Semiconductor surface impurity processing apparatus and method

Abstract

The application provides a semiconductor surface impurity treatment device and a method thereof, and relates to the field of semiconductor cleaning.The device comprises an outer shell and supporting feet.The middle end of the inner part of the outer shell is a drying bin.The left and right sides of the drying bin are a dry cleaning bin and a wet cleaning bin.The dry cleaning bin and the wet cleaning bin are both hollow hemispherical cylinder structures with hollow hemispherical ends.The outer shell is provided with a placing rack at the position of the drying bin.The dry cleaning bin, the wet cleaning bin and the drying bin are provided, so that dry cleaning or wet cleaning can be selected according to the need when different types of semiconductor wafers are cleaned, and the drying bin can dry the cleaned semiconductor wafers, further increasing the functionality of the device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning technology, and in particular to a semiconductor surface impurity treatment apparatus and method. Background Technology

[0002] Currently, the semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advancements in IC materials and design have resulted in several generations of ICs, each with smaller and more complex circuits than the previous generation. In the course of IC development, functional density (i.e., the number of interconnect devices per chip area) has generally increased, while geometry (i.e., the smallest component that can be produced using manufacturing processes) has decreased. In addition to IC components becoming smaller and more complex, the semiconductor structures on which ICs are manufactured have become increasingly larger, which places increasingly higher demands on the quality of semiconductor structures.

[0003] Semiconductor cleaning equipment is used to clean impurities on the surface of semiconductor wafers to remove deposits. Commonly used cleaning equipment includes wet cleaning equipment and dry cleaning equipment. Each of the two cleaning methods has its own advantages and disadvantages. However, each individual piece of equipment has certain limitations in functionality, which leads manufacturers to need to purchase two types of equipment to meet production needs. Therefore, this invention proposes a semiconductor surface impurity treatment device and method to solve the problems existing in the prior art. Summary of the Invention

[0004] To address the aforementioned problems, this invention proposes a semiconductor surface impurity treatment apparatus and method. This semiconductor surface impurity treatment apparatus, by setting up a dry cleaning chamber, a wet cleaning chamber, and a drying chamber, allows for the selection of dry or wet cleaning as needed when cleaning different types of semiconductor wafers. At the same time, the drying chamber can dry the cleaned semiconductor wafers, further increasing the functionality of the apparatus.

[0005] To achieve the objectives of this invention, the invention is implemented through the following technical solution: a semiconductor surface impurity treatment device and method, comprising an outer shell and supporting legs, wherein the middle of the inner part of the outer shell is a drying chamber, and the left and right sides of the drying chamber are respectively a dry cleaning chamber and a wet cleaning chamber, both of which are cylindrical structures with hollow hemispherical ends; a placement rack is provided inside the outer shell at the position of the drying chamber; a first pushing mechanism is provided on the bottom inner wall of the inner shell to push the placement rack to the dry cleaning chamber or the wet cleaning chamber; a second pushing mechanism is provided on the inner wall of the outer shell at the rear side of the drying chamber to push the placement rack forward; a chamber cover is provided on the outer wall of the outer shell at the front side of the drying chamber; a sealing component is provided on the side of the dry cleaning chamber and the wet cleaning chamber near the drying chamber; and a supply component for cleaning in conjunction with the dry cleaning chamber and the wet cleaning chamber is also provided on the outer wall of the outer shell.

[0006] The sealing assembly includes an arc-shaped sealing block, an arc-shaped groove, a turntable, a motor, an arc-shaped slot, and a connecting rod. The outer shell has an arc-shaped groove located outside the dry cleaning chamber and the wet cleaning chamber. An arc-shaped sealing block is located inside the arc-shaped groove. A turntable is fixed to the end of the arc-shaped sealing block. A motor is fixed inside the hemispherical structure on the rear side of the outer shell. The output end of the motor is fixedly connected to the turntable. An arc-shaped slot is provided on the turntable. The shell structure located inside the arc-shaped groove and the turntable is fixedly connected to the inner wall of the hemispherical shell structure on the rear side of the turntable through the connecting rod and the arc-shaped slot.

[0007] A further improvement is that the placement frame includes a horizontal sliding support plate, a vertical sliding support plate, an adjustment assembly, a support arm, and a placement seat. The top of the horizontal sliding support plate is slidably mounted with a vertical sliding support plate. Adjustment assemblies are provided at both the front and rear ends of the vertical sliding support plate. Support arms are fixed at both ends of the two sets of adjustment assemblies. A placement seat for fixing the semiconductor wafer is fixed at the top of the support arm.

[0008] A further improvement is made in that: the placement seat includes mounting block groups, connecting plates, rotating mechanisms, storage columns, springs, limiting plates, and support belts. Two sets of mounting block groups are symmetrically arranged on the left and right sides, and the mounting block groups are connected and fixed to each other by connecting plates. Multiple sets of storage columns are rotatably installed on the inner side of each of the two sets of mounting block groups. Limiting plates are fixedly installed at both ends of each storage column by springs. A rotating mechanism that drives multiple sets of storage columns to rotate synchronously is provided on one side of each set of mounting block groups. Support belts are provided between the multiple sets of storage columns located on the left and right sides.

[0009] A further improvement is that: the multiple sets of bin columns on the left side are provided with a fixing end for fixing the end of the support belt, and the bin column on the right side is provided with a winding end for winding the end of the support belt.

[0010] A further improvement is that the adjustment assembly includes a bidirectional adjustment cylinder, which is fixedly connected to a vertical sliding support plate.

[0011] Further improvements are made in the following ways: The first pushing component includes an embedded groove, an electric lifting rod, and a first electric push rod. Embedded grooves are symmetrically provided on the bottom inner wall of the outer shell. The first electric push rod is provided in the embedded groove. The pushing end of the first electric push rod is provided with an electromagnetic push block. The first electric push rod pushes the electromagnetic push block to electromagnetically engage with the side wall of the transverse sliding support plate. An electric lifting rod is fixed below the first electric push rod. The electric lifting rod drives the first electric push rod to be hidden in the embedded groove. A transverse slider is provided on the bottom inner wall of the outer shell to limit the transverse sliding support plate. The bottom of the transverse sliding support plate is provided with a transverse sliding groove that matches the transverse slider.

[0012] A further improvement is that the second pushing component includes a second electric push rod, which is disposed through the outer shell. The pushing end of the second electric push rod is also provided with an electromagnetic push block. The second electric push rod pushes the electromagnetic push block to electromagnetically engage with the adsorption end on the outer wall of the bidirectional adjusting cylinder. The top of the horizontal sliding support plate is symmetrically provided with vertical sliders, and the bottom of the vertical sliding support plate is provided with a vertical groove that matches the vertical sliders.

[0013] Further improvements include: the supply component includes a gas storage chamber, a suction chamber, a nitrogen storage chamber, a nitrogen recovery chamber, a cleaning fluid storage chamber, a cleaning fluid recovery chamber, a nozzle, and a recovery pipe; the top of the outer shell is provided with a gas storage chamber, a nitrogen storage chamber, and a cleaning fluid storage chamber; the left side wall of the outer shell is provided with a suction chamber; the right side wall of the outer shell is provided with a cleaning fluid recovery chamber; the rear side wall of the outer shell is provided with a nitrogen recovery chamber; the top of the dry cleaning chamber, the drying chamber, and the wet cleaning chamber are all provided with nozzles; and the dry cleaning chamber, the drying chamber, and the wet cleaning chamber are all provided with recovery pipes. The nozzles and recovery pipes are connected to the corresponding chambers through pipes and arc-shaped slots.

[0014] The processing method using the above-described semiconductor surface impurity treatment apparatus includes the following steps;

[0015] S1. By opening the chamber cover, the second electric push rod pushes the vertical sliding support plate forward through the electromagnetic push block and the electromagnetic attraction of the adsorption end, and pushes the placement rack out of the drying chamber. The worker inserts the semiconductor wafer into the placement rack.

[0016] S2. By activating the bidirectional adjusting cylinder, the placement seats are moved synchronously, thereby adjusting the lateral spacing between the placement seats. At the same time, the support belt is released or wound up by the winding end to adjust the length of the support belt, thereby storing semiconductor wafers of different diameters. Meanwhile, the spring elasticity drives the limiting plate to limit from both the front and rear directions, and the support belt lifts the bottom of the semiconductor wafer to ensure the stability of the semiconductor wafer.

[0017] S3. Select the cleaning method according to the characteristics of the semiconductor wafer. Taking the dry cleaning method as an example, by activating the electric lifting rod located inside the recess on the right side, the electric lifting rod pushes the first electric push rod upward and makes the electromagnetic push block of the first electric push rod electromagnetically attracted to the side wall of the transverse sliding support plate. Under the guidance of the transverse slider and the transverse slide groove, the first electric push rod pushes the placement frame into the dry cleaning chamber. After the push is completed, the first electric push rod resets.

[0018] S4. By starting the motor, the turntable is driven to rotate, which in turn drives the arc-shaped sealing block to rotate and seal the dry cleaning chamber;

[0019] S5. After sealing, the gaseous cleaning agent stored in the gas storage chamber is sent into the dry cleaning chamber through the nozzle. At the same time, the rotating mechanism drives multiple sets of chamber columns to rotate and tilt simultaneously, which facilitates the adhesion of the gaseous cleaning agent. After a certain period of time, the gaseous cleaning agent in the dry cleaning chamber is sucked out through the recovery pipe and the sucked impurity gas is sent into the suction chamber. At the same time, the delivery of the nozzle is turned off.

[0020] S6. After cleaning, the arc-shaped sealing cover is opened, the first electric push rod resets the placement rack, and then the arc-shaped sealing covers of the dry cleaning chamber and the wet cleaning chamber are closed. Nitrogen gas is sent into the drying chamber through the nozzle to dry the semiconductor wafer. After drying, the nitrogen gas is recovered through the recovery pipe. Then, the chamber cover is opened and the placement rack is pushed out by the second electric push rod to recover the semiconductor wafer.

[0021] This invention, through the configuration of a dry cleaning chamber, a wet cleaning chamber, and a drying chamber, allows for the selection of either dry or wet cleaning methods when cleaning different types of semiconductor wafers. The drying chamber further dries the cleaned semiconductor wafers, enhancing the device's functionality. Furthermore, the device incorporates a sealing assembly to ensure the dry or wet cleaning chambers remain sealed during cleaning, preventing leakage of cleaning fluid or gas and thus ensuring worker safety. Finally, the device, through the cooperation of a first and a second pushing mechanism, allows for lateral and forward / backward movement of the placement rack. The automation function of this device is further enhanced, and the newly introduced placement rack makes it easier for workers to load and unload materials. At the same time, the elastic potential energy of the spring can limit the semiconductor wafers of different thicknesses by the limiting plate. In addition, the bidirectional adjusting cylinder drives the placement seat to move synchronously, thereby limiting the semiconductor wafers of different sizes. The support belt can lift the semiconductor wafer from the bottom, and together with the limiting plate, it limits the semiconductor wafer in the placement seat. With the drive of the rotation mechanism, the angle of the limited semiconductor wafer can be changed, so that more gas or liquid can adhere to the surface of the semiconductor, thereby increasing the cleaning effect. Attached Figure Description

[0022] Figure 1 This is a front view schematic diagram of the present invention.

[0023] Figure 2 This is a rear view schematic diagram of the present invention.

[0024] Figure 3 This is the front sectional view of the present invention.

[0025] Figure 4 This is a schematic diagram of the internal structure of the outer shell of the present invention.

[0026] Figure 5 This is a schematic diagram of the structure of the placement rack of the present invention.

[0027] Figure 6 This is a schematic diagram of the operation of the second electric push rod of the present invention.

[0028] Figure 7 This is a schematic diagram of the structure of the placement base of the present invention.

[0029] Figure 8 This is a front sectional view of the column compartment of the present invention.

[0030] Figure 9 This is a schematic diagram of the sealing assembly of the present invention.

[0031] Figure 10 This is a schematic diagram of the lifting and lowering of the first electric push rod of the present invention.

[0032] Figure 11 This is a schematic diagram of the structure of the transverse sliding support plate of the present invention.

[0033] Figure 12 This is a schematic diagram showing the position of the connecting rod of the present invention.

[0034] The components include: 1. Outer shell; 2. Support feet; 3. Drying chamber; 4. Dry cleaning chamber; 5. Wet cleaning chamber; 6. Placement rack; 7. Chamber cover; 8. Arc-shaped sealing block; 9. Arc-shaped groove; 10. Turntable; 11. Motor; 12. Arc-shaped slot; 13. Connecting rod; 14. Horizontal sliding support plate; 15. Vertical sliding support plate; 16. Support arm; 17. Mounting block assembly; 18. Connecting plate; 19. Rotating mechanism; 20. Chamber column; 21. Spring; 22. Limiting plate; 23. Support belt. 24. Fixed end; 25. Rewinding end; 26. Bidirectional adjusting cylinder; 27. Embedded groove; 28. Electric lifting rod; 29. ​​First electric push rod; 30. Electromagnetic push block; 31. Horizontal slider; 32. Horizontal slide groove; 33. Second electric push rod; 34. Vertical slider; 35. Vertical slide groove; 36. Gas storage chamber; 37. Suction chamber; 38. Nitrogen storage chamber; 39. Nitrogen recovery chamber; 40. Cleaning fluid storage chamber; 41. Cleaning fluid recovery chamber; 42. Nozzle; 43. Recovery pipe. Detailed Implementation

[0035] To enhance understanding of the present invention, the present invention will be further described in detail below with reference to embodiments. These embodiments are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention.

[0036] according to Figures 1-12 As shown, this embodiment proposes a semiconductor surface impurity treatment device and method, including a housing 1 and supporting legs 2. The middle of the interior of the housing 1 is a drying chamber 3. The left and right sides of the drying chamber 3 are a dry cleaning chamber 4 and a wet cleaning chamber 5, respectively. Both the dry cleaning chamber 4 and the wet cleaning chamber 5 are cylindrical structures with hollow hemispherical ends. A placement rack 6 is provided inside the housing 1 at the position of the drying chamber 3. A first pushing mechanism is provided on the bottom inner wall of the housing 1 to push the placement rack 6 to the dry cleaning chamber 4 or the wet cleaning chamber 5. A second pushing mechanism is provided on the inner wall of the housing 1 at the rear side of the drying chamber 3 to push the placement rack 6 forward. A chamber cover 7 is provided on the outer wall of the housing 1 at the front side of the drying chamber 3. Both the dry cleaning chamber 4 and the wet cleaning chamber 5 are provided with sealing components on the side near the drying chamber 3. The outer wall of the housing 1 is also provided with a supply component that cooperates with the dry cleaning chamber 4 and the wet cleaning chamber 5 for cleaning.

[0037] The sealing assembly includes an arc-shaped sealing block 8, an arc-shaped groove 9, a turntable 10, a motor 11, an arc-shaped slot 12, and a connecting rod 13. An arc-shaped groove 9 is provided on the outer casing 1 at a position outside the dry cleaning chamber 4 and the wet cleaning chamber 5. An arc-shaped sealing block 8 is located within the arc-shaped groove 9. A turntable 10 is fixed to the end of the arc-shaped sealing block 8. A motor 11 is fixed within a hemispherical structure on the rear side of the outer casing 1. The output end of the motor 11 is fixedly connected to the turntable 10. An arc-shaped slot 12 is provided on the turntable 10, located within the arc-shaped groove 9. The inner shell structure of the slot 9 and the turntable 10 is fixedly connected to the inner wall of the hemispherical shell structure on the rear side of the turntable 10 through the connecting rod 13 and the arc-shaped slot 12. The arc-shaped sealing block is only in contact with the outer shell 1. At the same time, rubber is used to seal the connection between the rear turntable 10 and the outer shell 1. The connecting rod 13 supports the inner shell structure of the arc-shaped sealing block 8 to ensure the stability of the device operation. Moreover, the setting of the arc-shaped slot 12 makes it impossible for the setting of the connecting rod 13 to affect the rotation of the turntable 10.

[0038] This device, by setting up a dry cleaning chamber 4, a wet cleaning chamber 5, and a drying chamber 3, allows for the selection of either dry cleaning or wet cleaning when cleaning different types of semiconductor wafers. The drying chamber 3 dries the cleaned semiconductor wafers, further enhancing the device's functionality. Furthermore, the device incorporates a sealing component to ensure the dry cleaning chamber 4 or wet cleaning chamber 5 remains sealed during cleaning, preventing leakage of cleaning fluid or gas and ensuring worker safety. The device, through the cooperation of a first and second pushing mechanism, can move the placement rack 6 left and right as well as forward and backward, further increasing its automation capabilities. The extended placement rack 6 also facilitates loading and unloading operations for workers.

[0039] The placement rack 6 includes a horizontal sliding support plate 14, a vertical sliding support plate 15, adjustment components, support arms 16, and a placement seat. The vertical sliding support plate 15 is slidably mounted on the top of the horizontal sliding support plate 14. Adjustment components are provided at both the front and rear ends of the vertical sliding support plate 15. Support arms 16 are fixed at both ends of the two sets of adjustment components. A placement seat for fixing semiconductor wafers is fixed on the top of the support arms 16.

[0040] The placement base includes mounting block assembly 17, connecting plate 18, rotating mechanism 19, storage column 20, spring 21, limiting plate 22, and support belt 23. The mounting block assembly 17 is arranged symmetrically on the left and right sides. The mounting block assembly 17 is connected and fixed to each other by connecting plate 18. Multiple storage columns 20 are rotatably mounted on the inner side of both sets of mounting block assembly 17. The front and rear ends of each storage column 20 are fixedly mounted with limiting plate 22 by spring 21. A rotating mechanism 19 is provided on one side of one set of mounting block assembly 17 to drive multiple storage columns 20 to rotate synchronously. A support belt 23 is provided between the multiple storage columns 20 located on the left and right sides.

[0041] The rotating mechanism 19 is a common gear-and-synchronous toothed belt linkage structure, which will not be described in detail here.

[0042] The multiple sets of bin columns 20 on the left side are provided with fixing ends 24 for fixing the ends of the support belt 23, and the bin column 20 on the right side is provided with winding ends 25 for winding the ends of the support belt 23.

[0043] The adjustment assembly includes a bidirectional adjustment cylinder 26, which is fixedly connected to a vertical sliding support plate 15.

[0044] The elastic potential energy of the spring 21 can limit the semiconductor wafers of different thicknesses by the limiting plate 22. In conjunction with the bidirectional adjusting cylinder 26 driving the placement seat to move synchronously, semiconductor wafers of different sizes can be limited. The support belt 23 can lift the semiconductor wafer from the bottom. With the limiting plate 22, the semiconductor wafer is limited in the placement seat. With the drive of the rotating mechanism 19, the angle of the limited semiconductor wafer can be changed, so that more gas or liquid can adhere to the surface of the semiconductor, thereby increasing the cleaning effect.

[0045] The first pushing component includes an embedded groove 27, an electric lifting rod 28, and a first electric push rod 29. The embedded groove 27 is symmetrically provided on the bottom inner wall of the outer shell 1. The first electric push rod 29 is provided in the embedded groove 27. The pushing end of the first electric push rod 29 is provided with an electromagnetic push block 30. The first electric push rod 29 pushes the electromagnetic push block 30 to electromagnetically engage with the side wall of the transverse sliding support plate 14. The electric lifting rod 28 is fixed below the first electric push rod 29. The electric lifting rod 28 drives the first electric push rod 29 to be hidden in the embedded groove 27. The bottom inner wall of the outer shell 1 is provided with a transverse slider 31 to limit the transverse sliding support plate 14. The bottom of the transverse sliding support plate 14 is provided with a transverse groove 32 that matches the transverse slider 31.

[0046] By activating the electric lifting rod 28 located inside the embedded groove 27, the electric lifting rod 28 pushes the first electric push rod 29 upward, and after the electromagnetic push block 30 of the first electric push rod 29 electromagnetically engages with the side wall of the transverse sliding support plate 14, the first electric push rod 29 pushes the placement rack 6 into the dry cleaning chamber 4 or wet cleaning chamber 5 under the guidance of the transverse slider 31 and the transverse slide groove 32.

[0047] The second pushing component includes a second electric push rod 33, which is disposed through the outer shell 1. The pushing end of the second electric push rod 33 is also provided with an electromagnetic push block 30. The second electric push rod 33 pushes the electromagnetic push block 30 to electromagnetically engage with the adsorption end on the outer wall of the adjusting cylinder. The top of the horizontal sliding support plate 14 is symmetrically provided with a vertical slider 34, and the bottom of the vertical sliding support plate 15 is provided with a vertical groove 35 that matches the vertical slider 34.

[0048] By activating the second drive rod, the second electric push rod 33 pushes the vertical sliding support plate 15 forward through the electromagnetic push block 30 and the electromagnetic attraction of the adsorption end, and pushes the placement rack 6 out of the drying chamber 3.

[0049] The supply assembly includes a gas storage chamber 36, a suction chamber 37, a nitrogen storage chamber 38, a nitrogen recovery chamber 39, a cleaning fluid storage chamber 40, a cleaning fluid recovery chamber 41, a nozzle 42, and a recovery pipe 43. The top of the outer shell 1 is provided with the gas storage chamber 36, the nitrogen storage chamber 38, and the cleaning fluid storage chamber 40. The left side wall of the outer shell 1 is provided with the suction chamber 37. The right side wall of the outer shell 1 is provided with the cleaning fluid recovery chamber 41. The rear side wall of the outer shell 1 is provided with the nitrogen recovery chamber 39. The top of the dry cleaning chamber 4, the drying chamber 3, and the wet cleaning chamber 5 are all provided with nozzles 42. The dry cleaning chamber 4, the drying chamber 3, and the wet cleaning chamber 5 are all provided with recovery pipes 43. The nozzles 42 and the recovery pipes 43 are all connected to the corresponding chambers through pipes and arc-shaped slots 12.

[0050] The dry cleaning chamber 4 receives gaseous cleaning agent stored in the gas storage chamber 36 via the nozzle 42, while the wet cleaning chamber 5 receives cleaning liquid stored in the cleaning liquid storage chamber 40 via the nozzle 42. A rotating mechanism 19 drives multiple sets of chamber columns 20 to rotate and tilt simultaneously, facilitating the adhesion of either gaseous or liquid cleaning agent. After a certain period, the dry cleaning chamber 4 draws in the gaseous cleaning agent via the recovery pipe 43 and sends the drawn-in impurity gas into the suction chamber 37. The wet cleaning chamber 5 recovers the remaining liquid via the recovery pipe 43 and sends it into the cleaning liquid recovery chamber 41. In the drying chamber 3, nitrogen from the nitrogen dehumidification chamber is drawn into the drying chamber 3 via the nozzle 42, and then drawn in again via the recovery pipe 43 and sent into the nitrogen recovery chamber 39, thus recovering the nitrogen.

[0051] Includes the following steps;

[0052] S1. By opening the chamber cover 7, the second electric push rod 33 pushes the vertical sliding support plate 15 forward through the electromagnetic push block 30 and the electromagnetic attraction of the adsorption end, and pushes the placement rack 6 out of the drying chamber 3. The workers insert the semiconductor wafers into the placement rack 6.

[0053] S2. By activating the bidirectional adjusting cylinder 26, the placement seats are moved synchronously, thereby adjusting the lateral spacing between the placement seats. At the same time, the support belt 23 is released or wound up by the winding end 25 to adjust the length of the support belt 23, thereby storing semiconductor wafers of different diameters. Meanwhile, the spring 21 drives the limiting disk 22 to limit the movement from both the front and rear directions. In addition, the support belt 23 lifts the bottom of the semiconductor wafer, thereby ensuring the stability of the semiconductor wafer.

[0054] S3. Select the cleaning method according to the characteristics of the semiconductor wafer. Taking the dry cleaning method 4 as an example, by activating the electric lifting rod 28 located inside the right embedded groove 27, the electric lifting rod 28 pushes the first electric push rod 29 upward and makes the electromagnetic push block 30 of the first electric push rod 29 electromagnetically attracted to the side wall of the transverse sliding support plate 14. Under the guidance of the transverse slider 31 and the transverse slide groove 32, the first electric push rod 29 pushes the placement rack 6 into the dry cleaning chamber 4. After the push is completed, the first electric push rod 29 is reset.

[0055] S4. By starting the motor 11, the turntable 10 is driven to rotate, thereby driving the arc-shaped sealing block 8 to rotate and seal the dry cleaning chamber 4.

[0056] S5. After sealing, the gaseous cleaning agent stored in the gas storage chamber 36 is sent into the dry cleaning chamber 4 through the nozzle 42. At the same time, the rotating mechanism 19 drives multiple sets of chamber columns 20 to rotate and tilt simultaneously, so as to facilitate the adhesion of the gaseous cleaning agent. After a certain period of time, the gaseous cleaning agent in the dry cleaning chamber 4 is sucked out through the recovery pipe 43 and the sucked impurity gas is sent into the suction chamber 37. At the same time, the delivery of the nozzle 42 is turned off.

[0057] S6. After cleaning, the first electric push rod 29 resets the placement rack 6 by opening the arc-shaped sealing cover. Then, the arc-shaped sealing covers of the dry cleaning chamber 4 and the wet cleaning chamber 5 are closed. Nitrogen gas is sent into the drying chamber 3 through the nozzle 42 to dry the semiconductor wafer. After drying, the nitrogen gas is recovered through the recovery pipe (43). Then, the chamber cover 7 is opened and the placement rack 6 is pushed out by the second electric push rod 33 to recover the semiconductor wafer.

[0058] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor surface impurity treatment apparatus, comprising a housing (1) and supporting feet (2), characterized in that: The middle of the interior of the outer shell (1) is a drying chamber (3). The left and right sides of the drying chamber (3) are a dry cleaning chamber (4) and a wet cleaning chamber (5), respectively. Both the dry cleaning chamber (4) and the wet cleaning chamber (5) are cylindrical structures with hollow hemispherical ends. A placement rack (6) is provided inside the outer shell (1) at the position of the drying chamber (3). The bottom inner wall of the outer shell (1) is provided with a pusher for the placement rack (6) to move to the dry cleaning chamber (4) or the wet cleaning chamber (5). The first pushing mechanism of the outer shell (1) is provided on the inner wall of the drying chamber (3) behind the first pushing mechanism to push the placement rack (6) forward. The outer wall of the outer shell (1) in front of the drying chamber (3) is provided with a chamber cover (7). The dry cleaning chamber (4) and the wet cleaning chamber (5) are both provided with sealing components on the side of the dry chamber (3) close to the drying chamber (3). The outer wall of the outer shell (1) is also provided with a supply component that cooperates with the dry cleaning chamber (4) and the wet cleaning chamber (5) for cleaning. The sealing assembly includes an arc-shaped sealing block (8), an arc-shaped groove (9), a turntable (10), a motor (11), an arc-shaped slot (12), and a connecting rod (13). An arc-shaped groove (9) is provided on the outer shell (1) at a position outside the dry cleaning chamber (4) and the wet cleaning chamber (5). An arc-shaped sealing block (8) is provided in the arc-shaped groove (9). A turntable (10) is fixed to the end of the arc-shaped sealing block (8). A motor (11) is fixed in the hemispherical structure on the rear side of the outer shell (1). The output end of the motor (11) is fixedly connected to the turntable (10). An arc-shaped slot (12) is provided on the turntable (10). The shell structure located inside the arc-shaped groove (9) and the turntable (10) is fixedly connected to the inner wall of the hemispherical shell structure on the rear side of the turntable (10) through the connecting rod (13) and the arc-shaped slot (12).

2. The semiconductor surface impurity treatment apparatus according to claim 1, characterized in that: The placement rack (6) includes a horizontal sliding support plate (14), a vertical sliding support plate (15), an adjustment assembly, a support arm (16), and a placement seat. The top of the horizontal sliding support plate (14) is slidably mounted with the vertical sliding support plate (15). The front and rear ends of the vertical sliding support plate (15) are provided with adjustment assemblies. The two ends of the two sets of adjustment assemblies are fixed with support arms (16). The top of the support arm (16) is fixed with a placement seat for fixing the semiconductor wafer.

3. The semiconductor surface impurity treatment apparatus according to claim 2, characterized in that: The placement seat includes mounting block group (17), connecting plate (18), rotating mechanism (19), storage column (20), spring (21), limiting plate (22) and support belt (23). The mounting block group (17) is symmetrically arranged in two groups on the left and right. The mounting block groups (17) are connected and fixed to each other by connecting plate (18). Multiple storage columns (20) are rotatably installed on the inner side of both groups of mounting block groups (17). The front and rear ends of the storage column (20) are fixedly installed with limiting plate (22) by spring (21). A rotating mechanism (19) that drives multiple storage columns (20) to rotate synchronously is provided on one side of one group of mounting block groups (17). A support belt (23) is provided between the multiple storage columns (20) located on the left and right sides.

4. The semiconductor surface impurity treatment apparatus according to claim 3, characterized in that: The multiple sets of bin columns (20) on the left side are provided with a fixing end (24) for fixing the end of the support belt (23), and the bin column (20) on the right side is provided with a winding end (25) for winding the end of the support belt (23).

5. The semiconductor surface impurity treatment apparatus according to claim 2, characterized in that: The adjustment assembly includes a bidirectional adjustment cylinder (26), which is fixedly connected to a vertical sliding support plate (15).

6. The semiconductor surface impurity treatment apparatus according to claim 2, characterized in that: The first pushing component includes an embedded groove (27), an electric lifting rod (28), and a first electric push rod (29). The bottom inner wall of the outer shell (1) is symmetrically provided with embedded grooves (27). The embedded grooves (27) are provided with the first electric push rod (29). The pushing end of the first electric push rod (29) is provided with an electromagnetic push block (30). The first electric push rod (29) pushes the electromagnetic push block (30) to electromagnetically engage with the side wall of the transverse sliding support plate (14). The electric lifting rod (28) is fixed below the first electric push rod (29). The electric lifting rod (28) drives the first electric push rod (29) to hide in the embedded groove (27). The bottom inner wall of the outer shell (1) is provided with a transverse slider (31) that limits the transverse sliding support plate (14). The bottom of the transverse sliding support plate (14) is provided with a transverse groove (32) that matches the transverse slider (31).

7. The semiconductor surface impurity treatment apparatus according to claim 6, characterized in that: The second pushing component includes a second electric push rod (33), which is disposed through the outer shell (1). The pushing end of the second electric push rod (33) is also provided with an electromagnetic push block (30). The second electric push rod (33) pushes the electromagnetic push block (30) to electromagnetically engage with the adsorption end on the outer wall of the bidirectional adjusting cylinder (26). The top of the horizontal sliding support plate (14) is symmetrically provided with vertical sliders (34), and the bottom of the vertical sliding support plate (15) is provided with a vertical groove (35) that is adapted to the vertical slider (34).

8. The semiconductor surface impurity treatment apparatus according to claim 1, characterized in that: The supply assembly includes a gas storage chamber (36), a suction chamber (37), a nitrogen storage chamber (38), a nitrogen recovery chamber (39), a cleaning fluid storage chamber (40), a cleaning fluid recovery chamber (41), a nozzle (42), and a recovery pipe (43). The top of the outer shell (1) is provided with the gas storage chamber (36), the nitrogen storage chamber (38), and then the cleaning fluid storage chamber (40). The suction chamber (37) is provided on the left side wall of the outer shell (1), and the right side of the outer shell (1) is provided with the suction chamber (37). A cleaning fluid recovery chamber (41) is provided on the wall, and a nitrogen recovery chamber (39) is provided on the rear side wall of the outer shell (1). The top of the dry cleaning chamber (4), the drying chamber (3) and the wet cleaning chamber (5) are all provided with spray pipes (42). The dry cleaning chamber (4), the drying chamber (3) and the wet cleaning chamber (5) are all provided with recovery pipes (43). The spray pipes (42) and the recovery pipes (43) are all connected to the corresponding chambers through pipes and arc-shaped slots (12).

9. A method for processing impurities on a semiconductor surface according to claims 1-8, characterized in that: Includes the following steps; S1. By opening the chamber cover (7), the second electric push rod (33) pushes the vertical sliding support plate (15) forward through the electromagnetic push block (30) and the electromagnetic attraction of the adsorption end, and pushes the placement rack (6) out of the drying chamber (3). The workers insert the semiconductor wafer into the placement rack (6). S2. By activating the bidirectional adjusting cylinder (26), the placement seat is moved synchronously, thereby adjusting the lateral spacing between the placement seats. At the same time, the support belt (23) is released or wound up by the winding end (25) to adjust the length of the support belt (23), thereby storing semiconductor wafers of different diameters. Meanwhile, the limiting disk (22) is driven by the elasticity of the spring (21) to limit the position from both the front and rear directions. In addition, the support belt (23) lifts the bottom of the semiconductor wafer, thereby ensuring the stability of the semiconductor wafer. S3. Select the cleaning method according to the characteristics of the semiconductor wafer. Taking the dry cleaning (4) method as an example, by activating the electric lifting rod (28) located inside the right embedded groove (27), the electric lifting rod (28) pushes the first electric push rod (29) upward and makes the electromagnetic push block (30) of the first electric push rod (29) electromagnetically attracted to the side wall of the transverse sliding support plate (14). Under the guidance of the transverse slider (31) and the transverse slide groove (32), the first electric push rod (29) pushes the placement rack (6) into the dry cleaning chamber (4). After the push is completed, the first electric push rod (29) resets. S4. By starting the motor (11) to drive the turntable (10) to rotate, the arc-shaped sealing block (8) will rotate to seal the dry cleaning chamber (4); S5. After sealing, the gaseous cleaning agent stored in the gas storage chamber (36) is sent into the dry cleaning chamber (4) through the nozzle (42). At the same time, the rotating mechanism (19) drives multiple sets of chamber columns (20) to rotate and tilt simultaneously, so as to facilitate the adhesion of the gaseous cleaning agent. After a certain period of time, the gaseous cleaning agent in the dry cleaning chamber (4) is sucked out through the recovery pipe (43) and the sucked impurity gas is sent into the suction chamber (37). At the same time, the delivery of the nozzle (42) is turned off. S6. After cleaning, the first electric push rod (29) resets the placement rack (6) by opening the arc-shaped sealing cover. Then, the arc-shaped sealing covers of the dry cleaning chamber (4) and the wet cleaning chamber (5) are closed. Nitrogen gas is sent into the drying chamber (3) through the nozzle (42) to dry the semiconductor wafer. After drying, the nitrogen gas is recovered through the recovery pipe (43). Then, the chamber cover (7) is opened and the placement rack (6) is pushed out by the second electric push rod (33) to recover the semiconductor wafer.

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