LED chip die bonder swing arm control system and control method

Abstract

The invention relates to the technical field of semiconductor production equipment, in particular to an LED chip die bonder swing arm control system and a control method.The LED chip die bonder swing arm control system comprises a base, a swing mechanism, a lifting mechanism and an image detection mechanism, an annular carrying table is arranged on the base, and the swing mechanism is provided with a track disc, a swing arm assembly, a rotary drive and a crank assembly; the crank assembly is connected with the rotary drive in the vertical direction. The track disc is slidably connected with the base in the vertical direction, one end of the swing arm assembly is connected with the track disc, and one end of the crank is slidably connected with the swing arm assembly. A suction nozzle is arranged at one end of the swing arm assembly; the lifting mechanism is used for controlling the track disc to move in the vertical direction. By means of the structural design, one end of the crank assembly does linear motion on the swing arm, so that the swing arm assembly is controlled to rotate on the track disc, the gravity center position of the swing arm assembly is continuously adjusted, and vibration of the tail end of the swing arm assembly can be effectively restrained.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production equipment, and in particular to a swing arm control system and a control method of an LED chip bonding machine. Background Art

[0002] LED packaging is the process of connecting LED chips to external circuits and protecting the chips from environmental influences. The main purpose of packaging is to improve the reliability, heat dissipation and optical performance of LEDs. The packaging process involves multiple steps, including chip bonding, wire bonding, sealing, baking, cutting and packaging.

[0003] LED die bonders are key equipment in the semiconductor packaging process. They are mainly used to firmly connect the electrical connection points (solder joints) between the chip (wafer) and the packaging substrate to achieve electrical connection and physical support. The die bonder plays an important role in the semiconductor packaging process. It can place components at high speed and high precision, and realize key steps such as positioning, alignment, flip-chip, and continuous mounting. With the acceleration of the production rhythm of the die bonder, the vibration problem at the end of the die bonder's swing arm has become more and more serious, which has a serious impact on the positioning accuracy of the end of the swing arm. At present, most domestic LED die bonders use servo motors to directly control the rotation of the swing arm. When the processing speed of the LED die bonder exceeds 6,000 pieces / hour, the vibration at the end of the swing arm becomes more and more serious as the processing speed increases; resulting in chip positioning deviation and a long vibration elimination stagnation cycle, thereby limiting the processing speed of the LED die bonder. It has become a problem that needs to be solved urgently for ultra-high-speed die bonding. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, in a first aspect, the present invention proposes a swing arm control system for an LED chip bonding machine, which can reduce the end vibration of the swing arm of the LED chip bonding machine. In a second aspect, the present invention also provides a control method applied to the above-mentioned swing arm control system for an LED chip bonding machine,

[0005] According to the first aspect of the present invention, a swing arm control system for an LED chip bonding machine includes:

[0006] A base, wherein a ring carrier is arranged on the base, and the ring carrier is used to carry a circular wafer;

[0007] A swing mechanism, wherein the swing mechanism is provided with a track plate, a swing arm assembly, a rotary drive and a crank assembly, wherein the rotary drive is fixedly connected to the base, and the crank assembly is slidably connected to the rotary drive in a vertical direction; the track plate is slidably connected to the base in a vertical direction, one end of the swing arm assembly is rotatably connected to the track plate, and one end of the crank assembly is slidably connected to the swing arm assembly in a horizontal direction; a suction nozzle is provided at one end of the swing arm assembly;

[0008] A lifting mechanism, the lifting mechanism is used to control the track plate to move in a vertical direction;

[0009] An image detection mechanism is provided with a CCD camera above the ring carrier.

[0010] According to some embodiments of the present invention, the swing arm assembly includes a front swing arm and a rear swing arm, one end of the rear swing arm is rotatably connected to the track disk, the other end of the rear swing arm is detachably connected to one end of the front swing arm, the other end of the front swing arm is provided with a mounting portion, and the suction nozzle is provided on the mounting portion.

[0011] According to some embodiments of the present invention, a first slide rail is provided on the rear swing arm along its own length direction, and the crank assembly is slidably connected to the first slide rail via a first slider.

[0012] According to some embodiments of the present invention, the track disk is a fan-shaped structure, a curved step is provided on a side of the track disk away from the center of the circle, and the rear swing arm is provided with a curved sliding block corresponding to the curved step.

[0013] According to some embodiments of the present invention, the rotary drive includes a first servo motor, a first coupling and a drive shaft; the first servo motor and the base are fixedly connected, and the output end of the first servo motor is transmission-connected to the drive shaft via the first coupling; the crank assembly and the drive shaft are slidingly connected in a vertical direction, and the first coupling is a flexible coupling.

[0014] According to some embodiments of the present invention, the crank assembly includes a crank seat, a second slide rail and a second slider, the second slide rail and the crank seat are fixedly connected, the second slider and the drive shaft are fixedly connected, the second slider and the second slide rail are slidably connected, and a connecting rod is provided on the peripheral side wall of the lower end of the crank seat, and the connecting rod and the first slider are rotatably connected.

[0015] According to some embodiments of the present invention, the crank assembly includes a preload spring, which is sleeved on the drive shaft, one end of the preload spring abuts against the crank seat, and the other end of the preload spring abuts against the base.

[0016] According to some embodiments of the present invention, the lifting mechanism includes a second servo motor, a second coupling, a crankshaft, a guide rod, a vertical rod and a transmission rod; the second servo motor is fixedly connected to the base, and the output end of the second servo motor is transmission-connected to the crankshaft via the second coupling; one end of the guide rod is fixedly connected to the base, the other end of the guide rod is arranged in a vertical direction, and the track disk and the guide rod are slidingly connected; one end of the vertical rod is fixedly connected to the track disk, the other end of the vertical rod is fixedly connected to the transmission rod, the axis of the transmission rod is arranged in a horizontal direction, and the transmission rod abuts against the crankshaft.

[0017] According to some embodiments of the present invention, a slot hole is provided on the transmission rod, and the transmission rod is sleeved on the crankshaft through the slot hole.

[0018] A swing arm control system for an LED chip bonding machine according to an embodiment of the present invention has at least the following beneficial effects:

[0019] According to the solution of the present invention, the swing arm control system of the LED chip bonding machine includes a base, a swing mechanism, a lifting mechanism and an image detection mechanism, wherein a ring carrier for placing a circular wafer is arranged on the base, and the swing mechanism is provided with a track disk, a swing arm assembly, a rotary drive and a crank assembly, the rotary drive is fixedly connected to the base, and the crank assembly is slidably connected to the rotary drive in the vertical direction; the track disk is slidably connected to the base in the vertical direction, one end of the swing arm assembly is rotationally connected to the track disk, and one end of the crank is slidably connected to the swing arm assembly in the horizontal direction; a suction nozzle is arranged at one end of the swing arm assembly; the suction nozzle can suck or place the chip on the circular wafer, and the lifting mechanism is used to control the track disk to move in the vertical direction; the image detection mechanism is provided with a CCD camera above the ring carrier, and the position of the suction nozzle can be collected in real time by setting the CCD camera, so as to determine the position state of the swing arm assembly; through the design of this structure, one end of the crank assembly controls the swing arm assembly to rotate on the track disk by making a linear motion on the swing arm, and continuously adjusts the center of gravity position of the swing arm assembly, so as to effectively suppress the end vibration of the swing arm assembly.

[0020] A control method according to an embodiment of the second aspect of the present invention comprises the following steps:

[0021] S01: Initial calibration, moving the suction nozzle to the center of the wafer; fine-tuning the image detection mechanism; controlling the error E between the center of the suction nozzle and the center of the wafer a ≤10μm;

[0022] S02: When the initial calibration is completed, the lifting mechanism controls the track plate to rise; and controls the swing arm assembly to rotate at a first angular velocity through the rotary drive;

[0023] S03: when the swing arm assembly completes the accelerated rotation, the swing arm assembly is controlled to rotate at a uniform speed at a second angular velocity through the rotary drive;

[0024] S04: when the swing arm assembly completes the uniform rotation, the swing arm assembly is controlled by the rotary drive to decelerate at a third angular velocity until the angular velocity of the swing arm assembly is zero;

[0025] S05: when the angular velocity of the swing arm assembly is zero, the error is measured by the image detection mechanism, and the error is input into the rotary drive; and the error is corrected by using a PID control method;

[0026] S06: the lifting mechanism controls the track plate to descend;

[0027] S07: Repeat steps S02 to S06.

[0028] The control method of the swing arm control system of the LED chip bonding machine according to the embodiment of the present invention has at least the following beneficial effects:

[0029] According to the solution of the present invention, through real-time monitoring and feedback of the image detection mechanism, the system can quickly identify and correct slight deviations of the swing arm assembly, ensuring that the accuracy of each operation is within the allowable range; the rotary drive controls the swing arm assembly through the crank assembly to achieve three-stage speed control of acceleration, constant speed and deceleration, which not only ensures the smoothness of operation, but also minimizes the terminal vibration, thereby improving the stability and efficiency of the chip bonding process; by introducing the PID algorithm, through the comprehensive calculation of the proportional term, integral term and differential term of the error signal, the rotary drive output is intelligently adjusted to effectively improve the response speed and control accuracy of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A structural schematic diagram of the present invention;

[0031] Figure 2 A schematic diagram of a structure of the ringless carrier configuration of the present invention;

[0032] Figure 3 A schematic cross-sectional view of the present invention;

[0033] Figure 4 For the present invention Figure 3 A schematic diagram of the enlarged local structure at A;

[0034] Figure 5 The figure is a schematic cross-sectional view of the lifting mechanism of the present invention.

[0035] In the figure:

[0036] 100-base, 110-ring carrier;

[0037] 200-swing mechanism, 210-track plate, 211-arc-shaped step, 220-swing arm assembly, 221-front swing arm, 2211-mounting portion, 222-rear swing arm, 2221-arc-shaped slider, 223-first slide rail, 224-first slider, 230-slewing drive, 231-first servo motor, 232-first coupling, 233-drive shaft, 240-crank assembly, 241-crank seat, 242-second slide rail, 243-second slider, 244-connecting rod, 245-preload spring;

[0038] 300 - lifting mechanism, 310 - second servo motor, 320 - second coupling, 330 - crankshaft, 340 - guide rod, 350 - vertical rod, 360 - transmission rod, 361 - slot hole. DETAILED DESCRIPTION

[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] In the description of the present invention, it should be understood that descriptions involving orientation, such as orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of the present invention, "a plurality" means more than two. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0042] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0043] Reference Figures 1 to 5As shown, in the first aspect, the present invention discloses a swing arm control system for an LED chip bonding machine, comprising a base 100, a swing mechanism 200, a lifting mechanism 300 and an image detection mechanism; wherein, a ring carrier 110 is arranged on the base 100, and the ring carrier 110 is used to carry a round wafer; the swing mechanism 200 is provided with a track disk 210, a swing arm assembly 220, a rotary drive 230 and a crank assembly 240, the rotary drive 230 is fixedly connected to the base 100, and the crank assembly 240 is slidably connected to the rotary drive 230 in a vertical direction; the track disk 210 is slidably connected to the base 100 in a vertical direction, one end of the swing arm assembly 220 is rotatably connected to the track disk 210, and one end of the crank assembly 240 is slidably connected to the swing arm assembly 220 in a horizontal direction; a suction nozzle is arranged at one end of the swing arm assembly 220; the lifting mechanism 300 is used to control the track disk 210 to move in a vertical direction; the image detection mechanism is provided with a CCD camera above the ring carrier 110.

[0044] Specifically, in the present embodiment, the swing arm control system of the LED chip bonding machine includes a base 100, which is the supporting base of the entire system, and a ring carrier 110 is installed on the base 100 for placing a round wafer. In the present embodiment, the ring carrier 110 adopts an XY axis adjustment mechanism, and can realize the rotation control of the round wafer at the same time. The swing mechanism 200 is composed of a track disk 210, a swing arm assembly 220, a rotary drive 230 and a crank assembly 240. The rotary drive 230 is fixed on the base 100, and is used to provide a power source to drive the crank assembly 240 to rotate around the vertical axis; the track disk 210 is slidably connected to the base 100 in the vertical direction to provide support and guidance for the swing arm assembly 220; the swing arm assembly 220 is connected to the track disk 210 through rotation, and reciprocates under the action of the crank assembly 240 to form a crank-guide rod 340 structure. Specifically, one end of the crank assembly 240 makes a linear motion on the swing arm assembly 220, thereby controlling the swing arm assembly 220 to rotate on the track disk 210, thereby avoiding the oscillation effect caused by the large instantaneous angular velocity change of the traditional swing mechanism 200. Further, one end of the crank assembly 240 can change the overall mass distribution of the swing arm assembly 220 by making a linear motion on the swing arm assembly 220, thereby redistributing the momentum of the swing arm assembly 220. On the one hand, it can offset the vibration caused by external forces or other factors, such as wind resistance, and on the other hand, it can avoid the resonance effect by changing the natural frequency of the swing arm assembly 220. Furthermore, by setting a suction nozzle at the end of the swing arm assembly 220, the chip on the round wafer can be sucked or placed to achieve precise positioning of the chip. The lifting mechanism 300 controls the vertical displacement of the track disk 210 to ensure that the swing arm assembly 220 can complete the suction or placement of the chip at different heights. The image detection mechanism is mainly composed of a CCD camera located above the ring stage 110, which can capture and analyze the nozzle position information in real time, feed it back to the control system, optimize the position adjustment strategy of the swing arm assembly 220, and ensure the accuracy of the operation. The introduction of the crank assembly 240 enables the swing arm assembly 220 to perform efficient and smooth linear motion, effectively reducing the vibration phenomenon of the end of the swing arm that is common in the traditional die bonding process, and improving the stability and reliability of the system. Through precise image detection technology, the system can monitor the nozzle position in real time and automatically correct deviations, greatly improving the accuracy and speed of chip bonding and reducing the scrap rate.

[0045] In some embodiments of the present invention, the swing arm assembly 220 includes a front swing arm 221 and a rear swing arm 222, one end of the rear swing arm 222 is rotatably connected to the track plate 210, the other end of the rear swing arm 222 is detachably connected to one end of the front swing arm 221, the other end of the front swing arm 221 is provided with a mounting portion 2211, and the suction nozzle is provided on the mounting portion 2211. Specifically, in this embodiment, the swing arm assembly 220 adopts a split structure, and the swing arm assembly 220 includes a front swing arm 221 and a rear swing arm 222. In this embodiment, the other end of the rear swing arm 222 is detachably connected to the front swing arm 221, and the use of models of different specifications and models can be achieved by replacing the front swing arm 221 of different lengths. In this embodiment, one end of the rear swing arm 222 rotates with the track plate 210, and is responsible for transmitting the power obtained by the crank assembly 240, ensuring that the entire swing arm assembly 220 can rotate smoothly, while providing stable support for the front swing arm 221.

[0046] In some embodiments of the present invention, a first slide rail 223 is provided on the rear swing arm 222 along its own length direction, and the crank assembly 240 is slidably connected to the first slide rail 223 via the first slider 224 .

[0047] Specifically, in this embodiment, the swing mechanism 200 includes a track plate 210, a swing arm assembly 220, a rotary drive 230, a crank assembly 240 and a suction nozzle, the swing arm assembly 220 includes a front swing arm 221 and a rear swing arm 222, the rear swing arm 222 includes a first slide rail 223 and a first slider 224, the first slide rail 223 is fixedly arranged on the rear swing arm 222 along the length direction of the rear swing arm 222, the first slider 224 is slidably connected to the first slide rail 223, the crank assembly 240 is slidably connected to the rotary drive 230 in the vertical direction, and one end of the crank assembly 240 is rotatably connected to the first slider 224. The cooperation between the first slide rail 223 and the first slider 224 constitutes a part of the internal precision guide system of the swing arm assembly 220, ensuring the accurate positioning and synchronization of each movement link. The sliding connection mechanism adopted by the crank assembly 240 and the swing arm assembly 220 allows the crank assembly 240 to respond quickly according to the actual working conditions and realize dynamic adjustment, so as to maintain stable and reliable performance regardless of whether it is in a high-speed movement state or in a subtle fine-tuning process.

[0048] In some embodiments of the present invention, the track disk 210 is a fan-shaped structure, and a curved step 211 is provided on the side of the track disk 210 away from the center of the circle, and a curved slider 2221 is provided on the rear swing arm 222 corresponding to the curved step 211. In this embodiment, the swing arm assembly 220 includes a front swing arm 221 and a rear swing arm 222, and one end of the rear swing arm 222 is rotatably connected to the track disk 210. The track disk 210 is a fan-shaped structure, and a curved step 211 is provided on the side of the track disk 210 away from the center of the circle, and the rear swing arm 222 is rotatably connected to the track disk 210 through the curved slider 2221, and the track disk 210 can provide support for the rear swing arm 222; by providing the curved step 211, local contact can be formed, and during processing, only the curved step 211 of the track disk 210 needs to be processed with high precision, thereby ensuring precision while reducing the processing cost of the track disk 210.

[0049] In some embodiments of the present invention, the rotary drive 230 includes a first servo motor 231, a first coupling 232 and a drive shaft 233; the first servo motor 231 is fixedly connected to the base 100, and the output end of the first servo motor 231 is connected to the drive shaft 233 through the first coupling 232; the crank assembly 240 and the drive shaft 233 are connected in a sliding manner in the vertical direction, and the first coupling 232 is a flexible coupling. Specifically, in this embodiment, the first servo motor 231 is fixed to the base 100, and by receiving a control signal, the rotation speed can be accurately controlled to ensure the stability and accuracy of the power output. The first coupling 232 uses a flexible coupling, which is not only used to connect the output end of the servo motor with the drive shaft 233, but also has the ability to compensate for axial, radial and angular errors. The elastic characteristics of the flexible coupling absorb the impact and vibration during the start-stop process, and improve the flexibility and durability of the transmission system. In addition, the presence of the flexible coupling absorbs irregular fluctuations in the transmission process, reduces vibration and noise, and improves the overall stability and work efficiency of the system. During operation, the first servo motor 231 drives the drive shaft 233 to rotate through the first coupling 232, ensuring continuous and smooth transmission of power, and finally guiding the swing arm assembly 220 to reciprocate. The rotational kinetic energy of the first servo motor 231 is converted into the reciprocating motion of the swing arm assembly 220 through the crank assembly 240, realizing efficient conversion and distribution of power. The drive shaft 233 is axially slidably connected to the crank assembly 240, and the lifting action can be performed without affecting the rotation transmission.

[0050] In some embodiments of the present invention, the crank assembly 240 includes a crank seat 241, a second slide rail 242 and a second slider 243. The second slide rail 242 and the crank seat 241 are fixedly connected, the second slider 243 and the drive shaft 233 are fixedly connected, the second slider 243 and the second slide rail 242 are slidably connected, and a connecting rod 244 is provided on the peripheral side wall of the lower end of the crank seat 241, and the connecting rod 244 and the first slider 224 are rotatably connected. Specifically, in this embodiment, the rotary drive 230 includes a first servo motor 231, a first coupling 232 and a drive shaft 233; the first servo motor 231 is fixedly connected to the base 100, and the output end of the first servo motor 231 is transmission-connected to the drive shaft 233 through the first coupling 232; the crank assembly 240 includes a crank seat 241, a second slide rail 242 and a second slider 243, the second slide rail 242 is fixedly connected to the crank seat 241, the second slider 243 is fixedly connected to the drive shaft 233, the second slider 243 is slidably connected to the second slide rail 242, and a connecting rod 244 is provided on the peripheral side wall of the lower end of the crank seat 241, and the connecting rod 244 is rotationally connected to the first slider 224. The drive shaft 233 is slidably connected to the crank seat 241 through the second slider 243, the second slide rail 242 and the crank seat 241, and can perform lifting and lowering actions without affecting the rotation transmission.

[0051] In some embodiments of the present invention, the crank assembly 240 includes a preload spring 245, which is sleeved on the drive shaft 233, one end of the preload spring 245 abuts against the crank seat 241, and the other end of the preload spring 245 abuts against the base 100. In this embodiment, the preload spring 245 can provide a certain preload force to the first slider 224, so that the rear swing arm 222 fits the track plate 210.

[0052] In some embodiments of the present invention, the lifting mechanism 300 includes a second servo motor 310, a second coupling 320, a crankshaft 330, a guide rod 340, a vertical rod 350 and a transmission rod 360; the second servo motor 310 is fixedly connected to the base 100, and the output end of the second servo motor 310 is transmission-connected to the crankshaft 330 via the second coupling 320; one end of the guide rod 340 is fixedly connected to the base 100, and the other end of the guide rod 340 is arranged in a vertical direction, and the track disk 210 and the guide rod 340 are slidingly connected; one end of the vertical rod 350 is fixedly connected to the track disk 210, and the other end of the vertical rod 350 is fixedly connected to the transmission rod 360, the axis of the transmission rod 360 is arranged in a horizontal direction, and the transmission rod 360 abuts against the crankshaft 330.

[0053] Specifically, in the present embodiment, the second servo motor 310 is used for the power output of the lifting action, and the output end of the second servo motor 310 is connected to the crankshaft 330 through the second coupling 320 to ensure the smooth transmission of power. Through the sensor and the controller, the lifting mechanism 300 can respond to the command quickly. The second coupling 320 can absorb vibration and ensure the power transmission from the motor to the crankshaft 330. The crankshaft 330 can receive the rotational force of the second servo motor 310 and transmit it to the transmission rod 360, converting the vertical motion into a push-pull force in the horizontal direction to complete the action transformation. One end of the guide rod 340 is fixed to the base 100, and the other end extends vertically to form a sliding connection with the track disk 210 to provide guidance and constraints for the lifting motion. The vertical rod 350 is connected to the track disk 210 as a support for the crankshaft 330. The design of this structure can achieve a smooth lifting motion.

[0054] In some embodiments of the present invention, a slot 361 is provided on the transmission rod 360, and the transmission rod 360 is sleeved on the crankshaft 330 through the slot 361. The slot 361 can provide a limiting and guiding function to ensure the smooth lifting movement. Through the close combination of the slot 361 and the crankshaft 330, the entire transmission system obtains higher rigidity, reduces vibration and noise, and makes the movement of the lifting mechanism 300 smoother and more stable.

[0055] In a second aspect, the present invention discloses a control method for a swing arm control system of an LED chip bonding machine, comprising the following steps:

[0056] S01: Initial calibration, move the nozzle to the center of the wafer; perform fine adjustment through the image detection mechanism; control the error E between the nozzle center and the wafer center a ≤10μm; through the swing mechanism 200 and the servo control system, the suction nozzle is guided to the preset position, as close as possible to the geometric center of the wafer. Through the image detection mechanism and image processing technology, the actual position information of the suction nozzle and the wafer is captured, and the pre-stored standard template is compared to calculate the distance difference between the centers of the two. According to the calculation results, the control system of the crystal bonding machine commands the suction nozzle to move slightly, gradually reducing the error until the allowable range of ±10μm is reached. When the deviation between the suction nozzle and the center of the wafer falls within the target value, the system immediately locks the current position to ensure that subsequent operations are carried out from this coordinate origin.

[0057] S02: When the initial calibration is completed, the lifting mechanism 300 controls the track disk 210 to rise; the swing arm assembly 220 is controlled to rotate at a first angular velocity through the rotary drive 230; based on the completion of the initial calibration, the lifting mechanism 300 of the crystal bonding machine is activated to drive the track disk 210 to rise smoothly. Ensure that the suction nozzle is 0.5cm to 1cm away from the wafer; after the track disk 210 is lifted, the rotary drive 230 begins to control the accelerated rotation of the swing arm assembly 220. The rotation speed is increased at a preset acceleration, and this step can improve the response time and work efficiency. In this step, the time range of the accelerated rotation cycle is 0<t≤t1, and the speed formula of the acceleration stage is: ω(t)=A*t, where A is the acceleration of the acceleration stage.

[0058] S03: When the swing arm assembly 220 completes the accelerated rotation, the swing arm assembly 220 is controlled to rotate at a uniform speed at the second angular velocity through the rotary drive 230; during the solid crystal process, the swing arm assembly 220 needs to carry the chip for multiple rapid and precise movements. The rotary drive 230 ensures the smoothness and consistency of each movement by controlling the second angular velocity, reduces shaking and errors, and improves the accuracy of chip bonding. In this step, the time range of the uniform rotation cycle is t1<t≤t2; the speed formula of the uniform speed stage is: ω(t)=ω max , where ω max is the maximum angular velocity at the end of the acceleration phase.

[0059] S04: When the swing arm assembly 220 completes the uniform rotation, the swing arm assembly 220 is controlled by the rotary drive 230 to decelerate at a third angular velocity until the angular velocity of the swing arm assembly 220 is zero; since a sudden stop may cause vibration or impact, affecting the safety and position accuracy of the chip. By controlling the swing arm to decelerate at the third angular velocity, such problems can be effectively avoided to ensure the stability of the entire process. It can be understood that the third angular velocity is not a fixed value, but refers to the speed function of the swing arm assembly 220 during deceleration. The design of this structure can achieve a smooth transition from the second angular velocity to a complete stop. In this step, the time range of the uniform rotation cycle is t2<t≤t3; the speed formula for the uniform speed stage is: ω(t)=ω max -B*(t-t2)where ω max is the maximum angular velocity at the end of the acceleration phase, and B is the acceleration during the deceleration phase.

[0060] S05: When the angular velocity of the swing arm assembly 220 is zero, the error is measured by the image detection mechanism, and the error is input into the rotary drive 230; and the error is corrected by the PID control method; specifically, in this step, the specific steps of the PID control method are: first set the proportional, integral and differential parameters of the PID control, and calculate the proportional control signal according to the current error value; accumulate the error value to obtain the integral control signal; calculate the rate of change of the error value to obtain the differential control signal; add the calculated results of the proportional, integral and differential control signals. The total output of the PID controller is:

[0061]

[0062] Where u(t) is the controller output, K p is the proportionality coefficient, K i is the integral coefficient, K d is the differential coefficient, and e(t) is the measurement error of the image detection mechanism. Since the PID controller has strong adaptability, it can automatically adjust the control parameters according to environmental conditions, load changes or external interference.

[0063] S06: the lifting mechanism 300 controls the track plate 210 to descend;

[0064] S07: Repeat steps S02 to S06.

[0065] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A swing arm control system for an LED chip bonding machine, characterized in that: include: A base (100), wherein a ring carrier (110) is arranged on the base (100), and the ring carrier (110) is used to carry a circular wafer; A swing mechanism (200), wherein the swing mechanism (200) is provided with a track disk (210), a swing arm assembly (220), a rotary drive (230) and a crank assembly (240), wherein the rotary drive (230) is fixedly connected to the base (100), and the crank assembly (240) is slidably connected to the rotary drive (230) in a vertical direction; the track disk (210) is slidably connected to the base (100) in a vertical direction, one end of the swing arm assembly (220) is rotatably connected to the track disk (210), and one end of the crank assembly (240) is slidably connected to the swing arm assembly (220) in a horizontal direction; a suction nozzle is provided at one end of the swing arm assembly (220); A lifting mechanism (300), the lifting mechanism (300) being used to control the track plate (210) to move in a vertical direction; An image detection mechanism is provided with a CCD camera above the ring carrier (110).

2. The swing arm control system of the LED chip bonding machine according to claim 1, characterized in that: The swing arm assembly (220) comprises a front swing arm (221) and a rear swing arm (222); one end of the rear swing arm (222) is rotatably connected to the track plate (210); the other end of the rear swing arm (222) is detachably connected to one end of the front swing arm (221); the other end of the front swing arm (221) is provided with a mounting portion (2211); and the suction nozzle is provided on the mounting portion (2211).

3. The swing arm control system of the LED chip bonding machine according to claim 2, characterized in that: The rear swing arm (222) is provided with a first slide rail (223) along its own length direction, and the crank assembly (240) is slidably connected to the first slide rail (223) via a first slider (224).

4. The swing arm control system of the LED chip bonding machine according to claim 3, characterized in that: The track disk (210) is a fan-shaped structure, a side of the track disk (210) away from the center of the circle is provided with an arc-shaped step (211), and the rear swing arm (222) is provided with an arc-shaped sliding block (2221) corresponding to the arc-shaped step (211).

5. The swing arm control system of the LED chip bonding machine according to claim 3, characterized in that: The rotary drive (230) comprises a first servo motor (231), a first coupling (232) and a drive shaft (233); the first servo motor (231) and the base (100) are fixedly connected, and the output end of the first servo motor (231) is transmission-connected to the drive shaft (233) via the first coupling (232); the crank assembly (240) and the drive shaft (233) are slidingly connected in a vertical direction, and the first coupling (232) is a flexible coupling.

6. The swing arm control system of the LED chip bonding machine according to claim 5, characterized in that: The crank assembly (240) comprises a crank seat (241), a second slide rail (242) and a second slider (243); the second slide rail (242) and the crank seat (241) are fixedly connected; the second slider (243) and the drive shaft (233) are fixedly connected; the second slider (243) and the second slide rail (242) are slidably connected; a connecting rod (244) is provided on the peripheral side wall of the lower end of the crank seat (241); the connecting rod (244) and the first slider (224) are rotatably connected.

7. The swing arm control system of the LED chip bonding machine according to claim 6, characterized in that: The crank assembly (240) comprises a preload spring (245), wherein the preload spring (245) is sleeved on the drive shaft (233), one end of the preload spring (245) abuts against the crank seat (241), and the other end of the preload spring (245) abuts against the base (100).

8. The swing arm control system of the LED chip bonding machine according to claim 1, characterized in that: The lifting mechanism (300) comprises a second servo motor (310), a second coupling (320), a crankshaft (330), a guide rod (340), a vertical rod (350) and a transmission rod (360); the second servo motor (310) is fixedly connected to the base (100), and the output end of the second servo motor (310) is transmission-connected to the crankshaft (330) through the second coupling (320); one end of the guide rod (340) is fixedly connected to the base (100), the other end of the guide rod (340) is arranged in a vertical direction, and the track disk (210) and the guide rod (340) are slidably connected; one end of the vertical rod (350) is fixedly connected to the track disk (210), the other end of the vertical rod (350) is fixedly connected to the transmission rod (360), the axis of the transmission rod (360) is arranged in a horizontal direction, and the transmission rod (360) abuts against the crankshaft (330).

9. The swing arm control system of the LED chip bonding machine according to claim 8, characterized in that: The transmission rod (360) is provided with a slot hole (361), and the transmission rod (360) is sleeved on the crankshaft (330) through the slot hole (361).

10. A control method for the swing arm control system of a chip bonding machine according to claims 1-9, characterized in that: The following steps are involved: S01: Initial calibration, moving the suction nozzle to the center of the wafer; fine-tuning the image detection mechanism; controlling the error E between the center of the suction nozzle and the center of the wafer a ≤10μm; S02: When the initial calibration is completed, the lifting mechanism (300) controls the track plate (210) to rise; and controls the swing arm assembly (220) to rotate at a first angular velocity through the rotary drive (230); S03: When the swing arm assembly (220) completes the accelerated rotation, the swing arm assembly (220) is controlled by the rotary drive (230) to rotate at a uniform speed at a second angular velocity; S04: when the swing arm assembly (220) completes the uniform rotation, the swing arm assembly (220) is controlled by the rotary drive (230) to decelerate at a third angular velocity until the angular velocity of the swing arm assembly (220) is zero; S05: when the angular velocity of the swing arm assembly (220) is zero, measuring the error through the image detection mechanism, and inputting the error into the rotary drive (230); and correcting the error using a PID control method; S06: the lifting mechanism (300) controls the track plate (210) to descend; S07: Repeat steps S02 to S06.

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