an embodiment of the present invention;

[0043] Figure 6 A schematic diagram of a leveling device according to another embodiment of the present invention is shown;

[0044] Fig. 7A An exploded view of a leveling assembly according to an embodiment of the present invention is shown;

[0045] Figure 7B A schematic diagram of a leveling assembly installed on a leveling base according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0046] The detailed features and advantages of the present invention are described in detail in the specific embodiments below, and the content is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the description, claims and drawings disclosed in this specification, those skilled in the art can easily understand the relevant purposes and advantages of the present invention. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0049] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, channels, components, regions, layers and / or parts, these components, channels, components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, components, regions, layers and / or parts. In addition, the terms "first", "second", "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0050] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0051] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0052] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0053] In the prior art, the leveling structure of the heating plate of the thin film deposition equipment uses three leveling nuts evenly distributed at 120° to adjust the level of the heating plate, and the adjustment process requires simultaneous adjustment of three points.

[0054] During the process, when the horizontality of the heating plate needs to be adjusted again according to the process performance, the adjustment method in the prior art requires three leveling nuts to be adjusted at the same time, and can only be adjusted blindly, not quantitatively. Therefore, it is difficult to meet the process development requirements, and multiple attempts to adjust are required, which wastes time and energy and increases process development costs.

[0055] In addition, in the prior art, two leveling nuts are arranged at the rear of the leveling device, which is not conducive to the adjustment operation due to the high requirements on equipment integration, compact structural design, and small adjustment operation space.

[0056] In order to overcome the defects of the prior art, the present invention provides a leveling device for a semiconductor heating plate and a leveling method for a heating plate.

[0057] Figure 1 FIG. 2 shows an overall schematic diagram of a heating plate and a leveling device according to an embodiment of the present invention. Figure 1As shown, the leveling device 102 is located under the heating plate 101. The fixing seat 106 of the leveling device 102 is connected to the lifting slide 107, and the lifting slide 107 is fixed under the heating plate 101 for lifting the heating plate 101. A bellows 109 is connected between the leveling device 102 and the heating plate 101.

[0058] The leveling device 102 includes a leveling seat 103, a fixing seat 106, a fixed connection assembly and two leveling assemblies. The fixed connection assembly and the two leveling assemblies are evenly distributed in the circumferential direction, for example, at intervals of 120°. The leveling seat 103 is leveled by adjusting only the two leveling assemblies to achieve leveling of the heating plate.

[0059] The fixed connection assembly is used to fixedly connect the leveling seat 103 to the fixing seat 106 . Figure 1 Due to the relationship of the view, only the fixed connection assembly is shown. The fixed connection assembly is arranged on the side close to the slide 107. The fixed connection assembly includes a fixing nut 108, a fixing screw 104 and a preload spring 105. The fixing screw 104 passes through the preload spring 105, and the fixing screw 104 connects the fixing seat 106 and the leveling seat 103, and it is specified that one end of the screw 104 is fixed on the fixing seat 106, and the other end is fixed on the leveling seat 103 by the fixing nut 108.

[0060] During the installation of the leveling device 102, in order to ensure adjustable space, a gap needs to be reserved between the fixed seat 106 and the leveling seat 103. Due to the effect of gravity, the leveling seat will tend to decline, so the leveling seat needs to be lifted up. However, the traditional fixed point leveling nut is in a locked state, so during subsequent leveling, the fixed point will be in a locked state and cannot be adjusted. In order to ensure that the leveling seat can float horizontally, a pre-stressed spring is designed at this position, and the spring can lift up the leveling seat, thereby lifting up the heating plate.

[0061] In addition, when the leveling seat 103 is adjusted, the leveling seat needs to rotate around the fixed leveling nut at a single point and cannot move horizontally. In order to ensure that the fixed point is adjustable, a spherical contact needs to be designed. For example, a double spherical surface is designed. When leveling, the nut needs to be loosened. If the nut is not loosened, the point is in a locked state and the level cannot be adjusted. Therefore, not only a pre-stressed spring structure is designed at this position, but also the upper part is a spherical contact, so that the horizontal state of the leveling seat can be adjusted without loosening the nut.

[0062] Figure 2A schematic diagram of a fixed connection assembly according to an embodiment of the present invention is shown. The fixed connection assembly is used to fixedly connect the leveling seat 103 to the fixed seat 106. The fixed connection assembly is arranged on the side close to the slide 107. The fixed connection assembly includes a fixing nut 108, a fixing screw 104 and a preload spring 105. The fixing screw 104 passes through the preload spring 105, and the fixing screw 104 connects the fixed seat 106 and the leveling seat 103. One end of the fixing screw 104 is fixed to the fixed seat 106, and the other end is fixed to the leveling seat 103 by the fixing nut 108.

[0063] In one embodiment, the spring preload force of the preload spring 105 should be greater than the weight of the heating plate. This is because, during the process, the chamber is in a vacuum state, the heating plate is acted upon by the vacuum force, and the force is greater than the gravity, and the heating plate is forced upward. Therefore, in order to ensure the position consistency of the heating plate before and after vacuuming, the spring preload force needs to be greater than the weight of the heating plate.

[0064] In one embodiment, the contact surface between the fixing nut 108 and the leveling seat 103 is a spherical surface 201. The contact surface between the leveling seat 103 and the fixing nut 108 is chamfered 202. Therefore, the contact track between the fixing nut 108 and the leveling seat 103 is a line contact. The advantage of this design is that it not only ensures that the position of the leveling seat is relatively fixed, but also realizes the non-locking state of this point when leveling, so that when the other two-point leveling components are used for leveling, the leveling seat can float horizontally.

[0065] Figure 3 A schematic diagram of the application environment of two leveling components according to an embodiment of the present invention is shown. Two leveling components 301 are located on the side away from the slide. The leveling components 301 connect the leveling seat 103 and the fixed seat 106. The leveling components 301 have an adjustment end and a fixed end. The adjustment end is located on the lower surface of the fixed seat 106, and the fixed end is fixed to the upper surface of the leveling seat 103.

[0066] Figure 4A An exploded view of a leveling assembly according to an embodiment of the present invention is shown, wherein the leveling assembly includes a leveling screw 403 , a locking nut 402 and a scale nut 401 .

[0067] Figure 4B A schematic diagram of an assembled leveling assembly according to an embodiment of the present invention is shown. Figure 4C FIG. 2 is a schematic diagram showing a leveling assembly installed on a leveling seat according to an embodiment of the present invention. Figure 4B and 4C As shown, the present invention designs the traditional leveling nut into a leveling component with adjustable scale. The scale nut has scale lines. At the same time, an alignment line 404 is provided on the fixing seat.

[0068] Figure 5A cross-sectional view of a leveling assembly according to an embodiment of the present invention is shown.

[0069] The leveling assembly includes a leveling screw 403 , a locking nut 402 and a scale nut 401 .

[0070] The leveling screw 403 is threadedly connected to the fixing seat 106, and the contact surface with the leveling seat 103 is a spherical surface 501. The contact surface between the leveling seat 103 and the leveling screw 403 is chamfered 502. Therefore, the contact track between the leveling screw 403 and the leveling seat 103 is a linear contact. The overall horizontal state of the leveling seat can be adjusted by adjusting the positions of the leveling screws 403 in the two leveling components respectively.

[0071] The scale nut 401 is sleeved on the leveling screw 403 and is located below the lower surface of the fixing seat. The scale nut 401 has scales, and the lower surface of the fixing seat has scale alignment lines.

[0072] The locking nut 402 is threadedly connected to the leveling screw 403 . The locking nut 402 is located below the scale nut 401 and presses the scale nut 401 .

[0073] The present invention also provides a method for leveling a heating plate using the aforementioned leveling device. The method includes but is not limited to the following steps:

[0074] Using the leveling device to perform initial leveling on the heating plate before the process; and

[0075] During the process, the leveling device is used to quantitatively adjust the horizontal angle of the heating plate.

[0076] Specifically, before the process, after the heating plate is leveled by adjusting two sets of leveling components (for example, adjusting the leveling screws separately), the position of the leveling screw 403 is kept unchanged, the locking nut 402 is loosened, and the scale nut 401 is rotated to align the "0" scale of the scale nut with the alignment line 404 on the leveling seat, and then the locking nut 402 is tightened to complete the initial leveling of the heating plate.

[0077] During the process, when horizontal adjustment is required based on the results, quantitative adjustment can be made according to the process requirements (i.e., adjust the horizontal position of the heating plate again): first determine the specific position of the heating plate that needs to be adjusted and the adjustment range (for example, floating upward by 0.5mm), where the specific position of the adjustment point and the adjustment range correspond to each scale on the scale nut. Next, determine which scale value the scale nut should be adjusted to based on the specific position and adjustment range required for adjustment. Subsequently, rotate the leveling screw, and the scale nut will rotate with the leveling screw (the rotation angle of the scale nut is the required rotation angle of the leveling nut) until the desired scale value on the scale nut is aligned with the alignment line on the fixed seat, thereby achieving the heating plate angle required for the process, that is, quantitative adjustment is achieved.

[0078] In one embodiment, the specific position of the adjustment point includes the adjustment position angle and the adjustment point radius. For example, the circumferential direction of the heating plate is represented by 0 to 360°, and a certain degree α in 0 to 360° represents the direction in which the heating plate needs to be adjusted. For example, an adjustment position angle of 30° indicates that the heating plate needs to be adjusted in the direction of 30°. The adjustment point radius a indicates which specific position at the determined adjustment position angle needs to be adjusted. The adjustment position angle and the adjustment point radius can be used to indicate the exact position of the point on the heating plate that needs to be adjusted. The adjustment amplitude uses the adjustment position value h to indicate the height that the exact position of the heating plate needs to be adjusted up and down.

[0079]

[0080] Table 1

[0081] There is a one-to-one correspondence between h, α, and a and the scale values ​​on the two leveling components (see Table 1, where "1 point" represents the first leveling component and "2 point" represents the second leveling component). Therefore, once the values ​​of h, α, and a are determined, it is possible to determine (for example, by looking up a table) the scale value to which each of the two leveling components needs to rotate, and whether to rotate forward or reverse.

[0082] Figure 6 FIG. 2 shows a schematic diagram of a leveling device according to another embodiment of the present invention. Figure 6 As shown, the scale nut and the locking nut of the leveling assembly 601 are both located above the leveling seat.

[0083] Fig. 7A The exploded view of the leveling assembly according to an embodiment of the present invention is shown, wherein the leveling assembly includes a leveling nut 701 , a locking nut 702 and a scale nut 703 .

[0084] Figure 7B A schematic diagram of a leveling assembly installed on a leveling base according to an embodiment of the present invention is shown, wherein an alignment line is provided on the leveling base.

[0085] like Fig. 7A and 7B As shown, the leveling assembly 601 includes a leveling nut 701 , a locking nut 702 , and a scale nut 703 .

[0086] The contact surface between the leveling nut 701 and the leveling seat 103 is a spherical surface. The contact surface between the leveling seat and the leveling nut is chamfered. Therefore, the contact track between the leveling nut 701 and the leveling seat is a linear contact. The overall horizontal state of the leveling seat can be adjusted by adjusting the positions of the leveling nuts in the two leveling assemblies respectively.

[0087] The scale nut 703 is sleeved on the leveling nut 701 and is located above the upper surface of the leveling seat. The scale nut 703 has scales, and the upper surface of the leveling seat has scale alignment lines.

[0088] The locking nut 702 is sleeved on the leveling nut 701 , and the locking nut 702 is located above the scale nut 702 and presses the scale nut 703 .

[0089] Figure 6 , Fig. 7A , Figure 7B The working principle of the leveling device in the embodiment shown is similar to Figure 3-5 The working principle is the same, so it will not be described here.

[0090] The terms and expressions used above are for descriptive purposes only, and the present invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean to exclude any equivalent features of the illustrations and descriptions (or parts thereof), and it should be recognized that various modifications that may exist should also be included in the scope of the claims. Other modifications, changes and substitutions may also exist. Accordingly, the claims should be deemed to cover all such equivalents.

[0091] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus facilitate the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of this application, multiple features are sometimes combined into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims.

[0092] Similarly, it should be pointed out that although the present invention has been described with reference to the current specific embodiments, ordinary technicians in this technical field should realize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions may be made without departing from the spirit of the present invention. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the essential spirit of the present invention, they will fall within the scope of the claims of this application.

Claims

1. A leveling device for a semiconductor heating plate, characterized in that: include: A leveling seat, a fixing seat, at least one fixing connection component and at least two leveling components; The at least one fixed connection assembly fixedly connects the leveling seat to the fixed seat; Each of the at least two leveling assemblies includes a leveling screw, a locking nut, and a scale nut; Among them, the leveling screw is threadedly connected to the fixing seat, the scale nut is sleeved on the leveling screw and is located below the lower surface of the fixing seat, and the locking nut is threadedly connected to the leveling screw and is located below the scale nut and presses the scale nut.

2. The leveling device for a semiconductor heating plate according to claim 1, characterized in that: There is a gap between the leveling seat and the fixing seat; the fixing seat is connected to the lifting slide, and a bellows is connected between the leveling seat and the heating plate; the at least one fixed connection component and the two leveling components are evenly distributed in the circumferential direction.

3. The leveling device for a semiconductor heating plate according to claim 1, characterized in that: The fixed connection assembly includes a fixing nut, a fixing screw and a pre-stressed spring; the fixing screw passes through the pre-stressed spring, the fixing screw connects the fixing seat and the leveling seat, one end of the fixing screw is fixed to the fixing seat, and the other end is fixed to the leveling seat by the fixing nut; the contact surface between the fixing nut and the leveling seat is a spherical surface, and the contact surface between the leveling seat and the fixing nut is chamfered.

4. The leveling device for a semiconductor heating plate according to claim 1, characterized in that: The spring preload force of the preload spring is greater than the gravity of the heating plate.

5. The leveling device for a semiconductor heating plate according to claim 1, characterized in that: The contact surface between the leveling screw and the leveling seat is a spherical surface, and the contact surface between the leveling seat and the leveling screw is chamfered.

6. The leveling device for a semiconductor heating plate according to claim 1, characterized in that: The at least one fixed connection component is arranged close to the lifting slide; and the at least two leveling components are far away from the lifting slide.

7. The leveling device for a semiconductor heating plate according to claim 1, characterized in that: The scale nut is provided with a scale, and the lower surface of the fixing seat is provided with a scale alignment line; each value of the scale is set to be associated with the position angle, radius and adjustment range of the adjustment point on the heating plate.

8. A method for leveling a heating plate using the leveling device for a semiconductor heating plate according to any one of claims 1 to 7, characterized in that: The method comprises: Performing initial leveling of the heating plate of the leveling device before the process; and The horizontal angle of the heating plate is quantitatively adjusted during the process.

9. The method according to claim 8, characterized in that: The step of initially adjusting the heating plate of the leveling device before the process includes: Adjusting the at least two leveling components to level the heating plate; Without changing the position of the leveling screw, loosen the locking nut, and rotate the scale nut to align the "0" scale with the alignment line on the leveling seat; Tighten the locking nut; The step of quantitatively adjusting the horizontal angle of the heating plate during the process comprises: Determine the position angle, radius and adjustment range of the adjustment point of the heating plate; According to the relationship between the scale value and the position angle, radius and adjustment range of the adjustment point, determine to rotate the scale nut to the corresponding scale value; The leveling screw is rotated, and the scale nut rotates along with the leveling screw until the corresponding scale value on the scale nut is aligned with the scale alignment line.

10. A leveling device for a semiconductor heating plate, characterized in that: include: A leveling seat, a fixing seat, at least one fixing connection component and at least two leveling components; The at least one fixed connection assembly fixedly connects the leveling seat to the fixed seat; Each of the at least two leveling assemblies includes a leveling nut, a locking nut, and a scale nut; Among them, the leveling nut is threadedly connected to the leveling seat, the scale nut is sleeved on the leveling screw and is located above the upper surface of the leveling seat, and the locking nut is threadedly connected to the leveling nut, and is located above the scale nut and presses the scale nut.

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