Semiconductor surface impurity treatment device and method

Abstract

The invention provides a semiconductor surface impurity treatment device and method, and relates to the field of semiconductor cleaning, the semiconductor surface impurity treatment device comprises an outer shell and supporting feet, the middle end in the outer shell is a drying bin, and the left side and the right side of the drying bin are respectively a dry method cleaning bin and a wet method cleaning bin; the dry-process cleaning bin and the wet-process cleaning bin are each of a barrel structure with the two ends provided with hollow hemispheres, and a containing frame is arranged at the position, located at the drying bin, of the interior of the outer shell. According to the semiconductor wafer cleaning device, the dry cleaning bin, the wet cleaning bin and the drying bin are arranged, when different types of semiconductor wafers are cleaned, dry cleaning or wet cleaning can be selected according to needs, meanwhile, the cleaned semiconductor wafers can be dried through the drying bin, and the functionality of the semiconductor wafer cleaning device is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cleaning, and in particular to a semiconductor surface impurity treatment device and method. Background Art

[0002] Currently, the semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced several generations of ICs, each of which has smaller and more complex circuits than the previous generation. In the process of IC development, functional density (i.e., the number of interconnected devices per chip area) has generally increased, while geometric size (i.e., the smallest component that can be produced using a manufacturing process) has decreased. In addition to IC components becoming smaller and more complex, the semiconductor structures on which ICs are manufactured have become larger and larger, which places higher and higher quality requirements on semiconductor structures.

[0003] A semiconductor cleaning device is used to clean impurities on the surface of a semiconductor wafer to remove attachments on the surface of the semiconductor wafer. Commonly used cleaning equipment includes wet cleaning equipment and dry cleaning equipment. Both cleaning methods have their own advantages and disadvantages, but a single device has certain functional limitations, resulting in manufacturers needing to purchase two devices to meet production needs. Therefore, the present invention proposes a semiconductor surface impurity treatment device and method thereof to solve the problems existing in the prior art. Summary of the invention

[0004] In response to the above problems, the present invention proposes a semiconductor surface impurity treatment device and method. The semiconductor surface impurity treatment device is equipped with a dry cleaning chamber, a wet cleaning chamber and a drying chamber. When cleaning different types of semiconductor wafers, dry cleaning or wet cleaning can be selected as needed. At the same time, the setting of the drying chamber can dry the cleaned semiconductor wafers, further increasing the functionality of the device.

[0005] To achieve the purpose of the present invention, the present invention is implemented through the following technical solutions: a semiconductor surface impurity processing device and method thereof, comprising an outer shell and supporting feet, the middle end of the inner part of the outer shell is a drying bin, the left and right sides of the drying bin are respectively a dry cleaning bin and a wet cleaning bin, the dry cleaning bin and the wet cleaning bin are both cylindrical structures with hollow hemispherical shapes at both ends, a placement rack is provided at the position of the drying bin inside the outer shell, a first pushing mechanism for pushing the placement rack to move to the dry cleaning bin or the wet cleaning bin is provided on the bottom inner wall of the inner part of the outer shell, a second pushing mechanism for pushing the placement rack forward is provided on the inner wall of the outer shell located at the rear side of the drying bin, a bin cover is provided on the outer wall of the outer shell located at the front side of the drying bin, a sealing assembly is provided on the side of the dry cleaning bin and the wet cleaning bin close to the drying bin, and a supply assembly for cooperating with the dry cleaning bin and the wet cleaning bin for cleaning is also provided on the outer wall of the outer shell; The sealing assembly includes an arc-shaped sealing block, an arc-shaped groove, a turntable, a motor, an arc-shaped slot and a connecting rod. The outer shell is provided with an arc-shaped groove at a position outside the dry cleaning chamber and the wet cleaning chamber. The arc-shaped sealing block is provided in the arc-shaped groove. The turntable is fixed to the end of the arc-shaped sealing block. The motor is fixed in the hemispherical structure on the rear side of the outer shell. The output end of the motor is fixedly connected to the turntable. The turntable is provided with an arc-shaped slot. The shell structure located inside the arc-shaped slot and the turntable is fixedly connected to the inner wall of the hemispherical shell structure on the rear side of the turntable through a connecting rod and the arc-shaped slot.

[0006] Further improvements are: the placement rack includes a horizontal sliding support plate, a vertical sliding support plate, an adjustment component, a support arm and a placement seat, the top of the horizontal sliding support plate is slidably installed with a vertical sliding support plate, the front and rear ends of the vertical sliding support plate are provided with adjustment components, both ends of the two groups of adjustment components are fixed with support arms, and the top of the support arm is fixed with a placement seat for fixing the semiconductor wafer.

[0007] A further improvement is that the placement seat includes a mounting block group, a connecting plate, a rotating mechanism, a warehouse column, a spring, a limit plate and a support belt. The mounting block group is symmetrically arranged in two groups, and the mounting block groups are connected and fixed by a connecting plate. Multiple groups of warehouse columns are rotatably installed on the inner sides of the two groups of mounting block groups, and limit plates are fixedly installed on the front and rear ends of the warehouse columns by springs. A rotating mechanism for driving multiple groups of warehouse columns to rotate synchronously is provided on one side of one group of mounting block groups, and a support belt is provided between the multiple groups of warehouse columns located on the left and right sides.

[0008] A further improvement is that: the plurality of groups of the storage columns located on the left side are provided with fixing ends for fixing the ends of the support belts, and the storage columns located on the right side are provided with winding ends for winding the ends of the support belts.

[0009] A further improvement is that the adjustment assembly includes a bidirectional adjustment cylinder, and the bidirectional adjustment cylinder is fixedly connected to the vertical sliding support plate.

[0010] Further improvements are: the first pushing component includes an embedded groove, an electric lifting rod and a first electric push rod, the bottom inner wall of the outer shell is symmetrically provided with an embedded groove, the first electric push rod is provided in the embedded groove, the pushing end of the first electric push rod is provided with an electromagnetic push block, the first electric push rod pushes the electromagnetic push block and the side wall of the transverse sliding support plate to electromagnetically engage, an electric lifting rod is fixed under the first electric push rod, the electric lifting rod drives the first electric push rod to be hidden in the embedded groove, a transverse sliding block for limiting the transverse sliding support plate is provided on the bottom inner wall of the outer shell, and a transverse sliding groove matching the transverse sliding block is provided at the bottom of the transverse sliding support plate.

[0011] Further improvements are: the second pushing component includes a second electric push rod, the second electric push rod is arranged through the outer shell, the pushing end of the second electric push rod is also provided with an electromagnetic push block, the second electric push rod pushes the electromagnetic push block to electromagnetically engage with the adsorption end on the outer wall of the two-way adjustment cylinder, the top of the horizontal sliding support plate is symmetrically provided with a vertical sliding slide, and the bottom of the vertical sliding support plate is provided with a vertical sliding groove adapted to the vertical sliding slide.

[0012] A further improvement is that: the supply assembly includes a gas storage chamber, a suction chamber, a nitrogen storage chamber, a nitrogen recovery chamber, a cleaning liquid storage chamber, a cleaning liquid recovery chamber, a nozzle and a recovery pipe; the top of the outer shell is provided with a gas storage chamber, a nitrogen storage chamber and then a cleaning liquid storage chamber; the left side wall of the outer shell is provided with a suction chamber, the right side wall of the outer shell is provided with a cleaning liquid recovery chamber, the rear side wall of the outer shell is provided with a nitrogen recovery chamber, the tops of the dry cleaning chamber, the drying chamber and the wet cleaning chamber are all provided with nozzles, the dry cleaning chamber, the drying chamber and the wet cleaning chamber are all provided with recovery pipes, and the nozzles and the recovery pipes are respectively connected with the corresponding chambers through pipes and arc grooves.

[0013] The processing method using the semiconductor surface impurity processing device comprises the following steps: S1. By opening the chamber cover, the second electric push rod pushes the vertical sliding support plate forward through the electromagnetic attraction of the electromagnetic push block and the adsorption end, and pushes the placement rack out of the drying chamber, and the worker inserts the semiconductor wafer into the placement rack; S2. Start the bidirectional adjustment cylinder to synchronously drive the placement seat to move, so as to adjust the lateral spacing between the placement seats. At the same time, release or reel in the support belt through the reeling end to adjust the length of the support belt, so as to store semiconductor wafers of different diameters. At the same time, the elasticity of the spring drives the limit plate to limit in the front and rear directions, and then cooperates with the support belt to lift the bottom of the semiconductor wafer, so as to ensure the stability of the semiconductor wafer. S3. Select a cleaning method according to the characteristics of the semiconductor wafer. Take the dry cleaning method as an example. Start the electric lifting rod located inside the right embedded groove. The electric lifting rod pushes the first electric push rod to move upward, and the electromagnetic push block of the first electric push rod is electromagnetically attracted to the side wall of the horizontal sliding support plate. The first electric push rod pushes the placement rack into the dry cleaning chamber under the guidance of the horizontal slider and the horizontal slide groove. After the push-in is completed, the first electric push rod is reset; S4, starting the motor to drive the turntable to rotate, thereby driving the arc-shaped sealing block to rotate to seal the dry cleaning chamber; S5. After the sealing is completed, the gaseous cleaning agent stored in the gas storage chamber is sent into the dry cleaning chamber through the nozzle, and the rotating mechanism drives multiple groups of chamber columns to rotate and tilt at the same time, so as to facilitate the adhesion of the gaseous cleaning agent. After a certain period of time, the gaseous cleaning agent in the dry cleaning chamber is sucked through the recovery pipe and the sucked impurity gas is sent into the suction chamber, and the delivery of the nozzle is closed at the same time; S6. After cleaning is completed, the arc-shaped sealing cover is opened and the first electric push rod resets the placement rack. Then, the arc-shaped sealing covers of the dry cleaning chamber and the wet cleaning chamber are closed, and nitrogen is sent into the drying chamber through the nozzle to dry the semiconductor wafers. After drying, the nitrogen is recovered through the recovery pipe, and then the chamber cover is opened and the placement rack is pushed out by the second electric push rod, so as to recover the semiconductor wafers.

[0014] The device of the present invention is provided with a dry cleaning chamber, a wet cleaning chamber and a drying chamber. When cleaning different types of semiconductor wafers, dry cleaning or wet cleaning can be selected as needed. At the same time, the provision of the drying chamber can dry the cleaned semiconductor wafers, further increasing the functionality of the device. The device is provided with a sealing component, which can ensure the closure of the dry cleaning chamber or the wet cleaning chamber during cleaning, prevent leakage of cleaning liquid or cleaning gas, and thus ensure the work safety of the staff. The device can complete the left-right movement and the front-back movement of the placement rack through the cooperation of the first pushing mechanism and the second pushing mechanism. The automation function of the device is further increased, and the placement rack introduced at the same time makes it more convenient for workers to load and unload materials. At the same time, the elastic potential energy of the spring can enable the limit plate to limit semiconductor wafers of different thicknesses, and then cooperate with the two-way adjustment cylinder to drive the placement seat to move synchronously, so that semiconductor wafers of different sizes can be limited. The setting of the support belt can lift the semiconductor wafer from the bottom of the semiconductor wafer, and cooperate with the limit plate to limit the semiconductor wafer in the placement seat. Cooperating with the drive of the rotating mechanism, the angle of the limited semiconductor wafer can be changed, so that more gas or liquid can adhere to the surface of the semiconductor, thereby increasing the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view schematic diagram of the present invention.

[0016] Figure 2 It is a rear view schematic diagram of the present invention.

[0017] Figure 3 It is a front cross-sectional view of the present invention.

[0018] Figure 4 It is a schematic diagram of the structure inside the outer shell of the present invention.

[0019] Figure 5 It is a structural schematic diagram of a placement rack of the present invention.

[0020] Figure 6 It is a working schematic diagram of the second electric push rod of the present invention.

[0021] Figure 7 It is a structural schematic diagram of the placement seat of the present invention.

[0022] Figure 8 It is a front sectional view of the column bin of the present invention.

[0023] Fig. 9 It is a structural schematic diagram of the sealing component of the present invention.

[0024] Fig.10 It is a schematic diagram of the lifting of the first electric push rod of the present invention.

[0025] Fig.11 It is a structural schematic diagram of the transverse sliding support plate of the present invention.

[0026] Fig.12 It is a schematic diagram of the position of the connecting rod of the present invention.

[0027] Among them: 1. outer shell; 2. support feet; 3. drying chamber; 4. dry cleaning chamber; 5. wet cleaning chamber; 6. placement rack; 7. chamber cover; 8. arc-shaped sealing block; 9. arc-shaped groove; 10. turntable; 11. motor; 12. arc-shaped slot; 13. connecting rod; 14. horizontal sliding support plate; 15. vertical sliding support plate; 16. support arm; 17. mounting block group; 18. connecting plate; 19. rotating mechanism; 20. chamber column; 21. spring; 22. limit plate; 23. support belt; 24. Fixed end; 25. Winding end; 26. Bidirectional adjustment cylinder; 27. Embedded groove; 28. Electric lifting rod; 29. ​​First electric push rod; 30. Electromagnetic push block; 31. Horizontal slider; 32. Horizontal slide groove; 33. Second electric push rod; 34. Vertical slider; 35. Vertical slide groove; 36. Gas storage chamber; 37. Suction chamber; 38. Nitrogen storage chamber; 39. Nitrogen recovery chamber; 40. Cleaning liquid storage chamber; 41. Cleaning liquid recovery chamber; 42. Nozzle; 43. Recovery pipe. DETAILED DESCRIPTION

[0028] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with examples. The examples are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.

[0029] according to Figure 1-Figure 12 As shown, this embodiment proposes a semiconductor surface impurity treatment device and method, including an outer shell 1 and a supporting foot 2, the middle end of the inner part of the outer shell 1 is a drying chamber 3, the left and right sides of the drying chamber 3 are respectively a dry cleaning chamber 4 and a wet cleaning chamber 5, the dry cleaning chamber 4 and the wet cleaning chamber 5 are both cylindrical structures with hollow hemispherical ends, a placement rack 6 is provided at the position of the drying chamber 3 in the inner part of the outer shell 1, a first pushing mechanism for pushing the placement rack 6 to move to the dry cleaning chamber 4 or the wet cleaning chamber 5 is provided on the inner wall of the bottom of the inner part of the outer shell 1, a second pushing mechanism for pushing the placement rack 6 forward is provided on the inner wall of the inner part of the outer shell 1 located at the rear side of the drying chamber 3, a chamber cover 7 is provided on the outer wall of the outer shell 1 located at the front side of the drying chamber 3, the dry cleaning chamber 4 and the wet cleaning chamber 5 are both provided with sealing components on one side close to the drying chamber 3, and a supply component for cooperating with the dry cleaning chamber 4 and the wet cleaning chamber 5 for cleaning is also provided on the outer wall of the outer shell 1; The sealing assembly includes an arcuate sealing block 8, an arcuate groove 9, a turntable 10, a motor 11, an arcuate slot 12 and a connecting rod 13. The outer shell 1 is provided with an arcuate groove 9 at a position outside the dry cleaning chamber 4 and the wet cleaning chamber 5. The arcuate sealing block 8 is arranged in the arcuate groove 9. The turntable 10 is fixed at the end of the arcuate sealing block 8. The motor 11 is fixed in the hemispherical structure on the rear side of the outer shell 1. The output end of the motor 11 is fixedly connected to the turntable 10. The turntable 10 is provided with an arcuate slot 12. The arcuate slot 12 is located at the arcuate slot 9. The groove 9 and the shell structure inside the turntable 10 are fixedly connected to the inner wall of the hemispherical shell structure on the rear side of the turntable 10 through the connecting rod 13 and the arc-shaped groove 12. The arc-shaped sealing block is simply fitted with the outer shell 1. At the same time, rubber is used for sealing at the connection between the rear end turntable 10 and the outer shell 1, and the connecting rod 13 is used to support the shell structure inside the arc-shaped sealing block 8 to ensure the stability of the operation of the device. In addition, through the setting of the arc-shaped groove 12, the setting of the connecting rod 13 cannot affect the rotation of the turntable 10.

[0030] By setting up a dry cleaning chamber 4, a wet cleaning chamber 5 and a drying chamber 3, the device can select dry cleaning 4 or wet cleaning as needed when cleaning different types of semiconductor wafers. At the same time, the setting of the drying chamber 3 can dry the cleaned semiconductor wafers, further increasing the functionality of the device. In addition, by setting up a sealing component, the device can ensure the closure of the dry cleaning chamber 4 or the wet cleaning chamber 5 during cleaning, prevent the leakage of cleaning liquid or cleaning gas, and thus ensure the work safety of the staff. In addition, the device can complete the left and right movement and forward and backward movement of the placement rack 6 through the cooperation of the first pushing mechanism and the second pushing mechanism, further increasing the automation function of the device. At the same time, the placement rack 6 pushed out makes it more convenient for workers to load and unload materials.

[0031] The placement rack 6 includes a horizontal sliding support plate 14, a vertical sliding support plate 15, an adjustment component, a support arm 16 and a placement seat. The vertical sliding support plate 15 is slidably installed on the top of the horizontal sliding support plate 14. Adjustment components are provided at the front and rear ends of the vertical sliding support plate 15. Support arms 16 are fixed at both ends of the two groups of adjustment components. A placement seat for fixing the semiconductor wafer is fixed on the top of the support arm 16.

[0032] The placement seat includes a mounting block group 17, a connecting plate 18, a rotating mechanism 19, a warehouse column 20, a spring 21, a limit plate 22 and a support belt 23. The mounting block group 17 is symmetrically arranged in two groups. The mounting block groups 17 are connected and fixed by a connecting plate 18. Multiple groups of warehouse columns 20 are rotatably installed on the inner sides of the two groups of mounting block groups 17. The limit plates 22 are fixedly installed on the front and rear ends of the warehouse columns 20 by springs 21. A rotating mechanism 19 for driving the multiple groups of warehouse columns 20 to rotate synchronously is provided on one side of one group of the mounting block groups 17. A support belt 23 is provided between the multiple groups of warehouse columns 20 located on the left and right sides.

[0033] The rotating mechanism 19 is a common linkage structure of gears and synchronous toothed belts, which will not be described in detail here.

[0034] The plurality of groups of the storage columns 20 on the left are provided with fixing ends 24 for fixing the ends of the support belts 23 , and the storage columns 20 on the right are provided with reeling ends 25 for reeling the ends of the support belts 23 .

[0035] The adjustment assembly includes a bidirectional adjustment cylinder 26 , and the bidirectional adjustment cylinder 26 is fixedly connected to the vertical sliding support plate 15 .

[0036] The elastic potential energy of the spring 21 can make the limiting plate 22 limit the semiconductor wafers of different thicknesses, and then cooperate with the two-way adjustment cylinder 26 to drive the placement seat to move synchronously, so that semiconductor wafers of different sizes can be limited. The setting of the support belt 23 can lift the semiconductor wafer from the bottom of the semiconductor wafer, and cooperate with the limiting plate 22 to limit the semiconductor wafer in the placement seat. Cooperate with the drive of the rotating mechanism 19, the angle of the limited semiconductor wafer can be changed, so that more gas or liquid can adhere to the surface of the semiconductor, thereby increasing the cleaning effect.

[0037] The first pushing component includes an embedded groove 27, an electric lifting rod 28 and a first electric push rod 29. The embedded groove 27 is symmetrically arranged on the bottom inner wall of the outer shell 1. The first electric push rod 29 is arranged in the embedded groove 27. The pushing end of the first electric push rod 29 is provided with an electromagnetic pushing block 30. The first electric push rod 29 pushes the electromagnetic pushing block 30 to electromagnetically engage with the side wall of the transverse sliding support plate 14. An electric lifting rod 28 is fixed below the first electric push rod 29. The electric lifting rod 28 drives the first electric push rod 29 to be hidden in the embedded groove 27. A transverse sliding block 31 for limiting the transverse sliding support plate 14 is provided on the bottom inner wall of the outer shell 1. The bottom of the transverse sliding support plate 14 is provided with a transverse sliding groove 32 adapted to the transverse sliding block 31.

[0038] By starting the electric lifting rod 28 located inside the embedded groove 27, the electric lifting rod 28 pushes the first electric push rod 29 to move upward, and the electromagnetic push block 30 of the first electric push rod 29 is electromagnetically attracted to the side wall of the transverse sliding support plate 14. Then, the first electric push rod 29 pushes the placement rack 6 into the dry cleaning chamber 4 or the wet cleaning chamber 5 under the guidance of the transverse slider 31 and the transverse slide groove 32.

[0039] The second pushing assembly includes a second electric push rod 33, which is arranged to penetrate the outer shell 1. The pushing end of the second electric push rod 33 is also provided with an electromagnetic push block 30. The second electric push rod 33 pushes the electromagnetic push block 30 to electromagnetically engage with the adsorption end on the outer wall of the adjusting cylinder. The top of the horizontal sliding support plate 14 is symmetrically provided with a vertical sliding block 34, and the bottom of the vertical sliding support plate 15 is provided with a vertical sliding groove 35 adapted to the vertical sliding block 34.

[0040] By starting the second driving push rod, the second electric push rod 33 pushes the vertical sliding support plate 15 forward through the electromagnetic attraction between the electromagnetic push block 30 and the adsorption end, and pushes the placement rack 6 out of the drying chamber 3.

[0041] The supply assembly includes a gas storage chamber 36, a suction chamber 37, a nitrogen storage chamber 38, a nitrogen recovery chamber 39, a cleaning liquid storage chamber 40, a cleaning liquid recovery chamber 41, a nozzle 42 and a recovery pipe 43. The top of the outer shell 1 is provided with a gas storage chamber 36, a nitrogen storage chamber 38 and then a cleaning liquid storage chamber 40, the left side wall of the outer shell 1 is provided with a suction chamber 37, the right side wall of the outer shell 1 is provided with a cleaning liquid recovery chamber 41, and the rear side wall of the outer shell 1 is provided with a nitrogen recovery chamber 39. The tops of the dry cleaning chamber 4, the drying chamber 3 and the wet cleaning chamber 5 are all provided with a nozzle 42, and the dry cleaning chamber 4, the drying chamber 3 and the wet cleaning chamber 5 are all provided with a recovery pipe 43. The nozzle 42 and the recovery pipe 43 are respectively connected to the corresponding chambers through pipelines and arc grooves 12.

[0042] The dry cleaning chamber 4 delivers the gaseous cleaning agent stored in the gas storage chamber 36 into the dry cleaning chamber 4 through the nozzle 42, while the wet cleaning chamber 5 delivers the cleaning liquid stored in the cleaning liquid storage chamber 40 into the wet cleaning chamber 5 through the nozzle 42. The rotating mechanism 19 drives multiple groups of chamber columns 20 to rotate and tilt at the same time, so as to facilitate the adhesion of the gaseous cleaning agent or liquid cleaning liquid. After a certain period of time, the dry cleaning chamber 4 sucks the gaseous cleaning agent in the dry cleaning chamber 4 through the recovery pipe 43 and sends the sucked impurity gas into the suction chamber 37, while the wet cleaning chamber 5 recovers the remaining liquid through the recovery pipe 43 and sends it into the cleaning liquid recovery chamber 41, and in the drying chamber 3, the nitrogen in the nitrogen dehumidification chamber is sent to the drying chamber 3 through the nozzle 42, and then sucked by the recovery pipe 43 and sent to the nitrogen recovery chamber 39, so as to recover the nitrogen.

[0043] The steps include: S1, by opening the chamber cover 7, the second electric push rod 33 pushes the vertical sliding support plate 15 forward through the electromagnetic attraction of the electromagnetic push block 30 and the adsorption end, and pushes the placement rack 6 out of the drying chamber 3, and the worker inserts the semiconductor wafer into the placement rack 6; S2, by starting the two-way adjustment cylinder 26 to synchronously drive the placement seat to move, so as to adjust the lateral spacing between the placement seats, and at the same time, the support belt 23 is released or rolled up by the winding end 25, and the length of the support belt 23 is adjusted, so as to store semiconductor wafers of different diameters, and at the same time, the limit plate 22 is driven by the elasticity of the spring 21 to limit from the front and back directions, and then the bottom of the semiconductor wafer is lifted with the support belt 23, so as to ensure the stability of the semiconductor wafer; S3. Select a cleaning method according to the characteristics of the semiconductor wafer. Take dry cleaning method 4 as an example. Start the electric lifting rod 28 located inside the right embedded groove 27. The electric lifting rod 28 pushes the first electric push rod 29 to move upward, and the electromagnetic push block 30 of the first electric push rod 29 is electromagnetically attracted to the side wall of the horizontal sliding support plate 14. The first electric push rod 29 pushes the placement rack 6 into the dry cleaning chamber 4 under the guidance of the horizontal slider 31 and the horizontal slide groove 32. After the pushing is completed, the first electric push rod 29 is reset; S4, starting the motor 11 to drive the turntable 10 to rotate, thereby driving the arc-shaped sealing block 8 to rotate to seal the dry cleaning chamber 4; S5. After the sealing is completed, the gaseous cleaning agent stored in the gas storage chamber 36 is sent into the dry cleaning chamber 4 through the nozzle 42, and the rotating mechanism 19 drives the multiple groups of chamber columns 20 to rotate and tilt at the same time, so as to facilitate the adhesion of the gaseous cleaning agent. After a certain period of time, the gaseous cleaning agent in the dry cleaning chamber 4 is sucked through the recovery pipe 43 and the sucked impurity gas is sent into the suction chamber 37, and the delivery of the nozzle 42 is closed at the same time; S6. After cleaning is completed, the arc-shaped sealing cover is opened and the first electric push rod 29 resets the placement rack 6. Then, the arc-shaped sealing covers of the dry cleaning chamber 4 and the wet cleaning chamber 5 are closed, and nitrogen is sent into the drying chamber 3 through the nozzle 42 to dry the semiconductor wafers. After drying, the nitrogen is recovered through the recovery pipe (43), and then the chamber cover 7 is opened and the placement rack 6 is pushed out by the second electric push rod 33, so as to recover the semiconductor wafers.

[0044] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor surface impurity treatment device, comprising an outer shell (1) and a support foot (2), characterized in that: The middle end of the outer shell (1) is a drying chamber (3), and the left and right sides of the drying chamber (3) are respectively a dry cleaning chamber (4) and a wet cleaning chamber (5), and both the dry cleaning chamber (4) and the wet cleaning chamber (5) are cylindrical structures with hollow hemispherical ends. A placement rack (6) is provided at the location of the drying chamber (3) inside the outer shell (1), and a push mechanism (6) is provided on the inner wall of the bottom of the outer shell (1) to move the placement rack (6) to the dry cleaning chamber (4) or the wet cleaning chamber (5). ), a second pushing mechanism for pushing the placement rack (6) forward is provided on the inner wall of the outer shell (1) located at the rear side of the drying bin (3), a bin cover (7) is provided on the outer wall of the outer shell (1) located at the front side of the drying bin (3), a sealing component is provided on the side of the dry cleaning bin (4) and the wet cleaning bin (5) close to the drying bin (3), and a supply component for cooperating with the dry cleaning bin (4) and the wet cleaning bin (5) for cleaning is also provided on the outer wall of the outer shell (1); The sealing assembly comprises an arcuate sealing block (8), an arcuate groove (9), a rotating disk (10), a motor (11), an arcuate slot (12) and a connecting rod (13); an arcuate groove (9) is provided on the outer shell (1) at a position outside the dry cleaning chamber (4) and the wet cleaning chamber (5); an arcuate sealing block (8) is provided in the arcuate groove (9); a rotating disk (10) is fixed to the end of the arcuate sealing block (8); a motor (11) is fixed in a hemispherical structure on the rear side of the outer shell (1); an output end of the motor (11) is fixedly connected to the rotating disk (10); an arcuate slot (12) is provided on the rotating disk (10); and a shell structure located inside the arcuate groove (9) and the rotating disk (10) is fixedly connected to the inner wall of the hemispherical shell structure on the rear side of the rotating disk (10) through a connecting rod (13) and in cooperation with the arcuate slot (12).

2. A semiconductor surface impurity treatment device according to claim 1, characterized in that: The placement rack (6) comprises a transverse sliding support plate (14), a vertical sliding support plate (15), an adjustment component, a support arm (16) and a placement seat, wherein a vertical sliding support plate (15) is slidably mounted on the top of the transverse sliding support plate (14), adjustment components are provided at both front and rear ends of the vertical sliding support plate (15), support arms (16) are fixed at both ends of the two groups of adjustment components, and a placement seat for fixing the semiconductor wafer is fixed at the top of the support arm (16).

3. A semiconductor surface impurity treatment device according to claim 2, characterized in that: The placement seat comprises a mounting block group (17), a connecting plate (18), a rotating mechanism (19), a bin column (20), a spring (21), a limit plate (22) and a support belt (23). The mounting block group (17) is symmetrically provided with two groups. The mounting block groups (17) are connected and fixed by a connecting plate (18). Multiple groups of bin columns (20) are rotatably installed on the inner sides of the two groups of mounting block groups (17). The limit plates (22) are fixedly installed on the front and rear ends of the bin columns (20) by springs (21). A rotating mechanism (19) for driving the multiple groups of bin columns (20) to rotate synchronously is provided on one side of one group of mounting block groups (17). A support belt (23) is provided between the multiple groups of bin columns (20) located on the left and right sides.

4. A semiconductor surface impurity treatment device according to claim 3, characterized in that: The plurality of groups of the bin columns (20) located on the left are provided with fixing ends (24) for fixing the ends of the support belts (23), and the bin columns (20) located on the right are provided with reeling ends (25) for reeling the ends of the support belts (23).

5. A semiconductor surface impurity treatment device according to claim 2, characterized in that: The adjustment assembly comprises a bidirectional adjustment cylinder (26), and the bidirectional adjustment cylinder (26) is fixedly connected to the vertical sliding support plate (15).

6. A semiconductor surface impurity treatment device according to claim 2, characterized in that: The first pushing component comprises an embedding groove (27), an electric lifting rod (28) and a first electric push rod (29); the embedding groove (27) is symmetrically provided on the bottom inner wall of the outer shell (1); the first electric push rod (29) is provided in the embedding groove (27); an electromagnetic push block (30) is provided at the pushing end of the first electric push rod (29); the first electric push rod (29) pushes the electromagnetic push block (30) to electromagnetically engage with the side wall of the transverse sliding support plate (14); an electric lifting rod (28) is fixed below the first electric push rod (29); the electric lifting rod (28) drives the first electric push rod (29) to be hidden in the embedding groove (27); a transverse sliding block (31) for limiting the transverse sliding support plate (14) is provided on the bottom inner wall of the outer shell (1); and a transverse sliding groove (32) adapted to the transverse sliding block (31) is provided at the bottom of the transverse sliding support plate (14).

7. A semiconductor surface impurity treatment device according to claim 6, characterized in that: The second pushing assembly comprises a second electric push rod (33), the second electric push rod (33) is arranged to penetrate the outer shell (1), and the pushing end of the second electric push rod (33) is also provided with an electromagnetic push block (30), the second electric push rod (33) pushes the electromagnetic push block (30) to electromagnetically engage with the adsorption end on the outer wall of the two-way adjustment cylinder (26), the top of the horizontal sliding support plate (14) is symmetrically provided with a vertical sliding block (34), and the bottom of the vertical sliding support plate (15) is provided with a vertical sliding groove (35) adapted to the vertical sliding block (34).

8. The semiconductor surface impurity treatment device according to claim 1, characterized in that: The supply assembly comprises a gas storage chamber (36), a suction chamber (37), a nitrogen storage chamber (38), a nitrogen recovery chamber (39), a cleaning liquid storage chamber (40), a cleaning liquid recovery chamber (41), a nozzle (42) and a recovery pipe (43); the top of the outer shell (1) is provided with a gas storage chamber (36), a nitrogen storage chamber (38) and a cleaning liquid storage chamber (40); the left side wall of the outer shell (1) is provided with a suction chamber (37); the right side wall of the outer shell (1) is provided with a nozzle (42) and a recovery pipe (43); A cleaning liquid recovery chamber (41) is provided on the wall, a nitrogen recovery chamber (39) is provided on the rear side wall of the outer shell (1), a spray pipe (42) is provided on the top of each of the dry cleaning chamber (4), the drying chamber (3) and the wet cleaning chamber (5), and a recovery pipe (43) is provided in each of the dry cleaning chamber (4), the drying chamber (3) and the wet cleaning chamber (5), and each of the spray pipe (42) and the recovery pipe (43) is connected to the corresponding chambers through a pipe and an arc-shaped slot (12).

9. A method for treating semiconductor surface impurities according to any one of claims 1 to 8, characterized in that: The steps include: S1, by opening the bin cover (7), the second electric push rod (33) pushes the vertical sliding support plate (15) forward through the electromagnetic attraction of the electromagnetic push block (30) and the adsorption end, and pushes the placement rack (6) out of the drying bin (3), and the worker inserts the semiconductor wafer into the placement rack (6); S2, by starting the bidirectional adjustment cylinder (26) to synchronously drive the placement seats to move, thereby adjusting the lateral spacing between the placement seats, and at the same time releasing or reeling the support belt (23) through the reeling end (25), adjusting the length of the support belt (23), thereby storing semiconductor wafers of different diameters, and at the same time driving the limit plate (22) to limit in the front and rear directions through the elasticity of the spring (21), and then cooperating with the support belt (23) to lift the bottom of the semiconductor wafer, thereby ensuring the stability of the semiconductor wafer; S3. Select a cleaning method according to the characteristics of the semiconductor wafer. Take the dry cleaning method (4) as an example. Start the electric lifting rod (28) located inside the right embedded groove (27). The electric lifting rod (28) pushes the first electric push rod (29) to move upward, and the electromagnetic push block (30) of the first electric push rod (29) is electromagnetically attracted to the side wall of the horizontal sliding support plate (14). The first electric push rod (29) pushes the placement rack (6) into the dry cleaning chamber (4) under the guidance of the horizontal slider (31) and the horizontal slide groove (32). After the pushing is completed, the first electric push rod (29) is reset; S4, starting the motor (11) to drive the rotating disk (10) to rotate, thereby driving the arc-shaped sealing block (8) to rotate to seal the dry cleaning chamber (4); S5. After the sealing is completed, the gaseous cleaning agent stored in the gas storage chamber (36) is sent into the dry cleaning chamber (4) through the nozzle (42). At the same time, the plurality of groups of chamber columns (20) are driven to rotate and tilt simultaneously through the rotating mechanism (19), thereby facilitating the adhesion of the gaseous cleaning agent. After a certain period of time, the gaseous cleaning agent in the dry cleaning chamber (4) is sucked through the recovery pipe (43) and the sucked impurity gas is sent into the suction chamber (37). At the same time, the delivery of the nozzle (42) is closed; S6. After cleaning is completed, the arc-shaped sealing cover is opened, and the first electric push rod (29) resets the placement rack (6). Then, the arc-shaped sealing covers of the dry cleaning chamber (4) and the wet cleaning chamber (5) are closed, and nitrogen is sent into the drying chamber (3) through the nozzle (42) to dry the semiconductor wafers. After drying, the nitrogen is recovered through the recovery pipe (43), and then the chamber cover (7) is opened and the placement rack (6) is pushed out by the second electric push rod (33), thereby recovering the semiconductor wafers.

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